JP2005251673A - Bus bar and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bus bar that is subjected to metal plating and insulating coating for reducing contact resistance. <P>SOLUTION: A metal member 30 is obtained by performing rustproofing Ni plating to a metal base material 14. An intermediate product 64 in which the surface of terminal sections 16, 18 is plated by Sn or Au is generated by plating a metal member 62 in which a body section 20 is subjected to mask treatment with Sn or Au for reducing contact resistance. Then, an intermediate product 70 in which the terminals sections 16, 18 of the intermediate product 64 are subjected to mask treatment is subjected to electrodeposition coating by insulating coating, thus forming insulating coating on an Ni-plated layer compatible with the insulating coating on the surface of the body section 20, and manufacturing a bus bar 72 in which Sn or Au-plated layer for reducing contact resistance is formed at the terminal sections 16, 18. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a technique for manufacturing a bus bar serving as an electric conduction path by performing a metal plating process for reducing electric resistance and a coating process for insulation.

  Bus bars are frequently used in various electric circuits including motor motor control / drive units. A bus bar conducts electric power between terminal parts by attaching the terminal part to an external circuit.

  FIG. 9 is a top view of the laminated bus bar 100 attached between the inverter and the AC motor of the electric vehicle. The laminated bus bar 100 includes three plate-like bus bars 102, 104, and 106 as conductive paths. The bus bars 102 to 106 are plated with Cu (copper) or Al (aluminum) for rust prevention, and further plated with Sn (tin) or Au (gold) for reducing contact resistance. It is formed using a metal member subjected to the above as a core. At both ends, terminal portions 108, 110, 112, 114, 116, 118 having bolt holes are provided, and the other main body portions are bent at bending portions 120, 122, 124. Insulating resins 126, 128, 130, 132 are placed between and outside the bus bars 102-106. This plays the role which hold | maintains the bus-bars 102-106 integrally, and the mutual insulation between the bus-bars 102-106. FIG. 10 is a cross-sectional view taken along the line AA ′ of FIG. Three plate-like bus bars 102 to 106 are fixed and insulated by insulating resin ribs 134.

  Conventionally, measures have been taken for bus bars to prevent short circuits with other bus bars and devices in the above manner. That is, insulation is ensured by mounting an insulating tape, an insulating resin, or another member other than the terminal portion, or by performing an insulating process such as integral molding with the insulating resin. This situation is the same not only when the bus bar is used as a laminated bus bar but also when it is used alone.

  Patent Document 1 below discloses a means for performing electroplating by removing the masking after coating the areas that do not require electroplating in a state where the areas requiring electroplating are masked. Has been. Further, Patent Document 2 below discloses a technique for improving the adhesion of a coating film by performing a blasting process of spraying hard balls on the surface of the bus bar to be subjected to insulation coating, thereby smoothing the surface. Patent Document 3 below discloses a technique for preventing surface oxidation that causes an increase in contact resistance by providing a different nickel or cobalt plating layer on a base material and further providing an Sn plating layer thereon. Yes.

JP-A-7-173671 Japanese Patent Laid-Open No. 11-203944 Japanese Patent Laid-Open No. 8-7960

  In order to realize space saving of the bus bar, it is desirable to perform the insulation process by an insulation coating, instead of performing the insulation process by using another member or by integrally molding. Insulating treatment by insulating coating also has an effect of reducing costs, for example, it is not necessary to create a separate member or a mold for integral molding. However, in general, Sn or Au plating for reducing contact resistance is incompatible with insulating coatings such as polyimide, polyamideimide, polyesterimide, epoxy, urethane, acrylic, etc., so there is a film thickness on the Sn or Au plating. An insulating coating film cannot be formed, and it is difficult to ensure insulation performance.

  An object of the present invention is to realize a bus bar on which metal plating for reducing contact resistance and insulating coating are made.

  Another object of the present invention is to establish a manufacturing technique of a bus bar that can be applied even when the compatibility between a metal plating for reducing contact resistance and a paint for insulating coating is poor.

  The bus bar manufacturing method of the present invention includes a molding step of molding a metal member having at least two terminal parts attached to an external circuit, and a main body part integrally formed with the terminal parts and conducting electric power between the terminal parts, and a terminal Or a metal plating step for performing metal plating for reducing contact resistance directly on a metal member surface in a part or body part and a terminal part, and directly on a metal member surface in at least a part of the body part And an electrodeposition coating step of performing an electrodeposition coating of an insulating paint.

  The metal member mainly constituting the bus bar is made of a metal such as Al or Cu, and the surface thereof may be plated for rust prevention. The metal member generally includes a main body having a plate shape or a cylindrical shape, and terminal portions provided at both ends thereof and connected to external terminals. The terminal portion is connected to the terminal of the external circuit by connecting means such as bolt fastening. And electric conduction of electric power is performed through a main-body part from one terminal part to the other terminal part. The forming step is a step of forming the metal member.

  In the metal plating step, metal plating for reducing contact resistance is performed directly on the surface of the metal member. That is, the metal plating layer is formed so as to be in contact with the surface of the metal member. As the metal plating, one having high electrical conductivity and being difficult to oxidize is applied, and is typically made by electrolytic plating of Sn or Au. The target for metal plating is the terminal portion. However, metal plating may be applied to a part of the main body that does not require insulation coating.

  In the electrodeposition coating step, the insulating coating is directly applied to the surface of the metal member of the main body. That is, the insulating paint is electrodeposited so as to be in contact with the surface of the metal member. The main object of this electrodeposition coating is the part of the main body where insulation is required, and the part that does not require insulation due to the environment during installation etc. is indirectly (for example, on Sn or Au plating). May be performed or electrodeposition coating may not be performed.

  According to this configuration, it is possible to manufacture a bus bar provided with metal plating for reducing contact resistance in the terminal portion and insulation coating at a location where the main body portion requires insulation. Insulation coating at places where insulation is required is performed directly on the metal member, so an insulating coating with a sufficient thickness can be formed regardless of compatibility with metal plating for reducing contact resistance. .

  Desirably, in the bus bar manufacturing method of the present invention, in the metal plating step, the metal member is plated in a state where masking is performed on a portion where metal plating is not performed. Masking can be performed by attaching a tape to a portion where metal plating is not performed.

  Alternatively, in the bus bar manufacturing method of the present invention, in the metal plating step, only the metal plating target portion may be immersed in an electrolytic solution to perform the plating process. This is because masking with a tape or the like is unnecessary and the number of steps can be reduced. In this case, the bus bar manufacturing method of the present invention can be bent into a shape in which only all the terminal portions can be simultaneously immersed in the electrolytic solution tank in the molding step. In order to perform processing quickly, it is desirable to immerse two or more terminal portions in the electrolytic solution at a time. This can be realized by devising the shape of the metal member (in some cases, the arrangement of the terminal position itself of the external device).

  Desirably, in the bus bar manufacturing method of the present invention, in the electrodeposition coating step, the electrodeposition coating process is performed on the metal member in a state where masking is performed on a portion where the electrodeposition coating is not performed.

  Alternatively, in the bus bar manufacturing method of the present invention, in the electrodeposition coating step, only the portion to be electrodeposited may be immersed in the paint bowl to perform the electrodeposition coating process. In this case, the bus bar manufacturing method of the present invention can be bent into a shape in which only the main body portion can be immersed in the paint layer at a time in the molding step.

  Preferably, the bus bar manufacturing method of the present invention performs the electrodeposition coating step after performing the metal plating step.

  Or the bus-bar manufacturing method of this invention may perform a metal plating step, after performing an electrodeposition coating step. In this case, in the metal plating step, it is possible to perform the electrodeposition coating process by immersing the metal member in the paint layer without masking the metal member subjected to electrodeposition coating. This is because metal plating hardly adheres to the electrodeposited portion, and the same result as that obtained when masking is obtained.

  Preferably, the bus bar manufacturing method of the present invention performs metal plating only on all of the terminal portions in the metal plating step, and performs electrodeposition coating only on all of the main body portions in the electrodeposition coating step. . It is sufficient that the metal plating for reducing the contact resistance is performed at the terminal portion, and it is particularly desirable that the other portions are subjected to insulating coating to prevent short circuit.

  Preferably, in the bus bar manufacturing method of the present invention, the forming step includes a step of forming a metal member by applying metal plating for rust prevention to the metal base material. For metal plating for rust prevention, it is particularly desirable to use Ni electroplating. In general, the compatibility between Ni and the insulating paint is good, so that it does not become an obstacle to construct the coating film to a desired thickness.

  The bus bar of the present invention directly covers at least two terminal parts attached to an external circuit, a metal member having a body part integrally formed with the terminal parts and conducting power between the terminal parts, and the metal member surface of the terminal part. A metal plating layer for reducing contact resistance; and an insulating coating layer that directly covers at least a part of the metal member surface of the main body. The insulating coating is preferably done by electrodeposition coating, but may be performed by alternative means.

(Reference example)
First, the manufacturing method of the bus bar as a reference example is shown using FIG. 1 and FIG.

  FIG. 1 is a diagram schematically showing a series of processes related to the manufacture of a bus bar. FIG. 1A shows a plate material 10 of Cu or Al that is a base material of a bus bar. FIG. 1B is a schematic side view of the punch forming apparatus 12. In the punching and forming apparatus 12, the plate-like material 10 is punched, and a metal base material 14 having a bus bar shape shown in FIG. 1C is formed. The size of the metal base material 14 is not particularly limited, but is, for example, a length of 100 mm to 600 mm, a plate width of 10 mm to 30 mm, and a plate thickness of about 1 mm to 6 mm. The metal base material 14 is provided with terminal portions 16 and 18 for connecting to an external circuit at both ends. The terminal portions 16 and 18 are formed so as to open bolt holes 16a and 18a for bolt tightening, respectively. The bolt holes 16a and 18a may be formed separately after the punching. A main body 20 is provided between the terminal portions 16 and 18. The main body portion 20 functions as a conductive path that transmits power from one terminal portion to the other terminal portion. The metal base material 14 is linearly formed, but additional processing such as bending is performed as necessary.

  FIG.1 (d) is the figure which showed typically the electroplating apparatus 22 for performing a rust prevention process. The electroplating apparatus 22 is provided with a DC power source 24. The Ni rod 26 is used as the anode, and the metal base material 14 is used as the cathode. Both electrodes are immersed in the Ni electrolytic solution bowl 28. As a result, Ni cations are dissolved at the anode, and Ni is deposited on the surface of the metal base material 14 at the cathode. FIG. 1E shows a metal member 30 obtained by this Ni plating process.

  The metal member 30 is a member mainly constituting a bus bar, and the bus bar is manufactured by performing Sn or Au plating for reducing contact resistance and electrodeposition coating for insulation on the metal member 30.

  FIG. 1 (f) is a diagram schematically showing an electroplating apparatus 32 for reducing contact resistance. The electroplating device 32 is provided with a DC power supply 34. An Sn or Au rod 36 is used as the anode, and a metal member 30 is used as the cathode. Both electrodes are immersed in a Sn or Au electrolytic solution tank 38. As a result, Sn or Au cations melt at the anode, and Sn or Au deposits on the surface of the metal member 30 at the cathode. FIG. 1G shows the intermediate product 40 obtained by this Sn or Au plating process.

  FIG. 1 (h) shows a state in which the terminal portions 16 and 18 of the intermediate product 40 are masked using mask materials 42 and 44 such as tape. The masked intermediate product 41 is processed by the electrodeposition coating apparatus 46 shown in FIG. The electrodeposition coating apparatus 46 is an apparatus for electrodeposition-coating paints such as polyimide, polyamideimide, polyesterimide, epoxy, urethane, and acrylic having insulating properties. The electrodeposition coating apparatus 46 is provided with a DC power supply 48, and a metal electrode 50 is used for the anode and a masked intermediate product 41 is used for the cathode. Both poles are immersed in the emulsion paint basket 52. As a result, paint is deposited on the masked intermediate product 41. Furthermore, an insulating coating film is formed by performing a washing process and a baking process. FIG. 1 (j) shows the bus bar 54 created in this way.

  FIG. 2A is a top view of the bus bar 54. An Sn or Au plating layer is formed on the surfaces of the terminal portions 16 and 18, and an insulating coating film is formed on the surface of the main body portion 20.

  FIG. 2B is a cross-sectional view of the bus bar 54 taken along the line BB ′ in FIG. In FIG. 2B, for the sake of explanation, the thickness of the plating layer and the insulating coating is drawn with emphasis, and the plating layer on the side is omitted.

  As shown in FIG. 2B, the bus bar 54 is provided with Ni plating layers 58a and 58b for preventing rust on the surface of the Cu or Al layer 56 made of the metal base material 14 as a nucleus. Sn or Au plating layers 60a and 60b for reducing contact resistance are formed on the surfaces of the Ni plating layers 58a and 58b, respectively. And the insulating coating films 62a and 62b are formed in the surface of the main-body part 20 of Sn or Au plating layer 60a, 60b.

  Since the insulating coatings 62a and 62b are incompatible with Sn or Au, the coatings are not sufficiently thick. According to experiments, a thickness of about 120 μm can be formed on Ni plating, but only about 70 μm can be formed on Sn or Au plating. According to Ohm's law, the insulation resistance R is expressed by the following equation using the resistivity ρ of the insulating coating film, the thickness L of the insulating coating film, and the current inflow / outflow area S.

R = ρL / S (1)
Therefore, if the insulating coating film is not formed to a sufficient thickness, the necessary insulation resistance cannot be ensured and a short circuit will occur.

(Example)
The following embodiment has been made to solve the problems of the reference example.

  First, a typical embodiment will be described with reference to FIGS. FIG. 3 is a diagram corresponding to FIG. 1 and schematically showing a series of processes related to the manufacture of the bus bar. FIGS. 3A to 3E are the same as FIGS. 1A to 1E. That is, the process from applying Ni plating to the surface of the metal base material 14 to obtain the metal member 30 is the same as that described with reference to FIG.

  As shown in FIG. 3 (f), the metal member 30 is masked using a mask material 60 on the main body 20. The masked metal member 62 is Sn or Au plated by an electroplating device 32 for reducing contact resistance. The electroplating apparatus 32 is the same as the electroplating apparatus 32 shown in FIG. 1 (f), except that a metal member 62 masked by the cathode is used.

  FIG. 3 (h) shows the intermediate product 64 plated with Sn or Au. For the intermediate product 64, the main body 20 is plated with Ni, and the Ni plated surfaces of the terminal portions 16, 18 are plated with Sn or Au. As shown in FIG. 3I, the intermediate product 64 is masked with mask materials 66 and 68 of the terminal portions 16 and 18. That is, the intermediate product 70 in which the Sn or Au plated portion is masked is prepared.

  FIG. 3 (j) shows an electrodeposition coating apparatus 46 similar to FIG. 1 (i). However, the masked intermediate product 70 is used as the cathode. As a result, an electrodeposition-coated bus bar 72 shown in FIG. 3 (k) is obtained.

  FIG. 4A is a top view of the bus bar 72. An Sn or Au plating layer is formed on the surfaces of the terminal portions 16 and 18, and an insulating coating film is formed on the surface of the main body portion 20. The difference between the bus bar 72 and the bus bar 54 shown in FIG. 2A becomes clear by comparing the cross sections.

  FIG. 4B is a cross-sectional view of the bus bar 72 taken along CC ′ of FIG. 4A and corresponds to FIG. In FIG. 4 (b), as in FIG. 2 (b), the thickness of the plating layer and the insulating coating film is emphasized for the sake of explanation, and the plating layer at the side is omitted.

  The bus bar 72 is formed with the Cu or Al layer 56 made of the metal base material 14 as a nucleus, and has Ni plating layers 58a and 58b for preventing rust on the surface thereof. About this structure, it is the same as that of the bus-bar 54 of FIG.2 (b). However, the surface configurations of the Ni plating layers 58a and 58b are different. That is, in the bus bar 72, Sn or Au plating layers 74 a, 74 b, 76 a, 76 b are formed on the terminal portions 16, 18, and insulating coatings 78 a, 78 b are formed on the main body portion 20.

  In general, the compatibility between the insulating paint and Ni is good. For this reason, the insulating coatings 78a and 78b of the bus bar 72 formed directly on the surfaces of the Ni plating layers 58a and 58b are sufficiently thicker than the insulating coatings 62a and 62b of the bus bar 54, and have a predetermined insulation resistance. It can be secured. In the bus bar 72, Sn or Au plating layers 74a, 74b, 76a, and 76b are steadily formed on the surfaces of the terminal portions 16 and 18 that are in contact with the bolts and the terminals of the external circuit. For this reason, the contact resistance accompanying the connection with an external circuit can be reduced. As described above, in the bus bar 72, the insulation resistance in the main body portion 20 and the contact resistance reduction in the terminal portions 16 and 18 can be realized.

  In addition, the arrangement area of the Sn or Au plating layer and the insulating coating can be appropriately changed as long as the purpose can be achieved. For example, the insulating coatings 78a and 78b need not be provided in the main body portion 20 where insulation is not required due to the structure when the bus bar 72 is installed. This configuration has the advantage of promoting the cooling of the bus bar 72 and reducing the material cost. The Sn or Au plating layer may or may not be provided at a place where the insulating coating films 78a and 78b are not provided. In addition, Sn or Au plating layers may be formed in the process of Sn or Au plating processing at locations where the insulating coatings 78a and 78b are essentially unnecessary. Such a portion is not formed so thick that the insulating coating film can secure the insulation resistance as shown in FIG. 2B, but does not cause a problem because the insulation is unnecessary.

  Next, a modification of the embodiment will be described with reference to FIG. FIG. 5 is a view corresponding to FIG. 3 and schematically showing a series of processes related to the manufacture of the bus bar. FIGS. 5A to 5E are the same as FIGS. 3A to 3E. That is, the process from applying Ni plating to the surface of the metal base material 14 to obtain the metal member 30 is the same as in the case of FIGS.

  As shown in FIG. 5F, the metal member 30 is masked by using mask materials 80 and 82, respectively. Electrodeposition coating is performed on the masked metal member 84. FIG. 5G shows an electrodeposition coating apparatus 46 similar to that shown in FIG. However, a masked metal member 84 is used as the cathode. Thereby, the intermediate product 86 shown in FIG. For the intermediate product 86, Ni plating layers are formed on the terminal portions 16 and 18, and an insulating coating film is formed on the Ni plating layer of the main body portion 20.

  The main body 20 of the intermediate product 86 is masked using the mask material 88 in the process of FIG. The masked intermediate product 90 is subjected to Sn or Au plating. FIG. 5 (j) shows an electroplating apparatus 32 for reducing contact resistance similar to FIG. 3 (g). However, a masked intermediate product 90 is used for the cathode. Thereby, the bus bar 92 shown in FIG. 5K is obtained.

  The bus bar 92 is made by performing the same processing steps as the bus bar 72 in different procedures. That is, only the order of the electrodeposition coating process and the Sn or Au plating process is different, and the structure of the completed bus bar 92 is the same as the structure of the bus bar 72 shown in FIG.

  Next, another modification of the embodiment will be described with reference to FIG. FIG. 6 is a view corresponding to FIG. 5 and schematically showing a series of processes related to the manufacture of the bus bar. FIGS. 6A to 6H are the same as FIGS. 5A to 5H. That is, the process from producing the metal member 30 by performing Ni plating on the surface of the metal base material 14 and forming the insulating coating film on the Ni plating of the main body portion 20 to obtain the intermediate product 86 is shown in FIG. This is the same as the process shown in FIG.

  The intermediate product 86 is subjected to Sn or Au plating. FIG. 6 (i) shows an electroplating apparatus 32 for reducing contact resistance similar to FIG. 5 (j). However, an intermediate product 86 is used for the cathode. Since Sn or Au plating is incompatible with the insulating paint, the Sn or Au plating layer is hardly formed on the insulating coating film. Therefore, unlike the example shown in FIG. 5, the Sn or Au plating layer is not formed on the main body portion 20 even though it is not masked. The Sn or Au plating layer is formed only on the terminal portions 16 and 18 that have been plated with Ni. Therefore, the bus bar 94 as the final product shown in FIG. 6J has the same structure as the bus bar 72 shown in FIGS. 3 and 4 and the bus bar 92 shown in FIG. In the series of procedures shown in FIG. 6, the mask process is only required for the terminal portions 16 and 18 shown in FIG. 6 (f), and therefore the number of steps is reduced as compared with the examples of FIGS. Can do.

  FIG. 7 is an example in which a laminated bus bar is configured using the bus bar obtained by any one of the modes of FIGS. 3 to 6, and is a view similar to FIG. 10 showing a cross section of the main body. The laminated bus bar 200 is formed by laminating three plate-like bus bars 202, 204, and 206. Each bus bar 202, 204, 206 is constituted by metal members 208, 210, 212 having Ni plating on the surface of a metal base material, and insulating coatings 214, 216, 218 on the surface thereof. This laminated bus bar 200 has a smaller configuration for insulation than the laminated bus bar 100 shown in FIG. In other words, in the bus bar 100, the insulating resin ribs 134 are made large (thick) in consideration of ease of mounting and ensuring the creepage distance, and the cross-sectional area is large. On the other hand, in the laminated bus bar 200, the insulation coating is ensured by forming the bus bar having the insulation coating integrated with the metal member by electrodeposition coating, so the insulation coating is wasted. It is not formed large (thick). As a result, the stacked bus bar 200 can achieve a space saving compared to the stacked bus bar 100.

  In the steps shown in FIGS. 1, 3, 5 and 6, after masking with a mask material, Sn or Au plating or electrodeposition coating with an insulating paint was performed. This masking process is not always necessary. For example, when it is desired to perform Sn or Au plating only on the terminal portions, only the terminal portions may be alternately attached to the electrolytic solution bath.

  FIG. 8A shows a bus bar 220 having a shape designed so that Sn or Au plating treatment or electrodeposition coating of an insulating paint can be performed partially without performing masking treatment. The bus bar 220 includes a rectangular parallelepiped plate-shaped main body portion 222 and terminal portions 224 and 226 provided on one side with respect to the main body portion 222.

  When manufacturing the bus bar 220, for example, as shown in FIG. 8B, the terminal portions 224 and 226 can be subjected to Sn or Au plating. In FIG. 8B, only the terminal portions 224 and 226 of the Ni-plated metal member 230 for manufacturing the bus bar 220 are immersed in the Sn or Au electrolytic solution bowl 228. Therefore, Sn or Au plating of two terminal portions can be performed at the same time without performing mask processing on the main body portion 222.

  FIG. 8C shows a state in which only the main body 222 of the intermediate product 232 obtained by the process of FIG. Even in this process, it is not necessary to perform mask processing on both terminal portions 224 and 226.

  In this way, the bus bar 220 shown in FIG. 8A is manufactured without performing mask processing. The shape of the bus bar that does not require masking is not limited to the shape shown in FIG. In particular, when the bus bar is provided with a bent portion and configured three-dimensionally, the degree of freedom in shape design increases.

  Note that the electrolytic solution soot for immersing only a plurality of terminal portions at the same time to perform the plating process may be a single soot, or may be a separate soot. For example, in a bus bar having a bent part, when a part of the main body part is located between the terminal parts, a bowl having a concave shape that does not immerse the main body part is used, or a separate electrolytic solution layer for each terminal part May be used. Further, depending on the shape of the bus bar, accurate and efficient plating may be performed by changing the height of the liquid surface of the plurality of electrolytic solution layers.

It is a figure which shows the manufacturing process of the bus-bar as a reference example. It is a figure which shows the structure of the bus-bar as a reference example. It is a figure which shows the manufacture process of the bus-bar as an Example. It is a figure which shows the structure of the bus-bar as an Example. It is a figure which shows the manufacturing process of the bus-bar as a modification. It is a figure which shows the manufacturing process of the bus-bar as another modification. It is sectional drawing of a laminated bus bar. It is a figure which shows the modification of a bus-bar shape. It is a top view of the laminated bus bar as a reference example. It is sectional drawing of the lamination | stacking bus-bar as a reference example.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 Plate material, 12 Punch-forming apparatus, 14 Metal base material, 16, 18 Terminal part, 16a, 18a Bolt hole, 20 Main body part, 22, 32 Electroplating apparatus, 24, 34, 48 DC power supply, 26 Ni rod, 28,38 Electrolytic solution tank, 30 Metal member, 32 Electroplating device, 36 Sn or Au rod, 40, 64, 86 Intermediate product, 41, 70, 90 Masked intermediate product, 42, 44, 60, 66 , 68, 80, 82, 88 Mask material, 46 Electrodeposition coating device, 50 Metal electrode, 52 Emulsion paint bottle, 54, 72, 92, 94 Bus bar, 62, 84 Masked metal member.

Claims (13)

A molding step of molding a metal member having at least two terminal parts attached to an external circuit, and a main body part integrally formed with the terminal parts and conducting electric power between the terminal parts;
A metal plating step for directly performing metal plating for reducing contact resistance on the metal part surface in the terminal part or the main body part and the terminal part, and
An electrodeposition coating step in which an electrodeposition coating of an insulating paint is directly applied to a metal member surface in at least a part of the main body;
A bus bar manufacturing method comprising: The bus bar manufacturing method according to claim 1,
In the metal plating step, a metal bar is plated in a state where masking is performed on a portion where metal plating is not performed. The bus bar manufacturing method according to claim 1,
In the metal plating step, only the metal plating target portion is immersed in an electrolytic solution to perform a plating process. In the bus bar manufacturing method according to claim 3,
In the forming step, the bus bar manufacturing method is characterized in that bending is performed into a shape in which only all the terminal portions can be simultaneously immersed in the electrolytic solution bath. The bus bar manufacturing method according to claim 1,
In the electrodeposition coating step, a metal bar is subjected to electrodeposition coating in a state where masking is performed on a portion where electrodeposition coating is not performed. The bus bar manufacturing method according to claim 1,
In the electrodeposition coating step, a method for manufacturing a bus bar, characterized in that an electrodeposition coating process is performed by immersing only a portion to be electrodeposited in a paint bowl. In the bus bar manufacturing method according to claim 6,
In the molding step, the bus bar manufacturing method is characterized in that bending is performed into a shape that allows only the main body to be immersed in the paint layer at one time. The bus bar manufacturing method according to claim 1,
A bus bar manufacturing method, comprising performing an electrodeposition coating step after performing a metal plating step. The bus bar manufacturing method according to claim 1,
A method of manufacturing a bus bar, comprising performing a metal plating step after performing an electrodeposition coating step. In the bus-bar manufacturing method of Claim 9,
In the metal plating step, the electrode member is subjected to an electrodeposition coating process by immersing the metal member in a paint layer without masking the electrodeposited metal member. The bus bar manufacturing method according to claim 1,
In the metal plating step, metal plating is performed only on all of the terminals,
In the electrodeposition coating step, the bus bar manufacturing method is characterized in that electrodeposition coating is performed only on the entire main body. The bus bar manufacturing method according to claim 1,
The bus bar manufacturing method, wherein the forming step includes a step of forming a metal member by applying metal plating for rust prevention to the metal base material. A metal member having at least two terminal parts attached to an external circuit, and a main body part integrally formed with the terminal parts and conducting power between the terminal parts;
A metal plating layer for reducing contact resistance that directly covers the surface of the metal member of the terminal portion;
An insulating coating layer directly covering at least a part of the metal member surface of the main body,
A bus bar comprising:

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