JP2005217055A - Thermoelectric module manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermoelectric module manufacturing method wherein a thermoelectric element is stably fixed on the soldering paste without falling down, the thermoelectric element and its supporting substrate are soldered together with high precision, and mass productivity is improved at a low cost. <P>SOLUTION: A thermoelectric module has a supporting substrate, a plurality of n-type and p-type thermoelectric elements arranged on the supporting substrate, and wiring conductors for electrically connecting the plurality of thermoelectric elements in series. The manufacturing method comprises a step of printing the soldering paste to the wiring conductors on the supporting substrate, a step of arraying thermoelectric elements on a heat-resistant lattice-type arraying jig, a step of transferring the thermoelectric elements from the lattice-type arraying jig to the connecting conductors with the soldering paste printed thereon, a step of drying the soldering paste, and a step of heating a part or the entirety of the lattice-type arraying jig with the ends of the transferred thermoelectric elements contacting with the soldering paste. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a low-cost manufacturing method that is excellent in mass productivity of thermoelectric modules that are suitably used for temperature adjustment, cooling, and the like of heating elements such as semiconductors.

  Conventionally, a thermoelectric element using the Peltier effect has been used as a thermoelectric element for cooling because one end generates heat and the other end absorbs heat when an electric current is passed. In particular, temperature control of laser diodes as thermoelectric modules, small size and simple structure, cooling devices without refrigerators, refrigerators, thermostats, photodetectors, electronic cooling elements such as semiconductor manufacturing equipment, temperature control of laser diodes, etc. Use is expected.

The thermoelectric element material used for the thermoelectric module used near room temperature is from A ₂ B ₃ type crystal (A is Bi and / or Sb, B is Te and / or Se) from the viewpoint of excellent cooling characteristics. A thermoelectric element is generally used.

For example, a solid solution of Bi ₂ Te ₃ (bismuth telluride) and Sb ₂ Te ₃ (antimony telluride) is used for a P-type thermoelectric element, and Bi ₂ Te ₃ and Bi ₂ Se ₃ (for a N-type thermoelectric element). Since the solid solution with bismuth selenide shows particularly excellent performance, this A ₂ B ₃ type crystal (A is Bi and / or Sb, B is Te and / or Se) is widely used as a thermoelectric element. .

  As shown in FIG. 1, in the thermoelectric module using the Peltier effect, wiring conductors 2a and 2b are formed on the surfaces of the support substrates 1a and 1b, respectively, and the thermoelectric element 3 is sandwiched between the wiring conductors 2a and 2b. It is configured to be electrically connected in series.

  These N-type thermoelectric elements 3a and P-type thermoelectric elements 3b are alternately arranged, connected by wiring conductors 2a and 2b so as to be electrically in series, and further connected to the lead wire 4, and the thermoelectric element from the outside. A DC voltage can be applied to the element 3, and heat absorption or heat generation can be generated according to the direction of the current.

  The wiring conductors 2a and 2b are usually made of copper electrodes so as to withstand a large current, and the thermoelectric element 3 is joined to the wiring conductors 2a and 2b with solder.

  The thermoelectric module as described above has been attracting attention for its wide use since it has a simple structure and is easy to handle, but can maintain stable characteristics. In particular, it is small and can be locally cooled, and precise temperature control near room temperature is possible, so it is used for devices that are precisely controlled to a constant temperature, such as semiconductor lasers and optical integrated circuits, and small refrigerators. .

In producing a thermoelectric module having such a structure, in particular, a small and fine thermoelectric element 3 is soldered on the support substrate 1 so as not to tilt perpendicularly to the support substrate 1 at equal intervals. The mounting process is particularly difficult and is one of the factors that increase the cost of thermoelectric modules. The support substrate 1 or the thermoelectric element 3 mounted with solder prevents the solder component from diffusing into the thermoelectric element 3 and is plated with Au on the Ni plating in order to improve solder wettability. For the purpose of facilitating the mounting described above, either the thermoelectric element 3 or the plated surface of the support substrate 1 is solder-plated, and a high-viscosity flux is applied to the joint surface in advance to apply the thermoelectric element 3 and the support substrate 1. A method is known in which solder is temporarily fixed by heat and then heated and soldered (Patent Document 1).
Japanese Patent Laid-Open No. 4-10474

  However, although the thermoelectric module manufacturing method described in Patent Document 1 is an excellent method capable of temporarily fixing the thermoelectric element, it is necessary to flatten the thermoelectric element and the support substrate by solder plating or the like, and the solder composition is limited. There was a problem that would be expensive. Furthermore, it takes an extra step of applying a highly adhesive flux, and it is necessary to mount a thermoelectric element in a short time until the flux dries. there were.

  On the other hand, as a manufacturing process of a low-cost thermoelectric module, a method of mounting a thermoelectric element after screen printing a solder paste on a support substrate is conceivable. However, when the solder paste is used, the printed surface becomes a mountain shape, and the thermoelectric element However, the manufacturing method suitable for the mass production method by the printing method using the solder paste has not been established so far.

  We have studied earnestly about the manufacturing method of thermoelectric module by the process of printing solder paste which is low cost and excellent in mass productivity, arrange the thermoelectric element once in the alignment jig, and then transfer the solder paste onto the printed support substrate, transfer The present inventors have found that a thermoelectric module can be produced by a method in which the solder paste and the thermoelectric element are temporarily fixed by adhesion by heating in such a state.

  That is, the manufacturing method of the thermoelectric module of the present invention includes a support substrate, a plurality of N-type and P-type thermoelectric elements arranged on the support substrate, and a wiring that electrically connects the plurality of thermoelectric elements in series. In a method for manufacturing a thermoelectric module having a conductor, a step of printing a solder paste on a wiring conductor on the support substrate, a step of aligning and arranging the thermoelectric elements on a heat-resistant grid-like alignment jig, The step of transferring the thermoelectric elements arranged on the grid-like alignment jig onto the wiring conductor printed with the solder paste, the step of drying the solder paste, and the end surface of the transferred thermoelectric element were brought into contact with the solder paste The method includes a step of fixing and heating a part or all of the grid-like alignment jig in a state.

  The drying temperature is 50 to 150 ° C.

  The grid-like alignment jig is made of phenol resin or metal.

  The support substrate on which the solder paste is printed is heated and solder-bonded in a state where the support substrate is disposed at both ends of the thermoelectric element.

  At least one of the support substrates on which the solder paste is printed is dried at a temperature of 50 to 150 ° C., and then heated and soldered in a state of being disposed at both ends of the thermoelectric element.

  By the above method, a method for producing a thermoelectric module that is low in cost and excellent in mass productivity can be obtained.

  According to the manufacturing method of the thermoelectric module of the present invention, the thermoelectric element can be fixed on the solder paste without falling down, and the thermoelectric element and the supporting substrate can be soldered with high accuracy, and the mass production can be achieved at low cost. An excellent thermoelectric module can be manufactured.

  Furthermore, it is possible to fix the thermoelectric element and the solder paste with high accuracy while suppressing the deterioration of the solder paste and improving the solder joint state, thereby increasing the yield of the joining process.

  Furthermore, deformation of the alignment jig during heating for fixing the thermoelectric element and the solder paste can be suppressed, defects due to contact between the thermoelectric element and the jig on the grid during heating can be reduced, and the yield can be improved.

  Furthermore, the soldering process between the thermoelectric element and the support substrate is only once, and it is possible to manufacture a thermoelectric module that is low in cost and excellent in mass productivity.

  Furthermore, it is possible to manufacture a thermoelectric module in which thermoelectric elements are arranged with high accuracy by reducing the inclination of the thermoelectric elements at a low cost and with excellent mass productivity.

  FIG. 1 is a perspective view showing a thermoelectric module manufactured by the method for manufacturing a thermoelectric module of the present invention.

  As shown in FIG. 1, the thermoelectric module produced by the thermoelectric module manufacturing method of the present invention has wiring conductors 2a and 2b formed on the surfaces of the support substrates 1a and 1b, respectively, and the thermoelectric element 3 is connected to the wiring conductor 2a, It is configured to be sandwiched by 2b and electrically connected in series.

  These N-type thermoelectric elements 3a and P-type thermoelectric elements 3b are alternately arranged, connected by wiring conductors 2a and 2b so as to be electrically in series, and further connected to the lead wire 4, and the thermoelectric element from the outside. A DC voltage can be applied to the element 3, and heat absorption or heat generation can be generated according to the direction of the current.

  The wiring conductors 2a and 2b are usually made of copper electrodes so as to withstand a large current, and the thermoelectric element 3 is joined to the wiring conductors 2a and 2b with a solder paste 8.

The thermoelectric element 3 used in the present invention preferably contains at least two of Bi, Sb, Te and Se as main components. The thermoelectric element 3 using a chalcogenite type crystal such as Bi ₂ Te ₃ , Sb ₂ Te ₃ , Bi ₂ Se ₃ is excellent in thermoelectric properties near room temperature, and can be suitably used as a cooling thermoelectric module related to information communication.

  In particular, the N-type thermoelectric element 3 preferably contains I and / or Br. That is, in order to form a semiconductor, the electron concentration is adjusted by addition of a halogen element, and excellent characteristics can be exhibited as the N-type thermoelectric element 3a having a controlled carrier concentration.

  The N-type thermoelectric element and the P-type thermoelectric element may be a melted material or a sintered body, but the N-type thermoelectric element is made of a melted material, particularly a single crystal, and the P-type thermoelectric element 3b. Are made of a sintered body, particularly a sintered body having an average crystal grain size of 5 μm or less, or that the N-type thermoelectric element 3a and the P-type thermoelectric element 3b are made of a melted material, particularly a single crystal. This is preferable because reduction can be easily realized at the same time.

  Furthermore, the joining of the thermoelectric element 3 and the wiring conductor 2 is most suitable in terms of electrical, mechanical performance and cost. The solder to be used varies depending on the application of the thermoelectric module to be used, but generally Sn—Pb, Sn—Sb, and Au—Sn are preferably used. In particular, since the demand for Pb-free has been increasing in recent years, Sn—Sb and Au—Sn, which have high solder melting temperatures, are preferable in terms of improving the environment and heat resistance. The both end faces connected to the electrodes of the thermoelectric element 3 are provided with a nickel plating layer and an Au plating layer to improve the wettability of the solder, and the solder components constituting the solder layer diffuse into the thermoelectric element 3, Deteriorating performance can be suppressed.

  Next, the manufacturing method of the thermoelectric module of this invention is explained in full detail.

  First, the support substrate 1 is prepared. The material of the support substrate 1 is preferably a material that is excellent in vibration resistance and impact resistance, has high adhesion strength of the wiring conductor 2, and has low heat resistance as a heat radiating surface or a cooling surface. Specifically, a sintered body made of at least one of alumina, mullite, aluminum nitride, silicon nitride, and silicon carbide can be exemplified. In particular, from the viewpoint of cost, the alumina sintered body, the aluminum nitride sintered body from the viewpoint of high thermal conductivity and low thermal resistance, the silicon carbide sintered body from the viewpoint of strength and thermal conductivity, the impact resistance and strength of the sintered body. In this respect, a silicon nitride sintered body can be suitably used.

  The bending strength of the support substrate 1 is 200 MPa or more, particularly 250 MPa or more, and more preferably 300 MPa or more, so that the support substrate 1 can be prevented from being damaged even with respect to stress concentration caused by the formation of the wiring conductor 2 or the solder layer. It is preferable in terms of enhancing the effect and obtaining higher reliability.

  Next, the wiring conductor 2 is formed on the support substrate 1. The wiring conductor 2 can use at least one kind of metal among Cu, Al, Au, Pt, Ni and W. Of these, Cu is particularly desirable in terms of electrical conductivity and adhesion strength to the support substrate 1, and Al is desirable in terms of cost. The wiring conductor 2 may be formed, for example, by applying a metal paste to the surface of the green sheet to be the support substrate 1 and then simultaneously firing. However, once the support substrate 1 is prepared, the metal paste is applied and fired. Producing by plating on the metallized surface is preferable in terms of cost and accuracy of electrode shape.

  Hereinafter, it demonstrates along the flowchart of this invention of Fig.5 (a).

  A solder paste 8 having a desired composition is applied on the wiring conductor 2 provided on the support substrate 1. Solder paste 8 may be a commercially available paste in which subcomponents such as flux and organic solvent are mixed with solder having a particle size of about 10 to 100 μm. However, according to the present invention, in order to increase the adhesive force with thermoelectric element 3, It is desirable to store in a cool and dark place so that the solvent component does not evaporate. If it is dried, it can be used by adjusting the viscosity by adding flux or the like.

  As a method of applying, fine ball-shaped solder may be dropped by a dispenser, but for mass production, a paste is printed using a plate in which openings 15 are formed with high precision on a screen mesh in advance. Screen printing is optimal. In the screen printing method, the amount of solder and the height of printed solder can be adjusted by adjusting the thickness and opening shape of the screen mesh.

  According to the present invention, by arranging the support substrate 1 on the support substrate holder 12 with high accuracy, a plurality of support substrates 1 can be printed simultaneously.

  In addition, the amount of solder should be in the range where the thickness of the wiring conductor 2 is 5 to 30 μm, and the height of the solder should be ½ or less of the width of the thermoelectric element 3. It is preferable for suppressing the inclination of the element 3 and further for suppressing the resistance variation of the thermoelectric module.

  Next, an alignment jig 5 for aligning the thermoelectric elements 3 is prepared.

  With the alignment jig 5, N-type and P-type can be alternately arranged in a staggered pattern on the support substrate 1 on the main surface of the heat-resistant material as shown in FIG. The jig is provided with an opening 15 in accordance with the shape of the surface where the thermoelectric element 3 is bonded to the wiring board. The opening 15 may have a shape larger than that of the thermoelectric element 3, but the R processing 16 is applied to the edge portion as shown in FIG. 3B to transfer the thermoelectric element 3 without damaging it. Is preferable. The material of the alignment jig 5 is not limited as long as it has heat resistance up to 150 ° C. and can be processed finely and with high precision, but phenol resin or metal is preferable in terms of workability and cost. In particular, bakelite, stainless steel, and aluminum are preferable, and stainless steel is particularly preferable because stainless steel can be easily processed with high accuracy and fineness by an etching process using a photolithography technique.

  Next, one of the two surfaces to be joined to the wiring conductor 2 of the thermoelectric element 3 is inserted into the opening 15 of the alignment jig 5 so as to face the upper surface. As a method of insertion, it may be inserted by vacuum tweezers or the like, or may be automated by combining a parts feeder and a robot. However, according to the present invention, as a method of low cost and excellent mass productivity, vibration oscillation It is preferable to insert the thermoelectric element 3 by transfer according to. In order to alternately arrange the N-type thermoelectric elements 3a and the P-type thermoelectric elements 3b, the N-type thermoelectric elements 3a and the P-type thermoelectric elements 3b are separately transferred to the transfer jig once, and then transferred to the alignment jig 5. The method is desirable. As shown in FIG. 4 (a), the alignment jig 5 is structured such that a vacuum processing hole 7 is provided in advance so that the thermoelectric element 3 can be fixed by drawing a vacuum during transfer. Is easy. According to the present invention, the alignment jig 5 may be an integrated type as shown in FIG. 4 (a), but the opening 15 of the integrated alignment jig 5 processed with a rough processing accuracy is highly accurate by etching. In order to improve the positional accuracy of the thermoelectric element 3, a combined structure in which a metal mask 17 made of stainless steel, preferably made of stainless steel, is disposed is particularly desirable. The size of the opening 15 of the metal mask 17 is desirably 105 to 120% of the width of the thermoelectric element 3. By processing these alignment jigs 5 with high accuracy, a plurality of thermoelectric elements 3 for thermoelectric modules can be arranged simultaneously.

  Next, the thermoelectric element 3 arranged on the alignment jig 5 is transferred onto the support substrate 1 on which the solder paste 8 is printed. By providing the guide pins 9 on the support substrate holder 12, the spacers 13 and the alignment jig 5 can be accurately arranged. The alignment jig 5 in which the thermoelectric element 3 is inserted uses a vacuum pump to adsorb and fix the thermoelectric element 3 using a vacuuming hole, and positions it on the support substrate holder 12 as it is using a guide pin. Thereafter, by stopping the vacuuming, the thermoelectric element 3 falls due to its own weight, and the thermoelectric element 3 is brought into contact with the solder paste 8. At this time, when the alignment jig 5 to which the above-described metal mask 17 is attached is used, the same process may be performed, but the thermoelectric element 3 may be transferred in a state where only the metal mask 17 is previously disposed on the spacer. According to the present invention, since two or more metal masks 17 are arranged, the position can be finely adjusted by the metal mask 17 even when the thermoelectric element 3 is displaced with respect to the electrode position. It is desirable to use 5. In this case, after transferring the thermoelectric element 3, the alignment jig 5 to which the vacuuming hole is attached may be removed.

  Next, heating is performed while the alignment jig 5 is fixed in a state where the thermoelectric element 3 is in contact with the solder paste 8. Here, when the alignment jig 5 is an integral type, it is fixed as it is. However, when the metal mask 17 is used, only the metal mask 17 that can prevent the thermoelectric element 3 from falling may be fixed. Although the heating temperature varies depending on the type of the solder paste 8, in the case of solder suitably used for the thermoelectric module, the range of 50 to 150 ° C is desirable, preferably 70 to 130 ° C, and more desirably 80 to 120 ° C. When the temperature is lower than 50 ° C., the adhesive strength between the thermoelectric element 3 and the solder paste is weak and cannot be fixed. On the other hand, when the temperature is higher than 150 ° C., the solder itself may be transformed by this process. When the transformation is performed, the wettability of the solder is lowered, and voids or gaps are frequently generated in the solder after joining. A heating time of 30 minutes or longer is sufficient, but according to the present invention, one hour or longer is desirable for reproducible adhesion.

  When the heating is completed, the alignment jig 5 is removed and then heated again to perform solder bonding. According to the present invention, when solder bonding is performed, the support substrate 1 printed with solder is arranged on the upper surface as shown in FIG. Then, it is preferable to perform the soldering step once. At this time, the upper and lower support substrates 1 can be bonded simultaneously by being uniformly pressurized by the pressure mechanism 12 via the pressure jig 11. Here, the pressure jig 11 is preferably made of a material having a low thermal conductivity in order to maintain a soaking property, and glass, polyimide resin, silicon rubber, or the like is preferably used. The pressure to be applied is preferably 1 to 10 MPa. Furthermore, it is preferable that the support substrate 1 disposed on the upper surface is heated at 150 ° C. or lower in advance to cure the solder, which can avoid the phenomenon that the solder wraps around the side of the thermoelectric element 3 when pressed. . If the solder wraps around the side surface of the thermoelectric element 3, the thermoelectric element 3 and the solder may react at the time of solder joining, and the performance of the thermoelectric module may be degraded. Although the drying temperature should just be 150 degrees C or less, Preferably it is 80-120 degreeC. Here, heating at a temperature of 150 ° C. or higher is not preferable because the above-described solder transformation occurs.

  Finally, after performing the solder bonding process, the jigs are removed to obtain a thermoelectric module in which the thermoelectric elements 3 are arranged on the upper and lower support substrates 1. A lead wire for applying current necessary for the thermoelectric module is soldered with a soldering iron, a fine heater, a soft beam for local heating, a laser, or the like to obtain a thermoelectric module.

  As described above, according to the present invention, the thermoelectric element 3 and the support substrate 1 are temporarily fixed by heating while preventing the collapse of the thermoelectric element 3 in contact with the support substrate 1 on which the solder paste 8 is printed. This makes it possible to manufacture a thermoelectric module using a solder paste that is low in cost and excellent in mass productivity.

  The thermoelectric module shown in FIG. 1 was produced using the production method of the present invention.

  First, a Cu wiring alumina substrate on which 46 thermoelectric elements 3 having a length of 8.2 mm, a width of 6.0 mm, and a thickness of 0.375 mm (23 pairs) are arranged is prepared as the support substrate 1.

Further, as the thermoelectric element 3, the thermoelectric element 3 having a composition of Bi ₂ Te _2.85 Se _0.15 is used for the N type, and the hot press having a composition of Bi _0.4 Sb _1.6 Te ₃ is used for the P type. A sintered polycrystalline thermoelectric ingot was prepared. The ingot is sliced to a thickness of 0.9 mm, then plated with Ni and Au, cut with a dicing saw to a width of 0.65 mm, N having dimensions of 0.65 mm in length, 0.65 mm in width, and 0.90 mm in height. A mold and a P-type thermoelectric element 3 were obtained.

  Next, the N-type and P-type thermoelectric elements 3 are inserted into the alignment jig 5 having an opening 15 of 0.75 ± 0.01 mm by a transfer and transfer method, and a solder paste having the composition shown in Table 1 is screen-printed. The alignment was performed using the guide pins 9 on the substrate 1, and the thermoelectric element 3 was transferred onto the support substrate 1 using the alignment jig 5 using a vacuum pump. After being transferred and heated at the temperature shown in Table 1 for 1 hour, the alignment jig 5 was removed. At this time, the number of defectives during heating was calculated when the thermoelectric element 3 fell down and the thermoelectric module could not be manufactured. Next, after heating the solder-printed upper surface substrate at the temperature shown in Table 1 for 1 hour, the substrate is placed in the state shown in FIG. 2, and the Sn-Sb solder is 280 ° C. while being pressed using the pressure jig 11. The Au—Sn solder was soldered on the hot plate while maintaining the support substrate holder 12 at a temperature of 340 ° C. After joining, the lead wire was joined with a soldering iron, and flux cleaning was performed to obtain a thermoelectric module. 100 thermoelectric modules were manufactured under each condition shown in Table 1, and when the thermoelectric module 3 could not be manufactured because the thermoelectric element 3 collapsed 3 degrees or more after the first heating, it was determined that the thermoelectric module did not fall down. 3 and an electrode having a solder joint failure were calculated as joint failures.

  It was assumed that the solder joint failure did not cover the entire end face of the thermoelectric element 3 due to repelling or burning.

The results are also shown in Table 1.

  As is apparent from Table 1, Comparative Example No. in which the thermoelectric element 3 and the solder paste 8 which are outside the scope of the present invention are not temporarily fixed. In Examples 1 and 2, the yield is 5 to 10%, whereas in Examples No. 3 to 19 in which the thermoelectric element 3 and the solder paste 8 are temporarily fixed, which is within the scope of the present invention, the yield is 91. The yield was as high as%.

  Further, the element contact temperature is preferably 50 ° C. or higher and 150 ° C. or lower because of sample no. It can be seen from 3-9.

  Moreover, it can confirm with sample No. 10-15 that the upper surface board | substrate heating temperature is 50 to 150 degreeC is preferable.

Sectional drawing which shows the thermoelectric element transcription | transfer state using the alignment jig in the manufacturing method of this invention It is sectional drawing which shows the pressurization state in the manufacturing method of this invention. (A) is a top view which shows the opening part of the alignment jig in this invention, (b) is an opening part enlarged view. (A) is sectional drawing of embodiment which shows the structure of the alignment jig in this invention, (b) is sectional drawing of other embodiment which shows the structure of the alignment jig in this invention. (A) is a flowchart of the present invention, and (b) is a flowchart of a conventional example. It is a perspective view which shows the thermoelectric module of a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Support substrate 2 Wiring conductor 3 Thermoelectric element 3a N type thermoelectric element 3b P type thermoelectric element 4 Lead wire 5 Alignment jig
7 Vacuum quoted hole 8 Solder paste 9 Guide pin 11 Pressure jig 12 Pressure mechanism 13 Spacer

Claims (5)

In a method for manufacturing a thermoelectric module, comprising: a support substrate; a plurality of N-type and P-type thermoelectric elements arranged on the support substrate; and a wiring conductor that electrically connects the plurality of thermoelectric elements in series. A step of printing a solder paste on a wiring conductor on a support substrate, a step of aligning and arranging the thermoelectric elements on a grid-like alignment jig having heat resistance, and a thermoelectric element arranged on the grid-like alignment jig A step of transferring the solder paste onto the printed wiring conductor, a step of drying the solder paste, and a part or the whole of the grid-like alignment jig with the end face of the transferred thermoelectric element in contact with the solder paste. The manufacturing method of the thermoelectric module characterized by including the process of fixing and heating. The method for producing a thermoelectric module according to claim 1, wherein the drying temperature is 50 to 150 ° C. The method of manufacturing a thermoelectric module according to claim 1 or 2, wherein a material of the grid-like alignment jig is phenol resin or metal. The method of manufacturing a thermoelectric module according to any one of claims 1 to 3, wherein the support substrate on which the solder paste is printed is heated and soldered in a state of being disposed at both ends of the thermoelectric element. 5. The solder substrate is formed by drying at least one of the support substrates on which the solder paste is printed at a temperature of 50 to 150 ° C., and then heating and soldering in a state of being disposed at both ends of the thermoelectric element. Method for manufacturing a thermoelectric module.

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