JP2005243736A5 - - Google Patents
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- JP2005243736A5 JP2005243736A5 JP2004048507A JP2004048507A JP2005243736A5 JP 2005243736 A5 JP2005243736 A5 JP 2005243736A5 JP 2004048507 A JP2004048507 A JP 2004048507A JP 2004048507 A JP2004048507 A JP 2004048507A JP 2005243736 A5 JP2005243736 A5 JP 2005243736A5
- Authority
- JP
- Japan
- Prior art keywords
- processing
- processing chamber
- temperature
- substrate
- gas supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (2)
前記処理室を加熱する加熱手段と、
前記処理室内に処理ガスを供給する処理ガス供給手段と、
前記処理室を排気する排気手段と、
前記加熱手段を予め設定された設定温度に基づき制御する加熱制御手段と、
前記処理ガス供給手段を制御して前記処理室内に前記処理ガスを供給することで前記基板の処理を開始する処理ガス供給制御手段とを備え、
前記設定温度は、少なくとも前記処理ガス供給制御手段が前記処理室内に前記処理ガスを供給する前に、前記処理室内の温度を降下させるように設定されていることを特徴とする基板処理装置。 A processing chamber for processing the substrate;
Heating means for heating the processing chamber;
A processing gas supply means for supplying a processing gas into the processing chamber;
Exhaust means for exhausting the processing chamber;
Heating control means for controlling the heating means based on a preset temperature, and
Processing gas supply control means for controlling the processing gas supply means to start processing of the substrate by supplying the processing gas into the processing chamber;
The set temperature, before at least the process gas supply control means supplies the processing gas into the processing chamber, pre Symbol substrate processing apparatus characterized by being configured to make lower the temperature in the room.
前記処理室内の温度を所定の温度まで昇温する工程と、Raising the temperature in the processing chamber to a predetermined temperature;
前記処理室内の温度を降下させる工程と、Lowering the temperature in the processing chamber;
前記処理室内の温度を降下させる工程に引続き、前記処理室内に処理ガスを導入して前記基板を処理する工程と、Following the step of lowering the temperature in the processing chamber, the step of processing the substrate by introducing a processing gas into the processing chamber;
を有することを特徴とする半導体装置の製造方法。A method for manufacturing a semiconductor device, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004048507A JP4610908B2 (en) | 2004-02-24 | 2004-02-24 | Substrate processing apparatus and semiconductor device manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004048507A JP4610908B2 (en) | 2004-02-24 | 2004-02-24 | Substrate processing apparatus and semiconductor device manufacturing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005243736A JP2005243736A (en) | 2005-09-08 |
| JP2005243736A5 true JP2005243736A5 (en) | 2007-04-05 |
| JP4610908B2 JP4610908B2 (en) | 2011-01-12 |
Family
ID=35025177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004048507A Expired - Lifetime JP4610908B2 (en) | 2004-02-24 | 2004-02-24 | Substrate processing apparatus and semiconductor device manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4610908B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101003446B1 (en) * | 2006-03-07 | 2010-12-28 | 가부시키가이샤 히다치 고쿠사이 덴키 | Substrate processing apparatus and substrate processing method |
| JP5101243B2 (en) * | 2007-10-29 | 2012-12-19 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing apparatus control method, and program |
| JP5060324B2 (en) | 2008-01-31 | 2012-10-31 | 株式会社日立国際電気 | Substrate processing apparatus, semiconductor device manufacturing method, and processing container |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3184000B2 (en) * | 1993-05-10 | 2001-07-09 | 株式会社東芝 | Method and apparatus for forming thin film |
| JP4553227B2 (en) * | 2000-02-18 | 2010-09-29 | 東京エレクトロン株式会社 | Heat treatment method |
| JP4546623B2 (en) * | 2000-07-25 | 2010-09-15 | 東京エレクトロン株式会社 | Method for determining control conditions for heat treatment equipment |
| JP4514915B2 (en) * | 2000-07-25 | 2010-07-28 | 東京エレクトロン株式会社 | Heat treatment apparatus, substrate heat treatment method, and medium on which treatment recipe is recorded |
-
2004
- 2004-02-24 JP JP2004048507A patent/JP4610908B2/en not_active Expired - Lifetime
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