JP2005212355A - Thread, ic chip-filled sheet, manufacturing method for them and sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the possibility of the breakage of an IC chip without costing much labor. <P>SOLUTION: In a thread formed by installing an IC chip 10, which can read out at least information under non-contact state, on a strip-like resin layer 20, a paper layer 50, in which a hole part 51 is formed so as to expose the IC chip 10 beyond the resin layer 20, is laminated on the resin layer 20 and then, by dripping a resin in the hole part 51, a reinforcing member 40 is formed so as to cover the IC chip 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a thread in which an IC chip is mounted on a sheet substrate, a sheet containing an IC chip, a manufacturing method thereof, and a sheet.

  In the past, counterfeit crimes have frequently occurred in securities such as prepaid cards, various admission tickets, gift certificates and stock certificates because they are widely distributed and can be exchanged relatively easily. In particular, in recent years, with the improvement and popularization of copying machines such as color copiers, counterfeit products that cannot be easily distinguished from genuine products can be manufactured relatively easily, and countermeasures against counterfeiting are required. Yes. Moreover, measures against counterfeiting are required not only for the above-mentioned securities but also for banknotes.

  As one of countermeasures against such counterfeiting, a technique for preventing forgery of securities or banknotes by attaching or inserting a member called a thread on the securities or banknotes is considered. In this technology, a thread formed by cutting a plastic film, thin paper, etc. to a width of about several millimeters is not exposed from the surface of securities or banknotes, or securities such that a part is exposed from the surface. It is inserted into the paper layer of the banknote, and the authenticity of the securities and banknotes is determined by the presence or absence of this thread.

  Furthermore, in recent years, a technique for determining the authenticity of securities or bills using a thread on which an IC chip is mounted has been considered. In this technology, a thread in which an IC chip is bonded to one side of a film cut to a width of about several millimeters is inserted into a paper layer of securities or banknotes, and when using securities or banknotes, an IC is used. By reading the information written on the chip, the authenticity of the securities or bills is determined (for example, see Patent Document 1).

  However, in the above-described thread and the IC chip-containing sheet in which the IC chip is mounted on the sheet base material like this thread, the IC chip is only bonded on the sheet base material. As a result, the IC chip is likely to be damaged.

Here, in a non-contact IC card in which an antenna and an IC chip are mounted on a substrate, a technique for providing a substantially circular reinforcing material on the IC chip and thereby protecting the IC chip is considered (for example, (See Patent Document 2). If this technique is used, the possibility that the IC chip adhered on the sheet base material is damaged can be reduced.
JP 2002-319006 A Japanese Patent Laid-Open No. 2002-170087

  However, when the IC chip is protected by providing the reinforcing material on the IC chip as described above, the position and pressure when the reinforcing material is mounted on the IC chip must be precisely controlled. There is a problem that it takes.

  The present invention has been made in view of the problems of the conventional techniques as described above, and a thread and an IC chip that can reduce the possibility of the IC chip being damaged without taking time and effort. It is an object of the present invention to provide an entering sheet, a manufacturing method thereof, and a sheet.

In order to achieve the above object, the present invention provides:
A thread in which an IC chip capable of reading at least information in a non-contact state is mounted on a belt-shaped first sheet base material,
A reinforcing member is provided on the first sheet base so as to cover at least the IC chip.

In addition, a second sheet base material having a hole formed so as to expose the IC chip is laminated on the first sheet base material,
The reinforcing member is formed by dropping resin into the hole.

Further, a thread in which an IC chip capable of reading at least information in a non-contact state is mounted on a belt-shaped sheet base material,
Printing is performed on the periphery of the IC chip on the sheet base material with a thick film forming ink containing a granular filler.

In addition, the thread manufacturing method,
Laminating the second sheet on the first sheet substrate, and bonding the first sheet and the second sheet;
Mounting the IC chip inside the hole on the first sheet base material on which the second sheet base material is laminated;
Dropping the resin into the hole.

Also, an IC chip-containing sheet in which an IC chip is mounted on a sheet base material,
Printing is performed on the periphery of the IC chip on the sheet base material with a thick film forming ink containing a granular filler.

Moreover, it is a manufacturing method of the sheet containing the IC chip,
Printing a thick film forming ink containing the granular filler around a region where the IC chip is mounted on the sheet base;
And mounting the IC chip on the sheet base material.

  In the present invention configured as described above, the IC chip mounted on the first sheet base material is covered with the reinforcing member provided on the first sheet base material. Thus, even if the IC chip is protected and the thread is attached to a securities or banknote, the possibility of the IC chip being damaged is reduced.

  As a specific means, when a second sheet base material in which a hole for exposing an IC chip is laminated on the first sheet base material, a resin is dropped into the hole. It is conceivable to form a reinforcing member so as to cover the IC chip.

  In addition, the IC chip is protected by printing the thick film forming ink containing the particulate filler around the IC chip on the sheet substrate on which the IC chip is mounted. The possibility of doing so is reduced.

  As described above, in the present invention, in a thread in which an IC chip capable of reading at least information in a non-contact state is mounted on a belt-shaped first sheet base material, Since the reinforcing member is provided so as to cover at least the IC chip, the IC chip is protected by the reinforcing member, and even when the thread is attached to a securities or banknote, the IC chip is The possibility of breakage can be reduced.

  In addition, in the case where printing is performed around the IC chip on the sheet base material with the thick film forming ink containing the granular filler, the IC chip is protected by the thick film forming ink, As a result, it is possible to reduce the possibility that the IC chip is damaged without taking time and effort by simply printing on the sheet base material with the thick film forming ink.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
1A and 1B are diagrams showing a first embodiment of a thread according to the present invention, in which FIG. 1A is a top view and FIG. 1B is a cross-sectional view taken along line AA ′ shown in FIG.

  In this embodiment, as shown in FIG. 1, an IC chip 10 is mounted and bonded to a resin layer 20 as a first sheet base material by a hot melt layer 30 made of hot melt as an adhesive. The paper layer 50 which is the 2nd sheet | seat base material in which the hole part 51 where 10 is exposed is formed is laminated | stacked and comprised. In addition, a reinforcing member 40 made of resin is provided inside and above the hole 51, whereby the IC chip 10 bonded onto the resin layer 20 is covered with the reinforcing member 40. Yes. The resin layer 20 is made of strip-shaped PET, and is bonded to the paper layer 50 by a hot melt layer 30. Further, the IC chip 10 can read information in a non-contact state, and the information written in the IC chip 10 can be read close to an information writing / reading device provided outside. Read out.

  In the thread configured as described above, for example, an adhesive (not shown) is applied to one surface, and is used by being affixed to securities or banknotes. Therefore, if one surface of the thread is made of a paper layer 50 or a layer made of nonwoven fabric and this surface is a surface to be affixed to securities or banknotes, the adhesiveness between the threads and securities or banknotes can be improved. it can. On the other hand, when the first sheet base material on which the paper layer 50 is laminated is the resin layer 20 made of a material such as PET as described above, the mechanical strength of the thread can be improved. The first and second sheet base materials to be laminated have the effects described above by being limited to the resin layer 20 and the paper layer 50, but the present invention is not limited to these.

  When a securities or banknote with a thread attached is brought close to the above-described information writing / reading device, for example, information written in the IC chip 10 is read, and based on the read information, the valuable information is read. The authenticity of securities and banknotes will be determined. Note that, in the IC chip 10, as described above, when the authentication determination is performed only by the information written in the IC chip 10, the information written in the IC chip 10 may be read in a non-contact state. However, the information may be written in a non-contact state by being brought close to the information writing / reading device.

  It is also conceivable to use the thread by inserting it into the paper layer of the securities or banknotes instead of sticking the threads as shown in FIG. 1 to the securities or banknotes. In that case, for example, paper made from at least two paper layers using a multi-tank type net paper machine is used as securities or banknotes, and threads are made between the paper layers when manufacturing securities or banknotes. Keep in mind. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above. Moreover, it is also conceivable to use a securities or banknotes in which a plurality of papers are stacked with a thread sandwiched between the stacked papers.

  It is also conceivable that a recess is formed in securities, bills or the like, and a thread as shown in FIG. 1 is fitted into the recess. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above.

  The thread as shown in FIG. 1 is not limited to securities, banknotes, etc. as described above, but is attached to a sheet-like one, as described above, punched, sandwiched, Alternatively, it is used by being incorporated into a sheet by being fitted.

  Below, the manufacturing method of the thread | sled mentioned above is demonstrated.

  FIG. 2 is a diagram for explaining a method of manufacturing the thread shown in FIG.

  First, the hot melt layer 30 is laminated on the resin sheet 21 by applying hot melt to the entire surface of the resin sheet 21 that becomes the resin layer 20 by being cut (FIG. 2A).

  Next, a paper layer 50 as a second sheet base material is laminated on the resin sheet 21 on which the hot melt layer 30 is laminated, and the paper layer 50 and the resin sheet 21 are heated by the hot melt layer 30 by heating and pressing. And glue. Here, the paper layer 50 is laminated on the resin sheet 21, and when the IC chip 10 is mounted on the resin sheet 21 later, a hole 51 is formed in a region facing the IC chip 10. (FIG. 2B).

  Next, the IC chip 10 is mounted on the resin sheet 21 on which the paper layer 50 is laminated so that the IC chip 10 enters the hole 51 formed in the paper layer 50 (FIG. 2C). As a result, the IC chip 10 is exposed from the hole 51 formed in the paper layer 50.

  When the IC chip 10 is heated and pressed when the IC chip 10 is mounted on the resin sheet 21, the portion of the hot melt layer 30 that contacts the IC chip 10 and its surroundings are melted, thereby causing the IC chip 10 to be hot. The IC chip 10 is bonded onto the resin sheet 21 by being embedded in the melt layer 30 and then the hot melt layer 30 is cured (FIG. 2D).

  FIG. 3 is a diagram showing a state in which the IC chip 10 is mounted and bonded on the resin sheet 21 on which the paper layer 50 is laminated in the manufacturing process of the thread shown in FIG.

  As shown in FIG. 3, the IC chip 10 is mounted and bonded in a matrix on the resin sheet 21 on which the paper layer 50 is laminated, and is exposed from the holes 51 formed in the paper layer 50.

  Next, when resin is dropped into the hole 51, the resin enters the hole 51 and then hardens, thereby forming the reinforcing member 40 inside and above the hole 51 (FIG. 2 (e)). )).

  FIG. 4 is a view showing a state in which the reinforcing member 40 is formed in the hole 51 in the manufacturing process of the thread shown in FIG.

  When the resin is dropped into the hole 51, the resin enters the hole 51, and the reinforcing member 40 is formed so as to close the hole 51 as shown in FIG. The IC chip 10 is covered with the reinforcing member 40.

  Thereafter, the resin sheet 21 in which the reinforcing member 40 is formed in the hole 51 is cut into a band shape, thereby completing the thread roll.

  FIG. 5 is a diagram illustrating a state in which the resin sheet 21 is cut into a band shape in the thread manufacturing process illustrated in FIG. 1.

  As shown in FIG. 5, when the resin sheet 21 in which the reinforcing member 40 is formed in the hole 51 is cut into a strip shape, the thread in which the IC chip 10 and the reinforcing member 40 are linearly arranged on the resin sheet 21. A roll is formed, and this thread roll is wound up and then cut for each unit to be attached (for example, one IC chip 10 is included) when it is attached to securities or banknotes. As a result, a thread as shown in FIG. 1 is formed.

  In this embodiment, a paper layer 50 in which a hole 51 is formed so that the IC chip 10 is exposed is laminated on the resin layer 20 on which the IC chip 10 is mounted, and the hole 51 of the paper layer 50 is stacked. Although the reinforcing member 40 made of resin is provided so as to block the paper, the paper layer 50 is not laminated on the resin layer 20, and the reinforcing member 40 is provided on the entire surface of the resin layer 20 on which the IC chip 10 is laminated. It is also conceivable to provide the reinforcing member 40 so as to cover only the IC chip 10 on the resin layer 20 on which the IC chip 10 is laminated.

(Second Embodiment)
6A and 6B are diagrams showing a second embodiment of the thread of the present invention, where FIG. 6A is a diagram showing a stacked state, and FIG. 6B is a diagram showing an internal configuration.

  In this embodiment, as shown in FIG. 6, an IC chip 110 is mounted on and adhered to a resin layer 120 as a first sheet base material by a hot melt layer 130 made of hot melt as an adhesive, and further thereon. A paper layer 150 as a second sheet base material is laminated. Further, the printed layer 140 is formed around the IC chip 110 of the resin layer 120 by printing so as to surround the IC chip 110 with the thick film forming ink including the particulate filler. The resin layer 120 is made of a strip-shaped PET, and is bonded to the paper layer 150 by a hot melt layer 130. Further, the IC chip 110 can read information in a non-contact state, and the information written in the IC chip 110 can be read by bringing it close to an information writing / reading device provided outside. Read out.

  In the thread configured as described above, for example, an adhesive (not shown) is applied to one surface, and is used by being affixed to securities or banknotes. Therefore, if one surface of the thread is made of a paper layer 150 or a layer made of nonwoven fabric and this surface is a surface to be affixed to securities or banknotes, the adhesiveness between the threads and securities or banknotes can be improved. it can. On the other hand, when the first sheet base material on which the paper layer 150 is laminated is the resin layer 120 made of a material such as PET as described above, the mechanical strength of the thread can be improved. The first and second sheet base materials to be laminated have the effects described above by being limited to the resin layer 120 and the paper layer 150, but the present invention is not limited to these.

  When the securities or banknotes to which the thread is attached are brought close to the information writing / reading device described above, for example, the information written in the IC chip 110 is read, and the valuable information is read based on the read information. The authenticity of securities and banknotes will be determined. Note that, in the IC chip 110, when the authenticity determination is performed only by the information written in the IC chip 110 as described above, the information written in the IC chip 110 may be read in a non-contact state. However, the information may be written in a non-contact state by being brought close to the information writing / reading device.

  Moreover, it is also conceivable to use the thread by inserting it into the paper layer of the securities or banknotes instead of sticking the threads as shown in FIG. 6 to the securities or banknotes. In that case, for example, paper made from at least two paper layers using a multi-tank type net paper machine is used as securities or banknotes, and threads are made between the paper layers when manufacturing securities or banknotes. Keep in mind. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above. Moreover, it is also conceivable to use a securities or banknotes in which a plurality of papers are stacked with a thread sandwiched between the stacked papers.

  It is also conceivable to form a recess in securities, banknotes, etc., and insert a thread as shown in FIG. 6 into this recess. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above.

  Note that the thread as shown in FIG. 6 is not limited to securities, banknotes, etc. as described above, but is attached to a sheet-like one, as described above, punched, sandwiched, Alternatively, it is used by being incorporated into a sheet by being fitted.

  Below, the manufacturing method of the thread | sled mentioned above is demonstrated.

  FIG. 7 is a diagram for explaining a method of manufacturing the thread shown in FIG.

  First, printing is performed around the area where the IC chip 110 of the resin sheet 121 that becomes the resin layer 120 by being cut is mounted with the thick film forming ink including the granular filler so as to surround the area. A layer 140 is formed (FIG. 7A). In addition, as a material of a granular filler, although resin, an inorganic substance, a metal oxide, a metal, carbon, etc. are mentioned, when insulation is requested | required, it is necessary to use resin or an inorganic substance. Among them, a granular filler made of polyurethane resin, acrylic resin, polyamide resin, polystyrene resin or the like is preferable because of less sedimentation in the ink. Further, if the shape of the granular filler is a sphere or a shape close to a sphere, variations in the thickness of the ink film can be suppressed.

  Next, the hot melt layer 130 is laminated on the resin sheet 121 by applying hot melt to the entire surface of the resin sheet 121 on which the print layer 140 is formed, on which the print layer 140 is formed (FIG. 7B). )).

  Next, the IC chip 110 is mounted on the resin sheet 121 on which the hot melt layer 130 is laminated (FIG. 7C).

  When the IC chip 110 is heated and pressurized when the IC chip 110 is mounted on the resin sheet 121, the portion of the hot melt layer 130 that contacts the IC chip 110 and its periphery are melted, whereby the IC chip 110 is hot. The IC chip 110 is bonded onto the resin sheet 121 by being embedded in the melt layer 130 and then curing the hot melt layer 130 (FIG. 7D).

  FIG. 8 is a diagram showing a state in which the IC chip 110 is mounted and bonded on the resin sheet 121 on which the printed layer 140 is formed and the hot melt layer 130 is laminated in the thread manufacturing process shown in FIG. .

  As shown in FIG. 8, on the resin sheet 121 on which the printed layer 140 is formed and the hot melt layer 130 is laminated, the IC chip 110 is mounted and bonded in a matrix, and these mounted and bonded in the matrix. Each IC chip 110 is surrounded by a printing layer 140 formed on the resin sheet 121.

  Next, when the paper layer 150 is laminated on the resin sheet 121 on which the IC chip 110 is mounted and adhered, and heated and pressurized, the hot melt layer 130 is melted and then the hot melt layer 130 is cured. The resin sheet 121 and the paper layer 150 are bonded to each other (FIG. 7E).

  Thereafter, the resin sheet 121 on which the paper layer 150 is laminated is cut into a strip shape to complete a thread roll.

  FIG. 9 is a diagram illustrating a state in which the resin sheet 121 is cut into a strip shape in the thread manufacturing process illustrated in FIG. 6.

  As shown in FIG. 9, when the resin sheet 121 on which the paper layer 150 is laminated is cut into a strip shape, the thread roll in which the IC chip 110 and the printing layer 140 surrounding it are linearly arranged on the resin sheet 121. The thread roll is wound up and then cut into units to be affixed (for example, one IC chip 110 is included) when being affixed to securities or banknotes. A thread as shown in FIG. 6 is formed.

  In this embodiment, the printed layer 140 is formed around the IC chip 110 on the resin layer 120 so as to surround the IC chip 110. However, the printed layer 140 is formed so as to surround the IC chip 110. The IC chip 110 may be formed in a C-shape having an open portion in a part thereof, only in a region adjacent to two opposite sides of the IC chip 110, or adjacent to each other. It may be possible to form only in a region adjacent to two sides. In these cases, if the material of the particulate filler contained in the printed layer 140 is a conductive material such as metal oxide or metal, the printed layer 140 functions as a booster antenna of the IC chip 110, and the IC chip. The communicable distance of 110 can be extended.

  In this embodiment, the printed layer 140 is formed and the paper layer 150 is laminated on the resin layer 120 on which the IC chip 110 is mounted. However, the present invention is not limited to laminating the paper layer 150. .

  In this embodiment, the thread in which the IC chip 110 is mounted and fixed on the belt-shaped resin layer 120 has been described. However, the IC chip-containing sheet in which the IC chip is mounted and fixed on the sheet base material is also described. It can be manufactured by the same manufacturing method as described above. The IC chip-containing sheet can be used as a single sheet by forming an adhesive or a printing layer on the sheet surface, or can be used by laminating other sheets.

(Third embodiment)
FIGS. 10A and 10B are diagrams showing a third embodiment of the thread of the present invention, where FIG. 10A is a diagram showing a stacked state, and FIG. 10B is a diagram showing an internal configuration.

  In this embodiment, as shown in FIG. 10, an IC chip 210 is mounted on and bonded to a resin layer 220 that is a first sheet base material by a hot melt layer 230 that is a hot melt that is an adhesive. A printed layer 240 is formed so as to cover, and a paper layer 250 as a second sheet base material is further laminated thereon. The resin layer 220 is made of strip-like PET, and is bonded to the paper layer 250 by a hot melt layer 230. Further, the IC chip 210 can read information in a non-contact state, and the information written in the IC chip 210 can be read by bringing it close to an information writing / reading device provided outside. Read out.

  In the thread configured as described above, for example, an adhesive (not shown) is applied to one surface, and is used by being affixed to securities or banknotes. Therefore, if one side of the thread is made of a paper layer 250 or a layer made of non-woven fabric and this side is used as a surface to be affixed to securities or banknotes, the adhesiveness between the threads and securities or banknotes can be improved. it can. On the other hand, when the first sheet base material on which the paper layer 250 is laminated is the resin layer 220 made of a material such as PET as described above, the mechanical strength of the thread can be improved. The first and second sheet base materials to be laminated have the effects described above by being limited to the resin layer 220 and the paper layer 250, but the present invention is not limited to these.

  When the securities or bills to which the thread is attached are brought close to the information writing / reading device described above, for example, the information written in the IC chip 210 is read, and the valuable information is read based on the read information. The authenticity of securities and banknotes will be determined. In the IC chip 210, as described above, in the case where the authenticity determination is performed only by the information written in the IC chip 210, the information written in the IC chip 210 may be read in a non-contact state. However, the information may be written in a non-contact state by being brought close to the information writing / reading device.

  Further, instead of sticking the thread as shown in FIG. 10 to the securities or banknotes, it is possible to use the thread by inserting it into the paper layer of the securities or banknotes. In that case, for example, paper made from at least two paper layers using a multi-tank type net paper machine is used as securities or banknotes, and threads are made between the paper layers when manufacturing securities or banknotes. Keep in mind. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above. Moreover, it is also conceivable to use a securities or banknotes in which a plurality of papers are stacked with a thread sandwiched between the stacked papers.

  It is also conceivable that a recess is formed in the securities or banknotes and a thread as shown in FIG. 10 is fitted into the recess. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above.

  Note that the thread as shown in FIG. 10 is not limited to securities and banknotes as described above, but is attached to a sheet-like one as described above, interleaved, sandwiched, Alternatively, it is used by being incorporated into a sheet by being fitted.

  Below, the manufacturing method of the thread | sled mentioned above is demonstrated.

  FIG. 11 is a diagram for explaining a method of manufacturing the thread shown in FIG.

  First, the hot melt layer 230 is laminated on the resin sheet 221 by applying hot melt to the entire surface of the resin sheet 221 that becomes the resin layer 220 by being cut (FIG. 11A).

  Next, the IC chip 210 is mounted on the resin sheet 221 on which the hot melt layer 230 is laminated (FIG. 11B), and when the IC chip 210 is heated and pressurized, it contacts the IC chip 210 of the hot melt layer 230. Then, the IC chip 210 is embedded in the hot melt layer 230, and then the hot melt layer 230 is cured, so that the IC chip 210 is bonded onto the resin sheet 221. (FIG. 11C).

  FIG. 12 is a diagram illustrating a state in which the IC chip 210 is bonded onto the resin sheet 221 in the thread manufacturing process illustrated in FIG. 10.

  As shown in FIG. 12, in the thread manufacturing process shown in FIG. 10, IC chips 210 are mounted and bonded in a matrix on the resin sheet 221.

  Next, printing is performed on the resin sheet 221 on which the IC chip 210 is mounted and bonded so as to cover the IC chip 210 with a thick film forming ink containing a granular filler, thereby forming a printed layer 240 (FIG. 11 ( d)).

  FIG. 13 is a diagram illustrating a state in which the printing layer 240 is formed on the resin sheet 221 on which the IC chip 210 is mounted in the thread manufacturing process illustrated in FIG. 10.

  As shown in FIG. 13, when the printed layer 240 is formed on the resin sheet 221, the IC chips 210 mounted and bonded in a matrix on the resin sheet 221 are each covered with the printed layer 240. .

  Next, when the paper layer 250 is laminated on the resin sheet 221 on which the IC chip 210 is mounted and the printing layer 240 is formed, and heated and pressurized, the hot melt layer 230 is melted, and then the hot melt layer 230 is formed. Is cured, the resin sheet 221 and the paper layer 250 are bonded to each other (FIG. 11E).

  Thereafter, the resin sheet 221 on which the paper layer 250 is laminated is cut into a strip shape to complete a thread roll.

  FIG. 14 is a diagram illustrating a state in which the resin sheet 221 is cut into a band shape in the thread manufacturing process illustrated in FIG. 10.

  As shown in FIG. 14, when the resin sheet 221 on which the paper layer 250 is laminated is cut into a strip shape, the IC chip 210 and the printed layer 240 formed so as to cover the resin chip 221 are arranged in a straight line. A thread roll is formed, and this thread roll is wound up, and then attached to a securities or banknote, for each unit to be attached (for example, one IC chip 210 is included). Thus, a thread as shown in FIG. 10 is formed.

  In this embodiment, the print layer 240 is formed so as to cover the IC chip 210 mounted on the resin layer 220. However, the print layer 240 is formed on the entire surface of the resin layer 220 on which the IC chip 210 is mounted. It is also possible to do. In particular, in that case, it is not necessary to dare to laminate the paper layer 250 on the resin layer 220.

  In the three embodiments described above, the resin layers 20, 120, and 220 are made of PET, but the present invention is not limited to this, and for example, those made of PET-G or PVC are considered. It is done. It is also conceivable to use a resin layer made of PET, PET-G or PVC instead of the paper layers 50, 150 and 250. When the resin layers 20, 120, 220 are made of PET-G or PVC, and the resin layers made of PET-G or PVC are used instead of the paper layers 50, 150, 250, these are heated. Therefore, the hot melt layers 30, 130, and 230 may be laminated only in the region of the resin sheets 21, 121, and 221 where the IC chips 10, 110, and 210 are mounted.

  Further, in the thread manufacturing method of the present invention, as described above, the resin sheets 21, 121, and 221 that become the resin layers 20, 120, and 220 by cutting and the IC chips 10, 110, and 210 in a matrix form are cut. In addition to manufacturing the thread by laminating the paper layers 50, 150, and 250 and then cutting the paper layers, the IC chips 10, 110 are substantially formed on the belt-shaped resin layers 20, 120, 220. 210 and the paper layers 50, 150, and 250 are stacked.

  Further, the IC chip 10, 110, 210 for bonding the resin layers 20, 120, 220 is not limited to the hot melt layers 30, 130, 230, for example, a layer made of an ultraviolet curable adhesive. It is also possible to use. In that case, when the IC chips 10, 110, and 210 are mounted on the resin sheets 21, 121, and 221, the side of the resin sheets 21, 121, and 221 opposite to the surface on which the IC chips 10, 110, and 210 are mounted By irradiating ultraviolet rays from the surface, thereby melting the ultraviolet curable adhesive, and then bonding the IC chips 10, 110, 210 on the resin sheets 21, 121, 221 by curing the adhesive. Become. In addition, when a layer made of an ultraviolet curable adhesive is used instead of the hot melt layers 30, 130, 230 as the resin layers 20, 120, 220 and the paper layers 50, 150, 250 are bonded to each other, When bonding the resin sheets 21, 121, 221 and the paper layers 50, 150, 250, ultraviolet rays are irradiated from the surface of the resin sheets 21, 121, 221, thereby melting the ultraviolet curable adhesive, Thereafter, the resin sheets 21, 121, and 221 and the paper layers 50, 150, and 250 are bonded by curing the adhesive. In these cases, the resin sheets 21, 121, and 221 need to be made of a material that transmits ultraviolet rays.

  Further, in the above-described three embodiments, the resin layer 20, 120, 220 is used as the first sheet base material, so that the sheet being conveyed can be fed into another paper layer or bonded. Twist and breakage can be prevented, and by using the paper layer 50, 150, 250 as the second sheet base material, it can be compared with a film or the like when interleaved with another paper layer or bonded. As a result, the adhesiveness is improved and it is difficult to peel off. Accordingly, by using one of the two sheet base materials to be laminated, one of which is made of resin and the other is made of paper, the sheet can be prevented from being twisted or broken, and has an effect of improving adhesion and being difficult to peel off. . Thus, the laminated structure is not limited to this embodiment, and the resin layers 20, 120, and 220 that are the first sheet base material and the paper layers 50, 150, and 250 that are the second sheet base material. It goes without saying that the same effect can be obtained even if the arrangement is reversed. Furthermore, when only the improvement in adhesiveness is required, it is conceivable that the two sheet base materials to be laminated are made of paper, and in order to improve the mechanical strength 2 One sheet base material may be made of resin.

It is a figure which shows 1st Embodiment of the thread | sled of this invention, (a) is a top view, (b) is A-A 'sectional drawing shown to (a). It is a figure for demonstrating the manufacturing method of the thread | sled shown in FIG. FIG. 2 is a diagram showing a state in which an IC chip is mounted and bonded on a resin sheet on which a paper layer is laminated in the thread manufacturing process shown in FIG. It is a figure which shows the state in which the reinforcement member was formed in the hole part in the manufacturing process of the thread | sled shown in FIG. It is a figure which shows the state by which the resin sheet was cut | judged in the strip | belt shape in the manufacturing process of the thread | thread shown in FIG. It is a figure which shows 2nd Embodiment of the thread | sled of this invention, (a) is a figure which shows a lamination | stacking state, (b) is a figure which shows an internal structure. It is a figure for demonstrating the manufacturing method of the thread | sled shown in FIG. FIG. 7 is a diagram showing a state in which an IC chip is mounted and bonded on a resin sheet on which a printed layer is formed and a hot melt layer is laminated in the thread manufacturing process shown in FIG. 6. It is a figure which shows the state by which the resin sheet was cut | judged in the strip | belt shape in the manufacturing process of the thread | thread shown in FIG. It is a figure which shows 3rd Embodiment of the thread | sled of this invention, (a) is a figure which shows a lamination | stacking state, (b) is a figure which shows an internal structure. It is a figure for demonstrating the manufacturing method of the thread | sled shown in FIG. FIG. 11 is a diagram showing a state where an IC chip is bonded onto a resin sheet in the thread manufacturing process shown in FIG. 10. It is a figure which shows the state in which the printing layer was formed on the resin sheet in which the IC chip was mounted in the manufacturing process of the thread | thread shown in FIG. It is a figure which shows the state by which the resin sheet was cut | judged in the strip | belt shape in the manufacturing process of the thread | thread shown in FIG.

Explanation of symbols

10, 110, 210 IC chip 20, 120, 220 Resin layer 21, 121, 221 Resin sheet 30, 130, 230 Hot melt layer 40 Reinforcing member 50, 150, 250 Paper layer 51 Hole 140, 240 Print layer

Claims (7)

A thread in which an IC chip capable of reading at least information in a non-contact state is mounted on a belt-shaped first sheet base material,
A thread provided with a reinforcing member so as to cover at least the IC chip on the first sheet base material. The thread of claim 1,
On the first sheet base material, a second sheet base material in which a hole is formed so that the IC chip is exposed is laminated,
The thread, wherein the reinforcing member is formed by dripping a resin into the hole. A thread in which an IC chip capable of reading at least information in a non-contact state is mounted on a belt-like sheet base material,
A thread in which the periphery of the IC chip on the sheet base material is printed with thick film forming ink containing a granular filler. It is a manufacturing method of the thread according to claim 2,
Laminating the second sheet on the first sheet substrate, and bonding the first sheet and the second sheet;
Mounting the IC chip inside the hole on the first sheet base material on which the second sheet base material is laminated;
A method of manufacturing a thread, the method comprising: dropping a resin into the hole.   The sheet | seat in which the thread | sled of any one of Claim 1 thru | or 3 was integrated. An IC chip-containing sheet in which an IC chip is mounted on a sheet substrate,
An IC chip-containing sheet in which printing is performed around the IC chip on the sheet base material with a thick film forming ink containing a granular filler. It is a manufacturing method of the sheet | seat containing an IC chip of Claim 6,
Printing a thick film forming ink containing the granular filler around a region where the IC chip is mounted on the sheet base;
A method of manufacturing an IC chip-containing sheet, comprising a step of mounting the IC chip on the sheet base material.

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