JP2005216561A - Microrelay - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a microrelay by which an end of a coil of an electromagnetic device soldered to a substrate is prevented from being removed by heat generated at mounting, when the substrate provided at the electromagnetic device is mounted on a printed-circuit board by soldering to mount the substrate on the circuit board, in the microrelay using the electromagnetic device in which the entire microrelay is thinned. <P>SOLUTION: In the substrate 23 fixed to a yoke 20 of the electromagnetic device 2, a coil connecting portion 230c to which the end of the coil 22 of the electromagnetic device 2 is soldered is provided on a surface at a side of the yoke 20; and a through-hole 230, which is electrically connected to the coil connecting portion 230c and in which through-hole plating is applied to an inner face, is opened to an other face. A through-hole plating portion 230a exposed to an opening edge of this opening portion is constituted as a terminal portion 230b for mounting. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a micro relay.

  2. Description of the Related Art Conventionally, as a micro relay capable of increasing the driving force compared to an electrostatic driving type micro relay, a micro relay in which an armature is driven to open and close a contact using electromagnetic force of an electromagnet device is known ( For example, see Patent Document 1).

  Here, the micro relay disclosed in Patent Document 1 has two insertion holes in which a pair of fixed contacts are provided at both ends in the longitudinal direction on one surface side in the thickness direction and two electromagnet devices are inserted. A base substrate composed of a rectangular plate-shaped ceramic substrate formed spaced apart in the longitudinal direction, a rectangular frame-shaped frame portion and an inner side of the frame portion, and swingable to the frame portion via a pair of pivotal support portions An armature that is supported and has permanent magnets at portions facing each electromagnet device, and an armature block having a movable contact fixed to both ends of the armature, and a peripheral portion of the base substrate and a frame portion of the armature block And an intervening rectangular frame spacer. The micro relay disclosed in Patent Document 1 has an advantage that the driving force can be increased as compared with the electrostatic drive type micro relay, so that the contact pressure can be increased and the impact resistance and reliability can be improved. The advantage is that the driving stroke of the amateur can be increased, the distance between the movable contact and the fixed contact at the time of opening the contact can be increased, and the high frequency characteristics (isolation characteristics) can be improved. There is an advantage that it becomes possible.

  By the way, in the micro relay disclosed in Patent Document 1, two permanent magnets are provided on the surface facing each electromagnet device in the amateur, and the thickness dimension is between the peripheral portion of the base substrate and the frame portion of the amateur block. Therefore, there is a problem in that the thickness of the relay as a whole becomes large.

  In order to solve such a problem, an electromagnet device 2 as shown in FIGS. 11A and 11B that can reduce the thickness of the entire relay has been proposed.

The yoke 20 of the electromagnet device 2 is formed by bending an iron plate such as electromagnetic soft iron by bending, casting, pressing or the like into a U-shape, and both ends of the central piece are respectively used as coil winding portions 20a. The coils 22 and 22 are directly wound around both ends in the longitudinal direction, and a rectangular plate-shaped permanent magnet 21 is disposed between the coils 22 and 22 so that the ends of the leg pieces 20b and 20b at both ends in the longitudinal direction. Is extended in a direction approaching the amateur, and its tip is a magnetic pole surface that is excited to a different polarity according to the excitation current to the coils 22 and 22. A circuit board 23 arranged to be orthogonal to the longitudinal direction of the central piece is fixed to the opposite side of the surface facing the permanent magnet 21. In the permanent magnet 21, the magnetic pole surfaces 21a and 21b on both surfaces in the overlapping direction (thickness direction) with the coil winding portion 20a are magnetized with different polarities, and one magnetic pole surface 21b is one surface of the central piece of the yoke 20. The thickness dimension is set so that the other magnetic pole surface 21a is positioned on the same plane as the tip surfaces of the leg pieces 20b, 20b of the yoke 20.
Japanese Patent Laid-Open No. 5-114347 (see paragraph numbers [0033]-[0036], FIGS. 11-13)

  In order to mount the electromagnet device 2 shown in FIGS. 11 (a) and 11 (b) on a mounting board (not shown), a circuit board 23 provided on the yoke 20 is an insulating board 23a as shown in FIG. 11 (c). Conductive patterns 23b are formed at both ends in the longitudinal direction on one surface of each of the conductor patterns 23b, and the circularly formed portions of the conductive patterns 23b constitute the mounting terminal portions 23c, and the rectangularly formed portions are the coils. A connecting portion 23d is configured. Therefore, when soldering to the mounting substrate (not shown) with the bumps 24 provided on the mounting terminal portion 23c, heat is transmitted to the coil connecting portion 23d, and the coil 22 soldered to the coil connecting portion 23d is wound. There was a problem that the end of the line was detached.

  The present invention has been made in view of the above problems, and the object of the present invention is to provide an electromagnet device for mounting on a mounting board in a microrelay using an electromagnet device capable of reducing the thickness of the entire relay. An object of the present invention is to provide a microrelay in which when a circuit board is mounted on a mounting board by soldering, a winding end of a coil of an electromagnet device soldered to the circuit board is prevented from coming off due to heat during mounting.

  In order to achieve the above object, according to the first aspect of the present invention, there is provided an electromagnet device that generates a magnetic flux in response to an exciting current applied to a coil wound around a yoke, and a fixed contact on one surface side in the thickness direction. The base substrate, the frame portion fixed to the one surface side of the base substrate, the armature disposed on the inner side of the frame portion and supported swingably by the frame portion, and the armature driven by the electromagnet device and the armature contact spring portion The yoke includes an armature block having a movable contact base portion provided with a movable contact. The coil connection portion for soldering the winding end of the coil is provided on one surface of the yoke. A circuit board having a through-hole plated on the inner surface with a through-hole plating electrically connected to the portion opened on the other surface, and opened on the other surface of the circuit board Characterized in that the through-hole plating portion is exposed to the opening edge of Ruhoru was mounting terminal portion.

  According to the first aspect of the present invention, when mounting on the mounting board using the external connection terminals of the circuit board, the heat of soldering during mounting is applied to the coil connection portion provided on the opposite surface of the circuit board. Therefore, the solder connecting the coil winding end of the electromagnet device does not melt at the coil connecting portion, and the coil winding end can be prevented from coming off during mounting.

  According to a second aspect of the present invention, in the first aspect of the present invention, the opening of the through hole opened on one surface of the circuit board is sealed with a resist material.

  According to the second aspect of the present invention, it is possible to prevent solder from flowing into the opposite side surface of the circuit board through the through hole during mounting using the external connection terminal, and to insulate the conductive portion of the through hole from the yoke.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the coil connection portion is provided at a position deviated from the position of the opening portion of the through hole on the one surface side of the circuit board.

  According to the invention of claim 3, the heat at the time of mounting is more difficult to be transmitted to the coil connecting part side, and it is possible to prevent the solder connecting the coil winding end of the electromagnet device from melting to the coil connecting part. Thus, it is possible to reliably prevent the coil winding end from coming off.

  According to a fourth aspect of the present invention, in any of the first to third aspects of the present invention, a permanent magnet for magnetic holding is disposed and fixed substantially at the center of one surface of the yoke, and the opposite side of the permanent magnet is disposed. The circuit board is arranged and fixed on the other surface of the yoke in a direction perpendicular to the yoke, both ends of the circuit board are protruded in both directions of the yoke, and extended from the both ends of the yoke so as to approach the armature. A pair of leg pieces whose opposite poles are excited in accordance with an excitation current to the coil, and the yoke part between the permanent magnet and the projecting part of the circuit board; It is characterized by that.

  According to invention of Claim 4, a circuit board can be utilized as a collar part of a coil winding part.

  The invention of claim 5 is characterized in that, in the invention of claim 4, the corners of the circuit board are curved.

  According to invention of Claim 5, it can prevent that the coil | winding of a coil catches on a circuit board at the time of coil winding, and is disconnected.

  The invention of claim 6 is characterized in that, in the invention of claim 4 or 5, the width of the circuit board in the same direction is made smaller than the width of the permanent magnet in the both ends of the yoke.

  According to the sixth aspect of the present invention, it is possible to reduce the coil winding from being caught on the circuit board during coil winding, and to prevent disconnection of the coil winding during winding.

  According to a seventh aspect of the present invention, there is provided a pair of circuits according to the fourth to sixth aspects, wherein one surface of the circuit board is equidistant from the center in both end directions in the both end directions, and the distance is substantially equal to the width on both sides of the yoke. Protruding portions are provided, and positioning is performed by fitting the yoke between the both protruding portions.

  According to the seventh aspect of the invention, the yoke can be positioned in the width direction when the circuit board is arranged and fixed on the yoke.

  According to an eighth aspect of the present invention, in the fourth to sixth aspects of the present invention, the center of one surface of the circuit board and the other surface side of the yoke on which the circuit board is fixedly disposed are connected between the circuit board and the yoke by concavity and convexity. A positioning means for performing positioning is provided.

  According to the invention of claim 7, when the circuit board is disposed and fixed on the yoke, the yoke can be positioned in the width direction and the longitudinal direction.

  In the present invention, when mounting on the mounting board using the external connection terminals of the circuit board, the heat of soldering at the time of mounting is not easily transmitted to the coil connecting part provided on the opposite surface of the circuit board. There is an effect that the solder connecting the coil winding end of the electromagnet device to the connecting portion does not melt, and the coil winding end can be prevented from being detached during mounting.

  Hereinafter, the micro relay of the present embodiment will be described with reference to FIGS.

  As shown in FIG. 3, the microrelay of this embodiment is composed of an electromagnet device 2 that generates a magnetic flux in response to an exciting current applied to coils 22 and 22 wound around a yoke 20, and a rectangular glass substrate. The base substrate 1 provided with a pair of fixed contacts 14 at both ends in the longitudinal direction on one surface side in the direction, and a frame-shaped (rectangular frame-shaped) frame portion 31 fixed to the one surface side of the base substrate 1 The armature 30 and the armature 30 that are disposed inside the frame portion 31 and supported by the frame portion 31 via the four support spring portions 32 so as to be swingable are driven by the electromagnet device 2, respectively. An amateur block 3 having two movable contact bases 34 supported by a part 35 and provided with movable contacts 39, respectively, and a base substrate 1 in the amateur block 3 Peripheral portion on the opposite side is a cover 4 made of a rectangular plate-shaped glass substrate which is fixed to the frame portion 31.

  The yoke 20 used in the electromagnet device 2 of the present embodiment is formed by bending an iron plate such as electromagnetic soft iron into a substantially H shape by a bending process, a casting process, a pressing process, or the like. The cross sections of the pieces 20b and 20b are formed in a rectangular shape. A concave portion 20c is formed on the surface of the central portion of the central piece facing the armature 30 to accommodate and fix the rectangular plate-shaped permanent magnet 21, and the coils 22 are wound directly on both sides of the concave portion 20c. The coil winding portion 20a is formed with convex portions 20d for restricting coil drop off at the four corners of the lower surface of the yoke 20 corresponding to the base portions of the leg pieces 20b and 20b at both ends in the longitudinal direction. Here, in the permanent magnet 21, the magnetic pole surfaces 21 a and 21 b on both sides in the thickness direction are magnetized to have different polarities, one magnetic pole surface 21 b abuts against the bottom surface of the recess 20 c of the yoke 20, and the other magnetic pole surface 21 a The thickness dimension is set so as to be at the same height as the front end surfaces of both leg pieces 20b, 20b of the yoke 20.

  An arrow A in FIG. 6 indicates the magnetization direction of the permanent magnet 21. Further, a circuit board 23 made of a printed circuit board is fixed to the lower surface of the central piece of the yoke 20 opposite to the concave portion 20c by bonding or the like so as to be orthogonal to the central piece.

  Here, if the upper surface of the permanent magnet 21 facing the armature 30 side, that is, the height position of the magnetic pole surface 21a is the same as in the case of FIG. 11, a large permanent magnet thick only in the recessed portion of the recess 20c can be used. Thus, the suction force can be increased. Further, the coil 22 wound by the convex portion 20d can be restricted from moving to the leg piece 20b, so that the coil 22 can be prevented from falling off the yoke 20 and becoming a defective product in an assembling process or the like. Can do.

  As shown in FIGS. 1A to 1C, the circuit board 23 fixed to the yoke 20 has through-hole plating formed by applying through-hole plating to the inner peripheral surface at both ends in the longitudinal direction of the insulating substrate 23a. An end surface of the through-hole plated portion 230a that is formed through the through-hole 230 having the portion 230a and is exposed to the opening edge of the through-hole 230 on the surface side (the lower surface side in FIG. 1A) opposite to the yoke 20 when fixed. Is the mounting terminal portion 230b. Further, a rectangular conductive pattern is integrated with the through-hole plating portion 230a at a position shifted from the position of the opening portion of the through-hole 230 on the yoke 20 side (upper surface side in FIG. 1A) to the end side. The conductive pattern is used as a coil connection portion 230c. Therefore, the coil connection part 230c and the mounting terminal part 230b are electrically connected by the through-hole plating part 230a. Further, the opening of the through hole 230 on the upper surface side of the insulating substrate 23a is sealed with a resist material 231, and solder flows into the through hole 230 when the winding end of the coil 20 is soldered to the coil connecting portion 230c. On the contrary, when the mounting terminal portion 230b is soldered to the mounting substrate (not shown), it is prevented from coming out to the upper surface side of the insulating substrate 23a through the through hole 230. Yes.

  Now, the coil ends of the coils 22 and 22 are connected to the coil connection portion 230c. When the coils 22 and 22 are connected to a power source between the mounting terminals 230b and an excitation current is supplied to the coils 22 and 22, Are connected so that the tip surfaces of both leg pieces 20b, 20b of the yoke 20 have different magnetic poles. Note that bumps 24 made of a conductive material (for example, Au, Ag, Cu, solder, etc.) are appropriately fixed to the mounting terminal portion 230b. Instead of fixing the bumps 24, bonding wires are bonded. Also good.

  The circuit board 23 formed as described above is arranged on the lower surface of the central portion of the central piece of the yoke 20 so as to be orthogonal to the longitudinal direction of the yoke 20 as shown in FIG. The Therefore, each leg piece 20b of the yoke 20, the permanent magnet 21 disposed and fixed in the recess 20c, and the portion of the yoke 20 surrounded by the portion of the circuit board 23 protruding to the side of the yoke 20, respectively, are coil winding portions 20a, 20a is configured, and the projecting portions of the leg pieces 20b, the permanent magnets 21 and the circuit board 23 function as the flange portions of the coil bobbin. In order to prevent the winding of the coil 22 from being caught by the corner portion of the circuit board 23 when the coil 22 is wound, the corner portion has an R surface (curved surface). Further, as shown in FIG. 2, the width dimension b in the same direction of the circuit board 23 is made smaller than the width dimension a of the permanent magnet 21 in the both ends of the yoke 20, so that the windings are wound when the coil 22 is wound. To be caught in Further, the permanent magnet 21 and the yoke 20 are coated with a resin coating on the surfaces of the permanent magnet 21 and the yoke 20 in order to prevent disconnection at the burr and the like and to provide electrical insulation. In this case, the magnetic pole surface 21a of the permanent magnet 21 and the magnetic pole surface portion at the tip of the leg piece 20b are made to have the same height position by polishing and peeling the resin coating.

  The base substrate 1 is made of heat-resistant glass such as Pyrex (R) and has a rectangular outer peripheral shape. A storage hole 16 that penetrates in the thickness direction and stores the electromagnet device 2 is formed in the center. A through hole 10 is provided in the vicinity of each of the four corners so as to penetrate in the thickness direction. Also, lands 12 are formed on both sides of the base substrate 1 in the thickness direction and on the periphery of each through hole 10. Here, the lands 12 that overlap in the thickness direction of the base substrate 1 are electrically conductive materials (for example, Cu, Cr, Ti, Pt, Co, Ni, Au, or the like) deposited on the inner peripheral surface of the through hole 10. They are electrically connected by a conductor layer (not shown) made of an alloy or the like. Further, bumps 13 are appropriately fixed to the lands 12 on the other surface side in the thickness direction of the base substrate 1, and the through holes 10 are formed on the other surface side of the base substrate 1 by fixing the bumps 13 to the lands 12. The opening surface is covered with the bump 13. The opening surface of the through hole 10 has a circular shape, and a lid 19 made of four silicon thin films covering the opening surface of the through hole 10 and the land 12 is fixed to the one surface of the base substrate 1. .

  In addition, each of the pair of fixed contacts 14 described above is arranged in parallel in the short direction between two through holes 10 that are spaced apart in the short direction of the base substrate 1 at both ends in the longitudinal direction of the base substrate 1. And is electrically connected to the lands 12 formed on the periphery of the adjacent through holes 10 in the short direction via the conductive patterns 18. Here, as the material of the fixed contact 14, the conductive pattern 18 and the land 12, for example, a conductive material such as Cr, Ti, Pt, Co, Cu, Ni, Au, or an alloy thereof may be employed. For example, a conductive material such as Au, Ag, Cu, or solder may be employed as the material 13. The through hole 10 and the storage hole 16 described above may be formed by, for example, a sand blast method or an etching method, and the above-described conductor layer may be formed by, for example, a plating method, a vapor deposition method, a sputtering method, or the like. In the present embodiment, the lid 19 constitutes a closing means for closing the opening surface of the through hole 10, and the land 12 on the other surface side of the base substrate 1 constitutes a connection electrode.

  The opening surface of the storage hole 16 has a cross shape, and a lid 17 made of a silicon thin film that closes the storage hole 16 is fixed to the one surface side of the base substrate 1. That is, the electromagnet device 2 is inserted into the storage hole 16 such that the front end surfaces of both leg pieces 20 b and 20 c of the yoke 20 face the lid body 17. In the present embodiment, the space surrounded by the inner peripheral surface of the storage hole 16 and the lid body 17 constitutes a storage unit that stores the electromagnet device 2. In the electromagnet device 20, the permanent magnet 21 is the base substrate 1. The surface of the insulating substrate 23 a in the circuit board 23 is substantially flush with the other surface of the base substrate 1. The lids 17 and 19 are made of a silicon thin film formed by thinning a silicon substrate by etching or polishing, and the thickness dimension is set to 20 μm. Here, the thickness dimension of the lid 17 is not limited to 20 μm, and may be appropriately set within a range of about 5 μm to 50 μm, for example. The lids 17 and 19 are not limited to the silicon thin film, and may be formed of a glass thin film formed by thinning a glass substrate by etching or polishing.

  The storage hole 16 has a tapered shape in which the opening area gradually increases from the one surface of the base substrate 1 toward the other surface, and the electromagnetic device 2 can be easily inserted from the other surface side of the base substrate 1. In addition, the opening area of the accommodation hole 16 on the one surface of the base substrate 1 can be made relatively small.

  The amateur block 3 is arranged on the inner side of the above-described rectangular frame-shaped frame portion 31, the above-described four support springs 32, and the frame portion 31 by processing a semiconductor substrate made of a silicon substrate by a semiconductor microfabrication process. The movable base 30a having a rectangular plate shape that constitutes a part of the amateur 30, the four contact pressure springs 35, and the two movable contact bases 34 are formed. The armature 30 is composed of a base 30a and a rectangular plate-like magnetic body 30b made of a magnetic body (for example, soft iron, electromagnetic stainless steel, permalloy, etc.) fixed to the surface of the movable base 30a facing the base substrate 1. It is composed. Accordingly, the armature 30 is swingably supported by the frame portion 31 via the four support spring portions 32. The movable base portion 30a is thinner than the frame portion 31, and the thickness of the armature 30 is such that the armature block 3 and the base substrate 1 are fixed to each other between the magnetic body portion 30b of the armature 30 and the lid body 17. A predetermined gap is set between them.

  The above-described support spring portions 32 are formed at two locations on both sides in the short direction of the movable base portion 30a so as to be separated from each other in the longitudinal direction of the movable base portion 30a. Each support spring portion 32 has one end portion connected to the frame portion 31 continuously and integrally, and the other end portion connected to the movable base portion 30a continuously and integrally. In addition, each support spring part 32 is lengthened by forming the site | part between the said one end part and the said other end part in the planar shape in the meandering shape in the same surface, and the amateur 30 It is possible to disperse the stress applied to each support spring portion 32 when swinging, and to prevent each support spring portion 32 from being damaged.

  In addition, the movable base portion 30a has a rectangular protruding piece 36 extending continuously and integrally from the center of both side edges in the lateral direction, and also from a portion corresponding to the protruding piece 36 on the inner peripheral surface of the frame portion 31. A rectangular projecting piece 37 is continuously extended. In other words, the projecting piece 36 extending from the movable base portion 30a and the projecting piece 37 extending from the frame portion 31 are opposed to each other at their front end surfaces. Here, a convex portion 36a is formed on the tip surface of each protruding piece 36 extending from the movable base portion 30a, and the protruding surface of each protruding piece 37 extended from the frame portion 31 is convex. A recess 37a into which the portion 36a enters is formed. Therefore, the movement of the armature 30 in the plane orthogonal to the thickness direction of the frame portion 31 is restricted by the convex portion 36a coming into contact with the inner peripheral surface of the concave portion 37a. Note that the two support spring portions 32 disposed on the same side edge side of the armature 30 are located on both sides of the projecting piece 36.

  The armature block 3 has movable contact base portions 34 disposed between both end portions of the armature 30 and the frame portion 31 in the longitudinal direction of the amateur 30, and the base substrate 1 in each movable contact base portion 34. A movable contact 39 made of a conductive material is fixed to the surface facing the surface. Here, the movable contact base portion 34 is supported by the movable base portion 30a via the two contact pressure spring portions 35 described above. The movable base portion 30a is formed in a rectangular plate shape as described above, and the stopper portions 33 that limit the displacement amount of the magnetic body portion 30b are continuously extended from the four corners, and the contact pressure spring. The planar shape of the portion 35 is formed in a U shape along three sides of the outer peripheral edge of the stopper portion 33. The stopper portion 33 limits the amount of displacement of the magnetic body portion 30 b by coming into contact with the one surface of the base substrate 1.

  As can be seen from the above description, the armature block 3 includes a frame portion 31, a movable base portion 30a, a support spring portion 32, a movable contact holding portion 34, and a contact pressure spring portion 35, which are part of the semiconductor substrate described above. It is configured. As the semiconductor substrate, for example, a silicon substrate having a thickness dimension of about 200 μm may be used. However, the thickness dimension is not particularly limited, and may be appropriately set in a range of, for example, about 50 μm to 300 μm.

  Further, the total dimension of the thickness dimension of the movable contact base portion 34 and the thickness dimension of the movable contact 39 is also set so that the distance between the movable contact 39 and the fixed contact 14 is a predetermined distance in the contact open state. ing.

  The cover 4 is made of heat-resistant glass such as Pyrex (R), and a recess 4 a that ensures a swinging space for the amateur 30 is formed on the surface facing the amateur block 3.

  By the way, a metal thin film for bonding 38b is formed over the entire periphery of the surface of the frame portion 31 of the armature block 3 facing the base substrate 1, and on the periphery of the surface facing the cover 4. A bonding metal thin film 38a is formed over the entire circumference. Further, a metal thin film 15 for bonding is formed over the entire periphery of the surface of the base substrate 1 facing the amateur block 3, and the entire periphery of the periphery of the cover 4 facing the armature block 3 is also formed. Accordingly, the bonding metal thin film 42 is formed. Therefore, the armature block 3, the base substrate 1 and the cover 4 can be hermetically joined by pressure welding or anodic bonding, and the airtightness of the space surrounded by the base substrate 1, the cover 4 and the frame portion 31 can be improved.

  As a result, the microrelay of this embodiment includes the amateur 30 and the movable contact 33 in an airtight space surrounded by the base substrate 1, the cover 4, and the frame portion 31 interposed between the base substrate 1 and the cover 4. The fixed contact 14 is accommodated. In addition, as a material of the above-described bonding metal thin films 15, 38a, 38b, 42, for example, Au, Al-Si, or the like may be employed.

  When mounting the microrelay of this embodiment described above on a mounting substrate (not shown), for example, the two bumps 24 and the four bumps 13 exposed on the other surface side of the base substrate 1 are respectively connected to the above-described surface. What is necessary is just to connect to the conductor pattern formed in the one surface side of the mounting substrate (not shown).

  In this embodiment, each of the base substrate 1 and the cover 4 is formed by processing a glass substrate. However, one or both of the base substrate 1 and the cover 4 are formed by processing a silicon substrate. May be. Further, if the base substrate 1 and the cover 4 are limited to glass substrates and the semiconductor substrate from which the armature block 3 is based is limited to a silicon substrate, the bonding metal thin films 15, 38a, 38b, 42 are not provided. It is also possible to hermetically bond the amateur block 3 to the base substrate 1 and the cover 4 by anodic bonding. A wafer formed with a large number of the above-described amateur blocks 3, a wafer formed with a large number of the above-described base substrates 1, and a wafer formed with a large number of the above-described covers 4 are fixed by pressure welding or anodic bonding, and then individually processed by a dicing process or the like. Of course, it may be divided into micro relays.

  Hereinafter, the operation of the micro relay of this embodiment will be described.

  In the micro relay of this embodiment, when the coils 22 are energized, one end in the longitudinal direction of the magnetic body portion 30b is attracted to one leg piece 20b of the yoke 20 in accordance with the direction of magnetization, and the amateur 20 The movable contact 39 fixed to the movable contact base 34 at one end of the armature 30 contacts the pair of fixed contacts 14 and 14 facing each other with a predetermined contact pressure. Even if energization is stopped in this state, the attractive force is maintained by the magnetic flux generated by the permanent magnet 21, and the state is maintained as it is.

  Further, when the energization direction to the coils 22 and 22 is reversed, the magnetic body portion 30b of the armature 30 is attracted to the other leg piece 20b of the yoke 20 and the armature 30 swings to move the other end side of the armature 30. The movable contact 39 held by the contact base 34 contacts the pair of fixed contacts 14 and 14 facing each other with a predetermined contact pressure. Even if energization is stopped in this state, the attractive force is maintained by the magnetic flux generated by the permanent magnet 21, and the state is maintained as it is.

  In the microrelay of this embodiment, the spring constant of the support spring 32 is set so that the attractive force of the magnetic body portion 30b by the permanent magnet 21 is stronger than the return force by the support spring 32. The spring constant of the support spring 32 may be set so that the attraction force of the magnetic body portion 30b due to is weaker than the return force of the support spring 32.

  According to the microrelay of the present embodiment described above, the armature 3 and the fixed contact 14 are provided by including the cover 4 whose peripheral portion is fixed to the frame portion 31 on the side opposite to the base substrate 1 in the armature block 3. And the movable contact 39 is disposed in a sealed space, and the electromagnet apparatus 2 includes the permanent magnet 21 in the magnetic path formed by the armature 30 and the yoke 20 within the thickness dimension of the base substrate 1. Thus, there is no need to interpose a spacer between the amateur block and the base substrate, and the entire relay can be made thin. In other words, the thickness dimension of the entire relay can be defined by the total dimension of the thickness dimension of the base substrate 1, the thickness dimension of the frame portion 31 of the armature block 3, and the thickness dimension of the cover 4, and the base substrate 1, the cover 4 and the frame The container composed of the portion 31 can be made thinner.

  Further, in the micro relay of the present embodiment, the permanent magnet 21 is disposed so as to overlap with the armature 30 side in the central portion in the longitudinal direction of the coil winding portion 20a, and both surfaces in the overlapping direction are magnetized with different polarities. The armature 30 can swing around the central portion of the longitudinal direction of the 30, and the impact resistance is improved. Further, since the fulcrum projections 36b are projected from the surface of each projection piece 36 extending from the movable base portion 30a of the amateur 30 so as to face the base substrate 1, by providing such a pair of fulcrum projections 36b. The swinging motion of the amateur 30 can be further stabilized.

  In order to position the circuit board 23 with respect to the width direction of the yoke 20, as shown in FIG. 10 (a), the upper surface of the printed circuit board 20 is equidistant from the center in the both end directions in the both end directions. By providing a pair of convex portions 43, 43 substantially equal to the width dimension of the yoke in the short side direction and fitting the yoke 20 between the both convex portions 43, 43, the circuit board 23 is arranged in the width direction of the yoke 20. Positioning may be performed.

  Further, as shown in FIG. 10B, a convex portion 44 having a rectangular horizontal cross-sectional shape is provided at the center of the upper surface of the circuit board 23, and a rectangular concave portion (not shown) that is concavo-convexly coupled with the convex portion 44 is The circuit board 23 may be positioned with respect to the short side direction and the long side direction of the yoke 20 by being formed at the center of the lower surface of the central piece. Further, as shown in FIG. 10C, a rectangular square hole 45 is provided on the circuit board 23 side, and a convex portion (not shown) corresponding to the square hole 45 is formed at the center of the lower surface of the central piece of the yoke 20. However, the circuit board 23 may be positioned with respect to the short side direction and the long side direction of the yoke 20 by the concave / convex coupling between the square hole 45 and the convex portion. In the configuration of the positioning means in FIG. 10 (c), since the machining on the circuit board 23 may be perforated, it is easier than the case where the convex portions 43 or 44 are formed as shown in FIGS. is there.

The printed circuit board with which the electromagnet apparatus used for Embodiment 1 is equipped is shown, (a) is an expanded sectional view, (b) is a perspective view of the upper surface side, (c) is a perspective view of the lower surface side. It is a perspective view of the electromagnet apparatus used for the same as the above. It is an exploded perspective view same as the above. It is a perspective view which shows the same as the above. It is a principal part exploded perspective view same as the above. It is a front view of the electromagnet apparatus used for the same as the above. The amateur block in the same as above is shown, (a) is a plan view and (b) is a bottom view. It is a disassembled perspective view of the amateur block in the same as the above. It is a perspective view of the cover used for the same as the above. (A) is a perspective view of another example of the electromagnet device used in the above, (b) is a perspective view of another example of the printed circuit board provided in the electromagnet device used in the above, and (c) is provided in the electromagnet device used in the above. It is a perspective view of the other example of the printed circuit board to do. (A) is a perspective view of an electromagnet device used in a conventional example, (b) is a front view of the electromagnet device used in the above, and (c) is a perspective view of a printed board included in the electromagnet device used in the above.

Explanation of symbols

23 Circuit board 230 Through hole 230a Through hole plating part 230b Mounting terminal part 230c Coil connection part 231 Resist

Claims (8)

A base substrate provided with an electromagnet device that generates magnetic flux in response to an excitation current to a coil wound around a yoke, and provided with a fixed contact on one surface side in the thickness direction;
A frame portion fixed to the one surface side of the base substrate and an armature disposed on the inside of the frame portion and supported swingably by the frame portion and driven by an electromagnet device, and supported by a contact spring portion. It consists of an amateur block having a movable contact base provided with movable contacts,
The yoke is provided with a coil connecting portion for soldering the coil winding end on one side, and a through hole having a through hole plating electrically connected to the coil connecting portion on the inner surface is opened on the other side. A microrelay comprising: a mounted circuit board, wherein a through hole plating portion exposed at an opening edge of the through hole opened on the other surface of the circuit board is used as a mounting terminal portion. 2. The micro relay according to claim 1, wherein an opening of the through hole that opens on one surface of the circuit board is sealed with a resist material. 3. The micro relay according to claim 1, wherein the coil connection portion is provided at a position deviated from the position of the opening portion of the through hole on the one surface side of the circuit board. A permanent magnet for magnetic holding is arranged and fixed at substantially the center of one surface of the yoke, and the circuit board is arranged and fixed in a direction perpendicular to the yoke on the other surface of the yoke opposite to the arrangement position of the permanent magnet. Thus, both ends of the circuit board are projected in both directions of the yoke, and are extended from the both ends of the yoke so as to approach the armature. 4. The micro relay according to claim 1, wherein the yoke part between the pair of leg pieces and the projecting part of the permanent magnet and the circuit board is a coil winding part. 5. The micro relay according to claim 4, wherein a corner portion of the circuit board is a curved surface. 6. The micro relay according to claim 4, wherein the width of the circuit board in the same direction is made smaller than the width of the permanent magnet in the both ends of the yoke. On one surface of the circuit board, a pair of convex portions that are equidistant from the center in both end directions in the both end directions and whose distance is substantially equal to the width of both sides of the yoke are provided, and the yoke is positioned between the two convex portions for positioning. The micro relay according to claim 4, wherein: The positioning means for positioning between the circuit board and the yoke by uneven coupling is provided on the center of one surface of the circuit board and on the other surface side of the yoke on which the circuit board is fixedly arranged. The micro relay according to any one of 4 to 6.

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