JP2005201659A - Probe card, probe apparatus, probe test method, and semiconductor device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe card capable of accurately connecting a probe needle to a terminal of a semiconductor device and facilitating the maintenance. <P>SOLUTION: The probe card is provided with a probe card substrate 101; a plurality of probe needles 102a and 102b mounted to the probe card substrate 101 and each electrically connected to a plurality of terminals of the semiconductor device; and a plurality of elastic members 104a and 104b, located between the plurality of probe needles 102a and 102b and the probe card substrate, for making the probe needles 102a and 102b sink toward the probe card substrate 101, when the probe needles 102a and 102b are to be connected to the terminals of the semiconductor device. The plurality of probe needles 102a and 102b may be mounted to the probe card substrate 101 with different densities. The elastic members 104a and 104b are, for example, an electrically conductive elastomer. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a probe card, a probe device, a probe test method, and a semiconductor device manufacturing method. In particular, the present invention relates to a probe card, a probe device, a probe test method, and a semiconductor device manufacturing method that can connect a probe needle to a terminal of a semiconductor device with high accuracy and facilitate maintenance.

When a large number of semiconductor devices are formed on a semiconductor wafer in a semiconductor process, the electrical characteristics of each semiconductor device are inspected as they are and the defective products are screened. In general, a probe device is used for this inspection. In this probe device, the probe card is opposed to the semiconductor wafer and the distance between them is reduced, whereby the probe needles of the probe card are brought into contact with the terminals of the individual semiconductor devices on the semiconductor wafer. Then, by applying a predetermined voltage from the probe needle, an electrical test such as a continuity test of each semiconductor device is performed, and whether each semiconductor device has electrical characteristics is tested via a tester (for example, a patent) Reference 1).
JP 2003-188218 A (3rd to 5th paragraphs)

  The terminals of the IC product for the liquid crystal driver are arranged in a row on the outer periphery of the chip, but the number of output terminals is larger than that of the input terminals. For this reason, the density of the probe needles of the probe card also differs between the output terminal side and the input terminal side. In this case, the pressing force of the probe needle against the terminal of the IC product is also different between the output terminal side and the input terminal side. Then, the pressing force of the probe needle on the input terminal side becomes too strong, and the repulsive force may cause the probe needle to come off from the terminal to be contacted. In this case, a normal IC product is also judged as a defective product.

  Further, when the pressing force of the probe needle against the terminal of the IC product is different, the wear amount of the probe needle is different. For this reason, the wear amount of the probe needle on the input terminal side is relatively increased. In this case, the probe needles on the output terminal side must be polished more than the probe needles on the input side during maintenance of the probe card, which requires time and labor for maintenance of the probe card. In addition, the life of the probe needle is shortened.

  The present invention has been made in consideration of the above-described circumstances, and an object of the present invention is to provide a probe card, a probe apparatus, and a probe test method in which a probe needle can be accurately connected to a terminal of a semiconductor device and maintenance is facilitated. And a method of manufacturing a semiconductor device.

In order to solve the above problems, the present invention is a probe card for performing a probe test on a semiconductor device,
A probe card substrate;
A plurality of probe needles mounted on the probe card substrate and electrically connected to each of a plurality of terminals of the semiconductor device;
A plurality of probe needles that are located between the base ends of the probe needles and the probe card substrate, and that sink the probe needles toward the probe card substrate when the tip portions of the probe needles contact the terminals. And an elastic member.

  According to this probe card, the elastic member is provided between the probe card substrate and the probe needle. When the probe needle is pressed against the terminal of the semiconductor device, the probe needle sinks toward the probe card substrate. For this reason, the repulsive force of the probe needle is smaller than when no elastic member is provided, and the probe needle is unlikely to be detached from the terminal to be contacted.

The present invention is particularly effective when a part of the plurality of probe needles is mounted on the probe card substrate at a density different from that of the other probe needles. In this case, the elastic members corresponding to some probe needles may have different elastic moduli from other elastic members. Furthermore, in this case, some probe needles are formed with a lower density than other probe needles, and elastic members corresponding to some probe needles may have a lower elastic modulus than other elastic members.
Some of the plurality of elastic members may have different elastic moduli from other elastic members.

The elastic member may be a conductive elastomer or may be a spring member formed of a conductive material. The elastic member is at least partially embedded in a recess provided in the probe card substrate, and the joint between the elastic member and the probe needle and the opening surface of the recess are sealed with a flexible adhesive. May be.
The elastic modulus of the plurality of elastic members is preferably lower than the elastic modulus of the terminal.

A probe apparatus according to the present invention is a probe apparatus that performs a probe test on a semiconductor device,
A test head;
A probe card assembled to the test head;
A stage for aligning the semiconductor device with respect to the probe card,
The probe card is
A probe card substrate;
A plurality of probe needles mounted on the probe card substrate and electrically connected to each of a plurality of terminals of the semiconductor device;
A plurality of probe needles that are located between the base ends of the probe needles and the probe card substrate, and that sink the probe needles toward the probe card substrate when the tip portions of the probe needles contact the terminals. And an elastic member.

The probe test method according to the present invention includes:
A test head;
A probe card assembled to the test head;
A stage for aligning the semiconductor device with respect to the probe card,
The probe card is
A probe card substrate;
A plurality of probe needles mounted on the probe card substrate and electrically connected to each of a plurality of terminals of the semiconductor device;
A plurality of probe needles that are located between the base ends of the probe needles and the probe card substrate, and that sink the probe needles toward the probe card substrate when the tip portions of the probe needles contact the terminals. A method for performing a probe test on a semiconductor device using a probe device having an elastic member of
Placing a semiconductor wafer on the stage of the probe device;
A step of performing a probe test by bringing the probe needles of the probe card into contact with each other of the plurality of terminals of the semiconductor device formed on the semiconductor wafer so that they can conduct each other;
It comprises.

A method for manufacturing a semiconductor device according to the present invention includes:
A test head;
A probe card assembled to the test head;
A stage for aligning the semiconductor device with respect to the probe card,
The probe card is
A probe card substrate;
A plurality of probe needles mounted on the probe card substrate and electrically connected to each of a plurality of terminals of the semiconductor device;
A plurality of probe needles that are located between the base ends of the probe needles and the probe card substrate, and that sink the probe needles toward the probe card substrate when the tip portions of the probe needles contact the terminals. A method of manufacturing a semiconductor device using a probe device having an elastic member,
Forming a semiconductor device having a plurality of terminals on a semiconductor wafer;
Placing a semiconductor wafer on the stage of the probe device;
A step of performing a probe test by bringing the probe needles of the probe card into contact with each other of the plurality of terminals of the semiconductor device formed on the semiconductor wafer so that they can conduct each other;
It comprises.

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram schematically showing the probe apparatus according to the first embodiment.
The probe device includes a test head 31 configured to be movable up and down by a lift mechanism (not shown), a performance board 32 sequentially disposed in the device main body (not shown) below the test head 31, and the performance board 32. The connection ring 34 supported by the insert ring 33 so as to be connected to the probe card 100, the probe card 100 disposed below the connection ring 34, and the semiconductor wafer 1, which is a device under test, are aligned with respect to the probe card 100. An alignment mechanism 20 is provided.

  The test head 31 includes a pin electronics 36 including a power source for a sample for applying a voltage to the semiconductor device on the semiconductor wafer 1 and an input unit for taking the output from the semiconductor device into the measurement unit. The pin electronics 36 is electrically connected to a plurality of electronic component circuits 37 mounted on the performance board 32. These electronic component circuits 37 are configured as various measurement circuits including, for example, a matrix relay, a driver circuit, etc., and the connection terminals 38 to the connection ring 34 of each electronic component circuit 37 are the main body of the performance board 32, for example, an epoxy system. On the lower surface of the resin substrate 39, for example, they are arranged on four circumferences that are concentric with the substrate 39.

  Further, on the upper surface of the connection ring 34, the pogo pins 40 corresponding to the connection terminals 38 are arranged on four circumferences formed so as to form concentric circles, and the pogo pins 41 connected to the pogo pins 40 are connected to the lower surface thereof. It is provided corresponding to the member 42. The connection member 42 is configured to be connected to a tester connection terminal on the lower surface of the probe card 100 from below. Accordingly, the test head 31 is configured to be electrically connected to the probe card 100 via the performance board 32, the connection ring 34, and the connection member 42.

  A spacer 43 made of a cushioning material such as rubber is disposed on the lower surface of the connection ring 34, and the spacer 43 is formed at a position corresponding to the upper surface of the probe card 100. As a result, the entire upper surface of the probe card 100 can be pressed downward by the spacer 43. During the pressurization, the pogo pin 41 can be electrically connected to the connection member 42, and the connection member 42 is electrically connected to the tester connection terminal of the probe card 100.

  The probe card 100 is capable of simultaneously measuring one or a plurality of semiconductor devices 2 formed on the semiconductor wafer 1. The probe card 100 has a probe card substrate 101 provided with printed wiring (not shown) on the surface and inside. The probe card board 101 is, for example, a printed board. A connection terminal area is provided on the outer periphery of the lower surface of the probe card substrate 101, and a tester connection terminal connected to the connection member 42 is disposed in the connection terminal area. The probe card substrate 101 has a structure in which the needle stand surface and the tester connection terminal surface are arranged on the same surface (the lower surface in FIG. 1). Accordingly, the connection member 42 for electrical connection is also structured to contact from the lower surface.

  A plurality of probe needles 102 a and 102 b are fixed to the lower surface side of the probe card substrate 101, and the fixed base ends are connected to the printed wiring of the probe card substrate 101. The printed wiring is connected to the tester connection terminal via a jumper wiring (not shown), or connected to the tester connection terminal by a multi-wire wiring (registered trademark) in the printed circuit board.

  Next, the alignment mechanism 20 will be described. A substantially circular stage 25 is provided below the probe card 100, and the semiconductor wafer 1 is held horizontally by a wafer chuck 24 disposed on the upper surface of the stage 25. Inside the wafer chuck 24, a heating device (not shown) and a cooling medium circulation path (not shown) are provided as a temperature adjusting mechanism, and the semiconductor wafer 1 is, for example, 150.degree. The semiconductor wafer 1 can be cooled to, for example, −10 ° C. by a cooling medium flowing through the circulation path.

  The stage 25 has a driving mechanism (not shown) that drives the wafer chuck 24 in the horizontal direction, the vertical direction, and the θ direction. The stage 25 is moved to the rails 21 and 22 by driving the driving mechanism when the semiconductor wafer 1 is aligned. The wafer chuck 24 moves in the X and Y directions and rotates in the θ direction, and further moves up and down. Further, a target plate 23 is attached to the wafer chuck 24, and a predetermined plate formed on the target plate 23 and the semiconductor wafer 1 by optical imaging devices 44 and 45 and a capacitance sensor 46 disposed above the target plate 23. The position of the probe card 100 and the semiconductor device is calculated based on the detection signal. Based on the calculation result, the drive mechanism of the stage 25 is driven and controlled so that the semiconductor device to be inspected on the semiconductor wafer 1 is aligned with the probe card 100.

FIG. 2 is a plan view showing a configuration of the semiconductor device 2 to be probe-tested by the probe device. A plurality of semiconductor devices 2 are formed on the semiconductor wafer 1. The semiconductor device 2 is a driver of a liquid crystal display device, for example, and is divided from the semiconductor wafer 1 after a probe test is performed by the probe device.
The semiconductor device 2 has an elongated shape, and includes a plurality of input terminals 2a such as pads along one long side and a plurality of output terminals 2b such as pads along the other long side. The number of output terminals 2b is larger than the number of input terminals 2a, for example, twice or more the number of input terminals 2a.

  FIG. 3 is an enlarged view of the lower surface of the probe card 100 included in the probe device. The probe card 100 has a plurality of probe needle groups 103 for testing each of the plurality of semiconductor devices 2 formed on the semiconductor wafer 1. Each probe needle group 103 includes a plurality of probe needles 102a connected to each of the plurality of input terminals 2a of the semiconductor device 2 and a plurality of probe needles 102b connected to each of the plurality of output terminals 2b. The number of probe needles 102b is larger than the number of probe needles 102a, and the density thereof is also higher than the density of probe needles 102a.

  The proximal ends of the probe needle 102a and the probe needle 102b are inserted into conductive elastomers 104a and 104b embedded in the lower surface of the probe card substrate 101, and the conductive elastomers 104a and 104b. To the printed wiring of the probe card substrate 101. Therefore, each of the probe needle 102a and the probe needle 102b sinks toward the probe card substrate 101 when a load is applied. The elastic moduli of the conductive elastomers 104a and 104b are lower than the elastic moduli of the input terminal 2a and the output terminal 2b. The elastic modulus of the conductive elastomer 104b is higher than that of the conductive elastomer 104a.

4 is a cross-sectional view showing an AA cross section of FIG. Although this figure shows the structure of the joint part between the probe needle 102a and the conductive elastomer 104a, the structure of the joint part between the probe needle 102b and the conductive elastomer 104b is also the structure shown in this figure.
The probe card substrate 101 is provided with a recess 101a for each probe needle 102a. A printed wiring (not shown) is exposed in the recess 101a, and a conductive elastomer 104a is embedded. The proximal end of the probe needle 102a is inserted into the conductive elastomer 104a. The surface of the recess 101a and the joint between the conductive elastomer 104a and the probe needle 102a are sealed with a flexible adhesive 105. For this reason, the joint part of the conductive elastomer 104a and the probe needle 102a is not easily separated. Further, the conductive elastomer 104 a and the probe needle 102 a are not easily detached from the probe card substrate 101.

  Next, a method for manufacturing a semiconductor device using this probe device will be described. First, one or more semiconductor devices 2 are formed on the semiconductor wafer 1. Next, the semiconductor wafer 1 is placed on the stage 25. Next, the stage 25 is driven based on detection data obtained from the target plate 23, the optical imaging devices 44 and 45, the capacitance sensor 46, and the like, and the semiconductor wafer 1 is aligned with the probe card 100.

  After completion of the alignment, the test head 31 is lowered and the probe card 100 and the connection member 42 electrically connected thereto are raised. Thereby, the connection terminal 38 on the lower surface of the performance board 32 is electrically connected to the pogo pin 40 on the upper surface of the connection ring 34, and the connection member 42 is electrically connected to the pogo pin 41 on the lower surface of the connection ring 34. As a result, the pin electronics 36 of the test head 31 and the electronic component circuit 37 of the performance board 32 are electrically connected, and these are connected to the tester of the probe card 100 via the pogo pins 40 and 41 of the connection ring 34 and the connection member 42. The pin electronics 36 and the probe needles 102a and 102b are electrically connected to the terminal.

  Thereafter, the wafer chuck 24 is raised to bring the probe tips 102a and 102b into contact with the input terminal 2a and output terminal 2b of the semiconductor device 2 on the semiconductor wafer 1, respectively, and the wafer chuck 24 is moved to a predetermined amount (for example, 30 μm or more). (60 μm or less) By overdriving, the input terminal 2a and the output terminal 2b and the probe needles 102a and 102b are brought into a conductive state.

When overdriving the wafer chuck 24, the probe needle 102a has a lower density than the probe needle 102b, so that the needle tip of the probe needle 102a is likely to receive a larger load than the probe needle 102b. In contrast, in the present embodiment, conductive elastomers 104a and 104b are provided between the base ends of the probe needles 102a and 102b and the probe card substrate 101, respectively. For this reason, when the probe tips of the probe needles 102a and 102b are pressed against the input terminal 2a and output terminal 2b of the semiconductor device 2, the proximal ends of the probe needles 102a and 102b sink into the conductive elastomers 104a and 104b. For this reason, the load applied to the probe tips of the probe needles 102a and 102b is smaller than in the case where the conductive elastomers 104a and 104b are not provided. The elastic moduli of the conductive elastomers 104a and 104b are lower than the elastic moduli of the input terminal 2a and the output terminal 2b. Therefore, the probe tips of the probe needles 102a and 102b press the input terminal 2a and the output terminal 2b with an appropriate force.
Accordingly, the probe needle 102a is not easily detached from the input terminal 2a to be conducted.

  Further, since the elastic modulus of the conductive elastomer 104a is made lower than that of the conductive elastomer 104b, the probe needle 102a sinks by the same amount with a smaller load than the probe needle 102b. Accordingly, the probe needle 102a is less likely to receive a load than when the elastic modulus of the conductive elastomers 104a and 104b is the same, and the loads applied to the probe tips of the probe needles 102a and 102b are close to each other. Therefore, the load applied to the probe tip of the probe needle 102a is further reduced, and it is difficult for the probe needle 102a to be detached from the input terminal 2a to be conducted.

  When a predetermined electrical signal is transmitted from the test head 31 in a conductive state and an electrical signal is input to the input terminal 2a of the semiconductor device 2 via the performance board 32, the connection ring 34, the connection member 42, and the probe needle 102a, An output signal based on this input signal is taken into the pin electronics 36 from the output terminal 2b of the semiconductor device 2 through the probe needle 102b, the connection ring 34, and the electronic component circuit 37 of the performance board 32. In this way, electrical inspection of the semiconductor device is performed.

  Thus, in the probe card 100 according to the present embodiment, the conductive elastomers 104a and 104b are provided between the probe needles 102a and 102b and the probe card substrate 101, respectively. For this reason, even if the density of the probe needle 102a is higher than the density of the probe needle 102b, when the probe needles 102a and 102b are brought into contact with the input terminals 2a and 2b formed on the semiconductor wafer 1, the load applied to the probe needle 102a is Get smaller. Accordingly, the probe needle 102a is not easily detached from the input terminal 2a to be connected, and the probe test can be performed with high accuracy.

  Further, since the wear amounts of the probe needles 102a and 102b are close to each other, the probe needles 102a and 102b can be easily polished when the probe card 100 is maintained. Therefore, maintenance of the probe card 100 is facilitated. Further, since the polishing amount of the probe needles 102a and 102b is reduced, the life of the probe needles 102a and 102b is extended.

Next, a probe apparatus according to the second embodiment will be described. This embodiment is the same as the first embodiment except for the configuration of the probe card 100.
FIG. 5 is a cross-sectional view of the probe card 100, and corresponds to FIG. 4 in the first embodiment. The probe card 100 of the present embodiment is the same as that of the first embodiment except that the spring members 106a and 106b are used instead of the conductive elastomers 104a and 104b, respectively.

The spring members 106a and 106b are coil springs formed of a conductive material, for example, a metal wire. The spring members 106a and 106b have base ends connected to printed wiring (not shown) exposed in the recesses 101a formed on the probe card substrate 101, and other ends connected to the bases of the probe needles 102a and 102b. It is joined to the end. The opening surface of the recess 101a and the joined portions of the spring members 106a and 106b and the probe needles 102a and 102b are sealed with a flexible adhesive 105. The elastic modulus of the spring member 106a is lower than the elastic modulus of the spring member 106b.
Also in this embodiment, the same effect as the first embodiment can be obtained.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

The block diagram which shows schematically the probe apparatus by 1st Embodiment The top view which shows the structure of the semiconductor device 2 probe-tested by a probe apparatus The enlarged view of the lower surface of the probe card 100 which a probe apparatus has Sectional drawing which shows the AA cross section of FIG. Sectional drawing of the probe card 100 concerning 2nd Embodiment

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Semiconductor wafer, 2 ... Semiconductor device, 2a ... Input terminal, 2b ... Output terminal, 20 ... Alignment mechanism, 21, 22 ... Rail, 23 ... Target board, 24 ... Wafer chuck, 25 ... Stage, 31 ... Test head, 32 ... Performance board, 33 ... Insert ring, 34 ... Connection ring, 36 ... Pin electronics, 37 ... Electronic component circuit, 38 ... Connection terminal, 39 ... Substrate, 40, 41 ... Pogo pin, 42 ... Connection member, 43 ... Spacer, 44, 45 ... Optical imaging device, 46 ... Capacitance sensor, 100 ... Probe card, 101 ... Probe card substrate, 101a ... Recess, 102a, 102b ... Probe needle, 103 ... Probe needle group, 104a, 104b ... Conductivity Elastomer, 105 ... Adhesive, 106a, 106b ... Spring member

Claims (12)

A probe card for performing a probe test on a semiconductor device,
A probe card substrate;
A plurality of probe needles mounted on the probe card substrate and electrically connected to each of a plurality of terminals of the semiconductor device;
A plurality of probe needles that are located between the base ends of the probe needles and the probe card substrate, and that sink the probe needles toward the probe card substrate when the tip portions of the probe needles contact the terminals. A probe card comprising the elastic member.   2. The probe card according to claim 1, wherein some of the plurality of probe needles are mounted on the probe card substrate at a density different from that of the other probe needles.   The probe card according to claim 2, wherein the elastic member corresponding to the part of the probe needles has a different elastic modulus from other elastic members. The some probe needles are formed at a lower density than the other probe needles,
The probe card according to claim 3, wherein the elastic member corresponding to the part of the probe needles has a lower elastic modulus than the other elastic members.   The probe card according to claim 1, wherein some of the plurality of elastic members have different elastic moduli from the other elastic members.   The probe card according to claim 1, wherein the elastic member is a conductive elastomer.   The probe card according to claim 1, wherein the elastic member is a spring member formed of a conductive material. The elastic member is at least partially embedded in a recess provided in the probe card substrate,
Furthermore, the joint part of the said elastic member and the said probe needle, and the opening surface of the said recessed part are the probe cards in any one of Claims 1-7 sealed with the adhesive agent which has a softness | flexibility.   The probe card according to claim 1, wherein an elastic modulus of the plurality of elastic members is lower than an elastic modulus of the terminal. A probe device for performing a probe test on a semiconductor device,
A test head;
A probe card assembled to the test head;
A stage for aligning the semiconductor device with respect to the probe card,
The probe card is
A probe card substrate;
A plurality of probe needles mounted on the probe card substrate and electrically connected to each of a plurality of terminals of the semiconductor device;
A plurality of probe needles that are located between the base ends of the probe needles and the probe card substrate, and that sink the probe needles toward the probe card substrate when the tip portions of the probe needles contact the terminals. A probe device having the elastic member. A test head;
A probe card assembled to the test head;
A stage for aligning the semiconductor device with respect to the probe card,
The probe card is
A probe card substrate;
A plurality of probe needles mounted on the probe card substrate and electrically connected to each of a plurality of terminals of the semiconductor device;
A plurality of probe needles that are located between the base ends of the probe needles and the probe card substrate, and that sink the probe needles toward the probe card substrate when the tip portions of the probe needles contact the terminals. A method for performing a probe test on a semiconductor device using a probe device having an elastic member of
Placing a semiconductor wafer on the stage of the probe device;
A step of performing a probe test by bringing the probe needles of the probe card into contact with each other of the plurality of terminals of the semiconductor device formed on the semiconductor wafer so that they can conduct each other;
A probe test method comprising: A test head;
A probe card assembled to the test head;
A stage for aligning the semiconductor device with respect to the probe card,
The probe card is
A probe card substrate;
A plurality of probe needles mounted on the probe card substrate and electrically connected to a plurality of terminals of the semiconductor device;
A plurality of probe needles that are located between the base ends of the probe needles and the probe card substrate, and that sink the probe needles toward the probe card substrate when the tip portions of the probe needles contact the terminals. A method of manufacturing a semiconductor device using a probe device having an elastic member,
Forming a semiconductor device having a plurality of terminals on a semiconductor wafer;
Placing a semiconductor wafer on the stage of the probe device;
A step of performing a probe test by bringing the probe needles of the probe card into contact with each other of the plurality of terminals of the semiconductor device formed on the semiconductor wafer so that they can conduct each other;
A method for manufacturing a semiconductor device comprising:

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