JP2005243052A - Ic seal manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC seal manufacturing device for attaching an IC chip to a conventional object in which embedding is difficult in a device for manufacturing a seal including an electronic circuit chip such as an integrated circuit chip. <P>SOLUTION: This manufacturing device is provided with a cutting device (B10200) for cutting a sheet (B) 1300 having a plurality of sets of an IC chip 1100 and communication equipment 1200 for each set of an IC chip and communication equipment, a thermal adhering device 11100 for adhering the cut sheet (B) to a sheet (A) 1300 having an adhesive surface and a cutting device (A) 10200 for cutting the sheet (A) with the sheet (B) attached thereto, and the cut sheet (A) is taken out as an IC seal. This solves the problems that material to be embedded is limited to a portion of material, such as plastic in the current IC chip built-in technology, and that an IC chip built-in product generally has already had a built-in IC chip at the time of shipping so that it is difficult for a user to incorporate an IC chip when the IC chip is required to be incorporated in a certain object. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an apparatus for manufacturing a seal incorporating an electronic circuit chip such as an integrated circuit chip.

  In recent years, with the progress of miniaturization and thinning of electronic circuit chips (hereinafter referred to as IC chips) such as integrated circuit chips, IC chips have come to be used in various usage forms.

  As one of the usage forms of such an IC chip, for example, as described in Japanese Patent Application Laid-Open No. 3-38396, a small electronic circuit chip for storing information is transferred from the IC chip in a non-contact manner. A usage form is known that is used by being embedded in a portable plastic card together with a communication device for reading. As an application example, a usage form is known in which a plastic card having personal identification information stored in an IC chip is used as an electronic ID card for confirming personal identification information without contact. There is also known a utilization method in which a plastic card in which information on parts constituting an industrial product is stored in an IC chip is put in the industrial product and used as information on reuse of the parts at the time of disposal.

JP-A-3-38396

  Thus, the range of use of IC chips is expanding. However, with the current IC chip integration technology, materials that can be incorporated are limited to some materials such as plastic. In addition, at present, products incorporating IC chips are generally already incorporated at the time of shipment, and the IC chip is incorporated when the user needs to incorporate the IC chip into a certain object. Is difficult.

  On the other hand, a sticker in which an adhesive surface is added to a thin sheet made of a material such as paper or cellophane is also widely used. While the seal is used for repair purposes, there are other uses for the purpose of adding information such as writing or pasting information such as characters and designs on the seal surface. However, there is a problem that the information that can be added to the conventional seal is limited to information that can be written on the seal surface such as characters and designs.

  It is an object of the present invention to provide an IC seal manufacturing apparatus that adds an IC chip to those that have been difficult to embed.

  The present invention provides a first cutting device that cuts a first sheet having a plurality of sets of IC chips and communication devices for each IC chip and communication device, and the cut first sheet is bonded to the first surface. And a second cutting device for cutting the second sheet to which the first sheet is attached. The cut second sheet is taken out as an IC seal.

  In addition, the present invention provides a cutting device that cuts a first sheet having a plurality of sets of IC chips and communication devices for each set of IC chips and communication devices, the cut first sheet, an adhesive surface, A device for attaching to a second sheet having a description surface, and a communication device for communicating with the IC chip via the communication device and after the first sheet is attached to the second sheet and before being taken out as an IC seal And a device for printing.

  ADVANTAGE OF THE INVENTION According to this invention, the IC seal manufacturing apparatus which can print a character and a design on the description surface of an IC seal is realizable.

  ADVANTAGE OF THE INVENTION According to this invention, the IC seal manufacturing apparatus which can set arbitrarily the number of the group of IC chip and communication apparatus to be incorporated irrespective of the length of the IC seal to produce is realizable.

  The present invention proposes an IC seal in which an IC chip is incorporated in a seal obtained by adding an adhesive surface to a sheet made of a material such as paper or cellophane. When an IC seal is used, an IC chip can be added even to a material that can hardly be embedded in a conventional IC chip as long as it can be pasted. Further, it can be retrofitted when an IC chip needs to be added. Furthermore, information such as voice, sound, electronic texts and designs that cannot be added by a conventional seal can be digitized and recorded and pasted on an IC chip.

  The present invention proposes a structure of an IC seal that pays attention to the operation of pasting / peeling, peripheral devices related to the IC seal, and an application system using the IC seal.

  Hereinafter, embodiments of the present invention will be described in detail.

  The structure of the IC seal 1000 will be described with reference to FIGS. This embodiment is referred to as Embodiment 1.

  FIG. 1 is a cross-sectional view of the IC seal 1000 taken along the dotted line 1900 from the IC seal 1000 shown in FIG. In the cross-sectional view of FIG. 1, the thickness of the IC seal 1000 is increased for convenience of explanation. Hereinafter, in this embodiment, the sectional view of the IC seal 1000 will be described with the thickness of the IC seal 1000 increased. The IC seal 1000 includes a sheet 1300, an IC chip 1100, and a communication device 1200 as components. The sheet 1300 is a thin material such as paper, cellophane or a plus chip card. The sheet 1300 has an adhesive surface 1400. An adhesive is attached to the adhesive surface 1400, and has a function of attaching the IC seal 1000 to an object 2100 to be applied later. The sheet 1300 may have a description surface 1500. The description surface 1500 is a surface on which characters, symbols, pictures, images, etc. are printed or written. The sheet 1300 includes an IC chip 1100 and a communication device 1200.

  A storage device 1110 and a processing device 1120 are incorporated in the IC chip 1100. The storage device 1110 records data 1111 and a program 1112. The processing device 1120 executes the program 1112. The communication device 1200 communicates with or without contact with an IC chip reader / writer (hereinafter referred to as IC chip R / W) 2200 described later, and mediates communication between the IC chip 1100 and an external terminal 2300 described later. The communication device 1200 also supplies power to the IC chip 1100.

  In some cases, an additional material (description surface side) 1620 and an additional material (adhesion surface side) 1610 are incorporated in the sheet 1300. The additional material (description surface side) 1620 is a material positioned on the description surface 1500 side with respect to the IC chip 1100 and the communication device 1200. For example, the IC chip 1100 and the communication are generated by pressure generated when writing to the description surface 1500 or printing. There are a reinforcing material that prevents the device 1200 from being destroyed, a heat insulating material that protects the IC chip 1100 and the communication device 1200 from heat generated during printing on the description surface 1500, and the like.

  The additional material (adhesion surface side) 1610 is a material located on the adhesion surface 1400 side with respect to the IC chip 1100 and the communication device 1200. For example, when the surface to which the IC seal 1000 is attached is a curved surface, the additional material (adhesion surface side) 1610 The reinforcing material that protects the device 1200 from being deformed and destroyed, the heat insulating material that protects the IC chip 1100 and the communication device 1200 from the influence of heat when the object 2100 to be described later generates heat, and the object to be described later When the object 2100 generates magnetic force, there is a magnetic shielding material that protects the IC chip 1100 and the communication device 1200 from the influence of the magnetic force.

  The IC chip 1100, the communication device 1200, the additional material (description surface side) 1620, and the additional material (adhesion surface side) 1610 are arranged in order on the description surface 1500 or the adhesion surface 1400 of the sheet 1300, in addition to being incorporated in the sheet 1300. You can paste without changing. In this case, if the description surface 1500 in FIG. 1 is referred to as the top and the adhesive surface 1400 is referred to as the bottom, the additional material (description surface side) 1620 is always disposed on the IC chip 1100 and the communication device 1200. The additional material (description surface side) 1610 means that the additional material (description surface side) 1610 is always arranged below the IC chip 1100 and the communication device 1200.

  With the IC seal 1000 shown in the first embodiment, the IC chip 1100 and the communication device 1200 can be attached by attaching the IC seal 1000 even to a material that is difficult to incorporate the conventional IC chip 1100 and the communication device 1200. Is possible. In addition, when an IC seal is used, it is possible to attach the IC chip 1100 and the communication device 1200 at a stage where the necessity arises for a thing that needs to be assembled.

  An example of use of the IC seal 1000 will be described with reference to FIG. This embodiment is referred to as a second embodiment.

  The IC seal 1000 is attached to the object 2100 to be attached using the adhesive surface 1400. The IC seal 1000 records the data 1111 and the program 1112 related to the IC seal 1000 as the data 1111 and the program 1112, and the data 1111 and the program 1112 related to the pasting target 2100. The IC chip R / W 2200 communicates with or without contact with the communication apparatus 1200 and mediates communication between the IC chip 1100 and the external terminal 2300 via the communication line 2400. Here, the communication line 2400 indicates a general communication device that mediates transmission / reception of data regardless of wired, wireless, or short distance / long distance, and is, for example, the Internet or a bus in the system. The external terminal 2300 communicates with the IC chip 1100, reads / writes data 1111 and the program 1112, calls a process in the program 1112, or conversely, responds to a call from a process from the program 1112, and further sets the external terminal 2300 to Performs input / output processing with the operating operator.

  With the IC seal 1000 shown in the second embodiment, the IC chip 1100 and the communication device 1200 can be attached by attaching the IC seal 1000 to a material made of a material that is difficult to incorporate the conventional IC chip 1100 and the communication device 1200. Is possible. In addition, when an IC seal is used, it is possible to attach the IC chip 1100 and the communication device 1200 at a stage where the necessity arises for a thing that needs to be assembled.

  The structure of the IC seal 1000 that can detect that the seal has been peeled off is described with reference to FIGS. This embodiment is referred to as Embodiment 3.

  FIG. 4 is a cross-sectional view of the IC seal 1000 and the pasting object 2100 before the IC seal 1000 is peeled off. In the third embodiment, the IC seal 1000 is constituted by two sheets 1300. In order to distinguish the two sheets, they are called a sheet (primary) 1300 and a sheet (secondary) 1300, respectively. An IC chip 1100 and a communication device 1200 are incorporated in the sheet (correct) 1300. The sheet (positive) 1300 has a strong adhesive surface 3400 having a stronger adhesive force than the adhesive surface 1400. The sheet (secondary) 1300 has an adhesive surface 1400, and a part thereof is bonded to the sheet (primary) 1300. Further, a cutting sensor 3300 partially incorporated in each of the sheet (primary) 1300 and the sheet (secondary) 1300 is assembled between the sheet (primary) 1300 and the sheet (secondary) 1300. The cutting sensor 3300 is, for example, a U-shaped metal wire. When the seal 1000 is pasted on the pasting object 2100, a part of the strong adhesion surface 3400 of the sheet (primary) 1300 and the adhesion surface 1400 of the sheet (secondary) 1300 adheres to the pasting object 2100.

  Next, the state after the IC seal 1000 is peeled will be described with reference to FIG. When the IC seal 1000 is peeled off, the portion of the sheet (secondary) 1300 is peeled off, but the sheet (primary) 1300 and the pasting object 2100 are bonded rather than the bonding surface 1400 that bonds the sheet (primary) 1300 and the sheet (secondary) 1300. Since the strong adhesive surface 3400 to be bonded has stronger adhesive force, the sheet (positive) 1300 remains attached to the object 2100 to be attached. As a result, the cutting sensor 3300 is divided into a cutting sensor (primary) 4100 in the sheet (primary) 1300 and a cutting sensor (secondary) 4200 in the sheet (secondary) 1300.

  With the above structure, a current test is performed at both ends of the U-shape of the cutting sensor 3300. If power is supplied, the IC seal 1000 is not peeled off. If power is not supplied, it can be detected that the IC seal 1000 has been peeled off. Further, the cutting sensor 3300 is incorporated in the sheet (primary) 1300 and the sheet (secondary) 1300 in a state where tension is applied, so that the cutting sensor (primary) 4100 and the cutting sensor (secondary) 4200 are disconnected when the cutting sensor 3300 is cut. Even if the cut surfaces sink into the sheet (primary) 1300 and the sheet (secondary) 1300, and the sheet (primary) 1300 and the sheet (secondary) 1300 are bonded again, the cutting sensor (positive) 4100 and the cutting sensor (secondary) ) A mechanism that does not contact 4200 can be realized. By this mechanism, even if the IC seal 1000 that has been peeled once is pasted again, it can be detected that it has already been peeled off.

  The function of the IC chip 1100 can be stopped by peeling the IC seal 1000 by incorporating a part of the IC chip 1100 into the sheet (sub) 1300 without using the cutting sensor 3300. Further, the IC chip 1100 can be prevented from communicating with the external terminal 2300 by removing the IC seal 1000 by incorporating the communication device 1200 into the sheet (secondary) 1300. Further, the communication device 1200 is divided into a communication device for reading and a communication device for writing, and any one of the communication devices is incorporated into the sheet (secondary) 1300, and the IC seal 1000 is peeled off to make it read-only or write-only. Can do.

  According to the third embodiment, it is possible to detect that the IC seal 1000 has been peeled off. Conventionally, there are seals for detecting that the video tape has been peeled off, such as a sticker for preventing the rental video cassette from being disassembled and a sticker for proving that the rental video cassette has not been opened. When these seals are peeled off, the color of the seals changes or the seals themselves are broken. Although it was possible to detect that these seals were peeled off visually, it was difficult to detect them electronically. According to the third embodiment, it is possible to electronically detect that the IC seal 1000 has been peeled off.

  The structure of the IC seal 1000 that enables communication with the external terminal 2300 by pasting will be described with reference to FIG. This embodiment is referred to as a fourth embodiment.

  In the fourth embodiment, an IC chip 1100 and a connection terminal (IC seal side) 6100 connected to the IC chip 1100 are incorporated in the IC seal 1000. Further, the communication device 1200 and the connection terminal (the paste object side) 6200 connected to the communication device 1200 are incorporated in the paste object 2100. The connection terminal (IC seal side) 6100 exists on the surface of the adhesive surface 1400 of the IC seal 1000. A plurality of connection terminals (attachment object side) 6200 exist on the surface of the attachment object 2100. By attaching the IC seal 1000 to the object 2100 to be attached, the connection terminal (IC seal side) 6100 and any one of the connection terminals (attachment object side) 6200 come into contact. Thus, the IC chip 1100 and the communication device 1200 are connected via the connection terminal (IC seal side) 6100 and the connection terminal (attachment target side) 6200. Hereinafter, as in the second embodiment, the communication device 1200 and the IC chip R / W 2200 mediate, and the IC chip 1100 and the external terminal 2300 communicate with each other.

  According to the fourth embodiment, the communication device 1200 can be disposed in the pasting target 2100 outside the IC seal 1000. When the IC chip 1100 communicates with the external terminal 2300 in a non-contact manner, communication at a longer distance is possible if the communication device 1200 is larger. However, when the communication device 1200 is in the IC seal 1000, the portability of the IC seal 1000 is lowered when the communication device 1200 is enlarged. According to the present embodiment, the communication device 1200 can be incorporated into the pasting object 2100, and the large communication device 1200 can be used while the IC seal 1000 is small.

  The structure of the IC seal 1000 in which the IC chip 1100 and the communication device 1200 can be reused will be described with reference to FIGS. This embodiment is referred to as Embodiment 5.

  In the fifth embodiment, the IC seal 1000 is composed of three sheets 1300 shown in FIG. In order to identify the respective sheets 1300, they are referred to as a sheet (A) 1300, a sheet (B) 1300, and a sheet (C) 1300. An IC chip 1100 and a communication device 1200 are incorporated in the sheet (C) 1300. The sheet (A) 1300 has a description surface 1500. The sheet (B) 1300 has an adhesive surface 1400. The sheet (C) 1300 is placed on the surface opposite to the bonding surface 1400 of the sheet (B) 1300 (hereinafter, the upper direction in the figure is referred to as the above), and the sheet (A) 1300 is further stacked on the sheet (C) 1300. . The sheet (A) 1300 and the sheet (B) 1300 are bonded to each other by attaching an adhesive to the internal adhesive surface 8400 where the sheet (A) 1300 and the sheet (B) 1300 are in direct contact without passing through the sheet (C) 1300. .

  For the IC seal 1000 having the above structure, when the IC chip 1100 and the communication device 1200 are reused, the IC seal 1000 is cut along the dotted line 8500 and the dotted line 8600. FIG. 8 is a cross-sectional view of the IC seal 1000 after cutting. The sheet (A) 1300 is cut into a sheet (A1) 1300, a sheet (A2) 1300, and a sheet (A3) 1300. The sheet (B) 1300 is cut into a sheet (B1) 1300, a sheet (B2) 1300, and a sheet (B3) 1300. Since the sheet (A2) 1300 and the sheet (C) 1300 and the sheet (B2) 1300 and the sheet (C) 1300 are not bonded, the sheet (C) 1300 can be taken out alone. The IC chip 1200 and the communication device 1200 can be reused by sandwiching the extracted sheet (C) 1300 with a new sheet (A) 1300 and a sheet (B) 1300. In the present embodiment, the adhesive surface 1400 may not be provided.

  According to the fifth embodiment, the IC chip 1100 and the communication device 1200 can be reused.

  The IC seal printing apparatus 10000 will be described with reference to FIG. This embodiment is referred to as Embodiment 6.

  The IC seal printing apparatus 10000 includes a cutting apparatus 10200, an IC chip R / W 2200, a printing apparatus 10300, a roll shaft 10400, and a take-out port 10500. Further, the IC sticker printing apparatus 10000 is connected to the external terminal 2300 via the communication line 2400. The external terminal 2300 may exist in the IC sticker printing apparatus 10000. The cutting device 10200 cuts the IC seal 1000. The printing apparatus 10300 prints characters, designs, and the like on the description surface 1500. An IC seal roll 10100 is mounted on the roll shaft 10400. The IC seal roll 10100 is a product in which the IC seal 1000 is wound around a cylindrical side surface, and the roll seal 10400 rotates to feed the IC seal 1000 in the direction of the arrow 10700. A set of a plurality of IC chips 1100 and a communication device 1200 is incorporated in the IC seal roll 10100. The take-out port 10500 is an exit through which the cut IC seal 1000 is taken out.

  Hereinafter, the printing procedure will be described. In the external terminal 2300, print data 10600 to be printed on the description surface 1500 of the IC sticker 1000, data 1111 to be stored in the IC chip 1100, and a program 1112 are determined. For example, the operator specifies the external terminal 2300 to determine the data. Next, the print data 10600 is sent to the printing apparatus 10300 via the communication line 2400 and printed on the description surface 1500.

  Next, the data 1111 and the program 1112 are sent to the storage device 1110 in the IC chip 1000 via the communication line 2400, the IC chip R / W 2200, and the communication device 1200, and stored in the storage device 1110. When printing on the description surface 1500 and storage on the storage device 1110 are completed, the roll shaft 10400 is rotated, and the IC chip 1100 on which the print data 10600, data 1111 and program 1112 printed on the description surface 1500 are recorded and the IC chip. The communication device 1200 associated with 1100 sends out the IC seal 1000 until it comes to the take-out port 10500 side (left side in FIG. 9) with respect to the cutting device 10200 position. The position where the IC chip 1100 and the communication device 1200 are embedded can be detected, for example, by changing the width or thickness of the IC seal 1000 only in the embedded portion. Next, the IC seal 1000 is cut using the cutting device 10200, and the IC seal 1000 is sent out from the takeout port 10500.

  According to the sixth embodiment, an IC sticker printing apparatus 10000 that prints characters and designs on the description surface 1500 of the IC sticker 1000 and further writes data on the IC chip 1100 can be realized.

  The second IC sticker printing apparatus 10000 will be described with reference to FIG. This embodiment is referred to as Embodiment 7. The difference between the seventh embodiment and the sixth embodiment is that, in the IC seal printing apparatus 10000 of the sixth embodiment, the number of sets of the IC chip 1100 and the communication apparatus 1200 in which the IC seal 1000 after cutting is built is the number of IC seals 1000 after cutting. In the seventh embodiment, the number of sets of the IC chip 1100 and the communication device 1200 in which the IC seal 1000 after cutting is built is arbitrarily specified regardless of the length of the IC seal 1000 after cutting. It is a point that can be done.

  In this embodiment, the IC seal printing apparatus 10000 includes two cutting apparatuses 10200, an IC chip R / W 2200, a printing apparatus 10300, a heat deposition apparatus 11100, two roll shafts 10400, and a take-out port 10500. The two cutting devices 10200 are referred to as a cutting device (A) 10200 and a cutting device (B) 10200 in order to identify them. The two roll shafts 10400 are also referred to as a roll shaft (A) 10400 and a roll shaft (B) 10400 in order to identify them. A sheet roll 11200 around which a sheet 1300 is wound on a cylindrical side surface is mounted on the roll axis (A) 11400 and the roll axis (B). In order to distinguish each sheet 1300 and sheet roll 11200, what is wound around the roll shaft (A) 11400 is called a sheet (A) 1300 and sheet roll (A) 11200, and is wound around the roll shaft (B) 10400. These are called a sheet (B) 1300 and a sheet roll (B) 11200. The roll (A) 10400 rotates to feed the sheet (A) in the direction of the arrow 11800. Further, the roll (B) 10400 rotates to feed the sheet (B) 1300 in the direction of the arrow 11850.

  The sheet (A) 1300 in this embodiment has an adhesive surface 1400 and a description surface 1500. On the other hand, the sheet (B) 1300 in the present embodiment includes a plurality of sets of the IC chip 1100 and the communication device 1200 and an internal adhesive surface 8400.

  When the number of sets of the IC chip 1100 and the communication device 1200 to be attached to the IC seal 1000 to be created is designated from the external terminal 2300, the designated number of sheets (B) 1300 are rolled into the roll axis (B) 10400 and the cutting device (B). 10200, using the heat deposition apparatus 11100, the sheet (A) 1300 is pasted on the description surface 1500. An operator inputs the number of sets of the IC chip 1100 and the communication device 1200 to be pasted into the external terminal 2300, for example.

  The sheet (B) 1300 is affixed by first rotating the roll shaft (B) 10400 to feed the sheet (B) 1300 in the direction of the arrow 11850, and a pair of IC chips 1100 and a communication device 1200 of the cutting device (B) 10200. Sent until it passes completely below. Next, the sheet (B) 1300 is cut using the cutting device (B) 10200. Next, the cut sheet (B) is affixed to the description surface 1500 of the sheet (A) 1300 using the heat deposition apparatus 11100.

  The sheet (B) 1300 has an internal adhesive surface 8400 on the side in contact with the description surface 1500 of the sheet (A) 1300. The internal adhesive surface 8400 is coated with an adhesive whose viscosity increases due to heat. The heat deposition apparatus 11100 has a constricted shape at the center, and when the sheet (B) 1300 is pressed against the sheet (A) 1300, only the peripheral part of the heat deposition apparatus 11100 is around the sheet (B) 1300 (IC chip 1100 and communication). The device 1200 is touched. As a result, the periphery of the sheet (B) 1300 is heated by the heat transmitted from the heat deposition apparatus 11100, and the internal adhesive surface 8400 adheres to the sheet (A) 1300. The reason why the sheet (B) 1300 is bonded around is to prevent the IC chip 1100 and the communication device 1200 from being destroyed by heat. The process for pasting the sheet (B) 1300 is repeated as many times as the number of groups to be pasted.

  In the present embodiment, the sheet (B) 1300 attached to the sheet (A) 1300 is referred to as an IC seal 1000. Hereinafter, printing / writing of data on the description surface 1500 of the IC seal 1000 and the IC chip 1300 and cutting of the IC seal 1000 are the same as in the case of the sixth embodiment.

  According to the seventh embodiment, it is possible to realize an IC seal printing apparatus 10000 that can arbitrarily specify the number of IC chip 1100 and communication apparatus 1200 to be incorporated regardless of the length of the IC seal 1000 to be created.

  The structure of a reuse IC seal creating apparatus 12000 that creates an IC seal 1000 that can be reused of the IC chip 1100 and the communication apparatus 1200 shown in the fifth embodiment will be described with reference to FIG. This embodiment is referred to as an eighth embodiment. The reuse IC seal creation apparatus 12000 includes a cutting apparatus 10200, a heat deposition apparatus 11100, a sheet insertion apparatus 12100, a roll shaft (A) 10400, a roll shaft (B) 10400, and a take-out port 10500.

  The roll shaft (A) 10400 is provided with a sheet roll (A) 11200 in which the sheet (A) 1300 described in the fifth embodiment is wound around a cylindrical side surface, and the roll (A) 10400 is rotated to rotate the sheet ( A) 1300 is sent in the direction of arrow 12700. The roll shaft (B) 10400 is provided with a sheet roll (B) 11200 in which the sheet (B) 1300 described in the fifth embodiment is wound on the side surface of the cylinder, and the roll shaft (B) 10400 rotates. ) 1300 is sent in the direction of arrow 12750. The seal (B) 1300 has an internal adhesive surface 8400, and an adhesive that increases in viscosity and adheres to the internal adhesive surface 8400 is applied to the internal adhesive surface 8400. The seal (A) 1300 may have the internal adhesive surface 8400. The sheet insertion device 12100 inserts the sheet (C) 1300 described in the fifth embodiment between the sheet (A) 1300 and the sheet (B) 1300. By rotating the roll shaft (A) 10400 and the roll shaft (B) 10400, the sheet (C) 1300 is conveyed to the heat deposition apparatus 11100.

  The heat deposition apparatus 11100 has a constricted central portion, and when the sheet (A) 1300 is pressed against the sheet (B) 1300, only the peripheral portion of the heat deposition apparatus 11100 is surrounded by the sheet (A) 1300 (sheet (C) Contact 1300). As a result, the periphery of the sheet (A) 1300 is heated by the heat transmitted from the heat deposition apparatus 11100 and adheres to the sheet (B) 1300. Since the portion where the sheet (C) 1300 is sandwiched is not heated by the heat deposition apparatus 11100, the sheet (A) 1300 and the sheet (C) 1300 and the sheet (B) 1300 and the sheet (C) 1300 are bonded. Not.

  Next, the roll shaft (A) 10400 and the roll shaft (B) 10400 are rotated to sandwich the sheet (A) 1300 and the sheet (B) 1300 which are heat-fitted with the sheet (C) 1300 interposed therebetween (see FIG. 11 to the left). Next, by cutting the sheet (A) 1300 and the sheet (B) 1300 using the cutting device 10200, the IC seal 1000 having the structure of the IC seal 1000 shown in Embodiment 5 can be created.

  According to the eighth embodiment, it is possible to realize a reuse IC seal creating apparatus 12000 that creates an IC seal 1000 that can be reused by the IC chip 1100 and the communication apparatus 1200 shown in the fifth embodiment.

  A technique for enabling playback of the digital content recording medium 13100 after passing through the sales terminal 13200 will be described with reference to FIG. This embodiment is referred to as Embodiment 9. This embodiment includes a digital content recording medium 13100, an IC seal 1000, a sales terminal 13200, a key management server 13300, a media playback device 13400, and a communication line 2400.

  The digital content recording medium 13100 is a medium for recording digital content 13650 such as music, video, and software, and is, for example, a CD-ROM, a DVD, or the like. In this embodiment, the encrypted digital content 13600 is recorded on the digital content recording medium 13100. The digital content 13650 has a content ID 13500, and the digital content 13650 having the same content ID 13500 is encrypted using the same encryption key 13750. The encryption key 13750 has a corresponding decryption key 13700. Here, “corresponding” means that the data encrypted with the encryption key 13750 can be decrypted with the decryption key 13700. Further, a key correspondence table 13800 indicating an encryption key 13750 and a decryption key 13700 used for the content ID 13500 is prepared. An IC seal 1000 is attached to the digital content recording medium 13100.

  As the IC seal 1000 used in the present embodiment, the IC seal 1000 that cannot be read by peeling as shown in the third embodiment is used. This prevents the IC seal 1000 from being peeled off and pasted on another digital content recording medium for reuse. The content ID 13500 is recorded on the IC seal 1000. The decryption key 13700 and the key correspondence table 13800 are recorded in the key management server 13300.

  The sales terminal 13200 includes an IC chip R / W 2200. The sales terminal 13200 reads the content ID 13500 recorded in the IC seal 1000 using the built-in IC chip R / W 2200 at the time of selling the digital content recording medium 13100, and sends the content to the key management server 13300 via the communication line 2400. Send ID13500. At the same time, the sales information may be sent to the key management server 13300. The sales information is, for example, where the sales terminal 13200 is, the age of the purchaser, the purchase time, and the like.

  The key management server 13300 searches the decryption key 13700 corresponding to the received content ID 13500 using the key correspondence table 13800, and sends it back to the sales terminal 13200 via the communication line 2400. Upon receiving the decryption key 13700, the sales terminal 13200 records the decryption key 13700 on the IC seal 1000 using the built-in IC chip R / W 2200.

  The media playback device 13400 is a device that plays back the digital content 13650. The media playback device 13400 has a structure in which a media reading device 13450, an IC chip R / W 2200, a processing device 13490, a decoding device 13460, and an output device 13470 are connected by a bus 13480. The media reader 13450 reads the encrypted digital content 13600 that is the recording content of the digital content recording medium 13100. The decryption device 13460 decrypts the digital content 13600 encrypted using the decryption key 13700. The processing device 13490 performs data processing on the decrypted digital content 13650. Here, data processing includes conversion from digital to analog waveform data if the content of the digital content 13650 is, for example, music, and conversion from digital data to image data if the content is video. The output device 13470 outputs the result processed by the processing device 13490 to the outside. Here, the external means an amplifier or the like if the digital content to be played is music, a monitor or the like if it is video, and a computer or the like if it is software. A bus 13480 mediates data communication between devices in the media playback device 13400.

  Hereinafter, the reproduction process will be described in order. When the digital content recording medium 13100 is set in the media playback device 13400, the media playback device 13400 reads the decryption key 13700 from the IC seal 1000 using the built-in IC chip R / W 2200. If the decryption key 13700 is not recorded on the IC seal 1000, the reproduction is stopped. Next, the media playback device 13400 reads the digital content 13600 encrypted using the media reading device 13450. Next, the decryption device 13460 decrypts the encrypted digital content 13600 using the read decryption key 13700. Further, the decrypted digital content 13650 is processed using the processing device 13490 and output to the outside using the output device 13470.

  According to the ninth embodiment, it is possible to prevent the digital content 13650 from being played back on the digital content recording medium 13100 before sales, which is useful for preventing shoplifting of the digital content recording media 13100 before sales.

  An embodiment in which the IC seal 1000 is applied to a patch (partial update of contents) of a ROM medium 14000 that is a read-only medium for recording digital data will be described with reference to FIG. This embodiment is referred to as Embodiment 10. The ROM medium 14000 stores digital data 14220, and the data 14220 can be referred to by an address 14210 that each data 14220 has individually. Affix the IC seal 1000 to the ROM media 14000. The IC seal 1000 stores a patch table 14100. The patch table 14100 records a set of a change target address 14110 and change data 14130. When the address 14210 and the change target address 14110 match the data 14220 of the ROM medium 14000 to which the IC seal 1000 is pasted, the patch table 14100 changes the data 14220 and the change data 14130 paired with the change target address 14110. It is a table showing the replacement.

  On the other hand, in this embodiment, the media playback device 13400 that reads the ROM media 14000 has a structure in which a media reader 13450, an IC chip R / W 2200, a processing device 13490, a processing device 1110, a storage device 1120, and an output device 13470 are connected by a bus 13480. have. When the ROM media 14000 is set in the media playback device 13400, the media retransmission device 13400 reads the patch table 14100 recorded in the IC seal 1000 using the IC chip R / W 2200 and records it in the storage device 1120. Next, the media playback device 13400 reads the data 14220 using the media reading device 13450 and transfers it to the processing device 13490. At this time, if there is a change target address 14110 that matches the address 14210 of the read data 14220 using the processing device 1110, the media playback device 13400 pairs with the change target address 14110 instead of the data 14220. The changed data 14130 is transferred to the processing device 13490. Hereinafter, processing by the processing device 13490 and the output device 13470 is the same as in the case of the ninth embodiment.

  According to the tenth embodiment, the change data 14130 for the ROM medium 14000 is stored in the IC sticker 1000 and pasted, so that the change data 14130 can be prevented from being lost.

  An embodiment in which the position of the pasting object 2100 is detected using the IC seal 1000 and a plurality of IC chips R / W 2200 will be described with reference to FIGS. 14 and 15. This embodiment is referred to as Embodiment 11. First, a system configuration for performing position detection will be described with reference to FIG.

  First, a plurality of IC chips R / W 2200 are prepared and arranged in a distributed manner. In this embodiment, it is assumed that there are a plurality of shelves 15200, and an IC chip R / W 2200 is arranged on each shelf 15200. Here, in order to distinguish the individual shelf 15200 and the IC chip R / W 2200, subscripts are respectively added and described as IC chip R / W [m] 2200 and shelf [n] 15200. However, m and n are variables, and different numbers are entered for each shelf 15200 and each IC chip R / W 2200. Each IC chip R / W [m] 2200 is connected to an external terminal 2300 via a communication line 2400. It is assumed that the pasting target 2100 is placed on the shelf [n] 15200. Further, an IC seal 1000 is pasted on the pasting object 2100. Here, since there may be a plurality of objects to be pasted 2100 and IC seals 1000, in order to identify each of them, a subscript is added to each of them to indicate the objects to be pasted [p] 2100 and IC seal [p] 1000. . The handling of the variable p is the same as the variables m and n. The same variable is used for both the object to be pasted [p] 2100 and the IC sticker [p] 1000. The IC sticker 1000 and the object to be pasted 2100 having the relationship of being pasted / pasted have the same variable p value. It means that.

  A search data table 15100 is recorded in the IC seal [p] 1000. The search data table 15100 has columns of an item 15110 and a value 15120. The item 15110 is data indicating what kind of data is recorded in the value 15120 column. In the example of FIG. 14, in the column of the value 15120 for the pasting object [p] 2100, the “title” of the book, the place where the book is “held”, and the “issue date” of the book are recorded. The data of each item 15110 indicates that this is true. In the value 15120, data corresponding to each item 15110 is recorded. In the example of FIG. 14, “△△ Encyclopedia” is set for the “title” item, “XX Library” is set for the “holding” item, and “× month” is set for the “issue date” item. X day "is recorded.

  For the system having the above configuration, the external terminal 2300 performs processing according to the flowchart shown in FIG. In processing step 16010, the search condition of the pasting object [p] 2100 to be searched using the external terminal 2300 is designated from the outside. The search condition is specified in the form of “Title” in the column of the item 15110 and “ΔΔ Encyclopedia” in the column of the value 15120 of the item 15110, for example.

  In the processing step 16020, one IC chip R / W [m] not already selected in the loop realized by the processing flow 16090 from the IC chips R / W [m] 2200 connected to the external terminal 2300. 2200 is selected (the selected IC chip R / W2200 [m] is expressed in particular as IC chip R / W2200 [p0] 2200). In processing step 16030, it is checked whether there is an IC seal [p] 1000 that can be read by the IC chip R / W [m0] 2200 and has not been read in the loop realized by the processing flow 16080 (existence). In this case, the IC seal [p] 1000 is particularly referred to as IC seal [p0] 1000). If the IC seal [p0] 1000 exists, the process flow moves to process step 16040. If not, the process flow moves to process step 16060. In processing step 16040, it is checked whether or not the contents of the search data table 15100 held by the IC seal [p0] 1000 match the search conditions. If they match, the processing flow is shifted to processing step 16050. If they do not match, the process flow moves to process step 16030. In processing step 16050, using the external terminal 2300, the paste object [p0] 2100 (the paste object to which the IC seal [p0] 1000 is pasted) in which the IC chip R / W [m0] 2200 is in the search condition is found. Is displayed. In processing step 16060, it is determined whether or not all the IC chips R / W [m] 2200 connected to the external terminal 2300 have been selected. If all the IC chips R / W [m] 2200 have been selected, the position detection process is terminated. The flow moves to process step 16020.

  According to the eleventh embodiment, the position of the pasting object 2100 can be searched.

It is the figure which showed the structure of IC seal. It is the figure which showed the general view of the IC seal. It is the figure which showed the usage example of IC seal. It is the figure (before peeling) which showed the structure of the IC seal which can detect having peeled. It is the figure which showed the structure of the IC seal | sticker which can detect having peeled (after peeling). It is the figure which showed the structure which the communication apparatus and IC seal in a sticking target object connect by sticking. The IC seal structure is excellent in reusability of the IC chip and the communication device (before the IC chip and the communication device are taken out). The IC seal structure is excellent in reusability of the IC chip and the communication device (after the IC chip and the communication device are taken out). It is the figure which showed the structure of the IC sticker printing apparatus. It is the figure which showed the structure of the IC seal | sticker printing apparatus which can control the number of IC chips and communication apparatuses to incorporate. It is the figure which showed the structure of the apparatus which produces a reusable IC seal. It is a block diagram of the system which downloads a decryption key to an IC seal at the time of sale. It is the figure which showed the example which used the IC sticker as the difference supply media with respect to ROM media. It is a block diagram of the system which detects the position of a sticking target object using IC seal. It is a flowchart of the process which detects the position of a sticking target object using IC seal | sticker.

Explanation of symbols

1000 ... IC seal, 1100 ... IC chip, 1110 ... storage device, 1120 ... processing device, 1300 ... sheet, 2200 ... IC chip R / W, 2300 ... external terminal, 2400 ... communication line.

Claims (10)

An IC seal having an adhesive surface for adhering to another object and a printable description surface, the IC seal having an IC chip for storing data and a communication device used for the IC chip to communicate with the outside An IC seal manufacturing apparatus for manufacturing
A first cutting device for cutting a first sheet having a plurality of sets of the IC chip and the communication device for each set;
An apparatus for attaching the cut first sheet to the second sheet having the adhesive surface;
A second cutting device for cutting the second sheet to which the first sheet is attached,
The IC seal manufacturing apparatus, wherein the cut second sheet is taken out as the IC seal.   2. The IC seal manufacturing apparatus according to claim 1, further comprising an apparatus that communicates with the IC chip via the communication apparatus and prints on the description surface.   The printing device communicates with the IC chip via the communication device after the first sheet is attached to the second sheet and before it is taken out as the IC seal and on the descriptive surface. The IC seal manufacturing apparatus according to claim 2, wherein printing is performed. A first shaft for mounting a first roll around which the first sheet is wound;
A second shaft for mounting a second roll around which the second sheet is wound,
The first sheet is sent out from the first roll toward the first cutting device,
The said 2nd sheet | seat is sent out toward the apparatus which attaches a said 1st sheet | seat to a 2nd sheet | seat from the said 2nd roll, and the lower side of the said 1st sheet | seat. 4. The IC seal manufacturing apparatus according to any one of 3.   5. The IC according to claim 1, wherein the device for attaching the first sheet to the second sheet attaches the first sheet to the second sheet using heat. Seal manufacturing equipment.   The apparatus for attaching the first sheet to the second sheet is characterized in that a central portion is constricted so that a periphery of the cut first sheet is adhered to the second sheet. IC seal manufacturing apparatus in any one of 1-5. An IC seal having an adhesive surface for adhering to another object and a printable description surface, the IC seal having an IC chip for storing data and a communication device used for the IC chip to communicate with the outside An IC seal manufacturing apparatus for manufacturing
A cutting device for cutting a first sheet having a plurality of sets of the IC chip and the communication device for each set;
An apparatus for attaching the cut first sheet to a second sheet having the adhesive surface and the description surface;
A device that communicates with the IC chip via the communication device and prints on the descriptive surface after the first sheet is attached to the second sheet and before being taken out as the IC seal. An IC seal manufacturing apparatus characterized by the above. A first shaft for mounting a first roll around which the first sheet is wound;
A second shaft for mounting a second roll around which the second sheet is wound,
The first sheet is sent out from the first roll toward the cutting device,
The said 2nd sheet | seat is sent toward the apparatus which attaches the said 1st sheet | seat to a 2nd sheet | seat from the said 2nd roll, and is sent out to the lower side of the said 1st sheet | seat. The IC seal manufacturing apparatus as described.   The apparatus for manufacturing an IC seal according to claim 7 or 8, wherein the apparatus for attaching the first sheet to the second sheet attaches the first sheet to the second sheet using heat. . The apparatus for attaching the first sheet to the second sheet is characterized in that a central portion is constricted so that a periphery of the cut first sheet is adhered to the second sheet. IC seal manufacturing apparatus in any one of 7-9.

Images