JP2005204802A - Manufacturing method of capsule type medical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a capsule type endoscope for which a solid-state image pickup element can be mounted on a small-sized substrate in high density together with other chip components without obstructing the image quality of the solid-state image pickup element. <P>SOLUTION: The manufacturing method includes a process of mounting the chip component 34 to an image pickup substrate 30 stored inside a tightly sealing container to be introduced into a celom and a process of mounting the solid-state image pickup element 31 to the image pickup substrate 30 on which the chip component 34 is mounted. As a result, the solid-state image pickup element 31 is mounted on the image pickup substrate 30 together with the other chip component 34 in the high density without obstructing the image quality of the solid-state image pickup element 31. Further, since the solid-state image pickup element 31 is mounted after the chip component 34 is mounted, dust caused by mounting the chip component 34 is prevented from sticking to the solid-state image pickup element 31. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a capsule medical device that is introduced into a subject and collects information in the subject, and more particularly to a method for manufacturing a capsule endoscope.

  Conventionally, as a capsule medical device, a capsule-type endoscope that can be introduced into a body cavity from the mouth to a patient as a subject and can collect information in the living body cavity by photographing the digestive tract such as the stomach A mirror is known. This capsule endoscope includes an imaging system including an illumination source, an image sensor (solid-state imaging device) and an optical system, and an optical window as a device that performs in-vivo imaging. The illumination source illuminates each part of the body through the optical window. Image sensors and optical systems acquire images from various parts of the body through optical windows. The device further includes a transmitter and antenna for transmitting image signals from the image sensor, and a battery that provides power to the electrical elements of the device. This device is accommodated in a capsule-like container (see, for example, Patent Document 1).

WO 02/102224 pamphlet

  The above-described capsule endoscope has the device housed in a small container that is easy to swallow for introduction into the body cavity from the mouth. That is, it is required to downsize the circuit board of the apparatus accommodated in the container and to mount a plurality of chip components on the circuit board at high density. However, when mounting chip components at a high density on a miniaturized circuit board, it is necessary to consider the heat resistance of each chip component. In particular, the image sensor has a color filter made of an organic film. If the color filter changes color due to heat during mounting, a desired image cannot be obtained.

  The present invention has been made in view of the above, and is a capsule-type endoscope capable of mounting a solid-state image pickup device together with other chip components on a small substrate at high density without causing an obstacle to the image quality of the solid-state image pickup device. It aims at providing the manufacturing method of a mirror.

  In order to solve the above-described problems and achieve the object, a capsule medical device manufacturing method according to claim 1 of the present invention is a capsule type that is introduced into a subject and executes a predetermined function set in advance. In the method for manufacturing a medical device, a step of mounting a chip component on a substrate housed in a sealed container formed in a capsule shape for introduction into the subject, and obtaining a subject image in the subject And a step of mounting the solid-state imaging device on the substrate on which the chip component is mounted.

  The method for manufacturing a capsule medical device according to claim 2 of the present invention is the method of manufacturing the capsule medical device according to claim 1, wherein in the step of mounting the chip component, the substrate on which the solid-state imaging device is mounted and another substrate are connected by a flexible substrate. The method further includes a step of collectively mounting the chip components on the substrate in the form described above.

  The method for manufacturing a capsule medical device according to claim 3 of the present invention further includes the step of mounting the chip component on both sides of the substrate in the step of mounting the chip component according to claim 1 or 2. It is characterized by that.

  According to a fourth aspect of the present invention, there is provided a capsule medical device manufacturing method according to any one of the first to third aspects, wherein a substrate on which the solid-state imaging device is mounted and another substrate are connected by a flexible substrate. Then, after the step of mounting the solid-state image sensor, the method further includes a step of mounting a switch unit for supplying power to the solid-state image sensor on the other substrate.

  According to a fifth aspect of the present invention, there is provided a capsule medical device manufacturing method according to any one of the first to third aspects, wherein a substrate on which the solid-state imaging device is mounted and another substrate are connected by a flexible substrate. Then, after the step of mounting the solid-state imaging device, the method further includes a step of connecting a transmission unit that transmits a subject image of the solid-state imaging device to the flexible substrate.

  The method for manufacturing a capsule medical device according to the present invention includes a step of mounting a chip component on a substrate and then mounting a solid-state imaging device on the substrate. For this reason, the heat at the time of mounting chip components does not affect the solid-state imaging device. As a result, the solid-state image sensor can be mounted on the substrate together with other chip components at a high density without affecting the image quality of the solid-state image sensor. Furthermore, since the solid-state image sensor is mounted after the chip component is mounted, it is possible to prevent dust from being attached to the solid-state image sensor when the chip component is mounted.

  In the method of manufacturing a capsule medical device according to the present invention, in the step of mounting the chip component, the chip component is assembled to the substrate in a form in which the substrate on which the solid-state imaging device is mounted and another substrate are connected by a flexible substrate. And further including a mounting process. As a result, the chip component can be mounted at a suitable temperature, and the solid-state image sensor can be mounted at a suitable temperature.

  In the method of manufacturing a capsule medical device according to the present invention, in the step of mounting the chip component, both sides of the substrate on which the solid-state image sensor is mounted, or the substrate on which the solid-state image sensor is mounted and another substrate are connected by a flexible substrate. The method further includes the step of mounting the chip components on both sides of the substrate. As a result, the efficiency of the manufacturing process can be increased without reworking the same type of process on both sides of the substrate.

  In the method for manufacturing a capsule medical device according to the present invention, in the form in which the substrate on which the solid-state imaging device is mounted and another substrate are connected by a flexible substrate, the switch unit is connected to the other substrate after the step of mounting the solid-state imaging device. The method further includes a step of implementing the above. As a result, since the substrate on which the solid-state image sensor is mounted and the substrate on which the switch unit is mounted are provided at a distance via the flexible substrate, heat generated when the switch unit is mounted affects the solid-state image sensor. There is no.

  In the method for manufacturing a capsule medical device according to the present invention, in a form in which a substrate on which a solid-state imaging device is mounted and another substrate are connected by a flexible substrate, the transmitter is attached to the flexible substrate after the step of mounting the solid-state imaging device. The method further includes a step of connecting to each other. As a result, since the substrate on which the solid-state imaging device is mounted and the flexible substrate that connects the transmission unit are spaced apart by the flexible substrate, heat generated when connecting the transmission unit affects the solid-state imaging device. There is no. Furthermore, the heat generated when mounting the chip component and the solid-state imaging device does not affect the setting related to transmission of the transmission unit.

  Exemplary embodiments of a method for manufacturing a capsule endoscope that is a capsule medical device according to the present invention will be described below in detail with reference to the accompanying drawings. Note that the present invention is not limited to the embodiments.

  FIG. 1 is a side sectional view showing a configuration of a capsule endoscope that is a capsule medical device according to the present invention, FIG. 2 is a sectional view of an illumination board viewed from the front, and FIG. 3 is a section of the illumination board viewed from the rear. 4 is a cross-sectional view of the imaging board as viewed from the front, FIG. 5 is a cross-sectional view of the imaging board as viewed from the rear, FIG. 6 is a cross-sectional view of the switch board as viewed from the front, and FIG. FIG. 8 is a cross-sectional view of the antenna substrate as seen from the rear, FIG. 9 is a side view showing the manufacturing process of the capsule endoscope that is a capsule medical device according to the present invention, and FIG. 10 is related to the present invention. FIG. 11 is a side view showing a manufacturing process of a capsule endoscope as a capsule medical apparatus according to the present invention, and FIG. 12 is a side view showing a manufacturing process of the capsule endoscope as a capsule medical apparatus according to the present invention. A manufacturing process of a capsule endoscope which is a capsule medical device according to the present invention is shown. FIG. 13 is a side view showing a manufacturing process of a capsule endoscope that is a capsule medical device according to the present invention, and FIG. 14 is a manufacturing process of a capsule endoscope that is a capsule medical device according to the present invention. FIG. 15 is a side view showing a manufacturing process of a capsule endoscope that is a capsule medical device according to the present invention, and FIG. 16 is a diagram of the capsule endoscope that is a capsule medical device according to the present invention. FIG. 17 is a side view showing a manufacturing process of a capsule endoscope that is a capsule medical device according to the present invention, and FIG. 18 is a capsule internal view that is a capsule medical device according to the present invention. 19 is a side view showing the manufacturing process of the mirror, FIG. 19 is a side view showing the manufacturing process of the capsule endoscope as the capsule medical apparatus according to the present invention, and FIG. 20 is inside the capsule mold as the capsule medical apparatus of the present invention. Medical system using endoscope It is a schematic diagram systems out.

  First, the configuration of the capsule endoscope will be described with reference to FIGS. As shown in FIG. 1, the capsule endoscope 1 includes an internal configuration body mainly including an illumination section 2, an imaging section 3, a drive section 4, a power supply section 5, and a transmission section 6, and the internal configuration. It has the airtight container 7 which accommodates a body.

  As shown in FIG. 1, the illuminating unit 2 includes illuminating means 21 that is a chip component made of a light emitter such as a light emitting diode (for example, a white LED). As shown in FIG. 2, the illumination means 21 is provided on the front surface of the illumination board 20 formed in a disk shape. The illumination board 20 is provided with a through hole 20a at the center thereof. The illumination means 21 has a total of four through-holes 20a on the front surface of the illumination board 20 one above the other in the center. The illuminating means 21 irradiates illumination light on the front side of the illumination substrate 20. Further, as shown in FIG. 3, a chip component 22 constituting a circuit for driving the illumination means 21 is provided on the rear surface of the illumination board 20. By illuminating means 21 and chip parts 22 for driving the illuminating means 21 being integrated on the front and rear surfaces of the illuminating board 20, the illuminating board 20 can be reduced in size and the illuminating unit 2 can be operated stably. Is possible. In addition, the illumination means 21 is not limited to the said light emitting diode, For example, an EL element etc. can be used. Also, the number is not limited to four.

  As shown in FIG. 1, the imaging unit 3 includes a solid-state imaging device 31 such as a CCD, and an imaging lens 32 as an imaging optical system that forms an image of a subject on the solid-state imaging device 31. As shown in FIG. 4, the solid-state imaging device 31 is provided on the front surface of the imaging substrate 30 formed in a disk shape. The imaging lens 32 is provided on the front side of the solid-state image sensor 31. As a result, the solid-state imaging element 31 captures an optical image formed on the light receiving surface via the imaging lens 32.

  As shown in FIG. 1, the imaging lens 32 includes a pair of lenses 32 a and 32 b arranged together on the optical axis of the solid-state imaging device 31. The lenses 32a and 32b are held by a cylindrical lens frame 33a in a form in which the optical axes of the lenses 32a and 32b coincide with each other. In this way, the lens unit is configured by holding the lenses 32a and 32b on the lens frame 33a.

  On the other hand, a cylindrical holding frame 33 b is provided on the front surface side of the solid-state imaging element 31. The holding frame 33b is positioned and fixed with respect to the optical axis of the solid-state imaging device 31 (the center of the light receiving surface: not shown). The lens frame 33a of the lens unit is housed and held movably in the direction along the optical axis with respect to the holding frame 33b. That is, the lens frame 33a and the holding frame 33b constitute a focus adjustment mechanism 33 that moves the imaging lens 32 along the optical axis. The focus adjustment mechanism 33 can absorb manufacturing variations of the lens frame 33a and the imaging lens 32, and can set a desired resolving power, depth, and viewing angle. The lens frame 33 a is inserted into the through hole 20 a of the illumination board 20, and the optical axis of the imaging lens 32 is directed to the front surface of the illumination board 20. Thereby, the imaging part 3 can image the range illuminated with the illumination light of the illumination part 2. FIG.

  Furthermore, the optical axis of the imaging unit 3 and the illumination substrate 20 are substantially orthogonal to ensure the light distribution in the observation image associated with the illumination light irradiation by the illumination unit 21, and includes the illumination unit 2 and the imaging unit 3. It is possible to reduce the size. Further, as shown in FIGS. 4 and 5, chip parts 34 constituting a circuit for driving the solid-state image sensor 31 are provided on the front and rear surfaces of the image-capture substrate 30 so as to surround the solid-state image sensor 31. . Note that the solid-state imaging device 31 is not limited to the CCD, and for example, a CMOS or the like can be used.

  The drive unit 4 has a DSP 41 (digital signal processor). As shown in FIG. 5, the DSP 41 is provided on the rear surface of the imaging substrate 30 so as to be surrounded by the chip component 34. The DSP 41 serves as the center of drive control of the capsule endoscope 1 in the present embodiment, and performs drive control of the solid-state image sensor 31, output signal processing of the solid-state image sensor 31, and drive control of the illumination unit 21.

  The chip component 34 on the rear surface of the imaging substrate 30 includes a semiconductor component. This semiconductor component has a function of mixing two signals of a video signal and a clock signal output from the DSP 41 into one signal.

  As shown in FIG. 1, the power supply unit 5 includes a battery 51, a switch unit 52, and a power supply unit 53. The battery 51 is a button-type silver oxide battery or the like having a circular outer shape, and a plurality (three in the present embodiment) are arranged in series and the negative electrode side is arranged rearward. The battery 51 is not limited to a silver oxide battery, and for example, a rechargeable battery, a power generation battery, or the like may be used.

  As shown in FIG. 1, the switch unit 52 has a reed switch 52a and a bias magnet 52b. As shown in FIG. 6, the reed switch 52a and the bias magnet 52b are provided on the front surface of the switch substrate 50A formed in a disk shape. As shown in FIG. 1, the reed switch 52a is inserted into a notch hole 50Aa provided in the switch board 50A and fixed with an adhesive, thereby suppressing the protrusion height of the switch board 50A toward the front surface, and the switch portion 52a. Is miniaturized. This reed switch 52a is a normally OFF type, and is always in an ON state in combination with the bias magnet 52b. Then, the main power supply of the capsule endoscope 1 is turned on by the ON state of the reed switch 52a.

  Further, the switch unit 52 is provided with the longitudinal direction of the bias magnet 52b (direction between the magnetic poles) and the direction of the reed relay built in the reed switch 52a. As a result, the magnetic force of the bias magnet 52b for constantly operating the reed switch 52a in the ON state is stabilized. Further, the switch unit 52 is configured such that the longitudinal direction of the bias magnet 52b (direction between the magnetic poles) and the direction of the reed relay built in the reed switch 52a are parallel to each other. This stabilizes the operation of the reed switch 52a. In addition, the switch unit 52 employs a normally OFF type reed switch 52a, thereby reducing the overall size.

  As shown in FIG. 6, a chip component 54 is provided on the front surface of the switch substrate 50A. The chip component 54 includes a memory such as an EEPROM and a vibrator. The memory stores, for example, an initial value of the DSP 41, color variations and white balance of the solid-state image sensor 31, and a unique number of the capsule endoscope 1. As a result, higher functionality can be achieved. The vibrator gives a basic clock to the DSP 41. As shown in FIG. 1, a contact point 55 formed of a leaf spring is provided on the rear surface of the switch substrate 50A. The contact 55 is in contact with the positive electrode of the battery 51.

  The power supply unit 53 includes a DCDC converter 53a. As shown in FIG. 7, the DCDC converter 53a is provided on the rear surface of the power supply substrate 50B formed in a disk shape. The DCDC converter 53a controls the voltage obtained from the battery 51 in order to always obtain a certain voltage necessary for the system. Although not shown in the figure, a contact point that contacts the negative electrode of the battery 51 is provided on the front surface of the power supply substrate 50B. As described above, the power supply unit 5 supplies the power by placing the batteries 51 connected in series between the switch board 50A and the power board 50B.

  The transmission unit 6 includes an oscillation circuit 61 and an antenna 62. As shown in FIGS. 1 and 8, the oscillation circuit 61 is provided on the rear surface of the transmission board 60A formed in a disk shape. Further, as shown in FIG. 8, the antenna 62 is provided in a substantially spiral pattern on the rear surface of the antenna substrate 60B formed in a disk shape. The transmitting unit 6 extracts a signal having a certain frequency, amplitude, and waveform from the signal mixed by the semiconductor component described above by the oscillation circuit 61 and transmits the extracted signal to the outside by the antenna 62. The transmission board 60A and the antenna board 60B are electrically connected by solder to form an integral transmission unit.

  The illumination board 20, the imaging board 30, the switch board 50A, and the power board 50B are rigid boards. As shown in FIG. 1, each rigid substrate is provided in such a manner as to sandwich a series of flexible substrates 80. Accordingly, the rigid substrates are provided at predetermined intervals in the order of the illumination substrate 20, the imaging substrate 30, the switch substrate 50A, and the power supply substrate 50B via the flexible substrate 80, and are electrically connected to each other. And each board | substrate 20,30,50A, 50B provided with each components is laminated | stacked on the front-back direction in the aspect shown in FIG. As shown in FIGS. 2 to 7, a flat portion 90 is formed at the edge of each of the substrates 20, 30, 50 </ b> A, 50 </ b> B from which the flexible substrate 80 extends, and the flexible substrate 80 is bent when the flexible substrate 80 is bent. The deformation of the substrate 80 is suppressed. Thus, each board | substrate 20, 30, 50A, 50B and the flexible board | substrate 80 comprise the rigid flexible board | substrate integrally and electrically connected. As shown in FIGS. 1 and 8, the flexible board 80 extending from the lower edge of the power supply board 50B is electrically connected to the transmission board 60A constituting the transmission unit by soldering.

  The sealed container 7 accommodates the above-described internal structure, and is formed by joining a tip cover 71 and a case 72 as an exterior member as shown in FIG. The distal end cover 71 is disposed on the front side of the capsule endoscope 1 and covers the front side of the illumination board 20. The tip cover 71 has a substantially hemispherical dome shape, and the rear side is opened in a circular shape. The tip cover 71 forms a transparent or translucent transparent part, transmits the illumination light of the illumination unit 2 to the outside of the sealed container 7, and transmits an image illuminated with the illumination light to the inside of the sealed container 7. To penetrate. The tip cover 71 is made of cycloolefin polymer, polycarbonate, acrylic, polysulfone or urethane, and cycloolefin polymer or polycarbonate is particularly preferable for ensuring optical performance and strength.

  The case 72 is a part that covers the internal structure on the rear side of the tip cover 71. The case 72 is formed by integrating a cylindrical body and a rear end portion having a substantially hemispherical dome shape, and the front side of the body is opened in a circular shape. The case 72 accommodates the illumination board 20 of the illumination unit 2, the imaging board 30 of the imaging unit 3, the switch board 50A and the power board 50B of the power supply unit 5, and the battery 51 in the body part, and the transmission unit. The six transmission boards 60A and the antenna board 60B are accommodated in the rear end portion of the dome shape. The case 72 is made of cycloolefin polymer, polycarbonate, acrylic, polysulfone or urethane, and polysulfone is particularly preferable for ensuring strength.

  As shown in FIG. 1, the tip cover 71 that covers the front side of the lighting substrate 20 and the case 72 that covers the internal structure are joined to each other with an adhesive in a manner that ensures watertightness inside the sealed container 7. It is. In accommodating the internal components inside the sealed container 7, the gaps between the illumination board 20, the imaging board 30 and the switch board 50A, and the gaps between the power board 50B, the transmission board 60A and the antenna board 60B are as follows: A sealing resin 73 for sealing the gap and the like is filled. Further, the gap between the outer periphery of the internal structure excluding the antenna substrate 60 </ b> B and the inner surface of the sealed container 7 is sealed by filling with a sealing resin 73.

  Hereinafter, the manufacturing process of the capsule endoscope 1 described above will be described with reference to FIGS.

  First, a rigid flexible substrate is formed as shown in FIG. The rigid flexible substrate is electrically connected through the flexible substrate 80 in the order of the illumination substrate 20, the imaging substrate 30, the switch substrate 50 </ b> A, and the power supply substrate 50 </ b> B made of a rigid substrate. Further, a flexible substrate 80 is further extended on the side opposite to the switch substrate 50A in the power supply substrate 50B. In this rigid flexible substrate, a flexible substrate 80 formed in a longitudinal shape is sandwiched between the rigid substrates, and the flexible substrate and the rigid substrate are electrically connected to each other. The illumination board 20 is provided with a through hole 20a, and the switch board 50A is provided with a notch hole 50Aa. In the present embodiment, the rigid flexible substrate is held in a holding frame (not shown) formed in a frame shape so as to surround the outer periphery of each substrate 20, 30, 50A, 50B. Then proceed to the following steps. The holding frame has a configuration in which a plurality of the rigid flexible substrates are juxtaposed and held, and the following steps are performed on the plurality of rigid flexible substrates.

  Next, as shown in FIG. 10, individual chip components 21, 22, 34, 54, and 53a such as resistors, capacitors, and transistors are mounted on the respective substrates 20, 30, 50A, and 50B. In the present embodiment, the chip components 21, 22, 34, 54, 53a are placed at the positions of the paste-like solder printed on the substrates 20, 30, 50A, 50B in advance, and the substrates 20, 30, 50A, It is mounted by reflow which melts the solder by directly applying heat to 50B. These chip components 21, 22, 34, 54, and 53a are mounted together on the front and rear surfaces (upper and lower surfaces in FIG. 10) of each of the substrates 20, 30, 50A, and 50B.

  Next, as shown in FIG. 11, the DSP 41 and the above-described semiconductor component (chip component) 54 having a mixing function are mounted on the substrates 30 and 50A. In the present embodiment, the DSP 41 and the semiconductor component 54 are configured as flip chip components, and are mounted by flip chip bonding in which solder between the contact points and the wiring electrodes of the substrates 30 and 50A is melted by heat.

  Next, as shown in FIG. 12, the solid-state imaging device 31 is mounted on the imaging substrate 30. In the present embodiment, the solid-state imaging device 31 is configured as a ball grid array chip component, and is mounted by a ball grid array that melts the solder balls between the contact points and the wiring electrodes of the imaging substrate 30 with heat. . At this time, since only heat of about 230 ° C., which is lower than the mounting of the chip parts 21, 22, 34, 54, 53a, the DSP 41 and the semiconductor part 54, is applied for 10 seconds, the color filter made of the organic film of the solid-state image pickup device 31. There is no discoloration. The solid-state imaging device 31 is the last electrical component mounted on the imaging substrate 30 that is a predetermined substrate.

  In the present embodiment, a frame transfer type solid-state imaging device 31 (CCD) is employed. The solid-state imaging device 31 itself is a light receiving unit. For this reason, it is possible to increase the number of pixels with a high aperture ratio (approximately 100%), high sensitivity, and low processing accuracy compared to other CCDs (for example, interline type).

  In the imaging substrate 30, the DSP 41 is provided on the opposite surface where the solid-state imaging element 31 is provided, and chip components that constitute the drive circuit for the solid-state imaging element 31 are provided on both sides. These are connected by a hole (through hole) formed in the substrate, or a hole (via hole) formed between necessary layers of the layered substrate. As a result, the imaging substrate 30 is reduced in size.

  Next, as shown in FIG. 13, the reed switch 52a is mounted on the switch board 50A. The reed switch 52a is inserted into the cutout hole 50Aa and individually mounted by soldering. Thereafter, as shown in FIG. 13, the transmission board 60A of the transmitter 6 assembled separately in advance is individually connected to the flexible board 80 extending from the power supply board 50B by soldering.

  Next, as shown in FIG. 14, the bias magnet 52b is fixed to the switch substrate 50A. The bias magnet 52b is fixed with an adhesive that does not generate heat. The bias magnet 52b turns on the normally OFF type reed switch 52a by the magnetic field. In addition, after fixing the bias magnet 52b, operation check about the illumination part 2, the imaging part 3, the power supply part 5, and the transmission part 6 is performed. Although not shown in the figure, the operation confirmation is easily performed using a test pad provided on the imaging substrate 30.

  Next, the holding frame 33b is attached to the solid-state imaging device 31 as shown in FIG. Next, as shown in FIG. 16, the lens frame 33a is built in the holding frame 33b. Then, focus adjustment is performed by the focus adjustment mechanism 33 including the lens frame 33a and the holding frame 33b, and the lens frame 33a is fixed to the holding frame 33b. The holding frame 33b and the lens frame 33a are fixed with an adhesive that does not generate heat.

  Next, each board | substrate 20, 30, 50A, 50B is removed from the above-mentioned holding frame (not shown), the flexible board | substrate 80 is bent, and each board | substrate 20, 30, 50A, 50B, 60A, 60B is made into a lamination | stacking state. . At this time, the lens frame 33a provided on the imaging substrate 30 side is inserted into the through hole 20a of the illumination substrate 20 to fix the illumination substrate 20 to the lens frame 33a and the holding frame 33b. Further, the battery 51 is disposed between the switch board 50A and the power supply board 50B with the negative electrode side facing the power supply board 50B. Each electrode of the battery 51 contacts a contact 55 provided on the rear surface of the switch substrate 50A and the front surface of the power supply substrate 50B. Then, the heat shrink band 56 is wound around the switch board 50A and the power supply board 50B with the battery 51 interposed. The heat contraction band 56 contracts by heating to bundle a plurality of batteries 51, and maintains electrical contact between the batteries 51 and contact between the electrodes and the contacts 55. This heating is a temperature that does not affect the solid-state imaging device 31. When the battery 51 is disposed, power is supplied by the battery 51. Therefore, a magnetic field that invalidates the magnetic field of the bias magnet 52b acting on the reed switch 52a is brought close to the reed switch 52a to Prevent consumption. Thereafter, the outer diameters between the substrates 20, 30, 50A, 50B, 60A, 60B are adjusted, and the imaging substrate 30 and the switch substrate 50A are bonded, and the power supply substrate 50B and the transmission substrate 60A are bonded. Thereby, an internal structure is completed.

  Next, the tip cover 71 is fixed to the front surface of the illumination board 20 as shown in FIG.

  Finally, as shown in FIG. 19, a sealing resin 73 is attached around the internal structure excluding the antenna substrate 60B, the rear end of the internal structure is inserted into the case 72, and the tip cover 71 and the case 72 are joined together. Thereby, the capsule endoscope 1 is completed.

  Here, an example of a medical system using the above-described capsule endoscope 1 will be described. As shown in FIG. 20, the capsule endoscope 1 is portable in a state of being housed in the package 100. Although not explicitly shown in the figure, the package 100 is provided with a permanent magnet. The permanent magnet is arranged with a polarity opposite to that of the bias magnet 52b of the switch unit 52, and invalidates the magnetic field of the bias magnet 52b. For this reason, the reed switch 52a of the switch unit 52 is turned off, and the main power supply of the capsule endoscope 1 is turned off.

  The medical system using the capsule endoscope 1 includes a capsule endoscope 1 housed in the package 100, a jacket 102 to be worn by a patient, that is, an examinee 101, a receiver 103 detachably attached to the jacket 102, and The computer 104 is configured.

  The jacket 102 is a shield jacket made of electromagnetic shielding fibers. The jacket 102 is provided with antennas 102a to 102d for capturing radio waves transmitted from the antenna 62 of the capsule endoscope 1, and the capsule endoscope 1 and the receiver are connected via the antennas 102a to 102d. Communication with 103 is possible. Note that the number of antennas 102a to 102d is not limited to four as shown in FIG. By selecting the antenna having the maximum reception intensity among the plurality of antennas 102a to 102d, it is possible to satisfactorily receive radio waves according to the position associated with the movement of the capsule endoscope 1. Further, the position of the capsule endoscope 1 in the body cavity can also be detected by the reception intensity of each of the antennas 102a to 102d.

  The receiver 103 performs white balance processing on captured image data that is sequentially received, and stores the image data that has undergone white balance processing in, for example, a compact flash (R) memory card (CF memory card) 105. The reception by the receiver 103 is not synchronized with the start of imaging of the capsule endoscope 1, and the start and end of reception are controlled by the operation of the input unit of the receiver 103.

  The computer 104 performs reading / writing of the CF memory card 105 and the like. The computer 104 has a processing function for a doctor or a nurse (examiner) to make a diagnosis based on an image of an internal organ of a patient imaged by the capsule endoscope 1.

  The general operation of the system will be described. First, as shown in FIG. 20, the capsule endoscope 1 is taken out from the package 100 before starting the inspection. As a result, the reed switch 52a of the capsule endoscope 1 is turned on and the main power supply is turned on. That is, the capsule endoscope 1 is in a state in which the illumination means 21 irradiates illumination light, transmits the illumination light to the distal end cover 71 and illuminates the outside of the sealed container 7, and transmits from the distal end cover 71. The formed image is formed on the solid-state imaging device 31 in the sealed container 7, and data of this image can be transmitted to the outside of the sealed container 7.

  Next, the subject 101 swallows the capsule endoscope 1 from his / her mouth. Thereby, the capsule endoscope 1 passes through the esophagus and progresses in the body cavity by the peristaltic motion of the digestive tract cavity, thereby illuminating the body cavity and sequentially capturing images in the body cavity. The capsule endoscope 1 outputs radio waves of the captured image as the imaging result as necessary or as needed. This radio wave is captured by the antennas 102 a to 102 d of the jacket 102. The captured radio wave is relayed as a signal from the antennas 102a to 102d to the receiver 103.

  Finally, when the observation (inspection) of the inspected person 101 by the capsule endoscope 1 is completed, the CF memory card 105 storing the photographed image data is taken out from the receiver 103 and inserted into the memory card insertion hole of the computer 104. . The computer 104 reads the captured image data stored in the CF memory card 105 and stores the captured image data corresponding to each patient.

  As described above, in the capsule endoscope manufacturing method according to the present embodiment, after the chip component 34 is mounted on the imaging substrate 30 housed in the hermetic container 7 to be put into the body cavity, the imaging substrate The solid-state imaging device 31 is mounted on 30. That is, since heat at the time of mounting the chip component 34 is not involved in the solid-state image sensor 31, a situation where the color filter made of an organic film provided on the solid-state image sensor 31 is discolored is avoided. A quality image can be obtained. As a result, it is possible to mount the solid-state image pickup device 31 together with the other chip components 34 on the image pickup substrate 30 without causing any trouble in the image quality of the solid-state image pickup device 31.

  Furthermore, since the solid-state image sensor 31 is mounted after the chip component 34 is mounted, it is possible to prevent dust from being attached to the solid-state image sensor 31 when the chip component 34 is mounted. High-quality images can be obtained.

  When mounting the chip components 34, a plurality of chip components 34 are mounted together by reflow, and the solid-state imaging device 31 is mounted by a ball grid array at a temperature lower than that of reflow. As a result, it is possible to mount the chip component 34 at a suitable temperature, and it is possible to mount the solid-state imaging device 31 at a suitable temperature in a range where the color filter does not change color.

  In addition, a plurality of chip parts 34 are collectively mounted on both surfaces of the imaging substrate 30 by reflow, and then the solid-state imaging device 31 is mounted by a ball grid array. As a result, since the mounting process by reflow is continuously performed and then the mounting process by the ball grid array is performed, it is possible to improve the efficiency of the manufacturing process without reworking the same type of processes on both surfaces of the imaging substrate 30. become.

  In particular, the imaging substrate 30 constitutes a rigid flexible substrate continuous with the flexible substrate 80 together with the other substrates 20, 50 </ b> A, 50 </ b> B, and each substrate is mounted in the process of mounting the chip components 21, 22, 34, 54, 53 a. Mounting is performed on the 20, 30, 50A, and 50B (including both sides) together by reflow. As a result, it is possible to mount the chip components 21, 22, 34, 54, 53a and the solid-state imaging device 31 on the respective substrates 20, 30, 50A, 50B (including both sides) at appropriate temperatures. . In addition, it is possible to improve the efficiency of the manufacturing process without causing reworking of the same type of process on both surfaces of each substrate 20, 30, 50A, 50B.

  Further, in the capsule endoscope manufacturing method described above, after the step of mounting the solid-state imaging device 31, the reed switch 52a of the switch unit 52 is mounted on the switch substrate 50A. As a result, the switch substrate 50A is provided at a distance from the imaging substrate 30 via the flexible substrate 80, and the reed switch 52a is mounted by local soldering, so that heat generated when the reed switch 52a is mounted is imaged. The solid-state imaging device 31 on the substrate 30 is not affected.

  In the above-described capsule endoscope manufacturing method, the transmitter 6 assembled in advance is connected to the flexible substrate 80 after the step of mounting the solid-state imaging device 31. As a result, the flexible board 80 for connecting the transmission board 60A is provided at a distance from the imaging board 30, and the transmission board 60A is connected by local soldering, so that heat when the transmission board 60A is connected is imaged. The solid-state imaging device 31 on the substrate 30 is not affected. Furthermore, the heat generated by the reflow mounting of the chip parts 21, 22, 34, 54, 53a, the mounting by the flip chip bonding of the DSP 41 and the semiconductor part 54, and the mounting by the ball grid array of the solid-state imaging element 31 is preassembled. It does not affect the setting related to transmission of a certain transmission unit 6.

It is a sectional side view which shows the structure of the capsule type endoscope which is a capsule type medical device which concerns on this invention. It is sectional drawing which looked at the illumination board | substrate from the front. It is sectional drawing which looked at the illumination board | substrate from the rear surface. It is sectional drawing which looked at the imaging substrate from the front. It is sectional drawing which looked at the imaging board | substrate from the rear surface. It is sectional drawing which looked at the switch board | substrate from the front. It is sectional drawing which looked at the power supply board from the rear surface. It is sectional drawing which looked at the antenna board | substrate from the rear surface. It is a side view which shows the manufacturing process of the capsule type | mold endoscope which is a capsule type medical device which concerns on this invention. It is a side view which shows the manufacturing process of the capsule type | mold endoscope which is a capsule type medical device which concerns on this invention. It is a side view which shows the manufacturing process of the capsule type | mold endoscope which is a capsule type medical device which concerns on this invention. It is a side view which shows the manufacturing process of the capsule type | mold endoscope which is a capsule type medical device which concerns on this invention. It is a side view which shows the manufacturing process of the capsule type | mold endoscope which is a capsule type medical device which concerns on this invention. It is a side view which shows the manufacturing process of the capsule type | mold endoscope which is a capsule type medical device which concerns on this invention. It is a side view which shows the manufacturing process of the capsule type | mold endoscope which is a capsule type medical device which concerns on this invention. It is a side view which shows the manufacturing process of the capsule type | mold endoscope which is a capsule type medical device which concerns on this invention. It is a side view which shows the manufacturing process of the capsule type | mold endoscope which is a capsule type medical device which concerns on this invention. It is a side view which shows the manufacturing process of the capsule type | mold endoscope which is a capsule type medical device which concerns on this invention. It is a side view which shows the manufacturing process of the capsule type | mold endoscope which is a capsule type medical device which concerns on this invention. It is the schematic of the medical system using the capsule type endoscope which is the capsule type medical device of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Capsule type endoscope 2 Illumination part 20 Illumination board 20a Through-hole 21 Illumination means 22 Chip component 3 Imaging part 30 Imaging board 31 Solid-state image sensor 32 Imaging lens 32a, 32b Lens 33 Focus adjustment mechanism 33a Lens frame 33b Holding frame 34 Chip part 4 Drive part 5 Power supply part 50A Switch board 50Aa Notch hole 50B Power supply board 51 Battery 52 Switch part 52a Reed switch 52b Bias magnet 53 Power supply part 53a DCDC converter 54 Chip part 55 Contact point 56 Thermal contraction band 6 Transmitter part 60A Transmission board 60B Antenna board 61 Oscillator circuit 62 Antenna 7 Sealed container 71 Tip cover 72 Case 73 Sealing resin 80 Flexible substrate 90 Flat part 100 Package 100a Permanent magnet 101 Subject 102 Jacket 102 a Antenna 103 Receiver 104 Computer 105 Memory card

Claims (5)

In a method for manufacturing a capsule medical device that is introduced into a subject and executes a predetermined function set in advance,
Mounting a chip component on a substrate housed in a sealed container formed in a capsule shape for introduction into the subject; and
Mounting a solid-state imaging device that obtains a subject image in the subject on the substrate on which the chip component is mounted.   The step of mounting the chip component further includes the step of collectively mounting the chip component on the substrate in a form in which the substrate on which the solid-state imaging device is mounted and another substrate are connected by a flexible substrate. A method for manufacturing a capsule medical device according to claim 1.   The method of manufacturing a capsule medical device according to claim 1, wherein the step of mounting the chip component further includes a step of mounting the chip component on both sides of the substrate.   In a form in which a substrate on which the solid-state image sensor is mounted and another substrate are connected by a flexible substrate, a switch unit that supplies power to the solid-state image sensor after the step of mounting the solid-state image sensor is connected to the other substrate. The method for manufacturing a capsule medical device according to any one of claims 1 to 3, further comprising a mounting step.   In a form in which a substrate on which the solid-state image sensor is mounted and another substrate are connected by a flexible substrate, a transmitter for transmitting a subject image of the solid-state image sensor to the flexible substrate after the step of mounting the solid-state image sensor The method for manufacturing a capsule medical device according to claim 1, further comprising a step of connecting to the capsule medical device.

Images