JP2005258152A - Suction mechanism for photosensitive planar member and image recording apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a suction mechanism for a photosensitive planar member, the mechanism which can reliably suck a photosensitive planar member tightly adhered to a stage in a simple structure even when the member has warpage, and to provide an image recording apparatus equipped with the suction mechanism for a photosensitive planar member. <P>SOLUTION: Each suction disk 118 is energized toward a substrate 150 by a first coil spring 120 so that even when the substrate 150 has warpage, the suckers 118 can be disposed along the profile of the substrate 150 to reliably suck the substrate. A second coil spring 132 having higher elastic force than that of the first coil spring is housed in a plunger 124 and pressurizes the substrate 150 having warpage toward the mount face 152P of the stage 152 to eliminate warpage. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a photosensitive plate-like member suction mechanism and an image recording apparatus.

  In an image recording apparatus in which a photosensitive plate-like member is mounted on a stage and records a desired pattern or the like, a plurality of suction holes are formed on the mounting surface of the stage, and the photosensitive device mounted on the mounting surface. There is a configuration in which an adhesive plate-like member is adsorbed and held by a negative pressure.

  By the way, if the photosensitive plate-like member is warped or the like, a gap is generated between the photosensitive plate-like member and the stage mounting surface, so that air may leak from the suction hole and a sufficient suction force may not be obtained. .

  In order to prevent such inconvenience, for example, in Patent Document 1, the suction member provided integrally with the transport member (stage) has an elastic portion, and can be moved in a direction perpendicular to the suction surface by the transport portion. A substrate suction apparatus is disclosed. Since the suction member protrudes from the suction surface and is brought into contact with the substrate, and the substrate is supported only by the suction member, even if the substrate is greatly deformed, the suction port of the suction member can be brought into contact with the substrate for suction. it can.

  Patent Document 2 discloses a substrate support device in which a support pin is lifted by a cylinder and sucks the back surface of the substrate. The rising strokes of the support pins are set so that the tips of all the support pins completely reach the back surface of the slid substrate, and the excess stroke is absorbed by the spring.

However, the contents disclosed in any of the above patent documents require a mechanism for raising and lowering the suction member and the support pin in the stage, and the structure becomes complicated.
Japanese Patent Laid-Open No. 5-190414 Japanese Patent Laid-Open No. 7-79098

  In consideration of the above facts, the present invention provides a photosensitive plate-like member suction mechanism that can be reliably attached to a stage even when the photosensitive plate-like member is warped with a simple configuration, and the photosensitive plate-like member. It is an object of the present invention to obtain an image recording apparatus having a suction mechanism.

  In the first aspect of the invention, the stage on which the photosensitive plate-like member can be placed on the placement surface and the photosensitive plate-like member placed on the placement surface are sandwiched from the opposite side of the placement surface. A plurality of suction pads capable of advancing and retreating and capable of sucking the photosensitive plate-like member; a biasing member for biasing each of the suction pads toward the photosensitive plate-like member; And a pressing member capable of pressing the suction pad against the plate member with a pressing force stronger than the biasing force of the biasing member.

  In this photosensitive plate-like member suction mechanism, each of the plurality of suction pads can be moved back and forth with respect to the photosensitive plate-like member. Therefore, even if the substrate is warped, each of the suction pads is warped. It can be set to a combined position. Since each of the suction pads is biased toward the photosensitive plate member by the biasing member, the suction pad can be brought into close contact with the photosensitive plate member and the photosensitive plate member can be reliably sucked. In this way, the photosensitive plate-like member can be adsorbed by the suction pad, and the photosensitive plate-like member can be transferred and placed on the placement surface of the stage.

  The pressing member presses the suction pad against the photosensitive plate member on the mounting surface with a pressing force stronger than the urging force of the urging member. As a result, even if the photosensitive plate-like member is warped, it can be strongly pressed against the mounting surface to eliminate the warp, and can be adsorbed while being strongly adhered to the stage. When the photosensitive plate-like member is sucked by the suction pad, if the pressing force by the pressing member is not applied, each of the suction pads can be easily moved to a position corresponding to the warp of the substrate.

  Moreover, the plurality of suction pads are arranged on the opposite side of the placement surface across the photosensitive plate-like member placed on the placement surface, and the biasing member and the pressing member are also located on the opposite side of the placement surface. Can be arranged. Since it is not necessary to provide these members on the stage, the structure is simple.

  The specific configurations of the urging member and the elastic member according to claim 1 are not particularly limited. For example, as the urging member, the first elasticity that elastically urges each of the suction pads as described in claim 2. It can be set as the structure containing the member. As described in claim 3, the pressing member may include a second elastic member that elastically presses the suction pads.

  According to a fourth aspect of the present invention, an image is recorded on the photosensitive plate-like member adsorption mechanism according to any one of the first to third aspects and the photosensitive plate-like member adsorbed on the placement surface. And an image recording means.

  Since the photosensitive plate-like member adsorption mechanism according to any one of claims 1 to 3 is provided, even if the photosensitive plate-like member is warped, it can be reliably brought into close contact with the stage. Can be adsorbed.

  An image can be recorded by the image recording means with the photosensitive plate-like member adsorbed on the stage mounting surface.

  According to a fifth aspect of the present invention, in the invention according to the fourth aspect, the image recording means is a laser recording means for performing image recording by irradiating a photosensitive plate member with a laser beam. Features.

  In this way, by irradiating the photosensitive plate member with the laser beam by the laser recording means, it becomes possible to record an image with high speed and high accuracy.

  Since the present invention has the above-described configuration, even if the photosensitive plate-like member is warped, it can be reliably adsorbed by being brought into close contact with the stage.

  8 and 9 show the substrate suction mechanism 104 according to the first embodiment of the present invention. FIG. 1 shows an image recording apparatus 102 provided with the substrate suction mechanism 104.

  This image recording apparatus 102 is a so-called flat bed type image recording apparatus, and adsorbs a substrate 150, which is an example of a photosensitive plate-like member, to the surface (mounting surface 152P) as shown in FIG. A holding stage 152 is provided. Two guides 158 extending along the stage moving direction are installed on the upper surface of the plate-shaped surface plate 156 supported by the four legs 154. The stage 152 is arranged so that the longitudinal direction thereof faces the stage moving direction, and is supported by a guide 158 so as to be reciprocally movable. The image recording apparatus is provided with a driving device (not shown) for driving the stage 152 along the guide 158, and has a desired moving speed (scanning speed) in the scanning direction, as will be described later. As described above, the drive is controlled by a controller (not shown).

  A gate 160 is provided at the center of the surface plate 156 so as to straddle the moving path of the stage 152. Each end of the U-shaped gate 160 is fixed to both side surfaces of the surface plate 156. A scanner 162 is provided on one side of the gate 160, and a plurality (for example, two) of detection sensors 164 for detecting alignment marks provided on the substrate 150 are provided on the other side. The scanner 162 and the detection sensor 164 are respectively attached to the gate 160 and fixed above the moving path of the stage 152. The scanner 162 and the detection sensor 164 are connected to a controller (not shown) that controls them, and are controlled to be exposed at a predetermined timing when exposure is performed by the exposure head 166, as will be described later.

  The detection sensor 164 includes a strobe (not shown) as a light source at the time of imaging, and the light receiving sensitivity is set so that imaging can be performed only when the strobe emits light. .

  The detection sensor 164 emits a strobe at a predetermined timing when the stage 152 passes through the imaging position immediately below the detection position, and receives the reflected light from the strobe, thereby forming an alignment mark formed on the substrate 150. Each of the imaging ranges including is imaged. Further, the detection sensor 164 can be adjusted along the width direction according to the position of the alignment mark and the like.

  The scanner 162 is supported by the gate 160 so that the position can be adjusted along the scanning direction. Thereby, the distance between the imaging position by the detection sensor 164 and the exposure position by the scanner 162 can be adjusted within a predetermined range.

As shown in FIGS. 2 and 3B, the scanner 162 includes a plurality of exposure heads 166 arranged in an approximately matrix of m rows and n columns (for example, 3 rows and 5 columns). In this example, in relation to the width of the substrate 150, five exposure heads 166 are arranged in the first and second rows, and four exposure heads 166 are arranged in the third row. In addition, when showing each exposure head arranged in the m-th row and the n-th column, it is expressed as an exposure head 166 _mn .

In FIG. 2, the exposure area 168 by the exposure head 166 has a rectangular shape with the scanning direction as the short side and is inclined at a predetermined inclination angle with respect to the head arrangement direction. As the stage 152 moves, a strip-shaped exposed area 170 is formed on the substrate 150 for each exposure head 166. In addition, when showing the exposure area by each exposure head arranged in the m-th row and the n-th column, it is expressed as an exposure area 168 _mn .

Further, as shown in FIGS. 3A and 3B, the exposure heads of the respective rows arranged in a line so that each of the strip-shaped exposed areas 170 partially overlaps the adjacent exposed areas 170 are formed. Each is arranged at a predetermined interval in the head alignment direction. Therefore, can not be exposed portion between the exposure area 168 ₁₁ in the first row and the exposure area 168 _12, it can be exposed by the second row of the exposure area 168 ₂₁ and the exposure area 168 ₃₁ in the third row.

Each of the exposure heads 166 _{11 to} 166 _mn is a spatial light modulator that modulates an incident light beam for each pixel according to image data, as shown in FIGS. 4, 5 (A) and (B). A digital micromirror device (DMD) 50 is provided. The DMD 50 is connected to a controller (not shown) including a data processing unit and a mirror drive control unit. The data processing unit of the controller generates a control signal for driving and controlling each micromirror in the region to be controlled by the DMD 50 for each exposure head 166 based on the input image data.

  The mirror drive control unit controls the angle of the reflection surface of each micromirror of the DMD 50 for each exposure head 166 based on the control signal generated by the image data processing unit.

  On the light incident side of the DMD 50, a fiber array light source 66 including a laser emitting section in which emission ends (light emitting points) of an optical fiber are arranged in a line along a direction corresponding to the long side direction of the exposure area 168, a fiber A lens system 67 for correcting the laser light emitted from the array light source 66 and condensing it on the DMD, and a mirror 69 for reflecting the laser light transmitted through the lens system 67 toward the DMD 50 are arranged in this order.

  The lens system 67 includes a pair of combination lenses 71 that collimate the laser light emitted from the fiber array light source 66 and a pair of combination lenses that correct the light quantity distribution of the collimated laser light to be uniform. 73 and a condensing lens 75 that condenses the laser light whose light quantity distribution is corrected on the DMD. With respect to the arrangement direction of the laser emitting ends, the combination lens 73 spreads the light beam at a portion close to the optical axis of the lens and contracts the light beam at a portion away from the optical axis, and with respect to a direction orthogonal to the arrangement direction. Has a function of allowing light to pass through as it is, and corrects the laser light so that the light quantity distribution is uniform.

  Further, on the light reflection side of the DMD 50, lens systems 54 and 58 that form an image of the laser light reflected by the DMD 50 on the scanning surface (exposed surface) 56 of the substrate 150 are arranged. The lens systems 54 and 58 are arranged so that the DMD 50 and the exposed surface 56 are in a conjugate relationship.

  In the present embodiment, the laser light emitted from the fiber array light source 66 is set to be approximately 5 μm by each lens system 54 and 58 after being substantially magnified 5 times. .

  As shown in FIG. 6, the DMD 50 is configured such that a micromirror 62 is supported by a support column on an SRAM cell (memory cell) 60, and a large number of (pixels) (pixels) are formed. For example, it is a mirror device configured by arranging micromirrors with a pitch of 13.68 μm, 1024 × 768) in a grid pattern. Each pixel is provided with a micromirror 62 supported by a support column at the top, and a material having a high reflectance such as aluminum is deposited on the surface of the micromirror 62. The reflectance of the micromirror 62 is 90% or more. A silicon gate CMOS SRAM cell 60 manufactured in a normal semiconductor memory manufacturing line is disposed directly below the micromirror 62 via a support including a hinge and a yoke, and is entirely monolithic (integrated type). ).

  When a digital signal is written in the SRAM cell 60 of the DMD 50, the micromirror 62 supported by the support is inclined within a range of ± α degrees (for example, ± 10 degrees) with respect to the substrate side on which the DMD 50 is disposed with the diagonal line as the center. It is done. FIG. 7A shows a state in which the micromirror 62 is tilted to + α degrees in the on state, and FIG. 7B shows a state in which the micromirror 62 is tilted to −α degrees in the off state. Therefore, by controlling the inclination of the micromirror 62 in each pixel of the DMD 50 as shown in FIG. 6 according to the image signal, the light incident on the DMD 50 is reflected in the inclination direction of each micromirror 62. .

  FIG. 6 shows an example of a state in which a part of the DMD 50 is enlarged and the micromirror 62 is controlled to + α degrees or −α degrees. On / off control of each micromirror 62 is performed by a controller (not shown) connected to the DMD 50. A light absorber (not shown) is arranged in the direction in which the light beam is reflected by the micromirror 62 in the off state.

  FIG. 8 shows a stage 152 constituting the substrate suction mechanism 104 of the present embodiment. The stage 152 is formed in a hollow flat box shape, and its upper surface is a mounting surface 152P on which the substrate 150 is mounted. The size of the mounting surface 152P is set so that even the largest substrate that is the target of image recording in the image recording apparatus 102 can be mounted.

  A plurality of suction holes 172 are formed on the mounting surface 152P. A suction device (for example, a vacuum pump) (not shown) is also connected to the stage 152 via a pipe line (not shown), and the inside of the stage 152 can be set to a negative pressure and air can be sucked from the suction hole 172. It is like that. When the suction hole 172 is covered with the substrate 150 placed on the placement surface 152P, the substrate 150 is sucked. The suction holes 172 are arranged so as to cover a wide range capable of reliably sucking the maximum size substrate and to have a surface density capable of reliably sucking even the smallest size substrate. .

  A substrate suction transfer device 106 is disposed above the stage 152. The substrate suction transfer device 106 has a transfer frame 108 parallel to the stage 152, and the entire substrate suction transfer device 106 is transferred in a direction parallel to the stage 152 by a transfer drive mechanism (not shown). ing.

  A lift frame 112 is supported on the transport frame 108 by a sliding support member 110 so as to be movable up and down. The lifting frame 112 is lifted and lowered by a lifting drive member (not shown). The elevating frame 112 is formed on a rectangular frame when viewed from the front, and a rod 116 is supported on the lower surface of the lower plate 112 </ b> L by a sliding support member 114 so as to be elevable. An upper flange 116A and a lower flange 116B are provided at the upper end and the lower end of the rod 116, respectively, to limit the lifting / lowering range of the rod 116 and prevent inadvertent removal from the lower plate 112L.

  The lower part of the rod 116 is located below the lower plate 112L, and a suction cup 118 is attached to the lower end thereof. As shown in FIG. 9A, the substrate 150 can be sucked by the suction portion 118B of the suction cup 118.

  A first coil spring 120 is disposed between the lower plate 112L of the elevating frame 112 and the lower flange 116B of the rod 116, and urges the rod 116 and the suction cup 118 downward. This urging force is set to be weaker than the urging force of the second coil spring 132, which will be described later, and the suction cup 118 in accordance with the warp of the substrate 150 (or swell, hereinafter collectively referred to as “warp”). These are allowed to move up and down.

  A bracket 122 corresponding to each of the rods 116 is attached to the upper surface of the lower plate 112 </ b> L of the elevating frame 112. The bracket 122 has a substantially inverted “U” shape, and the upper part of the rod 116 moves up and down inside.

  A plunger 124 is attached to the upper part of the bracket 122. The plunger 124 has a cylindrical cylinder 126, and a piston 130 that is slidably held up and down by a sliding support member 128 at a lower portion of the cylinder 126. The downward movement of the piston 130 is limited to a predetermined range by the upper flange 116A, and is prevented from accidentally falling off.

  A second coil spring 132 is disposed in the cylinder 126 and presses the piston 130 downward. This pressing force is larger than the urging force of the first coil spring 120, and is a pressing force that can press the warped substrate 150 against the mounting surface 152P to eliminate the warping. An adjustment screw 134 is screwed onto the upper bottom of the cylinder 126, and the lower end thereof is in contact with the second coil spring 132. The length of the second coil spring 132 is changed by the adjusting screw 134 so that the elastic force can be adjusted.

  Next, the operation of this embodiment will be described.

  In order to record an image on the substrate 150, first, for example, the substrate 150 accommodated in an accommodating member (not shown) is adsorbed by the substrate adsorbing and conveying device 106 and placed on the placement surface 152P of the stage 152. .

  At this time, first, the transport frame 108 is moved by a transport driving member (not shown), and the entire substrate suction mechanism 104 is positioned on the substrate in the housing member. Then, the lifting frame 112 is lowered by a lifting drive member (not shown), and the suction cup 118 is brought into close contact with the substrate 150. In this state, the piston 130 of the plunger 124 and the rod 116 are separated from each other, and the pressing force of the second coil spring 132 does not act on the rod 116. For this reason, each of the suction cups 118 is biased toward the substrate 150 only by the first coil spring 120, and each vertical movement of the suction cups 118 is allowed in accordance with the warpage of the substrate 150. Since each position of the suction cup 118 easily follows the shape of the substrate 150, all the suction cups 118 can be brought into close contact with the warped substrate 150 and the substrate 150 can be reliably adsorbed. (See FIG. 9A).

  With the substrate 150 adsorbed, the transport frame 108 is moved by a transport drive mechanism (not shown) and positioned on the stage 152. Then, the elevating frame 112 is lowered toward the stage 152 by an elevating drive mechanism (not shown), and the pressing of the substrate 150 to the mounting surface 152P is started. Due to the warpage of the substrate 150, a part of the substrate 150 first comes into contact with the mounting surface 152P, and the other part gradually contacts the mounting surface 152P. As a result, the biasing force of the first coil spring 120 acts greatly, so that the warpage is eliminated in the case of a substrate with low rigidity.

  When the elevating frame 112 is further lowered, the piston 130 comes into contact with the rod 116, and the pressing force of the second coil spring 132 gradually acts on the rod 116, so that the substrate 150 is pressed against the mounting surface 152P. In the example shown in FIG. 9B, the piston 130 is in contact with the two rods 116 on both sides, but the piston 130 is not in contact with the central rod 116. Since the pressing force of the second coil spring 132 acts on the rod 116 with which the piston 130 is in contact, even if the substrate is highly rigid, the warpage is eliminated.

  FIG. 10 shows the relationship between the descending amount of the lifting frame 112 and the total pressing force acting on the substrate 150. Here, the “total pressing force” is a resultant force of the urging force from the first coil spring 120 and the pressing force from the second coil spring 132. As can be seen from this graph, only the urging force of the first coil spring 120 is acting in a state where the amount of descent is less than a constant value, but when the amount of descent exceeds a certain value, the piston 130 contacts the rod. The pressing force of the second coil spring 132 also acts. Therefore, the total pressing force acting on the substrate 150 is also increased, and even a highly rigid substrate can exert a sufficient pressing force only to eliminate the warpage.

  As shown in FIG. 9C, in a state where all the pistons 130 are in contact with the rods 116 and the pressing force of the second coil springs 132 is applied, the entire surface of the substrate 150 is brought into surface contact with the mounting surface 152P to warp. It can be completely eliminated and flattened.

  In this way, in a state where the warpage of the substrate 150 is eliminated, a suction device (not shown) is driven to make the inside of the stage 152 have a negative pressure, and the substrate 150 is sucked and held on the mounting surface 152P of the stage 152.

  The stage 152 that has attracted the substrate 150 to the placement surface 152P is moved at a constant speed from the upstream side to the downstream side of the gate 160 along the guide 158 by a driving device (not shown).

  When the alignment mark reaches the imaging position of the detection sensor 164, a controller (not shown) causes the strobe to emit light and causes the detection sensor 164 to image an imaging area including the alignment mark. At this time, the imaging information obtained by the detection sensor 164 is output to the image processing unit, and the image processing unit converts the imaging information into position information corresponding to the position along the scanning direction and the width direction of the alignment mark. Outputs position information to the controller.

  The controller determines the positions of a plurality of alignment marks provided corresponding to one drawing area based on the position information of the alignment marks from the image processing unit, and determines the drawing area from the positions of these alignment marks. The position along the scanning direction and the width direction and the amount of inclination of the drawing area with respect to the scanning direction are determined.

  Thereafter, the controller calculates the exposure start timing for the drawing area based on the position along the scanning direction of the drawing area, and draws the drawing pattern based on the position along the width direction of the drawing area and the amount of inclination with respect to the scanning direction. The image information corresponding to the image information is converted, and the converted image information is stored in the frame memory. Here, the contents of the conversion process include a coordinate conversion process for rotating the image information around the coordinate origin, and a coordinate conversion process for translating the image information along the coordinate axis corresponding to the width direction. Further, as necessary, the controller executes a conversion process for expanding or contracting the image information in accordance with the expansion amount and the reduction amount along the width direction and the scanning direction of the drawing area.

  Then, the controller outputs an exposure start signal to the scanner control unit in synchronization with the timing when the leading end of the drawing area reaches the exposure position. Accordingly, the scanner control unit sequentially reads out the image information stored in the frame memory for each of a plurality of lines, generates a control signal for each exposure head 166 based on the image information read out by the data processing unit, and drives the mirror. Based on the control signal generated by the control unit, each of the micromirrors of the DMD 50 is controlled to be turned on / off for each exposure head 166.

  When the DMD 50 is irradiated with laser light from the fiber array light source 66, the laser light reflected when the micro mirror of the DMD 50 is in an on state is imaged on the exposed surface of the substrate 150 by the lens systems 54 and 58. . In this way, the laser light emitted from the fiber array light source 66 is turned on and off for each pixel, and the drawing area of the substrate 150 is exposed in units of pixels that are approximately the same number as the number of used pixels of the DMD 50. Further, when the substrate 150 is moved at a constant speed together with the stage 152, the substrate 150 is sub-scanned in the direction opposite to the stage moving direction by the scanner 162, and a strip-shaped exposed region 170 (see FIG. 2) for each exposure head 166. And FIG. 3A) are formed.

  As can be seen from the above description, in the substrate suction transfer device 106 of this embodiment, in addition to the first coil spring 120 that exerts an urging force for causing the shape of the substrate 150 to follow the position of the suction cup 118, this urging force. The second coil spring 132 that exerts a stronger pressing force is provided so that the pressing force is applied to the substrate 150 on the stage 152 to reliably eliminate the warp. On the other hand, for example, in the configuration having only the first coil spring 120, the force that presses the substrate (coil spring biasing force) is weak, and thus there is a possibility that the substrate 150 is strongly pressed on the stage 152 and the warp cannot be reliably eliminated. In addition, since the elastic force is too strong in the configuration having only the second coil spring 132, it is difficult to follow the position of the suction cup 118 in the shape of the board 150, so that the board 150 must be held straight only by the holding force of the suction cup 118. Absent. Therefore, the suction force is insufficient with respect to the restoring force of the substrate 150 (the force to warp again), and the suction cup 118 is easily peeled off. In this embodiment, it is set as the structure which has two coil springs, The above-mentioned inconvenience does not arise.

  Moreover, it is not necessary to provide a member for moving the suction cup 118 up and down in the stage 152, and a simple configuration is sufficient.

  In the above description, the plunger 124 provided with the second coil spring 132 is taken as an example of the pressing member of the present invention. However, the pressing member is not limited to this, and in short, the first coil spring 120 (biasing member). Any substrate can be used as long as it can reliably eliminate the warp of the substrate 150 with a pressing force stronger than the urging force.

  FIG. 11 shows a substrate suction mechanism 136 according to a second embodiment of the present invention that includes a pressing member different from the first embodiment. In the substrate suction conveyance device 138 constituting the substrate suction mechanism 136 of the second embodiment, a solenoid 140 is used as a pressing member. That is, by energizing the solenoid 140, the piston 142 can be positively lowered and brought into contact with the rod 116 to press the substrate 150. In addition, since the other components, members, and the like are the same as those in the first embodiment, the same reference numerals are given to the drawings, and detailed descriptions thereof are omitted.

In the process of sucking and transporting the substrate 150 by the substrate suction transporting device 138 of the second embodiment and placing it on the placement surface 152P of the stage 152, the substrate suction is performed by a transport driving member (not shown) as in the first embodiment. The entire mechanism 104 is positioned on the substrate in the housing member, the lifting frame 112 is lowered by a lifting drive member (not shown), and the suction cup 118 is brought into close contact with the substrate 150. In this state, the solenoid 140 is not energized, the piston 142 and the rod 116 are separated from each other, and each of the suction cups 118 is biased toward the substrate 150 only by the first coil spring 120. However, since it easily follows the shape of the substrate 150, all the suction cups 118 can be brought into close contact with the warped substrate 150, and the substrate 150 can be reliably adsorbed. (See FIG. 11 (A))
With the substrate 150 adsorbed, the transport frame 108 is positioned on the stage 152 by a transport drive mechanism (not shown), and the lift frame 112 is lowered toward the stage 152 by the lift drive mechanism (not shown) to place the substrate 150. The pressing to the surface 152P is started. Due to the warp of the substrate 150, a part of the substrate 150 first comes into contact with the placement surface 152P, and the other part gradually comes into contact with the placement surface 152P (see FIG. 11B). As in the first embodiment, the urging force of the first coil spring 120 acts greatly, so that the warpage is eliminated in the case of a substrate with low rigidity.

  Here, in the second embodiment, the solenoid 140 is energized and the piston 142 is actively lowered. The piston 142 contacts the rod 116, and the pressing force gradually acts on the rod 116, so that the substrate 150 is pressed against the mounting surface 152P.

  As shown in FIG. 11C, in a state where all the pistons 142 are in contact with the rods 116 and the pressing force of the second coil spring 132 is applied, the entire surface of the substrate 150 is brought into surface contact with the mounting surface 152P to warp. It can be completely eliminated and flattened.

  In the above description, the exposure head including the DMD as the spatial light modulation element has been described. However, in addition to the reflective spatial light modulation element, a transmissive spatial light modulation element (LCD) can also be used. For example, a liquid crystal shutter such as a MEMS (Micro Electro Mechanical Systems) type spatial light modulator (SLM), an optical element (PLZT element) that modulates transmitted light by an electro-optic effect, or a liquid crystal light shutter (FLC). It is also possible to use a spatial light modulation element other than the MEMS type, such as an array. Note that MEMS is a general term for a micro system that integrates micro-sized sensors, actuators, and control circuits based on a micro-machining technology based on an IC manufacturing process. A MEMS-type spatial light modulator is an electrostatic force. It means a spatial light modulation element driven by an electromechanical operation using Further, a plurality of Grafting Light Valves (GLVs) arranged in a two-dimensional shape can be used. In the configuration using these reflective spatial light modulator (GLV) and transmissive spatial light modulator (LCD), a lamp or the like can be used as a light source in addition to the laser described above.

  In the above embodiment, an example using a fiber array light source including a plurality of combined laser light sources has been described. However, the laser device is not limited to a fiber array light source in which combined laser light sources are arrayed. For example, a fiber array light source obtained by arraying fiber light sources including one optical fiber that emits laser light incident from a single semiconductor laser having one light emitting point can be used.

  Furthermore, a light source (for example, an LD array, an organic EL array, etc.) in which a plurality of light emitting points are arranged two-dimensionally can also be used. In the configuration using these light sources, the spatial modulation measures described above can be omitted by making each of the light emitting points correspond to a pixel.

  In the above embodiment, as shown in FIG. 12, the example in which the entire surface of the substrate 150 is exposed by one scan in the X direction by the scanner 162 has been described. However, as shown in FIGS. In addition, after the substrate 162 is scanned in the X direction by the scanner 162, the scanner 162 is moved one step in the Y direction and scanned in the X direction. Alternatively, the entire surface may be exposed.

  In the above embodiment, a so-called flood bed type image recording apparatus has been described as an example. However, as the image recording apparatus of the present invention, a so-called outer drum type image recording apparatus having a drum around which a photosensitive material is wound. It may be.

  The image recording apparatus includes, for example, exposure of a dry film resist (DFR) in a manufacturing process of a printed wiring board (PWB) and a color filter in a manufacturing process of a liquid crystal display (LCD). Can be suitably used for applications such as formation of DFT, exposure of DFR in a TFT manufacturing process, and exposure of DFR in a plasma display panel (PDP) manufacturing process.

  The image recording apparatus can use either a photon mode photosensitive material in which information is directly recorded by exposure or a heat mode photosensitive material in which information is recorded by heat generated by exposure. When using a photon mode photosensitive material, a GaN-based semiconductor laser, a wavelength conversion solid-state laser, or the like is used for the laser device. When using a heat mode photosensitive material, an AlGaAs-based semiconductor laser (infrared laser), A solid state laser is used.

1 is a perspective view illustrating an appearance of an image recording apparatus according to a first embodiment of the present invention. 1 is a perspective view illustrating a configuration of a scanner of an image recording apparatus according to a first embodiment of the present invention. (A) is a top view which shows the exposed area | region formed in a photosensitive material, (B) is a figure which shows the arrangement | sequence of the exposure area by each exposure head. 1 is a perspective view showing a schematic configuration of an exposure head according to a first embodiment of the present invention. (A) is sectional drawing of the subscanning direction along the optical axis which shows the structure of the exposure head shown in FIG. 4, (B) is a side view of (A). It is the elements on larger scale showing the composition of the digital micromirror device (DMD) concerning the exposure head of a 1st embodiment of the present invention. (A) And (B) is explanatory drawing for demonstrating operation | movement of DMD which concerns on the exposure head of 1st Embodiment of this invention. It is a front view which shows a part of the board | substrate adsorption | suction mechanism of 1st Embodiment of this invention, and is shown broken. It is explanatory drawing which shows operation | movement of the board | substrate adsorption | suction mechanism of 1st Embodiment of this invention to (A)-(C) in order. It is a graph which shows qualitatively the relationship between the fall amount of the raising / lowering frame in the board | substrate adsorption | suction mechanism of 1st Embodiment of this invention, and a corresponding pressure. It is explanatory drawing which shows operation | movement of the board | substrate adsorption | suction mechanism of 2nd Embodiment of this invention to (A)-(C) in order. It is a top view for demonstrating the exposure system which exposes a photosensitive material by one scan by a scanner. (A) And (B) is a top view for demonstrating the exposure system which exposes a photosensitive material by the multiple times of scanning by a scanner.

Explanation of symbols

LD1 to LD7 GaN-based semiconductor laser 102 Image recording device 104 Substrate adsorption mechanism (photosensitive plate member adsorption mechanism)
106 Substrate suction transfer device 116 Rod 118 Suction cup (Suction pad)
120 1st coil spring (1st elastic member, biasing member)
132 Second coil spring (second elastic member, pressing member)
140 Solenoid (pressing member)
150 substrate (photosensitive plate member)
152 Stage 152P Mounting surface 166 Exposure head 172 Suction hole 176 Winding roll 178 Flexible film 182 Motor (unwinding device)
188 wire (unwinding device)
204 Substrate adsorption mechanism (photosensitive plate member adsorption mechanism)
204 Support member 206 Hinge

Claims (5)

A stage on which a photosensitive plate-like member can be placed on the placement surface;
A plurality of suction pads capable of advancing and retreating from the opposite side of the placement surface across the photosensitive plate-like member placed on the placement surface, and capable of sucking the photosensitive plate-like member;
A biasing member that biases each of the suction pads toward the photosensitive plate member;
A pressing member capable of pressing the suction pad with a pressing force stronger than the urging force of the urging member against the photosensitive plate-like member on the placement surface;
A photosensitive plate-like member suction mechanism comprising: A first elastic member for elastically urging each of the suction pads;
The photosensitive plate member adsorbing mechanism according to claim 1, comprising: A second elastic member for elastically pressing the suction pads, respectively,
The photosensitive plate-like member suction mechanism according to claim 1, wherein the photosensitive plate-like member suction mechanism is included. The photosensitive plate-like member adsorption mechanism according to any one of claims 1 to 3,
Image recording means for recording an image on the photosensitive plate-like member placed on the placement surface;
An image recording apparatus comprising: Laser recording means for performing image recording by irradiating a photosensitive plate member with the laser beam,
The image recording apparatus according to claim 4, wherein:

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