JP2005209784A - Pressure contact semiconductor device and converter using same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pressure contact semiconductor device which can hold a uniform pressurizing status in the area of a pressure contact package, in which a gap is not caused between the semiconductor element and a main electrode plate, even if a temperature expansion change or the change of an applied pressure occurs at a pressure sealing package in use, and which has high reliability; and to provide a power converter. <P>SOLUTION: A flat package is provided with an elastic body 105 and a metallic mesh sheet 107 between a first main electrode plate 106 and a first intermediate electrode 103. Thus, a highly reliable pressure contact package can be obtained wherein no gap exists between a semiconductor element and a main electrode plate to temperature change or a change in applied pressure when a pressure contact package is used, and a converter can also be obtained. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a pressure contact type semiconductor device, for example, a novel high heat resistant semiconductor device in which a plurality of semiconductor chips are connected in parallel and incorporated in one package, and a power converter using the same.

  Power electronics technology that controls the main circuit current by making full use of Si semiconductor electronics technology has been applied in a wide range of fields along with its performance improvement, and its application is being expanded. As power semiconductor devices, in addition to diodes and thyristors, MOS control devices such as MOS field effect transistors (hereinafter abbreviated as MOSFETs) that control main current by input signals to MOS structure gates, insulated gate bipolar transistors (hereinafter referred to as IGBTs) (Abbreviated) etc. are attracting attention. They are widely used as power switching devices in applications such as motor PWM control inverters.

  However, in recent years, high-performance devices that have reached the limits of Si devices have also been developed, and new semiconductor materials such as SiC, GaN, and diamond instead of Si have been used to further improve the performance of power devices. The study of the power device that had been started has begun.

  Among these, SiC is attracting attention as the most promising device, and research and development are being promoted. SiC has characteristics such as a large dielectric breakdown electric field compared to Si and a wide band gap, so that semiconductor operation at high temperatures is possible. Therefore, high breakdown voltage particularly suitable for high power control and high temperature It is expected that this system will be used in the system, that is, a system with a simplified cooling system will be realized.

  As shown in FIG. 9, in a conventional SiC semiconductor pressure contact type package 1000, a SiC semiconductor chip 104 is sandwiched between a first intermediate electrode 102 and a second intermediate electrode 103 between main electrodes 101 and 106. Implemented in the form. In addition to functioning as a conductor, the intermediate electrode functions as a heat buffer and a heat conductor. The intermediate electrode has poor processing accuracy and has a thickness variation of several micrometers to several tens of micrometers.

  Therefore, conventionally, the metal mesh sheet 201 is interposed between the intermediate electrode and the main electrode plate to absorb the thickness variation of the intermediate electrodes 102 and 103 and the semiconductor chip 104.

  Such a module structure is disclosed in JP-A-11-274185 and JP-A-11-297929. In this known example, there is disclosed a structure of a pressure contact type package in which a porous metal plate, a metal mesh, or an unevenly processed metal plate is disposed between a semiconductor element and a main electrode alone or in combination.

  In JP-A-10-98140, a plurality of semiconductor chips and a strain buffer plate are incorporated between electrode plates constituting a package, and a multiple elastic body is interposed between the strain buffer plate and one electrode plate, A technique for absorbing dimensional variations in the thickness direction of semiconductor chips, buffer plates, and the like is disclosed. As the multi-elastic body, an example in which a double structure of Cu pipe is pressed and flattened is illustrated.

JP-A-11-274185 (Claims, FIG. 1 etc.)

Japanese Patent Laid-Open No. 11-297929 (claims, FIG. 1 etc.) JP-A-10-98140 (Claims, FIG. 1 etc.)

  In the former publicly known example, by arranging a single metal mesh sheet or a combination of a plurality of metal mesh sheets between the semiconductor element and the main electrode plate, a uniform pressure contact state in a large area is ensured. This absorbs variations in the height of the contact surface (due to warpage, waviness, variation in member dimensions, etc.), and reduces thermal resistance and electrical resistance at the contact interface.

  The metal mesh sheet can absorb variations in the height of the contact surface by plastic deformation at the time of the first press-contact. However, a gap may be formed between the semiconductor element and the main electrode plate due to a change in temperature (thermal expansion change) or a change in pressure when the pressure contact type package is used, and some of the plurality of semiconductor elements have poor conduction. There is also a fear. In addition, when some of the plurality of semiconductor elements have poor conduction, the converter does not operate.

  In the latter known example, since the elastic body is interposed between the strain buffer plate and the electrode plate, in addition to absorbing the variation of the variable body chip and the strain buffer plate, the strain buffer plate and the semiconductor accompanying the temperature change in the package There is an advantage that it can cope with the thermal expansion change of the chip. However, since the elastic body has a multiple structure such as a double pipe, there are a plurality of points of the elastic body components, and there remain problems such as an increase in cost and difficulty in downsizing the apparatus.

  An object of the present invention is to maintain a uniform pressurized state in the area area of a pressure contact type package, and even if a temperature expansion change or a pressure change occurs in a member during use of the pressure contact type package, the semiconductor element and the main electrode An object of the present invention is to provide a highly reliable pressure contact type semiconductor device and a power converter in which no gap is generated between plates.

In order to achieve the above-described object, the present invention basically includes at least one semiconductor chip and a pair of intermediate electrodes sandwiching the semiconductor chip between a pair of main electrode plates that are components of a flat package. In a built-in semiconductor device or a converter using such a semiconductor device as a main power conversion element,
An elastic body and a metal mesh sheet were interposed between at least one of the main electrode plates and the intermediate electrode facing the main electrode plate.

  Alternatively, an elastic body is interposed between at least one of the main electrode plates and an intermediate electrode facing the main electrode plate, and a metal mesh sheet is provided between the at least one intermediate electrode and the electrode of the semiconductor chip facing the intermediate electrode. Intervened.

  Metal mesh sheets are plastic when pressed against each laminate, even if the thickness of each laminate (semiconductor chip, laminate of intermediate electrodes) varies due to variations in the thickness of the intermediate electrode and semiconductor chip of the flat package. By deforming, the uniform thickness of the entire flat package is assured, and as a result, variations in contact surfaces between members are absorbed. Further, the elastic body absorbs a change in temperature (change in temperature expansion) and a change in pressure when the pressure contact type package is used, thereby maintaining good conduction without generating a gap between the chip and the main electrode plate.

  In addition, when the metal mesh sheet is placed between the intermediate electrode and the semiconductor chip, it can absorb the warpage and undulation in each chip and obtain good conduction, as well as chip cracks and cracks during pressurization. Can be prevented.

  Here, the semiconductor chip has silicon, silicon carbide, diamond or gallium nitride as a main component.

  Preferably, the elastic body has a plate shape, for example, a spring washer. However, it is not limited to this, A leaf spring structure similar to it may be used.

  In addition, it is proposed that the elastic body and the metal mesh sheet be coated with platinum, chromium, nickel, gold or the like.

  According to the present invention, even if a uniform pressure state is maintained in the area area of the semiconductor package, and even if a temperature expansion change or a change in the pressure pressure occurs in the member during use of the package, the thermal expansion of the components inside the package It is possible to prevent poor conduction between components due to shrinkage by reversible deformation of the elastic body. As a result, a highly reliable pressure contact type package can be provided.

[Example 1]
FIG. 1 is a schematic sectional view of a pressure contact package 100 for explaining another embodiment of the present invention.

  A plurality of semiconductor chips 104 are juxtaposed between the first main electrode plate 101 and the second main electrode plate 106. Each semiconductor chip 104 is sandwiched between each pair of intermediate electrodes (first intermediate electrode 102 and second intermediate electrode 103) and is incorporated between main electrode plates 101 and 106.

  More specifically, between the first main electrode 101 and the second main electrode plate 106, first intermediate electrodes 102 (a), 102 (b), 102 (c) made of Mo, W or the like are used. And each semiconductor chip 104, second intermediate electrodes 103 (a), 103 (b), 103 (c) made of Mo, W or the like, and elastic bodies 105 (a), 105 (b), 105 (c ) And the metal mesh sheet 107 are stacked (contacted) in layers.

  As an example, for the metal mesh sheet 107, a foam metal sheet made of copper and having a thickness of 300 micrometers was used. Each elastic body 105 is preferably a plate-like elastic body.

    The elastic body 105 of the present embodiment is made of SUS and has a spring washer shape as shown in FIGS. That is, as shown in FIG. 3, the elastic body 105 has different end heights when viewed from the side, the elastic body 105 is crushed in the vertical direction, and the height increases or decreases according to the load in the vertical direction. It has a structure.

  The spring washer 105 is provided with a coating having excellent oxidation resistance, such as platinum, chromium, nickel, and gold. If such a coating is applied, the following effects can be expected. Since the operating temperature of the semiconductor module is as high as 200 to 500 ° C., when there is no coating, the washer is caused by moisture and oxygen contained in the atmospheric gas (mainly SF6: sulfur hexafluoride or nitrogen gas) in the module. Deteriorated. The deterioration of the washer has a problem that the spring property is lowered. In this embodiment, such a problem can be sufficiently dealt with. The thickness of the coating is several tens μm to several hundreds μm. The coating material is not limited to those exemplified above, and other materials may be employed as long as they can prevent deterioration in the package.

  In the present embodiment, the case where the thicknesses of the first intermediate electrodes 102 (a), 102 (b), and 102 (c) are different at the positions (a), (b), and (c) is shown.

According to the above configuration, (a) when uniform pressure is applied on the surfaces of the first and second main electrode plates 101 and 106, the thickness of the first intermediate electrode 102 is different. 107 is deformed according to the thickness of the first intermediate electrode 102. Thereby, as shown in FIG. 1, the first intermediate electrode 102 is embedded in the metal mesh sheet 107 in accordance with the degree of variation in thickness. Even if the thickness of the intermediate electrode 102 varies due to the deformation of the metal mesh sheet 107, the uniform thickness of the entire flat package and thus the pressurization state is guaranteed, and the contact between members such as the main electrode, the intermediate electrode, and the semiconductor chip is ensured. Absorbs surface variations. Therefore, all of the plurality of semiconductor chips 104 have a structure that can ensure electrical continuity.
(B) The elastic body 105 absorbs changes in temperature expansion between members and fluctuations in pressure when the pressure contact type package is used, and prevents a gap from being formed between the members. Thereby, good conduction can be obtained between the semiconductor chip and the main electrode plate. Moreover, the elastic body 105 can absorb the variation in thickness between members that cannot be absorbed by the metal mesh sheet.

  In the present embodiment, since the metal mesh sheet 107 and the elastic body 105 are used in combination as described above, the effects (a) and (b) can be expected. Such an effect cannot be expected sufficiently when only a metal mesh sheet is used as in the prior art or only by using an elastic body. That is, only the metal mesh sheet cannot absorb changes in temperature expansion between members during use as described above. On the other hand, with the elastic body alone, for example, when a uniform pressure is applied between the main electrodes, the amount of displacement of each elastic body becomes equal. For example, as shown in FIG. 1 (a), (b), (c) When there is a variation in the respective laminated bodies (intermediate electrode, laminated body of semiconductor chips) at the position, the variation may still remain. Therefore, nonuniformity may occur in the thickness of the entire flat package and the contact pressure between members.

  FIG. 4 shows the result of comparison in the temperature cycle test between the case where the elastic body 105 and the metal mesh sheet are present and the same structure as that of the conventionally known example shown in FIG. A SiC diode was used as the semiconductor chip, and a positive potential was applied between the first main electrode plate 101 and the second main electrode plate 106. Nine semiconductor chips were mounted. The module 100 was placed in an electric furnace and repeatedly raised and lowered. The maximum module temperature is 300 ° C., the minimum temperature is 100 ° C., each module is left for 2 hours, and the temperature is raised and lowered 50 times. At the origin of the time axis, the electrical resistance of the module with the elastic body is higher by 0.1 milliohm than the electrical resistance of the module without the elastic body, indicating an increase in the series resistance component due to the insertion of the elastic body 105.

  As a result of the temperature increasing / decreasing cycle test, the electrical resistance of the module increased from 13.3 milliohms to 15.0 milliohms during the cooling process after the third temperature elevation in the absence of the elastic body 105, that is, in the case of the conventional structure. In the cooling step after the fourth temperature increase, the electrical resistance increased from 15.0 milliohms to 17.1 milliohm, and further in the cooling step after the sixth temperature increase, from 17.1 milliohms to 24.0 milliohms.

  These phenomena are caused by the fact that each component inside the module thermally expands when the module temperature rises and the displacement amount of the metal mesh sheet 107 increases, and then when each component contracts when the module cools, the first main electrode plate 101 and intermediate electrode 102, between intermediate electrode 102 and semiconductor chip 104, between semiconductor chip 104 and intermediate electrode 103, between intermediate electrode 103 and metal mesh sheet 107, or at a plurality of locations. It can be interpreted that electrical continuity is lost.

  In this test, since the test was performed with a 9-chip module, as shown in FIG. 5, the series electrical resistance value for one chip was 120 milliohms, and during the cooling process after the third temperature increase, for one chip, the fourth time From the analysis of the equivalent circuit model in which the resistance components of 9 chips are connected in parallel, it is that the conduction of 1 chip is lost during the cooling process after the temperature rise of 2 and 2 chips are lost during the cooling process after the 6th temperature rise. I understood.

  On the other hand, in the module 100 using the elastic body 105, as shown in FIG. 4, a decrease in module resistance due to increase / decrease in module temperature was not observed. In this example, 50 heating / cooling cycles were repeated, but the electrical resistance of the module remained at 13.4 milliohms until the end. This is because, even when the dimensions of the internal components increase or decrease due to the temperature rise and fall of the module, the electrical continuity can be secured without causing a gap between the components due to the reversible plastic deformation of the elastic body 105. it is conceivable that.

  As described above, the elastic body 105 can ensure electrical continuity in all of the plurality of semiconductor chips 104 even if the thickness of the intermediate electrode 102 varies, and all of the semiconductor chips 104 can be changed even if the module temperature fluctuates. Thus, it was found that a highly reliable pressure contact type package 100 that can ensure electrical continuity can be obtained.

In this embodiment, the case where the thickness of the intermediate electrode 102 varies is shown, but it is obvious that the same effect can be obtained even if the thickness of the intermediate electrode 103 and the semiconductor chip 104 varies. In this embodiment, a diode chip made of silicon carbide is used as the semiconductor chip 104. However, a semiconductor chip mainly composed of silicon or gallium nitride may be used.
[Example 2]
FIG. 6 shows an embodiment in the case where the semiconductor element 104 has a large warp or undulation. In the present embodiment, metal mesh sheets 107 (a) and 107 (b) are interposed between the first intermediate electrode 102 and the semiconductor chip 104 and between the semiconductor chip 104 and the second intermediate electrode 103.

  If the semiconductor chip 104 has a large warp or undulation, if the semiconductor chip is directly sandwiched and pressed between the intermediate electrodes 102 and 103 made of Mo, W, etc., the semiconductor chip 104 cracks due to local stress concentration due to partial load. Although there was a risk of cracks occurring, by interposing the metal mesh sheets 107 (a) and 107 (b) between the intermediate electrode 102 and the semiconductor chip 104 and between the semiconductor chip 104 and the intermediate electrode 103, Those problems can be prevented. That is, warpage or undulation of the semiconductor chip 104 is absorbed by deformation of the metal mesh sheets 107 (a) and 107 (b) when the laminated member is pressed, and the semiconductor chip 104 can be evenly pressed, and the semiconductor chip is cracked. And cracks can be prevented.

If the semiconductor chip 104 is sunk into the metal mesh sheets 107 (a) and 107 (b) during the pressure contact, the semiconductor chip 104 is sunk into the metal mesh sheet. It is desirable that the size of the metal mesh sheets 107 (a) and 107 (b) is the same as or smaller than the size of the semiconductor chip 104.
Example 3
In the pressure contact type package of the present invention, a stable contact state between the electrodes can be obtained even when the number of semiconductor chips to be mounted is increased and the size is increased, that is, the capacity is increased, so that a semiconductor device having a small electric resistance can be obtained. Therefore, by using this pressure-contact type semiconductor device, it is possible to realize a large-capacity converter that greatly reduces the volume and cost of the converter.

  FIG. 7 shows a configuration circuit diagram of one bridge when the IGBT pressure contact type package according to the present invention is applied to a power converter as a main conversion element. An IGBT element 801 and a diode element 802 serving as main conversion elements are arranged in antiparallel, and n of them are connected in series. These IGBT and diode indicate a pressure contact type semiconductor device in which a large number of semiconductor chips according to the present invention are mounted in parallel. In the case of a reverse conduction type IGBT pressure contact type package, the IGBT chip and the diode chip in the figure are collectively contained in one package. This is provided with a snubber circuit 803 and a current limiting circuit.

  FIG. 8 shows the configuration of a self-excited converter in which the three-phase bridge of FIG. 7 is multiplexed four times. The press-contact type package of the present invention is mounted in a form called a stack structure in which a plurality of units are in series contact with the outside of the main electrode plate so as to sandwich the water-cooled electrode, and the entire stack is pressurized together.

  The pressure contact type semiconductor device of the present invention is not limited to the above example, and is particularly suitable for self-excited large capacity converters used in electric power systems and large capacity converters used as converters for mills. It can also be used for transformers such as substation equipment, substation equipment for electric railways, redox flow battery systems, sodium sulfur (NaS) battery systems, and vehicles.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. The perspective view which shows an example of the elastic body used for the said Example. The perspective view which changed the view of the said elastic body. The figure for demonstrating the measurement result of the electrical resistance of the module in a temperature cycle test in the module in which an elastic body exists, and the module which does not exist. An equivalent circuit model of the module for analyzing the resistance component of the module. BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIG. 5 is a configuration circuit diagram for one bridge when a pressure contact package is applied to a power converter as a main conversion element. The block diagram of the self-excited converter which multiplexed four 3 phase bridges. The cross-sectional schematic of the semiconductor module for demonstrating the mounting form of the conventional SiC semiconductor power device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Pressure-contact type package, 101 ... 1st main electrode plate, 102 ... 1st intermediate electrode, 103 ... 2nd intermediate electrode, 104 ... Semiconductor chip, 105 ... Elastic body, 106 ... 2nd main electrode plate, 107 ... Metal mesh sheet, 801 ... IGBT element, 802 ... Diode element, 803 ... Snubber circuit, 1000 ... Pressure contact type package

Claims (11)

In a semiconductor device in which at least one semiconductor chip and a pair of intermediate electrodes sandwiching the semiconductor chip are incorporated between a pair of main electrode plates that are components of a flat package,
A pressure-contact type semiconductor device, wherein an elastic body and a metal mesh sheet are interposed between at least one of the main electrode plates and an intermediate electrode facing the main electrode plate. In a semiconductor device in which at least one semiconductor chip and a pair of intermediate electrodes sandwiching the semiconductor chip are incorporated between a pair of main electrode plates that are components of a flat package,
An elastic body is interposed between at least one of the main electrode plates and an intermediate electrode facing the main electrode plate, and a metal mesh sheet is interposed between at least one intermediate electrode and the electrode of the semiconductor chip facing the intermediate electrode. A pressure contact type semiconductor device characterized by that.   3. The press contact type semiconductor device according to claim 1, wherein the elastic body is a plate-like elastic body. 4. The press contact type semiconductor device according to claim 1, wherein the elastic body has a spring structure.   5. The press contact type semiconductor device according to claim 1, wherein the elastic body is formed of a spring washer. 6. The pressure-contact type semiconductor device according to claim 1, wherein the metal mesh sheet is made of a porous metal plate, a metal mesh, or a metal plate that is uneven.   7. The press contact type semiconductor according to claim 1, wherein the shape and size of the metal mesh sheet are processed in accordance with the arrangement shape and size of the semiconductor chip in the flat package. apparatus.   8. The pressure contact type semiconductor device according to claim 1, wherein the elastic body is coated with a coating capable of preventing deterioration of the elastic body, such as platinum, chromium, nickel, and gold.   9. The pressure contact type semiconductor device according to claim 1, wherein the metal mesh sheet is coated with a coating capable of preventing deterioration of the metal mesh sheet such as platinum, chromium, nickel, and gold.   10. The pressure contact type semiconductor device according to claim 1, wherein the semiconductor chip contains silicon, silicon carbide, diamond, or gallium nitride as a main component. 11. A power converter, wherein the pressure contact type semiconductor device according to claim 1 is used as a main conversion element.

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