JP2002236889A - Method of recovering noncontact type ic chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently recover a noncontact type IC chip installed on a commodity. SOLUTION: This recovering method of the noncontact type IC chip installed on the commodity 61, having data on the commodity recovers an IC chip 62 capable of reading the data in a noncontact method. The IC chip is separated from the commodity, and is collected and recovered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC chip collecting method for collecting an IC chip which is attached to a product and has data on the product and which can be read out by a non-contact type.

[0002]

2. Description of the Related Art In addition to product information such as product name, product price, manufacturer information, manufacturing information, and bar code,
Data other than product information such as prize loss information, an application ticket mark at the time of a campaign, an application sticker, and the like are printed. The product is a concept that includes both the product itself and the packaging container for the product.

In particular, printing data other than product information on a product or the like is subject to design space restrictions.

[0004] In addition, as in the present situation, when data other than product information such as prize loss information, an application ticket mark at the time of a campaign, and a sticker is presented by printing on a container, a winning ticket, There is a risk that troubles such as copying, counterfeiting, improper use, etc. of application tickets and application stickers may occur, and the occurrence may be overlooked.

[0005] In addition, it takes time and effort for the manufacturers and sellers who carry out product sales campaigns to process and respond to application data submitted by a large number of customers. There is also an inconvenience that information and the like are difficult to utilize successfully.

[0006] Therefore, data other than the product information such as product information, hit-out information, application ticket mark, application sticker, etc. relating to the product is attached to the packaging container using a form other than printing so that it can be presented to the customer. This minimizes the design space constraints of the container and minimizes the hassle of removing, collecting, attaching to the mount, mailing, etc. when applying for a campaign, etc. In order to avoid the occurrence of copying, counterfeiting, unauthorized use, etc. of winning tickets or application tickets, etc. To confirm the conditions of the application, determine whether it is a genuine application ticket, and further improve the efficiency of various processes such as totaling work. By secondary use permit additional campaigns and the like, the product information that is packaged by the further product itself and packaging containers, has been demanded which can provide efficient for customers and product distributors like. The side that received the above application ticket is the side that implements the sales campaign, and is the manufacturer and seller,
Alternatively, it means a processing company or the like that has received the request.

[0007]

Therefore, it has been considered to attach an IC chip capable of reading data in a non-contact manner to a product. In that case, the necessary written data can be read, the problem of space can be solved, and there are the following advantages. In other words, a large amount of product information can be stored, confidentiality can be given without knowing the content of information visually, data can be used for counting, etc., data can be machine processed, and IT technology can be used. That is, it is possible to demonstrate many functions that have been performed. However, if such an IC chip is attached, the product is discarded with the IC chip attached, which is not environmentally friendly.
In particular, when attempting to recycle a product, the IC chip must be collected in a recycling process.

For example, an IC chip provided on a packaging material is discarded together with the packaging material when the contents thereof are used up. Against the background of the recent recycling campaign, these packaging materials are sorted and discarded for each material, or a recycling center employs a method of separating different resins using a specific gravity difference of the resins. Recently, in addition to the concept of recycling, a method of dissolving an ink component or a resin component with water or alkaline water has been studied. On the other hand, since IC chips can be recycled, there is a plan to collect and reuse them. For example, in the case of the packaging material described above, the IC chips returned to the recycling center together with various materials are reused. However, I collected at such recycling centers
Since the C chip is provided for various types of packaging materials, it is very difficult to separate the IC chip itself.

There is a possibility that not only the packaging material but also the IC chip storing the wrong information may be attached to the wrong product when recycling the IC chip. Therefore, it has been desired to collect IC chips. Also, preferably, an IC
It has been desired to collect and collect chips by data content. An object of the present invention is to recover a non-contact type IC chip attached to a product and to perform the recovery efficiently.

[0010]

According to a first aspect of the present invention, there is provided an IC chip which is attached to a product and has data relating to the product and which can be read out in a non-contact manner. The method for recovering a non-contact type IC chip described above is characterized in that the IC chip is separated from the product, collected, and then collected. In this collection method, the non-contact type IC chip or the IC tag to which it is tagged is separated from the product itself or the packaging container by a method such as cutting or peeling, and after collecting a plurality of separated IC tags, the collection is performed. Is what you do. The term “separation” means that the contactless IC chip is separated from the product so that it can be recycled, even in the state of the IC tag.
It is not always necessary to separate only the non-contact type IC chip.

As a method of putting together, there is a method of sticking on a support or putting in a collection bag. According to a second aspect of the present invention, in the method for collecting a non-contact type IC chip according to the first aspect, after the IC chip is separated, the IC chip is attached to a support and collected. Examples of the support include a mount and a film. In this case, it is desirable to attach to the support with high positional accuracy, and when recovering from the support, mechanization becomes easy. It is possible to have the consumer attach it with high positional accuracy by a simple method such as clearly indicating the attachment position on the mount.

Further, the invention according to claim 3 is based on claim 2.
In the method for collecting a non-contact type IC chip described above, the support is an application paper. As the application paper, for example, a paper on which the back of a postcard is printed can be cited. By using IC chips as application tickets and attaching them to application forms and sending them out to manufacturers and other people who conduct application campaigns, consumers can separate products from products. Motivation. And it can be expected that the recovery rate will be dramatically improved. By the way, ICs that have the same information as much as possible
It was desired that tags be collected without any other information being mixed with IC tags.

The invention according to claim 4 is based on claim 1.
4. The method for collecting a non-contact type IC chip according to claim 3, wherein the IC chips having the same data on merchandise are collected and collected. When the application form is used as described above, it is also possible to specify an attachment location for each type, and IC chips having the same data on products can be collected.
For example, it is possible to collect a plurality of IC tags having the same information at one time by planning a present for a novelty product or a plan for winning a prize.

The invention according to claim 5 is the invention according to claim 1.
5. The method for collecting a non-contact IC chip according to claim 4, wherein the IC chip is attached to a product via a tag, and the IC chip is collectively collected as it is. That is, when a non-contact type IC chip is converted into an IC tag and attached to a product, the IC tag can be used as a label, a seal, a tag, a sticker, or a bottleneck. it can. The above-mentioned billing includes, for example, price billing. The price tag is a frame with an IC memory, and the price is displayed so that humans can see it in the frame. For daily price changes, only the price in the frame is overlaid with a sticker from above. It can be changed by such a method as possible, and can be dealt with at low cost.

In the case of packaging materials, there is a particularly strong demand for recycling, and it has been desired that both packaging materials and non-contact IC chips can be recycled. Therefore, an invention according to claim 6 is the noncontact IC chip collection method according to any one of claims 1 to 5, wherein the IC chip is attached to a packaging material. . It is not necessary for all information to be input to the non-contact IC chip, and product information such as a product name, a manufacturer name, a seller name, and a barcode is displayed on the product itself and the package body of the product. It may be. A label, a sticker, and the like may be provided. Examples of the packaging material include a paper container, a plastic container such as a bottle, and a soft packaging container such as a pouch.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the method for collecting a non-contact type IC chip according to the present invention will be described in detail below.

FIGS. 3A and 3B are external perspective views showing an example in which a non-contact type IC chip is provided on a label, used as a tag, and attached to a product. FIG. 3A is a paper container such as a paper box. Container or plastic container (including bottle container),
This is a container in which the IC tag 1 is attached to one surface of a rigid packaging container A such as a glass container, and (b) is a synthetic resin film, a paper sheet, a metal foil, or a pouch made of a composite material thereof. This is a container in which the IC tag 1 is attached to one surface of the flexible packaging container B.

FIG. 3C shows an IC tag 1 in which a non-contact type IC chip is attached to one surface of a sheet C such as a label or a sticker. It is attached to the packaging container body such as the flexible packaging container B. The non-contact type IC chip may be directly attached to a product.

The non-contact type IC chip is, for example, a small IC memory chip (the size is not particularly limited.
For example, one side or a diameter of 1 mm or less can be used. In addition, for example, the circuit portion and / or the antenna portion and / or the memory portion of the IC memory can be formed using conductive ink and insulating ink (or electric resistance ink). IC tag 1 directly formed on the product and the packaging container body of the product by plate-making printing method
Alternatively, an IC memory chip in which an IC memory is formed on a predetermined chip substrate by a plate-making printing method may be used. The non-contact IC chip only needs to be able to read at least by a non-contact method, and may be capable of both writing and recording (including rewriting and rewriting recording) and reading. Of course, it is also possible to use a configuration in which only information data that has been written and recorded in advance can be read, and writing and recording (including rewriting and rewriting recording) cannot be performed in a non-contact manner.

The non-contact type IC chip includes an antenna unit, a memory unit, and a conductive circuit unit connecting the antenna unit and the memory unit. The antenna unit writes and records information data in the memory unit. This is a section for generating an induced electromotive force for supplying operating power for reading the obtained information data from the memory section. Further, the antenna portion may be formed separately from the chip, and the chip and the antenna portion may be formed on a support.

The product information on the product to be packaged recorded on the non-contact type IC chip includes, for example, a product name,
Product price, manufacturer, seller, address, telephone number, or manufacturing information such as manufacturing lot, manufacturing date, manufacturing machine, manufacturing staff, or cooking recipe, calories, expiration date, notice information, prize loss or application Information such as information such as campaign information, store information, or raw material name, raw material producer name, place of origin, or container body material, segregated collection, life cycle inventory information, assessment information, number of recycling, etc. are recorded. It is not limited to data. The data may be written at the time of manufacturing the non-contact IC chip, or may be written thereafter. The writing method may be a contact type or a non-contact type.

Also, as information other than the product information on the product to be packaged, such as the campaign information of the product recorded on the non-contact type IC chip, prize loss information (information on loss ticket), campaign application information (application ticket) And information on the application seal ticket), but are not limited to these. In addition, when used for application, not only when a specific name such as “application ticket” is visually entered, but also when a specific mark, character, symbol, etc. is attached,
In other words, the part that can be visually identified is, of course, the “entry ticket”. Furthermore, the identification number (manufacturer number, product standard, etc.)
Is provided, it is also possible to facilitate later separation.
For example, if a method of identifying the last two digits of the number or a method using a bar code is used, the secrecy of data of the non-contact type IC chip can be secured to some extent. In particular, it is effective when the same type of non-contact type IC chip is attached to different kinds of products.

Also, by bringing together non-contact type IC chips instead of an application type, and bringing them to a store at the same time,
A method of refund of cash is also conceivable. In the non-contact type IC chip, product information on a packaging target product and campaign information of the product in addition to the product information are recorded as information data, but only the product information on the packaging target product is recorded. Alternatively, only information other than the product information on the product to be packaged, such as product campaign information, may be recorded.

The non-contact type IC chip may be attached as it is, but it is preferable to attach it to a support and make it into an IC tag, since it is easy to attach. For this reason, the following description will be made as an IC tag in the present specification, but an IC chip may be directly attached instead of a tag. There are various places where the IC tag can be attached, but when it is attached to the product itself, it is typically attached to the outer surface of the product packaging container, but the inner side of the product packaging container, or In some cases, it is installed in the layers of the structure of the packaging container of the product or between the layers of the structure.

For example, it is attached and fixed to the surface or inner surface of the packaging container, or in the material layer of the product itself and the structure constituting the product container, or when the structure is a laminated material, between layers of the laminated material. You.

In the case of sheets such as labels and seals (a heat-sensitive adhesive layer or a pressure-sensitive adhesive layer (adhesive material layer may be laminated on the back surface)), the front surface or the back surface or the sheet thereof When the sheet is a laminated material, it is attached and fixed between layers of the laminated material.

If the material used for the packaging container or sheet is a light-shielding material, the IC tag 1 can be attached to the inner surface of the packaging container, the back surface of the sheet, or within the material layer or between the laminated material layers. It can be hidden visually. Further, when it is attached to the surface of a packaging container or sheets, it can be visually concealed by appropriately coating a light-shielding paint or attaching a light-shielding sheet.

By attaching the IC tag to the inner surface of the structure of the container body, the layer of the structure, or the laminated portion of the structure, it is possible to eliminate the restriction on the design space in printing information on the container and the restriction on the mounting space. The IC tag can be attached without receiving. It is an advantage of the non-contact method that various methods are allowed for the mounting method.

A writing / reading means (reader / writer) capable of writing and recording to and reading from an IC tag connected to an information terminal (such as a personal computer) is provided by means of product information or other information than product information transmitted from the antenna section of the means. A write signal or a read signal by induced electromotive force is generated in an antenna portion of a non-contact type IC chip that faces at a predetermined interval in response to a write signal or a read signal by a radio wave of a predetermined frequency based on information data.

The product information and information other than the product information are written and recorded as data in the memory portion of the IC tag.
Alternatively, the merchandise information and information other than the merchandise information recorded in the memory unit are read as data by the writing / reading unit.

The non-contact type IC chip may be capable of both writing and recording (including rewriting and rewriting recording) and reading by a writing / reading means (reader / writer). In order to prevent falsification and unauthorized use of the information, it is appropriate that only the information data that has been written and recorded in advance can be read by the writing / reading means (reader / writer). Non-contact IC in advance by the manufacturer (or seller) of the target product
It is written and recorded on the chip.

The information can be written on the non-contact type IC chip directly on the non-contact type IC chip or the IC tag.
Writing can be performed by linking the information printed on the container body with the C tag attached, but the IC tag is attached to the inner surface of the container with light shielding properties, in the container structure layer or between the layers, and visually. By concealing the IC tag and the information recorded on the IC tag, unauthorized use such as copying or forgery can be prevented, and security can be given to the information.

The information written and recorded on the product and the IC tag attached to the container wrapping the product can be read as data in a non-contact manner by reading means of a dedicated terminal. Can be registered, tallyed, or accumulated for quick data processing.

Next, an embodiment of the collecting method using the IC tag will be described in detail below. FIG. 1 is an explanatory diagram showing a flow from separation of a product to recycling. An IC tag 62 is attached to a product 61, and an IC tag 64 is attached to a product 63. I
The C tag 62 is separated from the product 61, and the IC tag 64 is separated from the product 63. The IC tags 62 are put together in a bag 66 according to an arrow 65 and sent to a recycling center 67. The IC tags 64 are put together in a bag 69 according to the arrow 68 and sent to the recycling center 67 in the same manner.

In this case, since the data is collected separately by the IC tag 62 and the IC tag 64, it is not necessary to sort after the collection. In the recycling center 67, cleaning is performed so that the product can be reused, and in some cases, data is rewritten, and the product is placed in a product factory. The IC tag 64 is applied to the product 70 and the IC tag 62 is applied to the product 71 again. It is attached.

FIG. 2 shows another embodiment, in which an IC tag 82 attached to a product 81 is a non-contact type I tag.
The C chip is attached to the seal, and in this example, a prize is won by collecting 20 pieces. The consumer puts 20 IC tags on the application postcard 83 and mails it to the campaign maker 84. The campaign maker removes the IC tag and recycles the IC tag. When applying to an application postcard, it is possible to set the application conditions so that the same type of IC tag can be attached, and by allowing the application tag to be attached within the frame, the position as shown You can have it sent in a state of being stuck together. Therefore, it becomes possible for the campaign execution maker to mechanize and remove it.

As described above, the non-contact type IC chip is attached to a bell mark, a maker's mark (trademark, etc.) with high accuracy, and is made into an IC tag. By having IC tags affixed to application stickers etc. with high positional accuracy and motivating consumers to have these IC tags sent to the manufacturer by some method, a large number of identical information can be It is possible to accumulate IC tags having the same information, and the problem of attaching IC tags with incorrect information to other products is reduced.

FIG. 4 is a system block diagram for explaining an embodiment of the recovery method of the present invention.
A product manufacturer that manufactures a product packaged with a packaging material with a tag, 12 manufactures the IC tag (or a sheet with a non-contact IC chip such as a label or a seal, and a packaging container to which the sheet is attached). Manufacturer of packaging containers for processing (container processing company; converter), 13 stores (sellers) that sell (or campaign, apply, etc.) the target products,
14 is a product packaged with a packaging material with an IC tag, 15
Is a customer who purchases a product, and 16 is a writing / reading means (or reading means) connected to a terminal device such as a register in a sales store. In the figure, the dotted arrow connecting the packaging container manufacturer 12, the product manufacturer 11, and the store 13 (seller) indicates the distribution of the product, the packaging container of the product, and the packaged product with the IC tag packaged in the container. Show.

In FIG. 4, reference numeral 20 stores and supplies information recorded in the IC memory of the IC tag 1 transmitted from the writing / reading means 16 (or reading means) of the dedicated terminal of the store (seller). Or a database for storing and supplying information to be recorded in an IC memory, information for output and display on a screen of a dedicated terminal of a store (seller), information for data processing of the information, and the like. An IC memory database 21 for storing the product information and various information other than the product information for recording in the IC memory of the IC tag 1, attribute information of the main body of each IC memory 1 (tag information as a memory tag), and the like; A database 22 for storing and supplying customer information such as application information, and a personal information database 23 for storing and supplying personal information extracted from information on customers. It consists of.

In FIG. 4, reference numeral 30 denotes information stored in the IC memory transmitted from the writing / reading means 16 (or reading means) of the terminal dedicated to the store (seller) in the database 20, Database 20
The information stored in (21, 22, 23) is output and displayed on the screen of a terminal dedicated to a store (seller), or written and recorded in the product itself and the IC memory attached to the packaging container. 41 is a support (service) company that cooperates with the product manufacturer.

In FIG. 4, reference numeral 50 denotes a network line such as an internet, which connects the product maker 11, the packaging container maker 12, and the write / read means 16 of the store 13 (seller). A dedicated terminal device to be controlled, an information general data server 30, and a support (service) agent 41 are connected to a network. The writing and recording of information into the IC memory (or IC memory chip) of the IC tag may be performed before or after the IC memory is attached to the packaging container body and the product. To manufacture, or to manufacture the product manufacturer 11 that packages the manufactured product, or the packaging container body or the product,
Any of the manufacturers 12 (converters) of packaging containers or the like that attach the IC tag 1 (or IC memory chip) to the manufactured packaging container body or the like can perform the writing using a writing unit (not shown). The information to be written is stored in the IC memory of the database 20 via the information management data server 30 which is network-connected to the writing means (not shown) installed in the product manufacturer 11 or the packaging container manufacturer 12. The product information to be recorded and various information other than the product information can be taken in from the IC memory database 21 for storing and supplying. The writing and recording of information on the non-contact type IC chip may be performed before or after the IC tag 1 is attached to the product and the packaging container body of the product. In addition, the work of writing and recording is performed by manufacturing the product, manufacturing the product manufacturer 11 that packages the manufactured product, manufacturing the packaging container body, or manufacturing the packaging container body.
Any one of the packaging container manufacturers 12 (converters) to which the C tag 1 is attached can be performed by using writing means (not shown).

A connection (connection authentication) between a terminal installed in a store (seller) or the like connected to the reading means 16 for reading information recorded on the IC tag 1 and the information general data server 30 (and the database 20). ) May be used as identification information such as an ID code.
The product information or information other than the product information (or partial information thereof) recorded in the memory may be used as individual tag information of the IC memory and used as identification information for connection (connection authentication). Further, as a form in which a non-contact type IC chip is specifically used, there are the following forms.
First, the merchandise provider 13 (store, seller) can at least read out the information data by using the IC tag of the present invention directly on the merchandise 14 or in a non-contact manner attached to the packaging container body of the merchandise. From the non-contact IC chip 1 to the IC
A readout unit 16 that connects to a terminal 20 that is connected to a network with an information management data server 30 that receives and supplies the information to and from a database 20 that stores information such as memory tag information, customer information, and customer personal information. The product information is read out using the
It provides campaign information, company information, store information, and the like.

Second, the merchandise provider 13 (store, seller) inserts the IC tag of the present invention into the packaging container body of the merchandise 14,
Alternatively, an IC memory, which is attached to the product itself and can at least read information data in a non-contact manner,
Readout means 16 for connecting to a terminal connected to a network with an information management data server 30 which accepts and supplies information to and from a database 20 which stores information such as C memory tag information, customer information, and customer personal information. Is used to read out information such as campaign winning information, and to provide the customer 15 with such information as the winning information.

Third, the merchandise provider 13 (store, seller) can at least read out information data by the non-contact method in which the IC tag of the present invention is attached to the merchandise 14 or the package body of the merchandise. From a simple IC memory to a database 20 storing information such as IC memory tag information, customer information, and customer personal information, to a terminal connected to a network with an information general data server 30 that receives and supplies the information. The service information such as campaign application information is read out using the reading means 16 to be connected, the service information is provided to the customer 14, and the personal information of the customer 15 is transmitted to the information management data server 30 using the terminal. To record in the database 20 and register corresponding to service information such as campaign application, store information, product information, etc. It is intended.

Next, as a specific example of the information providing method (system), as shown in FIG. 4, an operation control section for reading information recorded in the IC tag 1 near the register of the store 13 is shown. Dedicated terminals (eg personal computers)
And writing / reading means 16 connected thereto, and scanning the IC tag 1 attached to the product or the packaging container wrapping the product, so that the product information of the product recorded in the IC memory and / or Information other than the product information (such as campaign information of the product) is transferred to the information management data server 30 that is connected to the dedicated terminal via a network.

The customer can read the prize of the product or the hit / miss information in the application from the information integrated data server 30 and output and display it on the screen of the dedicated terminal device to check the information. It has an IC memory database 21 for storing memory tag information of IC memory, product information, and the like, and is connected to the dedicated terminal (reading terminal) of the store via a network such as a communication line. The server can be installed at a low cost without the need for each server.

The information directly written in the IC memory of the IC tag 1 is provided with a unique server having a database for storing the write information connected to the dedicated terminal (reading terminal) of the store 13, For example, a database and a unique server may be provided in the dedicated terminal (reading terminal) body of the store 13 and read and stored in the database. Alternatively, the data server 20 (21, 22,.
The data may be read out, stored, and obtained using a communication line such as the Internet in 23).

Next, as another specific example of the information providing method (system), as shown in FIG. 4, an IC memory (IC memory) in which necessary information is written instead of printing an application ticket and an application sticker is shown. Reading means 1 for connecting a product (packaged product) to which a tag (tag) is attached to a dedicated terminal as described above.
By reading in 6, registration, accumulation, and application of the campaign become possible. In addition, the processing time for receiving an application can be reduced.

An application is made by scanning the IC tag 1 attached to the product with a dedicated terminal and inputting customer data, and the data is transmitted to a personal information database 2 connected by a communication circuit such as the Internet.
3. An application is sent to a data server 30 having a database 20 such as an IC memory tag database 21 in which product information is stored.

The same processing is performed for the cumulative application, and when the required cumulative number is reached, the application is made. Customers, sellers, and the like can confirm the information on a screen that is an external output device connected to the terminal device.

The consumer data is made by initial input or by a card (name, address, telephone number, age, etc.) that can be confirmed by an individual. The information is sent to the product manufacturer 11 (sent via the network line) and processed, or sent to another affiliated service provider (organization) (sent via the network line) for processing. Is done.

As a result, automation of a customer's campaign application can be achieved, and customer information and the like that can be obtained through application can be utilized.

In addition, instead of printing the application ticket and the application sticker, by reading the data in the IC memory in which the necessary information is written and applying, the copy of the winning print, the forgery of the application ticket, etc., and the unauthorized use of the application sticker are made. And unauthorized acquisition can be prevented. Further, an information medium with a non-contact IC memory in which information about the product and campaign information other than the product information are written and recorded as electronic data is attached to the product itself and a package container body or the like in which the product is wrapped. By reading the information recorded from the IC memory, data registration and totalization of customer application information in a merchandise sales campaign and the like can be automated, and effective use of customer information obtained through application can be achieved.

Further, the writing of the IC tag 1 to the IC memory is restricted (for example, only once), or the inner surface of the material, the inner layer of the material, or the laminated material constituting the main body of the product or the packaging container (including the wrapping paper) of the IC tag 1 Unauthorized use or unauthorized acquisition can be prevented, for example, by mounting between layers, or by memory destruction due to unauthorized removal of the IC memory.

[0055]

According to the first aspect of the present invention, an IC chip is separated from a product and collected after being collected.
Chips can be collected efficiently, and products and I
Both recycling of C chips can be performed. According to the second aspect of the present invention, after the IC chip is separated, the IC chip is attached to the support and collected, so that the collection of the IC chip can be mechanized after the collection, and more efficient collection can be performed. it can.

According to the third aspect of the present invention, since the support is an application form, it is motivated by the consumer to send,
The chip recovery rate can be increased. According to the fourth aspect of the present invention, the IC having the same data on the product
Since the chips are collected and collected, collective processing can be performed after the collection, and the collection efficiency of the IC chips can be increased.

According to the fifth aspect of the present invention, since the IC chip is attached to the product via the tag and is collectively collected as the tag, the IC chip is not damaged at the time of collection. According to the sixth aspect of the present invention, since the IC chip is attached to the packaging material, when the IC chip is separated, the packaging material and the IC chip can be separately collected, and the collection that contributes to the environment is performed. be able to.

[0058]

[Brief description of the drawings]

FIG. 1 is an explanatory view of a recovery method of the present invention.

FIG. 2 is an explanatory view of a recovery method of the present invention.

3A and 3B are explanatory diagrams of an IC tag of the present invention,
(C) is an explanatory view of sheets (labels, stickers, etc.) with a non-contact IC memory used for the IC tag of the present invention.

FIG. 4 is a system block diagram showing usage of a non-contact type IC chip.

[Explanation of symbols]

A: Rigid packaging container B: Flexible packaging container C: Sheets 1 ... IC tag 11 ... Product manufacturer 12 ... Packaging container manufacturer 13 ... Store 14 ... IC tag 15 ... Customer 16 ... Terminal device 20 ... Database 21 ... IC memory Tag information database 22 ... Customer information database 23 ... Personal information database 30 ... Information control data server 41 ... Affiliated service provider (other organization) 50 ... Network 61 ... Product A 62 ... IC tag A 63 ... Product B 64
... IC tags B 66, 69 ... bags 67 ... recycling center 70 ... products A1 71 ... products B1 81 ... products A2 82 ... IC tags 8
3. Application postcard 84: Campaign maker

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2C005 MA28 NA09 QC04 SA13 TA22 5B035 BB09 BC00 CA23 5B058 CA17 KA40

Claims (6)

[Claims] In a non-contact type IC chip collecting method for collecting an IC chip which is attached to a product and has data relating to the product and which can be read out by a non-contact method, the IC chip is separated from the product. A method for collecting a non-contact type IC chip, wherein the non-contact type IC chip is collected after being collected. 2. The method for collecting non-contact type IC chips according to claim 1, wherein after the IC chips are separated, they are mounted on a support and collected. 3. The method according to claim 2, wherein said support is an application paper. 4. The method according to claim 1, wherein the IC chips having the same data on the products are collected and collected.
4. The method for collecting a non-contact type IC chip according to claim 1. 5. The non-contact method according to claim 1, wherein the IC chip is attached to a product via a tag, and the IC chip is collectively collected as it is. IC chip recovery method. 6. The method according to claim 1, wherein the IC chip is mounted on a packaging material.