JP2005213616A - Vapor deposition method, vapor deposition apparatus and method for manufacturing plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To uniformly form a vapor deposition coating on a moving substrate. <P>SOLUTION: This vapor deposition method comprises: introducing a beam B1 emitted from a plasma gun 14 onto a hearth 12 with the use of a permanent magnet 13 arranged below a hearth 12; reciprocating the permanent magnet 13 with a driving mechanism 15 in a direction approximately at right angles to a transportation path T and a horizontal direction with respect to the hearth 12; and vapor-deposits a vapor-depositing material E evaporated from the inside of the hearth 12, on the substrate P1 which is transported over the hearth 12 along the transportation path T. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method of evaporating an evaporation material by a beam emitted from a plasma gun and evaporating it on a substrate, an apparatus for carrying out the method, and a method of manufacturing a plasma display panel using the evaporation method.

  An evaporation method using a plasma gun is known as a method for forming a thin film on a substrate with a required material.

  In this plasma gun deposition method, a beam emitted from the plasma gun is guided into a hearth (hearth) by a magnetic field formed by a permanent magnet, and the deposition material placed in the hearth is evaporated by this beam to evaporate the surface of the substrate. This is a method of forming a thin film by vapor deposition.

  As an apparatus for performing such a vapor deposition method, an apparatus as shown in FIG. 1 has been proposed.

  In the vapor deposition apparatus of FIG. 1, a dish-shaped hearth 2 is installed at the center of the bottom of the vacuum deposition chamber 1.

  A plurality of permanent magnets 3 are movably disposed below the hearth 2 and connected to the adjusting mechanism 4 so that the permanent magnets 3 are movable along the radial direction of the hearth 2.

  A plasma gun 5 is attached to the side wall of the vapor deposition chamber 1, and a beam B is emitted from the plasma gun 5 into the vapor deposition chamber 1.

  In FIG. 1, 6 is an air-core coil for adjusting the pressure state emitted from the plasma gun 5, 1A is an exhaust hole for evacuating the inside of the deposition chamber 1, and 1B is a vacuum deposition chamber 1 A gas introduction hole for introducing a reaction gas into the inside.

  In this conventional vapor deposition apparatus, a vapor deposition material is put in the hearth 2, and a base P for forming a thin film is set at a predetermined position facing the hearth 2 on the ceiling side in the vapor deposition chamber 1. The plasma gun 5 is driven, and the beam B is emitted into the vapor deposition chamber 1 in the horizontal direction.

  The beam B emitted from the plasma gun 5 is irradiated into the hearth 2 while changing the course in the direction of the hearth 2 by the magnetic field formed by the permanent magnet 3 disposed below the hearth 2.

  The vapor deposition material E in the hearth 2 evaporates by the irradiation of the beam B and is vapor deposited on the surface of the base P set at a position facing the hearth 2 to form a thin film.

  At this time, the beam B irradiated to the hearth 2 usually has a high magnetic flux density at the central portion of the hearth 2 and decreases at the peripheral portion. Therefore, in the above conventional vapor deposition apparatus, each permanent magnet 3 is adjusted in advance by the adjusting mechanism 4. Therefore, the beam B irradiated to the hearth 2 can be adjusted so as to be uniform (see, for example, Patent Document 1).

  However, for example, when a thin film is formed using this deposition method on a relatively large substrate such as a plasma display panel (PDP) substrate, the deposition is performed while moving the substrate in the horizontal direction above the hearth. In general, a so-called moving film formation method is employed.

  In this case, since the vapor deposition material spreads in four directions around the evaporation point and evaporates, a circular evaporation distribution is formed around the position directly above the evaporation point, and the substrate is within the circular evaporation distribution region of this vapor deposition material. In order to move, the thickness of the thin film formed on the substrate is such that the central portion of the substrate passing through the central portion of the circular evaporation distribution region is thick, and both side edges of the substrate passing through the peripheral portion of the evaporation distribution region. There arises a problem that the thickness of the portion is reduced and the film thickness is uneven.

  Such a problem cannot be solved even by the conventional vapor deposition apparatus of FIG.

  That is, when moving film formation is performed by the conventional vapor deposition apparatus of FIG. 1, the magnetic field formed by the permanent magnet 3 is fixed, and this vapor deposition apparatus has a rough magnetic flux density in the width direction perpendicular to the movement direction of the substrate. Therefore, a peak value and a bottom value are inevitably generated in the deposition distribution on the substrate.

  Further, in this conventional vapor deposition apparatus, when performing the moving film formation, the peak value and the bottom value of the vapor deposition distribution slightly change depending on various vapor deposition conditions. Therefore, the position of the permanent magnet 3 is changed for each vapor deposition condition. The problem arises that it needs to be adjusted again.

JP-A-4-350157

  One object of the present invention is to solve the conventional problems in the case where a film is formed on a substrate by moving film formation as described above.

  In order to achieve the above object, the vapor deposition method according to the first invention (the invention described in claim 1) causes the plasma beam emitted from the plasma gun to enter the hearth by a magnet disposed below the hearth. In a vapor deposition method in which vapor deposition material evaporated from the inside of the hearth is vapor deposited on a substrate transported above the hearth, the magnet is reciprocated in a direction non-parallel to the substrate transport direction with respect to the hearth. It is characterized in that the substrate is transported in the same manner.

  Furthermore, in order to achieve the above object, a vapor deposition apparatus according to the second invention (the invention according to claim 5) is provided with a hearth into which the vapor deposition material is put, a plasma gun for injecting a plasma beam, and a bottom of the hearth. And a conveying member that conveys the substrate above the hearth. The plasma beam emitted from the plasma gun is guided into the hearth by the magnet, and vapor deposition material evaporated from the hearth is obtained. In the vapor deposition apparatus for vapor deposition on the substrate conveyed by the conveying member, a driving member for reciprocating the magnet in the direction parallel to the conveying direction of the substrate conveying member with respect to the hearth is attached to the magnet. It is a feature.

  Furthermore, in the method of manufacturing a plasma display panel according to the third invention (invention according to claim 9), in order to achieve the above object, a plasma beam emitted from a plasma gun is arranged below the hearth. In the method of manufacturing a plasma display panel, the method includes a vapor deposition step of guiding the vapor deposition material evaporated from the inside of the hearth by a magnet onto a substrate of the plasma display panel conveyed above the hearth. During the process, the substrate is transferred while reciprocating the magnet in a direction non-parallel to the transfer direction of the substrate with respect to the hearth.

  According to the present invention, a permanent magnet is movably disposed at a position facing a lower surface of a hearth (hearth) into which a deposition material is put, and the permanent magnet is placed on the permanent magnet with respect to the hearth on a substrate above the hearth. An embodiment of a vapor deposition apparatus to which a drive mechanism that reciprocates in a horizontal direction substantially perpendicular to the transport direction is attached, and a permanent magnet is ejected from the plasma gun in an amplitude motion by the drive mechanism of the vapor deposition apparatus. A vapor deposition method for evaporating vapor deposition material in the hearth by directing a plasma beam into the hearth by a permanent magnet and vapor deposition on a substrate conveyed above the hearth, and a plasma display using the vapor deposition method Each method of manufacturing a plasma display panel for manufacturing a panel substrate is the best embodiment.

  According to the vapor deposition method and the plasma display panel manufacturing method performed by the vapor deposition apparatus according to the best embodiment, the plasma beam from the plasma gun that is guided by the magnetic field formed by the permanent magnet and is irradiated into the hearth. The center position of the hearth moves along the moving direction of the permanent magnet in the hearth along with the amplitude motion of the permanent magnet, and the moving speed is high in the central part of the hearth, and becomes slower toward the peripheral part of the hearth.

  As a result, the evaporation amount of the vapor deposition material at the peripheral portion of the hearth is relatively increased with respect to the evaporation amount at the central portion of the hearth, which is less in the vapor deposition apparatus in which the conventional permanent magnet is fixed. The distribution of the evaporation amount of the vapor deposition material in the radial direction of the hearth along the moving direction is made uniform, so that the vapor deposition material is uniformly deposited on the substrate conveyed above the hearth.

  FIG. 2 is a schematic configuration diagram showing an example in the embodiment of the vapor deposition apparatus for carrying out the vapor deposition method according to the present invention.

  In this embodiment, a plasma display panel (PDP) substrate will be described as an example of a substrate to be vapor-deposited. However, in the present invention, a moving film is formed on a substrate other than the PDP substrate. It can also be applied to cases.

  In FIG. 2, the vapor deposition apparatus 10 is attached to the ceiling portion of the vapor deposition chamber 11 with a conveyance device (not shown) that conveys the substrate P1 of the PDP in the horizontal direction along the conveyance path T with the vapor deposition surface exposed. Further, the substrate P1 is carried into the vapor deposition chamber 11 and the substrate P1 from the vapor deposition chamber 11 in a state in which the vacuum state in the vapor deposition chamber 11 is maintained on opposite side wall portions on both sides of the vapor deposition chamber 11. A carry-in port 11A and a carry-out port 11B for carrying out are respectively provided.

  The vapor deposition chamber 11 is further provided with an exhaust hole 11C for evacuating the inside of the vapor deposition chamber 11 in the side wall portion, and a gas introduction hole 11D for introducing a reaction gas into the vapor deposition chamber 11 at the bottom portion. Is provided.

  A hearth 12 filled with a vapor deposition material E is installed at a position facing the conveyance path T at the bottom of the vapor deposition chamber 11.

  Further, in the lower part of the hearth 12, a range in which the permanent magnet 13 is opposed to the bottom surface of the hearth 12 in a horizontal direction perpendicular to the conveying direction of the conveying path T by a driving mechanism (not shown in FIG. 2) described later. It is attached so that it can reciprocate inside.

  A plasma gun 14 is attached to a position higher than the attachment position of the hearth 12 on the one side wall of the vapor deposition chamber 11 (in the illustrated example, a position below the carry-in port 11A). After B1 is adjusted to a required pressure by the air-core coil 14A, it is ejected horizontally above the hearth 12.

  FIG. 3 is a perspective view showing the configuration of the drive mechanism of the permanent magnet 13 of the vapor deposition apparatus 10.

  In FIG. 3, a plurality (two in the illustrated example) of hearths 12 are arranged horizontally in a direction perpendicular to the transport direction of the substrate P1.

  The drive mechanism 15 has a rail 15A attached to a position on the bottom surface of the vapor deposition chamber 11 facing the lower surfaces of the plurality of hearths 12 so as to extend in a horizontal direction perpendicular to the transport direction of the substrate P1, and on the rail 15A. The carriage 15B is placed so as to be able to travel along the rail.

  On the carriage 15B, the same number of permanent magnets 13 as the number of the hearths 12 are located between the centers of adjacent hearts 12 along the longitudinal direction of the carriage 15B (perpendicular to the conveyance direction of the substrate P1). Are arranged at the same interval and fixed so as to face the corresponding hearths 12 respectively.

  A rotating plate 15C that is rotated in one direction within a vertical plane by a horizontally extending rotating shaft 15Ca is disposed at a position facing one end side (front side in FIG. 3) of the cart 15B, and the rotating plate 15C, the cart 15B, The link 15D is attached by connecting one end of the link 15D to the outer peripheral portion of the rotating plate 15C so as to be swingable in the vertical direction and the other end being connected to one end portion of the carriage 15B so as to be swingable in the vertical direction. ing.

  That is, the drive mechanism 15 forms a reciprocating slider crank mechanism by the rail 15A, the carriage 15B, the rotating plate 15C, and the link 15D, and the carriage 15B moves on the rail 15A as the rotating plate 15C rotates in one direction. Are reciprocated.

  And the magnitude | size of the amplitude of the trolley | bogie 15B of this drive mechanism 15 is the magnitude | size which each permanent magnet 13 currently fixed on this trolley | bogie 15B does not protrude from the range of the diameter of each corresponding hearth 12 seeing from the upper direction. Is set.

  In the above, an example in which a plurality of hearths 12 are provided in the vapor deposition apparatus 10 is shown, but the configuration of the drive mechanism 15 is the same when one hearth 12 is provided.

  Next, a method for vapor deposition on the PDP substrate and a method for manufacturing the PDP substrate which are performed by the vapor deposition apparatus 10 will be described.

  In the vapor deposition apparatus 10, after a required vapor deposition material E is filled in each hearth 12, the drive mechanism 15 is started and a beam B 1 is emitted from the plasma gun 14 into the vapor deposition chamber 11 in the horizontal direction.

  The beam B1 is irradiated in the hearth 12 by changing its path downward by the magnetic field formed by the permanent magnet 13.

  At this time, the carriage 15B reciprocates on the rail 15A by the rotation of the rotating plate 15C of the drive mechanism 15, and this reciprocating movement of the carriage 15B includes the amplitude movement accompanying the rotation of the rotating plate 15C, as will be described below. Thus, the speed at the intermediate position between the dead points at both ends of the reciprocating motion is the fastest, and the speed decreases as the dead center on both sides approaches from the intermediate position.

  That is, as shown in FIG. 4, when the connecting portion C between the rotary plate 15C and the link 15D is positioned at an intermediate position between the dead points d1 and d2 on both sides of the link 15D, the horizontal speed of the link 15D is increased. The component x1 is the maximum, and the speed v1 of the carriage 15B is the fastest.

  As shown in FIG. 5, when the connecting portion C between the rotating plate 15C and the link 15D approaches the dead point d1 (or d2) of the link 15D as the rotating plate 15C rotates, the horizontal direction of the link 15D is increased. The speed component x2 is reduced, and the speed v2 of the carriage 15B decreases and increases after passing through the dead point d1 (or d2).

  Therefore, the center position of the beam B1 guided by the magnetic field formed by the permanent magnet 13 and irradiated in the hearth 12 is the moving direction of the permanent magnet 13 in the hearth 12 along with the amplitude motion of the permanent magnet 13 ( (The direction perpendicular to the conveyance path T) and the moving speed is high in the central portion of the hearth 12, and becomes slower toward the peripheral edge of the hearth 12.

  As a result, the magnetic flux distribution is made relatively uniform, and the evaporation amount of the vapor deposition material E at the peripheral portion of the hearth 12 which is small in the vapor deposition apparatus in which the conventional permanent magnet is fixed is the central portion of the hearth 12. Thus, the distribution of the evaporation amount of the vapor deposition material E in the radial direction of the hearth 12 along the moving direction of the permanent magnet 13 is made uniform.

  FIG. 6 shows a graph showing the evaporation distribution of the vapor deposition material E from the hearth 12 by the vapor deposition apparatus 10.

  In FIG. 6, a graph a indicated by a wavy line shows an evaporation distribution of the evaporation agent from the hearth in a vapor deposition apparatus in which a permanent magnet is fixed at the time of conventional vapor deposition, and a graph b indicated by a solid line indicates the vapor deposition apparatus 10. The evaporation distribution of the vapor deposition material E for each hearth 12 in FIG.

  Comparing the graphs a and b, the peak and bottom of the evaporation distribution appear in the graph a, whereas the graph b has a substantially uniform evaporation distribution in the direction perpendicular to the transport direction of the substrate P1. I understand.

  The evaporation distribution of the vapor deposition material E from the hearth 12 can be achieved by controlling the moving speed of the permanent magnet 13, that is, controlling the rotating speed of the rotating plate 15C more precisely, for example, the rotating plate 15C. This rotation speed control is performed in accordance with the evaporation distribution of the vapor deposition material E from the hearth 12 when the permanent magnet 13 is fixed.

  The speed control of the permanent magnet 13 can also be performed by selecting the radius of the rotating plate 15C and the connecting position of the rotating plate 15C and the link 15D.

  As described above, the substrate P1 is carried from the carry-in port 11A of the vapor deposition chamber 11 in a state where the uniform evaporation distribution of the vapor deposition material E from the hearth 12 is maintained (see FIG. 2). Are transported along the transport path T and are transported from the transport outlet 11B.

  At this time, in the vapor deposition chamber 11, the vapor deposition material E is evaporated from the hearth 12 with a uniform evaporation distribution, so that a uniform vapor deposition agent is also deposited on the moving substrate P <b> 1.

  In the above example, a so-called reciprocating slider crank mechanism based on the rotation of the rotating plate 15C is used to make the permanent magnet 13 perform an amplitude motion. However, as a driving mechanism for reciprocating the permanent magnet 13, In addition to the above, it is also possible to use a gear mechanism such as a rack and a pinion, and in this case, the amplitude motion of the permanent magnet 13 is realized by drive control of a drive motor that rotates the gear.

  Further, the reciprocating direction of the permanent magnet 13 is not limited to the horizontal direction perpendicular to the transport path T as described above, and if the direction is not parallel to the transport direction of the transport path T, the hearth 12 It is set in an arbitrary direction according to the shape and the shape of the substrate P1.

It is a schematic block diagram which shows the vapor deposition apparatus of a prior art example. It is a schematic block diagram which shows one Example in embodiment of the vapor deposition apparatus by this invention. It is a perspective view which shows the drive mechanism of the Example. It is explanatory drawing for demonstrating the moving speed of the permanent magnet 13 in the Example. It is explanatory drawing for demonstrating the moving speed of the permanent magnet 13 in the Example. It is a figure which shows the evaporation distribution from Haas in the Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Evaporation apparatus 11 ... Deposition chamber 12 ... Hearth (hearth)
13 ... Permanent magnet (magnet)
14 ... Plasma gun 15 ... Drive mechanism (drive member, reciprocating slider crank mechanism)
15A ... rail 15B ... cart 15C ... rotary plate 15D ... link B1 ... beam (plasma beam)
E ... Vapor deposition material P1 ... Substrate T ... Conveying path d1, d2 ... Dead point (turning point)

Claims (12)

A plasma beam emitted from the plasma gun is guided into the hearth by a magnet disposed below the hearth, and vapor deposition material evaporated from the hearth is deposited on a substrate transported above the hearth. In the vapor deposition method,
A vapor deposition method characterized in that the substrate is conveyed while reciprocating the magnet in a direction non-parallel to the substrate conveyance direction with respect to the hearth.   The vapor deposition method according to claim 1, wherein the magnet is reciprocated in a horizontal direction substantially perpendicular to a substrate transport direction.   The vapor deposition method according to claim 1, wherein the magnet is reciprocated so that the moving speed becomes slower as approaching the turning point from an intermediate position between the turning points on both sides of the reciprocating motion.   The vapor deposition method according to claim 3, wherein the magnet is reciprocated by a reciprocating slider crank mechanism. A plasma gun to be ejected from the plasma gun, comprising a hearth into which the deposition material is put, a plasma gun for injecting a plasma beam, a magnet disposed below the hearth, and a transport member for transporting the substrate above the hearth. In a vapor deposition apparatus for guiding a beam into a hearth by a magnet and depositing a vapor deposition material evaporated from the hearth on a substrate transported by a transport member,
A vapor deposition apparatus, wherein a drive member for reciprocating a magnet in a direction non-parallel to a conveyance direction by a substrate conveyance member with respect to the hearth is attached to the magnet.   The vapor deposition apparatus according to claim 5, wherein the driving member causes the magnet to reciprocate in a horizontal direction substantially perpendicular to a conveyance direction of the substrate by the conveyance member.   The vapor deposition apparatus according to claim 5, wherein the driving member causes the magnet to reciprocate so that the moving speed becomes slower as it approaches the turning point from an intermediate position between turning points on both sides of the reciprocating motion.   The vapor deposition apparatus according to claim 7, wherein the driving member is a reciprocating slider crank mechanism attached to a magnet. The plasma beam emitted from the plasma gun is guided into the hearth by a magnet disposed below the hearth, and the vapor deposition material evaporated from the hearth is transported above the hearth of the plasma display panel. In the manufacturing method of the plasma display panel including the vapor deposition step of vapor deposition on the substrate,
A method of manufacturing a plasma display panel, wherein the substrate is transported while the magnet is reciprocated in a direction non-parallel to the substrate transport direction with respect to the hearth during the vapor deposition step.   The method for manufacturing a plasma display panel according to claim 9, wherein the magnet is reciprocated in a horizontal direction substantially perpendicular to a substrate transport direction.   10. The method of manufacturing a plasma display panel according to claim 9, wherein the magnet is reciprocated so that the moving speed becomes slower as approaching the turning point from an intermediate position between the turning points on both sides of the reciprocating motion.   The method of manufacturing a plasma display panel according to claim 11, wherein the magnet is reciprocated by a reciprocating slider crank mechanism.

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