JP2005233738A - Probing apparatus for circuit board inspection, and circuit board inspecting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probing apparatus for circuit board inspections, capable of executing high-speed probing processes for various kinds of circuit boards, without making the circuit boards flawed or causing an inspecting probe to be damaged. <P>SOLUTION: The apparatus is equipped with a contact probe 3, which is brought into contact with a circuit board being an object to be inspected; a probe-moving mechanism 2 moving the contact probe 3 in a direction, in which the contact probe 3 is moved close to and apart from the circuit board; and a control section which controls the probe-moving mechanism 2 to move the contact probe 3. The probe-moving mechanism 2 includes an ultrasonic motor 11 as a source of power which makes the contact probe 3 move. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a circuit board inspection probing apparatus and a circuit board inspection apparatus provided with a probe moving mechanism for moving an inspection probe in a direction in which the inspection probe moves toward and away from a circuit board to be inspected.

As this type of circuit board inspection apparatus, Japanese Patent Application Laid-Open No. 2003-294800 discloses a circuit board inspection apparatus that inspects the quality of a wiring pattern by bringing an inspection probe into contact with the wiring pattern formed on the circuit board to be inspected. Has been. This circuit board inspection device can move up and down with respect to the lower bracket via a guide device and a plurality of lower probes implanted in the inspection head of the lower probe unit (moves in a direction to contact and separate from the circuit board) (Possibly) with an attached upper probe. In this case, in this circuit board inspection device, the cam attached to the drive shaft of the servo motor is rotated by the servo motor, and the operating portion provided on the slider of the guide device moves up and down with respect to the lower bracket together with the cam follower. As a result, the upper probe is moved in a direction in which the upper probe comes into contact with or separates from the circuit board. Therefore, for example, high-speed probing is possible as compared with a configuration in which the upper probe is moved up and down by a ball screw feed mechanism, for example. In addition, since the movement amount of the upper probe is uniquely determined by the cam feel (cam height), for example, unlike the configuration in which the upper probe is moved up and down by a belt feeding mechanism, the movement amount due to the extension of the timing belt. It is possible to accurately move the upper probe to a desired position without causing variations in the above.
JP 2003-294800 A

  However, the conventional circuit board inspection apparatus has the following problems. That is, in the conventional circuit board inspection apparatus, the upper probe is moved up and down with respect to the lower bracket by rotating the cam by a servo motor. In this case, the circuit board to be inspected has variations in the mounting height and board thickness of the mounted components. However, in the conventional circuit board inspection apparatus, as described above, since the movement amount of the upper probe is uniquely determined by the cam feel of the cam rotated by the servo motor, the upper probe is located at the same position every time probing is performed. Moved to. Therefore, for example, when the probing is performed on the circuit boards having different thicknesses, the contact pressure of the upper probe varies. For this reason, in the conventional circuit board inspection apparatus, for example, when probing a circuit board having a thick board thickness, the upper probe is strongly pressed against the circuit board, causing damage to the circuit board and damage to the upper probe, and When probing a circuit board having a thin board thickness, there is a problem that it is difficult to perform an accurate electrical inspection because the contact pressure of the upper probe with respect to the circuit board is less than the reference contact pressure.

  In this case, the amount of movement of the upper probe relative to the lower bracket can be restricted by rotating the cam within a predetermined angular range so that the cam follower does not reach the cam top dead center. However, in the conventional circuit board inspection apparatus in which the cam is rotated (rotated) by the servo motor, it takes a certain amount of time until the rotation of the drive shaft in the servo motor is stopped after the supply of driving power is stopped. It becomes difficult to stop the cam at a desired rotation angle. For this reason, in the conventional circuit board inspection apparatus, in the configuration in which the rotation angle of the cam is regulated within a predetermined angle range and the movement amount of the upper probe is regulated, the upper probe moves beyond the position to be stopped, There is a problem that the circuit board is easily damaged and the upper probe is easily damaged. In order to avoid damage to the circuit board and damage to the upper probe, when the upper probe is configured to be easily deformable with a small force, the upper probe is brought into contact with the circuit board at a desired contact pressure. It is necessary to move and deform the upper probe sufficiently. For this reason, in such a configuration, high-speed probing becomes difficult.

  The present invention has been made in view of such problems, and it is possible to perform probing for circuit board inspection capable of performing high-speed probing on various circuit boards without causing damage to the circuit board or damaging the inspection probe. The main object is to provide an apparatus and a circuit board inspection apparatus.

  The circuit board inspection probing device according to claim 1, in order to achieve the above object, moves the inspection probe brought into contact with the circuit board to be inspected, and the inspection probe in a direction to contact with or separate from the circuit board. A probe moving mechanism for controlling the probe moving mechanism to move the inspection probe, and the probe moving mechanism includes an ultrasonic motor as a power source for moving the inspection probe. It is configured.

  The circuit board inspection probing device according to claim 2 is the circuit board inspection probing device according to claim 1, wherein the amount of deformation of the inspection probe that is elastically deformed when contacting the circuit board is optically determined. Deformation amount detecting means for detecting is provided, and the control unit causes the probe moving mechanism to stop the movement of the inspection probe based on a detection result of the deformation amount detecting means.

  Furthermore, the circuit board inspection probing device according to claim 3 is the circuit board inspection probing device according to claim 1 or 2, wherein the probe moving mechanism is attached to a rotating shaft of the ultrasonic motor and the ultrasonic wave A base portion rotated by a motor, an attachment portion configured to be capable of attaching the inspection probe, a connecting portion formed of a flat plate-like elastic member and connecting the base portion and the attachment portion to each other; And a linear motion guide means for linearly moving the mounting portion in the contact and separation direction, and the base portion is rotated by the ultrasonic motor according to the control of the control portion to elastically deform the connecting portion. Meanwhile, the mounting portion is pulled up or pushed down via the connecting portion to cause the inspection probe to move linearly in the contacting / separating direction.

  According to a fourth aspect of the present invention, there is provided the circuit board inspection apparatus according to any one of the first to third aspects, and the circuit through the inspection probe of each of the circuit board inspection probing apparatuses. And an inspection unit that outputs an inspection signal to the substrate and electrically inspects the circuit board.

  According to the circuit board inspection probing device according to claim 1 and the circuit board inspection device according to claim 4, since the probe moving mechanism is configured by including the ultrasonic motor as a power source, the ultrasonic motor is powered. Therefore, the inspection probe being moved can be stopped at a desired stop position. As a result, high-speed probing can be performed on various circuit boards having different board thicknesses and the like without causing damage to the circuit board or damage to the inspection probe. Further, unlike the configuration in which the electromagnetic motor is used as a power source, the inspection can be executed without magnetically affecting the periphery of the circuit board (inspection probe) to be inspected. As a result, it is possible to carry out accurate inspection while eliminating magnetic influence.

  In the circuit board inspection probing device according to claim 2, the control unit stops the movement of the inspection probe by the probe moving mechanism based on the detection result by the deformation amount detection means, so that the inspection probe is A situation in which the circuit board is pressed too strongly against the circuit board can be avoided. As a result, it is possible to reliably avoid damage to the circuit board and damage to the inspection probe.

  Further, according to the probing device for circuit board inspection according to claim 3, the base portion is rotated by an ultrasonic motor to elastically deform the connecting portion, and the attachment portion is lifted or pushed down to contact and separate the inspection probe. By being configured to move linearly in the direction, each component for moving the inspection probe up and down can be operated without being moved. As a result, probing can be performed accurately without causing unintended movement (excessive movement amount or insufficient movement amount) of the inspection probe due to sticking.

  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The best mode of a circuit board inspection probing apparatus and a circuit board inspection apparatus according to the present invention will be described below with reference to the accompanying drawings.

  First, the configuration of the circuit board inspection apparatus 1 will be described with reference to the drawings.

  A circuit board inspection apparatus (hereinafter also referred to as “inspection apparatus”) 1 shown in FIG. 1 includes a probe moving mechanism 2, a contact probe 3, an inspection unit 4, a distance sensor 5, and a control unit 6, and is a printed circuit board. The contact probe 3 is brought into contact with a circuit pattern on the circuit board 10 such as an IC package, a hybrid board, and an MCM (Multi Chip Module) or a mounted circuit component, and an inspection signal is output, thereby determining whether the circuit is good or bad. Inspect. In this case, the contact probe 3 is an example of an inspection probe according to the present invention, and is formed by punching a metal plate into a predetermined shape. Specifically, as shown in FIG. 2, the contact probe 3 includes a base portion 21 for fixing to the probe moving mechanism 2 and arc notch fulcrums 22a, 22b and arc notch fulcrums 23a, A four-joint link mechanism (hereinafter also referred to as a “link mechanism”) RM, which includes an arm 22 and an arm 23 formed with 23b, respectively, and a probe main body 24 connected to the base portion 21 via the arms 22 and 23. Is configured. The contact probe 3 is connected to the inspection unit 4 via, for example, a signal line (not shown) electrically connected to the base unit 21, and the tip 24 a of the probe main body 24 is in contact with the circuit board 10. Then, an inspection signal is output to the circuit board 10.

  On the other hand, the probe moving mechanism 2 constitutes a circuit board inspection probing device according to the present invention in combination with the contact probe 3, the distance sensor 5 and the control unit 6, and performs probing on the circuit board 10 under the control of the control unit 6. Execute. As shown in FIGS. 3 and 4, the probe moving mechanism 2 includes an ultrasonic motor 11, a base portion 12, a connecting portion 13, attachment portions 14 and 15, and a guide rail 16 so that the contact probe 3 can be attached. Has been. The ultrasonic motor 11 includes, for example, a piezoelectric element (piezoelectric ceramic: not shown) as a vibrator, and is supplied with power from a power supply unit (not shown) under the control of the control unit 6. The slider (not shown) is rotated by utilizing the phenomenon of electrostriction (oscillating ultrasonically). A shaft 11 a is fixed to the slider of the ultrasonic motor 11. Since the internal structure and operation principle of the ultrasonic motor 11 are known, illustration and detailed description thereof are omitted. The ultrasonic motor 11 rotates the shaft 11a under the control of the control unit 6 to rotate the base 12 fixed to the shaft 11a in the direction of arrow B shown in FIG.

  As shown in FIG. 3, the base portion 12 is attached to the shaft 11a of the ultrasonic motor 11, and rotates in the direction of arrow B as the shaft 11a rotates. The base portion 12 has a fixed surface 12a for fixing the connecting portion 13 formed in a planar shape that can be brought into surface contact with the connecting portion 13, and the side surface 12b on the mounting portion 14 side and the fixing surface 12a intersect. A corner (portion indicated by an arrow R1) is chamfered in a circular arc shape in cross section. As an example, the connecting part 13 is a flat spring formed of a fiber reinforced resin using carbon fiber (hereinafter also referred to as “C-FRP”) (an example of a “flat elastic member” in the present invention). In this case, one end is bolted (fixed) to the base portion 12 and the other end is bolted (fixed) to the mounting portion 14. In this case, C-FRP is a resin material having a light weight and a high elastic modulus, and its fatigue life is long (that is, fatigue strength is increased).

  The attachment portion 14 is combined with the attachment portion 15 to constitute an attachment portion in the present invention. The attachment portion 14 is configured so that the contact probe 3 can be attached via the attachment portion 15, and via the slide piece 16a (see FIG. 4). The guide rail 16 is slidably attached. As shown in FIG. 3, the mounting portion 14 has a flat fixed surface 14 a for fixing the connecting portion 13, and is configured to be able to make surface contact with the connecting portion 13, and its base portion. A corner (a portion indicated by an arrow R2) where the side surface 14b on the 12th side and the fixed surface 14a intersect is chamfered in a circular arc shape. The attachment portion 15 is formed in a prismatic shape as a whole and is bolted to the attachment portion 14, and the contact probe 3 can be attached to the side surface thereof. The guide rail 16, together with the slide piece 16a, constitutes a linear motion guide means in the present invention. As shown in FIG. 4, the slide piece 16a to which the mounting portion 14 is bolted is moved in the directions of arrows A1 and A2. The contact probe 3 is guided in a direction in which the contact probe 3 comes in contact with and separates from the circuit board 10.

  The inspection unit 4 electrically inspects the circuit board 10 by outputting an inspection signal to the circuit board 10 via the contact probe 3 under the control of the control unit 6. The distance sensor 5 is an example of a deformation amount detecting means in the present invention. As shown in FIGS. 3 and 4, the distance sensor 5 is attached to the attachment portion 15 via the attachment 5 a and determines the deformation amount of the contact probe 3 during probing. Detect optically. Specifically, as shown in FIG. 2, the distance sensor 5 is relative to the base portion 21 by the elastic deformation of the contact probe 3 as shown by a broken line in the figure when probing the circuit board 10. A change in the height of the upper surface of the probe body 24 that is moved upward (ie, the amount of elastic deformation of the contact probe 3) is optically detected. The control unit 6 comprehensively controls the circuit board inspection apparatus 1. In addition, the control unit 6 controls the power supply unit (not shown) to supply power to the ultrasonic motor 11 to move the contact probe 3 up and down, and the contact probe 3 is set to a predetermined value based on the detection result of the distance sensor 5. When the deformation state occurs, the supply of electric power is stopped and the movement of the contact probe 3 is stopped.

  Next, a method for inspecting the circuit board 10 by the inspection apparatus 1 will be described with reference to the drawings.

  First, in a state where the contact probe 3 is moved up, a substrate to be inspected is set below the contact probe 3. Specifically, the control unit 6 controls the ultrasonic motor 11 of the probe moving mechanism 2 to rotate the base unit 12 in the direction of the arrow B1 shown in FIG. At this time, the connecting portion 13 pulls up the attachment portion 14 while being elastically deformed like a bow as the base portion 12 rotates. Further, the mounting portion 14 slides by a height H1 in the direction of the arrow A1 from the position indicated by the broken line in the drawing according to the guide of the guide rail 16. As a result, the contact probe 3 moves up in the direction of the arrow A1 as the mounting portion 14 moves up.

  In this case, instead of the base portion 12 in the probe moving mechanism 2, as shown in FIG. 6, the corner portion (the portion indicated by the arrow R1x) where the fixing surface 12a and the side surface 12b that fix the connecting portion 13 intersect is chamfered. When the base portion 12x that is not used is used, the connecting portion 13 is strongly pressed against the corner portion of the base portion 12x when the connecting portion 13 is elastically deformed as the base portion 12x rotates. Therefore, there is a possibility that the connection portion 13 may be damaged due to the stress concentrated on the portion pressed against the corner portion. On the other hand, in this probe moving mechanism 2, as shown in FIG. 7, the corner portion (the portion indicated by the arrow R1) of the base portion 12 is chamfered in a circular arc shape, and the connecting portion 13 is located on the mounting portion 14 side. As it goes, it is gradually separated from the fixed surface 12a of the base portion 12. Therefore, when the connecting portion 13 is elastically deformed with the rotation of the base portion 12, the connecting portion 13 is not strongly pressed against the corner portion of the base portion 12, and concentration of stress is avoided. 6 and 7, in order to facilitate understanding of the present invention, the deformation amount of the connecting portion 13 is exaggerated and greatly deformed.

  Further, instead of the mounting portion 14, as shown in FIG. 8, a mounting portion 14 x that is not chamfered at a corner portion (a portion indicated by an arrow R <b> 2 x) at which the fixing surface 14 a and the side surface 14 b that fix the connecting portion 13 intersect. When used, when the connecting portion 13 is elastically deformed, the connecting portion 13 is strongly pressed against the corner portion of the mounting portion 14x. Therefore, there is a possibility that the connection portion 13 may be damaged due to the stress concentrated on the portion pressed against the corner portion. On the other hand, in this probe moving mechanism 2, as shown in FIG. 9, the corner portion (the portion indicated by the arrow R2) of the mounting portion 14 is chamfered in a circular arc shape so that the connecting portion 13 faces the base portion 12 side. As it goes, it is gradually separated from the fixed surface 14a of the mounting portion 14. Therefore, when the connecting portion 13 is elastically deformed, the connecting portion 13 is not strongly pressed against the corner portion of the mounting portion 14, and stress concentration is avoided. 8 and 9, the amount of deformation of the connecting portion 13 is exaggerated and greatly deformed for easy understanding of the present invention.

  Next, the contact probe 3 is moved downward to bring the tip 24a of the probe main body 24 into contact with the substrate to be inspected. Specifically, the ultrasonic motor 11 rotates the base portion 12 in the direction of the arrow B2 shown in FIG. 10 according to the control of the control portion. At this time, the connecting portion 13 is elastically deformed like a bow as the base portion 12 rotates, and the mounting portion 14 is pushed down. Further, the mounting portion 14 slides (downward) by a height H2 in the direction of the arrow A2 from the position indicated by the alternate long and short dash line in FIG. As a result, the contact probe 3 smoothly moves downward in the direction of the arrow A2 as the mounting portion 14 moves downward. At this time, the contact probe 3 is moved from the state in which the tip 24a of the probe main body 24 is in contact with the substrate to be inspected, so that the base 21 is further moved downward by the probe moving mechanism 2 so that the link mechanism RM is moved to FIG. The tip 24a of the probe main body 24 is deformed as indicated by a broken line and moves upward (directly moves upward) relative to the base portion 21 in the direction of the arrow C1 shown in FIG. As a result, the tip 24a is urged toward the substrate to be inspected in the direction of the arrow C2 shown in the figure by the elastic force of the circular arc cut fulcrums 22a, 22b, 23a, and 23b.

  At this time, the distance sensor 5 detects the relative upward movement of the probe body 24 with respect to the base portion 21 and notifies the control unit 6 of the detection result. Further, the control unit 6 stops the ultrasonic motor 11 when the probe main body 24 moves up to a predetermined height (relative upward movement) with respect to the base unit 21 based on the detection result of the distance sensor 5. . In this case, the ultrasonic motor 11 immediately stops the rotation of the slider when the supply of power from the power supply unit is stopped (as an example, it stops between about 0.1 msec to 1 msec after the supply is stopped). . Therefore, unlike the configuration employing an electromagnetic motor that requires 5 ms to 10 ms from the power supply stop to the rotation stop, the rotation of the base portion 12 attached to the shaft 11a immediately stops. The pressing of the mounting portion 14 via the connecting portion 13 is stopped in a very short time after the supply of power is stopped, and thereby the downward movement of the contact probe 3 by the probe moving mechanism 2 is stopped. As a result, the tip 24a is urged toward the circuit board 10 with a predetermined contact pressure without being excessively pressed against the circuit board 10. Thereafter, the inspection unit 4 outputs an inspection signal to the circuit board 10 via the contact probe 3 under the control of the control unit 6 to execute an electrical inspection. Thereby, the quality of the circuit board 10 is inspected.

  Thus, according to this inspection apparatus 1, since the probe moving mechanism 2 is configured by including the ultrasonic motor 11 as a power source, the ultrasonic motor 11 is stopped in a very short time after the supply of power is stopped. Therefore, the moved contact probe 3 can be stopped at a desired stop position. As a result, high-speed probing can be performed on various circuit boards having different board thicknesses and the like without causing damage to the circuit board or damage to the contact probe 3. Further, unlike the configuration in which the electromagnetic motor is used as a power source, the inspection can be executed without magnetically affecting the periphery of the circuit board 10 (contact probe 3) to be inspected. As a result, it is possible to carry out accurate inspection while eliminating magnetic influence.

  Further, according to the inspection apparatus 1, the control unit 6 stops the movement of the contact probe 3 by the probe moving mechanism 2 based on the detection result by the distance sensor 5, so that the contact probe 3 is moved with respect to the circuit board 10. It is possible to avoid a situation where the pressure is excessively strong. As a result, damage to the circuit board and damage to the contact probe 3 can be reliably avoided.

  Further, according to the inspection apparatus 1, the base portion 21 is rotated by the ultrasonic motor 11 to elastically deform the connecting portion 13, and the attachment portion 14 is lifted or pushed down so that the contact probe 3 is contacted and separated. Unlike the conventional circuit board inspection apparatus in which the cam follower may be separated from the cam peripheral surface and rattle each component during high-speed probing, the contact probe 3 is moved up and down. Each part can be operated without rattling. As a result, probing can be performed accurately without causing unintended movement (excessive movement amount or insufficient movement amount) of the contact probe 3 due to sticking.

  The present invention is not limited to the configuration shown in the above-described embodiment of the present invention. For example, the example in which the contact probe 3 is moved up and down via the probe moving mechanism 2 having the base portion 12, the connecting portion 13, the attachment portions 14 and 15, and the guide rail 16 has been described. For example, the probe moving mechanism 2A shown in FIG. As described above, the base portion 21 of the contact probe 3 is fixed to the shaft 11a of the ultrasonic motor 11, and the tip 24a of the probe main body 24 is moved in the direction of contacting and separating from the circuit board 10 by the rotation of the shaft 11a. Can be adopted. According to this configuration, since the ultrasonic motor 11 stops in a very short time after the supply of power is stopped in the same manner as the probe moving mechanism 2 described above, the moved contact probe 3 is accurately placed at a desired stop position. Can be stopped. As a result, it is possible to perform high-speed probing with respect to various circuit boards having different board thicknesses and the like without causing damage to the circuit board or damage to the contact probe 3. In this probe moving mechanism 2A, it is preferable to fix the fixture 5a for fixing the distance sensor 5 to the shaft 11a together with the contact probe 3. According to this configuration, the relative upward movement of the probe main body 24 relative to the base portion 21 can be accurately detected by the distance sensor 5 that moves together with the contact probe 3 during probing.

  Further, like the probe moving mechanism 2B shown in FIG. 12, the shaft 32 as a slider in the ultrasonic motor 31 is fixed to the frame (or moving mechanism: none shown) of the probe moving mechanism 2B. A configuration in which the base portion 21 of the contact probe 3 is fixed to the motor main body 33 arranged to move up and down with respect to 32 can also be adopted. In this probe moving mechanism 2B, when electric power is supplied to the motor main body 33 by the control unit 6, the motor main body 33 moves downward or upward with respect to the shaft 32 (moves in a direction in which it contacts and separates from the circuit board 10). ) As a result, the contact probe 3 fixed to the motor main body 33 is moved in a direction in which the contact probe 3 is brought into contact with or separated from the circuit board 10, and the tip 24 a of the probe main body 24 is brought into contact with the circuit board 10. According to this configuration, the ultrasonic motor 31 stops in a very short time after the supply of power is stopped in the same manner as the probe moving mechanisms 2 and 2A described above. Can be stopped accurately. As a result, it is possible to perform high-speed probing on various circuit boards having different board thicknesses and the like without causing damage to the circuit board or damage to the contact probe 3. In this probe moving mechanism 2B, it is preferable that the fixture 5a for fixing the distance sensor 5 is fixed to the motor body 33 together with the contact probe 3. According to this configuration, the relative upward movement of the probe main body 24 relative to the base portion 21 can be accurately detected by the distance sensor 5 that moves together with the contact probe 3 during probing.

  Furthermore, although the probe moving mechanism 2 in which the base portion 12, the connecting portion 13, and the attachment portion 14 are formed separately and bolted (fixed) with fixing bolts has been described as an example, the present invention is limited to this. Instead, a configuration in which the base portion 12, the connecting portion 13, and the attachment portion 14 are integrally formed of, for example, a resin material can be employed. According to this configuration, since the attaching work of the connecting portion 13 to the base portion 12 and the attaching portion 14 is not required, the probe moving mechanism 2 can be easily assembled. As a result, the cost of the probe moving mechanism 2 is sufficiently reduced. be able to.

1 is a block diagram showing a configuration of a circuit board inspection device 1. FIG. 3 is a side view of a contact probe 3 in the circuit board inspection apparatus 1. FIG. 2 is a front view of a probe moving mechanism 2 in the circuit board inspection apparatus 1. FIG. 3 is a side view of a probe moving mechanism 2 in the circuit board inspection apparatus 1. FIG. It is a front view of the probe moving mechanism 2 in a state where the contact probe 3 is moved up. It is a front view which shows the base part 12x and the connection part 13 of the state elastically deformed. It is a front view which shows the base part 12 and the connection part 13 of the state elastically deformed. It is a front view which shows the attaching part 14x and the connection part 13 of the state elastically deformed. It is a front view which shows the attaching part 14 and the connection part 13 of the state elastically deformed. It is a front view of the probe moving mechanism 2 in a state where the contact probe 3 is moved downward. It is a side view of 2 A of probe moving mechanisms. It is a side view of the probe moving mechanism 2B.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit board inspection apparatus 2,2A, 2B Probe moving mechanism 3 Contact probe 4 Inspection part 5 Distance sensor 6 Control part 10 Circuit board 11,31 Ultrasonic motor 11a Shaft 12 Base part 13 Connection part 14,15 Attachment part 16 Guide rail 16a Slide piece 32 Shaft 33 Motor body

Claims (4)

An inspection probe that is brought into contact with the circuit board to be inspected, a probe moving mechanism that moves the inspection probe in a direction to be in contact with and away from the circuit board, and the probe moving mechanism that controls the inspection probe A moving control unit,
The circuit board inspection probing apparatus, wherein the probe moving mechanism includes an ultrasonic motor as a power source for moving the inspection probe. A deformation amount detecting means for optically detecting the deformation amount of the inspection probe that elastically deforms when contacting the circuit board;
The circuit board inspection probing apparatus according to claim 1, wherein the control unit causes the probe moving mechanism to stop moving the inspection probe based on a detection result of the deformation amount detection unit.   The probe moving mechanism includes a base portion that is attached to a rotation shaft of the ultrasonic motor and is rotated by the ultrasonic motor, an attachment portion configured to attach the inspection probe, and a flat elastic member A connecting portion that connects the base portion and the mounting portion to each other, and linear motion guide means that linearly moves the mounting portion in the contacting / separating direction, and according to control of the control portion The base portion is rotated by the ultrasonic motor to elastically deform the connecting portion, and the attachment portion is lifted or pushed down via the connecting portion to linearly move the inspection probe in the contacting / separating direction. The probing device for circuit board inspection according to claim 1 or 2.   A circuit board inspection probing device according to any one of claims 1 to 3, and an inspection signal is output to the circuit board via the inspection probe of each circuit board inspection probing device. A circuit board inspection apparatus configured to include an inspection unit for electrical inspection.

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