JP2005216625A - Organic electroluminescent element and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic EL element having a stable light emitting characteristics and its manufacturing method. <P>SOLUTION: This is the organic EL element that comprises a first electrode provided on a support substrate, a second electrode arranged opposed to the first electrode crossing at right angles, and an organic EL layer arranged between the first electrode and the second electrode. The first electrode is composed of a first electrode section that is divided in a plurality of regions and is connected to a plurality of corresponding bus electrodes at the respective plurality of regions, and the bus electrode and the first electrode are connected by a plurality of connecting parts, and the plurality of regions of the first electrode are driven independently respectively. A manufacturing method of this organic EL element is also provided. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an organic EL light-emitting device and a method for manufacturing the same, and more particularly to an organic EL light-emitting device that maintains stable light emission characteristics over a long period of time and a method for manufacturing the same.

  As an electrode configuration in the organic EL display, there are an active matrix driving method using a TFT (thin film transistor) and a passive matrix driving method. Among these methods, the passive matrix driving method has an advantage that it can be manufactured at low cost because the electrode configuration is simple.

In the passive matrix driving method, in order to form a high-definition panel with a high number of pixels, it is necessary to increase the number of electrodes (scanning electrodes and signal electrodes) constituting the XY matrix electrode structure. When passive matrix driving is performed at a constant frame frequency, each pixel emits light when a voltage is applied for a period assigned to one scan electrode. Since this period is defined by a duty ratio that is the reciprocal of the number of scan electrodes (duty ratio = 1 / number of scan electrodes), the period decreases in inverse proportion to the number of scan electrodes. Accordingly, when a surface luminance of 100 Cd / m ² is required in a display with a duty ratio of 1/100, each pixel needs to emit light with a luminance of 10,000 Cd / m ² . In order to obtain such luminance, it is necessary to increase the current flowing through the pixel. In general, when the amount of current is increased in the organic light emitting device, the reliability of image display indicated by the luminance half-life tends to decrease. is there.

  As a method of increasing the duty ratio in a liquid crystal display device of a passive matrix driving system, (1) a method in which signal electrodes are divided at the top and bottom of the panel and the panel is driven independently, and (2) two for one scanning electrode. (3) An insulating film is provided on a part of the lower signal line in the same substrate, and an upper signal line is further superimposed thereon. Thus, there is known a method in which signal electrodes are individually driven in an upper part and a lower part by arranging them. Furthermore, a method combining these methods is also known (see, for example, Patent Document 1). According to these methods, the duty ratio can be increased by increasing the number of scanning lines to which a voltage can be applied simultaneously.

  Also in an organic light emitting element, a method in which the above methods (1) and (2) are combined is already known (see, for example, Patent Documents 2 to 5).

  In the techniques (1) and (2) described above, two or more signal electrodes are arranged in a comb shape on one scanning electrode. However, the electrodes of all the pixels to be arranged must be insulated. Therefore, it is assumed that the manufacturing yield is reduced. Furthermore, since the current flowing through the scanning electrode increases as the number of pixels increases, it is necessary to make the driving IC on the scanning side correspond to one that can pass a current several times that of a normal IC.

  Further, a method similar to the above (3) is disclosed in Patent Document 6, for example. This technique is similar to the method described in Patent Document 1. That is, the technique described in Patent Document 6 is characterized in that the panel is divided into a plurality of sub-panel regions, and by dividing in this way, the first electrode is divided into a plurality in the vertical direction within the panel surface. Further, it is also disclosed that the signal electrode of this patent document is composed of a first bus electrode and a first electrode that is a translucent material electrically connected to the first bus electrode, and the wiring is three-dimensionally configured. Yes. Further, as this manufacturing method, a method of forming the first bus line after forming the first electrode is described.

  However, when the scan electrodes are divided by the method described in this patent document, the number of bus lines orthogonal to the scan electrodes increases in proportion to the number of divisions as the number of divisions increases, and the space between the bus line electrodes is narrowed. Become. This increases the probability that a short circuit failure will occur between adjacent bus lines due to a patterning failure, resulting in a decrease in manufacturing yield.

  Furthermore, when the scan electrodes are divided and driven according to the method described in Patent Document 6, the luminance changes sharply at the boundaries between the regions divided when the panel is turned on, and the electrode boundaries are visually recognized. is there.

  In addition, in the method described in Patent Document 6, the electrode pitch for connecting to the external drive circuit is smaller than 100 μm in a high-definition panel. In the flexible printed circuit board used for the connection between the substrates, there is a problem that it is difficult to make the conductive portion thin.

Japanese Patent Publication No. 1-57350 JP 2000-259124 A JP 2001-142415 A Japanese Patent Laid-Open No. 2001-217081 JP 2001-313182 A JP 2000-56707 A

  In the passive matrix driving method, it is necessary to simultaneously achieve the first problem of increasing the duty ratio and the second problem of simply forming the passive matrix driving electrode without reducing the yield. In addition, in the formation of the electrodes, not only the electrodes in the display portion but also the simple formation of the electrode portions including the electrode lead portions and connection portions is required. In particular, in order to obtain an organic EL light-emitting element that can be driven with high definition and stable over a long period of time, it is necessary to simultaneously achieve the above-described problems. Further, when the electrode is divided and formed, it is necessary to cope with a problem due to alignment when forming the electrode, for example, a different issue area for each region.

  However, until now, no effective and specific method for achieving all the above technical problems has been known.

  The present invention has been made in view of such problems, and an object of the present invention is to provide an organic EL light-emitting device that maintains high-definition and stable light-emitting characteristics over a long period of time and a method for manufacturing the same.

The present invention is solved by the following organic EL light-emitting device and manufacturing method thereof.
The first of the present invention relates to an organic EL light emitting device. In the first embodiment, the element is arranged between a first electrode provided on a support substrate, a second electrode arranged to be orthogonal to the first electrode, and between the first electrode and the second electrode. An organic EL light emitting device including the formed organic EL layer, wherein the first electrode is divided into a plurality of regions and connected to a plurality of corresponding bus electrodes in each of the plurality of regions. The bus electrode and the first electrode are connected by a plurality of connecting portions, and the plurality of regions of the first electrode are driven independently. In the present invention, it is preferable that the plurality of bus electrodes of the first electrode portion are insulated by an insulating film. Further, the bus electrodes may be alternately laminated with insulating films, and the insulating films may have openings at connection portions where the bus electrodes and the first electrodes are connected. In the present invention, the bus electrode and the first electrode are connected by a connection portion including a plurality of connection holes on the insulating film, or a connection portion including a plurality of protrusion portions of the bus electrode protruding from the insulating film. It is characterized by being.
In particular, in the present invention, it is preferable that the bus electrodes are formed of different materials.

  The 2nd of this invention is related with the manufacturing method of an organic electroluminescent light emitting element. The method includes: forming a first electrode divided into a plurality of regions divided into a plurality of regions and connected to a plurality of corresponding bus electrodes in each of the plurality of regions; an organic EL layer; And a step of forming a second electrode, wherein the step of forming the first electrode comprises: (1) a plurality of connections for connecting to the first electrode on a support substrate; Forming a plurality of bus electrodes having connecting portions; and (2) forming a first electrode divided so as to be connected to only the corresponding plurality of bus electrodes by the connecting portions. In the second embodiment of the manufacturing method of the present invention, the step of forming the first electrode includes: (1) forming a plurality of bus electrodes having a plurality of connecting portions for connecting to the first electrode on a support substrate; And (2) a step of forming an insulating film so as to cover at least a part of the bus electrode other than the connection portion of the bus electrode, and (3) the connection only to a plurality of corresponding bus electrodes. Forming a divided first electrode so as to be connected at a portion. In the third embodiment of the present invention, the step of forming the first electrode includes (1) forming one or a plurality of bus electrodes having a plurality of connection portions for connecting to the first electrode on the support substrate. A step, (2) a step of forming an insulating film so as to cover the bus electrode, except for the connection portion of the bus electrode, and (3) repeating the steps (1) and (2) to obtain the necessary plural Forming a bus electrode, and (4) forming a first electrode divided so as to be connected to only a plurality of corresponding bus electrodes at a connection portion. In particular, in the present invention, the bus electrode or the insulating film is provided so that the connecting portion is a connecting portion formed of a plurality of connecting holes on the insulating film or a connecting portion formed of a plurality of protruding portions of the bus electrode protruding from the insulating film. Form. In the present invention, the insulating film is preferably formed to be uniform in each region of the first electrode divided into a plurality.

  In the present invention, the bus electrodes are preferably formed of different materials. Furthermore, the present invention includes an organic EL light emitting device including a color conversion filter and a method for manufacturing the same.

  Other features and advantages of the present invention will become apparent from the following description of the invention.

According to the present invention, the first electrode is divided into a plurality of parts, which are connected from the first bus electrode to the nth bus electrode, respectively. By adopting such a configuration, among the organic light emitting layers provided between the first electrode and the second electrode, the organic light emitting layer portions positioned corresponding to the respective regions are driven independently of each other. Therefore, the duty ratio required in the passive matrix driving method can be increased. In the present invention, the arrangement of the first electrode portions can be easily formed without reducing the yield. For this reason, long-term driving stability can be ensured. As described above, the present invention can simultaneously achieve the two problems of increasing the duty ratio and simply forming the electrodes without reducing the yield. Furthermore, the organic EL light-emitting device having the electrode structure of the present invention can maintain high-definition and stable light emission characteristics over a long period of time. In addition, according to the method for manufacturing an organic EL light emitting device of the present invention, it is possible to provide an organic EL light emitting device that can achieve the above two problems.

  Furthermore, according to the present invention, the light emitting area can be homogenized by uniformly forming the insulating film.

The present invention will be described below with reference to the drawings.
The present invention relates to a passive matrix driving type organic EL light emitting device, and relates to an organic EL light emitting device characterized by the structure of the first electrode. The organic EL light-emitting device of the present invention is not particularly limited as long as it is a passive matrix driving method, and examples thereof include an organic EL light-emitting device having a structure shown in FIG. FIGS. 1A and 1B are stacked type so-called bottom emission type and top emission type passive matrix driving type organic EL light emitting elements, respectively, and FIG. 1C is a bonded type top emission type. It is an organic EL light emitting element of a passive matrix drive system.

  Specifically, an organic EL light emitting device 10 shown in FIG. 1A includes a black matrix 108, red, for example, on a support substrate 102 made of glass, ceramics, polyethylene terephthalate, polysulfone, polycarbonate, or the like. A color conversion filter layer (fluorescence conversion filter layer) 110 made of green or blue dye or pigment is provided. A flattening layer 112 covering these color conversion filter layers is provided thereon. A passivation layer 114 is provided thereon, and a first electrode 104 corresponding to each of the color conversion filter layers is provided on this surface. Here, the planarization layer 112 and the passivation layer 114 can be made of various polymer films, inorganic films, and the like as described later.

  On the first electrode 104, an organic EL layer 116 covering these electrodes (for example, as shown in FIG. 1D), a hole injection layer 124, a hole transport layer 126, an organic light emitting layer 128, an electron An injection layer 130 or the like is stacked. A second electrode 106 is provided on the organic EL layer 116. In addition, this organic EL light emitting element is sealed with a sealing member (not shown).

  The organic EL light emitting device 20 shown in FIG. 1B includes a first electrode 104 on a support substrate 102. On the first electrode 104, for example, the organic EL layer 116 as described above is stacked to cover these electrodes, and the second electrode 106 is provided on the organic EL layer 116. A passivation layer 114 a is provided on the second electrode 106. On the passivation layer 114a, a black matrix 108 and a color conversion filter layer (fluorescence conversion filter layer) 110 made of, for example, red, green, or blue dyes or pigments are provided. This organic EL light emitting element is sealed by a sealing member (not shown). Note that a passivation layer 114b may be provided on the color conversion filter layer 110 to cover them.

  An organic EL light emitting device 30 shown in FIG. 1C includes an organic EL light emitting device including a first electrode 104 formed on a support substrate 102, an organic EL layer 116 as described above, and a second electrode 106. A black matrix 108, for example, a color conversion filter layer (fluorescence conversion filter layer) 110 made of red, green, or blue dyes or pigments, a flattening layer 112b, and a passivation layer 114b are provided separately on the transparent substrate 118. The color conversion filter substrate is bonded to face to face with the outer peripheral sealing layer 120 interposed therebetween. The organic EL light emitting element may be provided with a passivation layer 114a.

  In this specification, the first electrode, the organic EL layer, and the second electrode formed on the support substrate are collectively referred to as a light emitting unit. In the present specification, as described above, the organic EL layer includes at least an organic light emitting layer, and contains a hole injection layer, a hole transport layer, an electron transport layer, and / or an electron injection layer as necessary. It is.

  The materials of the main constituent elements of the organic EL light emitting device of the present invention are the same as the conventional ones. For example, in order to obtain blue to blue light emission as the organic light emitting layer, for example, benzothiazole type, benzimidazole type Fluorescent brighteners such as benzoxazole, metal chelated oxonium compounds, styrylbenzene compounds, and aromatic dimethylidene compounds are preferably used. The organic EL light emitting device of the present invention is characterized by the arrangement of the first electrode portions. Accordingly, conventional materials can be used for the organic EL light emitting device, but the outline thereof will be described below as necessary.

  In the example of FIG. 1, a multicolor organic EL light emitting element including a color conversion filter is taken as an example, but the present invention also includes a so-called monochrome organic EL light emitting element that does not include a color conversion filter.

  As shown in FIG. 2, the passive matrix driving type organic EL light emitting device of the present invention includes a plurality of rows of first electrodes 104 on the transparent substrate 102 and a plurality of rows of second electrodes 106 intersecting the first electrodes. Is provided. FIG. 2 is a view of a bottom emission type passive matrix driving type organic EL light emitting element as viewed from the support substrate 102 (however, a color conversion filter, a bus electrode, etc. are omitted). In FIG. 2, the organic EL layer 116 including the organic light emitting layer, the pixel 202 constituted by the intersecting region of the first electrode 104 and the second electrode 106, and a plurality of the pixels 202 are arranged. A display portion 204 is shown. A display device is configured by connecting the external drive circuit and the display unit via a connection part formed by extending the first electrode and the second electrode from the display unit to the periphery of the substrate. The present invention is characterized by the structure of the first electrode and the components associated therewith. Hereinafter, the electrode structure will be described in detail with reference to the drawings, but the present invention is not limited thereto.

  FIG. 3 schematically shows the structure of the first electrode of the organic EL light emitting device of the present invention. FIG. 3A is a plan view of a part of the first electrode. FIGS. 3B and 3C show a cross-sectional view at the a-a ′ position and a cross-sectional view at the b-b ′ position in FIG. 3A, respectively. In the drawings referred to in the following description, the other components of the organic EL light emitting device of the present invention including the color filter layer and the color conversion layer are omitted for the purpose of explaining only the configuration of the first electrode. In the case of forming a color conversion filter on a support substrate, a color filter layer, a color conversion layer, a planarization layer, a passivation layer, and the like provided on these layers are integrally formed as “first It will be referred to as an “electrode substrate”. In the following specification, a bottom emission type organic EL light emitting element will be mainly described in order to avoid complexity. Therefore, the first electrode provided on the support substrate is provided in contact with the main surface of the first electrode substrate described above. However, the present invention may have any light emission form as long as it is a passive drive system as described above.

As shown in FIG. 3A, the first electrode unit includes a display unit 306 provided on the first electrode substrate, a connection unit 308 between the external drive circuit, and a lead-out unit 310. In this specification, the first electrode portion is a generic name for the structure around the first electrode including the first electrode, the insulating film, and the bus electrode (including the display portion, the lead portion, and the connection portion with the external drive circuit). It is. The display unit 306 has a plurality of regions A _{1 to An} (n is an integer of 1 or more). Each of the plurality of regions includes a divided first electrode 104 _n (n is an integer of 1 or more) and a plurality of bus electrodes 302 _n (n is an integer of 1 or more) connected to each of the divided electrodes. There is.) The plurality of regions, the first electrode is formed in parallel (e.g., the first electrode 104 n divided in the area of A _{1 (n =} 1) are formed in parallel.). Each of the bus electrodes 302 _n is connected to the external drive circuit from the connection part 308 with the external drive circuit via the lead-out part 310. As described above, in the present invention, the first electrode 104 is divided into a plurality of regions, and each of the first electrodes 104 is connected to the external drive circuit by a plurality of corresponding bus electrodes. In the present invention, the bus electrode 302 is insulated by an insulating film 304 _n (n is an integer of 1 or more). This is shown in FIGS. 3B and 3C. In the organic EL light emitting device of the present invention, the region where the first electrode is divided is preferably 2 or 3 (that is, n = 2 or 3).

With reference to FIGS. 3A to 3C, the structure of the first electrode portion of the present invention will be described in more detail. The first bus electrode ₃₀₂ n (n = 1) extends to the area _A 1 to A _n on the first electrode substrate. The first electrode 104n (n = 1) is provided in parallel to the area _{A 1,} in contact with the respective contact _{S 1} to the first bus electrode ₃₀₂ n (n = 1). To take the insulation between the first bus electrode ₃₀₂ n (n = 1), the area _A 2 to A _n insulating film ₃₀₄ on at least a first bus electrode to n (n = 2) is provided. In FIG. 3 (a), an example of forming the entire surface insulating film in a region _A 2 to A _n. The second bus electrode ₃₀₂ n on the insulating film (n = 2) it is, extends to the area _A 2 to A _n. The first electrode 104n (n = 2) is provided in parallel with the area _{A 2,} are in contact in each contact _{S 2} to the second bus electrode ₃₀₂ n (n = 2). This structure is repeated until the sequence regions A _n, the first electrode of the organic EL light-emitting device of the present invention shown in FIG. 3 is arranged. In the present invention, the contact point between the bus electrode and the insulating film may be formed by a single opening as shown in FIG. 3, or a plurality of connection points (for example, insulation as described in detail later). A plurality of connection holes or bus electrodes provided in the film may be formed in a comb shape so as to protrude from the insulating film. The opening and the connection hole may be embedded with a first electrode, or may be embedded with a conductive metal (for example, Cu, Mo, Al, etc.) different from the first electrode.

  In the present invention, the arrangement of the bus electrodes, the shape of the connection portion between the first electrode and the bus electrode, and the portion where the insulating film is provided can efficiently supply current to the first electrode without causing an insulation failure between the bus electrodes. There is no particular limitation as long as the ratio can be increased. Although FIG. 4 shows an example of the bus electrode, the shape of the connection portion between the first electrode and the bus electrode, and the combination of the insulating films, the present invention is not limited to this. FIG. 4 shows only a portion of the first electrode divided into a plurality of parts, and in order to avoid complication, only the reference numeral is attached to FIG.

  In the present invention, the arrangement of the bus electrodes may be a stacked type as shown in FIGS. 4 (a) to (c), (i) and (j), and FIGS. And may be a parallel type as shown in (k), or may be a combination of a stacked type and a parallel type as shown in FIGS. 4 (g), (h) and (l). . In addition, the bus electrode extends to the connection portion with the lead portion and the external drive circuit. By forming these shapes in combination with an insulating film to be described later into a predetermined form as will be described later, the bus electrode is formed. It becomes possible to prevent a short circuit between them, and it is possible to easily form the first electrode portion while improving the yield of the organic EL light emitting device of the present invention. In addition, prevention of a short circuit between the bus electrodes is important to ensure long-term stable driving. Further, for example, as shown in FIGS. 4I to 4L, in the case where the insulating film is provided on the bus electrode and in the vicinity thereof, and n is 2, the insulating film of 1 is provided. Preferably, a plurality of connection portions are formed. By doing so, the wiring structure of the electrodes becomes constant, and when the first electrode portion is formed by photolithography, the problem that the light emission area of the divided region of the first electrode is different due to the alignment accuracy is improved. Can do. Such an example will be described in detail later.

  In the present invention, metals such as Ag, Cu, Al, Mo, Cr, Ni, and W, and alloys of these metals can be used as the bus electrode material.

The bus electrode 302 _n uses a material having a relatively low electrical resistance (for example, Ag, Cu, or an alloy thereof) as it is provided at a location away from the extraction portion (that is, a location approaching n = 1), and is close to the extraction portion. The wiring resistance of each bus electrode can be made substantially the same by using a material (Cr, Ni, Mo, W, etc.) having a relatively high electric resistance as it is provided at the location. The bus electrode 302 _n has a larger bus electrode width and / or film thickness as it is provided at a location away from the lead portion, and a smaller bus electrode width and / or thickness as it is provided at a location closer to the lead portion. Thus, the wiring resistance of each bus electrode can be made substantially the same. By doing so, it is possible the value of the voltage drop due to the wiring resistance between the bus electrodes can be made substantially equal in each region A _n, to eliminate the difference in brightness of each region.

Insulating film is an entire surface of the _{A 1} on the first electrode substrate as shown in FIG. 4 (a) ~ (h) to a predetermined area _{A n,} connection of the bus electrodes 302 _n and the first electrode 104 _n It can be formed on the entire surface excluding the part S ₁ and the connection part with the external drive circuit. Furthermore, a bus electrode on a portion near its as in FIG. 4 (i) ~ (l) , except for the connection portion of the connection portion S _n and an external drive circuit of the bus electrode 302 _n and the first electrode 104n It can be formed in a part. In the present invention, it is possible to prevent a short circuit between bus electrodes by forming an insulating film also at a specific location such as a lead portion, and the first method can be achieved while improving the yield of the organic EL light emitting device of the present invention. An electrode part can be formed. In the present invention, it is preferable that the insulating film be formed uniformly in the display portion 306. By forming in this way, the wiring structure of the electrode becomes constant, and when the first electrode portion is formed by photolithography, the problem that the light emission area of the divided region of the first electrode differs due to the alignment accuracy is improved. be able to.

  When the bus electrode is a stacked type, a plurality of insulating films are formed according to the number of bus electrodes. When the bus electrode is a parallel type, in addition to providing a plurality of insulating films, all the plurality of bus electrodes are formed on the first electrode substrate. It is also possible to provide a single insulating film which is patterned and has a predetermined connection portion formed thereon. In such a case, the connection part may be formed from one opening part, and may consist of several opening parts like several connection holes.

  The insulating film is formed on the bus electrodes and has a function of insulating between the bus electrodes, a function of insulating the first electrode capital bus electrodes other than the divided first electrode and the bus electrode intended for connection, and the bus electrodes. It has a function of insulating from the organic EL layer (for example, preventing injection of holes into the hole injection layer of the organic EL layer).

  In the present invention, the insulating film is formed on a part of the first electrode substrate, or at least one side surface of the insulating film in one or a plurality of openings of the connection portion between the bus electrode and the first electrode. The end surface is preferably formed in a tapered shape. It is preferable to design the inclination angle of the insulating film with the tapered first electrode substrate surface to be 7 ° or more and less than 30 °. This is because the conductivity of the first electrode formed on the insulating film can be sufficiently ensured. Preferably, this angle is not less than 7 ° and less than 10 °.

  The insulating film can be made of an inorganic oxide such as silicon oxide, nitrogen oxide, silicon oxynitride, and aluminum oxide, an inorganic nitride, a mixture thereof, a negative photoresist such as acrylate, a polyimide material, or a novolac resin. is there. In the present invention, it is preferable to use a novolac resin. In the case of the top emission type, the insulating film may or may not be transparent, but in the case of the bottom emission type, for example, a material having high light transmittance such as silicon oxide is used as the insulating film. As a formation method, techniques such as patterning by a photolithography method and a lift-off method, and a dry etching method can be applied.

Connection portions S _n of the bus electrode and the first electrode may be formed only on a part of or the side surface over the side surface 402 of the first electrode as represented in Figure 4 (a) (b). Further, as represented by FIGS. 4C and 4D, it may be formed at the end portion 404 of the first electrode or a part of the end portion. Furthermore, as shown in FIGS. 4F, 4H, and 4G, the first electrode may be formed in parallel with the end portion of the first electrode. In the drawing, an example is shown in which the connection portion is formed over the entire width of the first electrode in parallel with the end portion of the first electrode. However, in the present invention, a connection portion shorter than this may be used. Moreover, the connection part may have a 1st electrode and several connection points (for example, connection hole). In the present invention, the connection portion S between the bus electrode and the first electrode is formed in the direction of the side surface or the end portion of the first electrode as shown in FIGS. 4 (a), (c), (e) to (l). It is preferably formed over the width of one electrode. By doing so, current can be efficiently supplied to the first electrode. In the present invention, as will be described in detail later, it is preferable that the bus electrode connected to the adjacent first electrode is provided at an equal distance from the end face of the adjacent first electrode. By doing so, current can be efficiently supplied to the first electrode. Furthermore, the connection portion may be embedded with a first electrode, or may be embedded with a conductive metal (for example, Cu, Mo, Al, etc.) different from the first electrode.

  The first electrodes are separated into a desired number as shown in FIG. 3 or FIG. By dividing the first electrode into a plurality of parts, the duty ratio of the organic EL light emitting element can be increased. The first electrode can be formed as an anode or a cathode. When the first electrode is used as the anode, the bottom emission type requires that the first electrode be transparent, and a conductive metal oxide such as ITO or IZO can be used. The same material can be used in the case of the top emission type, but the first electrode can be an electrode having a reflection function. Specifically, Ni or Cr having a high reflectivity is treated with ultraviolet rays instead of IZO or the like to make the work function equivalent to that of IZO or the like. In this way, holes can be injected and a predetermined reflective metal can be used as the anode. When the first electrode is used as a cathode, an alkali metal such as lithium and sodium, an alkaline earth metal such as potassium, calcium, magnesium and strontium, or an electron injecting metal such as fluoride thereof, and other metals Alloys and compounds are used.

  In the organic EL light emitting device of the present invention, the connecting portion where the first electrode and the bus electrode are connected, and the wiring portion of the bus electrode are regions other than the opening contributing to the light emission of the organic EL light emitting device (for example, the first electrode). It is preferable to be in a region corresponding to the black matrix of the substrate.

  Next, the structure of the first electrode portion will be described more specifically with reference to the drawings. In the following description, the case where n is 2 or 3 is taken as an example.

<First Embodiment>
The first embodiment is an example in which bus electrodes are formed in a stacked type.
A first example is shown in FIG. In the first example, the first electrode is divided into two regions A and B, and an insulating film is provided near the bus electrode in region A. FIG. 5A is a plan view of a part of the first electrode portion, and FIGS. 5B and 5C are cross-sectional views taken along the lines aa ′ and bb ′ of FIG. FIG. Each of the first electrodes (502, 504, 506) corresponds to each emission color of red, green, and blue, and each of these electrodes is provided on the first electrode substrate described above. 508, a connection portion 510 for connecting to an external drive circuit, and a lead-out portion 512. This display section has a region A (first electrodes of these regions are designated as 502A, 504A, and 506A) and a region B (first electrodes of these regions are designated as 502B, 504B, and 506B). In the region A, as shown in the cross-sectional view of FIG. 5B, the second bus is formed on the first bus electrode 516 provided on the main surface of the first electrode substrate 514 via the insulating film 520. An electrode 518 is provided, and further, a first electrode (502A, 504A, 506A) is provided on the second bus electrode 518. In the region B, as shown in the sectional view of FIG. 5C, the first electrodes (502B, 504B, 506B) are formed on the first bus electrodes 516 provided on the surface of the first electrode substrate 514. It has a provided structure. In the example shown in FIG. 5, the connection portion between the bus electrode and the first electrode is provided along the side surface 522 of the first electrode. That is, in the region A, the first electrode portion includes the first bus electrode 516 that is the first auxiliary wiring / the insulating film 520 / the second bus electrode 518 that is the second auxiliary wiring / the first electrode (502A, 504A, 506A), and the region B has a structure of a first bus electrode 516 / first electrode (502B, 504B, 506B) which is a first auxiliary wiring.

  The organic EL light-emitting element including the first electrode portion having such a structure is an organic light-emitting layer disposed between the first electrode and the second electrode (not shown) connected to the second bus electrode in the region A. (Not shown) and an organic light emitting layer (not shown) disposed between the first electrode and the second electrode (not shown) connected to the first bus electrode in the region B are independent from each other. Driven.

In the present invention, at least the side surface portion 521 of the insulating film 520 is preferably formed in a tapered shape. It is preferable to design the inclination angle of the insulating film 520 with the surface of the tapered first electrode substrate 514 to be 7 ° or more and less than 30 °. This is because the conductivity of the first electrode (502A, 504A, 506A) formed on the insulating film 520 can be sufficiently ensured. Preferably, this angle is not less than 7 ° and less than 10 °. FIG. 6 shows a cross-sectional SEM image showing the end shape of the insulating film 520 and the shape of the first electrode (502A, 504A, 506A). In the example shown in this figure, the inclination angle formed by the end portion of the insulating film 520 and the main surface of the first electrode substrate is 7 ° or more and less than 10 °.
FIG. 7 is a cross-sectional SEM image of the wiring portion of the first electrode portion described above. As shown in this figure, the first bus electrode 516, the second bus electrode 518, the insulating film 520, and the first electrode (502, 504, 506) of the first electrode portion are formed on the first electrode substrate without being disconnected. You can see that

  Next, a modification of the first example will be described with reference to FIGS. In these examples, the first bus electrode is provided with a protrusion, or the insulating film is provided with a plurality of connection holes. The shape and number of these protrusions and connection holes are arbitrary. First, a first modification is shown in FIG. In this example, as in the first example, the first electrode is divided into two regions A and B, and an insulating film is provided in the vicinity of the bus electrode. Has formed up to. FIG. 8A is a plan view of a part of the first electrode portion, and FIGS. 8B, 8C, and 8D are cross-sectional views taken along the line aa ′ in FIG. It is b 'sectional drawing and cc' sectional drawing.

  The configuration of the first electrode portion in this example is the same as that of the first example shown in FIG. 5 except for the structure of the bus electrode and the structure of the insulating film. As shown in FIG. 8, in region A, a first bus electrode 516 provided on the main surface of the first electrode substrate 514 (in this example, formed in part along the side surface of the first electrode in region A is formed. The second bus electrode 518 is provided over the second bus electrode 518 via the insulating film 520, and further, the first electrode (502A, 504A, 506A) is provided on the second bus electrode 518 (FIG. 8 ( a) and (b)). In the region B, the insulating film 520 is provided up to the end portion of the region B at the side surface portion of the first electrode, and the first bus electrode 516 is provided up to a part of the region B on the surface of the first electrode substrate 514. (FIGS. 8A, 8C and 8D). Here, the connection between the first bus electrode 516 and the first electrode is achieved by the protruding portion 822 from the insulating film formed on the first bus electrode (FIGS. 8A and 8B). In the example shown in FIG. 8, the insulating film is provided from the region A to the region B along the side surface of the first electrode. By forming a uniform insulating film in each region in this manner, the wiring structure of the electrode becomes constant, and when the first electrode portion is formed by photolithography, the light emission area of the divided region of the first electrode due to alignment accuracy It is possible to improve the problem of different.

  The organic EL light-emitting element including the first electrode portion having such a structure is an organic light-emitting layer disposed between the first electrode and the second electrode (not shown) connected to the second bus electrode in the region A. (Not shown) and an organic light emitting layer (not shown) disposed between the first electrode and the second electrode (not shown) connected to the first bus electrode in the region B are independent from each other. Driven.

  Also in this example, at least the side surface portion 521 of the insulating film 520 is preferably formed in a tapered shape. It is preferable to design the inclination angle of the insulating film 520 with the surface of the tapered first electrode substrate 514 to be 7 ° or more and less than 30 °. This is because the conductivity of the first electrode (502A, 504A, 506A) formed on the insulating film 520 can be sufficiently ensured. Preferably, this angle is not less than 7 ° and less than 10 °.

  Next, a second modification of the first example will be described with reference to FIG. This example is an example in which the first electrode is divided into two regions A and B and an insulating film is provided in the vicinity of the bus electrode, as in the first modification, and the insulating film 520 is changed from the region A to the region B. The first bus electrode 516 provided with a plurality of protrusions 922 is formed along the side surface of the region B up to the vicinity of the end of the region B. 9A is a plan view of a part of the first electrode portion, and FIGS. 9B and 9C are cross-sectional views taken along the lines aa ′ and bb ′ of FIG. 9A. It is.

  The configuration of the first electrode portion in this example is the same as that of the first example shown in FIG. 5 except for the structure of the first bus electrode and the structure of the insulating film. As shown in FIG. 9, in the region A, the second bus electrode 518 is provided on the first bus electrode 516 provided on the main surface of the first electrode substrate 514 via the insulating film 520, and A first electrode (502A, 504A, 506A) is provided on the second bus electrode 518 (FIGS. 9A and 9B). In the region B, the insulating film 520 is provided up to the end portion of the region B at the side surface portion of the first electrode, and the first bus electrode 516 is provided up to the end portion of the region B on the surface of the first electrode substrate 514. (FIGS. 9A and 9C). Here, the connection between the first bus electrode 516 and the first electrode is achieved by a plurality of protrusions 922 from the insulating film formed on the first bus electrode (FIGS. 9A and 9B). In the example shown in FIG. 9, the insulating film is provided from the region A to the region B along the side surface of the first electrode. By forming a uniform insulating film in each region in this manner, the wiring structure of the electrode becomes constant, and when the first electrode portion is formed by photolithography, the light emission area of the divided region of the first electrode due to alignment accuracy It is possible to improve the problem of different.

  The organic EL light-emitting element including the first electrode portion having such a structure is an organic light-emitting layer disposed between the first electrode and the second electrode (not shown) connected to the second bus electrode in the region A. (Not shown) and an organic light emitting layer (not shown) disposed between the first electrode and the second electrode (not shown) connected to the first bus electrode in the region B are independent from each other. Driven.

  Also in this example, at least the side surface portion 521 of the insulating film 520 is preferably formed in a tapered shape. It is preferable to design the inclination angle of the insulating film 520 with the surface of the tapered first electrode substrate 514 to be 7 ° or more and less than 30 °. This is because the conductivity of the first electrode (502A, 504A, 506A) formed on the insulating film 520 can be sufficiently ensured. Preferably, this angle is not less than 7 ° and less than 10 °.

  Next, a third modification of the first example will be described with reference to FIG. This example is an example in which the first electrode is divided into two regions A and B and an insulating film is provided in the vicinity of the bus electrode, as in the second modified example. The insulating film 520 is changed from the region A to the region B. And a plurality of connection holes 1022 are provided in the insulating film. The first bus electrode 516 is formed along the side surface of the region B up to the vicinity of the end of the region B, and does not have a protruding portion. FIG. 10A is a plan view of a part of the first electrode portion, and FIGS. 10B and 10C are cross-sectional views taken along the lines aa ′ and bb ′ of FIG. It is.

  The configuration of the first electrode portion in this example is the same as that of the first example shown in FIG. 9 except for the structure of the first bus electrode and the structure of the insulating film. As shown in FIG. 10, in the region A, the second bus electrode 518 is provided on the first bus electrode 516 provided on the main surface of the first electrode substrate 514 via the insulating film 520, and A first electrode (502A, 504A, 506A) is provided on the second bus electrode 518 (FIGS. 10A and 10B). In the region B, the insulating film 520 is provided up to the end portion of the region B at the side surface portion of the first electrode, and the first bus electrode 516 is provided up to the end portion of the region B on the surface of the first electrode substrate 514. (FIGS. 10A and 10C). Here, the connection between the first bus electrode 516 and the first electrode is achieved by a plurality of connection holes (a plurality of openings) 1022 of the insulating film formed in the insulating film 520 (FIGS. 10A and 10B). )). Further, the connection between the first bus electrode 516 and the first electrode may be achieved by embedding the first electrode in the connection hole, and a conductive metal different from the first electrode (for example, Cu, Mo, Al). Etc.) may be achieved through this conductive metal, embedded in the connection hole. In the example shown in FIG. 10, the insulating film is provided from the region A to the region B along the side surface of the first electrode. By forming a uniform insulating film in each region in this manner, the wiring structure of the electrode becomes constant, and when the first electrode portion is formed by photolithography, the light emission area of the divided region of the first electrode due to alignment accuracy It is possible to improve the problem of different.

  The organic EL light-emitting element including the first electrode portion having such a structure is an organic light-emitting layer disposed between the first electrode and the second electrode (not shown) connected to the second bus electrode in the region A. (Not shown) and an organic light emitting layer (not shown) disposed between the first electrode and the second electrode (not shown) connected to the first bus electrode in the region B are independent from each other. Driven.

  Also in this example, at least the side surface portion 521 of the insulating film 520 is preferably formed in a tapered shape. It is preferable to design the inclination angle of the insulating film 520 with the surface of the tapered first electrode substrate 514 to be 7 ° or more and less than 30 °. This is because the conductivity of the first electrode (502A, 504A, 506A) formed on the insulating film 520 can be sufficiently ensured. Preferably, this angle is not less than 7 ° and less than 10 °.

  Next, a second example will be described with reference to FIG. The second example is an example in which the first electrode is divided into two regions A and B and an insulating film is provided on the entire surface of the first electrode substrate. FIG. 11A is a plan view of a part of the first electrode portion, and FIGS. 11B and 11C are cross-sectional views taken along the lines aa ′ and bb ′ of FIG. FIG. Each of the first electrodes (502, 504, 506) and the arrangement of the bus electrodes are the same as in the first example. The first bus electrode 516 and the second bus electrode 518 are insulated by an insulating film 520. A second bus electrode 518 is provided on the insulating film 520, and a first electrode (502 A, 504 A, 506 A) in the region A is provided on the second bus electrode 518. In the region B, as shown in the sectional view of FIG. 11C, an insulating film 520 is provided on the first bus electrode 516 provided on the surface of the first electrode substrate 514. This insulating film A part of the insulating film is removed by patterning so that the first electrodes (502B, 504B, and 506B) can be in contact with each other. Thus, in the present invention, in the region B, the insulating film has the opening 524 so that the first bus electrode and the first electrode can come into contact with each other. In the second example, the connection portion between the bus electrode and the first electrode is provided along the side surface 522 of the first electrode. The connection between the bus electrode and the first electrode by the opening may be achieved by the first electrode filling the opening, and a conductive metal different from the first electrode (for example, Cu, Mo, Al, etc.). May be achieved by embedding.

  Thus, in the second example, in the region A, the first electrode portion includes the first bus electrode 516 that is the first auxiliary wiring / the insulating film 520 / the second bus electrode 518 / that is the second auxiliary wiring. The first electrode (502A, 504A, 506A) has a structure, and in the region B, a first bus electrode 516 / insulating film 520 which is a first auxiliary wiring (except for a contact portion with the first electrode) / The first electrode (502B, 504B, 506B) has a structure. The organic EL light-emitting element including the first electrode portion having such a structure is an organic light-emitting layer disposed between the first electrode and the second electrode (not shown) connected to the second bus electrode in the region A. (Not shown) and an organic light emitting layer (not shown) disposed between the first electrode and the second electrode (not shown) connected to the first bus electrode in the region B are independent from each other. Driven.

  In the present invention, the insulating film is preferably formed in a tapered shape at a connection portion for connecting at least the first electrode and the bus electrode. The tapered shape of the insulating film is preferably designed so that the inclination angle is 7 ° or more and less than 30 °. This is because the conductivity of the first electrode formed on the insulating film can be sufficiently ensured. Preferably, this angle is not less than 7 ° and less than 10 °.

  In the case where the bus electrode is a stacked type as described above, in the above example, the example in which the connection portion between the first electrode and the bus electrode is provided on the side surface of the first electrode is shown, but the present invention is not limited thereto, For example, it can take various shapes as shown in FIG. 12 (FIG. 12 shows only one portion of the first electrode divided into two regions, and FIG. 12 (i ) Is given a sign only.) In particular, in the present invention, the connection portion can be one or a plurality of protruding portions of the bus electrode, or one or a plurality of connection holes (openings) on the insulating film. The opening may be embedded with the first electrode in order to connect the first electrode capital bus electrode, and is embedded with a conductive metal (for example, Cu, Mo, Al, etc.) different from the first electrode. May be.

  As represented by FIGS. 12 (a) and (f), the connecting portion may be provided at the corner of the first electrode, as shown in FIGS. 12 (b) to (e) and (g) to (i). As represented, it may be provided in parallel to the end portions (526, 528, 530, 532) of the first electrode. When the connection portions are formed in parallel in this way, the first electrode is formed so as to cover the bus electrode as shown in FIGS. 12B, 12C, 12D, 12G, and 12H. Alternatively, it may be formed so as not to cover the bus electrode as shown in FIGS.

  When the connecting portion is provided in parallel to the end portions (526, 528, 530, 532) of the first electrode, the connecting portion is formed at an equal distance (d) from the adjacent end face (528, 530) of the first electrode. (See, for example, FIG. 12 (b), (e), (g) or (i)). As long as the distance (d) is the same, the connecting portion may be formed at any distance from the end portion. By forming the connection portion in this way and forming the connection portion in this way, the luminance does not change sharply at the boundary of the divided regions even when divided driving is performed as described above in order to increase the duty. Therefore, it is preferable.

  In the first embodiment, the insulating film 520 can be provided at various positions such as the vicinity of the bus electrode and the entire surface on the first electrode substrate as described above. Although not shown in the drawing, the insulating film 520 may be formed only in the region A, for example.

Next, a third example will be described. The third example is an example in which the first electrode is divided into three regions A, B, and C as shown in FIG.
FIG. 13A is a plan view of a part of the first electrode portion, and FIGS. 13B, 13C, and 13D are cross-sectional views taken along the line aa ′ in FIG. It is b 'sectional drawing and cc' sectional drawing. Each of the first electrodes (502, 504, 506) corresponds to each emission color of red, green, and blue, and each of these electrodes is provided on the first electrode substrate described above. 508, a connection portion 510 for connecting to an external drive circuit, and a lead-out portion 512. The display section includes a region A (first electrodes in these regions are 502A, 504A, and 506A) and a region B (first electrodes in these regions are 502B, 504B, and 506B). , Region C (the first electrodes in these regions are designated as 502C, 504C, and 506C), and an insulating film is provided in a part of the first electrode portion over these regions A and B.

  In the region A, as shown in the cross-sectional view of FIG. 13B, the first bus electrode 516 is provided on the main surface of the first electrode substrate 514, and this is covered with the first insulating film 1004. A second bus electrode 518 is provided on the insulating film 1004. Further, a second insulating film 520 is provided on the second bus electrode 518, and a third bus electrode 1002 is provided on the insulating film 520. A first electrode (502A, 504A, 506A) is provided on the third bus electrode 1002. The first insulating film 1004 extends to a region B, which will be described later, and the second insulating film 520 is provided in the vicinity of the bus electrode in the region A. The third bus electrode 1002 is formed in the region A.

  In the region B, as shown in the cross-sectional view of FIG. 13C, the first bus electrode 516 is provided on the main surface of the first electrode substrate 514, and this is covered with the first insulating film 1004. A second bus electrode 518 is provided on the insulating film 1004. Further, the first electrodes (502B, 504B, 506B) are provided on the second bus electrode 518. The first insulating film 1004 is provided in the vicinity of the bus electrode in the region B.

  In the region C, as shown in the cross-sectional view of FIG. 13D, the first electrode (502C, 504C, 506C) is provided on the first bus electrode 516 provided on the surface of the first electrode substrate 514. It has a structure. In the example shown in FIG. 13, the connection portion between the bus electrode and the first electrode is provided along the side surface 522 of the first electrode.

  The organic EL light-emitting element including the first electrode portion having such a structure includes an organic light-emitting layer (not shown) disposed between the third bus electrode 1002 and the second electrode (not shown) in the region A. An organic light emitting layer (not shown) disposed between a first electrode and a second electrode (not shown) connected to the second bus electrode in region B, and connected to the first bus electrode in region C The organic light emitting layer (not shown) disposed between the formed first electrode and second electrode (not shown) is driven independently of each other.

  Also in the third example, at least the side surface portion 1006 of the first insulating film 1004 and at least the side surface portion 521 of the second insulating film 520 are preferably formed in a tapered shape. It is preferable that the angle of inclination of the insulating film with the surface of the tapered first electrode substrate 514 is designed to be 7 ° or more and less than 30 °. This is because the conductivity of the first electrodes (502, 504, 506) formed on the insulating film can be sufficiently ensured. Preferably, this angle is not less than 7 ° and less than 10 °.

  Next, a fourth example will be described with reference to FIG. The fourth example is an example in which the first electrode is divided into three regions A, B, and C, and an insulating film is provided on the entire surfaces of the regions A and B. FIG. 14A is a plan view of a part of the first electrode portion, and FIGS. 14B, 14C, and 14D are cross-sectional views taken along the line aa ′ in FIG. It is sectional drawing of b 'and cc' sectional drawing. Each of the first electrodes (502, 504, 506) and the arrangement of the bus electrodes are the same as in the third example. In the region A, as shown in FIG. 14B, the first bus electrode 516 and the second bus electrode 518 are insulated by the first insulating film 1102 formed in the regions A and B. A second bus electrode 518 is provided on the insulating film 1102, and a second insulating film 520 is provided on the second bus electrode 518. A third bus electrode 1002 is formed on the second insulating film 520, and first electrodes (502A, 504A, 506A) are provided on the third bus electrode. In the region B, as shown in FIG. 14C, the second bus electrode 518 is provided on the insulating film 1102, and the first electrode (502B, 504B, 506B) is provided on the second bus electrode 518. Is provided. In the region C, as shown in FIG. 14D, the first electrode (502C, 504C, 506C) is provided on the first bus electrode 516 provided on the surface of the first electrode substrate 514. . In the fourth example, the connection portion between the bus electrode and the first electrode is provided along the side surfaces 522A, 522B, and 522C of the first electrode.

  In the fourth example, the insulating film 1102 is formed up to the region B. However, in the present invention, the insulating film is provided over the regions A to C as provided over the regions A and B as described in the second example. Also good. In this case, in the region C, the first bus electrode and the first electrode are connected through an opening provided in the insulating film 1102 (corresponding to 524 in FIG. 11A). The insulating film is preferably formed in a tapered shape at least at a connection portion for connecting the first electrode and the bus electrode. The tapered shape of the insulating film is preferably designed so that the inclination angle is 7 ° or more and less than 30 °. This is because the conductivity of the first electrode formed on the insulating film can be sufficiently ensured. Preferably, this angle is not less than 7 ° and less than 10 °.

  In the present invention, as described above, the connecting portion is preferably provided at an equal distance from the adjacent end face of the first electrode. Therefore, the fourth example preferably has a structure as shown in FIG. As shown in FIG. 15, the first bus electrode 516, the second bus electrode 518, and the third bus electrode 1003 are respectively connected to the first electrodes (502A, 504A, 506A, 502B, 504B, 506B, 502C, 504C). , 506C). In such an arrangement, the first insulating film 1102 and the second insulating film 520 are in the middle of the region B and in the middle of the region C (that is, the positions of the connection portions of the first bus electrode and the second bus electrode), respectively. Is formed. The connection between the bus electrode and the first electrode through the opening or the connection hole may be realized by embedding the first electrode in the opening or the connection hole. For example, Cu, Mo, Al, etc.) may be embedded.

  In addition to the structure shown in FIGS. 13 to 15, for example, as described in the example in which the first electrode is divided into the regions A and B with reference to FIG. The configuration can be taken. The arrangement of the bus electrode, the insulating film, the first electrode, and the like may be expanded and applied when the example of FIG. 12 is divided into three based on the contents described with reference to FIGS.

<Second Embodiment>
The second embodiment is an example in which bus electrodes are formed in parallel. A first example is shown in FIG. In this example, the first electrode is divided into two regions A and B. 16 (a) is a plan view of a part of the first electrode portion, and FIGS. 16 (b), (c) and (d) are cross-sectional views taken along the line aa ′ in FIG. 16 (a), respectively. It is sectional drawing of bb ', and cc' sectional drawing. As shown in FIG. 16, the first electrode unit includes a display unit 1302 provided on the first electrode substrate, a connection unit 1304 for connecting to an external driving circuit, and a lead-out unit 1306. The display unit 1302 has two areas, an area A and an area B. In the example of FIG. 16, the insulating film is provided in a part of the first electrode portion over these regions. Among these, the first bus electrode 1310 and the second bus electrode 1312 are provided in the region A on the surface of the first electrode substrate 1308 as shown in the cross-sectional views of FIGS. 16B and 16C. Yes. The first bus electrode is formed between the first electrodes, and the second bus electrode is formed between adjacent first bus electrodes. The first electrodes (1314A, 1316A, 1318A) are provided so as to overlap a part of the insulating film 1320 formed on the first bus electrode 1310 and to be in contact with the second bus electrode. That is, the second bus electrode is in contact with the first electrode (1314A, 1316A, 1318A) on one end 1322 side of the first electrode (1314A, 1316A, 1318A). The insulating film 1320 is between the first electrodes, and is formed so as to partially overlap the first film and cover the first bus electrode.

  In the region B, as shown in the cross-sectional view of FIG. 16D, the first bus electrode 1310 is provided on the surface of the first electrode substrate 1308. The first bus electrode is formed between the first electrodes. The first electrode (1314B, 1316B, 1318B) is provided so as to overlap with a part of the insulating film 1320 formed on the first bus electrode 1310. The first bus electrode is in contact with the first electrode (1314B, 1316B, 1318B) on one end 1328 side of the first electrode (1314B, 1316B, 1318B). The insulating film 1320 is between the first electrodes, and is formed so as to partially overlap the first film and cover the first bus electrode.

  In the present invention, as shown in FIG. 16, the bus electrode is preferably connected to the first electrode at a position equidistant from the adjacent ends 1324 and 1326 of the first electrode. This is as described in the first embodiment.

  In FIG. 16A, the first electrode is provided so as not to extend on the first bus electrode. However, in the present invention, since the insulating film is provided, the first electrode extends on the first bus electrode. It can also be provided. Such an example is shown in FIG. Such a structure is effective when the first bus electrodes are provided at the corners of the first electrodes (1314B, 1316B, 1318B) as shown in FIG.

  An outline of this structure will be described below. In the region A, as shown in FIG. 17B (aa ′ enlarged cross-sectional view in FIG. 17), the first electrode (1314A, 1316A, 1318A) is located between the two first bus electrodes 1310. The second bus electrode 1312 is connected so as to cover the surface of the second bus electrode 1312. In the region B, as shown in FIG. 17C (an enlarged cross-sectional view taken along line bb ′ in FIG. 17A), a first bus electrode 1310 is provided on the surface of the first electrode substrate 1308. Corner portions of the first electrodes (1314B, 1316B, 1318B) are connected so as to cover the surface of the first bus electrode 1310. FIG. 17 shows the case where the line widths of the first bus electrode and the second bus electrode are different. Also in the second embodiment, as in the first embodiment, the bus electrode can appropriately select the material, the line width, and / or the film thickness to prevent variation in luminance between regions. preferable.

As in the example shown in FIG. 17, the first electrode has two regions (A, B), and the first electrodes in the region A are a plurality of alternately arranged and spaced apart from each other. The first bus electrode 1310 and a plurality of second bus electrodes 1312 are provided. The first bus electrode is covered with an insulating film 1320 in the region A. The second bus electrode 1312, a first electrode on the connection portion _{S A (1314A, 1316A, 1318A} ) and is provided directly to electrically connect. Furthermore, the first electrodes (1314A, 1316A, 1318A) extend to the top surface of the insulating film 1320 to the position where the first bus electrode is provided.

  In addition, the first electrode in the region B includes a plurality of first bus electrodes (1314B, 1316B, 1318B) that are spaced apart from each other, and the first electrode is formed on the entire upper surface of the first bus electrode 1310. The corner portion on the end 1326 side is directly provided so as to be electrically connected.

  16 or 17, the first electrode (1314A, 1316A, 1318A) is connected to the second bus electrode 1312 in the region A, and the first electrode (1314B, 1316B, 1318B) in the region B. ) Is connected to the first bus electrode 1310, and the portion corresponding to the region A and the portion corresponding to the region B in the organic EL layer provided between the first electrode and the second electrode are mutually connected. It will be driven independently.

  The connection position of the first electrode and the bus electrode can take various positions as described in the first embodiment. Further, the shape of the connecting portion can take various shapes other than those shown in FIGS. 16 and 17, such as a shape along the side surface of the first electrode. 16 and 17, the insulating film is provided on a part of the first electrode substrate, particularly on the bus electrode. However, the present invention is not limited to this and is formed on the entire surface of the first electrode substrate. can do. In this case, for example, a first insulating film can be provided on the first bus electrode, and a second bus electrode can be provided on the first insulating film, whereby the bus electrode is formed stepwise. Can do. Further, in the examples other than the examples of FIGS. 16 and 17, it is preferable that the side surface portion and the end surface of the insulating film, or the portion for forming the connecting portion of the insulating film is formed in a tapered shape. The tapered shape of the insulating film is preferably designed so that the inclination angle is 7 ° or more and less than 30 °. This is because the conductivity of the first electrode formed on the insulating film can be sufficiently ensured. Preferably, this angle is not less than 7 ° and less than 10 °.

  Next, a modification of the first example will be described with reference to FIGS. In these examples, the first bus electrode is provided with a protrusion, or the insulating film is provided with a plurality of connection holes. The shape and number of these protrusions and connection holes are arbitrary. First, a first modification is shown in FIG. In this example, as in the first example, the first electrode is divided into two regions A and B, and an insulating film is provided in the vicinity of the first bus electrode. The region B is formed. 18A is a plan view of a part of the first electrode portion, and FIGS. 18B, 18C, and 18D are cross-sectional views taken along line aa ′ in FIG. It is b 'sectional drawing and cc' sectional drawing.

  The configuration of the first electrode portion in this example is substantially the same as the example shown in FIG. 16 except that the connection portion between the bus electrode and the first electrode is provided across the width direction of the first electrode. As shown in FIG. 18, in the region A, the first bus electrode 1310 provided on the main surface of the first electrode substrate 1308 (in this example, it is formed in part along the side surface of the first electrode in the region A. The first electrode (1314A, 1316A, 1318A) is provided so as to cover the insulating film 1320 and the second bus electrode 1312 (FIG. 18A). And (b)). In the region B, the insulating film 1320 is provided up to the end portion of the region B at the side surface portion of the first electrode, and the first bus electrode 1310 is provided up to a part of the region B on the surface of the first electrode substrate 1308. (FIGS. 18A, 18C and 18D). Here, the connection between the first bus electrode 1310 and the first electrode is achieved by the protruding portion 822 from the insulating film formed on the first bus electrode (FIGS. 18A and 18B). In the example shown in FIG. 18, the insulating film is provided from the region A to the region B along the side surface portion of the first electrode. By forming a uniform insulating film in each region in this manner, the wiring structure of the electrode becomes constant, and when the first electrode portion is formed by photolithography, the light emission area of the divided region of the first electrode due to alignment accuracy It is possible to improve the problem of different.

  The organic EL light-emitting element including the first electrode portion having such a structure is an organic light-emitting layer disposed between the first electrode and the second electrode (not shown) connected to the second bus electrode in the region A. (Not shown) and an organic light emitting layer (not shown) disposed between the first electrode and the second electrode (not shown) connected to the first bus electrode in the region B are independent from each other. Driven.

  Also in this example, at least the side surface portion 521 of the insulating film 1320 is preferably formed in a tapered shape. It is preferable that the angle of inclination of the insulating film 1320 with the surface of the tapered first electrode substrate 1308 is 7 ° or more and less than 30 °. This is because the conductivity of the first electrodes (1314A, 1316A, and 1318A) formed over the insulating film 1320 can be sufficiently ensured. Preferably, this angle is not less than 7 ° and less than 10 °.

  Next, a second modification of the first example will be described with reference to FIG. This example is an example in which the first electrode is divided into two regions A and B and an insulating film is provided in the vicinity of the first bus electrode, as in the first modification. The first bus electrode 1310 is formed up to the region B, and further provided with a plurality of protrusions 922, and is formed along the side surface of the region B to the vicinity of the end of the region B. 19A is a plan view of a part of the first electrode portion, and FIGS. 19B and 19C are aa ′ sectional view and bb ′ sectional view of FIG. 19A. It is.

  The configuration of the first electrode portion in this example is the same as that of the first example shown in FIG. 18 except for the structure of the first bus electrode. As shown in FIG. 19, the first bus electrode 1310 is provided on the main surface of the first electrode substrate 1308 (in this example, along the side surfaces of the first electrodes in the regions A and B, to the end of the region B). A first electrode (1314A, 1316A, 1318A) is provided on the insulating film 1320 (FIGS. 19A and 19B). Also, the insulating film 1320 is provided from the side surface portion of the first electrode to the end portions of the regions A to B (FIGS. 19A and 19C). Here, the connection between the first bus electrode 1310 and the first electrode is achieved by a plurality of protrusions 922 from the insulating film formed on the first bus electrode (FIGS. 9A and 9B). In the region A, the second bus electrode is provided up to a part of the region A in a region where the insulating film 1320 is not provided in parallel to the first bus electrode, and is connected to a part of the first electrode. In the example shown in FIG. 19, the insulating film is provided from the region A to the region B along the side surface portion of the first electrode. By forming a uniform insulating film in each region in this manner, the wiring structure of the electrode becomes constant, and when the first electrode portion is formed by photolithography, the light emission area of the divided region of the first electrode due to alignment accuracy It is possible to improve the problem of different.

  The organic EL light-emitting element including the first electrode portion having such a structure is an organic light-emitting layer disposed between the first electrode and the second electrode (not shown) connected to the second bus electrode in the region A. (Not shown) and an organic light emitting layer (not shown) disposed between the first electrode and the second electrode (not shown) connected to the first bus electrode in the region B are independent from each other. Driven.

  Also in this example, at least the side surface portion 521 of the insulating film 1320 is preferably formed in a tapered shape. It is preferable that the angle of inclination of the insulating film 1320 with the surface of the tapered first electrode substrate 1308 is 7 ° or more and less than 30 °. This is because the conductivity of the first electrodes (1314A, 1316A, and 1318A) formed over the insulating film 1320 can be sufficiently ensured. Preferably, this angle is not less than 7 ° and less than 10 °.

  Next, a third modification of the first example will be described with reference to FIG. In this example, as in the second modification, the first electrode is divided into two regions A and B, and an insulating film is provided in the vicinity of the bus electrodes in the regions A and B. In this example, as shown in FIG. 20, an insulating film 1320 is formed from region A to region B, and a plurality of connection holes 1022 are provided in the insulating film. The first bus electrode 1310 is formed along the side surface of the region B up to the vicinity of the end of the region B, and does not have a protruding portion. 20A is a plan view of a part of the first electrode portion, and FIGS. 20B and 20C are aa ′ sectional view and bb ′ sectional view of FIG. 20A. It is.

  The configuration of the first electrode portion in this example is the same as that of the first example shown in FIG. 19 except for the structure of the first bus electrode and the structure of the insulating film. As shown in FIG. 20, in the region A, the first bus electrode 1310 provided on the main surface of the first electrode substrate 1308 (in this example, the region B along the side surfaces of the first electrodes in the regions A and B). The first electrode is provided with an insulating film 1320 interposed therebetween. The second bus electrode 1312 is provided up to a part of the region A in parallel with the first bus electrode in a region where the insulating film 1320 is not provided, and is connected to the first electrode (1314A, 1316A, 1318A) (FIG. 20 ( a) and (b)). In the region B, the insulating film 1320 is provided to the end portion of the region B at the side surface portion of the first electrode, and the first bus electrode 1310 is provided to the end portion of the region B on the surface of the first electrode substrate 1308. (FIGS. 20A and 20C). Here, the connection between the first bus electrode 1310 and the first electrode is achieved by a plurality of connection holes (a plurality of openings) 1022 of the insulating film formed in the insulating film 1320 (FIGS. 20A and 20B). )). In the example shown in FIG. 20, the insulating film is provided from the region A to the region B along the side surface portion of the first electrode. By forming a uniform insulating film in each region in this manner, the wiring structure of the electrode becomes constant, and when the first electrode portion is formed by photolithography, the light emission area of the divided region of the first electrode due to alignment accuracy It is possible to improve the problem of different.

  The organic EL light-emitting element including the first electrode portion having such a structure is an organic light-emitting layer disposed between the first electrode and the second electrode (not shown) connected to the second bus electrode in the region A. (Not shown) and an organic light emitting layer (not shown) disposed between the first electrode and the second electrode (not shown) connected to the first bus electrode in the region B are independent from each other. Driven.

  Also in this example, at least the side surface portion 521 of the insulating film 1320 is preferably formed in a tapered shape. It is preferable that the angle of inclination of the insulating film 1320 with the surface of the tapered first electrode substrate 1308 is 7 ° or more and less than 30 °. This is because the conductivity of the first electrodes (1314A, 1316A, and 1318A) formed over the insulating film 1320 can be sufficiently ensured. Preferably, this angle is not less than 7 ° and less than 10 °.

  Next, a second example will be described. The second example is an example in which the first electrode is divided into three regions A, B, and C as shown in FIGS. In these drawings, a case where the connection positions of the first electrode and the bus electrode, which are preferred embodiments of the present invention, are formed at an equal distance from the end face of the adjacent first electrode is shown. However, in the present invention, as described in the first embodiment, the position and shape of the connection portion can take various forms.

  In the example of FIG. 21, insulating films are formed in regions A to C on the first bus electrode and the second bus electrode. FIG. 21A is a plan view of a part of the first electrode portion, and FIGS. 21B, 21C, 21D, and 21E are cross-sectional views taken along the line aa ′ in FIG. FIG. 4 is a cross-sectional view taken along line bb ′, a cross-sectional view taken along line cc ′, and a cross-sectional view taken along line dd ′. Each of the first electrodes (1314, 1316, 1318) corresponds to each of red, green, and blue emission colors, and each of these electrodes is provided on the first electrode substrate described above. It comprises a part 1302, a connection part with an external drive circuit, and a lead part 1304. The display unit includes a region A, a region B, and a region C, and an insulating film is provided over a part of the first electrode unit over these regions.

  In the region A, as shown in the cross-sectional view of FIG. 21B, the first bus electrode 1310 and the second bus electrode 1312 are provided on the main surface of the first electrode substrate 1308, which is covered with the insulating film 1320. ing. Third bus electrode 1330 is provided on the main surface of first electrode substrate 1308. A first electrode (1314A, 1316A, 1318A) is provided on the third bus electrode 1330. Insulating film 1320 is provided in the vicinity of first and second bus electrodes in region A. The third bus electrode is formed in the region A. In the example of FIG. 21, the third bus electrode is not covered with an insulating film, but the insulating film may cover the third bus electrode except for the connection portion of the third bus electrode. In the region A, the connection portion between the bus electrode and the first electrode is provided in the central portion of the first electrode in parallel with the end surface 1324.

  In the region B, as shown in the cross-sectional views of FIGS. 21C and 21D, the first bus electrode 1310 and the second bus electrode 1312 are provided on the main surface of the first electrode substrate 1308, which is the insulating film 1320. Covered with The insulating film 1320 is provided in the vicinity of the bus electrode. In the region B, the second bus electrode extending from the insulating film 1320 to the center position of the first electrode (1314B, 1316B, 1318B) and the first electrode are connected (FIG. 21D).

  In the region C, as shown in the sectional view of FIG. 21E, the first electrodes (1314C, 1316C, and 1318C) are provided on the first bus electrode 1310 provided on the surface of the first electrode substrate 1308. It has a structure. Also in the region C, the connection portion between the bus electrode and the first electrode is provided in the central portion of the first electrode in parallel with the end face 1332.

An organic EL light-emitting element including the first electrode portion having such a structure includes an organic light-emitting layer disposed between a first electrode and a second electrode (not shown) connected to the third bus electrode in the region A. (Not shown), an organic light emitting layer (not shown) disposed between the first electrode and the second electrode (not shown) connected to the second bus electrode in region B, and The organic light emitting layer (not shown) disposed between the first electrode and the second electrode (not shown) connected to the first bus electrode are driven independently of each other.
Also in the second example, it is preferable that at least both side portions of the insulating film 1320 be formed in a tapered shape. It is preferable to design the inclination angle of the insulating film with the surface of the tapered first electrode substrate 1308 to be 7 ° or more and less than 30 °. This is because the conductivity of the first electrode (1314, 1316, 1318) formed on the insulating film can be sufficiently ensured. Preferably, this angle is not less than 7 ° and less than 10 °.

  Next, the example of FIG. 22 will be described. In this example, the insulating film 1320 is provided on the entire surface of the first electrode substrate (except for the connection portion between the bus electrode and the first electrode). 22A is a plan view of a part of the first electrode portion, and FIGS. 22B, 22C, and 22D are cross-sectional views taken along line aa ′ in FIG. It is b 'sectional drawing and cc' sectional drawing. The arrangement of the connection / extraction part with the external drive circuit, the display part (excluding the insulating film), the first electrode, and the first to third bus electrodes is the same as the example of FIG. The display unit includes a region A, a region B, and a region C.

  In the region A, as shown in the cross-sectional view of FIG. 22B, the first bus electrode 1310 and the second bus electrode 1312 are provided on the main surface of the first electrode substrate 1308, which is covered with the insulating film 1320. Yes. The insulating film is formed on the entire surface of the first electrode substrate in the region A. The third bus electrode is formed in the region A. A first electrode (1314A, 1316A, 1318A) is provided on the third bus electrode 1330. In the example of FIG. 22, the third bus electrode is not covered with an insulating film. In the region A, the connection portion between the bus electrode and the first electrode is provided at the central portion of the first electrode and is provided in parallel with the end surface 1324 of the first electrode.

  In the region B, as shown in the sectional view of FIG. 22C, the first bus electrode 1310 and the second bus electrode 1312 are provided on the main surface of the first electrode substrate 1308, which is covered with the insulating film 1320. Yes. The insulating film 1320 is provided on the entire surface of the first electrode substrate except for the connection portion between the second bus electrode and the first electrode. In the region B, an opening for a connecting portion extends at the center position of the first electrode (1314B, 1316B, 1318B) of the insulating film 1320, and the first electrode and the second bus electrode are connected to the opening. ing. Also in the region B, the connection portion between the bus electrode and the first electrode is the central portion of the first electrode, and is provided in parallel with the end faces 1326 and 1328 of the first electrode.

  In the region C, as shown in the sectional view of FIG. 22D, the first bus electrode 1310 and the insulating film 1320 are provided on the surface of the first electrode substrate 1308. In the region C, the insulating film is provided on the entire surface of the first electrode substrate except for the connection portion between the first bus electrode and the first electrode (1314C, 1316C, 1318C). A first electrode (1314C, 1316C, 1318C) is provided on the insulating film. Also in the region C, the connection portion between the bus electrode and the first electrode is provided in parallel with the end surface 1332 at the center portion of the first electrode.

An organic EL light-emitting element including the first electrode portion having such a structure includes an organic light-emitting layer disposed between a first electrode and a second electrode (not shown) connected to the third bus electrode in the region A. (Not shown), an organic light emitting layer (not shown) disposed between the first electrode and the second electrode (not shown) connected to the second bus electrode in region B, and The organic light emitting layer (not shown) disposed between the first electrode and the second electrode (not shown) connected to the first bus electrode are driven independently of each other.
Also in this example, the insulating film 1320 is preferably formed in a tapered shape at least at the connection portion. It is preferable to design the inclination angle of the tapered shape of these insulating films to be 7 ° or more and less than 30 °. This is because the conductivity of the first electrode (1314, 1316, 1318) formed on the insulating film can be sufficiently ensured. Preferably, this angle is not less than 7 ° and less than 10 °.

  Next, an example of FIG. 23 will be described. In the example of FIG. 23, two types of insulating films, a first insulating film 1702 and a second insulating film 1320, are used.

  FIG. 23A is a plan view of a part of the first electrode portion, and FIGS. 23B, 23C, 23D, and 23E are cross-sectional views taken along the line aa ′ in FIG. FIG. 4 is a cross-sectional view taken along line bb ′, a cross-sectional view taken along line cc ′, and a cross-sectional view taken along line dd ′. The arrangement of the connection / extraction part with the external drive circuit, the display part (excluding the insulating film), the first electrode, and the first to third bus electrodes is the same as the example of FIG. The display unit includes a region A, a region B, and a region C.

  In the region A, as shown in the cross-sectional view of FIG. 23B, the first bus electrode 1310 is provided on the main surface of the first electrode substrate 1308, which is covered with the first insulating film 1702. The insulating film 1702 is provided on the entire surface of the first electrode substrate in the region A. A second bus electrode is provided on the insulating film 1702 and in the vicinity of the first bus electrode. The second bus electrode is covered with a second insulating film 1320, and this insulating film 1320 is provided on the entire surface of the first insulating film 1702 in the region A. The third bus electrode 1330 is provided on the second insulating film 1320. A first electrode (1314A, 1316A, 1318A) is provided on the third bus electrode 1330. The third bus electrode is formed in the region A. In the region A, the connection portion between the bus electrode and the first electrode is provided in the central portion of the first electrode in parallel with the end surface 1324.

  In the region B, as shown in the cross-sectional views of FIGS. 23C and 23D, the first bus electrode 1310 is provided on the main surface of the first electrode substrate 1308, which is covered with the insulating film 1702. These arrangements and the like are as described in the region A. A second bus electrode 1312 is provided on the insulating film 1702 in the vicinity of the first bus electrode. The second bus electrode is formed over the regions A to B. A second insulating film 1320 is provided on the second bus electrode. In the region B, the second insulating film 1320 is provided with an opening for a connection portion at the center position of the first electrode (1314B, 1316B, 1318B), and the first electrode is interposed through the opening. And the second bus electrode are connected (FIG. 23D).

  In the region C, as shown in the cross-sectional view of FIG. 23 (e), the first electrodes (1314C, 1316C, 1318C) are provided on the first bus electrode 1310 provided on the surface of the first electrode substrate 1308. It has a structure. In the region C, the first bus electrode is provided over the regions A to C. A first insulating film 1702 is provided on the first electrode substrate in the region C on the first bus electrode, and a second insulating film 1320 is provided on the first insulating film. Also in the region C, the connection portion between the bus electrode and the first electrode is provided in the central portion of the first electrode in parallel with the end face 1332. As shown in FIG. 23E, the connection portion is provided in an opening provided so as to penetrate both the first insulating film and the second insulating film.

  An organic EL light-emitting element including the first electrode portion having such a structure includes an organic light-emitting layer disposed between a first electrode and a second electrode (not shown) connected to the third bus electrode in the region A. (Not shown), an organic light emitting layer (not shown) disposed between the first electrode and the second electrode (not shown) connected to the second bus electrode in region B, and The organic light emitting layer (not shown) disposed between the first electrode and the second electrode (not shown) connected to the first bus electrode are driven independently of each other.

  Also in this example, it is preferable that at least a portion where the connection portion is provided in the insulating film 1320 be formed in a tapered shape. It is preferable to design the inclination angle of the insulating film with the surface of the tapered first electrode substrate 1308 to be 7 ° or more and less than 30 °. This is because the conductivity of the first electrode (1314, 1316, 1318) formed on the insulating film can be sufficiently ensured. Preferably, this angle is not less than 7 ° and less than 10 °.

  The connection position of the first electrode and the bus electrode can take various positions as described in the first embodiment. Further, the shape of the connecting portion can take various shapes other than those shown in FIGS. 21 to 23 such as a shape along the side surface of the first electrode. Also in these examples, the side surfaces and end surfaces of the insulating film, the connection portion between the first electrode of the insulating film and the bus electrode, and the like are preferably formed in a tapered shape. It is preferable to design the inclination angle of the tapered shape of the insulating film to be 7 ° or more and less than 30 °. This is because the conductivity of the first electrode formed on the insulating film can be sufficiently ensured. Preferably, this angle is not less than 7 ° and less than 10 °.

  Also in the second embodiment, when the bus electrode and the first electrode are connected via an opening (including a case where a plurality of connection holes are provided), the opening may be embedded with the first electrode. It may be embedded with a conductive metal (for example, Cu, Mo, Al, etc.) different from the first electrode.

<Third Embodiment>
Next, a third embodiment will be described. In the third embodiment, bus electrodes are provided in combination of a stacked type and a parallel type.
A third embodiment will be described with reference to FIG. The example in FIG. 24 uses two types of insulating films, a first insulating film 1820 and a second insulating film 1842. Further, in this example, the first bus electrode and the second bus electrode are formed in a stacked type, and the third bus electrode is formed in parallel with these.

  FIG. 24A is a plan view of a part of the first electrode portion, and FIGS. 24B, 24C, and 24D are cross-sectional views taken along the line aa ′ in FIG. It is b 'sectional drawing and cc' sectional drawing. Each of the first electrodes (1814, 1816, 1818) corresponds to each emission color of red, green, and blue, and each of these electrodes is provided on the above-described first electrode substrate. It comprises a part 1802, a connection part 1804 for connecting to an external drive circuit, and a lead part 1806. The display unit has a region A, a region B, and a region C. As the insulating film, a first insulating film and a second insulating film are provided, the first insulating film is provided from region A to a part of region C, and the second insulating film is provided from part of regions A to B. It is done.

  In the region A, as shown in the cross-sectional view of FIG. 24B, the first bus electrode 1810 is provided on the main surface of the first electrode substrate 1808, which is covered with the first insulating film 1842. The insulating film 1842 is provided on the entire surface of the first electrode substrate in the region A. A second bus electrode 1812 is provided on the insulating film 1842 and on the first bus electrode. The second bus electrode 1812 is covered with a second insulating film 1820, and the insulating film 1820 is provided on the entire surface of the first insulating film 1842 in the region A. The third bus electrode 1830 is provided on the second insulating film 1820. A first electrode (1814A, 1816A, 1818A) is provided on the third bus electrode 1830. The third bus electrode is formed in the region A. In the example of FIG. 24, the third bus electrode 1830 is provided in parallel with the end face 1824 on the first electrode lead-out portion 1806 side.

  In the region B, as shown in the cross-sectional view of FIG. 24C, the first bus electrode 1810 is provided on the main surface of the first electrode substrate 1808, and this is covered with the insulating film 1842. These arrangements and the like are as described in the region A. A second bus electrode 1812 is provided on the insulating film 1842 and on the first bus electrode. The second bus electrode is provided from the region A to the lead portion 1806 side of the region B. A second insulating film 1820 is provided on the second bus electrode. In the region B, the second insulating film 1820 is provided with an opening for the connection portion in the vicinity of the end surface 1826 on the lead portion side of the first electrode (1814B, 1816B, 1818B), and the opening is provided through the opening. The first electrode and the second bus electrode are connected.

  In the region C, as shown in the cross-sectional view of FIG. 24D, the first electrode (1814C, 1816C) is formed on the first bus electrode 1810 provided up to the lead-out side of the region C on the surface of the first electrode substrate 1808. , 1818C). The first bus electrode is provided over the areas A to C. In the example of FIG. 24, the first insulating film is formed from the region A up to the connection portion provided in the vicinity of the end portion 1832 of the first bus electrode. The first insulating film 1842 has an opening or a notch at a connection portion between the first bus electrode 1810 and the first electrode (1814C, 1816C, 1818C). The electrodes (1814C, 1816C, 1818C) are electrically connected.

An organic EL light-emitting element including the first electrode portion having such a structure includes an organic light-emitting layer disposed between a first electrode and a second electrode (not shown) connected to the third bus electrode in the region A. (Not shown), an organic light emitting layer (not shown) disposed between the first electrode and the second electrode (not shown) connected to the second bus electrode in region B, and The organic light emitting layer (not shown) disposed between the first electrode and the second electrode (not shown) connected to the first bus electrode are driven independently of each other.
Also in this example, in the first insulating film 1842 and the second insulating film 1820, it is preferable to form at least a portion where the connection portion is provided in a tapered shape. The tapered shape of these insulating films is preferably designed so that the inclination angle is 7 ° or more and less than 30 °. This is because the conductivity of the first electrodes (1814, 1816, 1818) formed on the insulating film can be sufficiently ensured. Preferably, this angle is not less than 7 ° and less than 10 °.

  The connection position of the first electrode and the bus electrode can take various positions as described in the first embodiment. Also, the shape of the connecting portion can take various shapes other than that shown in FIG. 24, such as a shape along the side surface of the first electrode. In particular, also in this embodiment, as described in the first embodiment or the second embodiment, the bus electrode can be provided with a protruding portion, or the insulating film can be provided with a plurality of connection holes. The shape and number of protrusions and connection holes are arbitrary. Also in the third embodiment, when the bus electrode and the first electrode are connected via an opening (including a case where a plurality of connection holes are provided), the opening may be embedded with the first electrode. It may be embedded with a conductive metal (for example, Cu, Mo, Al, etc.) different from the first electrode. Also in these examples, the side surfaces and end surfaces of the insulating film, the connection portion between the first electrode of the insulating film and the bus electrode, and the like are preferably formed in a tapered shape. The tapered shape of the insulating film is preferably designed so that the inclination angle is 7 ° or more and less than 30 °. This is because the conductivity of the first electrode formed on the insulating film can be sufficiently ensured. Preferably, this angle is not less than 7 ° and less than 10 °.

  Also in each of the embodiments described above, the insulating film has a function of insulating between the bus electrodes, and a function of insulating the first electrode and the bus electrode other than the divided first electrode and bus electrode intended to be connected. In addition, it has a function of insulating from the organic EL layer formed on the bus electrode (for example, preventing injection of holes into the hole injection layer of the organic EL layer).

  As described above, the organic EL light emitting device of the present invention divides the first electrode into a predetermined number and connects it to an external circuit with the bus electrode, so that the first electrode in the divided region can be independently provided. To drive. In the present invention, the first electrode of the organic EL light-emitting element is divided into two in the scanning line direction at the center of the element (that is, divided into two in the vertical direction of the element), and the divided first electrode is Can be divided into a predetermined number. In the present invention, such a configuration is preferable. A terminal (bus electrode) of the first electrode divided into two in the scanning line direction is taken out from the upper and lower directions and connected to an external drive circuit.

<Insulating film>
The position where the insulating film of the present invention is formed will be described below in relation to the bus electrode. In the present invention, as described above, the insulating film is provided for the purpose of insulating between a plurality of bus electrodes. However, as long as this purpose is achieved, the connection portion of the organic EL light emitting element with the external drive circuit is provided. It can be arranged at various positions on the drawer part and the display part. However, in the present invention, by providing an insulating film at a specific position, various purposes such as prevention of short-circuiting of the bus electrodes and securing of the pitch of the bus electrodes can be achieved. An EL light emitting element can be obtained. In addition, the insulating film of the present invention is preferably formed uniformly in the display portion as shown in FIGS. 8 to 10 and FIGS. 18 to 20, for example. Furthermore, the insulating film can have openings such as a plurality of connection holes as connection portions. The shape and number of connection holes are arbitrary. The opening provided in the insulating film may be embedded with the first electrode, or may be embedded with a conductive metal (for example, Cu, Mo, Al, etc.) different from the first electrode.

  In the present invention, the above-described effect can be exhibited by providing an insulating film also in a lead-out portion or a connection portion with an external connection circuit. 25 and 26 are examples of arrangement of such an insulating film. The example shown in FIG. 24 is also an example in which the insulating film is formed up to the lead portion 1806, and has the same effect as that of the insulating film described below.

  FIG. 25 and FIG. 26 show an example of the arrangement pattern of the bus electrode capital first electrode, and an example in which the insulating film is formed up to a part of the lead part 1904 or the connection part 1902 with the external drive circuit. Accordingly, the following example is also a part of the above-described embodiment, and has the effect of the present invention that arises from the pattern of the arrangement of the bus electrode and the first electrode.

  FIG. 25A shows that the connection portion of the first bus electrode 1916 and the second bus electrode 1918 to the first electrode is formed along the side surface of the first electrode, and the insulating film is drawn from the lead portion 1904 to the region B. This is an example in which up to the portion side is provided. FIG. 25B shows an example in which the connection portion of the first bus electrode 1916 and the second bus electrode 1918 to the first electrode is provided on the lead portion side of the first electrode. In this example, the insulating film is provided with an opening so that the first electrode and the first bus electrode or the second bus electrode can be in electrical contact at the connection portion. The opening may be embedded with the first electrode or may be embedded with a conductive metal (for example, Cu, Mo, Al, etc.) different from the first electrode.

  In the example of FIGS. 25A and 25B, an insulating film 1914 is formed on the first bus electrode, and a second bus electrode 1918 is formed on the insulating film. Therefore, since the first bus electrode and the second bus electrode are separated from each other via the insulating film, the pitch between the bus electrodes in the lead-out portion is such that the first bus electrode and the second bus electrode are arranged in parallel on the first electrode substrate. As compared with the case where it provides, it can take twice as wide.

  FIG. 26A shows the same configuration as FIG. 25B, except that an insulating film is formed up to a part of the connection portion 1902 between the lead portion and the external drive circuit, and the end portion of the second bus electrode is formed. It stays on the insulating film. FIG. 26B shows an example in which an insulating film is formed in part of the connection portion 1902 with the external drive circuit, and the end of the second bus electrode is kept on the insulating film.

  In the example of FIGS. 26A and 26B, an insulating film 1914 is formed on the first bus electrode, and a second bus electrode is formed on the insulating film. Further, the connection portion with the external drive circuit is also divided into two regions (a portion where an insulating film is provided and a portion where no insulating film is provided), and the pitch between the bus electrodes including the joint portion can be widened. Accordingly, it is possible to prevent a short circuit due to a patterning failure between adjacent bus electrodes. In addition, since the first bus electrode and the second bus electrode are separated by an insulating film, a short circuit does not occur even when there is a displacement in the connection between the second bus electrode and the flexible printed circuit board of the external drive circuit. .

  In the example of FIG. 26C, the insulating film of FIG. 25B is formed by connecting the first bus electrode and the first electrode, the second bus electrode and the first electrode, and the external drive circuit connection. This is an example provided over the entire surface. Also in this case, the insulating film has the effects described in FIG.

  As described above, the organic EL light emitting device of the present invention is characterized by the configuration of the first electrode. In addition, in the organic EL light emitting device of the present invention, an insulating layer may be formed for the purpose of covering the end of each divided first electrode and defining the light emitting region. In this case, a negative photoresist such as an inorganic oxide or acrylate, or a polyimide material can be used as the insulating layer, and patterning can be performed by a method such as photolithography.

  Furthermore, a second electrode separation partition may be formed in a direction perpendicular to the first electrode and between the second electrodes. In this case, a negative photoresist such as acrylate or a negative photoresist such as novolak resin can be used for the second electrode separation partition. The second electrode separation partition has a reverse taper shape, and has a patterning function for the organic EL layer and the second electrode.

  In order to form the second electrode in a desired shape, when using a mask having an opening in the shape, the organic EL layer and the second electrode are formed without using the second electrode separation partition. be able to.

  In the organic EL light-emitting device of the present invention, when the region is divided into two, the bus electrode is compared to the second bus electrode compared to the first bus electrode, which is installed up to a place away from the lead portion. By using a material having a low electrical resistance (for example, Ag, Cu, or an alloy thereof) and using a material (Cr, Ni, Mo, W, etc.) having a higher electrical resistance for the second bus electrode. The wiring resistance can be made substantially the same. In addition, when the region is divided into three, the first and third bus electrodes have the relationship as described above, and the second bus electrode is made of a material having an intermediate electrical resistance, so that The wiring resistance can be made substantially the same. Further, the bus electrode has a bus electrode width and / or film thickness that is increased by the first bus electrode, and the bus electrode width and / or film thickness is sequentially decreased as the bus electrode becomes the second bus electrode and the third bus electrode. Therefore, the wiring resistance of each bus electrode can be made substantially the same. By doing in this way, the value of the voltage drop by the wiring resistance between bus electrodes can be made substantially equal in each area | region, and the difference in the brightness | luminance of each area | region can be eliminated.

  Next, a method for manufacturing the organic EL light emitting device of the present invention shown in FIG. 1 will be described. Hereinafter, a multicolor organic EL light emitting element will be described as an example. However, in the case of a so-called monochrome organic EL light emitting element, the formation of a color conversion filter may be omitted. Moreover, in the following description, the case where the 1st electrode 104 is an anode and the 2nd electrode 106 is a cathode is taken as an example.

  In the first step, a first electrode substrate having a color conversion filter is provided. In this specification, the organic EL light-emitting display element or the multi-color organic EL light-emitting display element having a color conversion filter means an organic EL light-emitting display element including at least a color conversion filter and an organic light-emitting element. In this specification, the color conversion filter includes a color conversion filter layer, and additionally includes, for example, a transparent substrate, a black matrix, a planarization layer, a passivation layer, and the like. The color conversion filter layer is a general term for a color filter, a color conversion layer, and a laminate of a color filter and a color conversion layer. The color conversion layer emits light having a different wavelength by converting the wavelength of light emitted from the organic light emitting layer. The color filter transmits light in a specific wavelength range without performing wavelength distribution conversion. Further, the organic EL light emitting element means an organic electroluminescent element including at least a first electrode, an organic light emitting layer, and a second electrode. As the organic EL light emitting element, any light emitting color can be used. For example, an element emitting blue or blue-green light or white light can be used. As a combination of a color conversion filter and an organic EL light emitting element, for example, in the case of an element that emits light in a blue to blue-green region, a blue color filter and a green conversion filter that converts the light into green region light or red region light with a fluorescent dye The layer and the red conversion filter layer can be combined. When an element that emits white light is used, a combination of blue, green, and red color filters can be used, but one or both of a color filter and a color conversion filter can also be used.

  In the present invention, the organic light emitting display element may be any of a bottom emission type and a top emission type as described at the beginning with reference to FIG. 1, and a color conversion filter is laminated on the organic light emitting element. Or it is a thing of various forms, such as what combined the color conversion filter and the organic light emitting element. The multicolor organic EL light emitting display element of the present invention is a passive matrix drive system. In the present invention, the color conversion filter and the organic light emitting device of the multicolor organic light emitting display device may further include a planarization layer and a passivation layer. In FIG. 1, the multicolor organic light emitting display element is shown as one pixel in order to avoid complication, but may be a multicolor organic light emitting display element including a plurality of pixels.

  Below, a 1st process is demonstrated. 1st Embodiment of this process is a passive matrix type multicolor organic light emitting display element of the laminated type by the bottom emission system of Fig.1 (a). First, a method for manufacturing the multicolor organic light emitting display element of FIG. In this step, the black matrix 108 is patterned on the transparent support substrate 102, and the color conversion filter 110 is first formed. In the first embodiment, an insulating substrate made of glass or plastic can be used as the support substrate 102. Alternatively, a polymer film may be used as the support substrate 102.

  Specific manufacturing methods include, for example, a black inorganic layer, a layer in which a black pigment or a black dye is dispersed in a resin, and the like on a transparent substrate such as glass made by Corning, for example, sputtering, CVD, vacuum deposition, etc. The black matrix 108 can be formed by patterning by a photolithography method or the like. Next, a matrix resin containing a dye or a pigment is applied onto the transparent substrate 102 provided with the black matrix 108 by using a spin coating method or the like, and patterning is performed by a photolithography method or the like, whereby the color conversion filter 110 is formed. Form.

  Further, for example, the matrix resin is made of a photocurable resin or a photothermal combination type curable resin. This is subjected to light and / or heat treatment to generate radical species and ionic species to be polymerized or crosslinked to insolubilize the resin to form a color conversion filter layer.

  Examples of dyes or pigments used in color conversion filters include organic fluorescent dyes. For example, examples of fluorescent dyes that absorb blue to blue-green light emitted from the organic EL layer and emit red light include the following organic fluorescent dyes. That is, rhodamine dyes such as rhodamine B, rhodamine 6G, rhodamine 3B, rhodamine 101, rhodamine 110, sulforhodamine, basic violet 11, basic red 2, etc., cyanine dye, 1-ethyl-2- [4- (p -Dimethylaminophenyl) -13-butadienyl] -pyridium-perchlorate (pyridine 1) and other pyridine dyes or oxazine dyes. Furthermore, various dyes (direct dyes, acid dyes, basic dyes, disperse dyes, etc.) can be used as long as they can emit desired fluorescence. Examples of fluorescent dyes that absorb blue to blue-green light emitted from the organic EL layer and emit green fluorescent light include the following organic fluorescent dyes. That is, 3- (2-benzothiazolyl) -7-diethylaminocoumarin (coumarin 6), 3- (2′-benzoimidazolyl) -7-N, N-diethylaminocoumarin (coumarin 7), 3- (2′-N-methyl) Benzimidazolyl) -7-N, N-diethylaminocoumarin (coumarin 30), 2,3,5,6-1H, 4H-tetrahydro-8-trifluoromethylquinolidine (9,9a, 1-gh) coumarin (coumarin 153 Or the like, or basic yellow 51 which is a coumarin dye-based dye, and naphthalimide dyes such as solvent yellow 11 and solvent yellow 116. Furthermore, various dyes (direct dyes, acid dyes, basic dyes, disperse dyes, etc.) can be used as long as they can emit desired fluorescence. The organic fluorescent dye that can be used in the present invention includes polymethacrylate, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer resin, alkyd resin, aromatic sulfonamide resin, urea resin, melamine resin, benzoguanamine resin, and An organic fluorescent pigment may be obtained by kneading into a resin mixture or the like in advance to obtain a pigment. In addition, these organic fluorescent dyes and organic fluorescent pigments (in the present specification, the above two are collectively referred to as organic fluorescent dyes) may be used alone, or two or more of them may be used to adjust the hue of fluorescence. May be used in combination. The organic fluorescent dye used in the present invention is contained in an amount of 0.01 to 5% by weight, more preferably 0.1 to 2% by weight, based on the weight of the conversion filter layer, with respect to the color conversion filter layer. . When the content of the organic fluorescent dye is less than 0.01% by weight, sufficient wavelength conversion cannot be performed, and when the content exceeds 5%, color conversion efficiency is obtained due to effects such as concentration quenching. Decrease occurs. These film forming conditions may be conventional conditions.

In the present invention, subsequently, a planarization layer 112 and a passivation layer 114 are formed. These forming methods include, for example, applying a material for forming a smoothing layer on the above-described color conversion filter layer by a spin coating method or the like, and baking with a heating means such as an oven. The passivation layer can be formed by a conventional method such as a sputtering method, a CVD method, a vacuum deposition method, a dip method, or a sol-gel method. Various conditions such as the material, film thickness, and film formation of the planarization layer and the passivation layer are the same as in the past. For example, the planarization layer and the like can be formed of any material known in the art. Preferably, it is formed from inorganic oxide or nitride, polyimide or acrylic resin. For the passivation layer, materials such as inorganic oxides and inorganic nitrides such as SiO _x , SiN _x , SiN _x O _y , AlO _x , TiO _x , TaO _x , and ZnO _x can be used. Further, various polymer materials can be used as the passivation layer (for example, imide-modified silicone resin, inorganic metal compound (TiO, Al ₂ O ₃ , SiO _2, etc.) dispersed in acrylic, polyimide, silicone resin, etc. Photocurable resins and / or thermosetting materials such as materials, resins with reactive vinyl groups of acrylate monomers / oligomers / polymers, resist resins, fluororesins, or epoxy resins having a mesogenic structure with high thermal conductivity Resin).

  Next, the production of the first electrode portion including the first electrode 104 (second process) and the production of the organic light emitting layer 116 and the second electrode 106 (third process) will be described.

  Hereinafter, the formation of the first electrode portion will be described. As described above, the first electrode portion of the present invention is formed of the bus electrode, the divided first electrode, and the insulating film. The formation of the first electrode portion will be described based on a specific example with reference to the drawings. The specific example in the following description relates to the case where the first electrode is formed by being divided into two regions A and B. In the drawings to be referred to in the following description of specific manufacturing processes, each process is composed of two cross-sectional views, and these are cross-sectional views in which the upper part represents a region A and the lower part represents a region B. In addition, when dividing | segmenting a 1st electrode into two or more, the 1st electrode part can be formed by selecting and repeating and applying the procedure demonstrated below suitably.

  First, the case of forming a bus electrode in a stacked type will be described with reference to FIGS. 27 shows a manufacturing process of the stacked first electrode explained in FIG. 5, and FIG. 28 shows a manufacturing process of the stacked first electrode section explained in FIG.

  In the example of FIG. 27, the first bus electrode 516 is formed on the first electrode substrate 514. The first bus electrode is formed from the connection portion with the external drive circuit to the display portion (region B). As the material for the first bus electrode, Ag, Cu, Al, Mo, Cr, Ni, W, an Al alloy, and alloys thereof can be used as described above. Further, the first bus electrode can be formed by forming a film by a film forming method such as a sputtering method and then performing patterning by photolithography, and may be formed by a lift-off method, a mask film forming method, or the like.

  Next, an insulating film 520 is formed (FIG. 27B). In the region A, the first bus electrode 516 and the second bus electrode 518 are formed so as to cover at least the upper portion of the first electrode 516 in a three-dimensional region. As a forming method, patterning technology by photolithography, lift-off, dry etching or the like can be applied.

  The insulating film 520 can be formed using a negative photoresist such as an inorganic oxide or acrylate, or a polyimide material. In the present invention, a novolak resin (particularly a novolak resin containing a thermosetting component) is preferred. This is because the first electrode can be formed on the novolac resin without disconnection, and the novolac resin has a sufficient withstand voltage for driving the element. Further, when a novolac resin (particularly a novolac resin containing a thermosetting component) is used, there is an advantage that the shape (that is, the taper shape) of the side surface and the end of the insulating film becomes gentle. In addition, when the inclination angle formed by the end portion of the insulating film 520 and the main surface of the first electrode substrate 514 is 7 ° or more and less than 30 °, the conductivity of the first electrodes 502, 504, and 506 is sufficiently increased. Can be secured. When a novolak resin containing a thermosetting component is used, the taper-shaped inclination angle of the insulating film can be controlled by the post-baking temperature after patterning. In order to make it the preferable range of this invention, post-baking temperature was 170 degreeC-200 degreeC, and set it as 180 degreeC in the following Example.

  Next, a second bus electrode 518 is formed on the insulating film 520 (FIG. 27B). The second bus electrode 518 is formed from the connection portion with the external drive circuit to the display portion (region A). As the material of the second bus electrode 518, Al, Mo, Cr, Ni, W, an Al alloy, and alloys thereof can be used. Like the first bus electrode 516, patterning by photolithography or the like can be performed. Is possible.

  In the organic EL light emitting device of the present invention, the second bus electrode 518 has a wiring length shorter than that of the first bus electrode 516. Therefore, if a high-resistance metal such as Mo, W, Cr, or Ni is used as the material of the second bus electrode 518 and a low-resistance metal such as Al or Al alloy is used as the material of the first bus electrode 516, The voltage drop in the display panel can be made uniform. This is an advantage of the present invention.

  Following the formation of the second bus electrode 518, patterned first electrodes 502, 504, and 506 are formed on the first bus electrode 516 and the second bus electrode 518 (FIG. 27C). As a material for the first electrodes 502, 504, and 506, ITO, In—Zn oxide, ATO, or the like can be used. A low resistance film is obtained, and patterning with a weak acid (for example, oxalic acid) is possible, which is preferable. The first electrodes 502, 504, and 506 can be formed by a sputtering method or the like and patterned by photolithography.

  In the example of FIG. 27, the insulating film is formed in the vicinity of the bus electrode. However, the insulating film can be provided over the entire region A in the same procedure. In such a case, a highly light-transmitting material such as silicon oxide may be used. The insulating film can also be formed on the connection portion with the lead portion or the external drive circuit.

  Further, by repeating the formation of the bus electrode and the insulating film, the first electrode portion can be formed in the same procedure even when the first electrode is divided more.

In addition, what is necessary is just to respond | correspond by forming the said insulating film or the 2nd bus electrode in a desired pattern, when forming the 1st electrode part of the modification demonstrated in the said FIGS. 8-10. In the case where a connection hole is provided in the insulating film, a conductive metal material different from the first bus electrode is introduced into the connection hole, and the first bus electrode and the first electrode are connected through the conductive metal material. For example, the first bus electrode, the insulating film, and the first electrode can be formed by the following procedure.
(A) First, the first bus electrode is formed on the first electrode substrate as described above, and then an insulating film having a connection hole is formed by photolithography, lift-off, dry etching, or the like. Thereafter, a conductive metal (such as Cu) is plated and polished to introduce the conductive metal into the connection hole. Next, the first electrode is formed as described above.
(B) First, the first bus electrode is formed on the first electrode substrate as described above, and then an insulating film having a connection hole is formed by photolithography, lift-off, dry etching, or the like. Thereafter, a conductive metal (for example, Mo, Al, etc.) is formed by sputtering, and the conductive metal other than the connection hole portion is removed by a photolithography method. Next, the first electrode is formed as described above. (C) First, the first bus electrode is formed on the first electrode substrate as described above, and then a conductive metal having a desired shape is formed at a desired position on the first bus electrode by using a photolithography method. A portion corresponding to the connection hole is formed by depositing. Next, an insulating film is formed by photolithography, lift-off, dry etching, or the like, and the first electrode is formed as described above.

  The manufacturing process will be described based on the example of FIG. In FIG. 28, the insulating film 520 is formed in the regions A and B.

  First, the first bus electrode 516 is formed on the first electrode substrate 514 (FIG. 28A). The material and forming method of the first bus electrode are as described in the example of FIG.

  Next, an insulating film 520 is formed from region A to region B (FIG. 28A). In the region B, the insulating film forms an opening 524 at a position where the first bus electrode and the first electrodes 502B, 504B, and 506B are in contact with each other. An insulating film having such an opening can be formed by applying a patterning technique such as photolithography, lift-off, or dry etching. A conductive metal made of a material different from that of the first bus electrode can be introduced into the opening by, for example, the procedures (a) to (c) described above. Although the material of the insulating film is as described above, in this example, since the insulating film is formed in the regions A and B, a material having high light transmittance such as silicon oxide is used. The insulating film can also be formed on the connection portion with the lead portion or the external drive circuit.

  Next, a second bus electrode is formed from the connection portion with the external drive circuit to the region A through the lead portion (FIG. 28B). The formation method, materials, and the like are as described in FIG.

  Next, following the formation of the second bus electrode 518, patterned first electrodes 502, 504 and 506 are formed on the first bus electrode 516 and the second bus electrode 518 (FIG. 28C).

  By repeating the formation of the bus electrode and the insulating film, the first electrode portion can be formed in the same procedure even when the first electrode is divided more.

  Next, the formation process of the parallel type first electrode part will be described with reference to FIG. FIG. 29 shows a manufacturing process of the parallel-type first electrode portion described in FIG.

  First, the first bus electrode 1310 and the second bus electrode 1312 are formed on the first electrode substrate 1308 (FIG. 29A). The first bus electrode and the second bus electrode are formed from the connection / extraction part to the display part to the external drive circuit. The materials and film forming methods of the first bus electrode and the second bus electrode are as described with reference to FIGS. The first bus electrode and the second bus electrode may be made of the same material or different materials. However, as described above, the first bus electrode is made of a material having a low resistance, and the second bus electrode is made of a material having a higher resistance. , Variation in luminance between regions can be prevented. In this way, when different materials are used for the first bus electrode and the second bus electrode, the first bus electrode and the second bus electrode may be formed separately in two stages.

  Next, an insulating film 1320 is formed (FIG. 29B). The insulating film is formed so as to cover the upper part of the first bus electrode 1310 in a portion where the first bus electrode 1310 and the first electrodes 1312, 1314, and 1316 are three-dimensionally configured at least in the region A. The material of the insulating film 1320 (a particularly preferable material is a novolak resin (particularly a novolak resin containing a thermosetting component)), a film forming method, and the like are as described with reference to FIGS. Also in this example, the insulating film 1320 is preferably formed in a tapered shape. The inclination angle of the tapered shape is as described above.

  Also in this example, for example, when a highly light-transmitting material such as silicon oxide is used, the entire surface except the connection portion between the first bus electrode and the first electrode and the connection portion with the external drive circuit is used. A method of forming the first bus electrode and the first electrode, a second bus electrode and the first electrode, and a method of forming the entire surface except for the connection portion with the external drive circuit is also possible. .

  Next, patterned first electrodes 1312, 1314, and 1316 are formed in region A and region B. The material of the first electrode is as described in the examples of FIGS.

  In the example of FIG. 29, the example in which the first bus electrode and the second bus electrode are formed on the first electrode substrate is shown. However, in the present invention, the first bus electrode is performed according to the procedure described with reference to FIGS. A sequential formation method may be used in which an electrode is formed, an insulating film is formed, and a second bus electrode is formed on the insulating film.

  Further, by repeating the formation of the bus electrode and the insulating film, the first electrode portion can be formed in the same procedure even when the first electrode is divided more.

  In addition, what is necessary is just to respond | correspond by forming the said insulating film or a 2nd bus electrode in a desired pattern, when forming the 1st electrode part of the modification demonstrated in the said FIG. In the case where a connection hole is provided in the insulating film, a conductive metal material different from the first bus electrode is introduced into the connection hole, and the first bus electrode and the first electrode are connected through the conductive metal material. For example, the first bus electrode, the insulating film, and the first electrode can be formed by the procedure as described above in (a) to (c).

  The manufacturing process in the case of using the stacked type and the parallel type together may be a combination of the above manufacturing processes as appropriate. For example, in the example shown in FIG. 24, the first bus electrode 1810 is formed on the first electrode substrate. Next, a first insulating film 1842 is formed next. The first insulating film is formed, for example, from the lead portion to a part of the region C on the side close to the lead portion. The first insulating film is patterned so that an opening for electrically connecting the first bus electrode and the first electrode is formed. A second bus electrode 1812 is formed on the first insulating film. Next, on the second bus electrode 1812, for example, a second insulating film is formed from the lead portion to a part of the region B near the lead portion. The second insulating film is patterned so that an opening for electrically connecting the second bus electrode and the first electrode is formed. Next, a third bus electrode 1830 is formed on the second insulating film. A conductive metal made of a material different from that of the first bus electrode can be introduced into the opening by, for example, the procedures (a) to (c) described above.

  Next, following the formation of the third bus electrode 1830, the patterned first electrodes 1814, 1816, 1818 are formed so as to be connected from the first bus electrode to the third bus electrode.

  By appropriately selecting and repeating the formation of the bus electrode and the insulating film, the first electrode portion can be formed by the same procedure even when the first electrode is divided more.

  When a plurality of connection holes are provided in the insulating film, or when a plurality of connection portions are formed by providing a plurality of protrusions on the bus electrode, these are appropriately formed at the stage of disposing the insulating film or the bus electrode. Patterning may be performed as follows. In the case where a connection hole is provided in the insulating film, a conductive metal material different from the first bus electrode is introduced into the connection hole, and the first bus electrode and the first electrode are connected through the conductive metal material. For example, the first bus electrode, the insulating film, and the first electrode can be formed by the procedure as described above in (a) to (c).

Next, the third step will be described.
The organic light emitting layer 116 is formed on the first electrode obtained as described above. The organic light emitting layer 116 may be formed by using a resistance heating vapor deposition apparatus or the like, for example, sequentially forming a hole injection layer, a hole transport layer, an organic light emitting layer, and an electron injection layer without breaking the vacuum. Note that the organic light emitting layer 116 is not limited to this configuration, and may take various forms as follows, for example. In each form, each layer may be formed using a resistance heating vapor deposition apparatus or the like. In the following example, a configuration including the first electrode and the second electrode is shown.

(A) Anode / organic light emitting layer / cathode (B) anode / hole injection layer / organic light emitting layer / cathode (C) anode / organic light emitting layer / electron transport layer / cathode (D) anode / hole injection layer / organic Light emitting layer / electron transport layer / cathode (E) anode / hole injection layer / hole transport layer / organic light emitting layer / electron transport layer / cathode (F) anode / hole injection layer / hole transport layer / organic light emitting layer / Electron transport layer / electron injection layer / cathode

  Thereafter, the second electrode (cathode) 106 is formed without breaking the vacuum by using a mask capable of obtaining a stripe pattern perpendicular to the line of the first electrode.

  As materials for the first electrode, the organic light emitting layer, and the second electrode, those conventionally known as described above can be used. For example, a transparent electrode such as indium-tin oxide (ITO) or indium-zinc oxide (IZO) can be used for the first electrode that is an anode, and lithium, sodium, for example, can be used as the second electrode that is a cathode. Materials such as alkali metals such as potassium, calcium, magnesium, strontium, or the like, or electron-injecting metals such as fluorides thereof, alloys or compounds with other metals, and the like can be used. As the material of each layer of the organic EL layer, known materials can be used. In order to obtain light emission from blue to blue-green, in the organic light emitting layer, for example, a fluorescent whitening agent such as benzothiazole, benzimidazole, and benzoxazole, a metal chelated oxonium compound, a styrylbenzene compound, Aromatic dimethylidin compounds are preferably used. As the electron injection layer, the material having a small work function described in the column of the electrode can be used. As the electron transport layer, a metal complex (Alq3), oxadiazole, a triazole compound, or the like can be used. For the hole injection layer, aromatic amine compounds, starburst amines, benzidine amine multimers, copper phthalocyanine (CuPc), and the like can be used. As the hole transport layer, a starburst amine, an aromatic diamine, or the like can be used. In addition, various conditions such as the film thicknesses of the first electrode, the organic light emitting layer, and the second electrode are the same as in the past.

  The obtained organic EL layer including the color conversion filter is subjected to a sealing step to become a sealed organic EL light emitting element. In the sealing process, after forming the second electrode, a method of continuously forming an inorganic film such as silicon oxide or silicon oxynitride, or a film such as a glass plate, a SUS plate, or a polycarbonate is cured with UV curable resin or thermosetting. A method of bonding to a substrate using a resin or the like can be used. The sealing conditions are the same as before.

  Next, a method for manufacturing the multicolor organic light emitting display element of the second embodiment will be described. The second embodiment is a method for manufacturing the multi-color organic light emitting display element 20 of the multilayer type by the top emission method shown in FIG.

  In the second embodiment, the multicolor organic light emitting display element is formed by forming the first electrode portion on the support substrate 102 (first step), and providing the organic light emitting layer 116, the second electrode 106, and the passivation layer 114a. An EL layer may be formed (second step), and a color conversion filter may be formed thereon (third step). In the organic light emitting element, the first electrode portion, the organic light emitting layer, and the second electrode may be formed on the support substrate 102. After forming the second electrode, a passivation layer 114a is further formed according to a conventional procedure. Also in this embodiment, the first electrode portion can be formed by the procedure described in the first embodiment.

  Next, a black matrix 108 and a color conversion filter layer 110 are formed on the passivation layer by using a spin coating method and a photolithography method in combination. Conventional methods may be applied to form the passivation layer and the color conversion filter layer. The obtained organic light emitting device including the color conversion filter is subjected to a sealing step and sealed to become the organic EL light emitting device of the present invention. In the sealing process, after forming the second electrode, a method of continuously forming an inorganic film such as silicon oxide or silicon oxynitride, or a film such as a glass plate, a SUS plate, or a polycarbonate is cured with UV curable resin or thermosetting. A method of bonding to a substrate using a resin or the like can be used.

  Next, the manufacturing method of the multicolor organic light emitting display element of 3rd embodiment is demonstrated. The third embodiment is a method of manufacturing the multi-color organic light emitting display elements 30 and 40 that are bonded by the top emission method shown in FIG. The present embodiment is a passive matrix type (FIG. 1C) multicolor organic light emitting display element.

  In the third embodiment, the first electrode portion is formed on the support substrate 102 (first step). Next, the organic light emitting layer 116 and the second electrode 106 are produced (second step). These steps can be formed by the procedure described in the first embodiment.

  After providing the second electrode 106, a passivation layer 114a is provided according to conventional procedures.

  Next, as a third step, on the transparent substrate 118, for example, a black matrix 108 and a color conversion filter layer 110 are formed by using a spin coating method and a photolithography method in combination, and then a planarization layer 112b, Then, a passivation layer 114b is formed to produce a color conversion filter. Next, the organic light-emitting element and the color conversion filter formed as described above may be bonded and sealed using a peripheral sealing layer 120 such as a UV curable adhesive (sealing step). Conventional conditions may be used as the sealing conditions. As described above, the organic EL light emitting device of the present invention shown in FIG. 1C can be obtained.

The organic EL light emitting device of the present invention will be described in more detail with reference to examples.
In the following description, FIG. 30 and FIG. 31 will be referred to. In the following examples, the organic EL light emitting element was formed with a pixel number of 320 × 240 × RGB and a pixel pitch of 0.195 mm. In this embodiment, as shown in FIG. 30, the display portion of the organic EL light emitting element is divided at the center as two regions (region 1: region A1, B1 and region 2: region A2, B2). This is an example in which the first electrode in region 1 and region 2 is divided into two. The first bus electrode and the second bus electrode provided in each of the region 1 and the region 2 are taken out from the upper and lower directions of the connection parts 2410A and 2410B to the external drive circuit, respectively. By adopting the structure as shown in this embodiment, in this embodiment, the screen is divided into four regions in the scanning line direction, and the duty ratio is 1/60.

  FIG. 30 is a diagram showing the electrode structure of the organic EL light emitting device of this example. In this figure, the insulating film is omitted to avoid complication. FIG. 31 is a diagram illustrating the insulating film 34 provided in the first electrode portion. In FIG. 30, reference numeral 2404 denotes a first bus electrode, 2402 denotes a second bus electrode, 2410A and 2410B denote connection electrodes of the first bus electrode and the second bus electrode (connection portions to an external drive circuit), and 2414A and 2414B. Represents a lead-out portion of the first bus electrode and the second bus electrode. 2412A and 2412B are connection electrode groups of the second electrode. 31, FIG. 31 (a) is a plan view of the light emitting portion of the organic EL light emitting device, and FIGS. 31 (b) and 31 (c) are aa ′ sectional view and bb ′ of FIG. 31 (a). It is sectional drawing. In FIG. 31, the insulating film is provided on the entire surface of the display portion except that the opening 36 is provided in the connection portion between the first electrode and the first bus electrode and the second bus electrode. 31 (b) and 31 (c), the periphery of the opening 36 is represented by 40 portions. In the example shown, the opening is formed at a position near the center of the drawer and the display. In the present invention, the opening is appropriately provided in accordance with the arrangement of the bus electrodes, the positions where these are formed, the arrangement of the insulating film, and the like.

  In FIGS. 30 and 31, the first bus electrode and the second bus electrode are shown as being formed up to positions near the center of the lead portion and the display portion, respectively, but as shown in the following examples The arrangement of the first bus electrode and the second bus electrode and the positions where they are formed can take various forms. Also, the insulating film can take various forms.

  The basic structure of the light emitting part of this organic EL light emitting element is the same as that shown in FIGS. Therefore, in the case of a multicolor organic EL light emitting device, a color conversion filter is provided on the first electrode side or the second electrode side of the light emitting unit shown in FIGS.

(Example 1)
This example is a performance comparison example of the organic EL light emitting device of the present invention when a laminated inorganic film layer is applied. Below, the manufacturing process of this organic EL light emitting element is demonstrated.

[Production of blue filter]
A black matrix (manufactured by Fuji Film Arch Co., Ltd., CK7800) having a thickness of 1.5 μm is formed on Corning Glass ^TM (100 × 100 × 0.7 mm) as the transparent support substrate 102, and a blue filter material (Fuji Film Arch Co., Ltd.) is formed. The color mosaic CB-7001) is applied by a spin coat method and patterned by a photolithography method to form a line pattern of blue filter layer 110B having a line width of 0.57 mm, a pitch of 0.195 mm, and a film thickness of 10 μm. Obtained.

[Production of green conversion filter layer]
Coumarin 6 (0.7 parts by weight) as a fluorescent dye was dissolved in 120 parts by weight of propylene glycol monomethyl ether acetate (PGMEA) as a solvent. 100 parts by weight of a photopolymerizable resin (V259PA / P5, manufactured by Nippon Steel Chemical Co., Ltd.) was added and dissolved to obtain a coating solution. This coating solution is applied by spin coating on the transparent support substrate 102 on which the blue filter line pattern has been formed, and patterned by photolithography, so that the line width of the green conversion filter layer 110G is 0. A line pattern having a thickness of .57 mm, a pitch of 0.195 mm, and a film thickness of 10 μm was obtained.

[Production of red conversion filter layer]
Coumarin 6 (0.6 parts by weight), rhodamine 6G (0.3 parts by weight) and basic violet 11 (0.3 parts by weight) are dissolved in 120 parts by weight of propylene glycol monomethyl ether acetate (PGMEA) as a solvent. It was. 100 parts by weight of a photopolymerizable resin (V259PA / P5, manufactured by Nippon Steel Chemical Co., Ltd.) was added and dissolved to obtain a coating solution. The coating solution is applied on the transparent support substrate 102 on which the line pattern of the blue filter and the green conversion filter layer has been formed, by spin coating, and patterned by photolithography, so that the red conversion filter layer A line pattern of 110R having a line width of 0.57 mm, a pitch of 0.195 mm, and a film thickness of 10 μm was obtained.

[Fabrication of planarization layer (polymer film layer)]
On these color conversion filter layers 110, a UV curable resin (epoxy-modified acrylate; manufactured by JSR, NN810) is applied by a spin coating method and irradiated with a high-pressure mercury lamp to form a polymer film layer having a thickness of 8 μm. 112 was formed. At this time, the pattern of the color conversion filter layer was not deformed, and the upper surface of the polymer film layer 109 was flat.

[Preparation of Passivation Layer (Inorganic Film Layer)]
At room temperature, an SiOx film having a thickness of 300 nm was formed by DC sputtering to form an inorganic film layer. Si was used as the sputtering target, and a mixed gas of Ar and oxygen was used as the sputtering gas.

[Formation of first bus electrode]
An Al pattern was formed as the first bus electrode 2402. The first bus electrode is wired from a connection part with the external drive circuit to a predetermined part of the region 1 and region 2 in the display panel (in this embodiment, the region up to the central part in the display unit). An Al film having a thickness of 300 nm was formed at room temperature by DC sputtering. Al was used as the sputtering target, and Ar was used as the sputtering gas. After patterning the resist by photolithography, a pattern with a wiring width of 7 μm was formed by patterning using a mixed solution of phosphoric acid, nitric acid and acetic acid as an etching solution. The resistivity of the first bus electrode was approximately 8.0 × 10 ⁻⁶ Ωcm.

[Formation of insulating film]
An insulating film 34 having a thickness of 1 μm was formed by a photolithography method using a positive photoresist (JEM700R2 manufactured by JSR) made of a novolac resin. The angle (taper angle) between the insulating film and the support substrate 102 was controlled to be about 10 ° by post-baking. The taper angle formed by the insulating film 34 and the support substrate 102 is about 70 ° immediately after pattern formation by photolithography, but the taper shape changes due to post-baking. Table 1 summarizes the relationship between post bake temperature and taper angle. The insulating film was formed excluding the junction between the first bus electrode and the first electrode and the junction with the external drive circuit.

  This result was obtained by performing post-baking at any temperature for 60 minutes, and in this example, post-baking was performed at 180 ° C. for 60 minutes.

[Formation of second bus electrode]
A Mo pattern was formed as the second bus electrode 2404. The second bus electrode is wired from a connection portion with the external drive circuit to a predetermined position (from the boundary between the region A and the region B in this embodiment) from the end of the region A of the display unit. A 300 nm Mo film was formed at room temperature by DC sputtering. Mo was used as the sputtering target, and Ar was used as the sputtering gas. After patterning the resist by photolithography, a pattern with a wiring width of 7 μm was formed by patterning using a mixed solution of phosphoric acid, nitric acid and acetic acid as an etching solution. The resistivity of the second bus electrode 204 was approximately 1.5 × 10 ⁻⁵ Ωcm.

  By using Al as the first bus electrode 2404 and Mo as the second bus electrode 2402, the voltage drop in the panel plane can be reduced to about 50% as compared with the case where Mo is used for any electrode. It could be confirmed.

[Formation of first electrode]
An In—Zn oxide pattern was formed as the first electrode 2406. The first electrode is formed in the display area by dividing it into four areas in the scanning line direction. An In—Zn oxide film having a thickness of 200 nm was formed at room temperature by a DC sputtering method. An In—Zn oxide fired target was used as the sputtering target, and a mixed gas of Ar and oxygen was used as the sputtering gas. After patterning the resist by photolithography, patterning was performed using oxalic acid as an etching solution to form a pattern with a wiring width of 58 μm and a gap of 7 μm.

[Production of organic light emitting layer and second electrode]
Following the above steps, the first electrode substrate on which the first electrode 2406 is formed is mounted in a resistance heating vapor deposition apparatus, and the hole injection layer 124, the hole transport layer 126, the organic light emitting layer 128, and the electron injection layer 130 are formed. Films were sequentially formed without breaking the vacuum. During film formation, the internal pressure of the vacuum chamber was reduced to 1 × 10 ⁻⁴ Pa. As the hole injection layer, copper phthalocyanine (CuPc) was laminated to a thickness of 100 nm. As the hole transport layer, 4,4′-bis [N- (1-naphthyl) -N-phenylamino] biphenyl (α-NPD) was laminated to 20 nm. The light emitting layer was formed by laminating 30 nm of 4,4′-bis [2,2′-diphenylvinyl) biphenyl (DPVBi). The electron injection layer was formed by laminating 20 nm of aluminum chelate (Alq).

  Thereafter, Mg / Ag with a thickness of 200 nm (weight ratio of 10: 1) is used using a mask that can obtain a stripe pattern having a width of 0.165 mm and a gap of 0.03 mm perpendicular to the line of the first electrode (2406). A second electrode (cathode) 2408 composed of layers was formed without breaking the vacuum. The organic light emitting device thus obtained was sealed with a sealing glass and a UV curable adhesive under a dry nitrogen atmosphere in the glove box (both oxygen and moisture concentrations were 10 ppm or less).

(Comparative example)
In a panel having 320 × 240 × RGB pixels and a pixel pitch of 0.195 mm, a signal line was formed only by the first electrode, and a panel having a drive duty of 1/240 was formed (Comparative Example 1). Further, in a panel having 320 × 240 × RGB pixels and a pixel pitch of 0.195 mm, a signal line is formed only by the first electrode, and a panel having a driving duty of 1/120 is formed by dividing the signal line at the center (Comparative Example). 2).

  For the three panels obtained in the above-described example and comparative example 1 and comparative example 2, after performing continuous driving for 1000 hours under the condition of line sequential scanning at a driving frequency of 60 Hz and a current amount of 75 μA per pixel. A comparative evaluation of the average luminance change of the panel was performed.

  Table 2 summarizes the results of this evaluation.

  As is apparent from the results, the luminance of the organic EL light emitting device of the present invention does not change before and after the evaluation, and no decrease in luminance due to driving is observed, whereas the organic EL light emission of Comparative Example 1 and Comparative Example 2 The brightness of the element is significantly reduced before and after the evaluation. That is, it was confirmed that a reduction in luminance retention rate can be suppressed by adopting the configuration of the organic EL light emitting device of the present invention.

(Example 2)
The second embodiment will be described below. In this example, the organic EL light emitting element was formed with a pixel number of 320 × 240 × RGB and a pixel pitch of 0.195 mm. The division of the first electrode is the same as in Example 1, and the duty ratio is 1/60. In this embodiment, the first bus electrode and the second bus electrode are provided in parallel. In the case of the parallel type, an insulating film can be formed on the first bus electrode and the second bus electrode can be formed thereon as in the first embodiment.

  Below, each preparation process of this organic electroluminescent light emitting element is demonstrated.

[Production of blue filter]
Corning Glass ^TM (100 × 100 × 0.7 mm) is used as a transparent support substrate, and a black matrix (CK7800, manufactured by Fuji Film Arch Co., Ltd.) having a thickness of 1.5 μm is formed thereon, and a blue filter material (Fuji Film Arch) is formed. Color mosaic CB-7001) manufactured by the company was applied by spin coating and then patterned by photolithography to obtain a blue filter line width of 0.57 mm, pitch of 0.195 mm, and film thickness of 10 μm. It was.

[Production of green conversion filter]
Coumarin 6 (0.7 parts by weight) as a fluorescent dye was dissolved in 120 parts by weight of propylene glycol monomethyl ether acetate (PGMEA) as a solvent. 100 parts by weight of a photopolymerizable resin (V259PA / P5, manufactured by Nippon Steel Chemical Co., Ltd.) was added and dissolved to obtain a coating solution. This coating solution is applied by spin coating on a transparent support substrate on which a blue filter line pattern has been formed, and patterned by photolithography, so that the green conversion filter has a line width of 0.57 mm and a pitch of 0. A line pattern having a thickness of 195 mm and a thickness of 10 μm was obtained.

[Production of red conversion filter layer]
Coumarin 6 (0.6 parts by weight), rhodamine 6G (0.3 parts by weight) and basic violet 11 (0.3 parts by weight) are dissolved in 120 parts by weight of propylene glycol monomethyl ether acetate (PGMEA) as a solvent. It was. 100 parts by weight of a photopolymerizable resin (V259PA / P5, manufactured by Nippon Steel Chemical Co., Ltd.) was added and dissolved to obtain a coating solution. This coating solution is applied on a transparent support substrate on which the line pattern of the blue filter and the green conversion filter has been formed by spin coating, and patterning is performed by photolithography, so that the line width of the red conversion filter is 0. A line pattern having a thickness of 57 mm, a pitch of 0.195 mm, and a film thickness of 10 μm was obtained.

[Fabrication of planarization layer (polymer film layer)]
On these color conversion filters, a UV curable resin (epoxy-modified acrylate; NN810, manufactured by JSR) is applied by spin coating, and irradiated with a high-pressure mercury lamp to form a polymer film layer with a film thickness of 8 μm. did. At this time, the pattern of the color conversion filter was not deformed, and the upper surface of the polymer film layer was flat.

[Preparation of Passivation Layer (Inorganic Film Layer)]
At room temperature, an SiOx film having a thickness of 300 nm was formed by DC sputtering to form an inorganic film layer. Si was used as the sputtering target, and a mixed gas of Ar and oxygen was used as the sputtering gas.

[Formation of first bus electrode]
An Al pattern was formed as the first bus electrode. The first bus electrode is wired from a connection part with the external drive circuit to a predetermined part of the region 1 and the region 2 in the display unit (in this embodiment, a region up to about 1/4 in the display unit). An Al film having a thickness of 300 nm was formed at room temperature by DC sputtering. Al was used as the sputtering target, and Ar was used as the sputtering gas. After patterning the resist by photolithography, a pattern with a wiring width of 7 μm was formed by patterning using a mixed solution of phosphoric acid, nitric acid and acetic acid as an etching solution. The resistivity of the first bus electrode (Al electrode) thus formed was about 8.0 × 10 ⁻⁶ Ωcm.

[Formation of insulating film]
An SiOx film was formed as an insulating film by a lift-off method. A lift-off resist was formed at the junction between the first bus electrode and the first electrode and the junction between the external drive circuit. Next, after forming a 300 nm SiOx film by DC sputtering at room temperature, the lift-off resist is removed with a resist stripping solution, and the insulating film is joined to the joint between the first bus electrode and the first electrode and the joint to the external drive circuit. Except for forming.

[Formation of second bus electrode]
A Mo pattern was formed as the second bus electrode. The second bus electrode is wired from the connection portion with the external drive circuit to the position of the end portion of the display portion (side closer to the lead portion). A 300 nm Mo film was formed at room temperature by DC sputtering. Mo was used as the sputtering target, and Ar was used as the sputtering gas. After patterning the resist by photolithography, a pattern with a wiring width of 7 μm was formed by patterning using a mixed solution of phosphoric acid, nitric acid and acetic acid as an etching solution. The resistivity of the second bus electrode (Mo electrode) was approximately 1.5 × 10 ⁻⁵ Ωcm.

  By using Al as the first bus electrode and Mo as the second bus electrode, the voltage drop in the panel plane can be reduced to about 50% compared to the case where Mo is used for both the first and second bus electrodes. It could be confirmed.

[Formation of first electrode]
An In—Zn oxide pattern was formed as the first electrode. The first electrode is formed in the display area by dividing it into four areas in the scanning line direction. An In—Zn oxide film having a thickness of 200 nm was formed at room temperature by a DC sputtering method. An In—Zn oxide fired target was used as the sputtering target, and a mixed gas of Ar and oxygen was used as the sputtering gas. After patterning the resist by photolithography, patterning was performed using oxalic acid as an etching solution to form a pattern having a wiring width of 58 μm and a gap of 7 μm.

[Production of organic light emitting layer and second electrode]
Following the above steps, the first electrode substrate on which the first electrode is formed is mounted in a resistance heating vapor deposition apparatus, and the hole injection layer, the hole transport layer, the organic light emitting layer, and the electron injection layer are maintained without breaking the vacuum. Films were sequentially formed. During film formation, the internal pressure of the vacuum chamber was reduced to 1 × 10 ⁻⁴ Pa. As the hole injection layer, copper phthalocyanine (CuPc) was laminated to a thickness of 100 nm. As the hole transport layer, 4,4′-bis [N- (1-naphthyl) -N-phenylamino] biphenyl (α-NPD) was laminated to 20 nm. The light emitting layer was formed by laminating 30 nm of 4,4′-bis [2,2′-diphenylvinyl) biphenyl (DPVBi). The electron injection layer was formed by laminating 20 nm of aluminum chelate (Alq).

  Thereafter, a 200 / nm-thick Mg / Ag (10: 1 weight ratio) layer is formed using a mask capable of obtaining a stripe pattern having a width of 0.165 mm and a gap of 0.03 mm perpendicular to the first electrode line. The second electrode (cathode) was formed without breaking the vacuum. The organic light emitting device thus obtained was sealed with a sealing glass and a UV curable adhesive under a dry nitrogen atmosphere in the glove box (both oxygen and moisture concentrations were 10 ppm or less).

  In the present embodiment, the first bus electrode, the insulating film, and the second bus electrode are sequentially formed as described above, and as described above with reference to FIG. A structure in which two bus electrodes are formed on the first electrode substrate, an insulating film is formed thereon, and the first electrode is further formed on the insulating film can be employed (FIGS. 17B and 17C). See also). That is, the configuration of the first electrode in the region A of the organic EL light emitting device of this example is such that a plurality of first bus electrodes and a plurality of second buses are alternately arranged on the first electrode substrate and spaced apart from each other. The first bus electrode and the second bus electrode are partially covered with an insulating film, and the first electrode is provided on the insulating film. Then, the second bus electrode and the first electrode are electrically connected through an opening for connection provided in the insulating film.

  The manufacturing process in the case of adopting this structure is substantially the same as that described above. In this case, the first bus electrode 2404 and the second bus electrode 2402 are formed at the same time.

  Also in the present example, as a result of performing the same driving test as in Example 1, it was confirmed that the decrease in luminance retention rate can be suppressed as in Example 1.

(Example 3)
The third embodiment will be described below. In this example, the organic EL light emitting element was formed with a pixel number of 320 × 240 × RGB and a pixel pitch of 0.195 mm. The division of the first electrode is the same as in Example 1, and the duty ratio is 1/60. In this embodiment, the first bus electrode and the second bus electrode are provided in parallel. In the case of this embodiment, the insulating film is formed on the first bus electrode and in this embodiment at the part of the connection portion with the external drive circuit. An example of such an insulating film is shown in FIG. In this embodiment, the first bus electrode, the insulating film, and the second bus electrode are sequentially formed in this order.

  Below, each preparation process of this organic electroluminescent light emitting element is demonstrated.

[Production of blue filter]
Corning Glass ^TM (100 × 100 × 0.7 mm) is used as a transparent support substrate, and a black matrix (CK7800, manufactured by Fuji Film Arch Co., Ltd.) having a thickness of 1.5 μm is formed thereon, and a blue filter material (Fuji Film Arch) is formed. Color mosaic CB-7001) manufactured by the company was applied by spin coating and then patterned by photolithography to obtain a blue filter line width of 0.57 mm, pitch of 0.195 mm, and film thickness of 10 μm. It was.

[Production of green conversion filter]
Coumarin 6 (0.7 parts by weight) as a fluorescent dye was dissolved in 120 parts by weight of propylene glycol monomethyl ether acetate (PGMEA) as a solvent. 100 parts by weight of a photopolymerizable resin (V259PA / P5, manufactured by Nippon Steel Chemical Co., Ltd.) was added and dissolved to obtain a coating solution. This coating solution is applied by spin coating on a transparent support substrate on which a blue filter line pattern has been formed, and patterned by photolithography, so that the green conversion filter has a line width of 0.57 mm and a pitch of 0. A line pattern having a thickness of 195 mm and a thickness of 10 μm was obtained.

[Production of red conversion filter layer]
Coumarin 6 (0.6 parts by weight), rhodamine 6G (0.3 parts by weight) and basic violet 11 (0.3 parts by weight) are dissolved in 120 parts by weight of propylene glycol monomethyl ether acetate (PGMEA) as a solvent. It was. 100 parts by weight of a photopolymerizable resin (V259PA / P5, manufactured by Nippon Steel Chemical Co., Ltd.) was added and dissolved to obtain a coating solution. This coating solution is applied on a transparent support substrate on which the line pattern of the blue filter and the green conversion filter has been formed by spin coating, and patterning is performed by photolithography, so that the line width of the red conversion filter is 0. A line pattern having a thickness of 57 mm, a pitch of 0.195 mm, and a film thickness of 10 μm was obtained.

[Fabrication of planarization layer (polymer film layer)]
On these color conversion filters, a UV curable resin (epoxy-modified acrylate; NN810, manufactured by JSR) is applied by spin coating, and irradiated with a high-pressure mercury lamp to form a polymer film layer with a film thickness of 8 μm. did. At this time, the pattern of the color conversion filter was not deformed, and the upper surface of the polymer film layer was flat.

[Preparation of Passivation Layer (Inorganic Film Layer)]
At room temperature, an SiOx film having a thickness of 300 nm was formed by DC sputtering to form an inorganic film layer. Si was used as the sputtering target, and a mixed gas of Ar and oxygen was used as the sputtering gas.

[Formation of first bus electrode]
An Al pattern was formed as the first bus electrode. The first bus electrode is wired from a connection portion with the external drive circuit to a predetermined portion of the region 1 and region 2 in the display unit (in this embodiment, a region up to the central portion in the display unit). An Al film having a thickness of 300 nm was formed at room temperature by DC sputtering. Al was used as the sputtering target, and Ar was used as the sputtering gas. After patterning the resist by photolithography, a pattern with a wiring width of 7 μm was formed by patterning using a mixed solution of phosphoric acid, nitric acid and acetic acid as an etching solution. The resistivity of the first bus electrode (Al electrode) thus formed was about 8.0 × 10 ⁻⁶ Ωcm.

[Formation of insulating film]
An SiOx film was formed as an insulating film by a lift-off method. After a lift-off resist was formed at the junction between the first bus electrode and the first electrode and the junction between the external drive circuit, a 300 nm SiOx film was formed at room temperature by DC sputtering. Note that in the connection portion with the external drive circuit, the insulating film is formed up to about the middle of the portion closer to the lead portion (see, for example, FIG. 26B). Thereafter, the lift-off resist was removed with a resist stripping solution, and an insulating film was formed excluding the junction between the first bus electrode and the first electrode and the junction with the external drive circuit.

[Formation of second bus electrode]
A Mo pattern was formed as the second bus electrode. The second bus electrode is wired from approximately the center of the connection portion with the external drive circuit to about 1/4 of the display portion. A 300 nm Mo film was formed at room temperature by DC sputtering. Mo was used as the sputtering target, and Ar was used as the sputtering gas. After patterning the resist by photolithography, a pattern with a wiring width of 7 μm was formed by patterning using a mixed solution of phosphoric acid, nitric acid and acetic acid as an etching solution. The resistivity of the second bus electrode (Mo electrode) was approximately 1.5 × 10 ⁻⁵ Ωcm.

  By using Al as the first bus electrode and Mo as the second bus electrode, the voltage drop in the panel plane can be reduced to about 50% compared to the case where Mo is used for both the first and second bus electrodes. It could be confirmed.

[Formation of first electrode]
An In—Zn oxide pattern was formed as the first electrode. The first electrode is formed in the display area by dividing it into four areas in the scanning line direction. An In—Zn oxide film having a thickness of 200 nm was formed at room temperature by a DC sputtering method. An In—Zn oxide fired target was used as the sputtering target, and a mixed gas of Ar and oxygen was used as the sputtering gas. After patterning the resist by photolithography, patterning was performed using oxalic acid as an etching solution to form a pattern having a wiring width of 58 μm and a gap of 7 μm.

[Production of organic light emitting layer and second electrode]
Following the above steps, the first electrode substrate on which the first electrode is formed is mounted in a resistance heating vapor deposition apparatus, and the hole injection layer, the hole transport layer, the organic light emitting layer, and the electron injection layer are maintained without breaking the vacuum. Films were sequentially formed. During film formation, the internal pressure of the vacuum chamber was reduced to 1 × 10 ⁻⁴ Pa. As the hole injection layer, copper phthalocyanine (CuPc) was laminated to a thickness of 100 nm. As the hole transport layer, 4,4′-bis [N- (1-naphthyl) -N-phenylamino] biphenyl (α-NPD) was laminated to 20 nm. The light emitting layer was formed by laminating 30 nm of 4,4′-bis [2,2′-diphenylvinyl) biphenyl (DPVBi). The electron injection layer was formed by laminating 20 nm of aluminum chelate (Alq).

  Thereafter, a 200 / nm-thick Mg / Ag (10: 1 weight ratio) layer is formed using a mask capable of obtaining a stripe pattern having a width of 0.165 mm and a gap of 0.03 mm perpendicular to the first electrode line. The second electrode (cathode) was formed without breaking the vacuum. The organic light emitting device thus obtained was sealed with a sealing glass and a UV curable adhesive under a dry nitrogen atmosphere in the glove box (both oxygen and moisture concentrations were 10 ppm or less).

  Also in the present example, as a result of performing the same driving test as in Example 1, it was confirmed that the decrease in luminance retention rate can be suppressed as in Example 1. Further, in this embodiment, since the insulating film is formed in a part of the connection portion with the external drive circuit, the electrode portion of the organic EL light emitting element even if there is a displacement in the connection between the bus electrode and the external drive circuit There was no short circuit.

Example 4
The fourth embodiment will be described below. In this example, the organic EL light emitting element was formed with a pixel number of 320 × 240 × RGB and a pixel pitch of 0.195 mm. The division of the first electrode is the same as in Example 1, and the duty ratio is 1/60. In this embodiment, the first bus electrode and the second bus electrode are provided in parallel. In this example, an insulating film was formed on the first bus electrode and on the entire surface of the lead portion. In this embodiment, the first bus electrode, the insulating film, and then the second bus electrode are sequentially formed.

  Below, each preparation process of this organic electroluminescent light emitting element is demonstrated.

[Production of blue filter]
Corning Glass ^TM (100 × 100 × 0.7 mm) is used as a transparent support substrate, and a black matrix (CK7800, manufactured by Fuji Film Arch Co., Ltd.) having a thickness of 1.5 μm is formed thereon, and a blue filter material (Fuji Film Arch) is formed. Color mosaic CB-7001) manufactured by the company was applied by spin coating and then patterned by photolithography to obtain a blue filter line width of 0.57 mm, pitch of 0.195 mm, and film thickness of 10 μm. It was.

[Production of green conversion filter]
Coumarin 6 (0.7 parts by weight) as a fluorescent dye was dissolved in 120 parts by weight of propylene glycol monomethyl ether acetate (PGMEA) as a solvent. 100 parts by weight of a photopolymerizable resin (V259PA / P5, manufactured by Nippon Steel Chemical Co., Ltd.) was added and dissolved to obtain a coating solution. This coating solution is applied by spin coating on a transparent support substrate on which a blue filter line pattern has been formed, and patterned by photolithography, so that the green conversion filter has a line width of 0.57 mm and a pitch of 0. A line pattern having a thickness of 195 mm and a thickness of 10 μm was obtained.

[Production of red conversion filter layer]
Coumarin 6 (0.6 parts by weight), rhodamine 6G (0.3 parts by weight) and basic violet 11 (0.3 parts by weight) are dissolved in 120 parts by weight of propylene glycol monomethyl ether acetate (PGMEA) as a solvent. It was. 100 parts by weight of a photopolymerizable resin (V259PA / P5, manufactured by Nippon Steel Chemical Co., Ltd.) was added and dissolved to obtain a coating solution. This coating solution is applied on a transparent support substrate on which the line pattern of the blue filter and the green conversion filter has been formed by spin coating, and patterning is performed by photolithography, so that the line width of the red conversion filter is 0. A line pattern having a thickness of 57 mm, a pitch of 0.195 mm, and a film thickness of 10 μm was obtained.

[Fabrication of planarization layer (polymer film layer)]
On these color conversion filters, a UV curable resin (epoxy-modified acrylate; NN810, manufactured by JSR) is applied by spin coating, and irradiated with a high-pressure mercury lamp to form a polymer film layer with a film thickness of 8 μm. did. At this time, the pattern of the color conversion filter was not deformed, and the upper surface of the polymer film layer was flat.

[Preparation of Passivation Layer (Inorganic Film Layer)]
At room temperature, an SiOx film having a thickness of 300 nm was formed by DC sputtering to form an inorganic film layer. Si was used as the sputtering target, and a mixed gas of Ar and oxygen was used as the sputtering gas.

[Formation of first bus electrode]
An Al pattern was formed as the first bus electrode. The first bus electrode is wired from a connection portion with the external drive circuit to a predetermined portion of the region 1 and region 2 in the display unit (in this embodiment, a region up to the central portion in the display unit). An Al film having a thickness of 300 nm was formed at room temperature by DC sputtering. Al was used as the sputtering target, and Ar was used as the sputtering gas. After patterning the resist by photolithography, a pattern with a wiring width of 7 μm was formed by patterning using a mixed solution of phosphoric acid, nitric acid and acetic acid as an etching solution. The resistivity of the first bus electrode (Al electrode) thus formed was about 8.0 × 10 ⁻⁶ Ωcm.

[Formation of insulating film]
A positive photoresist (JSR700R2 manufactured by JSR) made of novolac resin as an insulating film was formed by photolithography. The insulating film was formed on the first bus electrode and on the entire surface of the lead portion. In the same manner as in Example 1, the tapered shape of the end portion and side surface portion of the insulating film was controlled by post-baking so that the inclination angle was about 10 °.

[Formation of second bus electrode]
A Mo pattern was formed as the second bus electrode. The second bus electrode is wired from approximately the center of the connection portion with the external drive circuit to about 1/4 of the display portion. A 300 nm Mo film was formed at room temperature by DC sputtering. Mo was used as the sputtering target, and Ar was used as the sputtering gas. After patterning the resist by photolithography, a pattern with a wiring width of 7 μm was formed by patterning using a mixed solution of phosphoric acid, nitric acid and acetic acid as an etching solution. The resistivity of the second bus electrode (Mo electrode) was approximately 1.5 × 10 ⁻⁵ Ωcm.

  By using Al as the first bus electrode and Mo as the second bus electrode, the voltage drop in the panel plane can be reduced to about 50% compared to the case where Mo is used for both the first and second bus electrodes. It could be confirmed.

[Formation of first electrode]
An In—Zn oxide pattern was formed as the first electrode. The first electrode is formed in the display area by dividing it into four areas in the scanning line direction. An In—Zn oxide film having a thickness of 200 nm was formed at room temperature by a DC sputtering method. An In—Zn oxide fired target was used as the sputtering target, and a mixed gas of Ar and oxygen was used as the sputtering gas. After patterning the resist by photolithography, patterning was performed using oxalic acid as an etching solution to form a pattern having a wiring width of 58 μm and a gap of 7 μm.

[Production of organic light emitting layer and second electrode]
Following the above steps, the first electrode substrate on which the first electrode is formed is mounted in a resistance heating vapor deposition apparatus, and the hole injection layer, the hole transport layer, the organic light emitting layer, and the electron injection layer are maintained without breaking the vacuum. Films were sequentially formed. During film formation, the internal pressure of the vacuum chamber was reduced to 1 × 10 ⁻⁴ Pa. As the hole injection layer, copper phthalocyanine (CuPc) was laminated to a thickness of 100 nm. As the hole transport layer, 4,4′-bis [N- (1-naphthyl) -N-phenylamino] biphenyl (α-NPD) was laminated to 20 nm. The light emitting layer was formed by laminating 30 nm of 4,4′-bis [2,2′-diphenylvinyl) biphenyl (DPVBi). The electron injection layer was formed by laminating 20 nm of aluminum chelate (Alq).

  Thereafter, a 200 / nm-thick Mg / Ag (10: 1 weight ratio) layer is formed using a mask capable of obtaining a stripe pattern having a width of 0.165 mm and a gap of 0.03 mm perpendicular to the first electrode line. The second electrode (cathode) was formed without breaking the vacuum. The organic light emitting device thus obtained was sealed with a sealing glass and a UV curable adhesive under a dry nitrogen atmosphere in the glove box (both oxygen and moisture concentrations were 10 ppm or less).

  Also in the present example, as a result of performing the same driving test as in Example 1, it was confirmed that the decrease in luminance retention rate can be suppressed as in Example 1. Further, in this embodiment, since the insulating film is also formed in the lead portion, even if there is a displacement in the connection between the bus electrode and the external drive circuit, the electrode portion of the organic EL light emitting element is not short-circuited. It was.

(Example 5)
The fifth embodiment will be described below. In this example, the organic EL light emitting element was formed with a pixel number of 320 × 240 × RGB and a pixel pitch of 0.195 mm. The division of the first electrode is the same as in Example 1, and the duty ratio is 1/60. In this embodiment, the first bus electrode and the second bus electrode are formed in a stacked type. In this embodiment, the first bus electrode and the second bus electrode are formed to have different line widths. In this example, an insulating film was formed on the first bus electrode and on the entire surface of the lead portion.

  Below, each preparation process of this organic electroluminescent light emitting element is demonstrated.

[Production of blue filter]
Corning Glass ^TM (100 × 100 × 0.7 mm) is used as a transparent support substrate, and a black matrix (CK7800, manufactured by Fuji Film Arch Co., Ltd.) having a thickness of 1.5 μm is formed thereon, and a blue filter material (Fuji Film Arch) is formed. Color mosaic CB-7001) manufactured by the company was applied by spin coating and then patterned by photolithography to obtain a blue filter line width of 0.57 mm, pitch of 0.195 mm, and film thickness of 10 μm. It was.

[Production of green conversion filter]
Coumarin 6 (0.7 parts by weight) as a fluorescent dye was dissolved in 120 parts by weight of propylene glycol monomethyl ether acetate (PGMEA) as a solvent. 100 parts by weight of a photopolymerizable resin (V259PA / P5, manufactured by Nippon Steel Chemical Co., Ltd.) was added and dissolved to obtain a coating solution. This coating solution is applied by spin coating on a transparent support substrate on which a blue filter line pattern has been formed, and patterned by photolithography, so that the green conversion filter has a line width of 0.57 mm and a pitch of 0. A line pattern having a thickness of 195 mm and a thickness of 10 μm was obtained.

[Production of red conversion filter layer]
Coumarin 6 (0.6 parts by weight), rhodamine 6G (0.3 parts by weight) and basic violet 11 (0.3 parts by weight) are dissolved in 120 parts by weight of propylene glycol monomethyl ether acetate (PGMEA) as a solvent. It was. 100 parts by weight of a photopolymerizable resin (V259PA / P5, manufactured by Nippon Steel Chemical Co., Ltd.) was added and dissolved to obtain a coating solution. This coating solution is applied on a transparent support substrate on which the line pattern of the blue filter and the green conversion filter has been formed by spin coating, and patterning is performed by photolithography, so that the line width of the red conversion filter is 0. A line pattern having a thickness of 57 mm, a pitch of 0.195 mm, and a film thickness of 10 μm was obtained.

[Fabrication of planarization layer (polymer film layer)]
On these color conversion filters, a UV curable resin (epoxy-modified acrylate; NN810, manufactured by JSR) is applied by spin coating, and irradiated with a high-pressure mercury lamp to form a polymer film layer with a film thickness of 8 μm. did. At this time, the pattern of the color conversion filter was not deformed, and the upper surface of the polymer film layer was flat.

[Preparation of Passivation Layer (Inorganic Film Layer)]
At room temperature, an SiOx film having a thickness of 300 nm was formed by DC sputtering to form an inorganic film layer. Si was used as the sputtering target, and a mixed gas of Ar and oxygen was used as the sputtering gas.

[Formation of first bus electrode]
An Al pattern was formed as the first bus electrode. The first bus electrode is wired from a connection portion with the external drive circuit to a predetermined portion of the region 1 and region 2 in the display unit (in this embodiment, a region up to the central portion in the display unit). An Al film having a thickness of 300 nm was formed at room temperature by DC sputtering. Al was used as the sputtering target, and Ar was used as the sputtering gas. After patterning the resist by photolithography, a pattern having a wiring width of 10 μm was formed by patterning using a mixed solution of phosphoric acid, nitric acid and acetic acid as an etching solution. The resistivity of the first bus electrode (Al electrode) thus formed was about 8.0 × 10 ⁻⁶ Ωcm.

[Formation of insulating film]
A positive photoresist (JSR700R2 manufactured by JSR) made of novolac resin as an insulating film was formed by photolithography. The insulating film was formed on the first bus electrode and on the entire surface of the lead portion. In the same manner as in Example 1, the tapered shape of the end portion and side surface portion of the insulating film was controlled by post-baking so that the inclination angle was about 10 °.

[Formation of second bus electrode]
As the second bus electrode, Al, which is the same material as the first bus electrode, was patterned. The second bus electrode is wired from the connection part with the external drive circuit to the position of the end part of the display part (near the lead part of the region A). An Al film having a thickness of 300 nm was formed at room temperature by DC sputtering. Al was used as the sputtering target, and Ar was used as the sputtering gas. After patterning the resist by photolithography, a pattern having a wiring width of 5 μm was formed by patterning using a mixed solution of phosphoric acid, nitric acid and acetic acid as an etching solution. In this example, the wiring length of the first bus electrode was about 44 mm, and the wiring length of the second bus electrode was about 22 mm. Accordingly, by setting the wiring width to 10 μm and 5 μm, respectively, the wiring resistances of the first bus electrode and the second bus electrode are almost equal.

[Formation of first electrode]
An In—Zn oxide pattern was formed as the first electrode. The first electrode is formed in the display area by dividing it into four areas in the scanning line direction. An In—Zn oxide film having a thickness of 200 nm was formed at room temperature by a DC sputtering method. An In—Zn oxide fired target was used as the sputtering target, and a mixed gas of Ar and oxygen was used as the sputtering gas. After patterning the resist by photolithography, patterning was performed using oxalic acid as an etching solution to form a pattern with a wiring width of 55 μm and a gap of 10 μm.

[Production of organic light emitting layer and second electrode]
Following the above steps, the first electrode substrate on which the first electrode is formed is mounted in a resistance heating vapor deposition apparatus, and the hole injection layer, the hole transport layer, the organic light emitting layer, and the electron injection layer are maintained without breaking the vacuum. Films were sequentially formed. During film formation, the internal pressure of the vacuum chamber was reduced to 1 × 10 ⁻⁴ Pa. As the hole injection layer, copper phthalocyanine (CuPc) was laminated to a thickness of 100 nm. As the hole transport layer, 4,4′-bis [N- (1-naphthyl) -N-phenylamino] biphenyl (α-NPD) was laminated to 20 nm. The light emitting layer was formed by laminating 30 nm of 4,4′-bis [2,2′-diphenylvinyl) biphenyl (DPVBi). The electron injection layer was formed by laminating 20 nm of aluminum chelate (Alq).

  Thereafter, a 200 / nm-thick Mg / Ag (10: 1 weight ratio) layer is formed using a mask capable of obtaining a stripe pattern having a width of 0.165 mm and a gap of 0.03 mm perpendicular to the first electrode line. The second electrode (cathode) was formed without breaking the vacuum. The organic light emitting device thus obtained was sealed with a sealing glass and a UV curable adhesive under a dry nitrogen atmosphere in the glove box (both oxygen and moisture concentrations were 10 ppm or less).

  Also in the present example, as a result of performing the same driving test as in Example 1, it was confirmed that the decrease in luminance retention rate can be suppressed as in Example 1. Further, in this embodiment, since the insulating film is also formed in the lead portion, even if there is a displacement in the connection between the bus electrode and the external drive circuit, the electrode portion of the organic EL light emitting element is not short-circuited. It was.

(Example 6)
The sixth embodiment will be described below. In this example, the organic EL light emitting element was formed with a pixel number of 320 × 240 × RGB and a pixel pitch of 0.195 mm. The division of the first electrode is the same as in Example 1, and the duty ratio is 1/60. In this embodiment, the first bus electrode and the second bus electrode are provided in parallel. In the case of the parallel type, an insulating film can be formed on the first bus electrode and the second bus electrode can be formed thereon as in the first embodiment. In this embodiment, a plurality of connection holes are provided in the insulating film, and the connection between the first bus electrode and the first electrode is performed through the connection holes.

  Below, each preparation process of this organic electroluminescent light emitting element is demonstrated.

[Production of blue filter]
Corning Glass ^TM (100 × 100 × 0.7 mm) is used as a transparent support substrate, and a black matrix (CK7800, manufactured by Fuji Film Arch Co., Ltd.) having a thickness of 1.5 μm is formed thereon, and a blue filter material (Fuji Hunt Electronics Co., Ltd.). Technology-made color mosaic CB-7001) is applied by spin coating and then patterned by photolithography to obtain a blue filter line width of 0.57 mm, pitch of 0.195 mm, and film thickness of 10 μm. It was.

[Production of green conversion filter]
Coumarin 6 (0.7 parts by weight) as a fluorescent dye was dissolved in 120 parts by weight of propylene glycol monomethyl ether acetate (PGMEA) as a solvent. 100 parts by weight of a photopolymerizable resin (V259PA / P5, manufactured by Nippon Steel Chemical Co., Ltd.) was added and dissolved to obtain a coating solution. This coating solution is applied by spin coating on a transparent support substrate on which a blue filter line pattern has been formed, and patterned by photolithography, so that the green conversion filter has a line width of 0.57 mm and a pitch of 0. A line pattern having a thickness of 195 mm and a thickness of 10 μm was obtained.

[Production of red conversion filter layer]
Coumarin 6 (0.6 parts by weight), rhodamine 6G (0.3 parts by weight) and basic violet 11 (0.3 parts by weight) are dissolved in 120 parts by weight of propylene glycol monomethyl ether acetate (PGMEA) as a solvent. It was. 100 parts by weight of a photopolymerizable resin (V259PA / P5, manufactured by Nippon Steel Chemical Co., Ltd.) was added and dissolved to obtain a coating solution. This coating solution is applied on a transparent support substrate on which the line pattern of the blue filter and the green conversion filter has been formed by spin coating, and patterning is performed by photolithography, so that the line width of the red conversion filter is 0. A line pattern having a thickness of 57 mm, a pitch of 0.195 mm, and a film thickness of 10 μm was obtained.

[Fabrication of planarization layer (polymer film layer)]
On these color conversion filters, a UV curable resin (epoxy-modified acrylate; NN810, manufactured by JSR) is applied by spin coating, and irradiated with a high-pressure mercury lamp to form a polymer film layer with a film thickness of 8 μm. did. At this time, the pattern of the color conversion filter was not deformed, and the upper surface of the polymer film layer was flat.

[Preparation of Passivation Layer (Inorganic Film Layer)]
At room temperature, an SiOx film having a thickness of 300 nm was formed by DC sputtering to form an inorganic film layer. Si was used as the sputtering target, and a mixed gas of Ar and oxygen was used as the sputtering gas.

[Formation of first bus electrode]
An Al pattern was formed as the first bus electrode. The first bus electrode is wired from a connection portion with the external drive circuit to a predetermined portion of the region 1 and region 2 in the display unit (in this embodiment, a region up to the central portion in the display unit). An Al film having a thickness of 300 nm was formed at room temperature by DC sputtering. Al was used as the sputtering target, and Ar was used as the sputtering gas. After patterning the resist by photolithography, a pattern with a wiring width of 7 μm was formed by patterning using a mixed solution of phosphoric acid, nitric acid and acetic acid as an etching solution. The resistivity of the first bus electrode (Al electrode) thus formed was about 8.0 × 10 ⁻⁶ Ωcm.

[Formation of insulating film]
A positive photoresist (JSR700R2 manufactured by JSR) made of novolac resin as an insulating film was formed by photolithography. The insulating film was formed on the first bus electrode and on the entire surface of the lead portion. In addition, a plurality of connection holes are formed in the insulating film so that the first bus electrode and the first electrode can be connected.

[Formation of second bus electrode]
A Mo pattern was formed as the second bus electrode. The second bus electrode is wired from the connection portion with the external drive circuit to the position of the end portion of the display portion (side closer to the lead portion). A 300 nm Mo film was formed at room temperature by DC sputtering. Mo was used as the sputtering target, and Ar was used as the sputtering gas. After patterning the resist by photolithography, a pattern with a wiring width of 7 μm was formed by patterning using a mixed solution of phosphoric acid, nitric acid and acetic acid as an etching solution. The resistivity of the second bus electrode (Mo electrode) was approximately 1.5 × 10 ⁻⁵ Ωcm.

  By using Al as the first bus electrode and Mo as the second bus electrode, the voltage drop in the panel plane can be reduced to about 50% compared to the case where Mo is used for both the first and second bus electrodes. It could be confirmed.

[Formation of first electrode]
An In—Zn oxide pattern was formed as the first electrode. The first electrode is formed in the display area by dividing it into four areas in the scanning line direction. An In—Zn oxide film having a thickness of 200 nm was formed at room temperature by a DC sputtering method. An In—Zn oxide fired target was used as the sputtering target, and a mixed gas of Ar and oxygen was used as the sputtering gas. After patterning the resist by photolithography, patterning was performed using oxalic acid as an etching solution to form a pattern having a wiring width of 58 μm and a gap of 7 μm.

[Production of organic light emitting layer and second electrode]
Following the above steps, the first electrode substrate on which the first electrode is formed is mounted in a resistance heating vapor deposition apparatus, and the hole injection layer, the hole transport layer, the organic light emitting layer, and the electron injection layer are maintained without breaking the vacuum. Films were sequentially formed. During film formation, the internal pressure of the vacuum chamber was reduced to 1 × 10 ⁻⁴ Pa. As the hole injection layer, copper phthalocyanine (CuPc) was laminated to a thickness of 100 nm. As the hole transport layer, 4,4′-bis [N- (1-naphthyl) -N-phenylamino] biphenyl (α-NPD) was laminated to 20 nm. The light emitting layer was formed by laminating 30 nm of 4,4′-bis [2,2′-diphenylvinyl) biphenyl (DPVBi). The electron injection layer was formed by laminating 20 nm of aluminum chelate (Alq).

  Thereafter, a 200 / nm-thick Mg / Ag (10: 1 weight ratio) layer is formed using a mask capable of obtaining a stripe pattern having a width of 0.165 mm and a gap of 0.03 mm perpendicular to the first electrode line. The second electrode (cathode) was formed without breaking the vacuum. The organic light emitting device thus obtained was sealed with a sealing glass and a UV curable adhesive under a dry nitrogen atmosphere in the glove box (both oxygen and moisture concentrations were 10 ppm or less).

  As a result of performing the same driving test as in Example 1, it was confirmed that the decrease in luminance retention rate could be suppressed as in Example 1. In this embodiment, since an insulating film is formed on the first bus electrode, and the first bus electrode and the first electrode are connected by a plurality of connection holes, the insulating film is uniformly formed in the display portion. . Accordingly, the electrode wiring structure is constant, and when the first electrode portion is formed by photolithography, the light emission area of the divided region of the first electrode is not different depending on the alignment accuracy.

  As a modification of the present embodiment, as shown in FIG. 9, for example, a plurality of protrusions are formed on the first bus electrode, an insulating film is formed on a portion other than the protrusions of the first bus electrode, and the protrusions are formed. The first bus electrode and the first electrode can also be connected via each other.

  That is, in this embodiment, when patterning the first electrode, a protrusion is formed on the first electrode, and then an insulating film is formed on the first bus electrode other than the protrusion.

  Even in this case, when the same driving test as in Example 1 was performed, it was confirmed that a decrease in luminance retention rate could be suppressed as in Example 1. In addition, since the insulating film is uniformly formed in the display portion, the wiring structure of the electrode is constant, and when the first electrode portion is formed by photolithography, the light emission area of the divided region of the first electrode due to alignment accuracy There was nothing different.

  From the above examples, the duty ratio of the organic EL light emitting device of the present invention is 1/60. On the other hand, in a wiring structure in which an organic EL light emitting element having the same definition is simply divided into two and a signal line is simply taken out from two directions of the light emitting element, the duty ratio is 1/120. Therefore, the organic EL light-emitting device of the present invention has a life defined by a luminance half-life of about twice that of the conventional device. Further, in the organic EL light emitting device of the above example, the change in luminance also changed substantially continuously at the boundary of the signal line divided into four, and the luminance difference could not be recognized visually. This is because the resistance value of the signal line, that is, the voltage drop changes substantially continuously at the boundary of the signal line divided into four. Further, as shown in the above embodiment, the insulating film is formed also in the connection part and the lead part with the external drive circuit, so that the organic EL light emission can be achieved even when there is a displacement in the connection between the bus electrode and the external drive circuit. There is no short circuit of the electrode part of the element.

  In the above embodiment, an example of a multicolor organic EL light emitting device has been described. However, a so-called monochrome organic EL light emitting device can be obtained by omitting the procedure of providing a color conversion filter.

(A)-(c) is a schematic sectional drawing of the organic electroluminescent light emitting element of this invention, (d) is a figure which shows an example of the layer structure of an organic light emitting layer. It is a schematic plan view of the organic EL light emitting device of the present invention. It is a figure showing the 1st electrode part of this invention, (a) is a schematic plan view, (b) is aa 'sectional drawing of (a), (c) is bb' of (a). It is sectional drawing. (A)-(l) is a figure which shows the example of the wiring of the 1st electrode part of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows one Embodiment of the organic EL element of this invention, (a) is a top view, (b) And (c) is aa 'and bb' sectional drawing of (a), respectively. . It is a cross-sectional SEM image for demonstrating the edge part shape of the insulating film of a 1st electrode part, and the shape of a transparent conductive film. It is a cross-sectional SEM image of the wiring part of a 1st electrode part. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows one Embodiment of the organic EL element of this invention, (a) is a top view, (b), (c) and (d) are respectively aa 'and bb' of (a). And cc ′ cross-sectional view. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows one Embodiment of the organic EL element of this invention, (a) is a top view, (b) And (c) is aa 'and bb' sectional drawing of (a), respectively. . BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows one Embodiment of the organic EL element of this invention, (a) is a top view, (b) And (c) is aa 'and bb' sectional drawing of (a), respectively. . BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows one Embodiment of the organic EL element of this invention, (a) is a top view, (b) And (c) is aa 'and bb' sectional drawing of (a), respectively. . (A)-(i) is a figure which shows the example of the wiring of the 1st electrode part of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows one Embodiment of the organic EL element of this invention, (a) is a top view, (b), (c) and (d) are respectively aa 'and bb' of (a). And cc ′ cross-sectional view. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows one Embodiment of the organic EL element of this invention, (a) is a top view, (b), (c) and (d) are respectively aa 'and bb' of (a). And cc ′ cross-sectional view. It is a figure which shows one Embodiment of the organic EL element of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows one Embodiment of the organic EL element of this invention, (a) is a top view, (b), (c) and (d) are respectively aa 'and bb' of (a). And cc ′ cross-sectional view. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows one Embodiment of the organic EL element of this invention, (a) is a top view, (b) And (c) is aa 'and bb' sectional drawing of (a), respectively. . BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows one Embodiment of the organic EL element of this invention, (a) is a top view, (b), (c) and (d) are respectively aa 'and bb' of (a). And cc ′ cross-sectional view. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows one Embodiment of the organic EL element of this invention, (a) is a top view, (b) And (c) is aa 'and bb' sectional drawing of (a), respectively. . BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows one Embodiment of the organic EL element of this invention, (a) is a top view, (b) And (c) is aa 'and bb' sectional drawing of (a), respectively. . It is a figure which shows one Embodiment of the organic EL element of this invention, (a) is a top view, (b), (c), (d) and (e) are respectively aa 'of (a), It is bb ', cc', and dd 'sectional drawing. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows one Embodiment of the organic EL element of this invention, (a) is a top view, (b), (c) and (d) are respectively aa 'and bb' of (a). And cc ′ cross-sectional view. It is a figure which shows one Embodiment of the organic EL element of this invention, (a) is a top view, (b), (c), (d) and (e) are respectively aa 'of (a), It is bb ', cc', and dd 'sectional drawing. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows one Embodiment of the organic EL element of this invention, (a) is a top view, (b), (c) and (d) are respectively aa 'and bb' of (a). And cc ′ cross-sectional view. (A) And (b) is a figure which shows the example of formation of the insulating film of the 1st electrode part of the organic EL element of this invention. (A), (b) and (c) is a figure which shows the example of formation of the insulating film of the 1st electrode part of the organic EL element of this invention. It is a figure for demonstrating the manufacturing method of the organic EL element of this invention. It is a figure for demonstrating the manufacturing method of the organic EL element of this invention. It is a figure for demonstrating the manufacturing method of the organic EL element of this invention. It is a top view which shows the structure of the 1st electrode part of the organic EL light emitting element of this invention. (A) It is a top view which shows the structure of the 1st electrode part (an insulating film part is included) of the organic electroluminescent light emitting element of this invention. (B) and (c) are diagrams showing a part of a-a ′ and b-b ′ cross sections in (a), respectively.

Explanation of symbols

10, 20, 30, 40 Multicolor organic light emitting display element 102 Support substrate 104 First electrode 106 Second electrode 108 Black matrix 110 Color conversion filter layer 112 Flattening layer 114 Passivation layer 116 Organic light emitting layer 118 Sealing member 120 Stop layer 302n Bus electrode 304n Insulating films 822, 922 Protruding portion 1022 Connection hole

Claims (25)

  An organic EL including a first electrode provided on a support substrate, a second electrode disposed to be orthogonal to the first electrode, and an organic EL layer disposed between the first electrode and the second electrode A light emitting element, wherein the first electrode is divided into a plurality of regions, and includes a first electrode portion connected to a plurality of bus electrodes corresponding to each of the plurality of regions, and the bus electrode and the first electrode Are connected by a plurality of connecting portions, and the plurality of regions of the first electrode are independently driven.   The organic EL light-emitting element according to claim 1, wherein the plurality of bus electrodes of the first electrode portion are insulated by an insulating film.   The bus electrode and the insulating film are alternately stacked at least partially, and the bus electrode and the first electrode are a connection portion including a plurality of connection holes on the insulating film, or a bus protruding from the insulating film. The organic EL light-emitting element according to claim 2, wherein the organic EL light-emitting elements are connected by a connecting portion including a plurality of protruding portions of the electrode.   The plurality of bus electrodes are formed on a support substrate, an insulating film is formed to cover at least a part of the plurality of bus electrodes, and the bus electrode and the first electrode include a plurality of bus electrodes on the insulating film. The organic EL light-emitting element according to claim 2, wherein the organic EL light-emitting elements are connected by a connection portion including a connection hole or a connection portion including a plurality of protruding portions of the bus electrode protruding from the insulating film.   5. The organic EL display according to claim 2, wherein the insulating film is formed in a plurality of divided regions of the first electrode so as to have uniform regions.   3. The insulating film is made of a polymer material selected from novolac resin, polyimide and acrylic resin, or an inorganic material selected from silicon oxide, nitrogen oxide, silicon oxynitride and aluminum oxide. 5. The organic EL light emitting device according to 5 above.   7. The organic EL light emitting device according to claim 1, wherein a connection portion between the bus electrode and the plurality of divided first electrodes is equidistant from an adjacent end portion between the plurality of divided first electrodes. element.   The plurality of bus electrodes include a connection portion to an external drive circuit and a lead portion, the insulating film is formed in at least a part of these regions, and each of the plurality of bus electrodes is alternately stacked with the insulating film. The organic EL light emitting device according to claim 2, wherein the organic EL light emitting device is used.   The first electrode is selected from materials made of oxides of indium, tin, zinc, or mixed oxides thereof, and the plurality of bus electrodes are Al, Al alloy, Ag, Ag alloy, Cu, Ni, Cr, Mo, 9. The organic EL light emitting device according to claim 1, wherein the organic EL light emitting device is selected from metals consisting of W.   The organic EL light-emitting element according to claim 9, wherein the plurality of bus electrodes are selected from at least a part of different metals.   11. The organic EL light-emitting element according to claim 1, wherein the connection portion where the first electrode and the bus electrode are connected is in a region other than the opening region contributing to light emission of the organic EL light-emitting device.   The organic EL light-emitting element according to claim 1, wherein the first electrode is divided into two or three. Forming a plurality of first electrodes divided into a plurality of regions and connected to a plurality of corresponding bus electrodes in each of the plurality of regions, an organic EL layer, and a second electrode; A process for forming an organic EL light-emitting element, comprising the step of forming the first electrode,
(1) forming a plurality of bus electrodes having a plurality of connection portions for connecting to the first electrode on the support substrate;
(2) A method of manufacturing an organic EL light-emitting element, including a step of forming a divided first electrode so as to be connected to only a plurality of corresponding bus electrodes at the connection portion. Forming a plurality of first electrodes divided into a plurality of regions and connected to a plurality of corresponding bus electrodes in each of the plurality of regions, an organic EL layer, and a second electrode; A process for forming an organic EL light-emitting element, comprising the step of forming the first electrode,
(1) forming a plurality of bus electrodes having a plurality of connection portions for connecting to the first electrode on the support substrate;
(2) forming an insulating film so as to cover at least a part of the bus electrode other than the connection portion of the bus electrode;
(3) A method of manufacturing an organic EL light-emitting element, including a step of forming a divided first electrode so as to be connected to only a plurality of corresponding bus electrodes at the connection portion. Forming a plurality of first electrodes divided into a plurality of regions and connected to a plurality of corresponding bus electrodes in each of the plurality of regions, an organic EL layer, and a second electrode; A process for forming an organic EL light-emitting element, comprising the step of forming the first electrode,
(1) forming one or a plurality of bus electrodes having a plurality of connection portions for connecting to the first electrode on the support substrate;
(2) a step of forming an insulating film so as to cover the bus electrode other than the connection portion of the bus electrode;
(3) repeating the steps (1) and (2) to form a plurality of necessary bus electrodes;
(4) A method of manufacturing an organic EL light-emitting element, including a step of forming a divided first electrode so as to be connected to only a plurality of corresponding bus electrodes at a connection portion.   16. The connection part according to claim 13, wherein the connection part is a connection part including a plurality of connection holes on the insulating film, or a connection part including a plurality of protrusions of a bus electrode protruding from the insulating film. The organic EL light emitting element as described.   The method of manufacturing an organic EL light-emitting element according to claim 14, wherein the insulating film is formed by a lift-off method, a dry etching method, or a photolithography method.   15. The insulating film is made of a polymer material selected from novolac resin, polyimide and acrylic resin, or an inorganic material selected from silicon oxide, nitrogen oxide, silicon oxynitride and aluminum oxide. The manufacturing method of the organic electroluminescent light emitting element of Claims 17-17.   The first electrode is selected from materials made of oxides of indium, tin, zinc, or mixed oxides thereof, and the plurality of bus electrodes are Al, Al alloy, Ag, Ag alloy, Cu, Ni, Cr, Mo, The method for producing an organic EL light-emitting element according to claim 13, wherein the organic EL light-emitting element is selected from metals consisting of W.   20. The method of manufacturing an organic EL light emitting device according to claim 19, wherein the plurality of bus electrodes are selected from at least some different metals.   21. The method of manufacturing an organic EL light-emitting element according to claim 13, wherein the number of bus electrodes and the number of divisions of the first electrode are 2 or 3.   The insulating film is formed in a tapered shape, and an inclination angle of the tapered shape is 7 ° or more and less than 30 °. The organic EL light emitting device according to claim 2.   The organic EL light-emitting element according to claim 1, further comprising a color conversion filter on the first electrode side or the second electrode side.   The organic EL light-emitting element according to claim 13, wherein the step (1) includes a step of forming a color conversion filter on a substrate, and a bus electrode is formed on the color conversion filter. Production method. The method for producing an organic EL light-emitting element according to any one of claims 13 to 21, further comprising a step of forming a color conversion filter on the second electrode side after the step of forming the organic EL layer and the second electrode.

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