JP2005259988A - Multilayered wiring board and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board in which a via hole is not required to be formed. <P>SOLUTION: An insulating liquid is delivered to a substrate 10 on which a wiring pattern including first and second leads 12, 14 is formed, and an insulating layer 16 is formed so that a part of the first lead 12 may be covered. A wiring layer 20 is formed by delivering a dispersing liquid including conductive fine particles so that it may include a first portion 22 which overlaps with the first lead 12 without contact through the insulating film 16, a second portion 24 coming into contact with the second lead 14, and a connecting portion 26 of the first and the second portions 22, 24. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a multilayer wiring board and a manufacturing method thereof.

  In order to conduct electrical continuity between wiring layers in a manufacturing process of a multilayer wiring board, a method of forming a via hole in the board and filling some conductive material therebetween is common. As a method for imparting conductivity to a via hole, there is a conventional method of forming a metal plating film on the inner wall of the via hole. Also, in order to cope with higher wiring density of the substrate, a method of filling the via hole with metal plating (see Patent Document 1) or filling the via hole with a conductive paste, forming electrode layers on the upper and lower sides thereof, and hot pressing There are a method of connecting wiring layers (see Patent Document 2) and a method of connecting ball wiring metals by arranging ball-shaped metal in via holes (see Patent Document 3).

However, in the conventional method using the conductive paste or metal plating as described above, the via hole needs to be formed perpendicular to the substrate surface. When the via hole is inclined obliquely, the silver paste or metal plating does not reach the back of the via hole, and the connection reliability between the wiring layers is lowered. For this reason, in the conventional multilayer wiring board, the conductive portions between the wiring layers must be strictly overlapped when viewed from above, which complicates the layout of the wiring board and makes layout design difficult. In addition, the number of processes is increased due to the process of opening a via hole in the insulating layer once formed and filling with a conductive material. This not only increases the cost, but also discards the plating solution and the like when opening the via hole. At that time, a lot of garbage was generated, and the load to deal with environmental problems was heavy.
JP 58-121698 A Japanese Patent Laid-Open No. 7-176846 Japanese Patent Laid-Open No. 13-77497

  An object of the present invention is to provide a method of manufacturing a wiring board that does not require the formation of a via hole.

(1) In the method for manufacturing a multilayer wiring board according to the present invention, a part of the first lead is discharged by discharging an insulating liquid onto the board on which the wiring pattern including the first and second leads is formed. Providing an insulating layer so as to cover
A first portion that overlaps the first lead in a non-contact manner via the insulating layer; a second portion that contacts the second lead; and a connecting portion between the first and second portions. Discharging a dispersion containing conductive fine particles to form a wiring layer,
including. According to the present invention, since a multilayer wiring board can be manufactured without forming a via hole, the process can be simplified and the degree of freedom in layout design is improved.
(2) In this method of manufacturing a multilayer wiring board,
The wiring pattern includes a third lead,
The first lead is disposed between the second and third leads;
The wiring layer may be formed to have a third portion that contacts the third lead, and a connection portion between the first and third portions.
(3) The manufacturing method of this multilayer wiring board is as follows:
The wiring layer is used as a first wiring layer, and a dispersion liquid containing the conductive fine particles is discharged so that the second wiring layer is in contact with and overlaps the first wiring layer above the insulating layer. It may further include forming.
(4) The manufacturing method of this multilayer wiring board is as follows:
The insulating layer is used as the first insulating layer, the second insulating layer is covered so that a part of the first wiring layer is exposed, and is adjacent to the first insulating layer. Further forming by discharging the liquid,
Further comprising forming the second wiring layer in contact with the exposed portion of the first wiring layer from the second insulating layer and reaching the second insulating layer;
The second wiring layer may be formed so as to reach the second insulating layer.
(5) The manufacturing method of this multilayer wiring board is as follows:
The wiring pattern formed on the substrate may further include discharging the dispersion liquid containing the conductive fine particles.
(6) The multilayer wiring board according to the present invention is manufactured by the above method.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a plan view showing a part of a multilayer wiring board manufactured by the method according to the first embodiment of the present invention. 2 is a cross-sectional view of the multilayer wiring board shown in FIG. 1 taken along the line II-II.

  The multilayer wiring board 1 has a substrate 10. The substrate 10 may be formed of a resin such as a polyimide resin, or may be a ceramic substrate or a metal plate with an insulating coating (electrically insulating coating). The substrate 10 may be a flexible substrate or a rigid substrate.

  A wiring pattern including first and second leads 12 and 14 is formed on the substrate 10 (one surface thereof). The first and second leads 12 and 14 may be formed of the same material (conductive material such as metal). The first and second leads 12 and 14 may extend so as not to cross each other. The first and second leads 12 and 14 may not be electrically connected, or may be electrically connected by other leads (not shown).

  An insulating layer (electrical insulating layer) 16 is provided on the first lead 12. Specifically, the insulating layer 16 is provided so as to cover a part of the first lead 12 (for example, a part of the surface opposite to the substrate 10). The insulating layer 16 may be in contact with a part of the first lead 12. The first lead 12 may have a portion that is not covered by the insulating layer 16. The insulating layer 16 may cover a part of the substrate 10 (for example, a portion adjacent to the portion covered with the insulating layer 16 of the first lead 12). The substrate 10 may have a portion that is not covered by the insulating layer 16.

  The multilayer wiring board 1 has a wiring layer 20. The wiring layer 20 includes a first portion 22 that overlaps the first lead 12 through the insulating layer 16 in a non-contact manner. The first portion 22 may be provided in contact with the insulating layer 16. The wiring layer 20 includes a second portion 24 that contacts the second lead 14, and the two are electrically connected by the contact. The wiring layer 20 may be in contact with at least one (only one or both) of the upper surface (surface opposite to the substrate 10) and the side surface (surface rising from the substrate 10) of the second lead 14. The wiring layer 20 includes connection portions 26 of the first and second portions 22 and 24. At least a part (entirely or only a part) of the connection portion 26 may be provided on the substrate 10 (for example, may be in contact with the substrate 10). The wiring layer 20 is formed so as to get over the insulating layer 16. In other words, the wiring layer 20 is formed so as to extend from the first portion 22 on the insulating layer 16 in a plurality of directions (two directions on the left and right in FIG. 2) and reach the substrate 10.

  Next, a method for manufacturing the multilayer wiring board 1 will be described. In the present embodiment, a substrate 10 on which a wiring pattern including first and second leads 12 and 14 is formed is prepared. The first and second leads 12 and 14 may be formed by etching a metal foil, or may be formed by sputtering or vapor deposition.

  Alternatively, the first and second leads 12 and 14 may be formed by a method (for example, an ink jet method, a bubble jet (registered trademark) method, a gel jet (registered trademark) or the like that discharges a dispersion liquid (for example, metal ink) containing conductive fine particles. ) Method). For discharging, a printer head or a dispenser may be used. The conductive fine particles may be formed of a material that is difficult to oxidize, such as gold or silver, and has low electric resistance. The fine particles are not particularly limited in size, and are particles that can be discharged together with the dispersion. The conductive fine particles may be coated with a coating material in order to suppress the reaction. The dispersion may be difficult to dry and re-dissolvable. The conductive fine particles may be uniformly dispersed in the dispersion. If necessary, a treatment for volatilizing the dispersion and a treatment (heating) for bonding (for example, sintering) the conductive fine particles to each other are performed.

  The method for manufacturing the multilayer wiring board 1 includes forming the insulating layer 16. The insulating layer 16 may be formed by discharging an insulating liquid (for example, a resin precursor) to the substrate 10. The insulating liquid is discharged so as to cover a part of the first lead 12 (for example, a part of the surface opposite to the substrate 10). The insulating liquid may be discharged so as to contact a part of the first lead 12. The first lead 12 may have a portion that is not covered by the insulating liquid. The insulating liquid may be provided so as to cover a part of the substrate 10 (for example, a part adjacent to the part covered by the insulating layer 16 of the first lead 12). The substrate 10 may have a portion that is not covered by the insulating liquid. And the process (For example, drying, heating, or light irradiation, such as an ultraviolet-ray) which hardens an insulating liquid is performed as needed.

  The method for manufacturing the multilayer wiring board 1 includes forming a wiring layer 20 by discharging a dispersion liquid containing conductive fine particles. As the dispersion liquid containing conductive fine particles, the dispersion liquid described in the method for forming the first and second leads 12 and 14 may be used. The dispersion liquid containing conductive fine particles may be discharged so as to be in contact with the insulating layer 16. The dispersion liquid containing conductive fine particles is discharged through the insulating layer 16 so as to overlap the first lead 12 in a non-contact manner. By doing so, the first portion 22 can be formed. The dispersion liquid containing conductive fine particles is discharged so as to come into contact with the second lead 14. The dispersion liquid containing conductive fine particles is discharged so as to come into contact with at least one (one or both) of the upper surface (surface opposite to the substrate 10) and the side surface (surface rising from the substrate 10) of the second lead 14. May be. In this way, the second portion 24 can be formed. The dispersion liquid containing the conductive fine particles is discharged so as to continuously draw a line from one of the first and second leads 12 and 14 to the other. By doing so, the connecting portion 26 can also be formed. The dispersion liquid containing conductive fine particles may be discharged onto the substrate 10 (for example, discharged so as to contact the substrate 10). And as needed, the process (volatilization) which volatilizes a dispersion liquid and couple | bonds together (for example, sintering) electroconductive fine particles is performed. A process of curing the insulating liquid when forming the insulating layer 16 and a process of bonding conductive fine particles to each other (heating) when forming the first or second leads 12 and 14 or the wiring layer 20 are performed. Etc.) may be performed simultaneously. For example, before the insulating liquid is cured, a dispersion liquid containing conductive fine particles may be discharged thereon, and then a treatment such as heating may be performed. This also applies to other embodiments.

  According to the present embodiment, since the multilayer wiring board 1 can be manufactured without forming a via hole, the process can be simplified, and the degree of freedom in layout design is improved.

(Second Embodiment)
FIG. 3 is a cross-sectional view showing a part of a multilayer wiring board manufactured by the method according to the second embodiment of the present invention. The multilayer wiring board 2 has the substrate 10 described in the first embodiment.

  On the substrate 10 (one surface thereof), a wiring pattern including at least one (a plurality of in FIG. 3) first leads 32 and second and third leads 34 and 36 is formed. The first, second, and third leads 32, 34, and 36 may be formed of the same material (conductive material such as metal). The first, second, and third leads 32, 34, and 36 may extend so as not to cross each other. The first, second, and third leads 32, 34, and 36 may not be electrically connected, or may be electrically connected by other leads (not shown). The first lead 32 is disposed between the second and third leads 34 and 36.

  An insulating layer (electrical insulating layer) 38 is provided on the first lead 32. Specifically, the insulating layer 38 is provided so as to cover a part of the first lead 32 (for example, a part of the surface opposite to the substrate 10). The insulating layer 38 may be in contact with a part of the first lead 32. The first lead 32 may have a portion that is not covered by the insulating layer 38. The insulating layer 38 may cover a part of the substrate 10 (for example, a portion adjacent to the portion covered by the insulating layer 38 of the first lead 32). The substrate 10 may have a portion that is not covered by the insulating layer 38.

  The insulating layer 38 may be provided so as to contact a part of at least one of the second and third leads 34 and 36 (for example, a part of the surface rising from the substrate 10). For example, as shown in FIG. 3, an insulating layer 38 may be provided so as to fill the space between the second and third leads 34 and 36 (contact the surfaces facing each other). As a modification, the insulating layer 38 may be provided so as to completely avoid at least one of the second and third leads 34 and 36.

  The multilayer wiring board 2 has a wiring layer 40. The wiring layer 40 includes at least one (a plurality in FIG. 3) first portion 42 that overlaps the first lead 32 in a non-contact manner via the insulating layer 38. The first portion 42 may be provided in contact with the insulating layer 38. The wiring layer 40 includes a second portion 44 that contacts the second lead 34, and the two are electrically connected by the contact. The wiring layer 40 may be in contact with at least one (one or both) of the upper surface (surface opposite to the substrate 10) and the side surface (surface rising from the substrate 10) of the second lead 34. The wiring layer 40 includes a third portion 46 that contacts the third lead 36, and the two are electrically connected by the contact. The wiring layer 40 may be in contact with at least one (one or both) of the upper surface (surface opposite to the substrate 10) and the side surface (surface rising from the substrate 10) of the third lead 36. The wiring layer 40 may be formed so as to get over the insulating layer 38 and the second and third leads 34 and 36. In other words, the wiring layer 40 extends from the second and third portions 44 and 46 on the second and third leads 34 and 36 in different directions (left and right in FIG. 3) and reaches the substrate 10. May be formed.

  The wiring layer 40 includes a first portion 42 (a first portion 42 closest to the second portion 44 when there are a plurality of first portions 42) and a connection portion 48 of the second portion 44. In the example shown in FIG. 3, the entire connection portion 48 is provided on the insulating layer 38. As a modified example, at least a part (entirely or only a part) of the connection portion 48 may be provided on the substrate 10 (for example, may be in contact with the substrate 10).

  The wiring layer 40 includes a first portion 42 (a first portion 42 closest to the third portion 46 when there are a plurality of first portions 42) and a connection portion 50 between the third portions 46. In the example shown in FIG. 3, the entire connection portion 50 is provided on the insulating layer 38. As a modification, at least a part (entirely or only a part) of the connection part 50 may be provided on the substrate 10 (for example, it may be in contact with the substrate 10).

  When the wiring layer 40 includes a plurality of first portions 42, the wiring layer 40 includes the connecting portions 52 of the adjacent first portions 42. In the example shown in FIG. 3, the entire connection portion 52 is provided on the insulating layer 38. As a modified example, at least a part (entirely or only a part) of the connection part 52 may be provided on the substrate 10 (for example, may be in contact with the substrate 10).

  Next, a method for manufacturing the multilayer wiring board 2 will be described. In the present embodiment, a substrate 10 on which a wiring pattern including first, second, and third leads 32, 34, and 36 is formed is prepared. As a method for forming the first, second, and third leads 32, 34, and 36, the method for forming the first and second leads 12 and 14 described in the first embodiment can be applied.

  The method for manufacturing the multilayer wiring board 2 includes forming the insulating layer 38. The insulating layer 38 may be formed by discharging an insulating liquid (for example, a resin precursor) to the substrate 10. The insulating liquid is discharged so as to cover a part of the first lead 32 (for example, a part of the surface opposite to the substrate 10). The insulating liquid may be discharged so as to contact a part of the first lead 32. The first lead 32 may have a portion that is not covered by the insulating liquid. The insulating liquid may be provided so as to cover a part of the substrate 10 (for example, a part adjacent to the part covered by the insulating layer 38 of the first lead 32). The substrate 10 may have a portion that is not covered by the insulating liquid.

  The insulating liquid may be discharged so as to be in contact with a part of at least one of the second and third leads 34 and 36 (for example, a part of the surface rising from the substrate 10). For example, as shown in FIG. 3, the insulating liquid may be discharged so as to fill the space between the second and third leads 34 and 36 (contact the surfaces facing each other). As a modification, the insulating liquid may be discharged while completely avoiding at least one of the second and third leads 34 and 36. And the process (For example, drying, heating, or light irradiation, such as an ultraviolet-ray) which hardens an insulating liquid is performed as needed.

  The method for manufacturing the multilayer wiring board 2 includes forming a wiring layer 40 by discharging a dispersion liquid containing conductive fine particles. And as needed, the process (volatilization) which volatilizes a dispersion liquid and couple | bonds together (for example, sintering) electroconductive fine particles is performed.

  As the dispersion liquid containing conductive fine particles, the dispersion liquid described in the method of forming the first and second leads 12 and 14 in the first embodiment may be used. The dispersion liquid containing conductive fine particles may be discharged so as to be in contact with the insulating layer 38. The dispersion liquid containing conductive fine particles is discharged through the insulating layer 38 so as to overlap the first lead 32 in a non-contact manner. By doing so, the first portion 42 can be formed. The dispersion liquid containing conductive fine particles is discharged so as to be in contact with the second lead 34. The dispersion liquid containing conductive fine particles is discharged so as to come into contact with at least one (one or both) of the upper surface (surface opposite to the substrate 10) and the side surface (surface rising from the substrate 10) of the second lead 34. May be. In this way, the second portion 44 can be formed. The dispersion liquid containing conductive fine particles is discharged so as to be in contact with the third lead 36. The dispersion liquid containing conductive fine particles is discharged so as to be in contact with at least one (only one or both) of the upper surface (surface opposite to the substrate 10) and the side surface (surface rising from the substrate 10) of the third lead 36. May be. In this way, the third portion 46 can be formed.

  The dispersion liquid containing conductive fine particles may be discharged so as to draw a continuous line from one of the second and third leads 34 and 36 to the other. By doing so, the connecting portions 48, 50, 52 can also be formed. The dispersion liquid containing conductive fine particles may be discharged onto the substrate 10 (for example, discharged so as to contact the substrate 10).

  Specifically, the dispersion containing the conductive fine particles is formed above the first lead 32 (the first lead 32 closest to the second lead 34 when there are a plurality of first leads 32) and the second lead 32. It discharges so that a line may be drawn continuously from either one on the lead 34 to the other. Except on the second lead 34, this discharge may be performed only on the insulating layer 38 (so as not to contact the substrate 10), or may be performed so as to contact the substrate 10. By doing so, the connecting portion 48 can be formed.

  Further, the dispersion liquid containing the conductive fine particles is formed above the first lead 32 (the first lead 32 closest to the third lead 36 when there are a plurality of first leads 32) and the third lead. It discharges so that a line may be drawn continuously from either one on 36 to the other. This discharge may be performed only on the insulating layer 38 (so as not to contact the substrate 10) or on the substrate 10 except on the third lead 36. By doing so, the connecting portion 50 can be formed.

  When a plurality of first leads 32 are formed, the dispersion liquid containing conductive fine particles continuously draws a line from the upper side of one of the adjacent first leads 32 to the upper side of the other. To be discharged. This discharge may be performed only on the insulating layer 38 (so as not to contact the substrate 10) or may be performed so as to contact the substrate 10. In this way, the connection part 52 can be formed.

  According to the present embodiment, since the multilayer wiring board 2 can be manufactured without forming a via hole, the process can be simplified and the degree of freedom in layout design is also improved.

(Third embodiment)
FIG. 4 is a cross-sectional view showing a part of a multilayer wiring board manufactured by the method according to the third embodiment of the present invention. The multilayer wiring board 3 has the substrate 10 described in the first embodiment. A wiring pattern including first and second leads 62 and 64 is formed on the substrate 10 (one surface thereof). The first and second leads 62 and 64 correspond to the contents of the first and second leads 12 and 14 described in the first embodiment. Although the first and second leads 12 and 14 shown in FIG. 1 extend in parallel, the first and second leads 62 and 64 shown in FIG. 3 cross each other (not actually intersect). It extends.

  A first insulating layer (electrical insulating layer) 66 is provided on the first lead 62. The first insulating layer 66 corresponds to the content of the insulating layer 16 described in the first embodiment. The multilayer wiring board 3 has a first wiring layer 70. The first wiring layer 70 corresponds to the contents of the wiring layer 20 described in the first embodiment.

  The multilayer wiring board 3 has a second insulating layer 68. The second insulating layer 68 covers the first wiring layer 70 so that a part thereof is exposed. The second insulating layer 68 is provided so as to be adjacent to the first insulating layer 66. The second insulating layer 68 may be formed of the same material as the first insulating layer 66.

  The multilayer wiring board 3 has a second wiring layer 72. The second wiring layer 72 is formed to be in contact with and overlap the first wiring layer 70 above the first insulating layer 66. The second wiring layer 72 is in contact with the exposed portion of the first wiring layer 70 from the second insulating layer 68. The second wiring layer 72 is formed so as to reach the second insulating layer 68.

  The multilayer wiring board 3 includes a third lead (a part of the wiring pattern) 80 formed on the board 10, at least one (a plurality in FIG. 4) conductive portions 82 stacked thereon, And a third wiring layer 84 formed on the second insulating layer 68 while overlapping with the portion 82.

  Next, a method for manufacturing the multilayer wiring board 3 will be described. In the present embodiment, a substrate 10 on which a wiring pattern including first and second leads 62 and 64 is formed is prepared. As a method of forming the first and second leads 62 and 64, the method of forming the first and second leads 12 and 14 described in the first embodiment may be applied.

  The method for manufacturing the multilayer wiring board 3 includes forming the first insulating layer 66. As the formation method, the formation method of the insulating layer 16 described in the first embodiment may be applied. The method for manufacturing the multilayer wiring board 3 includes forming the first wiring layer 70. As the formation method, the formation method of the wiring layer 20 described in the first embodiment may be applied.

  The manufacturing method of the multilayer wiring board 3 includes forming the second insulating layer 68 by discharging an insulating liquid. As the formation method, the formation method of the insulating layer 16 described in the first embodiment may be applied. When the second insulating layer 68 is formed, the insulating liquid may be discharged so that the first wiring layer 70 is partially exposed but covers other portions. The insulating layer 66 may be adjacent to the insulating layer 66.

  The manufacturing method of the multilayer wiring board 3 includes forming a second wiring layer 72 by discharging a dispersion liquid containing conductive fine particles. As the formation method, the formation method of the wiring layer 20 described in the first embodiment may be applied. The contents described in the first embodiment correspond to the dispersion liquid containing conductive fine particles. When the second wiring layer 72 is formed, the dispersion liquid containing the conductive fine particles is discharged above the first insulating layer 66 by the first wiring layer 70 (specifically, exposure from the second insulating layer 68). Part) and may be carried out so as to reach over the second insulating layer 68.

  According to the present embodiment, since the multilayer wiring board 3 can be manufactured without forming a via hole, the process can be simplified and the degree of freedom in layout design is also improved.

(Other embodiments)
5 to 9 are diagrams showing application examples of the multilayer wiring board manufactured by the method according to the embodiment of the present invention.

  A semiconductor device 100 shown in FIG. 5 is mounted on the multilayer wiring board 102 manufactured by the method according to any one of the embodiments described above, the semiconductor chip 104 mounted on the multilayer wiring board 102, and the multilayer wiring board 102. And external terminals (solder balls) 106.

  A circuit board 110 illustrated in FIG. 6 includes a board (mother board) 112 on which a wiring pattern is formed, and a semiconductor device 100 mounted on the circuit board 112.

  An electronic module (display module such as a liquid crystal module or an electroluminescence module) 120 illustrated in FIG. 7 includes an electronic panel (display panel such as a liquid crystal panel or an electroluminescence panel) 122 and a substrate attached to the electronic panel 122. (For example, a flexible substrate) 124, a wiring pattern (not shown) is formed on the substrate 124, and a semiconductor chip 126 is mounted thereon.

  As an electronic device including any of the multilayer wiring boards 1, 2, 3, the semiconductor device 100, the circuit board 110, and the electronic module 120 described above, a notebook personal computer 1000 and a mobile phone are shown in FIGS. 2000 is shown.

  The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same purposes and results). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment. Furthermore, the present invention may be one that excludes any of the technical matters described in the embodiments in a limited manner. Alternatively, the present invention may be one in which known techniques are limitedly excluded from the above-described embodiments.

FIG. 1 is a plan view showing a part of a multilayer wiring board manufactured by the method according to the first embodiment of the present invention. 2 is a cross-sectional view of the multilayer wiring board shown in FIG. 1 taken along line II-II. FIG. 3 is a cross-sectional view showing a part of a multilayer wiring board manufactured by the method according to the second embodiment of the present invention. FIG. 4 is a cross-sectional view showing a part of a multilayer wiring board manufactured by the method according to the third embodiment of the present invention. FIG. 5 is a diagram showing an application example of the multilayer wiring board manufactured by the method according to the embodiment of the present invention. FIG. 6 is a diagram showing an application example of the multilayer wiring board manufactured by the method according to the embodiment of the present invention. FIG. 7 is a diagram showing an application example of the multilayer wiring board manufactured by the method according to the embodiment of the present invention. FIG. 8 is a diagram showing an application example of the multilayer wiring board manufactured by the method according to the embodiment of the present invention. FIG. 9 is a diagram showing an application example of the multilayer wiring board manufactured by the method according to the embodiment of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Multilayer wiring board 2 ... Multilayer wiring board 3 ... Multilayer wiring board 10 ... Substrate 12 ... 1st lead 14 ... 2nd lead 16 ... Insulating layer 20 ... Wiring layer 22 ... 1st part 24 ... 2nd part 26 ... Connecting portion 32 ... First lead 34 ... Second lead 36 ... Third lead 38 ... Insulating layer 40 ... Wiring layer 42 ... First part 44 ... Second part 46 ... Third part 48 ... Connection part 50 ... Connection part 52 ... Connection part 62 ... First lead 64 ... Second lead 66 ... First insulating layer 68 ... Second insulating layer 70 ... First wiring layer 72 ... Second wiring layer DESCRIPTION OF SYMBOLS 80 ... 3rd lead 82 ... Conductive part 84 ... 3rd wiring layer 100 ... Semiconductor device 102 ... Multilayer wiring board 104 ... Semiconductor chip 110 ... Circuit board 112 ... Substrate 120 ... Electronic module 122 ... Electronic panel 124 ... Base Board 126 ... Semiconductor chip

Claims (6)

Providing an insulating layer so as to cover part of the first lead by discharging an insulating liquid onto the substrate on which the wiring pattern including the first and second leads is formed; and
A first portion that overlaps the first lead in a non-contact manner via the insulating layer; a second portion that contacts the second lead; and a connecting portion between the first and second portions. Discharging a dispersion containing conductive fine particles to form a wiring layer,
A method of manufacturing a multilayer wiring board including: In the manufacturing method of the multilayer wiring board of Claim 1,
The wiring pattern includes a third lead,
The first lead is disposed between the second and third leads;
A method of manufacturing a multilayer wiring board, wherein the wiring layer is formed so as to have a third portion that contacts the third lead and a connection portion between the first and third portions. In the manufacturing method of the multilayer wiring board of Claim 1 or Claim 2,
The wiring layer is used as a first wiring layer, and a dispersion liquid containing the conductive fine particles is discharged so that the second wiring layer is in contact with and overlaps the first wiring layer above the insulating layer. A method of manufacturing a multilayer wiring board, further comprising forming. In the manufacturing method of the multilayer wiring board of Claim 3,
The insulating layer is used as the first insulating layer, the second insulating layer is covered so that a part of the first wiring layer is exposed, and is adjacent to the first insulating layer. Further forming by discharging the liquid,
A method of manufacturing a multilayer wiring board, wherein the second wiring layer is formed so as to come into contact with an exposed portion of the first wiring layer from the second insulating layer and to reach the second insulating layer. In the manufacturing method of the multilayer wiring board as described in any one of Claims 1-4,
A method for manufacturing a multilayer wiring board, further comprising forming the wiring pattern formed on the substrate by discharging a dispersion containing the conductive fine particles.   A multilayer wiring board manufactured by the method according to any one of claims 1 to 5.

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