JP2005251861A - Electronic controller for vehicle and its assembling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic controller for vehicle that can be improved in heat radiating efficiency, and to provide a method of assembling the controller. <P>SOLUTION: The electronic controller 20 for vehicle is provided with a printed wiring board 24, a component carrier 30 which is constituted to contain a heat-generating component 32 capable of generating heat and electrically connected to the printed wiring board 24 in a state where the carrier 30 is separated from the board 24, and a heatsink 40 which is attached to the component carrier 30 in a heat transferable state. The controller 20 is also provided with a case 21 which houses the printed wiring board 24 and component carrier 30, in a state where the heatsink 40 is exposed on the surface of the case 21. Since the heatsink 40, attached to the component carrier 30 in the heat transferable state, is exposed on the surface of the body 22 of the case 21, the heatsink 40 can directly transfer heat transferred from the heat generating component 32 to a heat transfer medium, such as outdoor air etc.; and thus, the heat radiating efficiency of the electronic controller can be improved. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic control device for a vehicle including an electronic component that can generate heat.

  In general, an electronic control device for a vehicle including an electronic component that can generate heat has a configuration that enables countermeasures against heat dissipation. For example, as disclosed in Patent Document 1 below, an electronic component capable of generating heat is mounted on an aluminum plate having a considerable heat capacity, or an aluminum case or heat sink having a larger heat capacity than the plate. The plate is attached so that heat can be transferred to dissipate heat. Furthermore, in the case of an electronic component surface-mounted on a printed wiring board, heat can be radiated to the case or the like through a via hole or a heat radiating gel.

  By the way, the application specification of Japanese Patent Application No. 2003-38842 filed by the applicant of the present application discloses a vehicle electronic control device 100 as shown in FIG. 6 (A) and FIG. 6 (B). 6A is a perspective view showing the appearance of the vehicle electronic control device 100, and FIG. 6B is a sectional view taken along line 6B-6B shown in FIG. 6A. Yes.

  The vehicle electronic control device 100 uses an aluminum case 130 having a box-shaped case main body 130a and a lid portion 130b as a housing. In the aluminum case 130, a component carrier 132, a microcomputer (microcomputer), and the like are used. The printed wiring board 131 on which the electronic component 133 is mounted is accommodated. Then, by providing a connector 34 electrically connected to the printed wiring board 131 by a connecting pin 135 on one side surface of the aluminum case 130, an actuator (not shown) to be controlled via the connector 34 and the like The vehicle electronic control device 100 is configured to be electrically connectable.

  Such an electronic control device for a vehicle 100 includes a holding member for an electronic component mainly made of a resin mold material, which is referred to as a “component carrier”. That is, as shown in FIG. 6 (B), the component carrier 132 of the vehicle electronic control device 100 has a cavity for holding a plurality of large parts, functions as circuit wiring for these large parts, and A conductive structure that can be electrically connected to the printed wiring board 131 by the connection terminal 141 is insert-molded in the resin mold material. Such large components held by the component carrier 132 may include electronic components that generate a larger amount of heat than other electronic components such as the current drive power transistor 121 and the diode 122. Therefore, in such a case, it is necessary to radiate the heat generated from the power transistor 121 or the like to the case or the heat sink as described above.

Therefore, in the vehicle electronic control device 100 shown in FIG. 6 (B), between the aluminum case main body 130a and the power transistor 121 or the diode 122, a heat dissipation gel 160, which is a silicone-based high heat transfer member, 161 is used so that heat generated from the power transistor 121 and the diode 122 can be radiated to the aluminum case 130 (case body 130a) via the heat radiating gels 160 and 161.
JP 2001-223489 A (page 3, FIGS. 1 to 4)

  However, according to the vehicle electronic control device disclosed in the above-mentioned Patent Document 1, in the case where an electronic component capable of generating heat is mounted on an aluminum plate having a considerable heat capacity, such a plate has sufficient heat dissipation. Even if the plate is attached to an aluminum case or heat sink that has a larger heat capacity than the plate so that heat can be transferred, heat can be dissipated over a wide range between the plate and the case. In many cases, it is structurally difficult to adhere. Therefore, there is a technical problem that it is difficult to improve the heat dissipation efficiency.

  In addition, in the case of electronic components that are surface-mounted on a printed wiring board, heat radiation characteristics are inferior to those of metal materials such as copper and aluminum in cases where heat can be radiated to the case through via holes or heat radiating gel. Since a plate must be interposed, there is a technical problem that it is difficult to improve the heat dissipation efficiency even in such a case.

  These technical problems are also considered to be solved by contacting an aluminum case or heat sink having a heat capacity directly or via a heat dissipation gel without interposing an aluminum plate or printed wiring board. It is done. However, when such a plate is removed from an electronic component that can generate heat and a case, etc., the electronic component approaches the case or the like as long as the plate is removed. Since the physical distance between the printed circuit board and the printed wiring board increases, a new technical problem arises in that the electronic components mounted on the printed wiring board lack mechanical stability.

  In the case of electronic components that are surface-mounted on a printed wiring board, for example, even if a case or the like is brought into direct contact with the opposite side of the mounting surface to enable heat dissipation, surface mounting components are considered in the surface mounting component design philosophy. It is often designed to dissipate heat to the printed wiring board by biasing the heat generating part inside to the mounting surface side. For this reason, even if the heat dissipation of the non-mounting surface on the opposite side is sufficient, it is difficult to expect improvement in heat dissipation efficiency, and eventually sufficient heat dissipation of the mounting surface is required.

  On the other hand, in the vehicular electronic control device 100 shown in FIG. 6 by the applicant of the present application, between the aluminum case 130 and the power transistor 121 and the diode 122, the heat dissipating gels 160 and 161, which are highly heat conductive members, are filled. The heat dissipation from the power transistor 121 and the like can be radiated to the case body 130a via the heat dissipation gel 160 and the like. However, the component carrier 132 itself that holds the power transistor 121 and the like is only soldered to the printed wiring board 131 by the connection terminal 141.

  Therefore, the gap between the case main body 130a and the power transistor 121 and the like may vary due to an assembly error of the printed wiring board 131 with respect to the height direction of the aluminum case 130. There is a case where the filling amount of 160 or the like is insufficient, and in such a case, there is a technical problem of reducing the heat radiation efficiency. Such a problem can be solved by increasing the filling amount of the heat dissipating gel 160 or the like, but in general, in a mass production line, it is difficult to manage the filling amount in accordance with such a variation in the interval. On the other hand, if the filling amount is increased, the heat-dissipating gel 160 and the like are excessively filled in those that maintain an appropriate interval, leading to an increase in product cost and a waste of resources.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electronic control device for a vehicle that can improve heat dissipation efficiency and an assembling method thereof.

  In order to achieve the above object, the means described in claim 1 described in claims is adopted. According to this means, a printed circuit board and a circuit module that includes an electronic component capable of generating heat and is electrically connected to the printed circuit board at a distance from the printed circuit board, and capable of transferring heat to the circuit module. A heat dissipating member to be attached; and a case for accommodating the printed wiring board and the circuit module by exposing the heat dissipating member to the surface. As a result, the heat dissipating member attached to the circuit module so as to be capable of transferring heat is exposed on the surface of the case, so that the heat dissipating member transfers heat transferred from the electronic component that can generate heat to a heat transfer medium (such as outside air of the case). Heat can be directly transferred to a heat transferable fluid (hereinafter the same). Further, even if the circuit module is separated from the printed wiring board and electrically connected to the printed wiring board, heat can be transferred to the heat radiating member in a mechanically stable manner.

  By adopting the means according to claim 2, the heat radiating member has a concave portion or a convex portion on the outer surface thereof. Thereby, the quantity of heat transfer media, such as external air which contacts a heat radiating member, can be increased.

  By adopting the means described in claim 3, the heat dissipating member and the electronic component capable of generating heat of the circuit module are in direct contact with each other. Thereby, compared with the case where a silicone type thermal radiation gel etc. are interposed between the said electronic component and a thermal radiation member, heat transfer can be made favorable, for example.

  By adopting the means according to claim 4, the heat radiating member is made of copper. Since copper has a higher thermal conductivity than iron or aluminum, the thermal conductivity can be improved as compared with the case where the heat radiating member is made of iron or aluminum. Thereby, the heat transfer by heat transfer media, such as the open air which contacts the said heat radiating member, can be accelerated | stimulated by making a heat radiating member copper.

  By adopting the means according to claim 5, there are a plurality of electronic components that can generate heat in the circuit module, and the plurality of electronic components are arranged so as to be dispersed with respect to the heat dissipation member. ing. Thereby, compared with the case where a plurality of electronic components capable of generating heat are concentrated and disposed at one place, the heat source is not biased, and substantially thermal flattening (equalization) and heat dispersion are possible.

  By adopting the means according to claim 6, the heat dissipating member is attached to the vehicle so that its outer surface can be in close contact with the vehicle body. Thereby, the clearance gap which can be formed between a case and a thermal radiation member can be obstruct | occluded with the vehicle body of the said vehicle. Heat can also be radiated to the case via the vehicle body, and foreign matter such as dust and sand can be prevented from entering the case through such a gap.

  By adopting the means according to claim 7, the heat dissipation member is attached to the circuit module before being electrically connected to the printed wiring board in the first step, and the first step is performed by the second step. The heat radiating member of the circuit module attached by the process is assembled to the case, and the printed wiring board is electrically connected to the circuit module assembled to the case by the second process in the third process. That is, after the circuit module with the heat dissipation member assembled is assembled to the case, the printed wiring board is electrically connected to the circuit module. As a result, the assembly position of the circuit module with respect to the case is determined prior to the connection position of the circuit module with respect to the printed wiring board. Therefore, an error in the connection position of the circuit module with respect to the printed wiring board (the height direction or planar direction of the case) Does not affect the assembly position of the circuit module with respect to the case.

  That is, contrary to such a process order, when connecting a circuit module to a printed wiring board and then assembling the circuit module in a case (first process → third process → second process, third process → first process In the first step → second step or third step → second step → first step), the assembly position of the circuit module with respect to the case is determined after the connection position of the circuit module with respect to the printed wiring board. An error in the connection position in the height direction or planar direction of the circuit module above affects the position of the circuit module when assembled to the case, and affects, for example, the exposure amount and the exposure position of the heat dissipation member. For this reason, an unscheduled gap is formed between the heat radiating member and the case, or a predetermined amount of contact with a heat transfer medium such as outside air cannot be obtained due to insufficient exposure.

  In the invention of claim 1, since the heat dissipating member attached to the circuit module so as to be capable of transferring heat is exposed on the surface of the case, the heat dissipating member directly transfers heat transmitted from the electronic component capable of generating heat to the outside air of the case. Can transfer heat. Further, even if the circuit module is separated from the printed wiring board and electrically connected to the printed wiring board, heat can be transferred to the heat radiating member in a mechanically stable manner. Therefore, the heat radiation efficiency can be improved as compared with the case where heat is radiated to the case via a plate, a printed wiring board, or the like.

  In invention of Claim 2, the quantity of heat transfer media, such as external air which contacts a heat radiating member, can be increased. Therefore, since the heat radiation amount by the heat radiating member increases, the heat radiation efficiency can be further improved.

  In invention of Claim 3, heat transfer can be made favorable compared with the case where a silicone type thermal radiation gel etc. are interposed between the said electronic component and a thermal radiation member, for example. Accordingly, since heat is easily transferred to the heat radiating member, the heat radiating efficiency can be further improved by direct contact between the electronic component and the heat radiating member.

  In the invention of claim 4, by making the heat radiating member made of copper, heat transfer by a heat transfer medium such as outside air contacting the heat radiating member can be promoted. Therefore, the heat dissipation efficiency can be further improved by this.

  According to the fifth aspect of the present invention, compared with the case where a plurality of electronic components capable of generating heat are concentrated and disposed at one place, the heat source is not biased, and substantially thermal flattening (equalization) and heat dispersion are possible. It becomes. Therefore, heat can be transferred to the entire heat transfer medium such as outside air in contact with the heat dissipation member without being biased to the portion of the heat dissipation member, so that the heat dissipation efficiency can be further improved.

  In the invention of claim 6, a gap that can be formed between the case and the heat radiating member can be closed by the vehicle body of the vehicle. Heat can also be radiated to the case via the vehicle body, and foreign matter such as dust and sand can be prevented from entering the case through such a gap. Therefore, the heat dissipation efficiency can be further improved by such attachment to the vehicle body. In addition, failure or malfunction of the vehicle electronic control device due to these foreign matters can be prevented.

  According to the seventh aspect of the present invention, the assembly position of the circuit module with respect to the case is easily managed by assembling the circuit module with the heat dissipation member assembled to the case and then electrically connecting the printed wiring board to the circuit module. Therefore, the amount of contact between the heat radiating member and the case and the heat transfer medium such as outside air can be set to a predetermined amount. Therefore, each effect | action and effect as an electronic control apparatus for vehicles as described in any one of Claims 1-6 can be obtained more reliably.

Hereinafter, an embodiment of an electronic control device for a vehicle according to the present invention will be described with reference to the drawings.
As shown in FIG. 1 (A) and FIG. 1 (B), the vehicle electronic control device 20 according to the present embodiment mainly includes a case 21 (case body 22, back cover 23), printed wiring board 24, connector. 26, a component carrier 30, a heat sink 40, and the like. 1A is a perspective view showing the external appearance of the vehicle electronic control device 20, and FIG. 1B is a case main body 22, a heat sink 40, a component carrier 30, a printed wiring board 24, and a back cover 23. Explanatory drawing which shows the state decomposed | disassembled is shown, respectively.

  As shown in FIG. 1 (A), the vehicular electronic control device 20 has an appearance substantially similar to that of the conventional vehicular electronic control device 100 described with reference to FIG. appear. However, as shown in FIG. 1B, in the vehicle electronic control device 20, a heat radiating window 22a is formed in the case body 22, and the heat sink 40 attached to the component carrier 30 is connected to the case from the heat radiating window 22a. The point which is exposed to the surface of 21 (case main body 22) differs from the conventional electronic control apparatus 100 for vehicles. Hereinafter, this point will be mainly described.

  First, the configuration of the case 21 will be described. As shown in FIG. 1B, the case 21 includes a case main body 22 and a back cover 23. The case body 22 has an open box shape without a lid that can accommodate the printed wiring board 24 and the component carrier 30, and is formed by, for example, aluminum die casting so as to have a sufficient heat capacity.

  A heat radiating window 22 a is formed on the upper surface of the case body 22. The heat radiating window 22a is formed to expose a heat sink 40, which will be described later, to the surface of the case 21 (case body 22). Therefore, the heat radiating window 22 a is formed in a similar shape slightly larger than the planar outline of the heat sink 40 attached to the component carrier 30.

  Further, a cutout portion 22b that allows the connector 26 to protrude outward is formed on one side surface of the case body 22. This connector 26 can electrically connect an unillustrated actuator or the like controlled by the vehicle electronic control device 20 and the vehicle electronic control device 20 in the same manner as the connector 134 of the vehicle electronic control device 100 described above. It is electrically connected to the circuit pattern and the like of the printed wiring board 24 by connection pins (not shown).

  Furthermore, posts 22 c that enable support of the printed wiring board 24 to be accommodated are formed at the inner four corners of the case body 22. These posts 22c are formed with screw holes that can be screwed into bolts 28 described later (see FIG. 4A). Thus, the printed wiring board 24 can be fastened together with the back cover 23 by the bolt 28.

  On the other hand, the back cover 23 is a plate-like member formed in a rectangular flat plate shape capable of closing the opening of the case main body 22 and is formed of, for example, aluminum or iron. The back cover 23 constitutes the case 21 together with the case main body 22 and is screwed to the case main body 22 with bolts 28 so as to close the opening of the case main body 22 (see FIG. 4A). Therefore, attachment holes 23 a that allow the bolts 28 to pass therethrough are formed at the four corners of the back cover 23.

  Next, the configuration of the component carrier 30 and the heat sink 40 will be described with reference to FIGS. 2A shows a plan view of the component carrier 30, and FIG. 2B shows a side view of the component carrier 30 as viewed in the 2B direction shown in FIG. 2A.

  The component carrier 30 is configured in substantially the same manner as the component carrier 132 of the conventional vehicle electronic control device 100 described with reference to FIG. That is, as shown in FIGS. 2A to 2C, the component carrier 30 is mainly composed of a resin mold portion 31 composed of a resin mold material, a structure not shown, and the like, and includes a plurality of large-sized electrons. A conductive structure that has a cavity for holding a component (heat generating component 32), functions as a circuit wiring of these electronic components, and enables electrical connection to the printed wiring board 24 by the connection terminal 33 A configuration in which the resin mold portion 31 is insert-molded is adopted. Note that the circuit and the like by the circuit wiring of the component carrier 30 are described in detail in the application specification of Japanese Patent Application No. 2003-38842 filed by the present applicant.

  Accordingly, for example, a DC-DC converter, an inverter, or the like is provided by placing an electronic component such as a capacitor, a coil, a power transistor, or a diode (not shown) in the resin mold portion 31 while being connected to the circuit wiring of the structure. This circuit module can be configured separately from the printed wiring board 24. Among such electronic components, an electronic component that can generate heat, such as a power transistor or a diode, serves as a heat generating component 32, and the back surface of the package coincides with the upper surface of the component carrier 30 (resin mold portion 31), or It is mounted on the resin mold part 31 so as to protrude upward from the upper surface.

  As described with reference to FIG. 1A, in the vehicle electronic control device 20, a heat sink 40 to be described below is attached to the upper surface of the component carrier 30, and the attached heat sink 40 is used as a case. It is configured to be exposed to the surface from the heat radiation window 22a of the main body 22. Therefore, in the component carrier 30 of this embodiment, as shown in FIGS. 2 (B) and 2 (C), the length of the connection terminal 33 soldered to the printed wiring board 24 is shown in FIG. 6 (B). By setting the length longer than that of the vehicle electronic control device 100, the heat sink 40 can be exposed by separating the component carrier 30 and the printed wiring board 24 from each other.

  In the example of the component carrier 30 shown in FIGS. 1 and 2, the component carrier 30 is electrically connected to the printed wiring board 24 through the connection terminals 33 and is also mechanically attached to the printed wiring board 24. For example, a mounting stay is formed on the resin mold portion 31 of the component carrier 30 and the mounting stay is screwed to the case main body 22, or the mounting stay is attached to the case main body 22. A configuration may be adopted that extends to the post 22c and allows the bolts 28 to be fastened together with the printed wiring board 24 and the back cover 23.

  With this configuration, the mounting position of the component carrier 30 can be managed by the mounting accuracy of the mounting stay, and the position of the heat sink 40 mounted on the component carrier 30 with respect to the heat radiation window 22a is also the mounting accuracy of the mounting stay. Can be managed. Therefore, as will be described later, it is possible to prevent displacement of the heat sink 40 with respect to the heat radiating window 22a of the case body 22 and the like. Even if the component carrier 30 is separated from the printed wiring board 24 and soldered to the printed wiring board 24 as described above, heat can be transferred to the heat sink 40 in a mechanically stable manner.

  As shown in FIG. 1B, the heat sink 40 is formed from, for example, copper or aluminum having a high thermal conductivity, and is exposed to the outside from the heat radiation window 22a of the case body 22, thereby generating the heat generating component 32. It is configured to be able to transfer heat to a heat transfer medium (for example, air, cooling gas, water, etc.) such as outside air that contacts the heat generated from the outside. That is, the heat sink 40 is formed of a thick plate-like member formed in a rectangular flat plate shape, and an attachment hole 40a is formed at a position corresponding to the attachment hole 32a of the heat generating component 32 mounted on the component carrier 30. Yes. On the other hand, the resin mold portion 31 of the component carrier 30 is internally provided with a nut that can be screwed into the bolt 45 inserted into the mounting hole 32 a of the heat generating component 32.

  With this configuration, the heat sink 40 is placed on the upper surface of the component carrier 30, and the bolt 45 is inserted into the mounting hole 40 a of the heat sink 40 and the mounting hole 32 a of the heat generating component 32, and the bolt 45 is inserted in the screw tightening direction. By rotating, the heat sink 40 can be screwed to the heat generating component 32. As a result, the heat generating component 32 and the heat sink 40 can be brought into direct contact with each other, so that heat transfer is made better than when, for example, a silicone-based heat radiating gel is interposed between the heat generating component 32 and the heat sink 40. be able to. Therefore, the heat generated from the heat generating component 32 is easily transferred to the heat sink 40, so that the heat dissipation efficiency can be further improved.

  As described above, in order to efficiently transmit the heat generated from the heat generating component 32 to the heat sink 40, it is desirable that the heat generating component 32 and the heat sink 40 are brought into close contact with each other to expand the range in which both are in direct contact with each other. When the adhesion is difficult, a silicone-based highly heat-conductive heat-radiating gel may be interposed between the two. Thereby, since the heat radiating gel can be interposed in the gap between the two that cannot be closely attached, the heat transfer efficiency can be improved as compared with the case where the heat radiating gel does not exist in the gap.

  In addition, as shown in FIG. 1B, in the component carrier 30, five heat generating parts 32 are held by the resin mold part 31, but these are not arranged in one place. In addition, the heat generating components 32 are arranged in a dispersed manner. Therefore, compared with the case where the plurality of heat generating components 32 are concentrated and arranged at one place, the heat generating source is not biased, and substantially thermal flattening and heat dispersion can be achieved. As a result, heat can be transferred to the entire heat transfer medium such as the outside air contacting the heat sink 40 without being biased to the heat sink 40, so that the heat dissipation efficiency can be further improved.

  Subsequently, the assembly process (assembly) of the vehicle electronic control device 20 is completed by assembling the case main body 22, the heat sink 40, the component carrier 30, the printed wiring board 24, and the back cover 23 to complete the vehicle electronic control device 20. (Method) will be described with reference to FIGS. 3A shows a first step of attaching the heat sink 40 to the component carrier 30, FIG. 3B shows a second step of attaching the component carrier 30 to which the heat sink 40 is attached to the case body 22, and FIG. C) is a third step of soldering the component carrier 30 assembled to the case main body 22 to the printed wiring board 24, and FIG. 4A is a fourth step of assembling the back cover 23 to the case main body 22, FIG. B) shows the vehicle electronic control device 20 after the assembly is completed.

  First, in the first step shown in FIG. 3A, an operation of attaching the heat sink 40 to the component carrier 30 before being electrically connected to the printed wiring board 24 is performed. That is, the heat sink 40 is directly placed on the upper surface of the component carrier 30 on which electronic parts such as the heat generating parts 32 are assembled, and the bolts 45 are passed through the mounting holes 40a of the heat sink 40 and the mounting holes 32a of the heat generating parts 32. Turn the bolt 45 in the screwing direction. As a result, a nut (not shown) housed in the resin mold portion 31 and the bolt 45 are screwed together, so that the heat generating component 32 of the component carrier 30 and the heat sink 40 can be brought into close contact with each other. In addition, since this volt | bolt 45 is screwed corresponding to all the heat-emitting components 32, all the heat-generating components 32 and the heat sink 40 can be closely_contact | adhered.

  In order to distinguish between the component carrier 30 to which the heat sink 40 is attached and the component carrier 30 to which the heat sink 40 is not attached, the component carrier 30 is hereinafter referred to as “component carrier 30 ′”. The first step shown in FIG. 3 (A) can correspond to the “first step” recited in the claims.

  In the second step shown in FIG. 3B, the work of assembling the heat sink 40 of the component carrier 30 'attached in the first step to the case body 22 is performed. That is, by exposing the heat sink 40 screwed to the component carrier 30 ′ to the surface of the case body 22 through the heat radiation window 22 a of the case body 22, the surface of the case body 22 and the surface of the heat sink 40 are stepped. The component carrier 30 ′ is attached to the case body 22 so as to form substantially the same surface. For example, the attachment may be performed by fixing an epoxy resin-based adhesive between the case body 22 and the component carrier 30 ′, or may not be formed on the component carrier 30 as described above. This is done by screwing the mounting stay to the case body 22.

  As described above, in the present embodiment, the component carrier 30 ′ is assembled to the case main body 22 by the second step before the component carrier 30 ′ and the printed wiring board 24 are soldered by the third step or the like. Thus, the assembly position of the component carrier 30 ′ with respect to the case body 22, that is, the position of the heat sink 40 exposed from the heat radiation window 22 a (exposure amount and exposure position) is set by soldering the component carrier 30 ′ with respect to the printed wiring board 24. It can be decided before the attachment position. That is, the assembly position of the heat sink 40 exposed from the heat radiation window 22a can be managed by the assembly position of the component carrier 30 'and its assembly error. The second step shown in FIG. 3B can correspond to the “second step” described in the claims.

  In the subsequent third step shown in FIG. 3C, an operation of electrically connecting the printed wiring board 24 to the component carrier 30 'assembled to the case body 22 in the second step is performed. That is, the connection terminal 33 of the component carrier 30 ′ is soldered to a predetermined mounting hole of the printed wiring board 24. At this time, the mounting holes 24a at the four corners of the printed wiring board 24 are aligned with the screw holes of the posts 22c at the four corners of the case main body 22, respectively. Can be tightened together. As a result, the electronic components such as the heat-generating component 32 mounted on the component carrier 30 ′ and the circuit wiring of the structure are electrically connected to the wiring pattern of the printed wiring board 24. Therefore, the component carrier 30 ′ is used for the vehicle. The electronic control device 20 can function as a circuit module such as a DC-DC converter or an inverter. In addition, this 3rd process can correspond to the "3rd process" as described in a claim.

  In the fourth step shown in FIG. 4A, an operation of assembling the back cover 23 to the case main body 22 is performed. That is, the bolt inserted through the mounting hole 23a of the back cover 23 into the screw hole of the post 22c of the case body 22 in which the component carrier 30 'and the printed wiring board 24 are assembled in the first to third steps shown in FIG. 28 is inserted. At this time, since the bolt 28 is also inserted into the mounting hole 24a of the printed wiring board 24, the printed wiring board 24 and the back cover 23 are fastened together with the post 22c by turning the bolt 45 in the screw tightening direction. It becomes possible to do. In addition, as described above, the mounting stay is formed on the component carrier 30, and when the mounting stay is configured to be fastened together with the printed wiring board 24 and the back cover 23, the mounting stay is also a printed wiring board. 24 and the back cover 23 are fastened together with bolts 28. When the fourth step is completed, the assembly of the vehicle electronic control device 20 is completed, and the vehicle electronic control device 20 as shown in FIG. 4B is completed.

  3 and 4, the heat sink 40 is screwed to the component carrier 30 before being soldered to the printed wiring board 24 by the first process, and the second process is performed by the second process. The heat sink 40 of the component carrier 30 ′ attached by the first process is assembled to the case body 22, and the printed wiring board 24 is soldered to the component carrier 30 ′ assembled to the case body 22 by the second process by the third process. . That is, after the component carrier 30 ′ to which the heat sink 40 is screwed is assembled to the case body 22 (second process), the printed wiring board 24 is soldered to the component carrier 30 ′.

  As a result, the assembly position of the component carrier 30 ′ with respect to the case body 22 is determined before the assembly position of the component carrier 30 ′ with respect to the printed wiring board 24 by soldering. Errors due to the soldering position (the height direction or the planar direction of the case body 22) do not affect the assembly position of the component carrier 30 ′ with respect to the case body 22.

  That is, contrary to the order of steps as described above (first step → second step → third step), the component carrier 30 ′ is soldered to the printed wiring board 24, and then the component carrier 30 ′ is attached to the case body. 22 (first process → third process → second process, third process → first process → second process or third process → second process → first process), the component carrier for the case body 22 The assembly position of 30 ′ is determined after the soldering position of the component carrier 30 ′ with respect to the printed wiring board 24.

  Therefore, an error that may occur due to variations in the soldering position is included in the height direction or planar direction position of the component carrier 30 ′ on the printed wiring board 24. Therefore, the error is assembled to the case body 22. This affects the position of the component carrier 30 ′. As a result, for example, an unscheduled gap is formed between the heat sink 40 and the case body 22 in order to influence the exposure amount and the exposure position of the heat sink 40, and a heat transfer medium such as outside air due to insufficient exposure amount. The planned contact amount may not be obtained.

  On the other hand, in the order of steps according to the present embodiment (first step → second step → third step), the component carrier 30 ′ assembled with the heat sink 40 is assembled to the case body 22 and then the component carrier 30 ′. By soldering the printed wiring board 24, the assembly position of the component carrier 30 ′ with respect to the case body 22 can be easily managed. Therefore, it is possible to set the amount of contact between the heat sink 40 and the case body 22 and the amount of contact with a heat transfer medium such as outside air to a predetermined amount.

  When a gap is formed between the heat radiating window 22a of the case body 22 and the heat sink 40 exposed from the heat radiating window 22a, a silicone-based highly heat conductive heat radiating gel may be interposed in the gap. good. Thereby, it becomes possible to improve the heat transfer efficiency from the heat sink 40 to the case main body 22 as compared with the case where no heat dissipation gel exists in the gap.

  Moreover, you may attach to the said vehicle so that the outer surface of the heat sink 40 exposed from the thermal radiation window 22a of the case main body 22 can contact | adhere to a vehicle body. As a result, a gap that can be formed between the case main body 22 and the heat sink 40 can be blocked by the vehicle body of the vehicle, so that heat can be radiated to the case main body 22 via the vehicle body, and dust, sand, etc. Foreign matter can be prevented from entering the case 21 (case body 22) through such a gap. Therefore, the heat radiation efficiency can be further improved by such attachment to the vehicle body, and failure or malfunction of the vehicle electronic control device 20 due to these foreign matters can be prevented.

  As described above, the vehicle electronic control device 20 according to the present embodiment includes the printed wiring board 24 and the heat generating component 32 that can generate heat, and is separated from the printed wiring board 24 to form the printed wiring board 24. A component carrier 30 that is electrically connected, a heat sink 40 that is attached to the component carrier 30 so that heat can be transferred, and a case 21 that accommodates the printed wiring board 24 and the component carrier 30 with the heat sink 40 exposed to the surface (case) A main body 22 and a back cover 23). As a result, the heat sink 40 attached to the component carrier 30 so as to be able to transfer heat is exposed on the surface of the case main body 22, so that the heat sink 40 transfers the heat transmitted from the heat generating component 32 that can generate heat, such as the outside air of the case 21. Heat can be transferred directly to the heat transfer medium. Further, even when the component carrier 30 is separated from the printed wiring board 24 and electrically connected to the printed wiring board 24, heat can be transferred to the heat sink 40 in a mechanically stable manner. Therefore, heat dissipation efficiency can be improved.

  As another example of the vehicle electronic control device according to the present embodiment, as shown in FIG. 5, a heat sink 70 having fins 72 formed as a heat radiating member is used as a heat radiating window of the case body 22 instead of the heat sink 40 described above. You may take the structure exposed from 22a. That is, in the vehicle electronic control device 20 described above, the heat sink 40 having a flat outer surface is used as the heat radiating member. However, as shown in FIG. 5, a concave or convex portion is formed on the outer surface as the heat radiating member. For example, the electronic control apparatus 50 for vehicles provided with the heat sink 70 with a fin may be sufficient. As a result, the surface area of the outer surface of the heat sink 70 is increased by the concave portions and the convex portions formed by the plurality of fins 72, so that the amount of heat transfer medium such as outside air that contacts the heat sink 70 can be increased. Therefore, since the heat radiation amount by the heat sink 70 increases, the heat radiation efficiency can be further improved as compared with the heat sink 40 without such concave portions or convex portions.

1A and 1B are diagrams showing a configuration of a vehicle electronic control device according to an embodiment of the present invention, FIG. 1A is a perspective view showing an external appearance of the vehicle electronic control device, and FIG. It is explanatory drawing which shows the state decomposed | disassembled into the component carrier, the printed wiring board, and the back cover. FIG. 2A is a plan view of the component carrier that constitutes the vehicle electronic control device of the present embodiment, FIG. 2B is a plan view, and FIG. 2B is a side view taken in the direction of the arrow 2B shown in FIG. FIG. 2 (C) is a perspective view. FIGS. 3A and 3B are explanatory views showing an assembly process of the vehicle electronic control device of the present embodiment. FIG. 3A is a first process for attaching a heat sink to a component carrier, and FIG. FIG. 3C shows a second step of assembling the component carrier to the case, and FIG. 3C shows a third step of soldering the component carrier assembled to the case by the second step to the printed wiring board. FIG. 4A is an explanatory view showing an assembly process of the vehicle electronic control device of the present embodiment. FIG. 4A is an assembly of the back cover to the case body in which the component carrier and the printed wiring board are assembled in the first to third processes. FIG. 4 (B) is a perspective view showing the vehicle electronic control device after assembly is completed. It is a perspective view which shows the other example of the vehicle electronic control apparatus which concerns on this embodiment. 6A and 6B are diagrams showing a conventional electronic control device for a vehicle. FIG. 6A is an external view, and FIG. 6B is a cross-sectional view taken along line 6B-6B shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 20, 50 ... Vehicle electronic control device 21 ... Case 22 ... Case main body 22a ... Radiation window 22b ... Notch 22c ... Post 23 ... Back cover 24 ... Printed wiring board 26 ... Connector 30, 30 '... Component carrier (circuit module)
31 ... Resin mold part 32 ... Heat generating component (electronic component capable of generating heat)
33 ... Connection terminal 40, 70 ... Heat sink (heat dissipation member)
72 ... Fins (concave or convex)

Claims (7)

A printed wiring board;
A circuit module configured to include an electronic component capable of generating heat, and electrically connected to the printed wiring board apart from the printed wiring board;
A heat dissipating member attached to the circuit module so that heat can be transferred;
A case for exposing the printed circuit board and the circuit module by exposing the heat dissipating member on the surface;
An electronic control device for a vehicle, comprising:   The vehicular electronic control device according to claim 1, wherein the heat radiating member has a concave portion or a convex portion on an outer surface thereof.   The vehicle electronic control device according to claim 1, wherein the heat dissipating member and the electronic component capable of generating heat of the circuit module are in direct contact with each other.   The vehicular electronic control device according to any one of claims 1 to 3, wherein the heat dissipation member is made of copper.   5. The electronic component capable of generating heat in the circuit module is plural, and the electronic components are arranged so as to be dispersed with respect to the heat dissipation member. An electronic control device for a vehicle as described in 1.   6. The vehicle electronic control device according to claim 1, wherein the heat dissipating member is attached to the vehicle so that an outer surface of the heat dissipating member can be in close contact with the vehicle body. An assembly method for an electronic control device for a vehicle according to any one of claims 1 to 6,
A first step of attaching the heat dissipation member to the circuit module before being electrically connected to the printed wiring board;
A second step of assembling the heat radiating member of the circuit module attached in the first step to the case;
A third step of electrically connecting the printed wiring board to the circuit module assembled to the case by the second step;
A method for assembling an electronic control device for a vehicle, comprising:

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