JP2005259916A - Component mounting apparatus and method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To securely control the shape of a bump and arbitrarily control the mounting height of a component. <P>SOLUTION: A component mounting apparatus comprises a holding means 22 for holding a first component 26, a support means 36 for supporting a second component 48 on which the first component 26 is mounted, heating means 20, 34 for heating at least one of the first component 26 or the second component 48, a temperature measuring means for measuring temperatures of the heating means 20, 34, a separation distance measuring means for measuring a separation distance between the holding means 22 and the support means 36, a computing means for computing a separation distance between the first component 26 and the second component 48 on the basis of the measurement result of the temperature measuring means and the separation distance measuring means, a driving means for driving at least one of the holding means 22 or the support means 36 to change the position thereof, and a control means for controlling the driving means on the basis of the computation result of the computing means. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting an optical component such as a laser diode on a substrate.

  As a conventional bonding apparatus, a bonding tool having an adsorbing means for adsorbing and holding a semiconductor chip and a heating means for heating the semiconductor chip, a Z-axis driving means of the bonding tool, and a bonding tool to the semiconductor chip after the bonding operation is started A switching means from pressure control for performing pressurization to position control for stopping the pressurization of the bonding tool and holding at a predetermined minute rising position, and heating means for heating at the time of switching or before switching by the switching means Is known (see Patent Document 1 below).

  According to this bonding apparatus, the semiconductor chip and the substrate are switched by switching from pressure control for pressurizing the bonding tool to the semiconductor chip by the switching unit to position control for stopping the pressing of the bonding tool and holding the bonding tool at a predetermined minute rising position. It is thought that the shape of the bumps between and can be made into a drum shape, and poor connection can be prevented.

JP-A-6-252221

However, in the above bonding apparatus, the mechanical part of the bonding apparatus is thermally deformed due to the heat generated from the heating means, thereby changing the position of the bonding tool. Under such circumstances, it is difficult to reliably control the shape of the bumps only by driving and stopping the Z-axis driving means by a minute amount.
Further, in the above bonding apparatus, the position of the semiconductor chip in the height direction is controlled by lowering the bonding tool to press the semiconductor chip against the substrate and stopping the bonding tool in a state where a predetermined load is reached. However, when the mechanical part of the bonding apparatus is thermally deformed, such position control cannot be performed accurately, and there is a problem that mounting accuracy is lowered.

  In view of the above circumstances, an object of the present invention is to provide a component mounting apparatus and a component mounting method capable of reliably controlling the shape of a bump and improving mounting accuracy.

  According to a first aspect of the present invention, there is provided holding means for holding the first component, support means for supporting the second component on which the first component is mounted, and at least one of the first component or the second component. Heating means for heating; separation distance measuring means for measuring a separation distance between the holding means and the supporting means; driving means for driving at least one of the holding means or the supporting means to change the position; and the driving means And a control means for controlling.

According to the first aspect of the present invention, the first part is held by the holding means, and the second part is supported by the support means. When the first component or the second component is mounted using the bump, the bump can be brought into a molten state by heating at least one of the first component or the second component by the heating means.
Here, the separation distance between the holding means and the support means is measured by the separation distance measuring means, and the driving means is controlled by the control means while observing the measurement result, and the holding means or the supporting means is driven by the driving means. The first part can be mounted on the second part by changing the position. For this reason, a 1st component can be mounted in arbitrary height with respect to a 2nd component. In addition, when the first component and the second component are mounted using bumps, the shape of the bumps can be controlled so that the shape of the bumps becomes a predetermined shape.

  According to a second aspect of the present invention, there is provided holding means for holding the first component, support means for supporting the second component on which the first component is mounted, and at least one of the first component or the second component. A heating means for heating, a temperature measuring means for measuring the temperature of the heating means, a separation distance measuring means for measuring a separation distance between the holding means and the support means, and the temperature measuring means and the separation distance measuring means. Calculation means for calculating a separation distance between the first part and the second part based on a measurement result; drive means for driving at least one of the holding means or the support means to change the position; and Control means for controlling the driving means based on the calculation result.

According to the second aspect of the present invention, the first part is held by the holding means, and the second part is supported by the support means. When the first component or the second component is mounted using the bump, the bump can be brought into a molten state by heating at least one of the first component or the second component by the heating means.
Here, the temperature of the heating means is measured by the temperature measurement means, and the separation distance between the holding means and the support means is measured by the separation distance measurement means. Then, based on the measurement result of the temperature measurement unit and the measurement result of the separation distance measurement unit, the separation distance between the first component and the second component is calculated by the calculation unit. The drive means is controlled by the control means based on the calculation result of the calculation means. The holding means or the supporting means is driven by the driving means, and its position changes. Thereby, the separation distance between the first component and the second component is accurately controlled, and the first component is mounted on the second component.
As described above, the first part, the second part, the holding means, the supporting means, and the like are thermally deformed by heating by the heating means, but by measuring the temperature of the heating means and taking into account the thermal deformation of each of the parts. The distance between the first component and the second component can be accurately detected. As a result, the first component can be mounted at an arbitrary height with respect to the second component. In addition, when the first component and the second component are mounted using bumps, the shape of the bumps can be controlled so that the shape of the bumps becomes a predetermined shape.

  According to a third aspect of the present invention, in the component mounting apparatus according to the first or second aspect, an electrode is formed on each of the holding unit and the support unit, and the separation distance measuring unit is formed on the holding unit. It is a capacitance meter that measures a capacitance between the electrode and the electrode formed on the support means.

  According to the third aspect of the present invention, electrodes are formed on the holding means and the supporting means, respectively, and the capacitance between the electrodes is measured by the capacitance meter. By measuring with this capacitance meter, the measurement accuracy of the separation distance between the first component and the second component can be improved. As a result, the mounting accuracy of the first component with respect to the second component can be increased. In addition, when the first component and the second component are mounted using bumps by increasing the mounting accuracy of the first component with respect to the second component, the bump shape is set so that the bump shape becomes a predetermined shape. Can be controlled.

  According to a fourth aspect of the present invention, in the component mounting apparatus according to the first or second aspect, a protruding means is provided on at least one of the holding means or the supporting means, and the first electrode is formed on the protruding means. A second electrode is formed on the holding means or the supporting means not provided with the protruding means, and the separation distance measuring means measures a capacitance between the first electrode and the second electrode. It is a capacitance meter.

According to the fourth aspect of the present invention, the first electrode is formed on the protruding means, and the second electrode is formed on the holding means or the supporting means not provided with the protruding means. The capacitance between the first electrode and the second electrode is measured by a capacitance meter.
Here, since the projecting means is provided in at least one of the holding means or the support means, the separation distance between the first electrode and the second electrode can be reduced, which is sufficient for the measurement by the capacitance meter. Capacitance can be obtained. As a result, the measurement accuracy by the capacitance meter can be further increased, and the mounting accuracy of the first component to the second component can be increased. In addition, when the first component and the second component are mounted using bumps by increasing the mounting accuracy of the first component with respect to the second component, the bump shape is set so that the bump shape becomes a predetermined shape. Can be controlled.

  According to a fifth aspect of the present invention, in the component mounting apparatus according to the fourth aspect, a third electrode is formed between the protruding means and the holding means or the supporting means provided with the protruding means. A voltage having the same potential as that of the first electrode is applied to the third electrode.

  According to the fifth aspect of the present invention, the third electrode is formed between the protruding means and the holding means or the supporting means provided with the protruding means, and the third electrode has the same potential as the first electrode. Is applied, the electrostatic capacitance generated between the first electrode and the second electrode is caused by the peripheral portion of the protruding means not related to the measurement (the holding means or the supporting means provided with the protruding means). This can prevent the measurement of capacitance from being affected. Thereby, the capacitance meter measures only the capacitance generated between the first electrode and the second electrode without being affected by the capacitance generated by the peripheral portion of the protruding means not related to the measurement. Therefore, the measurement accuracy of the capacitance meter is improved. As a result, the distance between the first component and the second component can be accurately measured.

  According to a sixth aspect of the present invention, in the component mounting device according to the fourth or fifth aspect, the protruding means is detachably provided on at least one of the holding means or the support means. .

  According to the invention described in claim 6, since the protruding means is detachably provided on at least one of the holding means and the supporting means, the size (particularly the thickness dimension) of the first part or the second part has changed. In some cases, it is possible to easily replace the projection means with an optimal size.

  The invention according to claim 7 is a holding step of holding the first part by the holding means, a supporting step of supporting the second part by the supporting means, and at least one of the first part or the second part by the heating means. At least one of the holding means and the support means by controlling the driving means by the control means, the heating step for heating the separation means, the separation distance measurement process for measuring the separation distance between the holding means and the support means by the separation distance measurement means, And a control step of changing the position of.

  According to the seventh aspect of the present invention, the first component is held by the holding means in the holding step. In the supporting step, the second component is supported by the supporting means. In the heating step, at least one of the first component and the second component is heated by the heating means. Thereby, when the first component or the second component is mounted using the bump, the bump can be in a molten state. In the separation distance measuring step, the separation distance between the holding means and the support means is measured by the separation distance measuring means. In the control step, the driving means is controlled by the control means based on the measurement result of the separation distance measuring means, and the position of at least one of the holding means and the supporting means is changed by the driving means. Thereby, the separation distance between the first component and the second component is accurately controlled, and the first component is mounted on the second component. As a result, the first component can be mounted at an arbitrary height with respect to the second component. In addition, when the first component and the second component are mounted using bumps, the shape of the bumps can be controlled so that the shape of the bumps becomes a predetermined shape.

  The invention according to claim 8 is a holding step of holding the first part by the holding means, a supporting step of supporting the second part by the supporting means, and at least one of the first component or the second part by the heating means. A heating step for heating the heating means, a temperature measuring step for measuring the temperature of the heating means by a temperature measuring means, a separation distance measuring step for measuring a separation distance between the holding means and the supporting means by a separation distance measuring means, Based on the measurement result of the temperature measurement means and the measurement result of the separation distance measurement means, the calculation step of calculating the separation distance between the first part and the second part by the calculation means, and based on the calculation result of the calculation step And a control step of controlling the driving means by the control means to change the position of at least one of the holding means or the support means.

According to the eighth aspect of the invention, the first component is held by the holding means in the holding step. In the supporting step, the second component is supported by the supporting means. In the heating step, at least one of the first component and the second component is heated by the heating means. Thereby, when the first component or the second component is mounted using the bump, the bump can be in a molten state. In the temperature measurement step, the temperature of the heating unit is measured by the temperature measurement unit, and in the separation distance measurement step, the separation distance between the holding unit and the support unit is measured by the separation distance measurement unit. In the calculation step, the separation distance between the first component and the second component is calculated by the calculation means based on the measurement result of the temperature measurement means and the measurement result of the separation distance measurement means. In the control step, the drive unit is controlled by the control unit based on the calculation result of the calculation step, and the position of at least one of the holding unit or the support unit is changed by the drive unit. Thereby, the separation distance between the first component and the second component is accurately controlled, and the first component is mounted on the second component.
As described above, the first part, the second part, the holding means, the supporting means, and the like are thermally deformed by heating by the heating means, but by measuring the temperature of the heating means and taking into account the thermal deformation of each of the parts. The distance between the first component and the second component can be accurately detected. As a result, the first component can be mounted at an arbitrary height with respect to the second component. In addition, when the first component and the second component are mounted using bumps, the shape of the bumps can be controlled so that the shape of the bumps becomes a predetermined shape.

  In the first aspect of the invention, the separation distance between the holding means and the support means is measured by the separation distance measuring means, and the driving means is controlled by the control means while observing the measurement result, and the holding means or the support means is driven. The first component can be mounted on the second component at an arbitrary height by being driven by the means to change its position and mounting the first component on the second component. In addition, when the first component and the second component are mounted using bumps, the shape of the bumps can be controlled so that the shape of the bumps becomes a predetermined shape.

  In the second aspect of the present invention, the first part, the second part, the holding means, the supporting means, and the like are thermally deformed by heating by the heating means. By considering this, the separation distance between the first part and the second part can be accurately detected. As a result, the first component can be mounted at an arbitrary height with respect to the second component. In addition, when the first component and the second component are mounted using bumps, the shape of the bumps can be controlled so that the shape of the bumps becomes a predetermined shape.

  In the third aspect of the present invention, electrodes are formed on the holding means and the supporting means, respectively, and the capacitance between the electrodes is measured by a capacitance meter. The measurement accuracy of the separation distance can be improved. As a result, the mounting accuracy of the first component with respect to the second component can be increased. In addition, when the first component and the second component are mounted using bumps by increasing the mounting accuracy of the first component with respect to the second component, the bump shape is set so that the bump shape becomes a predetermined shape. Can be controlled.

  According to a fourth aspect of the present invention, the first electrode is formed on the protruding means, and the second electrode is formed on the holding means or the supporting means not provided with the protruding means. The electrostatic capacitance between the first electrode and the second electrode is measured by the above, but by providing the protruding means, the distance between the first electrode and the second electrode can be reduced, Sufficient capacitance necessary for measurement with a capacitance meter can be obtained. As a result, the measurement accuracy by the capacitance meter can be further increased, and the mounting accuracy of the first component to the second component can be increased. In addition, when the first component and the second component are mounted using bumps by increasing the mounting accuracy of the first component with respect to the second component, the bump shape is set so that the bump shape becomes a predetermined shape. Can be controlled.

  According to a fifth aspect of the present invention, a third electrode is formed between the protruding means and the holding means or the supporting means provided with the protruding means, and a voltage having the same potential as the first electrode is applied to the third electrode. As a result, the electrostatic capacitance generated between the first electrode and the second electrode is generated by the peripheral portion of the protruding means not related to the measurement (the holding means or the supporting means provided with the protruding means). Can be prevented from affecting the measurement. Thereby, the capacitance meter measures only the capacitance generated between the first electrode and the second electrode without being affected by the capacitance generated by the peripheral portion of the protruding means not related to the measurement. Therefore, the measurement accuracy of the capacitance meter is improved. As a result, the distance between the first component and the second component can be accurately measured.

  According to the sixth aspect of the present invention, since the protruding means is detachably provided on at least one of the holding means and the supporting means, the size (particularly the thickness dimension) of the first part or the second part changes. Therefore, it is possible to easily replace the projecting means with the optimal size.

  In the seventh aspect of the invention, the separation distance between the holding means and the support means is measured by the separation distance measurement means in the separation distance measurement step, and the driving means is based on the measurement result of the separation distance measurement means by the control means in the control step. The position of at least one of the holding means and the supporting means is changed by the driving means. Thereby, the separation distance between the first component and the second component is accurately controlled, and the first component is mounted on the second component. As a result, the first component can be mounted at an arbitrary height with respect to the second component. In addition, when the first component and the second component are mounted using bumps, the shape of the bumps can be controlled so that the shape of the bumps becomes a predetermined shape.

  According to the eighth aspect of the present invention, the first part, the second part, the holding means, the support means, and the like are thermally deformed by heating by the heating means. By considering this, the separation distance between the first part and the second part can be accurately detected. As a result, the first component can be mounted at an arbitrary height with respect to the second component. In addition, when the first component and the second component are mounted using bumps, the shape of the bumps can be controlled so that the shape of the bumps becomes a predetermined shape.

  Next, a component mounting apparatus and a component mounting method according to an embodiment of the present invention will be described with reference to the drawings.

As shown in FIGS. 1 and 2, the component mounting apparatus 10 includes a head 12. A driving device 14 (driving means) is connected to the top of the head 12. The driving device 14 includes a base portion 14A located on the upper side (arrow A direction side in FIG. 1), and a telescopic portion 14B connected to the lower side of the base portion 14A (arrow B direction in FIG. 1). It is configured. In addition, the expansion / contraction part 14B is configured to be extendable / contractible in the vertical direction (the arrow Z direction in FIG. 1) with respect to the base part 14A. The height of the head 12 can be adjusted by the expansion / contraction of the expansion / contraction part 14B. As shown in FIG. 6, the driving of the driving device 14 is controlled by the control unit 54 based on the calculation result of the CPU 56 described later.
The base portion 14A is attached to a rail 16 that extends in the horizontal direction (the direction of arrow X in FIG. 1), and the head 12 can also move in the horizontal direction by moving the base portion 14A on the rail 16. It has become.

  Further, a linear scale 18 for detecting the height of the head 12 is provided in the vicinity of the side surface of the extendable portion 14B. The linear scale 18 includes a scale 18A attached to the extendable portion 14B and a measurement head 18B that detects the position of the scale 18A. By detecting the position of the scale 18A by the measuring head 18B, the height of the head 12 can be measured.

Further, the head 12 is attached to the lower end portion of the extendable portion 14B, and a head side heater chip (heating means) 20 is attached to the tip end portion of the head 12. The operation of the head side heater chip 20 is controlled by a control unit 54 (see FIG. 6) described later.
A flat work suction attachment 22 is attached to the lower surface of the head side heater chip 20 by a suction device (not shown) sucking air.

Further, as shown in FIGS. 3 and 4, the workpiece attracting attachment 22 is formed with a flat projection 24. A suction hole 25 (see FIG. 4) is formed in the projection 24, and the work (first part) 26 is sucked by suction of air by a suction device (not shown).
A ground electrode (second electrode) 28 is formed in a predetermined region on the lower surface of the work suction attachment 22 by sputtering, vapor deposition, plating, or the like. A heat-resistant electric wire 30 (not shown in FIG. 4) is connected to the ground electrode 28, and the heat-resistant electric wire 30 is connected to a capacitance meter (separation distance measuring means) 62 (see FIG. 6).

On the other hand, the component mounting apparatus 10 includes a stage 32 fixed to the floor surface. A stage-side heater chip (heating means) 34 is attached to the upper surface of the stage 32. The operation of the stage side heater chip 34 is controlled by a control unit 54 (see FIG. 6) described later.
Further, a flat plate-like substrate suction attachment 36 is attached to the upper surface of the stage side heater chip 34 by a suction device (not shown) sucking air. A measurement electrode flat plate (projecting means) 38 is similarly attached to the upper surface of the substrate suction attachment 36 by air suction.

  Further, as shown in FIG. 5, a guard electrode (third electrode) 40 is formed between the measurement electrode flat plate 38 and the substrate suction attachment 36 by sputtering, vapor deposition, plating, or the like. The region where the guard electrode 40 is formed is set to be substantially the same region as the region where the ground electrode 28 is formed. A heat-resistant electric wire 42 (not shown in FIG. 5) is connected to the guard electrode 40, and the heat-resistant electric wire 42 is connected to the capacitance meter 62 (see FIG. 6).

  A measurement electrode (first electrode) 44 is formed on the upper surface of the measurement electrode flat plate 38 by sputtering, vapor deposition, plating, or the like. A heat-resistant electric wire 46 (not shown in FIG. 5) is connected to the measurement electrode 44, and the heat-resistant electric wire 46 is connected to the capacitance meter 62.

  Further, as shown in FIG. 5, a suction hole 50 is formed in the center of the substrate suction attachment 36. The substrate 48 can be sucked and held on the substrate suction attachment 36 by sucking air from the suction hole 50 by a suction device (not shown).

As shown in FIG. 6, the head side heater chip 20 and the stage side heater chip 34 include a temperature measuring device (for example, a thermocouple, etc.) that measures the temperature of the head side heater chip 20 and the stage side heater chip 34. Measuring means) 52 are connected to each other. The temperature measuring device 52 is connected to the control unit 54.
Further, a CPU (calculation means) 56 is connected to the control unit 54. The CPU 56 calculates the separation distance between the workpiece 26 and the substrate 48 based on the measurement result by the temperature measurement device 52 and the measurement result by the capacitance meter 62.
Further, a memory 60 is connected to the control unit 54. The memory 60 includes first data (known data that has been measured in advance) indicating the correlation between the change in capacitance and the separation distance, and the workpiece 26, the substrate 48, the protrusion 24, and the measurement electrode. Each dimension of the flat plate 38 and second data that summarizes the thermal expansion coefficient are stored.

  Next, a component mounting method using the component mounting apparatus 10 of the present embodiment will be described.

  As shown in FIGS. 1 to 6, the workpiece 26 is sucked and held on the protrusion 24 of the workpiece suction attachment 22 (holding step). On the other hand, the substrate 48 is sucked and held on the substrate suction attachment 36 (supporting step). The workpiece 26 and the substrate 48 are adsorbed and held by the air suction force by the suction device as described above. By adsorbing and holding the workpiece 26 and the substrate 48 with an air suction force, the work 26 and the substrate 48 can be easily detached, and the work efficiency can be improved.

  After the holding process and the supporting process are finished, the head side heater chip 20 and the stage side heater chip 34 are operated by the control unit 54, and the head side heater chip 20 and the stage side heater chip 34 generate heat (heating process). When the head side heater chip 20 generates heat, the heat is transferred to the work suction attachment 22 and the protrusion 24, and the work 26 is heated. When the workpiece 26 is heated, bumps (not shown) provided on the workpiece 26 are in a molten state. On the other hand, when the stage-side heater chip 34 generates heat, the heat is transferred to the substrate suction attachment 36 and the substrate 48 is heated. When the substrate 48 is heated, bumps (not shown) provided on the substrate 48 are in a molten state.

  Next, while confirming the position of the scale 18 </ b> A with the measuring head 18 </ b> B, the drive unit 14 is driven and controlled (feedback control) by the control unit 54. At this time, the driving device 14 is appropriately controlled by detecting the scale of the scale 18A with the measuring head 18B. By this drive control, the telescopic portion 14B extends downward relative to the base portion 14A, and the head 12 moves downward (in the direction of arrow B in FIG. 3). Thereby, the workpiece | work 26 and the board | substrate 48 approach.

  Here, a voltage is applied to the guard electrode 40 by the capacitance meter 62 so that the guard electrode 40 and the measurement electrode 44 have the same potential (voltage application step). In this way, by setting the guard electrode 40 and the measurement electrode 44 to the same potential, the capacitance generated between the measurement electrode 44 and the stage side heater chip 34 in the measurement by the capacitance meter 62 is grounded. It is not added to the capacitance between the electrode 28 and the measurement electrode 44. For this reason, since it is not influenced by the electrostatic capacitance produced between the measurement electrode 44 and the stage side heater chip 34, the measurement precision by the electrostatic capacitance meter 62 improves.

Moreover, the temperature of the workpiece | work side heater chip | tip 20 and the stage side heater chip | tip 34 is measured by the temperature measurement apparatus 52 (temperature measurement process). Here, as described above, when the work side heater chip 20 generates heat, heat is transferred to the work 26, but the heat conductivity of the work suction attachment 22 and the protrusion 24 is extremely high, and the heat capacity of the work 26 is extremely small. The temperature of the workpiece 26 becomes substantially the same as the temperature of the workpiece-side heater chip 20.
Similarly, since the thermal conductivity of the substrate adsorption attachment 36 is extremely high and the thermal capacity of the substrate 48 is extremely small, the temperature of the substrate 48 becomes substantially the same as the temperature of the stage side heater chip 34. A measurement result by the temperature measuring device 52 is output to the CPU 56. For this reason, if the temperature of the workpiece | work side heater chip | tip 20 and the temperature of the stage side heater chip | tip 34 are set the same, the temperature of the workpiece | work 26 and the board | substrate 48 will become substantially the same.
Even when the work 26 and the substrate 48 are cooled, the heat capacities of the work suction attachment 22 and the substrate suction attachment 36 are set to be approximately the same, and the work side heater chip 20 and the stage side heater chip 34 are placed in a flow path (not shown). If cooling is performed to the same extent by flowing a cooling gas, the temperatures of the workpiece 26 and the substrate 48 become substantially the same.

Further, when the work 26 and the substrate 48 approach each other by driving the driving device 14, the capacitance between the ground electrode 28 and the measurement electrode 44 increases. This capacitance is measured by the capacitance meter 62 (separation distance measurement step). The measurement result of the capacitance by the capacitance meter 62 is output to the CPU 56.
Here, since the measurement electrode flat plate 38 is installed in the substrate suction attachment 36, the distance between the ground electrode 28 and the measurement electrode 44 can be reduced, which is necessary for the measurement by the capacitance meter 62. Sufficient capacitance can be obtained. As a result, the measurement accuracy of the capacitance by the capacitance meter 62 can be further increased.

Next, in the CPU, first, based on the first data stored in the memory 60 and the measurement result by the capacitance meter 62, the separation distance between the work suction attachment 22 and the measurement electrode flat plate 38 is calculated (calculation). Process).
The memory 60 also stores second data that summarizes the dimensions and thermal expansion coefficients of the workpiece 26, the substrate 48, the protrusion 24, and the measurement electrode flat plate 38. The distance between the workpiece 26 and the substrate 48 is calculated based on the calculation result of the distance between the attachment 22 for measurement and the measurement electrode flat plate 38 (calculation step).

Next, the drive unit 14 is controlled by the control unit 54 based on the calculation result of the CPU 56 (control process). Thereby, the position of the head 12 is changed by the drive of the driving device 14. Thus, since the head 12 is controlled based on the accurate distance between the workpiece 26 and the substrate 48, the workpiece 26 can be mounted on the substrate 48 with high accuracy in the Z direction. In particular, when the workpiece 26 is an optical component such as a laser diode (LD) and the substrate 48 is a substrate having an optical waveguide such as a fiber, high mounting accuracy between the workpiece 26 and the substrate 48 is required. By mounting the workpiece 26 and the substrate 48 in the Z direction with high accuracy as in the present invention, the optical axis of the LD and the optical axis of an optical waveguide such as a fiber do not shift after mounting.
In addition, by accurately controlling the separation distance between the workpiece 26 and the substrate 48, when the workpiece 26 and the substrate 48 are mounted using bumps, the bump shape is controlled so that the bump shape becomes a predetermined shape. can do.
Further, by controlling the base portion 14A to move on the rail 16 by the control portion 54, the head 12 can be moved in the horizontal direction (direction of arrow X in FIG. 1), and the workpiece 26 is positioned in the horizontal direction. Is possible. Further, since the base portion 14A is configured to be movable in the depth direction (the arrow Y direction in FIG. 2), the workpiece 26 can be positioned in the depth direction. Further, by configuring the stage 32 so as to be movable in the horizontal direction and the depth direction, the substrate 48 can be positioned in the horizontal direction and the depth direction.
Here, as shown in FIG. 7, the measurement electrode 44 includes an electrode portion 44A, a heat resistant wire connecting portion 44B, and a connecting portion 44C that connects the electrode portion 44A and the heat resistant wire connecting portion 44B. The area of the electrode portion 44A is smaller than the area of the ground electrode 28, and all the positions of the electrode portion 44A face the ground electrode 28 when the work 26 is mounted on the substrate 48. Accordingly, in order to align the positions of the workpiece 26 and the substrate 48 in the XY direction, even if the head 12 and the stage 32 move relatively in the XY direction based on another alignment method that is not disclosed in the present embodiment. If the movement amount is small, only the facing area of the connecting portion 44C of the measuring electrode 44 changes, and the electrode portion 44A always faces the ground electrode 28. The area hardly changes. Therefore, the relative movement in the XY directions of the head 12 and the stage 32 can be prevented from affecting the capacitance value between the measurement electrode 44 and the ground electrode 28, and the mounting accuracy in the Z direction can be prevented. Can be further improved.

  In the above embodiment, the capacitance meter is used to measure the separation distance between the workpiece suction attachment 22 and the measurement electrode flat plate 38, but the present invention is not limited to this. For example, the distance between them may be measured using an optical sensor having a laser beam light emitting part and a light receiving part.

  Further, the driving device 14 may be arranged on the stage 32 side. By disposing the driving device 14 on the stage 32 side, the substrate 48 can be moved in the vertical direction (the arrow Z direction in FIG. 1), and the work of mounting the workpiece 26 and the substrate 48 becomes easier.

It is a schematic block diagram of the component mounting apparatus which concerns on one Embodiment of this invention. It is the perspective view which showed a part of component mounting apparatus which concerns on one Embodiment of this invention. It is the front view which showed a part of component mounting apparatus which concerns on one Embodiment of this invention. It is a perspective view of the holding means which comprises the component mounting apparatus which concerns on one Embodiment of this invention. It is a perspective view of the support means which comprises the component mounting apparatus which concerns on one Embodiment of this invention. It is a block diagram of the component mounting apparatus which concerns on one Embodiment of this invention. It is the conceptual diagram which showed how the 1st electrode (measurement electrode) and the 2nd electrode (ground electrode) overlap.

Explanation of symbols

10 Component mounting device 14 Drive device (drive means)
20 Head side heater chip (heating means)
22 Workpiece attachment (holding means)
26 Workpiece (first part)
28 Ground electrode (second electrode)
34 Stage-side heater chip (heating means)
36 Substrate adsorption attachment (support means)
38 Flat plate for measuring electrode (protruding means)
40 Guard electrode (third electrode)
44 Measuring electrode (first electrode)
48 Substrate (second component)
52 Temperature measuring device (temperature measuring means)
54 Control unit (control means)
56 CPU (calculation means)
62 Capacitance meter (separation distance measuring means)

Claims (8)

Holding means for holding the first component;
Support means for supporting a second component on which the first component is mounted;
Heating means for heating at least one of the first component or the second component;
A separation distance measuring means for measuring a separation distance between the holding means and the support means;
Drive means for driving at least one of the holding means or the support means to change the position;
Control means for controlling the drive means;
A component mounting apparatus comprising: Holding means for holding the first component;
Support means for supporting a second component on which the first component is mounted;
Heating means for heating at least one of the first component or the second component;
Temperature measuring means for measuring the temperature of the heating means;
A separation distance measuring means for measuring a separation distance between the holding means and the support means;
An arithmetic means for calculating a separation distance between the first part and the second part based on measurement results of the temperature measurement means and the separation distance measurement means;
Drive means for driving at least one of the holding means or the support means to change the position;
Control means for controlling the drive means based on the calculation result of the calculation means;
A component mounting apparatus comprising: Electrodes are formed on the holding means and the support means,
2. The capacitance measuring apparatus according to claim 1, wherein the separation distance measuring unit is a capacitance meter that measures a capacitance between the electrode formed on the holding unit and the electrode formed on the supporting unit. Or the component mounting apparatus of 2. Protruding means is provided on at least one of the holding means or the supporting means, the first electrode is formed on the protruding means, and the second electrode is formed on the holding means or the supporting means not provided with the protruding means. And
The component mounting apparatus according to claim 1, wherein the separation distance measuring unit is a capacitance meter that measures a capacitance between the first electrode and the second electrode. A third electrode is formed between the protruding means and the holding means or the supporting means provided with the protruding means,
The component mounting apparatus according to claim 4, wherein a voltage having the same potential as that of the first electrode is applied to the third electrode.   The component mounting apparatus according to claim 4 or 5, wherein the protruding means is detachably provided on at least one of the holding means or the support means. A holding step of holding the first component by the holding means;
A supporting step of supporting the second component by the supporting means;
A heating step of heating at least one of the first component or the second component by a heating means;
A separation distance measuring step of measuring a separation distance between the holding means and the support means by a separation distance measuring means;
A control step of controlling the drive means by the control means to change the position of at least one of the holding means or the support means;
A component mounting method characterized by comprising: A holding step of holding the first component by the holding means;
A supporting step of supporting the second component by the supporting means;
A heating step of heating at least one of the first component or the second component by a heating means;
A temperature measuring step of measuring the temperature of the heating means by a temperature measuring means;
A separation distance measuring step of measuring a separation distance between the holding means and the support means by a separation distance measuring means;
A calculation step of calculating a separation distance between the first component and the second component by a calculation unit based on a measurement result of the temperature measurement unit and a measurement result of the separation distance measurement unit;
A control step of controlling the drive means by the control means based on the calculation result of the calculation step and changing the position of at least one of the holding means or the support means;
A component mounting method characterized by comprising:

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