JP2005228778A - Method and apparatus for inspecting semiconductor component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor component inspecting method and a semiconductor component inspecting apparatus which efficiently measures at a high accuracy the shape of a plurality of bump electrodes of an approximately rectangular semiconductor component, where the electrodes are formed in an approximately conical shape on a plurality of electrodes, formed on the mounting-side surface to a substrate. <P>SOLUTION: A semiconductor component has a plurality of bump electrodes formed into an approximately conical shape on a plurality of electrodes on a surface on the mounting side to a substrate. Planar images of the respective bump electrodes are acquired in an approximately orthogonal direction to the mounting side surface, oblique images of the bump electrodes are acquired in a direction oblique to the approximately orthogonal direction, the planar images are analyzed to inspect the layout of the respective bump electrodes along the mounting-side surface, and the oblique view images are analyzed to inspect the height sizes of the respective bump electrodes. By making the oblique view images enlarged in the height direction of the bump electrodes, inspection accuracy of the height size is improved. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  In the semiconductor component having a plurality of protruding electrodes formed so as to have a substantially conical shape on the plurality of electrodes on the surface on the mounting side of the substrate, the present invention acquires an image of each of the protruding electrodes, and The present invention relates to a semiconductor component inspection method and an inspection apparatus for inspecting each of the protruding electrodes by analyzing an image.

  In recent years, semiconductor mounting in which IC components, which are semiconductor components, are directly mounted on a substrate has been actively performed (see, for example, Patent Documents 1 to 4). In this semiconductor mounting, first, a plurality of electrodes are formed on the mounting side surface of the IC component, and the mounting is performed by joining these electrodes to a substrate electrode formed on the substrate. On the respective electrodes of the IC component, bumps (projection electrodes) are formed with a conductive metal material. Thereafter, the respective substrate electrodes on the substrate are brought into contact with and pressed against the tips of the respective bumps on the IC component, thereby performing metal bonding between them. By maintaining this metal bonded state, the IC component is mounted on the substrate.

  When metal bonding is performed between the bumps and the substrate electrodes in the semiconductor mounting, the tips of the bumps and the flatness (coplanarity) of the substrate electrodes are important. In particular, since each of the bumps formed on each of the electrodes in the IC component has a protruding shape, the flatness is more important.

  Therefore, in the conventional semiconductor mounting, the position and shape inspection of each bump formed on the IC component is performed before the IC component is mounted on the substrate. In such an inspection, for example, as shown in the schematic explanatory view of FIG. 14, each bump 503 is placed in a state where the IC component is arranged so that the tip of each bump 503 in the IC component 501 faces upward. Is obtained by irradiating light from above, and capturing and acquiring an image 511 (shown in the schematic diagram of FIG. 15) constituted by the reflected light by the imaging camera 510 disposed above. Based on the image, the position and shape of each bump 503 are inspected.

JP 2001-124523 A JP 2001-289615 A JP-A-8-285548 Japanese Patent No. 3150347

  However, each bump 503 is formed in a substantially conical shape, and its tip is often pointed. In such a case, since the light irradiated from above the respective bumps 503 is reflected so as to diffuse around the bumps 503, the reflected light is surely detected by the imaging camera 510 disposed above. It becomes difficult to obtain.

  Further, although it is important for the inspection of the flatness to surely recognize the shape of the tip portion of each bump 503, if it is difficult to reliably acquire the reflected light, this is the case. There is a problem in that the shape of the sharp tip cannot be reliably recognized, and the flatness inspection cannot be accurately performed.

  Further, by cutting the tip of each bump in the IC component, a leveling process is performed so that the respective heights are uniform, and then the IC component is mounted on the substrate (for example, ACF) (Pressure welding method using anisotropic conductive film, etc.) has been generally performed as a conventional method for mounting semiconductor components, but in recent years, various methods have been performed along with the diversification of such semiconductor mounting. It is becoming For example, without performing the leveling process as described above, each of the substrates can be obtained by breaking through a tape member having electrical insulation disposed between the substrate and the IC component at the tip of each bump. A method of performing metal bonding between electrodes and bumps is performed (see, for example, Patent Document 4).

  In the construction method in which the leveling process is performed, the shape of the tip portion of each bump is not so much a problem. On the other hand, the tape member is pierced by the tip portion of each bump without performing the leveling process. In the construction method, whether the crushing degree of the tip portion of each of the bumps is within an allowable range, that is, whether the tip portion is in a pointed state to the extent that the piercing operation can be performed reliably. It becomes a problem.

  However, if the shape of the tip portion of each bump cannot be reliably recognized as described above, the degree of collapse of each tip portion cannot be reliably recognized, and the above-described piercing operation is ensured. There is a problem that can not be. Furthermore, the fact that the tip portions of the respective bumps are pointed has a problem that it is difficult to reliably recognize the shape of the tip portion.

  It is also possible to use a three-dimensional measuring sensor using a laser or a confocal principle instead of the imaging camera 510 that acquires a two-dimensional image of each bump by acquiring such reflected light. However, in order to surely measure the shape of the tip portion of each bump 503, it is necessary to extremely increase the resolution, resulting in a decrease in inspection efficiency and an increase in inspection cost, which is not realistic.

  Accordingly, an object of the present invention is to solve the above-described problem, and has a substantially rectangular shape having a plurality of protruding electrodes formed so as to have a substantially conical shape on a plurality of electrodes on the surface on the mounting side of the substrate. It is an object of the present invention to provide a semiconductor component inspection method and inspection apparatus capable of efficiently measuring the shape of each protruding electrode with high accuracy.

  In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, in a semiconductor component having a plurality of protruding electrodes formed so as to have a substantially conical shape on a plurality of electrodes on the surface on the mounting side of the substrate, images of the respective protruding electrodes And analyzing the image, the semiconductor component inspection method for inspecting each of the protruding electrodes,
A planar image of each of the protruding electrodes is obtained from a direction substantially orthogonal to the mounting side surface, and a perspective image of each of the protruding electrodes is acquired from a direction inclined from the substantially orthogonal direction,
There is provided a method for inspecting a semiconductor component, characterized in that each protruding electrode is inspected by analyzing the shape of each protruding electrode based on the planar image and the perspective image.

According to the second aspect of the present invention, each of the protruding electrodes is inspected based on the planar image, and the arrangement of the protruding electrodes along the mounting-side surface is inspected, and based on the perspective image. Thus, the semiconductor component inspection method according to the first aspect for inspecting the height dimension of each protruding electrode is provided.
Further, in the inspection of the arrangement, the arrangement position of each protruding electrode is measured from the planar image, the measured arrangement position data is compared with the reference arrangement position data, and the difference is within an allowable range. It can be done by judging whether it is in the inside or not.

According to the third aspect of the present invention, the inspection of each of the protruding electrodes is performed by checking the degree of crushing of the substantially conical tip of each of the protruding electrodes on the basis of the planar image. According to the first aspect of the present invention, there is provided the semiconductor component inspection method according to the first aspect, wherein the height dimension of each protruding electrode is inspected.
The crushing degree of the tip is measured by measuring the area, width dimension, or diameter dimension of the substantially flat end surface formed at the tip of each protruding electrode from the planar image, and the measurement result indicates the degree of crushing. This can be done by determining whether it is within the allowable value.
Furthermore, when the test result of the crushing degree is good and the test result of the height dimension is good, it can be determined that the test result of each protruding electrode is good.

The fourth semiconductor component of the present invention has a substantially rectangular shape, and the respective protruding electrodes are arranged in a line along the respective ends of the substantially rectangular shape on the mounting side surface,
The semiconductor component inspection method according to any one of the first to third aspects, wherein the perspective image is acquired for each row of the respective protruding electrodes along the respective end portions.

  According to the fifth aspect of the present invention, the respective perspective images are refracted in a direction substantially orthogonal to the mounting-side surface, so that each perspective image is an image along the substantially orthogonal direction. A method for inspecting a semiconductor component according to a fourth aspect of the present invention is obtained in a lump.

According to the sixth aspect of the present invention, the entire surface on the mounting side of the semiconductor component is arranged in an imaging field, and the planar image of each protruding electrode is obtained in the imaging field.
A method for inspecting a semiconductor component according to a fifth aspect, wherein the imaging field of view is enlarged, and the respective perspective images are simultaneously arranged in the enlarged imaging field of view and are collectively acquired as the one image. To do.

According to the seventh aspect of the present invention, the center position of the semiconductor component and the rotation angle around the center position are calculated based on the planar image.
Based on the calculated center position and rotation angle, a sixth aspect of determining the imaging positions of the respective perspective images by aligning the enlarged imaging field of view with the mounting side surface of the semiconductor component A method for inspecting a semiconductor component described in 1. is provided.

  According to the eighth aspect of the present invention, the perspective image is an enlarged image of each of the protruding electrodes, and the height dimension of each of the protruding electrodes in the enlarged image is converted into an actual height dimension. When analyzing the shape of each of the protruding electrodes, the positional deviation amount of the arrangement of the protruding electrodes along the mounting-side surface is calculated based on the planar image, and the calculated positional deviation amount The semiconductor component inspection method according to any one of the first to seventh aspects is performed in consideration of the above.

  According to a ninth aspect of the present invention, there is provided the semiconductor component inspection method according to the eighth aspect, wherein the enlarged image is an image obtained by enlarging the respective protruding electrodes in the height direction.

  According to a tenth aspect of the present invention, there is provided the method for inspecting a semiconductor component according to the ninth aspect, wherein the enlarged image is an image in which the respective protruding electrodes are further enlarged along the arrangement direction.

  According to the eleventh aspect of the present invention, the respective perspective images of the respective protruding electrodes are inclined from an angle in a range of 30 to 60 degrees with respect to a direction substantially orthogonal to the mounting-side surface. The method for inspecting a semiconductor component according to any one of the first to tenth aspects is provided.

According to the twelfth aspect of the present invention, in a semiconductor component having a plurality of protruding electrodes formed so as to have a substantially conical shape on a plurality of electrodes on the surface on the mounting side of the substrate, an image of each of the protruding electrodes. Is a semiconductor component inspection apparatus that inspects each of the protruding electrodes by analyzing the image,
A component placement section where the semiconductor component is placed;
An imaging element that is disposed to face the component placement unit and has an optical axis that is disposed in a direction substantially orthogonal to the mounting-side surface, and that captures an image incident along the optical axis;
A perspective image refracting section that refracts a perspective image of each protruding electrode from a direction inclined from the substantially orthogonal direction in a direction along the optical axis;
An imaging unit that causes the planar image of each protruding electrode from the optical axis direction and the perspective image refracted by the perspective image refracting unit to be incident along the optical axis to form an image on the imaging element; ,
The image pickup device, the perspective image refracting portion, and the image forming portion are moved along the mounting side surface while maintaining the mutual arrangement relationship, and the approximate center of the mounting side surface for the imaging and the light are moved. An imaging positioning device for aligning with the shaft;
An imaging inspection control apparatus that inspects each protruding electrode by analyzing the shape of each protruding electrode based on the planar image and the perspective image acquired by being imaged on the imaging element. And a semiconductor component inspection apparatus.

  According to the thirteenth aspect of the present invention, the imaging inspection control device inspects the arrangement of the protruding electrodes on the mounting-side surface based on the planar image, and each of the imaging inspection control devices based on the perspective image. A semiconductor component inspection apparatus according to a twelfth aspect for inspecting the height dimension of the protruding electrode of the present invention.

  According to the fourteenth aspect of the present invention, the imaging inspection control device inspects the crushing degree of the substantially conical tip of each protruding electrode based on the planar image, and based on the perspective image. According to a twelfth aspect of the present invention, there is provided a semiconductor component inspection apparatus for inspecting a height dimension of each of the protruding electrodes.

According to a fifteenth aspect of the present invention, the semiconductor component has a substantially square shape, and the protruding electrodes are arranged in a line along the four ends of the substantially square shape on the mounting side surface. And
The four perspective images arranged near the four ends and individually refracting the respective perspective images so as to be incident on the imaging portion for each row of the respective protruding electrodes along the respective ends. A semiconductor component inspection apparatus according to any one of the twelfth to fourteenth aspects in which a refracting portion is provided.

  According to a sixteenth aspect of the present invention, the perspective image refracting portion has an angle adjusting means for adjusting a refraction angle in accordance with the arrangement of the respective protruding electrodes or the shape of the semiconductor component. To the semiconductor component inspection apparatus according to any one of the fifteenth aspects.

  According to a seventeenth aspect of the present invention, the perspective image refracting section includes an illuminating section that irradiates light from the inclined direction with respect to each of the protruding electrodes that are targets of the perspective image. A semiconductor component inspection apparatus according to any one of the twelfth to sixteenth aspects is provided.

  According to an eighteenth aspect of the present invention, the perspective image refracting unit refracts the perspective image and enlarges the perspective image in the height direction of the respective protruding electrodes. A semiconductor component inspection apparatus according to claim 1 is provided.

According to a nineteenth aspect of the present invention, in the semiconductor component, the protruding electrodes are arranged in a line along the substantially square ends of the mounting side surface,
The apparatus for inspecting a semiconductor component according to any one of the twelfth to eighteenth aspects, wherein the perspective image refracting unit refracts the perspective image and enlarges the perspective image in the arrangement direction of the respective protruding electrodes. I will provide a.

  According to a twentieth aspect of the present invention, there is provided the semiconductor component inspection apparatus according to the eighteenth aspect or the nineteenth aspect, wherein the perspective image refracting unit is a convex mirror or a cylindrical lens that enlarges and refracts the perspective image. .

  According to the first aspect of the present invention, each protruding electrode is formed on a semiconductor component in which uniformity of the height of formation of each protruding electrode (that is, flatness) is a problem. A planar image of each of the protruding electrodes is obtained from a direction substantially orthogonal to the mounting side surface, and a perspective image of each of the protruding electrodes is acquired from a direction inclined from the substantially orthogonal direction to obtain the planar image. Further, by analyzing the shape of each protruding electrode based on the perspective image, the arrangement position and shape can be inspected as the inspection of each protruding electrode. In particular, by using the perspective image, it is difficult to inspect each protruding electrode having a feature that it is difficult to inspect the shape of the tip having a substantially conical shape only from the planar image. Can be performed.

  In addition, instead of acquiring an image from the side of each protruding electrode from the lateral direction, the perspective image of each protruding electrode is acquired from the inclined direction. It is possible to prevent the occurrence of problems that may occur during image acquisition. Specifically, at the time of image acquisition from the side, it is affected by the illumination irradiated to the protruding electrodes arranged at the opposite ends on the mounting side surface, or is outside the imaging target. There may be a problem of acquiring up to the image of the protruding electrode at the opposite end, and in such a case, there is a possibility that reliable image acquisition may not be performed, In the case where the perspective image is acquired from the determined direction, such a problem does not occur. Therefore, the perspective image can be reliably acquired, and the semiconductor component can be reliably inspected.

  According to the second aspect of the present invention, the arrangement of the respective protruding electrodes along the mounting-side surface is inspected on the basis of the acquired planar image, and on the basis of the acquired perspective image, the By inspecting the height dimension of each protruding electrode, the individual characteristics of the planar image and the perspective image are effectively used, and the inspection is performed efficiently by combining the respective characteristics. Highly accurate inspection can be realized.

  According to the third aspect of the present invention, the degree of crushing of the substantially conical tip of each protruding electrode is inspected based on the acquired planar image, and each of the above is determined based on the perspective image. By inspecting the height dimension of each protruding electrode, the individual characteristics of the planar image and the perspective image are effectively used, and the inspection is performed in combination with the respective characteristics, so that it is efficient and high. Accurate inspection can be realized. In particular, not only the uniformity of the height dimension, but also the degree of crushing of the tip for the semiconductor component having the respective protruding electrodes that require the tip of the substantially conical shape to be sharp. In addition, it is possible to perform a more reliable and highly accurate inspection by inspecting together. Therefore, for example, in the semiconductor component, an insulating tape member or the like disposed between the semiconductor component and the substrate at each pointed portion without performing the leveling process of the height of each protruding electrode. It can be said that the above inspection method is particularly effective when the semiconductor component mounting method of joining each substrate electrode and each projection electrode on the substrate is performed.

  According to the fourth aspect of the present invention, in the semiconductor component that requires such an inspection, the protruding electrodes are aligned along the ends of the substantially rectangular shape on the mounting-side surface. However, in such a case, by acquiring the perspective image for each row of the respective protruding electrodes along the respective end portions, it is possible to obtain each of the respective rows. The protruding electrode can be reliably inspected.

  According to the fifth aspect of the present invention, as in the third aspect, even in the case where acquisition of a plurality of the perspective images is required, in the direction substantially orthogonal to the mounting side surface, The respective perspective images are refracted to obtain the respective perspective images as one image along the substantially orthogonal direction, that is, the respective perspective images are stored in one imaging field of view. It can be acquired as a single image. Therefore, it is possible to efficiently obtain the plurality of perspective images as the one image, and to provide an efficient inspection method capable of shortening the time required for the inspection.

  According to the sixth aspect of the present invention, the entire surface of the semiconductor component on the mounting side is arranged in an imaging field, and the planar image of each protruding electrode is obtained in the imaging field, and then The imaging field of view is enlarged, the respective perspective images are simultaneously placed in the enlarged imaging field of view, and the plane image is obtained as the plane image by acquiring the image as a single batch. While acquiring with a suitable imaging visual field, it can acquire with the imaging visual field suitable for acquiring each said perspective image as said one image, ie, the said enlarged imaging visual field. In particular, by changing the imaging field of view as described above, for example, two types of images can be acquired without moving the imaging element, and the planar image and the respective perspective images are respectively obtained. It can acquire efficiently with the imaging visual field suitable for the image of.

  According to the seventh aspect of the present invention, the center position on the mounting side surface of the semiconductor component and the rotation angle around the center position are calculated based on the acquired planar image, and the calculated center is calculated. Based on the position and the rotation angle, the enlarged imaging field of view and the mounting side surface are aligned, and the imaging position of the perspective image is determined, thereby obtaining an image for the alignment. In addition, it can be used for the acquisition of the planar image, and the time required for image capturing can be improved.

  According to the eighth aspect of the present invention, the perspective image is an enlarged image of each protruding electrode, and the height dimension of each protruding electrode in the enlarged image is set to an actual height dimension. When converting and analyzing the shape of each protruding electrode, the positional deviation amount of the arrangement of each protruding electrode along the mounting-side surface calculated based on the planar image is taken into account. Conversion can be performed. Specifically, the enlarged position of the protruding electrode and the perspective image thereof differs depending on the positional deviation of the arrangement, but the amount of deviation of the conversion rate (enlargement ratio) that accompanies this is determined by the position of the arrangement. It is possible to perform correction by using the deviation amount data and perform the conversion process using the corrected conversion rate. Accordingly, it is possible to efficiently realize a more accurate inspection without accompanying new image acquisition.

  According to the ninth aspect of the present invention, the enlarged image is an image obtained by enlarging the respective protruding electrodes in the height direction. This inspection can be performed with high accuracy.

  According to the tenth aspect of the present invention, the enlarged image is an image obtained by enlarging each of the protruding electrodes even in the arrangement direction thereof, and in particular, an image of the tip of each of the protruding electrodes. Since it can be enlarged, the accuracy of the shape inspection can be improved, and the inspection accuracy of each protruding electrode can be further improved.

  According to the eleventh aspect of the present invention, each of the perspective images is an image acquired from a direction inclined at an angle in a range of 30 to 60 degrees with respect to a direction substantially orthogonal to the mounting-side surface. Therefore, it is possible to obtain an image having features that are clearly different from the above-described planar image and also have features that are clearly different from the images from the side. Can be obtained.

  According to the twelfth aspect of the present invention, in the semiconductor component inspection apparatus, the perspective image refracting portion that refracts the perspective image of each protruding electrode in the direction along the optical axis of the image sensor, and the optical axis direction. And an imaging unit that causes the planar image of each of the protruding electrodes and the perspective image refracted by the perspective image refracting unit to be incident along the optical axis to form an image on the imaging device. Thus, with respect to a semiconductor component in which the uniformity of the formation height dimension of each of the protruding electrodes is a problem, the direction that is substantially perpendicular to the mounting surface on which the protruding electrodes are formed A planar image of each of the protruding electrodes is obtained from a direction along the optical axis, and a perspective image of each of the protruding electrodes is acquired from a direction inclined from the optical axis. And based on the above perspective view, By analyzing the shape of the serial respective protrusion electrodes can be inspected in the arrangement position and shape. In particular, by using the perspective image, it is difficult to accurately inspect each protruding electrode having a feature that it is difficult to accurately inspect the shape of the tip having a substantially conical shape only from the planar image. It can be done with accuracy.

  According to the thirteenth aspect of the present invention, in the imaging inspection control device, the inspection of the arrangement of the respective protruding electrodes along the mounting-side surface is performed based on the planar image, and based on the perspective image, By inspecting the height dimension of each of the protruding electrodes, the individual characteristics of the planar image and the perspective image are effectively used, and the inspection is performed by combining the characteristics, thereby efficiently In addition, highly accurate inspection can be realized.

  According to the fourteenth aspect of the present invention, in the imaging inspection control device, the degree of collapse of the substantially conical tip of each of the protruding electrodes is inspected based on the planar image, and based on the perspective image. By inspecting the height dimension of each of the protruding electrodes, by effectively using the individual characteristics of the planar image and the perspective image, the inspection is performed by combining the characteristics. Efficient and highly accurate inspection can be realized. In particular, not only the uniformity of the height dimension, but also the degree of crushing of the tip for the semiconductor component having the respective protruding electrodes that require the tip of the substantially conical shape to be sharp. In addition, it is possible to perform a more reliable and highly accurate inspection by inspecting together.

  According to the fifteenth aspect of the present invention, in the semiconductor component that requires such an inspection, each of the protruding electrodes extends along the four end portions of the substantially rectangular shape on the mounting-side surface. However, in such a case, for each row of the respective protruding electrodes along the respective end portions, the respective perspective images can be individually made incident on the imaging portion. By providing the four perspective image refracting portions to be refracted, the respective perspective images can be acquired collectively, and an efficient inspection can be realized.

  According to the sixteenth aspect of the present invention, the perspective image refracting portion has angle adjusting means for adjusting a refraction angle in accordance with the arrangement of the protruding electrodes or the shape of the semiconductor component. Accordingly, it is possible to flexibly cope with various arrangements of the respective protruding electrodes and various shapes of the semiconductor component.

  According to the seventeenth aspect of the present invention, the perspective image refracting unit includes an illuminating unit that irradiates light from the inclined direction with respect to the respective protruding electrodes that are targets of the perspective image. Thus, the perspective image can be acquired with good image quality, and the inspection accuracy can be improved.

  According to the eighteenth aspect of the present invention, the perspective image refracting unit refracts the perspective image and enlarges the perspective image in the height direction of the respective protruding electrodes, so that the height dimension of the perspective image is increased. It is possible to inspect each of the protruding electrodes, which are important for inspection, with high accuracy.

  According to the nineteenth aspect of the present invention, in particular, the perspective image refracting unit refracts the perspective image and enlarges the perspective image in the arrangement direction of the respective protruding electrodes. Since the image of the tip of the electrode can be enlarged, the accuracy of the shape inspection can be improved, and the inspection accuracy of each protruding electrode can be further improved.

  According to the twentieth aspect of the present invention, the perspective image refracting portion is a convex mirror or a cylindrical lens, whereby the magnification function of the perspective image can be specifically realized.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

(First embodiment)
FIG. 1 is a schematic explanatory view showing the configuration of an imaging inspection apparatus 100 which is an example of a semiconductor component inspection apparatus according to the first embodiment of the present invention. The imaging inspection apparatus 100 can perform the semiconductor component inspection method of the first embodiment. FIG. 2 shows a schematic perspective view of an IC component 1 that is an example of a semiconductor component to be inspected by the imaging inspection apparatus 100.

  First, the IC component 1 to be inspected will be described. As shown in FIG. 2, the IC component 1 has a mounting surface S on a substrate (not shown) on its upper surface. A plurality of bumps 3, which are examples of protruding electrodes, are formed on a plurality of electrodes (not shown) included in S. Here, an enlarged schematic perspective view of the bump 3 is shown in FIG. As shown in FIG. 3, each bump 3 is formed in a substantially conical shape from a conductive metal material (for example, gold, copper, solder, etc.). Further, in each bump 3, the tip portion, which is the upper end portion in the figure, is formed as a pointed portion 3a, and the bottom portion 3b covers the electrode surface of the IC component 1 so that reliable bonding is ensured. Further, it is formed so as to be further expanded from the bottom of the conical shape. Also, as shown in FIG. 2, the bumps 3 are formed in a line along the four end portions of the mounting surface S of the substantially square IC component 1, for example, The pitch between the bumps 3 is substantially uniform. In the first embodiment, the IC component 1 has a substantially square shape, and the bumps 3 are arranged in a line along the respective end portions of the substantially square shape, that is, on the mounting side. The case where the respective bumps 3 are arranged in a substantially rectangular frame shape on the surface S will be described, but the present invention is not limited to such a case. Instead of such a case, for example, the IC component 1 may have a circular shape or an irregular shape. Each bump 3 is formed so that, for example, the diameter at the bottom of the substantially conical shape is about 100 μm, the height is about 100 μm, and the interval pitch is about 200 μm. In addition, the present invention described in detail below is a micro-bump formed in such a size or smaller size (the bottom diameter is 100 μm or less, the height is 100 μm or less, the spacing is It can be made effective by being applied to a bump) having a pitch of about 200 μm or less.

  Next, the configuration of the imaging inspection apparatus 100 will be described. As shown in FIG. 1, the imaging inspection apparatus 100 is an example of a component placement unit that places and holds a component tray 5 in which a plurality of IC components 1 are housed in a state of being arranged and arranged with the mounting side surface S as an upper surface in the drawing. A tray placement unit 6 and an imaging camera 10 which is an example of an imaging device that takes an image of the mounting side surface S of the IC component 1 housed in the component tray 5 placed in the tray placement unit 6 are provided. . The imaging camera 10 has an optical axis P disposed in a direction substantially orthogonal to the mounting surface S that is the vertical direction in the figure.

  As shown in FIG. 1, an imaging unit that acquires an image by the imaging camera 10 by forming an incident image on the imaging camera 10 on the optical axis P below the imaging camera 10. An example lens unit 12 is provided. The center of the lens unit 12 is disposed on the optical axis P of the imaging camera 10 and can be formed on the imaging camera 10 as a planar image of the IC component 1 positioned on the optical axis P. It has become. The lens unit 12 includes a plurality of lenses, and has a focus adjustment function in imaging and an enlargement / reduction function (zoom function) of an imaging field by moving these lenses along the optical axis P. ing.

  Further, the imaging inspection apparatus 100 moves the imaging camera 10 in a direction orthogonal to the optical axis P thereof, that is, a direction along the mounting side surface S of the IC component 1, thereby mounting the mounting side surface of the IC component 1 for imaging. An X-axis drive device 14 and a Y-axis drive device 16, which are examples of an imaging positioning device that positions the approximate center of S and the optical axis P, are provided. The X-axis drive device 14 can move the imaging camera 10 forward and backward in the illustrated X-axis direction. The Y-axis drive device 16 supports the X-axis drive device 14 and together with the X-axis drive device 14. The imaging camera 10 can be moved back and forth in the Y-axis direction. The imaging camera 10 is supported by the X-axis driving device 14 via the Z-axis driving device 18, and the Z-axis driving device 18 can be moved up and down in the illustrated vertical direction of the imaging camera 10.

  Further, the imaging inspection apparatus 100 is configured to acquire an image of each bump 3 of the IC component 1 as a perspective image from a direction inclined from the illustrated Z-axis direction that is a direction substantially orthogonal to the mounting-side surface S. As a perspective image acquisition unit 20. A schematic enlarged perspective view of the perspective image acquisition unit 20 is shown in FIG. 4, and the configuration will be described in detail with reference to FIG. In FIG. 4, a part of the illustrated configuration and parts are exaggerated for the purpose of facilitating understanding of the description of the configuration and functions.

  As shown in FIG. 4, the perspective image acquisition unit 20 is an example of a perspective image refracting unit that refracts and reflects the perspective image of each bump 3 in the IC component 1 from the tilted direction upward in the Z axis in the figure. And the illumination unit 24 that irradiates the respective bumps 3 with light for acquiring the perspective image.

  As shown in FIG. 4, the perspective image acquisition unit 20 includes four mirror portions 22 arranged in the vicinity of each of the four end portions of the IC component 1. These four mirror portions 22 are arranged in a substantially rectangular frame shape along the XY plane (the plane constituted by the X axis and the Y axis) in the figure below the optical axis P of the lens unit 12. The optical axis P of the imaging camera 10 is located at the center of the shape. Yes. In addition, each mirror unit 22 acquires an image (that is, a perspective image) of each bump 3 arranged along the end located in the vicinity from, for example, a direction inclined by 45 degrees from the Z-axis direction. In addition, it has a reflecting surface 22a that reflects (or refracts) upward in the Z-axis direction in the figure. Further, the reflecting surface 22a has a function as a convex mirror, and the perspective image can be enlarged in the height direction of the bump together with the reflection. In FIG. 4, the enlarged perspective view G <b> 1 of the bump 3 is shown on the reflection surface 22 a of each mirror portion 22. In addition, each perspective image reflected by the reflecting surface 22a of each mirror portion 22 in the upward direction in the Z-axis in this way is incident on the lens unit 12 along the substantially optical axis P and together with the planar image. An image is formed on the imaging camera 10.

  In addition, a plurality of fiber illuminations 24 a arranged in alignment along the arrangement direction of the respective bumps 3 are arranged as illumination units 24 below the respective mirror units 22. Each fiber illumination 24a is necessary for imaging the respective bumps 3 to be imaged of the perspective image along the inclined direction, that is, along the acquisition direction of the perspective image. Irradiate light. In addition, the irradiation angle of the light from each illumination part 24 is the light irradiated from the one illumination part 24 toward the mounting side surface S of the IC component 1 arranged upward in the figure in FIG. It is preferable that the angle is such that the light reflected by the mounting surface S is not reflected in the perspective images of the respective bumps 3 facing each other.

  Further, the angle of the reflecting surface 22a of each mirror part 22 and the irradiation angle of each fiber illumination 24a can be varied, and a driving device (not shown) is provided for each combination unit of each mirror part 22 and illumination part 24. (It is an example of an angle adjusting device). By enabling such variable operation, the perspective image can be changed according to the shape, size, thickness, etc. of the IC component 1 to be imaged and the arrangement, shape, size, etc. of each bump 3. Angle adjustments for optimization of the tilted direction in acquisition can be performed. The inclined direction is an angle in the range of 30 to 60 degrees from the optical axis P (or Z axis), and more preferably an angle in the range of 40 to 50 degrees.

  Referring back to FIG. 1, the imaging inspection apparatus 100 includes a θ rotation driving device 26 that rotates the perspective image acquisition unit 20 about the optical axis P as a rotation center (so-called θ rotation). By rotating and moving the perspective image acquisition unit 20 by the θ rotation driving device 26, the arrangement direction of the respective bumps 3 of the IC component 1 to be imaged and the reflecting surface of each mirror portion 22 of the perspective image acquisition unit 20 22a can be positioned in parallel with each other, and the perspective image can be obtained with certainty.

  Further, in the imaging inspection apparatus 100, the operation in each component, that is, the imaging operation by the imaging camera 10, the focus adjustment operation in the lens unit 12, the zoom operation, and the angle adjustment of each mirror unit 22 in the perspective image acquisition unit 20 are performed. The operation control, the light irradiation operation of the illumination unit 24, and the operation control of the θ rotation drive device 26, the X-axis drive device 14, the Y-axis drive device 16, and the drive operation by the Z-axis drive device 18 are integrated and associated with each other. An imaging inspection control device 9 is provided. Further, the imaging inspection control device 9 performs analysis processing of the image data captured by the imaging camera 10, that is, the planar image and the perspective image of each bump 3, and based on the analysis processing result of the planar image. The arrangement of each bump 3 on the mounting side surface S of the IC component 1 is recognized, and the height dimension of each bump 3 is recognized on the basis of the analysis result of the perspective image, and a predetermined predetermined value is obtained. By comparing the permissible range data with the respective recognition results, it is possible to inspect the arrangement and height dimension of each bump 3. The imaging inspection control device 9 can also recognize the collapse degree of the tip 3a of each bump 3 from the analysis processing result of the plane image, and the collapse degree is the same as the arrangement and height dimension. It is possible to perform inspections.

  In the imaging inspection apparatus 100 having such a configuration, an inspection method for inspecting the arrangement and shape of each bump 3 for each IC component 1 housed in the component tray 5 will be described. The main procedure in this inspection method is shown in the flowchart of FIG. 5, and a schematic plan view showing the positional relationship between the selected IC component 1 and the perspective image acquisition unit 20 at the time of imaging by the imaging camera 10 is shown. It is shown in FIG. In addition, each operation control described below is performed as an overall control by the imaging inspection control device 9 included in the imaging inspection device 100 in which the respective operations are associated with each other.

  First, in the imaging inspection apparatus 100 of FIG. 1, a component tray 5 in which a plurality of IC components 1 are accommodated is supplied to the tray arrangement unit 6 and is arranged and held. Next, one IC component 1 is selected as an inspection target from among the IC components 1 housed in the component tray 5 (step S1 in FIG. 5). Thereafter, the arrangement position of the selected IC component 1 is recognized (step S2). For example, in this type of IC component 1, images of at least two reference marks (not shown) that are normally provided on the mounting-side surface S for the purpose of recognizing the arrangement position are acquired by the imaging camera 10, By performing the image recognition process, the center position of the mounting side surface S in the IC component 1 and the rotation angle (rotation angle posture) around the center position can be recognized (calculated) (step S3). It should be noted that during the imaging for recognizing the arrangement position, the selected IC component 1 and the imaging camera 10 are aligned by driving the X-axis driving device 14 and the Y-axis driving device 16. However, it is only necessary to acquire the images of the respective reference marks, and high alignment accuracy as high as the alignment of the two for acquiring each perspective image described later is not required.

  Thereafter, the X axis direction or the Y axis direction of the imaging camera 10 by the X axis driving device 14 and the Y axis driving device 16 so that the optical axis P of the imaging camera 10 is positioned at the calculated center position of the mounting side surface S. And the respective mirror portions 22 in the perspective image acquisition unit 20 are arranged along the respective end portions of the selected IC component 1 based on the calculated rotation angle posture. The rotational drive device 26 performs the rotational movement around the optical axis P of the perspective image acquisition unit 20. As a result, the selected IC component 1 is aligned with the imaging system such as the imaging camera 10 and the perspective image acquisition unit 20 (step S4). The planar arrangement relationship between each mirror part 22 and the selected IC component 1 in the perspective image acquisition unit 20 in this state is as shown in FIG. That is, as shown in FIG. 6, from the upper side of the optical axis P, it is possible to obtain a planar image on the mounting side surface S of the IC component 1, that is, a planar image of each bump 3, A state in which the reflection surface 22a of the mirror portion 22 that captures the perspective image of the bump 3 for each row is arranged along the outer edge of each of the mounting-side surfaces S and outside thereof, and each perspective image can be acquired. It is said.

  After this alignment, the imaging camera 10 is moved in the Z-axis direction by the Z-axis drive device 18 and the lens unit 12 performs focus adjustment and zoom adjustment so that the entire imaging field of the imaging camera 10 (the entire imaging field is efficient). The entire mounting side surface S of the IC component 1 is arranged so that it can be used in a practical manner. Thereafter, a planar image that is an image of the entire mounting surface S of the IC component 1 is incident on the lens unit 12 along the optical axis P, and is formed on the imaging camera 10 by the lens unit 12, thereby Imaging is performed (step S5). The captured planar image G2 is shown in the schematic plan view shown in FIG. As shown in FIG. 7, the image is captured so that the entire mounting surface S of the IC component 1 is within the entire imaging field of view R. The captured planar image G2 is input from the imaging camera 10 to the imaging inspection control device 9, and analysis processing is performed. Further, the imaging inspection control device 9 inspects the arrangement position of each bump 3 on the mounting side surface S based on the analysis processing result (step S7). In the inspection of the arrangement position, for example, the formation position of each bump 3 is calculated from the plane image G2 as absolute position coordinates, and the calculation result is set in advance for each bump arrangement position data (for example, By comparing with the design data, it is possible to calculate the difference and determine whether the difference is within a predetermined allowable range.

  After the planar image is captured in step S5, the lens unit 12 captures the respective perspective images to be performed next regardless of whether or not the analysis of the planar image in step S7 is started. The imaging field of view of the camera 10 is enlarged. Specifically, as shown in FIG. 8, the image is acquired by the respective mirror units 22 of the perspective image acquisition unit 20 and is refracted and formed on the imaging camera 10 through the lens unit 20 from the inclined direction. The perspective images G1 of the bumps 3 for each of the columns are simultaneously arranged along the periphery of the enlarged imaging field of view R, and a planar image is arranged on the inner side surrounded by the respective perspective images G1. In addition, the imaging field of view R is enlarged. Thereafter, in the enlarged imaging field of view R, each perspective image G1 is collectively captured by the imaging camera 10 through each mirror unit 22 and the lens unit 12 (step S6). When each perspective image G <b> 1 is captured, light irradiation for imaging is performed from the fiber illumination 24 a of each illumination unit 24 toward each bump 3. In addition, the angle of each of the mirror unit 22 and the illumination unit 24 is adjusted in advance by the drive device (not shown) so that each perspective image G1 can be acquired at an optimal angle. However, if necessary, a fine angle adjustment may be performed immediately before each perspective image G1 is captured in order to perform further optimum angle adjustment. In addition, it is preferable that the magnification of the perspective image at each mirror unit 22 is a magnification that enables collective imaging within the enlarged imaging field of view R. Such a magnification can be determined in a range of about 1 to 3 times, for example.

  Each of the captured perspective images G1 is input from the imaging camera 10 to the imaging inspection control device 9 and subjected to analysis processing. Further, the imaging inspection control device 9 performs shape inspection of each bump 3, specifically, for example, inspection of height dimension based on the analysis processing result (step S8). In the inspection of the height dimension, for example, the height dimension of the bump 3 is calculated from the perspective image while taking into consideration the enlargement ratio (or conversion value) of the mirror portion 22 and the calculation result is set in advance. The difference is calculated by comparing with the height dimension data (for example, design data) of each of the bumps 3 to determine whether or not the difference is within a predetermined allowable range.

  After the respective perspective images G1 are captured in step S6, the next IC component 1 accommodated in the component tray 5 regardless of whether or not the analysis of each perspective image G1 in step S8 is started. Is determined as to whether or not is selected as an inspection target (step S9). When the next IC component 1 is selected as the inspection target, the IC component 1 is selected in step S1. Thereafter, the above-described steps S2 to S8 are sequentially performed, and the selected IC component 1 is inspected.

  On the other hand, if it is determined in step S9 that the IC component 1 to be selected next does not exist, the inspection for the IC component 1 accommodated in the component tray 5 is completed.

  In the inspection method described above, when the planar image G2 on the mounting side surface S of the IC component 1 is captured and then the perspective image G1 of each bump 3 is captured, that is, the inspection of one IC component 1 is performed. For this reason, the case where two images are acquired has been described. However, the present embodiment is not limited to such a case. Instead of such a case, for example, the acquisition of the planar image G2 and the acquisition of the respective perspective images G1 may be simultaneously performed at the same time. In the case where the resolution of the imaging camera 10 and the optical system related thereto is sufficiently ensured, the images (for example, the planar image G2 shown in FIG. This is because sufficient analysis can also be performed based on the combined image with the perspective image G1), that is, the planar image G2 acquired smaller than in the case of twice imaging. By performing such collective imaging, the time required for the inspection of the IC component 1 can be shortened, and a more efficient inspection method can be provided.

  In the description of the procedure of the inspection method described above, the placement of each bump 3 on the mounting surface S of the IC component 1 is inspected based on the captured planar image G2, and the captured perspective image G1. Based on the above, the case where the height dimension inspection is performed as the shape inspection of each bump 3 has been described, but the present embodiment is not limited to such a case. For example, along with such an inspection, based on the analysis processing result of the planar image G2, whether or not each bump 3 is formed and a positional shift relative to the electrode of the IC component 1 (for example, formed on the electrode). The protrusion of the electrode is generated from the bump 3), and further, the degree of collapse of the tip 3 a of each bump 3 (for example, the area or diameter of the tip of the bump 3 is measured). Can be performed). Further, based on the analysis processing result of the perspective image G1, the contour shape of each bump 3 can be inspected. Note that, as shown in FIG. 9, for example, as shown in FIG. 9, a substantially circular flat surface 3c generated by the crushing of the tip 3a is used as the determination criterion in the crushing degree of the tip 3a of each bump 3 based on the analysis processing result of the plane image G2. If it is determined that the diameter dimension of the bump 3 is 20 μm or more, it can be determined that the bump 3 has a defective shape. Alternatively, when it is determined that the shape of the tip portion 3a has a width equal to or larger than a certain number of pixels, it may be determined that the bump 3 has a defective shape.

  In addition, when the crushing degree of the tip 3a of each bump 3 is inspected based on the plane image, the height dimension of each bump 3 is also inspected by each perspective image. You can also. Furthermore, only when it is determined that the crushing degree is good and the height dimension inspection is good, it is comprehensive that the shape inspection of each bump 3 in the IC component 1 is acceptable. Judgment can also be made. By performing such an inspection, a more strict inspection of the bump can be performed.

  Further, in the description of the procedure of the inspection method described above, after obtaining the planar image G2, regardless of the examination result obtained by analyzing the planar image G2, the respective perspective images G1 are obtained. Although the case where inspection by analysis is performed has been described, the present embodiment is not limited to such a case. Instead of such a case, the inspection result of the planar image G2 may be associated with the imaging processing of each perspective image G1. For example, it may be a case where a detailed inspection is performed by further enlarging the perspective image G1 of the bump 3 whose shape or the like is determined to be suspicious based on the inspection result of the planar image G2, and performing image acquisition. By performing such an inspection, the accuracy of the inspection can be improved.

  Further, in the above-described inspection method, when the obtained perspective image G1 is analyzed, the magnification (or conversion value) of each perspective image G1 is taken into consideration. This is a numerical value that is directly affected by the displacement of the formation position of each bump 3 on the mounting surface S. Therefore, the enlargement factor based on the positional deviation amount is corrected using the obtained analysis result of the planar image G2, and the analysis processing based on the perspective image G1 is performed using the corrected enlargement factor. In this way, the analysis processing result of the planar image G2 can be associated with the analysis processing of each perspective image G1. By performing this association, the inspection accuracy can be further improved. Note that such correction of the enlargement ratio may be performed for each row of the bumps 3, or when higher inspection accuracy is required, the enlargement ratio for each individual bump 3. It may be a case where the correction is performed.

  Further, in the above-described perspective image acquisition unit 20, a case has been described in which each mirror portion 22 is provided in order to reflect the perspective image G1 of each bump 3 in the direction along the optical axis P. However, the present embodiment is not limited to such a case. Instead of such a case where the mirror unit 22 is provided, a cylindrical lens, for example, a plurality of prisms (prism lenses) 32 may be used as shown in the schematic explanatory diagram of FIG. . As shown in FIG. 10, the prism 32 is arranged toward each row of bumps 3 to be imaged, and an image incident surface 32 a on which a perspective image is incident, and an incident on the prism 32. The projected perspective image refracts and reflects the image exit surface 32b emitted toward the lens unit 12 and the image entered from the image entrance surface 32a inside the prism 32 so that the image exit surface 32b can exit. It is formed in a substantially triangular prism shape by a refracting surface (or may be a case of a refractive reflecting surface) 32c. Further, in addition to the function of refracting and reflecting the perspective image on each prism 32, it is also possible to acquire an image of the enlarged perspective image by further providing a function of enlarging the perspective image. Thus, each mirror unit 22 has substantially the same function. Further, as the cylindrical lens, various types of optical lenses such as a convex lens, a concave lens, or a combination lens of both can be used. Note that such a cylindrical lens can be formed of an optically used material such as optical glass or synthetic quartz.

  Further, in the inspection method described above, as shown in FIG. 10, the surface S on the mounting side of the IC component 1 in the vicinity of the arrangement position of each mirror part 22 or prism 32 by each mirror part 22 or each prism 32. Although the case where the perspective image of each bump 3 arranged in the end of each is acquired was explained, this embodiment is not limited only to such a case. Instead of such a case, for example, as shown in the schematic explanatory view of FIG. 11, each bump arranged at the end opposite to the end near the arrangement position of each mirror 22 or prism 32. 3 may be obtained. In the case of acquiring the perspective image on the opposite side in this way, it is ensured that the perspective image is blocked by the edge portion 5a of the component tray 5 when acquiring each perspective image. The inclination angle in the inclined direction can be made closer to the horizontal direction, and the measurement accuracy of the height dimension of each bump 3 can be improved. It is possible to obtain the effect.

  According to the first embodiment, the following various effects can be obtained.

  First, the planar image G2 of the mounting-side surface S on which each bump 3 is formed with respect to the IC component 1 in which the flatness of the tip 3a of each bump 3, that is, the formation height dimension is a problem. In addition, the perspective image G1 of each bump 3 is also acquired, and the arrangement position and shape of each bump 3 are inspected based on the planar image G2 and each perspective image G1, The inspection of each bump 3, particularly the inspection accuracy of the formation height can be improved.

  Further, in the imaging inspection apparatus 100, the images of the respective bumps 3 are acquired as the respective perspective images from the direction inclined from the direction orthogonal to the mounting-side surface S, and the acquired respective perspective images are orthogonally crossed. A perspective image acquisition unit 20 that is refracted or reflected along a direction to be focused and forms an image on the imaging camera 10 through the lens unit 12, and further, the imaging camera 10 can also acquire the planar image. Accordingly, it is possible to acquire a planar image and respective perspective images with one imaging camera 10. Therefore, efficient image acquisition can be performed without increasing the apparatus cost of the imaging inspection apparatus 100.

  Further, the image for inspecting the height dimension of each bump 3 is the perspective image acquired from the inclined direction, so that the image of each bump 3 is acquired from the side. Thus, image acquisition can be performed reliably. For example, in the case where an image is acquired from the side, the influence of illumination that illuminates the bump 3 at the opposite end or the image of the bump 3 at the opposite end is acquired. In such a case, it may be difficult to obtain a smooth image. However, since the perspective image is obtained from the inclined direction, such a problem is caused. Can be prevented and smooth image acquisition can be realized.

  Further, in such an imaging inspection apparatus 100, the acquisition of the planar image and the acquisition of the respective perspective images can be performed by adjusting the size of the imaging field of view by the lens unit 12, and thus It can be said that the efficiency of image acquisition is also achieved from the viewpoint.

  In addition, since the reflection surface 22a of each mirror portion 22 provided in the perspective image acquisition unit 20 is formed in a convex shape, the respective mirror portions 22 reflect the perspective images of the respective bumps 3, and The perspective image can be enlarged in the height direction. In this way, the respective perspective images are enlarged in the height direction of the bumps 3 and acquired by the imaging camera 10 in this state, whereby the heights of the respective bumps 3 based on the acquired perspective images are obtained. Dimensional inspection can be performed with higher accuracy.

  Further, the perspective image acquisition unit 20 is provided with a drive device that varies the angle of the reflection surface 22a in each mirror portion 22, so that the IC component 1 of various sizes, thicknesses, or shapes can be inspected. It becomes possible to respond flexibly.

  Further, the alignment of the optical axis P of the imaging camera 10 for imaging the planar image G2 and the perspective image G1 of each bump 3 and the center of the IC component 1 accommodated in the component tray 5 to be imaged is as follows. Since the imaging camera 10 is moved in the X-axis direction or the Y-axis direction in the drawing by the X-axis driving device 14 and the Y-axis driving device 16 with the component tray 5 fixed, the movement of the component tray 5 There is no case that the IC component 1 accommodated is misaligned. In such a component tray 5, the IC component 1 is placed in the recess to accommodate the component tray 5, but a gap of about 1 mm exists between the recess and the IC component 1, for example. Even if such a gap exists, if the component tray 5 itself does not move, it is possible to reliably prevent the occurrence of the positional deviation.

(Second Embodiment)
In addition, this invention is not limited to the said embodiment, It can implement with another various aspect. For example, a method for inspecting a semiconductor component according to the second embodiment of the present invention will be described below.

  The inspection method according to the second embodiment is to perform inspection based on the analysis processing result by acquiring a planar image and a perspective image of the IC component 1 as an inspection target and performing analysis processing of each image. The point is the same as the inspection method of the first embodiment, but is different from the inspection method of the first embodiment in that each perspective image can be acquired more efficiently. Hereinafter, this difference will be mainly described. Note that the inspection method of the second embodiment is performed by the imaging inspection apparatus 100 used in the first embodiment.

  First, before describing the inspection method of the second embodiment, as an image captured by the inspection method of the first embodiment, a combined image of the planar image G2 and each perspective image G1 shown in FIG. Focus on it. The image shown in FIG. 8 is configured by a perspective image G1 along four ends and a planar image G2 disposed inside the perspective image G1 so as to be surrounded by each perspective image G1 in one enlarged imaging field of view. ing. However, since the length of each perspective image G1 is substantially the same as the length of the end portion of the planar image G2, the four corner regions in the imaging field of view R are not used for imaging. By improving, it becomes possible to further improve the efficiency of imaging. The inspection method of the second embodiment focuses on this point.

  In the inspection method of the second embodiment, first, as in the case of the first embodiment, the planar image G2 of the mounting side surface S of the IC component 1 is acquired. Thereafter, as shown in the schematic plan view of FIG. 12, a combined image of the planar image G2 of the mounting side surface S and the perspective images G3 arranged on the two sides facing each other is obtained.

  Here, as shown in FIG. 12, each perspective image G3 is enlarged in the height direction of each bump 3, and is also enlarged in the arrangement direction. Thereby, each perspective image G3 can be acquired by effectively using the vicinity of the corner of the imaging field of view R. Further, by analyzing the acquired planar image G2 and each perspective image G3, the arrangement position and formation height dimension of each bump 3 are inspected based on the analysis result. Note that, after the above-described two-sided perspective images G3 are captured, another two-sided perspective images G3 are captured.

  According to the inspection method of the second embodiment, it is possible to acquire the enlarged perspective image G3 by using the imaging field of view R of the imaging camera 10 to its corners, and to perform efficient image acquisition. Can do. Each acquired perspective image G3 is enlarged not only in the height direction of each bump 3 but also in the arrangement direction thereof, so that the enlargement ratio of each bump 3 can be set larger. This makes it possible to perform an accurate inspection with a small resolution.

(Third embodiment)
Next, a semiconductor component inspection method according to the third embodiment of the present invention will be described. The inspection method of the third embodiment further improves the efficiency of each perspective image acquisition form in the inspection method of the second embodiment. In addition, the inspection method of the third embodiment is performed by the imaging inspection apparatus 100 used in the first embodiment.

  First, as in the inspection methods of the first embodiment and the second embodiment, an imaging acquisition of the planar image G2 of the mounting side surface S of the IC component 1 is performed. Thereafter, as shown in the schematic plan view of FIG. 13, the imaging field of view R is enlarged, and the respective perspective images G4 for the respective end portions (four ends) are arranged on the periphery of the imaging field of view R, The planar image G2 and the respective perspective images G4 are acquired so that the planar image G2 is arranged so as to be surrounded by the four perspective images G4.

  Here, as shown in FIG. 13, each perspective image G <b> 4 is enlarged in the height direction of each bump 3 and also in the arrangement direction thereof. Further, at the respective corners in the imaging visual field R, the enlargement direction of the images in the arrangement direction of the respective perspective images G4 is determined so that the adjacent perspective images G4 do not interfere with each other. Specifically, as shown in FIG. 13, a method is adopted in which an end portion on the clockwise side in the perspective view of each perspective image G4 is fixed as a reference position and enlarged toward the end portion on the counterclockwise direction in the drawing. Thus, the image is enlarged in the arrangement direction. In addition, it may replace with the above cases, and may be a case where the edge part used as the said reference position is made into the counterclockwise side edge part.

  Thereafter, by analyzing the obtained planar image G2 and each perspective image G4, the arrangement position and the formation height dimension of each bump 3 are inspected based on the analysis result.

  According to the inspection method of the third embodiment, it is possible to acquire the enlarged perspective image G4 by using the imaging field of view R of the imaging camera 10 to the corners, and to obtain each of the four end portions. The perspective images G4 can be picked up collectively. Therefore, efficient image acquisition and high-precision inspection based on the enlarged image can be realized together.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

It is a model perspective view which shows the structure of the imaging inspection apparatus concerning 1st Embodiment of this invention. FIG. 3 is a schematic perspective view of an IC component to be inspected in the first embodiment. FIG. 3 is a schematic enlarged view of bumps in the IC component of FIG. 2. It is a model perspective view which shows the structure of the perspective view acquisition unit with which the imaging inspection apparatus of FIG. 1 is provided. It is a flowchart which shows the procedure of the inspection method of the said 1st Embodiment. FIG. 6 is a schematic plan view showing a state in which the IC component to be inspected and the perspective image acquisition unit are aligned in the inspection method of the first embodiment. It is a model top view of the plane image of the mounting side surface of IC components. It is a schematic plan view of the image comprised combining the said planar image of IC components, and each perspective image. FIG. 4 is a schematic enlarged view of the bump showing a state in which the tip end portion is crushed in the bump of FIG. 3. It is a schematic explanatory drawing which shows the state which acquires the perspective image of the bump arranged in the vicinity edge part by each prism of a perspective image acquisition unit. It is a schematic explanatory drawing which shows the state which has acquired the perspective image of the bump arranged in the far end part by each prism of the perspective image acquisition unit. It is a model top view of the image acquired in the inspection method of the IC component concerning a 2nd embodiment of the present invention, and the picture constituted by a plane image and each perspective image. It is a model top view of the image acquired in the inspection method of IC components concerning a 3rd embodiment of the present invention, and the picture constituted by a plane image and each perspective image. It is a model explanatory drawing of the inspection method of the conventional IC component. It is a schematic plan view of an IC component which is an inspection object in the conventional inspection method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC component 3 Bump 3a Pointed part 3b Bottom part 5 Component tray 6 Tray arrangement | positioning part 9 Imaging inspection control apparatus 10 Imaging camera 12 Lens unit 14 X-axis drive device 16 Y-axis drive device 18 Z-axis drive device 20 Perspective image acquisition unit 22 Mirror Unit 24 illuminating unit 26 θ rotation driving device 32 prism 100 imaging inspection devices G1, G3, G4 perspective image G2 plane image P optical axis R imaging field of view S mounting side surface

Claims (20)

In a semiconductor component having a plurality of protruding electrodes formed so as to have a substantially conical shape on a plurality of electrodes on the surface on the mounting side on the substrate, an image of each of the protruding electrodes is obtained and analyzed. Thus, there is a semiconductor component inspection method for inspecting each of the protruding electrodes,
A planar image of each of the protruding electrodes is obtained from a direction substantially orthogonal to the mounting side surface, and a perspective image of each of the protruding electrodes is acquired from a direction inclined from the substantially orthogonal direction,
A method for inspecting a semiconductor component, comprising: inspecting each protruding electrode by analyzing the shape of each protruding electrode based on the planar image and the perspective image.   The inspection of each of the protruding electrodes is performed based on the planar image, and the inspection of the arrangement of the protruding electrodes along the surface on the mounting side is performed, and the height dimension of each of the protruding electrodes is determined based on the perspective image. The method of inspecting a semiconductor component according to claim 1, wherein the inspection is performed.   Each of the protruding electrodes is inspected based on the planar image for the degree of collapse of the tip of the substantially conical shape of each protruding electrode, and based on the perspective image, the height of each protruding electrode is measured. 2. The method for inspecting a semiconductor component according to claim 1, wherein the inspection of the length is performed. The semiconductor component has a substantially square shape, and the respective protruding electrodes are arranged in a line along the respective ends of the substantially square shape on the mounting side surface,
4. The method for inspecting a semiconductor component according to claim 1, wherein the perspective image is acquired for each row of the respective protruding electrodes along the respective end portions.   The respective perspective images are refracted in a direction substantially orthogonal to the mounting-side surface, and the respective perspective images are collectively acquired as one image along the substantially orthogonal direction. Inspection method of the semiconductor component of description. The entire mounting side surface of the semiconductor component is arranged in an imaging field, and the planar image of each protruding electrode is obtained in the imaging field,
The semiconductor component inspection method according to claim 5, wherein the imaging field of view is enlarged, and the respective perspective images are simultaneously arranged in the enlarged imaging field of view and are collectively acquired as the one image. Based on the planar image, the center position of the semiconductor component and the rotation angle around the center position are calculated,
7. The imaging positions of the respective perspective images are determined by aligning the enlarged imaging field of view with the mounting side surface of the semiconductor component based on the calculated center position and rotation angle. Inspection method of the semiconductor component as described in 2.   The perspective image is an enlarged image of each protruding electrode, and the height dimension of each protruding electrode in the enlarged image is converted into an actual height dimension to analyze the shape of each protruding electrode. And performing the conversion in consideration of the calculated positional deviation amount based on the planar image when calculating the positional deviation amount of the respective protruding electrodes along the mounting-side surface. 8. A method for inspecting a semiconductor component according to any one of 1 to 7.   The method for inspecting a semiconductor component according to claim 8, wherein the enlarged image is an image in which each protruding electrode is enlarged in a height direction.   The method for inspecting a semiconductor component according to claim 9, wherein the enlarged image is an image in which the protruding electrodes are further enlarged along the arrangement direction.   11. The respective perspective images of the respective protruding electrodes are images from a direction inclined at an angle in a range of 30 to 60 degrees with respect to a direction substantially orthogonal to the mounting side surface. The inspection method of the semiconductor component as described in any one. In a semiconductor component having a plurality of protruding electrodes formed so as to have a substantially conical shape on a plurality of electrodes on the surface on the mounting side on the substrate, an image of each of the protruding electrodes is obtained and analyzed. Thus, a semiconductor component inspection apparatus for inspecting each of the protruding electrodes,
A component placement section where the semiconductor component is placed;
An imaging element that is disposed to face the component placement unit and has an optical axis that is disposed in a direction substantially orthogonal to the mounting-side surface, and that captures an image incident along the optical axis;
A perspective image refracting section that refracts a perspective image of each protruding electrode from a direction inclined from the substantially orthogonal direction in a direction along the optical axis;
An imaging unit that causes the planar image of each protruding electrode from the optical axis direction and the perspective image refracted by the perspective image refracting unit to be incident along the optical axis to form an image on the imaging element; ,
The image pickup device, the perspective image refracting portion, and the image forming portion are moved along the mounting side surface while maintaining the mutual arrangement relationship, and the approximate center of the mounting side surface for the imaging and the light are moved. An imaging positioning device for aligning with the shaft;
An imaging inspection control apparatus that inspects each protruding electrode by analyzing the shape of each protruding electrode based on the planar image and the perspective image acquired by being imaged on the imaging element. A semiconductor component inspection apparatus comprising:   The imaging inspection control device inspects the arrangement of the respective protruding electrodes on the surface on the mounting side based on the planar image, and inspects the height dimension of the respective protruding electrodes based on the perspective image. The apparatus for inspecting a semiconductor component according to claim 12 to be performed.   The imaging inspection control device inspects the crushing degree of the tip of the substantially conical shape in each projection electrode based on the planar image, and the height dimension of each projection electrode based on the perspective image. 13. The semiconductor component inspection apparatus according to claim 12, wherein the inspection is performed. The semiconductor component has a substantially square shape, and the protruding electrodes are arranged in a line along the four ends of the substantially square shape on the surface on the mounting side.
The four perspective images arranged near the four ends and individually refracting the respective perspective images so as to be incident on the imaging portion for each row of the respective protruding electrodes along the respective ends. 15. The semiconductor component inspection apparatus according to claim 12, further comprising a refracting portion.   The said perspective image refracting part has an angle adjustment means which adjusts a refraction angle according to arrangement | positioning of each said protruding electrode, or the shape of the said semiconductor component, It is any one of Claim 12 to 15 Inspection equipment for semiconductor parts.   The squint image refracting unit includes an illuminating unit that irradiates light from the inclined direction to each of the protruding electrodes that are targets of the squint image. Inspection apparatus of the described semiconductor component.   The semiconductor device inspection apparatus according to claim 12, wherein the perspective image refracting unit refracts the perspective image and enlarges the perspective image in a height direction of each protruding electrode. In the semiconductor component, the protruding electrodes are arranged in a line along the substantially square ends of the mounting surface.
19. The semiconductor component inspection apparatus according to claim 12, wherein the perspective image refracting unit refracts the perspective image and expands the perspective image in an arrangement direction of the respective protruding electrodes. 20. The semiconductor component inspection apparatus according to claim 18, wherein the perspective image refracting unit is a convex mirror or a cylindrical lens that enlarges and refracts the perspective image.

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