JP2005216541A - Micro relay and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a micro relay having an armature, a stationary contact and a movable contact arranged in a sealed space, and of which the whole structure can be, and its manufacturing method. <P>SOLUTION: This micro relay includes a base substrate 1 in which a storage portion for receiving an electromagnet device 2 is formed and the stationary contact 14 is provided on the side of one surface in the direction of its thickness; an armature block 3 having a frame portion 31 fixed on the side of the one surface of the base substrate 1, an armature 30 arranged inside the frame portion 31, supported in freely rocking by the frame portion 31 via a supporting spring portion 32 and driven by the electromagnet device 2, and a movable contact base portion 34 supported by the armature 30 via a contact pressure portion 35; and a cover 4 having a circumference portion fixed to the frame portion 31 on the opposite side of the base substrate 1 to the armature block 3. The electromagnet device 2 is constructed by providing a permanent magnet 21 in the magnetic field path formed by the armature 30 and a yoke 20 in the size of the thickness of the base substrate 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a microrelay and a manufacturing method thereof.

  2. Description of the Related Art Conventionally, as a microrelay that can increase the driving force compared to an electrostatically driven microrelay, a microrelay that uses an electromagnetic force of an electromagnet device to drive an armature to open and close a contact is known ( For example, see Patent Document 1).

Here, the micro relay disclosed in Patent Document 1 has two insertion holes in which a pair of fixed contacts are provided at both ends in the longitudinal direction on one surface side in the thickness direction and two electromagnet devices are inserted. A base substrate composed of a rectangular plate-shaped ceramic substrate formed spaced apart in the longitudinal direction, a rectangular frame-shaped frame portion and an inner side of the frame portion, and swingable to the frame portion via a pair of pivotal support portions An armature that is supported and has permanent magnets at portions facing each electromagnet device, an armature block having a movable contact fixed to both ends of the armature, and a periphery of the base substrate and a frame portion of the armature block And an intervening rectangular frame spacer. The micro relay disclosed in Patent Document 1 has an advantage that the driving force can be increased as compared with the electrostatic drive type micro relay, so that the contact pressure can be increased and the impact resistance and reliability can be improved. In addition, the armature drive stroke can be increased, the distance between the movable contact and the fixed contact when the contact is opened can be increased, and the high frequency characteristics (isolation characteristics) can be improved. There is an advantage that it becomes possible.
Japanese Patent Laid-Open No. 5-114347 (see paragraph numbers [0033]-[0036], FIGS. 11-13)

  By the way, in the micro relay disclosed in Patent Document 1, two permanent magnets are provided on the armature on the surface facing each electromagnet device, and the thickness dimension is between the peripheral portion of the base substrate and the frame portion of the armature block. Therefore, the thickness dimension of the entire relay is increased. Further, in the micro relay disclosed in Patent Document 1, the armature, the fixed contact and the movable contact are exposed to the outside air and may oxidize or foreign matter may enter between the fixed contact and the movable contact. It may be desirable to provide a cover on the opposite side of the block from the base substrate so that the armature and the stationary and movable contacts are located within the sealed space.

  The present invention has been made in view of the above-mentioned reasons, and an object of the present invention is to provide a micro relay in which an armature, a fixed contact, and a movable contact are arranged in a sealed space and can be thinned as a whole relay, and a manufacturing method thereof. It is to provide.

  According to the first aspect of the present invention, there is provided a base in which a housing portion for housing an electromagnet device that generates magnetic flux in response to an exciting current applied to a coil wound around a yoke is formed and a fixed contact is provided on one surface side in the thickness direction. A substrate, a frame-like frame portion fixed to the one surface side of the base substrate, and an armature disposed inside the frame portion and swingably supported by the frame portion via a support spring portion and driven by an electromagnet device And an armature block having a movable contact base portion supported by the armature via a contact pressure spring portion and provided with a movable contact, and a cover having a peripheral portion fixed to the frame portion on the opposite side of the base substrate in the armature block. The electromagnet device is characterized in that a permanent magnet is provided in a magnetic path formed by the armature and the yoke within the thickness dimension of the base substrate. .

  According to this invention, the armature, the fixed contact, and the movable contact are arranged in the sealed space by providing the cover whose peripheral portion is fixed to the frame portion on the opposite side of the base substrate in the armature block, and the electromagnetic device Since the permanent magnet is provided in the magnetic path formed by the armature and the yoke within the thickness dimension of the base substrate, it is not necessary to interpose a spacer between the armature block and the base substrate as in the prior art. The entire relay can be made thinner.

  According to a second aspect of the present invention, in the first aspect of the present invention, the yoke extends from the elongated coil winding portion around which the coil is wound and the armature from both ends of the coil winding portion so as to approach the armature. And a pair of leg pieces whose tip surfaces are excited to have different polarities according to the exciting current to the coil, and the permanent magnet is overlapped on the armature side in the central portion in the longitudinal direction of the coil winding portion. And both sides in the overlapping direction are magnetized to have different polarities.

  According to the present invention, the armature can swing around the central portion in the longitudinal direction of the armature, and the impact resistance is improved.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, between the frame portion and the base substrate and between the frame portion and the cover, the entire circumference of the frame portion is provided. And a metal thin film for bonding is interposed.

  According to this invention, the airtightness of the space surrounded by the base substrate, the cover, and the frame portion can be improved.

  According to a fourth aspect of the present invention, in the first to third aspects of the present invention, the base substrate includes a connection electrode formed on the other surface side in the thickness direction and an inner peripheral surface of a through hole penetrating in the thickness direction. A conductive layer electrically connecting the fixed contact and the connection electrode, and a closing means for closing the through hole.

  According to this invention, it is possible to prevent unnecessary gas and foreign matter from entering the internal space from the outside through the through hole, and contact reliability due to oxidation of the surface of the fixed contact and the movable contact and intrusion of foreign matter. Can be prevented. In addition, the operating speed of the armature can be changed by appropriately setting the atmospheric pressure in the internal space. For example, when used in applications where the relay operating speed is high, the internal space pressure is set to a relatively low pressure and the operating speed is low. However, when used for applications where contact bounce is to be reduced, the internal space pressure may be set to a relatively high pressure.

  According to a fifth aspect of the present invention, in the fourth aspect of the present invention, the closing means comprises a silicon thin film fixed to the base substrate so as to close the opening surface of the through hole on the one surface side of the base substrate. It is a lid.

  According to this invention, the opening surface of the through hole can be easily and stably closed.

  According to a sixth aspect of the present invention, in the first to fifth aspects of the invention, the armature is disposed on the inner side of the frame portion and is supported on the frame portion via the support spring portion. And a thin plate-like magnetic body portion made of a magnetic material fixed to the electromagnet device side in the movable base portion, and the armature block includes the frame portion, the support spring portion, and the movable base portion The contact pressure spring portion and the movable contact base portion are formed by processing a single semiconductor substrate.

  According to the present invention, most of the armature block can be formed by performing a semiconductor microfabrication process on a semiconductor substrate, and the mechanical life of the support spring portion and the contact pressure spring portion is improved. be able to.

  A seventh aspect of the invention is a method for manufacturing a microrelay according to any one of the first to sixth aspects, wherein the semiconductor substrate is processed to form a frame portion, a support spring portion, a contact pressure spring portion, and a movable portion. After the contact base portion and the movable base portion constituting a part of the armature are formed, a magnetic body portion made of a magnetic material is fixed to one surface on the base substrate side in the movable base portion, and the movable contact base portion The armature block forming process for forming the armature block by fixing the movable contact, and the base board, the cover, and the frame portion of the armature block by fixing the armature block, the base board and the cover formed in the armature block forming process. A sealing process for sealing the enclosed space, and an electromagnet device arrangement process for storing the electromagnet device in the storage portion of the base substrate after the sealing process are provided. And wherein the Rukoto.

  According to the present invention, it is possible to provide a microrelay in which an armature, a fixed contact, and a movable contact are arranged in a sealed space and the entire relay can be thinned.

  The invention according to claim 8 is the method for manufacturing a micro relay according to claim 5, wherein the semiconductor substrate is processed so that the frame portion, the support spring portion, the contact pressure spring portion, the movable contact base portion, and a part of the armature are formed. After forming the movable base portion to be configured, the armature block is formed by fixing the magnetic body portion made of a magnetic material to one surface on the base substrate side in the movable base portion and fixing the movable contact to the movable contact base portion. An armature block forming step to be formed, and a sealing step of sealing the space surrounded by the base substrate, the cover, and the frame portion of the armature block by fixing the armature block formed in the armature block forming step, the base substrate, and the cover; An electromagnet device arranging step of housing the electromagnet device in the base substrate housing portion after the sealing step, and in forming the base substrate The through hole is formed at the same time as the through hole is formed in the portion corresponding to the storage portion in the base plate of the base substrate in the thickness direction, and then the storage hole and the through hole are formed on the surface of the substrate on the side where the fixed contact is provided. A thin film covering both of the holes is fixed, and the thin film is patterned to form a plurality of lids that individually close the opening surfaces of the storage hole and the through hole.

  According to the present invention, it is possible to provide a micro relay in which an armature, a fixed contact, and a movable contact are arranged in a sealed space and can be thinned as a whole relay, and the storage hole and the through hole are simultaneously closed. Therefore, the number of processes can be reduced and the cost can be reduced as compared with the case of blocking in separate processes.

  According to the first aspect of the invention, the armature, the fixed contact, and the movable contact can be arranged in the sealed space, and the relay as a whole can be reduced in thickness.

  In the invention of claim 7, there is an effect that the armature, the fixed contact, and the movable contact are arranged in the sealed space, and a micro relay capable of reducing the thickness of the entire relay can be provided.

  According to the eighth aspect of the present invention, it is possible to provide a micro relay in which the armature, the fixed contact, and the movable contact are arranged in a sealed space and can be thinned as a whole relay, and the accommodation hole and the through hole are simultaneously closed. Therefore, there is an effect that the number of processes can be reduced and the cost can be reduced as compared with the case of blocking in separate processes.

  Hereinafter, the micro relay of this embodiment will be described with reference to FIGS.

  The microrelay of this embodiment is composed of an electromagnet device 2 that generates a magnetic flux in response to an exciting current applied to coils 22 and 22 wound around a yoke 20, and a rectangular plate-like glass substrate that is long on one side in the thickness direction. A base substrate 1 provided with a pair of fixed contacts 14 at both ends in the direction, a frame-shaped (rectangular frame-shaped) frame portion 31 fixed to the one surface side of the base substrate 1, and the inside of the frame portion 31 The armature 30 and the armature 30 are supported by the armature 30 and the armature 30 via the two contact pressure springs 35, respectively. The armature block 3 having two movable contact bases 34 each provided with a movable contact 39 is opposite to the base substrate 1 in the armature block 3. In the circumferential portion and a cover 4 made of a rectangular plate-shaped glass substrate which is fixed to the frame portion 31.

  The yoke 20 in the electromagnet device 2 approaches the armature 30 from each of the elongated rectangular plate-shaped coil winding part 20a around which the two coils 22 and 22 are directly wound, and both ends in the longitudinal direction of the coil winding part 20a. Coil winding between a pair of leg pieces 20b, 20b extending in the direction and excited at opposite ends according to the excitation current to the coils 22, 22, and both leg pieces 20b, 20b of the yoke 20 A rectangular plate-like permanent magnet 21 disposed on the central portion in the longitudinal direction of the portion 20a and an elongated rectangular plate shape opposite to the surface of the coil winding portion 20a of the yoke 20 facing the permanent magnet 21 And a printed circuit board 23 fixed to the coil winding portion 20a so as to be orthogonal to the coil winding portion 20a. The yoke 20 is formed by bending or casting an iron plate such as electromagnetic soft iron, and the cross sections of both leg pieces 20b and 20b are formed in a rectangular shape.

  In the permanent magnet 21, the magnetic pole surfaces 21a and 21b on both surfaces in the overlapping direction (thickness direction) with the coil winding portion 20a are magnetized in different polarities, and one magnetic pole surface 21b is the coil winding portion of the yoke 20. The thickness dimension is set so that the other magnetic pole surface 21a is in contact with 20a and is located on the same plane as the tip surfaces of both leg pieces 20b, 20b of the yoke 20. Note that an arrow A in FIG. 4 indicates the magnetization direction.

  Further, the movement of each of the coils 22 and 22 in the mouth axis direction (that is, the longitudinal direction of the coil winding portion 20a) is restricted by the permanent magnet 21 and the leg pieces 20b and 20b of the yoke 20, respectively. In the printed circuit board 23, conductor patterns 23b are formed at both ends in the longitudinal direction on one surface of the insulating substrate 23a, and the circularly formed portions of the conductor patterns 23b constitute external connection electrodes, and are rectangular. The site | part formed in comprises the coil connection part. Here, the terminals of the coils 22 and 22 are connected to the coil connecting portion, but the coils 22 and 22 are connected when a power source is connected between the external connection electrodes and an excitation current is passed through the coils 22 and 22. The leg surfaces 20b, 20b of the yoke 20 are connected so that the tip surfaces of the leg pieces 20b, 20b are different from each other. Note that bumps 24 made of a conductive material (for example, Au, Ag, Cu, solder, etc.) are appropriately fixed to the external connection electrodes in each conductor pattern 23b. Instead of fixing the bumps 24, bonding wires are bonded. May be bonded.

  The base substrate 1 is made of heat-resistant glass such as Pyrex (R), and has a rectangular outer peripheral shape. A storage hole 16 that penetrates in the thickness direction and stores the electromagnet device 2 penetrates the center portion. In addition, through holes 10 penetrating in the thickness direction are provided in the vicinity of the four corners. Also, lands 12 are formed on both sides of the base substrate 1 in the thickness direction and on the periphery of each through hole 10. Here, the lands 12 that overlap in the thickness direction of the base substrate 1 are electrically conductive materials (for example, Cu, Cr, Ti, Pt, Co, Ni, Au, or the like) deposited on the inner peripheral surface of the through hole 10. They are electrically connected by a conductor layer (not shown) made of an alloy or the like. Further, bumps 13 are appropriately fixed to the lands 12 on the other surface side in the thickness direction of the base substrate 1, and the through holes 10 are formed on the other surface side of the base substrate 1 by fixing the bumps 13 to the lands 12. The opening surface is covered with the bump 13. The opening surface of the through hole 10 has a circular shape, and a lid 19 made of four silicon thin films covering the opening surface of the through hole 10 and the land 12 is fixed to the one surface of the base substrate 1. .

  In addition, each of the pair of fixed contacts 14 described above is arranged in parallel in the short direction between two through holes 10 that are spaced apart in the short direction of the base substrate 1 at both ends in the longitudinal direction of the base substrate 1. And is electrically connected to the lands 12 formed on the periphery of the adjacent through holes 10 in the short direction via the conductive patterns 18. Here, as the material of the fixed contact 14, the conductive pattern 18 and the land 12, for example, a conductive material such as Cr, Ti, Pt, Co, Cu, Ni, Au, or an alloy thereof may be employed. For example, a conductive material such as Au, Ag, Cu, or solder may be employed as the material 13. The through hole 10 and the storage hole 16 described above may be formed by, for example, a sand blast method or an etching method, and the above-described conductor layer may be formed by, for example, a plating method, a vapor deposition method, a sputtering method, or the like. In the present embodiment, the lid 19 constitutes a closing means for closing the opening surface of the through hole 10, and the land 12 on the other surface side of the base substrate 1 constitutes a connection electrode.

  The opening surface of the storage hole 16 has a cross shape, and a lid 17 made of a silicon thin film that closes the storage hole 16 is fixed to the one surface side of the base substrate 1. That is, the electromagnet device 2 is inserted into the storage hole 16 so that the front end surfaces of the leg pieces 20 b and 20 b of the yoke 20 face the lid body 17. In the present embodiment, the space surrounded by the inner peripheral surface of the storage hole 16 and the lid body 17 constitutes a storage unit that stores the electromagnet device 2. In the electromagnet device 20, the permanent magnet 21 is the base substrate 1. Are provided in a magnetic path formed by the armature 30 and the yoke 20, and the surface of the insulating substrate 23 a in the printed circuit board 23 is substantially flush with the other surface of the base substrate 1. The lids 17 and 19 are made of a silicon thin film formed by thinning a silicon substrate by etching or polishing, and the thickness dimension is set to 20 μm. Here, the thickness dimension of the lid 17 is not limited to 20 μm, and may be appropriately set within a range of about 5 μm to 50 μm, for example. The lids 17 and 19 are not limited to the silicon thin film, and may be formed of a glass thin film formed by thinning a glass substrate by etching or polishing.

  The storage hole 16 has a tapered shape in which the opening area gradually increases from the one surface of the base substrate 1 toward the other surface, and the electromagnetic device 2 can be easily inserted from the other surface side of the base substrate 1. In addition, the opening area of the accommodation hole 16 on the one surface of the base substrate 1 can be made relatively small.

  The armature block 3 is disposed on the inside of the above-described rectangular frame-shaped frame portion 31, the above-described four support springs 32, and the frame portion 31 by processing a semiconductor substrate made of a silicon substrate by a semiconductor microfabrication process. The movable base portion 30a having a rectangular plate shape constituting a part of the armature 30, the four contact pressure springs 35 and the two movable contact base portions 34 are formed. The armature 30 is composed of a base 30a and a rectangular plate-like magnetic body 30b made of a magnetic body (for example, soft iron, electromagnetic stainless steel, permalloy, etc.) fixed to the surface of the movable base 30a facing the base substrate 1. It is composed. Therefore, the armature 30 is swingably supported by the frame portion 31 via the four support spring portions 32. The movable base portion 30a is thinner than the frame portion 31, and the thickness of the armature 30 is such that the armature block 3 and the base substrate 1 are fixed to each other between the magnetic body portion 30b of the armature 30 and the lid body 17. A predetermined gap is set between them.

  The above-described support spring portions 32 are formed at two locations on both sides in the short direction of the movable base portion 30a so as to be separated from each other in the longitudinal direction of the movable base portion 30a. Each support spring portion 32 has one end portion connected to the frame portion 31 continuously and integrally, and the other end portion connected to the movable base portion 30a continuously and integrally. In addition, each support spring part 32 is lengthened by forming the site | part between the said one end part and the said other end part in the planar shape in the meandering shape in the same surface, and the armature 30 is made into the shape. It is possible to disperse the stress applied to each support spring portion 32 when swinging, and to prevent each support spring portion 32 from being damaged.

  In addition, the movable base portion 30a has a rectangular protruding piece 36 extending continuously and integrally from the center of both side edges in the lateral direction, and also from a portion corresponding to the protruding piece 36 on the inner peripheral surface of the frame portion 31. A rectangular projecting piece 37 is continuously extended. In other words, the projecting piece 36 extending from the movable base portion 30a and the projecting piece 37 extending from the frame portion 31 are opposed to each other at their front end surfaces. Here, a convex portion 36a is formed on the tip surface of each protruding piece 36 extending from the movable base portion 30a, and the protruding surface of each protruding piece 37 extended from the frame portion 31 is convex. A recess 37a into which the portion 36a enters is formed. Therefore, the movement of the armature 30 in the plane orthogonal to the thickness direction of the frame portion 31 is restricted by the convex portion 36a coming into contact with the inner peripheral surface of the concave portion 37a. The two support spring portions 32 disposed on the same side edge side of the armature 30 are located on both sides of the projecting piece 36.

  In the armature block 3, movable contact base portions 34 are arranged between both end portions of the armature 30 and the frame portion 31 in the longitudinal direction of the armature 30, and the base substrate 1 in each movable contact base portion 34. A movable contact 39 made of a conductive material is fixed to the surface facing the surface. Here, the movable contact base portion 34 is supported by the movable base portion 30a via the two contact pressure spring portions 35 described above. The movable base portion 30a is formed in a rectangular plate shape as described above, and the stopper portions 33 that limit the displacement amount of the magnetic body portion 30b are continuously extended from the four corners, and the contact pressure spring. The planar shape of the portion 35 is formed in a U shape along three sides of the outer peripheral edge of the stopper portion 33. The stopper portion 33 limits the amount of displacement of the magnetic body portion 30 b by coming into contact with the one surface of the base substrate 1.

  As can be seen from the above description, the armature block 3 includes the frame portion 31, the movable base portion 30a, the support spring portion 32, the movable contact holding portion 34, and the contact pressure spring portion 35, which are part of the semiconductor substrate described above. It is configured. As the semiconductor substrate, for example, a silicon substrate having a thickness dimension of about 200 μm may be used. However, the thickness dimension is not particularly limited, and may be appropriately set in a range of, for example, about 50 μm to 300 μm.

  Further, the total dimension of the thickness dimension of the movable contact base portion 34 and the thickness dimension of the movable contact 39 is also set so that the distance between the movable contact 39 and the fixed contact 14 is a predetermined distance in the contact open state. ing.

  The cover 4 is made of heat-resistant glass such as Pyrex (R), and a recess 4 a that secures a swinging space of the armature 30 is formed on the surface facing the armature block 3.

  By the way, a metal thin film 38b for bonding is formed over the entire periphery of the surface of the frame portion 31 of the armature block 3 facing the base substrate 1 over the entire periphery. A bonding metal thin film 38a is formed over the entire circumference. Also, a metal thin film 15 for bonding is formed over the entire periphery of the surface of the base substrate 1 facing the armature block 3, and the entire periphery of the periphery of the cover 4 facing the armature block 3 is also formed. Accordingly, the bonding metal thin film 42 is formed. Therefore, the armature block 3, the base substrate 1 and the cover 4 can be hermetically bonded by pressure welding or anodic bonding, and the airtightness of the space surrounded by the base substrate 1, the cover 4 and the frame portion 31 can be improved.

  As a result, the microrelay of this embodiment includes the armature 30 and the movable contact 33 in an airtight space surrounded by the base substrate 1, the cover 4, and the frame portion 31 interposed between the base substrate 1 and the cover 4. The fixed contact 14 is accommodated. In addition, as a material of the above-described bonding metal thin films 15, 38a, 38b, 42, for example, Au, Al-Si, or the like may be employed.

  When the micro relay of this embodiment described above is mounted on a mounting board such as a printed board, for example, the two bumps 24 and the four bumps 13 exposed on the other surface side of the base substrate 1 are respectively connected to the above-described surface. What is necessary is just to connect to the conductor pattern formed in the one surface side of the mounting substrate.

  Next, a method for manufacturing the micro relay of this embodiment will be briefly described.

  In manufacturing the microrelay of this embodiment, a silicon substrate as a semiconductor substrate is processed by a semiconductor micromachining process (micromachining technology) such as a lithography technique and an etching technique to form a frame portion 31, a support spring portion 32, and a contact pressure spring portion. 35, after forming the movable contact base portion 34 and the movable base portion 30a constituting a part of the armature 30, the magnetic base portion 30b made of a magnetic material is formed on one surface of the movable base portion 30a on the base substrate 1 side. The armature block forming process for forming the armature block 3 by fixing and the movable contact 39 fixed to the movable contact base 34, and the armature block 3 formed in the armature block forming process, the base substrate 1 and the cover 4 are press-contacted. Alternatively, the base substrate 1, the cover 4, and the arm are fixed by anodic bonding. A sealing step of sealing a space surrounded by the frame portion 31 of the Chua block 3, and an electromagnetic device arrangement step of storing the electromagnet device 2 in the storage portion of the base substrate 1 and fixing the space to the base substrate 1 after the sealing step. It has.

  Here, in forming the base substrate 1, a storage hole 16 penetrating in the thickness direction is formed in a portion corresponding to the storage portion in a glass substrate which is a base of the base substrate 1, and in the thickness direction in the vicinity of the four corners of the glass substrate. After forming the through hole 10 penetrating into the glass substrate, the land 12, the fixed contact 14, the conductive pattern 18, the conductor layer, and the like are formed, and then the storage hole 16 and the through hole are formed on the surface of the glass substrate on the side where the fixed contact 14 is provided. Lids (19, 19 such as silicon thin film, glass thin film, etc.) covering both of the holes 10 are fixed, and the thin films (19) are individually patterned to close the lids (17, 19) that individually close the opening surfaces of the storage holes (16) and the through holes (10). What is necessary is just to form. The storage hole 16 and the through hole 10 may be formed by an etching method or a sand blast method.

  In forming the cover 4, the bonding metal thin film 42 may be formed after the recess 4 a is formed in the glass substrate which is the base of the cover 4. Here, the recess 4a may be formed by an etching method, a sand blast method, or the like.

  In this embodiment, each of the base substrate 1 and the cover 4 is formed by processing a glass substrate. However, one or both of the base substrate 1 and the cover 4 are formed by processing a silicon substrate. May be. Further, if the base substrate 1 and the cover 4 are limited to glass substrates and the semiconductor substrate from which the armature block 3 is based is limited to a silicon substrate, the bonding metal thin films 15, 38a, 38b, 42 are not provided. It is also possible to hermetically bond the armature block 3 to the base substrate 1 and the cover 4 by anodic bonding. A wafer formed with a large number of the above-described armature blocks 3 and a wafer formed with a large number of the above-described base substrates 1 and a wafer formed with a large number of the above-described covers 4 are fixed by pressure welding or anodic bonding and then individually processed by a dicing process or the like. Of course, it may be divided into micro relays.

  Hereinafter, the operation of the micro relay of this embodiment will be described.

  In the micro relay of this embodiment, when the coils 22 are energized, one end in the longitudinal direction of the magnetic body portion 30b is attracted to one leg piece 20b of the yoke 20 according to the direction of magnetization, and the armature The movable contact 39 fixed to the movable contact base 34 at one end of the armature 30 contacts the pair of fixed contacts 14 and 14 facing each other with a predetermined contact pressure. Even if energization is stopped in this state, the attractive force is maintained by the magnetic flux generated by the permanent magnet 21, and the state is maintained as it is.

  Further, when the energization direction to the coils 22 and 22 is reversed, the magnetic body portion 30b of the armature 30 is attracted to the other leg piece 20b of the yoke 20, and the armature 30 swings to move the other end side of the armature 30. The movable contact 39 held by the contact base 34 contacts the pair of fixed contacts 14 and 14 facing each other with a predetermined contact pressure. Even if energization is stopped in this state, the attractive force is maintained by the magnetic flux generated by the permanent magnet 21, and the state is maintained as it is.

  In the microrelay of this embodiment, the spring constant of the support spring 32 is set so that the attractive force of the magnetic body portion 30b by the permanent magnet 21 is stronger than the return force by the support spring 32. The spring constant of the support spring 32 may be set so that the attraction force of the magnetic body portion 30b due to is weaker than the return force of the support spring 32.

  According to the micro relay of the present embodiment described above, the armature 3 and the fixed contact 14 are provided by including the cover 4 whose peripheral portion is fixed to the frame portion 31 on the side opposite to the base substrate 1 in the armature block 3. The movable contact 39 is disposed in a sealed space, and the electromagnet device 2 includes the permanent magnet 21 in the magnetic path formed by the armature 30 and the yoke 20 within the thickness dimension of the base substrate 1. Thus, it is not necessary to interpose a spacer between the armature block and the base substrate, and the entire relay can be reduced in thickness. That is, the thickness dimension of the entire relay can be defined by the total dimension of the thickness dimension of the base substrate 1, the thickness dimension of the frame portion 31 of the armature block 3, and the thickness dimension of the cover 4. The container composed of the portion 31 can be made thinner.

  Further, in the micro relay of the present embodiment, the permanent magnet 21 is arranged on the armature 30 side in the longitudinal center of the coil winding portion 20a and both surfaces in the overlapping direction are magnetized with different polarities. The armature 30 can swing around the central portion of the longitudinal direction of the 30, and the impact resistance is improved. In addition, since the fulcrum protrusions 36b are provided so as to protrude from the surface of each protrusion 36 extending from the movable base portion 30a of the armature 30 so as to face the base substrate 1, by providing such a pair of fulcrum protrusions 36b. The swinging motion of the armature 30 can be further stabilized.

  By the way, in the above-mentioned micro relay, as shown in FIG. 8, a pair of weight-like fulcrum projections 17b on which the armature 30 is slidably mounted may be provided on the lid body 17, and such a pair By providing the fulcrum projection 17b, the swinging motion of the armature 30 can be further stabilized.

  Further, in the above-described micro relay, as shown in FIG. 9, the stopper 17c for limiting the displacement amount of the armature 30 may be provided so as to protrude from the portion corresponding to the both end portions of the magnetic body portion 30b in the lid body 17. Even when such a stopper 17c is provided, the magnetic body portion 30b can be prevented from colliding with the lid body 17 and the magnetic body portion 30b and the lid body 17 being damaged.

  In the above example, the armature 30 is movable in the armature 30 in order to prevent the magnetic body portion 30b of the armature 30 from colliding with the lid body 17 by the magnetic attraction force of the permanent magnet 21 and damaging the magnetic body portion 30b and the lid body 17. Although the stopper portions 33 are extended from the four corners of the base portion 30a, as shown in FIG. 10, the stopper 17d made of a metal film is formed on a portion of the lid body 17 facing both ends of the magnetic body portion 30b. May be. As a material for the metal film constituting the stopper 17d, for example, a metal such as Al, Cu, Cr, Ni, Au, or an alloy thereof may be employed.

  Further, in the above-described micro relay, as shown in FIG. 11, by providing notches 23 c and 23 c that make the width dimension smaller than other parts at both ends in the longitudinal direction of the insulating substrate 23 a in the printed circuit board 23, The process of winding the ends of the coils 22 and 22 becomes easy.

  Further, in the above-described micro relay, the U-shaped one is used as the yoke 20 in the electromagnet device 2, but the U-shaped one as shown in FIG. 12 is not limited to the U-shaped. It may be used.

It is a disassembled perspective view which shows embodiment. It is a perspective view which shows the same as the above. It is a principal part exploded perspective view same as the above. It is a principal part enlarged view same as the above. The armature block in the same as above is shown, (a) is a plan view and (b) is a bottom view. It is a disassembled perspective view of the armature block in the same as the above. It is a perspective view of the cover used for the same as the above. It is principal part sectional drawing of the other structural example same as the above. It is principal part sectional drawing of the other structural example same as the above. It is principal part explanatory drawing of the other structural example same as the above. It is a principal part perspective view of the other structural example same as the above. It is principal part explanatory drawing of the other structural example same as the above.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base board | substrate 2 Electromagnet apparatus 3 Armature block 4 Cover 10 Through hole 14 Fixed contact 16 Storage hole 17 Cover body 20 Yoke 20a Coil winding part 20b Leg piece 21 Permanent magnet 22 Coil 23 Printed board 30 Armature 30a Movable base part 30b Magnetic Body part 31 Frame part 32 Support spring part 34 Movable contact base part 35 Contact pressure spring part

Claims (8)

  A base substrate having an accommodating portion for accommodating an electromagnet device that generates magnetic flux in response to an excitation current to a coil wound around a yoke, and a fixed contact provided on one surface side in the thickness direction; A frame-like frame portion fixed to one surface side, an armature disposed inside the frame portion and supported swingably on the frame portion via a support spring portion and driven by an electromagnet device, and a contact pressure spring portion on the armature An armature block having a movable contact base portion supported by a movable contact and provided with a movable contact, and a cover whose peripheral portion is fixed to the frame portion on the side opposite to the base substrate in the armature block, A microrelay comprising a permanent magnet provided in a magnetic path formed by an armature and a yoke within a thickness dimension of a base substrate.   The yokes are elongated coil winding portions around which the coils are wound, and both end portions of the coil winding portions are extended toward the armature so as to approach each other according to the excitation current to the coils. A pair of leg pieces that are excited to have different polarities, and the permanent magnet is arranged on the armature side in the central portion in the longitudinal direction of the coil winding portion, and both surfaces in the overlapping direction are magnetized to have different polarities. The micro relay according to claim 1, wherein   2. A metal thin film for bonding is interposed between the frame portion and the base substrate and between the frame portion and the cover, respectively, over the entire circumference of the frame portion. Or the microrelay of Claim 2.   The base substrate is attached to a connection electrode formed on the other surface side in the thickness direction and an inner peripheral surface of a through hole penetrating in the thickness direction, and electrically connects the fixed contact and the connection electrode. 4. The microrelay according to claim 1, further comprising a conductor layer and a closing means for closing the through hole.   5. The lid according to claim 4, wherein the closing means is a lid made of a silicon thin film fixed to the base substrate so as to close an opening surface of the through hole on the one surface side of the base substrate. Micro relay.   The armature includes a thin plate-like movable base portion disposed on the inner side of the frame portion and supported by the frame portion via the support spring portion, and a magnetic body fixed to the electromagnet device side in the movable base portion. The armature block is a semiconductor in which the frame portion, the support spring portion, the movable base portion, the contact pressure spring portion, and the movable contact base portion are one piece. 6. The micro relay according to claim 1, wherein the micro relay is formed by processing a substrate.   7. The method of manufacturing a micro relay according to claim 1, wherein the semiconductor substrate is processed to form a frame portion, a support spring portion, a contact pressure spring portion, a movable contact base portion, and an armature. After forming the movable base portion constituting a part, the magnetic body portion made of a magnetic material is fixed to one surface on the base substrate side in the movable base portion, and the movable contact is fixed to the movable contact base portion. The armature block forming process for forming the armature block, and the armature block formed in the armature block forming process, the base board, and the cover are fixed to seal the space surrounded by the base board, the cover, and the frame portion of the armature block. And an electromagnet device disposing step of housing the electromagnet device in the housing portion of the base substrate after the sealing step. Method of manufacturing a micro relay.   6. The method of manufacturing a micro relay according to claim 5, wherein a movable base portion that forms a part of a frame portion, a support spring portion, a contact pressure spring portion, a movable contact base portion, and an armature by processing a semiconductor substrate. An armature block forming step of forming an armature block by fixing a magnetic body portion made of a magnetic material to one surface on the base substrate side of the movable base portion after forming and fixing the movable contact to the movable contact base portion; A sealing step for sealing a space surrounded by the base substrate, the cover, and the frame portion of the armature block by fixing the armature block formed in the armature block forming step, the base substrate, and the cover; and the base substrate after the sealing step An electromagnet device arranging step for accommodating the electromagnet device in the storage portion of the base substrate, and the base substrate is formed when the base substrate is formed. A through hole is formed at the same time as a through hole is formed in a portion corresponding to the storage portion in a substrate corresponding to the storage portion, and then both the storage hole and the through hole are covered on the surface on the side where the fixed contact is provided on the substrate. A method of manufacturing a microrelay, comprising: forming a plurality of lids for individually closing the opening surfaces of the storage hole and the through hole by fixing a thin film and patterning the thin film.

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