JP2005225904A - Method for joining matter to be adhered to adherend, joint structure and joining apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for joining a matter to be adhered to an adherend which permits highly accurate positioning by suppressing dislocation caused by shrinkage on curing of an energy-curable adhesive as much as possible by a simple apparatus constitution regardless of adhesion forms or the like, its joint structure and a joining apparatus therefor. <P>SOLUTION: In the method for joining the matter to be adhered to the adherend comprising joining the matter 2 to be adhered to the adherend 1 using the energy-curable adhesive 3 after highly accurately positioning the adherend 1 and the matter 2 to be adhered, the change amount of the volume caused by shrinkage on curing of the energy-curable adhesive 3 is compensated for. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for bonding an adherend to an adherend and an adhesive, a bonding structure used for the bonding method, and a bonding apparatus.

Optical parts such as lenses, diffraction gratings, mirrors, etc., optical components such as solid-state image sensors such as light receiving elements, light emitting elements, CCDs, etc. Techniques for joining a certain adhesive have been conventionally proposed (see, for example, Patent Documents 1 to 10).
In Patent Document 1, a support reference point for supporting a lens is provided, and the displacement of the lens in the mounting direction caused by the shrinkage of the adhesive is reduced, thereby improving the lens mounting accuracy and satisfying desired optical characteristics. Disclosure.
Patent Document 2 discloses providing a projector and an optical apparatus with improved optical performance by accurately determining the relative positions of a plurality of reflecting mirrors and bonding them in that state.
In Patent Document 3, the optical lens is held in the inner hole of the metal holder, the low-melting glass is applied to both gaps, heated to a temperature at which the low-melting glass melts, and then slowly cooled, It is disclosed to provide a lens component with good welding workability, high reliability of the hermetic sealing portion of the optical lens, and good optical characteristics.
Patent Document 4 discloses providing an optical member with less internal distortion due to linear shrinkage and accompanying optical performance degradation by using an adhesive having a low linear shrinkage rate during adhesive curing.
Patent Document 5 uses an adhesion method capable of adhering a plurality of members with high positional accuracy with a UV curing adhesive without reducing productivity by changing the irradiation intensity and curing, and this method. Disclosed is a method for manufacturing an optical head device.

Patent Document 6 discloses that the bonding efficiency of the optical member is improved while maintaining the surface accuracy by making the UV irradiation intensity uniform.
Patent Document 7 discloses that a filler having a uniform particle size and density is added to devise so that the volume change due to curing shrinkage and temperature change of the adhesive itself is reduced.
In Patent Document 8, an ultraviolet curable adhesive is filled between the holding member and the collimator lens, and after temporarily fixing by irradiating ultraviolet rays to a minute region using a condensing function as a cylindrical lens on the side of the collimator lens, It is disclosed that deterioration of the work fixing accuracy after bonding is prevented by irradiating the entire surface by using a light diffusing action as a cylindrical lens on the side surface of the collimator lens and performing main curing.
Patent Document 9 discloses that an ultraviolet curable adhesive is ejected in a plurality of times and is cured for each layer to increase the energy conversion efficiency of the curing reaction and prevent deterioration of the work fixing accuracy after bonding due to thermal deformation. doing.
In Patent Document 10, an ultraviolet curable adhesive is filled between the holding member and the collimator lens, and the collimator lens irradiates the ultraviolet rays to form parallel light, and uniformly irradiates the work fixing accuracy after bonding. It is disclosed to prevent.
In addition, after curing one energy curable adhesive, the technology to prevent misalignment due to curing shrinkage as much as possible is also studied by stiffening other energy curable adhesives by shifting the curing timing. .
JP 07-175000 A JP 2003-57529 A Japanese Patent Laid-Open No. 08-313779 JP 2002-362948 A JP 2003-183597 A JP 2001-350072 A JP-A-10-121013 Japanese Patent Laid-Open No. 09-243966 JP-A-10-007991 Japanese Patent No. 3375429

By the way, as an adhesive for adhering an adhesive to an object to be bonded such as conventional component bonding, an energy curable adhesive such as a thermosetting type or a light curable type is known, and some of these properties are known. Some of them have Since these energy curable adhesives have a high reaction speed and a short curing time, they are used in various fields for the purpose of improving the efficiency of the production process.
However, in this energy curable adhesive, volume shrinkage (curing shrinkage) occurs when it is cured, and stress (curing shrinkage force) is generated along with this hardening shrinkage. Generally, an acrylic ultraviolet curable resin is cured and shrunk by about 5 to 10%, and an epoxy ultraviolet curable resin is about 2 to 5%, and a curing shrinkage force is generated in proportion to the amount of curing shrinkage.
This curing shrinkage force causes only a slight decrease in strength in terms of adhesive strength, but does not have a significant effect, but it is highly accurate especially in parts joining, in that it causes a positional shift between the adherend and the adhesive. This is a serious problem in precision assembly that requires position adjustment.
That is, in the precision assembly process, after adjusting the position of the adhesive to the adherend strictly, the adjusted position is affected by the curing shrinkage of the energy curable adhesive that joins the adherend and the adhesive. If there is a deviation, the function of the precision assembly may be hindered.
In order to avoid such a problem, the following techniques are disclosed. First, in the first technology, forcibly hardened by fixing the adhesive and the object to be adhered with a support pillar provided on the object to be adhered or a jig or tool, and curing the energy ray curable adhesive. There has been proposed a method that does not cause contraction (see, for example, Patent Documents 1 and 2).
In the second technique, the energy beam curable adhesive itself is modified, and instead of the energy beam curable adhesive, a low melting glass is used, ceramic fine particles are added, or a filler is added. There have been proposed methods for reducing the amount of cure shrinkage as much as possible by using a low molecular weight material having a low cure shrinkage (see, for example, Patent Documents 3, 4, and 7).
In the third technique, the UV light to be irradiated is condensed and temporarily fixed, and then fixed as a divergent light, the one that is cured every time the photo-curing adhesive is applied, and the deviation due to thermal deformation is suppressed, There has been proposed a method of adjusting the position of a lens or the like after semi-curing to perform main curing (see, for example, Patent Documents 5, 8, and 9).
In the fourth technique, there is a method for controlling the UV light to be irradiated, and a method for controlling the UV light to be irradiated so as to eliminate variation and improve the uniformity of curing shrinkage has been proposed (for example, Patent Document 6 and Patent Document 6). 10).

However, the disclosure described in Patent Document 1 of the first technique assumes surface adhesion, for example, when an energy ray curable adhesive is thick and requires a large amount for multiaxial adjustment or the like. Cannot be used and the bonding form is limited. Moreover, it is restricted to the structure of the adherend.
On the other hand, the technique described in Patent Document 2 must strictly manage the accuracy of the jigs and tools prepared in advance, and corrects the object to be adhered and the adhesive so as not to move. The curing stress remains, and it is expected that the relative position between the adhesive and the bonded material cannot be maintained or cannot be maintained by a heat test or the like.
Moreover, in patent document 3 which is the 2nd technique, although low melting glass is used instead of energy ray hardening method adhesives, melting | fusing point has a melting | fusing point rather than glass like a plastics etc. Not applicable for low materials.
In the technique described in Patent Document 7, generally used fillers have a larger specific gravity (ceramics, metal powder, etc.) than the energy beam curable adhesive, and a large amount of the adhesive is applied. Causes uneven curing shrinkage, and changes the relative distance between the adherend and the adherend.
Furthermore, in the technique described in Patent Document 4, the bonding form is basically limited to surface bonding. In addition, since the molecular weight is low compared to a general energy ray curable adhesive, the adhesive has a low modulus of elasticity after curing, or in order to increase the adhesive strength, the surface on at least one of the adherend and the adhesive It is necessary to perform processing.
Moreover, in patent document 8 which is the 3rd technique, even if it temporarily fixes by condensing first, since the hardening shrinkage force at the time of the main fixing by a diverging light is large, there exists a problem that position shift will become large. .

On the other hand, in the technique described in Patent Document 9, curing shrinkage other than thermal deformation is not taken into account, and the amount of cure shrinkage accumulates every time it cures. Become.
In the technique described in Patent Document 5, unreacted monomers and polymers are often present, and it is expected that the relative position between the adhesive and the adhesive cannot be maintained or cannot be maintained by a heat test or the like.
And in the technique described in Patent Documents 6 and 10 as the fourth technique, if the amount of the energy ray curable adhesive is increased, the amount of curing shrinkage increases in proportion to this, and the positional deviation increases accordingly. It cannot be said that it is suitable for adhesive forms that require a large amount of energy ray curable adhesive, and the addition of an additive reduces the light transmittance and increases the amount of energy to be cured. There may be a need.
In consideration of these effects, research is also conducted on a method using multiple layers of energy curable adhesive that cures one energy curable adhesive and then cures the other energy curable adhesive by shifting the curing timing. Has been.
However, if this method is used, precise positioning is possible, but a process of applying a plurality of energy curable adhesives is required, or other energy curable adhesives are not given curing energy. There are extra steps, and it takes time for the bonding process, and an extra device is required.
The object of the present invention is to enable high-precision alignment by suppressing the displacement due to curing shrinkage of the energy-curable adhesive as much as possible regardless of the bonding form, etc., with a simple apparatus configuration in consideration of the above-described circumstances. An object of the present invention is to provide a bonding method between an adherend and an adhesive, a bonding structure, and a bonding apparatus.

In order to solve the above-mentioned problem, the invention according to claim 1, after positioning the adherend and the adhesive with high accuracy, using an energy curable adhesive, the adhesive is attached to the adherend. In the bonding method of the adherend to be bonded and the bonded material, a volume shrinkage change amount due to curing shrinkage of the energy curable adhesive is compensated.
Further, in the invention according to claim 2, after the object to be bonded and the bonded object are positioned with high accuracy, the object to be bonded is bonded to the object to be bonded using an energy curable adhesive. In an object bonding structure, an adhesive layer in which a core material and a microcapsule made of a capsule wall surrounding the core material are encapsulated is formed in the energy ray curable adhesive, and the microsphere is formed by curing shrinkage of the energy curable adhesive. The capsule is deformed and expanded.
In the invention according to claim 3, the microcapsule is deformed / expanded when the capsule wall is broken by any one of pressure, heat, and light, and the core material flows out or expands to expand the core material, The bonding structure according to claim 2, which compensates for a volume shrinkage change due to curing shrinkage of the energy curable adhesive.
The invention according to claim 4 is characterized in that the joining structure according to claim 2 or 3 uses gas as the core substance.
The invention according to claim 5 is characterized in that the joined structure according to any one of claims 2 to 4, wherein the internal pressure of the microcapsule is made equal to the external pressure after joining.

According to a sixth aspect of the present invention, a microcapsule composed of a core substance and a capsule wall surrounding the core substance is encapsulated in an energy ray curable adhesive, and a volume shrinkage change amount due to curing shrinkage of the energy curable adhesive is measured. The joining method according to claim 1, wherein the microcapsule is compensated by deformation and expansion.
According to a seventh aspect of the present invention, the capsule wall is broken by any of pressure, heat, and light, and the core material flows out or expands, and the core material also expands and deforms and expands. The bonding method according to claim 6, wherein a volume shrinkage change amount due to curing shrinkage of the agent is compensated.
The invention according to claim 8 is the method according to claim 6 or 7, wherein a gas is used as a core material to deform and expand a volume shrinkage change amount due to cure shrinkage of the energy curable adhesive. Features a joining method.
The invention according to claim 9 is characterized in that the joining method according to any one of claims 6 to 8, wherein the internal pressure of the microcapsule is made equal to the external pressure after joining.
The invention according to claim 10 is the energy curable adhesive in which a microcapsule is encapsulated in a bonding apparatus for bonding an object to be bonded to the bonded object using an energy curable adhesive. Application means for applying an agent, energy irradiation means for irradiating energy to cure the energy curable adhesive, energy irradiation control means for controlling on / off of the energy irradiation means, and A bonding apparatus including energy irradiation intensity control means for controlling irradiation intensity is characterized.

  According to the present invention, the shrinkage area of the adhesive accompanying cure shrinkage is supplemented by the microcapsules dispersed in the energy ray curable adhesive in advance, so that the adhesive portion does not substantially shrink in volume, and thus the adherend. It is possible to maintain the relative positions of the adhesive and the microcapsules are previously dispersed in the energy ray curable adhesive, so that no extra device is required.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic view showing a structure in which a microcapsule composed of a core substance and a capsule wall surrounding the core substance is encapsulated in an energy ray curable adhesive.
Energy curable adhesives (for example, light curable adhesives (UV curable adhesives, visible light curable adhesives), radiation curable adhesives, X-ray curable adhesives, etc.) are targeted.
Here, the reason for using an energy curable adhesive is that in the case of a thermosetting adhesive, it is necessary to apply heat in an oven or the like in order to cure it, which hinders improvement in production efficiency, Or, depending on the adhesive, heating may not be acceptable.
Further, in the case of an anaerobic curable adhesive, it is necessary to block air in order to cure the adhesive, which may limit the bonding form. Compared to this, the photo-curing adhesive does not have such a problem, and is easier to handle and practical than the thermosetting adhesive and the anaerobic curing adhesive.
Normally, when an adhesive is bonded to an object to be bonded with, for example, a UV curable adhesive, the adhesive is cured by applying the adhesive to the interface between the two members and irradiating it with UV (ultraviolet) light. Glued together.
When this adhesive is cured, a curing shrinkage phenomenon occurs, and as described above, a general acrylic ultraviolet curable resin contracts by about 5 to 10%, and an epoxy ultraviolet curable resin contracts by about 2 to 5%. When the adhesive is applied at a plurality of points, this curing shrinkage occurs at each adhesion point. And the tensile stress is produced by this hardening shrinkage.
In order to avoid this, in this embodiment, there is a bonding structure in which an object to be bonded and an adhesive aligned with the object to be bonded are bonded via an adhesive portion made of an energy curable adhesive. The adhesive portion replenishes the volume of cure shrinkage generated when the energy curable adhesive is cured by irradiating energy.
As a result, tensile stress associated with cure shrinkage is absorbed, so that this tensile stress does not propagate to the adherend, and the positional displacement of the adherend with respect to the adherend is prevented, thereby enabling extremely accurate adhesive bonding.

In FIG. 1, an adhesive structure 13 is shown, and a structure having an adhesive layer made of an adhesive 3 between the adherend 1 and the adhesive 2 is shown. Here, the bonding portion 3 has a structure in which the energy capsule curable adhesive 3a itself encloses the microcapsule 3b made of the core substance 12 surrounded (encapsulated) by the capsule wall 11.
For this reason, when the volume shrinkage due to the hardening shrinkage of the energy curable adhesive 3a is caused by the application of energy 9 such as UV light shown in FIG. 2, the microcapsule 3b compensates for the change by the deformation. Thus, it is possible to prevent the displacement of the adhesive 2 with respect to the adherend 1 and to perform extremely high-precision adhesive bonding.
2 shows a structure in which the microcapsule 3b shown in FIG. FIG. 2 illustrates a phenomenon in which the capsule wall 11 expands simultaneously with the volume shrinkage of the adhesive 3a due to the start of bonding. Here, tensile stress acts on the capsule wall 11 along with curing shrinkage, and the capsule wall 11 expands and the core substance 12 also expands. FIG. 3 shows the structure after joining in which the microcapsule 3b of FIG. 1 is encapsulated, but shows a state in which the capsule wall 11 of the microcapsule 3b is expanded as can be seen from part B.
More specifically, when the energy curable adhesive 3a is cured, a curing shrinkage force accompanying the curing shrinkage is generated. At this time, the microcapsule 3b is in a state of maintaining fluidity.
The energy curable adhesive 3a begins to harden and undergoes curing shrinkage, and tensile stress due to volume shrinkage occurs. Under such conditions, when volume shrinkage occurs, the amount of cure shrinkage generated by the hardening shrinkage of the microcapsule 3b is reduced. It will flow and deform to make up (replenish).
As described above, since the microcapsule 3b is deformed by flow and absorbs the tensile stress accompanying the curing shrinkage, the tensile stress does not propagate to the adherend 1 and the positional deviation of the adherend 2 with respect to the adherend 1 occurs. No (Figure 2).
Further, in such a bonding method, the object 1 and the adhesive 2 can be freely cured without hindering the curing shrinkage, so that no internal residual stress is generated. Since the internal residual stress is an important factor that causes a change over time, the change over time can be suppressed by suppressing the internal residual stress.

FIG. 4 shows a case of a joining structure that does not include a microcapsule for comparison with the present embodiment, and is a schematic diagram for comparison with FIG. FIG. 5 is a schematic view comparing the case of a joined structure not including microcapsules with FIG. 2, and the hatched portion is the volume after contraction. FIG. 6 is a schematic diagram comparing the case of a joining structure not including a microcapsule with FIG. 3, and the hatched portion is a volume after contraction, and a deviation width d is generated.
In such a joining structure, there is nothing that absorbs the tensile stress accompanying the curing shrinkage of the energy curable adhesive 3a, and this tensile stress propagates directly from the adhesive 2 to the adherend 1, so that the energy curable adhesive The amount of curing shrinkage that accompanies the curing of the agent 3a appears as it is as a positional deviation of the adhesive 2 with respect to the adherend 1, and a positional deviation with a large deviation width d occurs.
FIG. 7 is a schematic view showing a structure in which a microcapsule 3b composed of a core substance and a capsule wall surrounding the core substance is encapsulated in the same energy ray curable adhesive 3a as in FIG. FIG. 8 shows a structure in which the microcapsule 3b of FIG. 1 is encapsulated, and shows a state in which the capsule wall 11 expands simultaneously with the volume contraction of the adhesive 3a due to the start of bonding at part A. FIG. 9 shows a structure in which the microcapsules of FIG. 1 are enclosed. As can be seen from part B, the outline shows a state in which the core material in which the capsule wall 11 of the microcapsule 3b is broken and expanded is enclosed in the adhesive. FIG.
The material of the capsule wall 11 has a characteristic that can be collapsed by pressure due to curing shrinkage generated during the curing reaction, reaction heat, or light when irradiated with curing energy. Here, the core material 12 (FIG. 1) that maintains more fluidity can efficiently flow and deform, absorb tensile stress associated with curing shrinkage, and suppress displacement of the bonded material 2 with respect to the bonded material 1. Yes (FIGS. 8 and 9).
As described above, the material of the capsule wall 11 in FIG. 1 to FIG. 3 or FIG. 7 to FIG. 9 may be generally used as a capsule material in this case, and includes an interfacial polymerization method, an insolubilization reaction method, a phase separation method, an interfacial precipitation method. It is made by manufacturing methods such as spray drying and fluidized bed.

The material may be polyamide, polyalginate or the like, but it is necessary to make the film thickness as thin as possible so that the film can be deformed or expanded by the curing shrinkage of the energy curable adhesive.
In addition, in order to obtain a property that can be destroyed by light, generally, a photosensitizing additive is added to impart photodegradability to the polymer main chain, or as a photosensitizing group in the main chain during polymer polymerization. A structure in which a carbonyl group or the like is introduced and the structure is easily decomposed by light may be used.
Further, the core substance 12 may be any of gas, liquid, and solid, but gas is preferable when considering flow deformation and expansion. It is safe to use an inert gas such as nitrogen, air, argon or xenon as the gas component.
In particular, the inside of the microcapsule 3b after the deformation is deformed by making the pressure of the gas filled in the core material 12 after curing of the energy curable adhesive equal to the external pressure after bonding (1 atmosphere under normal use environment). When expanding, it is preferable to eliminate the pressure difference between the microcapsule 3b and the outside air. In this case, since the amount of cure shrinkage of the adhesive is determined by the adhesive, it is only necessary to enclose the microcapsule 3b with a pressure at which the amount of expansion of the core material can be balanced with respect to that amount.
As a result, the occurrence of internal stress due to the pressure difference can be suppressed, and the positional deviation can be further reduced. In addition, the relaxation of internal stress can improve the reliability against changes with time.
It is possible to make the pressure of the gas filled in the core material 12 equal to the external pressure of the bonding structure by inserting a foaming agent into the microcapsule 3b and foaming the foaming agent due to heat generated by the hardening of the adhesive 3a. It is.
The component of the blowing agent may be azodicarbonamide, dinitrosopentamethylenetetramine, pp′-oxybisbenzenesulfonylhydrazine, p-toluenesulfonylhydrazide, etc., which are generally commercially available.
In particular, azodicarbonamide is the only self-extinguishing and highly safe foaming agent among organic foaming agents, has a large amount of foaming gas, and can be used with either resin or rubber, making it easy to use among organic foaming agents. good.

FIG. 10 is a schematic view showing an adhesive bonding apparatus according to the present invention. In FIG. 10, the adhesive bonding apparatus includes a coating means 10 for applying an energy curable adhesive 3a enclosing a microcapsule 3b, and an energy irradiating means 7 for irradiating energy 9 to cure the energy curable adhesive 3a. ing.
The adherend 1 is composed of an optical base such as a glass plate, a ceramic plate, or a metal plate. The adhesive 2 is composed of optical components such as an optical element such as a lens, a diffraction grating, and a mirror, a light receiving element, a light emitting element, and a solid-state imaging element such as a CCD.
The application means 10 includes an application syringe or the like for applying an energy curable adhesive 3a for joining the adherend 1 and the adhesive 2 and a syringe moving means (not shown). It has the structure which has a means to apply | coat this adhesive agent. Further, a means for applying an arbitrary amount of adhesive may be provided as the application means 10.
As a coating method, a spray method, a mist method, a method of directly dipping in an adhesive solution, or a method of sticking an adhesive may be used. Moreover, an adhesive agent may take a sea-island structure by these application | coating.
The energy irradiating means 7 irradiates the cured portion with the energy source 6 that radiates the curing energy band of the energy curable adhesive 3a, the optical fiber that guides the radiated energy to a predetermined position, and the guided energy. A condenser lens or a diverging lens.
The integrated light amount measuring means 8 calculates the amount of energy 9 to be irradiated based on the irradiation intensity and irradiation time of the energy 9 irradiated by the energy irradiation means 7 to obtain the integrated light amount.
The control means 4 has a function (energy irradiation control means) capable of individually turning on / off the energy irradiation means 7 as required, a function (energy irradiation intensity control means) for controlling the irradiation intensity to be variable, It has a function (light shielding control means) for controlling the incidence / light shielding of the light shielding means. The control means 4 and the integrated light quantity measurement means 8 can be controlled by software in the computer.

FIG. 11 is a flowchart showing a control flow of a control unit provided in the adhesive bonding apparatus. First, the adherend 1, the adhesive 2, and the energy curable adhesive 3 a in which the microcapsules 3 b are encapsulated in advance are set at predetermined positions (S 1).
Next, conditions for irradiation conditions (integrated light amount) of the energy curable adhesive are set (S2). Next, energy irradiation is performed on the cured portion (S3). Next, the current energy integrated light quantity is calculated (S4).
Next, the calculated integrated light amount is compared with a preset integrated light amount for completing the curing of the energy curable adhesive 3a, and whether the integrated light amount has reached a set value (integrated light amount for completing the curing). It is determined whether or not (S5). If the integrated light quantity has not reached the set value, the process returns to step S3, and if it has reached the set value, the process ends.
In the present invention, a photocurable adhesive is used as the energy curable adhesive 3a. However, the energy curable adhesive is not limited to this as long as it is an energy curable adhesive. For example, a thermosetting adhesive or an anaerobic curable adhesive may be used. There may be. In the case of a thermosetting adhesive, it is cured while shifting the curing timing of each layer by applying heat energy.
Further, the integrated light amount is calculated from the intensity from the irradiation unit (energy irradiation means 7) and the irradiation time, but is not limited to this, the amount of energy from the direct irradiation unit is measured using a light amount meter, The measured value may be received by the computer as the integrated light quantity.

In addition, the curing reaction heat of the energy curable adhesive may be measured using a temperature measuring instrument, and the measured value may be received by a computer to calculate the integrated light quantity from the temperature of the measured value. The computer may collate the temperature with the temperature at the timing of curing the energy curable adhesive. Any of the above measurements makes it possible to accurately determine the curing timing of the energy curable adhesive.
As described above, the microcapsule 3a is broken by any one of pressure, heat, and light, so that the outflow of the core material 12 can be efficiently replenished in accordance with the curing shrinkage of the energy curable adhesive. It is possible to hold the relative positions of 1 and the adhesive 2.
Moreover, since gas is used for the core substance 12, a joining structure in which the microcapsule 3b can be easily deformed and expanded can be realized. Furthermore, since the internal pressure of the microcapsule 3b is made equal to the external pressure, there is no pressure difference between the microcapsule 3a and the outside air when the microcapsule 3b after curing is deformed and expanded.
Accordingly, it is possible to realize a joint structure that suppresses the generation of internal stress due to the pressure difference and holds the relative positions of the adherend 1 and the adherend 2 with higher accuracy. In addition, the relaxation of internal stress can improve the reliability against changes with time.
In the method in which the adherend 1 and the adhesive 2 are positioned with high accuracy, and then the adhesive is applied and cured and bonded, the microcapsule 3b in which the shrinkage area of the adhesive accompanying curing shrinkage is dispersed in the adhesive in advance. Since the adhesive portion does not substantially shrink in volume, the relative positions of the adherend 1 and the adhesive 2 can be maintained.
Furthermore, since the microcapsule 3b is dispersed in advance in the energy beam curable adhesive, no extra device is required.

  As described above, the bonding method, bonding structure, and bonding apparatus for an adherend and an adhesive according to the present invention are particularly useful for energy ray curable adhesives, and are particularly suitable for bonding to obtain a precise bonding position. .

Schematic which shows the structure which enclosed the microcapsule which consists of a capsule substance wall which surrounds a core substance and a core substance in an energy-beam curable adhesive. FIG. 2 is a schematic view showing a part A, which is a structure encapsulating the microcapsule of FIG. 1. FIG. 2 is a schematic view showing a portion B, which is a structure in which the microcapsules of FIG. 1 are enclosed. Schematic which compares the case of the junction structure which does not contain a microcapsule with FIG. Schematic which compares the case of the junction structure which does not contain a microcapsule with FIG. Schematic which compares the case of the junction structure which does not contain a microcapsule with FIG. Schematic which shows the structure which enclosed the microcapsule which consists of a capsule material which surrounds a core substance and a core substance in the same energy ray hardening-type adhesive agent as FIG. FIG. 8 is a schematic view showing a part A, in which the microcapsule of FIG. 7 is enclosed. FIG. 8 is a schematic view showing a part B, which is a structure in which the microcapsules of FIG. 7 are enclosed. Schematic which shows the adhesive bonding apparatus by this invention. The flowchart which shows the control flow of the control part with which an adhesive bonding apparatus is equipped.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 To-be-adhered thing 2 Adhesive thing 3 Adhesive (energy curable adhesive)
3a Adhesive (energy curable adhesive)
3b Microcapsule 4 Control means 6 Energy source 7 Energy irradiation means 8 Integrated light quantity measurement means 9 Energy 10 Application means 11 Capsule wall 12 Core substance 13 Adhesion structure d Shift width

Claims (10)

  In the method of bonding an adherend to an adherend, the energy curable adhesive is bonded to the adherend using an energy curable adhesive after positioning the adherend and the adhesive with high accuracy. A method for joining an adherend and an adhesive, characterized in that a volume shrinkage change due to curing shrinkage of the agent is compensated.   In the bonding structure of an adherend and an adhesive that joins the adhesive to the adherend using an energy curable adhesive after positioning the adherend and the adhesive with high accuracy, the energy beam curable type An adhesive layer in which a core material and a microcapsule including a capsule wall surrounding the core material are encapsulated in an adhesive is formed, and the microcapsule is deformed and expanded by curing shrinkage of the energy curable adhesive. Junction structure.   Microcapsules deform or expand when the capsule wall is torn by pressure, heat, or light and the core material flows out or expands, causing the core material to expand, and volume shrinkage due to curing shrinkage of the energy curable adhesive The joining structure according to claim 2, wherein the amount of change is compensated.   The joining structure according to claim 2 or 3, wherein gas is used as a core substance.   The bonded structure according to any one of claims 2 to 4, wherein after the bonding, the internal pressure of the microcapsule is made equal to the external pressure.   A microcapsule consisting of a core material and a capsule wall surrounding the core material is encapsulated in an energy ray curable adhesive, and the microcapsule deforms and expands to compensate for the volume shrinkage change due to the curing shrinkage of the energy curable adhesive. The joining method according to claim 1, wherein:   The capsule wall is broken by any of pressure, heat, and light, and the core material flows out or expands, and the core material also expands and deforms / expands to compensate for the volume shrinkage change due to the curing shrinkage of the energy curable adhesive. The joining method according to claim 6, wherein:   The joining method according to claim 6 or 7, wherein a gas is used as a core substance, whereby a volume shrinkage change amount due to curing shrinkage of the energy curable adhesive is deformed, expanded, and compensated.   9. The joining method according to claim 6, wherein after the joining, the internal pressure of the microcapsule is made equal to the external pressure. In an apparatus for bonding an adherend to an adherend using an energy curable adhesive, an application means for applying the energy curable adhesive encapsulating microcapsules, and the energy curing Energy irradiation means for irradiating energy to cure the mold adhesive, energy irradiation control means for controlling on / off of the energy irradiation means, and energy irradiation intensity control means for controlling the irradiation intensity of the energy irradiation means A joining apparatus comprising:

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