JP2005216980A - Electrical component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrical component which improves productivity and reduces cost. <P>SOLUTION: A case 11 consists of a peripheral wall 41 and a tabular bottom plate 42. The right edge 43 of the bottom plate 42 is connected to the peripheral wall 41 at a level higher than the left edge 44 of the bottom plate 42, so that a depth to a bottom face 45 formed by the upper surface of the bottom plate 42 is greater at the right edge 43 side than at the left edge 44 side. When the case 11 is placed on a level surface to make the peripheral wall 41 stand upright on the surface, the bottom surface 45 slopes to make the right edge 43 higher than the left edge 44. The slope of the bottom surface 45 against the level is set to an angle θ that is made by the difference of height between a small component 21a and a large component 21b. More clearly, the angle θ is made by the plane of the print board 3 and a virtual line 24 connecting tops between the height H1 of the small component 21a and the height H2 of the large component 21b. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electrical component provided with a board for controlling an actuator of a transmission, for example.

  Conventionally, as shown in FIG. 3, an electronic component 101 for controlling an actuator is accommodated in a certain type of electronic control transmission.

  This electrical component 101 is formed by housing a printed circuit board 111 forming an electronic circuit in a container-like case 112 having an open top, and the case 112 is filled with an epoxy sealant 113. Yes. As a result, the electronic components 114,... Mounted on the printed circuit board 111 are sealed, and the deterioration of the electronic components 114,. It is configured as follows.

  When forming the electrical component 101, as shown in FIG. 4, the printed circuit board 111 is placed and fixed on the support wall 122,... Projecting from the bottom surface 121 of the case 112 and sealed. Fill with a stop agent 113. At this time, the sealing agent 113 is filled from the gap between the side wall 123 of the case 112 and the printed board 111 (1) to (4), and the lower part of the printed board 111 is filled with the sealing agent 113. After confirmation, the sealant 113 is filled in the upper part of the printed board 111 (5). Then, when the sealant 113 reaches a height position above the highest component 114a on the printed circuit board 111, the filling is finished.

  Next, after the bubbles mixed in the sealant 113 were naturally defoamed, the sealant 113 was thermally cured by applying heat.

  However, in such an electrical component 101, the sealant 113 to be filled is blended so as to have oil resistance, heat resistance, and earthquake resistance that can withstand the environment in the transmission, and has high viscosity and fluidity. Because of the poor nature, it took time to reach every corner of the case 112 after filling. Further, air bubbles are likely to remain in the corners of the case 112 due to the surface tension, and in this case, the above-described function may be deteriorated.

  In order to prevent this, a method of inclining and arranging the case 112 when injecting the sealant 113 is used, but it is necessary to horizontally reposition the case 112 during heating. Moreover, although the method of performing a vacuum defoaming process after natural defoaming is also considered, since it becomes a batch process, while equipment cost increases, continuous production cannot be performed and it may become a cost increase factor.

  The present invention has been made in view of such a conventional problem, and an object of the present invention is to provide an electrical component capable of improving productivity and reducing cost.

  In order to solve the above-mentioned problem, in the electrical component according to claim 1 of the present invention, the substrate is disposed in a container-like case having an open top, filled with a sealing agent, and mounted on the substrate. In the electrical component for sealing the electronic component, the bottom surface is formed so as to be inclined so that one edge portion on the bottom surface inside the case is higher than the other edge portion.

  That is, when forming the electrical component, the substrate is disposed in the case, and the case is disposed in a horizontal place and filled with the sealant. At this time, the bottom surface inside the case is formed to be inclined so that one edge is higher than the other edge.

  For this reason, just by filling the sealing agent from the one edge side of the bottom surface, the sealing agent flows into the other edge side.

  According to another aspect of the electrical component of the present invention, the substrate is disposed along the bottom surface, and an electronic component having a small height is disposed on one edge side of the substrate that is disposed at a high position when the substrate is disposed. At the same time, an electronic component having a large height was arranged on the other edge side of the substrate arranged at a low position.

  As a result, the height position of each electronic component provided on the substrate is aligned to be almost horizontal in a state where the substrate is disposed to be inclined along the bottom surface of the case.

  Furthermore, in the electrical component according to claim 3, with the substrate disposed along the bottom surface, one edge of the substrate disposed at a high position and the other edge of the substrate disposed at a low position An injection hole for injecting the sealant was opened in the vicinity of the center of the plate.

  That is, the sealant is injected from the gap between the edge of the substrate placed at a high position and the wall surface of the case, and the sealant is injected from an injection hole provided near the center of the substrate. At this time, the injection hole is provided in the vicinity of a central portion between one edge portion of the substrate disposed at a high position and the other edge portion of the substrate disposed at a low position, and is injected from the gap. The time until the sealant reaches the vicinity of the center of the substrate is substantially the same as the time until the sealant injected from the injection hole reaches the low position on the bottom surface.

  For this reason, the filling time of the sealing agent is halved by performing the injection of the sealing agent from the gap and the injection of the sealing agent from the injection hole almost simultaneously.

  As described above, in the electrical component of claim 1 of the present invention, the sealing agent is simply filled from one edge of the case bottom set to be higher than the other edge. Can be poured into the other edge side along the bottom surface.

  For this reason, compared with the conventional case where the case bottom is formed horizontally, the time until the sealant is filled to every corner can be shortened. Thereby, productivity can be improved and cost reduction can be achieved.

  Further, since the sealant is poured along the bottom surface to fill the corners of the case, it is possible to prevent bubbles from remaining at the corners. Thereby, effects, such as prevention of oil penetration and securing of earthquake resistance, can be obtained.

  Then, continuous production is possible as compared with the conventional case where the case has to be horizontally repositioned when the sealant is cured after the case is inclined and the sealant is injected. In addition, since it is easy for air bubbles to be mixed, batch processing is not necessary as compared with the conventional case where it is necessary to perform vacuum defoaming after natural defoaming. This eliminates the need for equipment costs and reduces production costs by improving productivity through continuous production.

  In addition, in the electrical component according to claim 2, the height position of each electronic component provided on the substrate may be aligned in a nearly horizontal state in a state where the substrate is disposed to be inclined along the bottom surface of the case. it can. Thereby, the usage-amount of a sealing agent can be reduced compared with the case where a sealing agent must be filled to the height position where an electronic component with a large height dimension is hidden.

  Furthermore, in the electrical component according to claim 3, the sealing agent is injected from the gap between the edge of the substrate placed at a high position and the wall surface of the case, and sealed from the injection hole provided near the center of the substrate. The filling time of the sealant can be halved by performing injection of the stopper almost simultaneously.

  Thereby, the productivity can be further improved.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing an electrical component 1 according to the present embodiment. The electrical component 1 is a component that is provided in an oil pan of an electronically controlled transmission and is related to control of an actuator such as an electromagnetic valve provided in a hydraulic circuit.

  The electrical component 1 includes a rectangular container-shaped case 11 having an upper opening, and a rectangular printed board 13 accommodated in an accommodating space 12 in the case 11. The case 11 includes an epoxy-based case. The sealant 14 is filled. As a result, the electronic circuit formed on the printed circuit board 13 is sealed to prevent deterioration due to oil penetration of the transmission, to ensure earthquake resistance, and to reduce thermal shock.

  A plurality of electronic components 21,... Are mounted on the printed circuit board 13, and a control circuit related to the control of the actuator is formed by these electronic components 21,. Each of the electronic components 21 is formed at a different height, and the small component 21a having the smallest height dimension H1 in all the electronic components 21,. It is arranged on the right edge 22 side which is the part side. Further, among all the electronic components 21,..., The large component 21b having the largest height dimension H2 is disposed on the left edge 23 side, which is the other edge side of the printed circuit board 13, and other electronic components. .. Are arranged so as not to protrude upward from an imaginary line 24 connecting the uppermost part of the small part 21a and the uppermost part of the large part 21b. The imaginary line 24 forms a predetermined angle θ with respect to the printed circuit board 13, and a gradient corresponding to the height difference between the height dimension H1 of the small component 21a and the height dimension H2 of the large component 21b. Is made.

  In the printed circuit board 13, an injection hole 31 penetrating the back surface is formed at the center of the right edge 22 and the left edge 23. By injecting the sealing agent 14 into the injection hole 31, The encapsulant 14 can be filled in the lower part of the printed circuit board 13.

  The case 11 includes a peripheral wall 41 that forms an outer peripheral portion, and a bottom plate 42 provided inside the peripheral wall 41. The bottom plate 42 is formed in a flat plate shape. The bottom plate 42 is connected to the peripheral wall 41 at a position where the right edge 43 that is one edge is higher than the left edge 44 that is the other edge, and the upper surface of the bottom plate 42 is formed from the upper end of the peripheral wall 41. The depth dimension to the bottom surface 45 is set to be deeper on the left edge 44 side than on the right edge 43 side.

  Accordingly, the bottom surface 45 is provided so as to be inclined so that the right edge portion 43 is higher than the left edge portion 44 in a state where the peripheral wall 41 is erected and placed on a horizontal plane, The gradient of the bottom surface 45 is equivalent to the height difference between the height dimension H1 of the small component 21a and the height dimension H2 of the large component 21b of the printed circuit board 13, that is, the imaginary line 24 with respect to the printed circuit board 13. The predetermined angle θ is set.

  .. Are provided on the four corners of the bottom surface 45 so that the printed circuit board 13 can be supported by the substrate support parts 51. The height of each of the substrate support portions 51 is set to the same size, and is configured so that the printed circuit board 13 can be maintained parallel to the bottom surface 45.

  Each of the substrate support portions 51,... Is provided at a position corresponding to a screw hole (not shown) provided in the printed circuit board 13, and a tapping screw inserted through each screw hole is connected to each substrate support portion 51,. .. The printed circuit board 13 can be fixed by being screwed into the.

  At this time, the printed circuit board 13 arranges the right edge 22 portion where the small component 21a having a small height dimension H1 is arranged on the right edge portion 43 side of the bottom surface 45, and also has the large height dimension H2. The correspondence relationship between the screw holes and the substrate support portions 51,... Is fixed so that the left edge 23 portion on which the large component 21b is disposed can be fixed in a state of being disposed on the left edge portion 44 side of the bottom surface 45. Is set. Thus, the imaginary line 24 in which all the electronic components 21,... On the printed circuit board 13 are accommodated is configured to be horizontal.

  A terminal 55 is insert-molded on the bottom plate 42 and soldered so that a connecting portion 56 extending from the terminal 55 into the accommodating space 12 is connected to the electronic circuit of the printed board 13. Yes.

  Further, in this fixed state, the injection hole 31 provided in the printed circuit board 13 has a right edge 22 portion of the printed circuit board 13 disposed at a high position and a left edge of the printed circuit board 13 disposed at a low position. It is comprised so that it may be located in the center part with 23 parts.

  The opening position of the injection hole 31 is not limited to the center of the printed circuit board 13 and may be set slightly on the left edge 23 side from the center.

  In the present embodiment according to the above configuration, when the electrical component 1 is formed, the printed board 13 is placed on the board support portions 51,... Projecting from the bottom surface 45 of the case 11. Then, the printed circuit board 13 is fixed to the case 11 by screwing the tapping screws inserted into the screw holes of the printed circuit board 13 into the respective substrate support portions 51. And this case 11 is arrange | positioned in a horizontal place, and the sealing agent 14 before solidification is filled in the accommodation space 12. FIG.

  That is, as shown in FIG. 2, the sealant 14 is injected by a dispenser from the gap between the peripheral wall 41 of the case 11 and the right edge 22 of the printed board 13 (1). When the sealing agent 14 reaches the bottom surface 45 (2), the pre-solidifying sealing agent 14 is injected from the injection hole 31 provided in the central portion of the printed board 13 with a dispenser (3). The lower portion of the substrate 13 is filled (4).

  The sealant 14 injected from the injection hole 31 reaches the left edge 44 of the bottom surface 45 (5), and the sealant 14 injected from the gap reaches the lower part of the injection hole 31. Then (5 ′), the sealing agent 14 is injected from the top of the printed circuit board 13 with a dispenser (6), and all the electronic components 21 on the printed circuit board 13 are covered with the sealing agent 14 and sealed. When the agent 14 reaches a position higher than the virtual line 24 by a predetermined amount, the injection of the sealing agent 14 is terminated.

  Next, the case 11 is allowed to stand for a while to spontaneously degas bubbles mixed in the sealant 14, and then the sealant 14 is thermally cured by applying heat in a heating furnace to complete the electrical component 1. Let

  At this time, in the filling process of filling the sealant 14, the bottom surface 45 inside the case 11 is inclined so that the right edge 43 filled with the sealant 14 is higher than the left edge 44. Is formed. For this reason, the sealing agent 14 can be poured into the corner on the left edge portion 44 side along the bottom surface 45 only by filling the sealing agent 14 from the right edge portion 43 side of the bottom surface 45. .

  For this reason, the time until the sealing agent 14 is filled to every corner can be shortened as compared with the conventional case where the case bottom is formed horizontally. Thereby, productivity can be improved and cost reduction can be achieved.

  In addition, since the sealing agent 14 flows along the bottom surface 45 and fills the corners of the case 11, it is possible to prevent bubbles from remaining in the corners. Thereby, effects, such as prevention of oil penetration and securing of earthquake resistance, can be obtained.

  And since the case 11 does not need to be repositioned compared to the conventional case where the case had to be horizontally repositioned when the encapsulant is cured after inclining and injecting the encapsulant, continuous production is possible. It becomes. In addition, since it is easy for air bubbles to be mixed, batch processing is not necessary as compared with the conventional case where it is necessary to perform vacuum defoaming after natural defoaming. This eliminates the need for equipment costs and reduces production costs by improving productivity through continuous production.

  In the printed circuit board 13, the right edge 22 portion having the small component 21a having a small height dimension H1 is disposed on the right edge portion 43 side shallow to the bottom surface 45, and the height dimension H2 is large. The left edge portion 23 having the large component 21b is disposed on the left edge portion 44 side having a deep depth to the bottom surface 45. In this state, the imaginary line 24 in which all the electronic components 21,... On the printed circuit board 13 are placed is horizontal, and the height of all the electronic components 21,. The position can be made to be almost horizontal. For this reason, the usage-amount of the sealing agent 14 can be reduced compared with the case where the sealing agent has to be filled up to a height position where an electronic component having a large height is hidden.

  That is, as shown in FIG. 1B, the parallel line 61 parallel to the printed circuit board 13 is virtually assumed at a position where the sealant 14 covers the large component 21b, and the parallel line 61 is positioned above the parallel line 61. When the volume of the sealing agent 14 to be performed is S1, and the volume formed between the parallel line 61 and the sealing agent 14 is S2, the volume S2 is larger than the volume S1. Thereby, the amount of the sealing agent 14 obtained by subtracting the volume S1 from the volume S2 can be reduced.

  And the said injection hole 31 which inject | pours the said sealing agent 14 from the middle part is provided in the center part of the said printed circuit board 13. As shown in FIG. For this reason, the time until the sealant 14 injected from the gap reaches the vicinity of the center of the printed circuit board 13, and the sealant 14 injected from the injection hole 31 reaches the left edge 44 of the bottom surface 45. The time to reach the corner is almost the same.

  For this reason, the filling completion time of the sealing agent 14 can be halved by performing the injection of the sealing agent 14 from the gap and the injection of the sealing agent 14 from the injection hole 31 almost simultaneously.

  Thereby, the productivity can be further improved.

It is a figure which shows one embodiment of this invention, (a) is a figure which shows the state with which the sealing agent was filled, (b) is explanatory drawing which shows the reduction amount of a sealing agent. It is explanatory drawing which shows the filling process of the sealing agent of this invention. It is a figure which shows the conventional electrical component, (a) is a top view, (b) is sectional drawing of the principal part. It is a figure which shows the prior art example, (a) is the schematic diagram used for description, (b) is explanatory drawing which shows the filling process of sealing agent.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electrical component 11 Case 13 Printed circuit board 14 Sealant 21 Electronic component 22 Right edge 23 Left edge 45 Bottom

Claims (3)

In an electrical component that seals an electronic component mounted on the substrate by arranging the substrate in a container-like case with an open top and filling with a sealing agent,
An electrical component, wherein the bottom surface is formed so as to be inclined such that one edge portion on the bottom surface inside the case is higher than the other edge portion.   The substrate is disposed along the bottom surface, and an electronic component having a small height is disposed on one edge side of the substrate that is disposed at a high position during the disposition, and the substrate disposed at a low position. 2. The electrical component according to claim 1, wherein an electronic component having a large height is disposed on the other edge side. In a state where the substrate is disposed along the bottom surface, the sealant is located near a central portion between one edge portion of the substrate disposed at a high position and the other edge portion of the substrate disposed at a low position. The electrical component according to claim 1, wherein an injection hole to be injected is opened.

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