JP2005236230A - Component mounting apparatus and method of driving the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting apparatus capable of easily changing the coating quantity and the coating pattern of the bonding material for the mounting. <P>SOLUTION: The component mounting apparatus is furnished with a vertically movable head 210 for mounting a component, a vertically movable dispenser 220 which is connected to a cylinder 230 and applies the bonding material to a substrate, and the cylinder 230 for pushing the dispenser 220 downward. The head 210 has a first stopper 211, while the dispenser 220 has a second stopper 221 which touches the first stopper by pushing the dispenser 220 with a prescribed force by the cylinder 230. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a component mounting apparatus, and more particularly to a component mounting apparatus for mounting an electronic component on a substrate.

  Conventionally, in a component mounting apparatus such as a die bonder or a flip chip bonder for mounting an electronic component on a substrate such as a printed circuit board, an adhesive or a solder paste for fixing the electronic component is mounted before mounting the electronic component. A bonding material is applied on a substrate. This application is performed by applying a bonding material of a vertically movable dispenser connected to a cylinder to a substrate that has been transferred to a work position by a transfer unit by a mounting head unit (for example, Patent Document 1). reference).

FIG. 5 is a front view of the mounting head unit for explaining the operation of the mounting head unit in the component mounting by the conventional component mounting apparatus.
The bonding material is applied onto the substrate by setting the dispenser 510 to a predetermined origin height (FIG. 5A), pressing the dispenser 510 downward by the cylinder 500, and the tip of the nozzle 511 against the upper surface of the substrate 520. The dispenser 510 is lowered until a predetermined height is reached, and the bonding material 530 is discharged from the nozzle 511 (FIG. 5B). Is raised to the origin height of (Fig. 5 (c)).

Here, for example, as shown in the front view of the conventional mounting head in FIG. 6, the predetermined height is such that the first stopper portion 600 is provided in the dispenser 510 and the movement of the dispenser 510 is irrelevant. A frame 620 having a second stopper portion 610 that is fixed and pressed against the first stopper portion 600 by being pressed downward by the cylinder 500 is provided, and is set by manually adjusting the height of the second stopper portion 610. Is done.
Japanese Patent Laid-Open No. 62-179795

  By the way, since the ease of application differs depending on the types of the bonding material, the substrate, and the electronic component, it is necessary to change the coating amount according to the types of the bonding material, the substrate, and the electronic component. In recent years, a complicated coating pattern has been required in consideration of adhesion between a substrate and an electronic component. Therefore, generally, the thickness of the drawing is adjusted by adjusting the height of the nozzle tip with respect to the upper surface of the substrate to meet these requirements.

  However, in the conventional component mounting apparatus, the height of the nozzle tip is set manually by the operator, so that the height cannot be easily changed, and the coating amount and coating pattern can be easily changed. There is a problem that you can not. At this time, by providing a dedicated drive source in the dispenser and controlling it, the above problem can be dealt with, but a new problem of increased cost occurs.

Therefore, in view of such problems, the present invention has a first object to provide a component mounting apparatus that can easily change an application amount and an application pattern.
A second object is to provide a low-cost component mounting apparatus.

  In order to achieve the above object, a component mounting apparatus of the present invention includes a vertically movable head used for component mounting, a pressing means, and a vertically movable dispenser that is connected to the pressing means and applies a bonding material to a substrate. And the head has a first stopper portion, and the dispenser comes into contact with the first stopper portion by pressing with a downward force by the pressing means. It has the part. Here, the dispenser and the head are arranged side by side, the first stopper portion is a convex portion protruding toward the dispenser, and the second stopper portion protrudes toward the head. The downward force may not disturb the vertical movement of the head, and the first stopper portion and the second stopper portion are not in contact with each other. It may be power.

  As a result, the height of the dispenser relative to the upper surface of the substrate can be adjusted by the head, so that the height of the dispenser relative to the upper surface of the substrate can be adjusted by mechanical control without providing a dedicated drive source. It is possible to realize a low-cost component mounting apparatus that can easily change the above.

  Here, the pressing means may press the dispenser when the bonding material is applied by the dispenser, and the pressing means does not press the dispenser when the bonding material is not applied. May be.

  Thus, when applying the bonding material to the substrate, the thickness of the drawing can be adjusted when applying the bonding material by moving the dispenser up and down by moving the head up and down. The component mounting apparatus which can draw is realizable. Furthermore, since the dispenser can be raised at a high speed after raising the dispenser at the low speed when finishing the application of the bonding material, the stringing phenomenon that occurs when the nozzle leaves the adhesive supply point is avoided. It is possible to realize a component mounting apparatus that can easily cut the adhesive from the nozzle.

The component mounting apparatus may further include a recognition unit that recognizes that the first stopper portion and the second stopper portion are in contact with each other.
Accordingly, the first stopper portion and the second stopper portion can be reliably brought into contact with each other, so that the height of the dispenser relative to the upper surface of the substrate can be adjusted with the same height accuracy as the head height accuracy. A component mounting apparatus can be realized.

  The present invention also includes a vertically movable head having a first stopper portion and used for component mounting, and a vertically movable dispenser having a second stopper portion and applying a bonding material to the substrate. A method for driving a component mounting apparatus, comprising: a coating step of performing the coating with the dispenser while maintaining a state in which the first stopper portion and the second stopper portion are in contact with each other. It can also be set as the drive method of a mounting apparatus. Here, in the application in the application step, the head may be moved up and down, and the driving method of the component mounting apparatus further ends the application, and the second stopper portion and the first An application end step for bringing the stopper portion into a non-contact state may be included. The driving method of the component mounting apparatus may further include the first stopper portion after moving the head to a position where the application is performed. And a coating preparation step of bringing the second stopper portion into contact with each other.

  As a result, the height of the dispenser relative to the upper surface of the substrate can be adjusted by the head, so that the height of the dispenser relative to the upper surface of the substrate can be adjusted by mechanical control without providing a dedicated drive source. It is possible to realize a method for driving a component mounting apparatus that can easily be changed.

According to the component mounting apparatus according to the present invention, a low-cost component mounting apparatus capable of easily changing the coating pattern can be realized. In addition, it is possible to realize a component mounting apparatus that can draw a complicated coating pattern on a substrate. Furthermore, a component mounting apparatus that can easily cut the bonding material from the nozzle can be realized.
Therefore, according to the present invention, it is possible to provide a low-cost component mounting apparatus capable of easily changing the coating pattern, and its practical value is extremely high.

Hereinafter, a component mounting apparatus according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is an external view of a flip chip bonder according to the present embodiment.
The flip chip bonder of the present embodiment is intended to realize a flip chip bonder in which the coating amount and the coating pattern can be easily changed. After the electronic component is taken out, the electronic component is mounted. The reversing head unit 110 that is inverted upside down and held so as to be in a possible orientation, the electronic component held by the reversing head unit 110, and the mounting head unit 120 that mounts the electronic component on the substrate are adsorbed. A recognition unit 130 that is an imaging device that recognizes the state of the electronic component and the state of the substrate on which the electronic component is mounted, a stage unit 140 that holds and positions the substrate, and a substrate transport unit 150 that transports the substrate to the stage unit 140. With.

FIG. 2 is an external view of the mounting head unit 120.
The mounting head unit 120 adsorbs an electronic component and places the electronic component on the substrate 210. The dispenser 220 is disposed alongside the head 210 and applies an adhesive to the substrate. The dispenser 220 is pressed downward. And a cylinder 230.
Here, the head 210 is controlled by a drive unit (not shown) with a height accuracy of, for example, 0.25 to 0.5 μm, and moves up and down, and is a first stopper portion that is a convex portion protruding toward the dispenser 220. 211. The dispenser 220 is connected to the cylinder 230 so as to be movable up and down, and has a second stopper portion 221 that is a convex portion protruding toward the head 210 and a nozzle 222 from which an adhesive is discharged. Note that at least one of the first stopper portion 211 and the second stopper portion 221 may include a sensor or the like that senses that the first stopper portion 211 and the second stopper portion 221 are in contact with each other.

An operation in component mounting of the mounting head unit 120 having the above configuration will be described with reference to a front view of the mounting head unit 120 shown in FIG. 3, the same elements as those in FIG. 2 are denoted by the same reference numerals, and detailed description thereof will be omitted here.
First, as shown in FIG. 3A, the dispenser 220 and the head 210 are set to a predetermined origin height, for example, the height of the lower end of the head 210 with respect to the upper surface of the substrate 300 is 80 mm.

  Next, as shown in FIG. 3B, the head 210 is moved downward by the drive unit until the height of the lower end of the head 210 with respect to the upper surface of the substrate 300 becomes 20 mm, for example.

  Next, as shown in FIG. 3C, the dispenser 220 is pressed downward by the cylinder 230, and the second stopper portion 221 of the dispenser 220 is pressed against the first stopper portion 211 of the head 210. Thereby, the dispenser 220 can follow the movement of the head 210. At this time, the cylinder 230 presses the dispenser 220 with a force within a range that does not disturb the gain adjustment of the drive unit and does not separate the first stopper unit 211 and the second stopper unit 221. Then, the adhesive 310 is discharged from the nozzle 222, and the application of the adhesive 310 to the substrate 300 is started.

  Next, as shown in FIG. 3D, the head 210 is moved up and down within a range of, for example, 1 mm by the drive unit, and the adhesive 310 is applied while causing the dispenser 220 to perform a desired movement. The application of the agent 310 is terminated.

  Next, as shown in FIG.3 (e), the press of the dispenser 220 by the cylinder 230 is stopped, and the dispenser 220 is made the origin height. In order to recognize the electronic component 320, the head 210 is moved by the drive unit to a predetermined height, for example, until the height of the lower end of the head 210 with respect to the upper surface of the substrate 300 is 40 mm, 320 is adsorbed.

Next, as illustrated in FIG. 3F, the head 210 is moved downward by the driving unit, and the electronic component 320 adsorbed by the head 210 is placed on the upper surface of the substrate 300.
The mounting head unit 120 may perform the operations shown in FIGS. 4A and 4B instead of the operations shown in FIGS. 3B and 3C when mounting the components.
That is, after the dispenser 220 is pressed downward by the cylinder 230 and the second stopper portion 221 is pressed against the first stopper portion 211 (FIG. 4A), the head 210 is lowered to a predetermined height by the driving portion. The dispenser 220 may be moved downward to start application of the adhesive 310 to the substrate 300 (FIG. 4B).

  As described above, according to the flip chip bonder of the present embodiment, in the dispenser 220 of the mounting head unit 120, the height adjustment of the tip of the nozzle 222 with respect to the upper surface of the substrate 300 is driven to move the head 210 of the mounting head unit 120 up and down. Done by the department. Therefore, since the height of the nozzle tip with respect to the upper surface of the substrate can be adjusted by machine control without providing a dedicated drive source, the flip chip bonder of this embodiment can easily change the application amount and the application pattern. Therefore, it is possible to realize a low-cost flip chip bonder.

  Further, according to the flip chip bonder of the present embodiment, when the adhesive 310 is applied to the substrate 300 by the dispenser 220 of the mounting head 120, the nozzle 222 of the dispenser 220 can be moved up and down as desired. Therefore, since the thickness of the drawing can be adjusted when the adhesive is applied, the flip chip bonder of this embodiment can realize a flip chip bonder that can draw a complicated application pattern on the substrate. . Further, when the application of the adhesive 310 is finished, the nozzle can be raised at a low speed at first, and then the nozzle can be raised at a high speed. Therefore, a stringing phenomenon that occurs when the nozzle leaves the adhesive supply point. Therefore, it is possible to realize a flip chip bonder that can easily cut the adhesive from the nozzle.

  In addition, the flip chip bonder according to the present embodiment includes a sensor that senses that the first stopper portion 211 and the second stopper portion 221 are in contact with each other. Therefore, since the first stopper portion and the second stopper portion can be reliably brought into contact with each other, it is possible to adjust the height of the nozzle tip with respect to the substrate upper surface with the same height accuracy as the head height accuracy. A flip chip bonder can be realized.

  In the flip chip bonder of the present embodiment, the height adjustment of the tip of the nozzle 222 in the dispenser 220 of the mounting head unit 120 with respect to the upper surface of the substrate 300 is performed by a drive unit that moves the head 210 of the mounting head unit 120 up and down. did. However, the mounting head unit may further include a temporary pressure head, and the height adjustment of the nozzle tip with respect to the upper surface of the substrate may be performed by a drive unit that moves the temporary pressure head up and down.

  The present invention can be used for a component mounting apparatus, and in particular, can be used for a flip chip bonder or the like.

1 is an external view of a flip chip bonder according to an embodiment of the present invention. It is an external view of the mounting head part 120 of the flip chip bonder of the embodiment. It is a front view of the mounting head part 120 for demonstrating operation | movement of the mounting head part 120 in the component mounting by the flip chip bonder of the embodiment. It is a front view of the mounting head part 120 for demonstrating the modification of the operation | movement of the mounting head part 120 in the component mounting by the flip chip bonder of the embodiment. It is a front view of the mounting head part for demonstrating operation | movement of the mounting head part in the component mounting by the conventional component mounting apparatus. It is a front view of the mounting head part for demonstrating height adjustment with respect to the board | substrate upper surface of the nozzle tip in the component mounting by the conventional component mounting apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 110 Reverse head part 120 Mounting head part 130 Recognition part 140 Stage part 150 Board | substrate conveyance part 210 Head 211,610 First stopper part 220,510 Dispenser 221,600 Second stopper part 222,511 Nozzle 230,500 Cylinder 300, 520 Substrate 310 Adhesive 320 Electronic component 530 Bonding material 620 Frame

Claims (10)

A vertically movable head used for component mounting;
Pressing means;
A dispenser that is connected to the pressing means and is movable up and down to apply a bonding material to the substrate;
The head has a first stopper portion,
The dispenser has a second stopper portion that comes into contact with the first stopper portion when pressed by a downward force by the pressing means. The dispenser and the head are arranged side by side,
The first stopper portion is a convex portion protruding toward the dispenser,
The component mounting apparatus according to claim 1, wherein the second stopper portion is a convex portion protruding toward the head. The component mounting apparatus according to claim 1, wherein the pressing unit presses the dispenser when the bonding material is applied by the dispenser. The component mounting apparatus according to claim 3, wherein the pressing unit does not press the dispenser when the bonding material is not applied. The downward force is a force that does not disturb the vertical movement of the head and does not bring the first stopper portion and the second stopper portion into a non-contact state. The component mounting apparatus of any one of 1-4. The component mounting apparatus further includes:
The component mounting apparatus according to claim 1, further comprising a recognition unit that recognizes that the first stopper portion and the second stopper portion are in contact with each other. A driving method of a component mounting apparatus having a first stopper portion and a vertically movable head used for component mounting, and a second stopper portion and a vertically movable dispenser for applying a bonding material to a substrate Because
A driving method for a component mounting apparatus, comprising: a coating step of performing the coating with the dispenser while maintaining a state in which the first stopper portion and the second stopper portion are in contact with each other. The method for driving a component mounting apparatus according to claim 7, wherein the head is moved up and down in the application in the application step. The component mounting apparatus driving method further includes:
The driving of the component mounting apparatus according to claim 7, further comprising an application end step of ending the application and bringing the second stopper portion and the first stopper portion into a non-contact state. Method. The component mounting apparatus driving method further includes:
10. The coating preparation step of bringing the first stopper portion and the second stopper portion into contact with each other after moving the head to a position where the coating is performed. A method for driving a component mounting apparatus according to any one of the preceding claims.

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