JP2005266285A - Electro-optical device and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electro-optical device which has gaps made inconspicuous in junction parts and allows pixel pitches to be equalized even when joining small-sized substrates so as to enlarge the apparatus and to provide an electronic apparatus using the same. <P>SOLUTION: When side end surfaces 26 of four small-sized substrates 2 are joined to manufacture a large-sized organic EL display device 1, a side end surface 26 of one small-sized substrate 2a out of two small-sized substrates 2a and 2b having a junction part between them is formed into an upward forward taper 26a, and a side end surface of the other small-sized substrate 2b is formed into a downward backward taper 26b. Therefore, gaps in junction parts are inconspicuous when the organic EL display element 1 is viewed from an exit side of display light. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electro-optical device and an electronic apparatus using the same.

  Among various electro-optical devices, for example, in an organic EL display device, a substrate including a pixel switching element and an organic EL element is used for each of a large number of pixels arranged in a matrix. The organic EL element injects electrons and holes from the electron injection electrode and the hole injection electrode into the light emitting part, recombines the injected electrons and holes at the emission center to bring the organic molecules into an excited state, and the organic molecules Produces fluorescence when it returns from the excited state to the ground state. Here, if a fluorescent material that is a luminescent material is selected, the luminescent color can be changed, so that a color image can be displayed.

Such an organic EL display device is required to have a size exceeding 30 inches as in the case of a liquid crystal device, but in that case, the substrate is also enlarged. For this reason, a line for manufacturing a TFT (Thin Film Transistor) as a pixel switching element is enlarged. In addition, increasing the size of the substrate itself decreases the yield in the cleaning process and the film forming process. Furthermore, if an attempt is made to construct a TFT with a low-temperature polysilicon TFT for the purpose of using an inexpensive glass substrate as the substrate, laser annealing for crystallizing amorphous silicon into polysilicon becomes unstable. Therefore, a plurality of substrates (small substrates) that are sufficiently large and can be manufactured with conventional techniques and facilities are arranged in a plane, and the side end surfaces 26 of the small substrates 2 are joined together as shown in FIG. It has been proposed to produce a large organic EL display device (see, for example, Patent Documents 1 and 2).
JP 2001-102171 A JP 2002-297063 A

  In order to join the side end surfaces 26 of the small substrate 2 as shown in FIG. 7, as shown in FIG. 8 (A), the blade 4 is cut at right angles to the end portion of the small substrate 2, and the side end surface 26 is cut. However, it is unavoidable that an error occurs in the cutting position by the blade 4 during such cutting. For this reason, there exists a problem that a pixel pitch will shift | deviate compared with another area | region in the junction part with the small substrate 2. FIG. Further, at the time of cutting, it is unavoidable that the blade 4 yaws in the traveling direction indicated by the arrow S and unevenness occurs on the cut surface of the small substrate 2 as shown in FIG. Therefore, when the side end surfaces 26 of the small substrate 2 are joined to each other, useless gaps are generated between the side end surfaces 26 of the small substrate 2 as shown in FIG. However, there is a problem that the actual joining allowance becomes considerably large.

  In addition, in the joint portion between the small substrates 2, the pixel pitch is required to be constant with other regions, but in the related art, for example, as shown in FIG. 7, there is a region where the wiring 130 passes through the joint portion. If they are adjacent to each other, there is a problem that the pixel pitch P here becomes twice the pixel pitch P0 of other regions.

  In view of the above problems, an object of the present invention is to provide an electro-optical device in which a gap is not conspicuous in a bonded portion and a pixel pitch can be uniform even when a small substrate is bonded and the size is increased, and It is to provide an electronic device using the same.

  In order to solve the above-described problem, in the present invention, electro-optics in which side edges of a plurality of small substrates each having a large number of pixels arranged in a matrix are joined to each other and the plurality of small substrates are arranged in a plane. In the apparatus, a side end surface having an upward forward taper in one small substrate and a side end surface having a reverse reverse taper in the other small substrate are bonded at a joint portion between the small substrates. .

  In the present invention, since the small substrate is joined by the forward tapered side end surface and the reverse tapered side end surface, the end portions of the small substrate overlap in the thickness direction at the joint portion. Therefore, even when unevenness occurs on the cut surface when cutting a small substrate with a blade, the gap generated in the joint due to such unevenness only occurs in the thickness direction, and in the in-plane direction. Does not occur. That is, even when a gap occurs in the joint portion, such a gap is not conspicuous because it is covered with the end portion of the small substrate when viewed from the display light emission side. In addition, when a small substrate is cut with a blade, even if an error occurs in the cutting position, the relative position of the small substrate in the in-plane direction can be adjusted by simply shifting the small substrate in an oblique direction. Can be suppressed.

  In the present invention, for example, the one small substrate and the other substrate have the same substrate thickness and are disposed at the same position in the thickness direction. In such a case, the plurality of small substrates are composed of four rectangular small substrates joined to adjacent small substrates at portions corresponding to two adjacent sides, and each of the small substrates is arranged on the two sides. It is preferable that the two side end surfaces positioned have a forward taper and a reverse taper, respectively. If comprised in this way, the thing of the same structure can be used about the small board | substrate located diagonally among four small boards.

  In the present invention, it is preferable that the one small substrate and the other substrate are in a position shifted in a thickness direction in a direction in which a planar overlap is increased. With this configuration, since the planar overlap between the one small substrate and the other substrate is large, the pixel pitch at the boundary between the one small substrate and the other substrate is set to the pixel pitch of the other region. Can be aligned. Here, when the thickness of the one small substrate is smaller than that of the other substrate, the position of the one small substrate and the other substrate in the thickness direction of one substrate surface is between the small substrates. Can be arranged to match. In such a case, the plurality of small substrates are composed of four rectangular small substrates in which portions corresponding to two adjacent sides are joined to the adjacent small substrates, and the diagonal of the four small substrates is diagonal. In the two small substrates in the position, the two side end surfaces located on the two sides are forward tapered, and in the other two small substrates, the two side end surfaces located on the two sides are inversely tapered. It is preferable that If comprised in this way, it can join with the combination of a forward taper and a reverse taper in all the joining parts of four places.

  The present invention can be applied to an electroluminescence display device. In this case, the small substrate holds an electroluminescence element as an electro-optical material on one surface side.

  The present invention can also be applied to a liquid crystal device. In this case, the small substrate has a pair of substrates bonded to each other with a predetermined gap, and holds liquid crystal as an electro-optical material between the substrates.

  The electro-optical device according to the present invention can be used for a portable electronic device such as a mobile phone or a mobile computer, and can also be used for an electronic device having a large screen exceeding 30 inches.

  Hereinafter, an embodiment of an electro-optical device according to the invention and an electronic apparatus using the same will be described with reference to the drawings. In each drawing to be referred to, the scale may be different for each layer or each member in order to make the size recognizable on the drawing.

[Embodiment 1]
(Overall configuration of organic EL display device)
1A and 1B are a perspective view and a plan view of an active matrix organic EL display device according to Embodiment 1 of the present invention. FIG. 2 is an explanatory diagram showing an electrical configuration of the organic EL display device shown in FIG.

  In FIG. 1, an organic EL display device 1 according to the present embodiment includes a large panel 1 'of 30 inches or more using a so-called tiling technique, and includes four small substrates 2 (substrates for electro-optical devices). Are arranged. A gas barrier sealing resin 40 is applied to the small substrate 2 on the element forming surface 21 side, but the sealing resin 40 is formed so as to avoid a region where the terminals 20 are formed. Therefore, the flexible wiring board 7 on which the IC 70 is COF mounted can be connected to each of the terminals 20 formed at the end of the element forming surface 21 of the small substrate 2. In addition, although a board | substrate may be affixed on the surface side or back surface side of the small substrate 2, illustration is abbreviate | omitted.

  In the organic EL display device 1, a large number of pixels 100 are arranged in a matrix in a region where the sealing resin 40 is applied, as shown in FIG. 2. In FIG. 2, the organic EL display device 1 of the present embodiment also has a plurality of scanning lines 131 and a direction intersecting the scanning lines 131 on each of the four small substrates 2, similarly to the known organic EL display device. A plurality of signal lines 132 extending and a plurality of power supply lines 133 extending in parallel to the signal lines are wired. A pixel 100 is formed at each intersection of the scanning line 131 and the signal line 132. For example, the data line driving circuit 103 including a shift register, a level shifter, a video line, and an analog switch is connected to the signal line 132. Further, the scanning line drive circuit 104 including a shift register and a level shifter is connected to the scanning line 131.

(Pixel configuration)
FIG. 3 is an enlarged cross-sectional view of pixels in the organic EL display device shown in FIG. As shown in FIGS. 2 and 3, in each pixel 100 of the organic EL display device 1 of the present embodiment, a scanning signal is supplied to the gate electrode via the scanning line 131 on the element forming surface 21 side of the small substrate 2. A pixel switching TFT 123, a storage capacitor 135 for holding an image signal supplied from the signal line 132 through the TFT 123, and a pixel switching pixel for supplying the image signal held by the storage capacitor 135 to the gate electrode. A TFT 124 (for driving) is formed. In order to form such TFTs 123 and 124, the small substrate 2 is provided with a base protective film 2c made of a silicon oxide film on a base material made of a glass substrate, and the low-temperature polysilicon is formed on the base protective film 2c. An island-shaped semiconductor film 141 made of a film is formed. A source region 141a and a drain region 141b are formed in the semiconductor film 141 by high-concentration P ion implantation, and a portion where P is not introduced serves as a channel region 141c. A gate insulating film 142 is formed on the surface side of the base protective film 2c and the semiconductor film 141, and a gate electrode 143 (scanning line) made of Al, Mo, Ta, Ti, W, or the like is formed on the gate insulating film 142. ing. A transparent first interlayer insulating film 144a and a second interlayer insulating film 144b are formed on the surface side of the gate electrode 143 and the gate insulating film 142. The gate electrode 143 is provided at a position corresponding to the channel region 141c of the semiconductor film 141. Further, contact holes 145 and 146 connected to the source / drain regions 141a and 141b of the semiconductor film 141 are formed in the interlayer insulating films 144a and 144b. On the second interlayer insulating film 144b, a transparent pixel electrode 111 made of ITO or the like into which a drive current flows from the power line 133 when electrically connected to the power line 133 via the TFT 124 is formed in a predetermined shape. Yes. A TFT 124 is connected to the pixel electrode 111 through a contact hole 145.

  Further, in the pixel 100, an organic EL element 101 (self-emitting element) including a light emitting functional layer 110 (organic functional layer) sandwiched between the pixel electrode 111 and the cathode 12 is formed. The organic functional layer 110 includes, for example, a hole injection / transport layer stacked on the pixel electrode 111 and a light emitting layer (organic EL layer) formed on the hole injection / transport layer. An electron injection / transport layer may be formed between the light emitting layer and the cathode 12. The hole injection / transport layer has a function of injecting holes into the light emitting layer and a function of transporting holes inside the hole injection / transport layer. In the light emitting layer, the holes injected from the hole injecting / transporting layer and the electrons injected from the cathode 12 are recombined to obtain light emission. Here, a large number of pixels 100 correspond to each color of red (R), green (G), and blue (B), and the correspondence of such colors depends on the type of material constituting the organic functional layer 110. It is prescribed.

  The organic EL display device 1 of this embodiment is a top emission type that emits display light toward the side opposite to the substrate, as indicated by an arrow L, and the cathode 12 includes a calcium layer 12a and an ITO layer 12b. And formed on substantially the entire surface excluding the terminal formation region of the small substrate 2. The ITO layer 12b transmits the light emitted from the light emitting layer 110. In addition, a reflective film 113 made of an Al film, an Ag film, a laminated film of Al and Ag, or the like is formed on the lower layer side of the pixel electrode 111, and reflects light traveling from the light emitting layer 110 toward the substrate. It comes out.

  In the pixel 100, a partition 112 is formed as a bank so as to surround the peripheral edge of the pixel electrode 111. The partition 112 defines an application region of the liquid composition to be ejected and applied by an ink jet method (liquid ejection method) when forming the organic functional layer 110, and the liquid composition is uniform due to the surface tension. Formed with thickness. The partition 112 includes, for example, an inorganic bank layer located on the substrate side and an organic bank layer formed on the inorganic bank layer. A sealing resin 40 is formed on the element forming surface 21 of the small substrate 2 to prevent the cathode 12 or the organic functional layer 110 from being oxidized by preventing water and oxygen from entering.

  In the organic EL display device 1 configured as described above, when the scanning line 131 is driven and the TFT 123 is turned on, the potential of the signal line 132 at that time is held in the holding capacitor 135, and according to the state of the holding capacitor 135. Thus, the conduction state of the driving TFT 124 is controlled. When the driving TFT 124 is turned on, a current flows from the power supply line 133 to the pixel electrode 111 through the channel, and further, in the organic EL element 101, a current flows to the cathode 12 through the organic functional layer 110. . The organic functional layer 110 emits light according to the amount of current at this time. The light emitted from the organic functional layer 110 toward the cathode 12 is emitted as it is to the observer side as indicated by an arrow L, while the organic functional layer 110 is opposite to the cathode 12 (on the side of the substrate). ) Is reflected by the reflective layer 113 and emitted to the observer side as indicated by an arrow L.

(Joint structure)
FIG. 4 is an explanatory diagram schematically showing an enlarged joint portion between the small substrates 2 of the organic EL display device 1 of the present embodiment. FIG. 4 shows only the organic EL element 101 and the wiring 130 as the scanning line 131, the signal line 132, or the power supply line 133 on the element formation surface 21 of the small substrate 2.

  In this embodiment, when the small substrates 2 are bonded as shown in FIGS. 1A and 1B, of the four small substrates 2, two small substrates 2 sandwiching the bonding portion are shown in FIG. As described above, when one small substrate 2a and the other small substrate 2b are used, the one small substrate 2a is cut so that the side end face 26 becomes an upward forward taper 26a, while the other small substrate 2a. About 2b, the side end surface 26 is cut | disconnected so that it may become the downward reverse taper 26b, and the side end surfaces 26 provided with such a taper are joined together with the adhesive agent. Such a shape of the side end face 26 is obtained by inclining the blade 4 at an angle of, for example, 45 ° with respect to the end portion of the small substrate 2 in the cutting step described with reference to FIG.

  In this embodiment, the one small substrate 2a and the other small substrate 2b have the same substrate thickness, and when the side end surfaces 26 are joined together with an adhesive, the small substrates 2a and 2b are the same in the thickness direction. In position.

  Here, in each of the four small substrates 2 shown in FIGS. 1A and 1B, the portions corresponding to the two adjacent sides are joined to the adjacent small substrate 2, and the four small substrates are combined. In both cases, as shown in FIG. 1B, the two side end faces 26 located on the two sides are respectively a forward taper 26a and a reverse taper 26b. Therefore, the organic EL display device 1 according to this embodiment has a structure in which the forward taper 26a and the reverse taper 26b are bonded to each other at any of the four bonding portions as shown in FIG.

  As described above, in this embodiment, the small substrates 2 are joined by the forward taper 26a and the reverse taper 26b. Therefore, as described with reference to FIG. 8B, when the small substrate 2 is cut by the blade 4, even when unevenness occurs on the cut surface of the small substrate 2 due to yawing in the traveling direction indicated by the arrow S. Such a gap due to the unevenness only occurs in the thickness direction and does not occur in the in-plane direction. That is, even when a gap is generated at the joint surface between one small substrate 2a and the other small substrate 2b, such a gap is not observed when the organic EL display device 1 is viewed from the display light emitting side. Since it is covered with 2b, it is inconspicuous. Therefore, there is no need to worry about the joining cost.

  In addition, when the small substrate 2 is cut by the blade 4, even if an error occurs in the cutting position, the relative position of the small substrates 2a and 2b in the in-plane direction can be adjusted by simply shifting the small substrates 2a and 2b obliquely. it can. Therefore, the deviation of the pixel pitch at the junction can be minimized. Here, when the small substrates 2a and 2b are shifted in an oblique direction, a step of several tens of μm is generated. However, with such a step, there is no problem as compared with the size of the unevenness of the substrate surface.

  In this embodiment, when the small substrate 2 is joined by the forward taper 26a and the reverse taper 26b, the forward taper 26a and the reverse taper 26b are formed on any of the four small substrates 2. Therefore, as shown in FIG. 1B, since the same small substrate 2 can be used for the small substrate 2 in the diagonal position, there is an advantage that two kinds of small substrates 2 need only be prepared. is there.

  Further, in the present embodiment, the small substrates 2a and 2b having the same substrate thickness are used, and the small substrates 2a and 2b are joined so as to be in the same position in the thickness direction. Therefore, the position of the surface (back surface 22) opposite to the element forming surface 21 of the small substrates 2a and 2b can be matched in the thickness direction. Therefore, it is easy to bond the support substrate to the back surface 22 of the four small substrates 2 and increase the strength of the panel 1 ′.

[Embodiment 2]
FIG. 5 is an explanatory view schematically showing an enlarged joint portion between the small substrates 2 of the organic EL display device 1 according to Embodiment 2 of the present invention. FIG. For the surface 21, only the organic EL element 101 and the wiring 130 as the scanning line 131, the signal line 132, or the power supply line 133 are illustrated. In addition, since the basic structure of the organic EL display device of this embodiment is the same as that of Embodiment 1, the description of the common parts is omitted.

  In this embodiment, when the small substrate 2 is joined as shown in FIGS. 1A and 1B, as shown in FIG. 5, the side end surface 26 of one small substrate 2a has a forward taper 26a facing upward. On the other hand, the other small substrate 2b is cut so that the side end face 26 becomes a reverse taper 26b facing downward, and the side end faces 26 having such a taper are bonded to each other. It is joined with the agent. Such a shape of the side end face 26 is obtained by inclining the blade 4 at an angle of, for example, 45 ° with respect to the end portion of the small substrate 2 in the cutting step described with reference to FIG. In this embodiment, one small substrate 2a and the other small substrate 2b have the same substrate thickness.

  In this embodiment, when the side end surfaces 26 of the small substrates 2a and 2b are joined together with an adhesive, one small substrate 2a is deeply embedded under the other small substrate 2b. For this reason, the small board | substrate 2a has penetrated the small board | substrate 2a deeply under the other small board | substrate 2b, and the position in the thickness direction has shifted | deviated. That is, one small substrate 2a and the other substrate 2b are in a position shifted in the thickness direction in the direction in which the planar overlap increases.

  Here, each of the four small substrates 2 is bonded to the adjacent small substrate 2 at portions corresponding to the two adjacent sides. In this embodiment, the diagonal positions of the four small substrates 2 are diagonally positioned. For the two small substrates 2, both of the two side end surfaces 26 located on the two sides are forward tapered 26 a, and for the other two small substrates 2, the two side end surfaces 26 located on the two sides Both are set as the reverse taper 26b. Therefore, the organic EL display device 1 according to this embodiment has a structure in which the forward taper 26a and the reverse taper 26b are bonded to each other at any of the four bonding portions as shown in FIG. Moreover, since the same small board | substrate 2 can be used about the small board | substrate 2 in a diagonal position, what is necessary is just to prepare two types of small board | substrates 2. FIG.

  As described above, in this embodiment, since the small substrate 2 is joined by the forward taper 26a and the reverse taper 26b, when the small substrate 2 is cut with a blade as in the first embodiment, a cut surface is formed. Even when a gap is generated on the joint surface of the small substrates 2a and 2b due to the generated unevenness, such a gap is covered with the other small substrate 2b when the organic EL display device 1 is viewed from the display light emitting side. ,can not see. Even if an error occurs in the cutting position when cutting the small substrate 2 with the blade 4, the relative position of the small substrates 2a and 2b in the in-plane direction can be adjusted by simply shifting the small substrates 2a and 2b obliquely. it can.

  In addition, in this embodiment, the small substrate 2a having the side end surface 26 as the forward taper 26a is deeply buried under the other small substrate 2b having the side end surface 26 as the reverse taper 26b. The planar overlap of 2b is large. Therefore, the position of the wiring 130 formed at the end of one small substrate 2a and the position of the wiring 130 formed at the end of the other small substrate 2b can be overlapped in a plane. Therefore, the pixel pitch at the boundary between the one small substrate 2a and the other substrate 2b can be completely aligned with the pixel pitch in the other region.

  Note that if the positions of the small substrates 2a and 2b are shifted in the thickness direction, the pixel size may appear small when viewed from the side from which the display light is emitted. In such a case, the pixel size may be changed in the small substrates 2a and 2b.

[Embodiment 3]
FIG. 6 is an explanatory view schematically showing an enlarged joint portion between the small substrates 2 in the organic EL display device according to the third embodiment of the present invention. FIG. For the surface 21, only the organic EL element 101 and the wiring 130 as the scanning line 131, the signal line 132, or the power supply line 133 are illustrated. Since the basic configuration of the organic EL display device of this embodiment is the same as that of Embodiments 1 and 2, the description of common parts is omitted.

  In this embodiment, when the small substrate 2 is bonded as shown in FIGS. 1A and 1B, as shown in FIG. 6, one side of the small substrate 2a has a forward taper 26a with the side end face 26 facing upward. On the other hand, the other small substrate 2b is cut so that the side end face 26 becomes a reverse taper 26b facing downward, and the side end faces 26 having such a taper are bonded to each other. It is joined with the agent.

  In the present embodiment, the substrate thickness of one small substrate 2a having the side end surface 26 as the forward taper 26a is thinner than the other small substrate 2b having the side end surface 26 as the reverse taper 26b. Therefore, when joining the side end surfaces 26 of the small substrates 2a and 2b with an adhesive, the one small substrate 2a is deeply submerged under the other small substrate 2b to increase the planar overlap between the substrates. In the small substrates 2a and 2b, the position of the surface (back surface 22) opposite to the element formation surface 21 is aligned in the thickness direction.

  Here, each of the four small substrates 2 is bonded to the adjacent small substrate 2 at portions corresponding to the two adjacent sides. In the present embodiment, the diagonal portions of the four small substrates 2 are diagonal. With respect to the two small substrates 2 at the position, as one substrate 2a, the substrate thickness is thin, and both of the two side end surfaces 26 positioned on the two sides are forward tapered 26a. On the other hand, with respect to the other two small substrates 2, as the other substrate 2b, the substrate thickness is thick, and both of the two side end surfaces 26 located on the two sides are reverse tapered 26b. Therefore, the organic EL display device 1 according to this embodiment has a structure in which the forward taper 26a and the reverse taper 26b are bonded to each other at any of the four bonding portions as shown in FIG. Moreover, since the same small board | substrate 2 can be used about the small board | substrate 2 in a diagonal position, what is necessary is just to prepare two types of small board | substrates 2. FIG.

  As described above, in this embodiment, as in the first and second embodiments, the small substrate 2 is joined by the forward taper 26a and the reverse taper 26b. For this reason, the organic EL display device 1 is viewed from the emission side of the display light even when a gap is generated on the joint surface of the small substrates 2a and 2b due to the unevenness generated on the cut surface when the small substrate 2 is cut with a blade. Sometimes such a gap is not visible because it is covered with the other small substrate 2b. Further, when the small substrate 2 is cut by the blade 4, even if an error occurs in the cutting position, the relative position of the small substrates 2a and 2b in the in-plane direction can be adjusted by simply shifting the small substrates 2a and 2b in an oblique direction. it can.

  Further, in this embodiment, as in the second embodiment, one small substrate 2a having the side end face 26 having a forward taper 26a is deeply embedded under the other small substrate 2b having the side end face 26 having a reverse taper 26b. Therefore, the planar overlap of the small substrates 2a and 2b is large. Therefore, the position of the wiring 130 formed at the end of one small substrate 2a and the position of the wiring 130 formed at the end of the other small substrate 2b can be overlapped in a plane. Therefore, the pixel pitch at the boundary between the one small substrate 2a and the other substrate 2b can be completely aligned with the pixel pitch in the other region.

  Furthermore, in this embodiment, the substrate thickness of one small substrate 2a having the side end surface 26 as the forward taper 26a is thinner than the other small substrate 2b having the side end surface 26 as the reverse taper 26b. In a state where the small substrate 2a is deeply buried under the other small substrate 2b, the position of the surface (rear surface 22) opposite to the element forming surface 21 of the small substrates 2a and 2b can be matched in the thickness direction. it can. Therefore, it is easy to increase the strength of the panel 1 ′ by bonding the support substrate to the back surface 22 of the four small substrates 2.

  Note that if the positions of the small substrates 2a and 2b are shifted in the thickness direction, the pixel size may appear small when viewed from the side from which the display light is emitted. In such a case, the pixel size may be changed in the small substrates 2a and 2b.

[Other embodiments]
In the above embodiment, an example using a top emission type small substrate (organic EL display device) that emits display light toward the side opposite to the substrate is used, but bottom emission that emits display light from the side of the substrate. Large-sized organic EL display using a small-sized substrate (organic EL display device) or a combination of a top-emission small substrate (organic EL display device) and a bottom-emission small substrate (organic EL display device) The present invention may be applied when manufacturing an apparatus.

  Further, the above embodiment is an example in which the present invention is applied to an organic EL display device in which an electro-optical material is held on one electro-optical device substrate (small substrate), but for two electro-optical devices. The present invention may be applied to a case where a large liquid crystal device is manufactured by bonding a plurality of panels each holding an electro-optical material between substrates (small substrates) and having side end surfaces bonded to each other.

[Application to electronic devices]
The electro-optical device to which the present invention is applied is a multimedia-compatible personal computer (PC), mobile computer, engineering workstation (EWS), pager, or mobile phone, word processor, TV, viewfinder type or monitor direct view type. In addition to being applicable to electronic devices such as video tape recorders, electronic notebooks, electronic desk calculators, car navigation devices, POS terminals, touch panels, etc., they are mounted to construct electronic devices having a large screen exceeding 30 inches.

(A), (B) is the perspective view and top view of an active matrix type organic electroluminescence display which concern on Embodiment 1 of this invention. It is explanatory drawing which shows the electrical structure of the organic electroluminescent display apparatus shown in FIG. It is sectional drawing which expands and shows the pixel in the organic electroluminescent display apparatus shown in FIG. It is explanatory drawing which expands and shows typically the junction part of the small substrates of the organic electroluminescent display apparatus which concerns on Embodiment 1 of this invention. It is explanatory drawing which expands and shows typically the junction part of the small substrates of the organic electroluminescence display which concerns on Embodiment 2 of this invention. It is explanatory drawing which expands and shows typically the junction part of the small substrates of the organic electroluminescence display which concerns on Embodiment 3 of this invention. It is explanatory drawing which expands and shows typically the junction part of the small substrates of the conventional organic EL display apparatus. It is explanatory drawing of the problem of the conventional organic EL display apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Organic EL display device (electro-optical device), 1 ′ panel, 2 small substrate (substrate for electro-optical device), 2a one small substrate, 2b other small substrate, 26 side end face, 26a upward forward taper, 26b downward Reverse taper

Claims (9)

In an electro-optical device in which a plurality of small substrates each having a plurality of pixels arranged in a matrix are joined to each other, and the plurality of small substrates are arranged in a plane.
An electro-optical device characterized in that a side end surface having an upward forward taper in one small substrate and a side end surface having a reverse reverse taper in the other small substrate are bonded at a bonding portion between the small substrates. .   2. The electro-optical device according to claim 1, wherein the one small substrate and the other substrate have the same substrate thickness and are arranged at the same position in the thickness direction. In claim 2, the plurality of small substrates are composed of four rectangular small substrates in which portions corresponding to two adjacent sides are joined to the adjacent small substrates,
2. The electro-optical device according to claim 1, wherein each of the small substrates has two side end faces located on the two sides, the forward taper and the reverse taper, respectively.   2. The electric device according to claim 1, wherein the one small substrate and the other small substrate are in a position shifted in a thickness direction in a direction in which a planar overlap between the small substrates at a joint portion increases. Optical device.   5. The electro-optical device according to claim 4, wherein the one small substrate has a smaller substrate thickness than the other substrate. In claim 4 or 5, the plurality of small substrates are composed of four rectangular small substrates in which portions corresponding to two adjacent sides are joined to the adjacent small substrates,
Of the four small substrates, two small substrates at diagonal positions have the two side end surfaces located on the two sides being the forward taper, and the other two small substrates are 2. An electro-optical device, wherein two side end surfaces located on two sides are reversely tapered.   7. The electro-optical device according to claim 1, wherein the small substrate holds an electroluminescence element as an electro-optical material on one surface side.   7. The electric device according to claim 1, wherein the small substrate includes a pair of substrates bonded to each other with a predetermined gap, and holding a liquid crystal as an electro-optical material between the substrates. Optical device.   An electronic apparatus comprising the electro-optical device defined in any one of claims 1 to 8.

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