JP2005190897A - Manufacturing method for gas discharge display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a gas discharge display device, wherein there is no need for alignment in forming an electrode, the time needed for an electrode forming process can be substantially shortened, and the material cost of the electrode and the cost of a manufacturing facility can be reduced. <P>SOLUTION: In this manufacturing method for the gas discharge display device, a recessed part 7a and a groove 21 are formed on the surface of a glass substrate 31 by chemical etching etc., then a liquid-repellent layer 32 is formed over the entire surface of the glass substrate 31, including the groove 21, by a dipping method, a roll coating method, a spray coating method, etc.; then a conductive composition 33 containing conductive particles is supplied on the liquid-repellent layer 32 in a terminal forming range C including the groove 21 by using a dispenser 34; and a connecting terminal 22 is formed by heat-treating the conductive composition 33. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a gas discharge display device, and more particularly, when manufacturing a display device such as a plasma display for achieving high definition and high brightness, there is no need for alignment during electrode formation. The present invention relates to a technique that can significantly reduce the time required for the electrode forming process and can reduce the material cost of the electrode and the cost of the manufacturing equipment.

In recent years, a plasma display (PDP: gas discharge display device) has attracted attention as a large-screen high-definition display device for high-definition.
In this plasma display, a pair of transparent substrates are arranged to face each other via a sealant, and a plurality of stripe-shaped first electrodes are formed on the inner surface of one transparent substrate, and the inner surface of the other transparent substrate is formed. A plurality of stripe-shaped second electrodes perpendicular to the first electrode are formed, a partition is formed between the second electrodes, and a recess defined by the partition is used as a discharge cell. Compared to conventional liquid crystal displays and the like, various displays such as high gradation display, excellent color reproducibility and high-speed response, and can realize a large screen with a diagonal of 30 inches or more relatively inexpensively. Has characteristics.

FIG. 5 is a partially exploded perspective view showing a conventional AC type plasma display (AC-PDP) having a surface discharge electrode structure, and FIG. 6 is a cross-sectional view showing the vicinity of a terminal portion of a glass substrate on the back side of the plasma display. is there.
In this plasma display 100, two glass substrates (transparent substrates) 101 and 102 are arranged to face each other, and indium is formed on the inner surface of the front glass substrate 102 (one main surface facing the glass substrate 101). A plurality of stripe-shaped scan electrodes (transparent electrodes) 104A and sustain electrodes 104B made of a transparent conductive material such as indium tin oxide (ITO) or SnO ₂ are formed in parallel to each other. These scan electrodes 104A and sustain electrodes 104B is covered with a transparent dielectric layer 103, and this dielectric layer 103 is further covered with a transparent protective film (not shown) made of MgO or the like. The scan electrodes 104A and the sustain electrodes 104B are alternately arranged.

On the other hand, on the inner surface of the glass substrate 101 on the back side (one main surface on the side facing the glass substrate 102), the above-described scan electrodes 104A and the sustain electrodes are formed in order to form the discharge cells 107 which are spaces for gas discharge. A plurality of partition walls 108 having a predetermined height are formed in a stripe shape in a direction crossing the electrode 104B, and a recess 107a is formed by the partition walls 108, 108,... And surrounded by the partition walls 108, 108 and the recess 107a. This region is a groove-like discharge cell 107 which is a space for gas discharge. The partition wall 108 is formed integrally with the glass substrate 101.
Each recess 107a is formed with an address electrode 106 made of a conductive material such as a striped Ag foil, Ag paste, or Cr—Cu—Cr laminated film orthogonal to the scan electrode 104A and the sustain electrode 104B. The electrodes 106 are covered with a highly reflective dielectric layer 105, and on the dielectric layer 105, one of the three primary colors red (R), green (G), and blue (B) Are stacked.

As shown in FIG. 6, the inner surface (one main surface) of the glass substrate 101 on the back side is sealed with a display portion D serving as a display surface and a periphery of the display portion D with a sealing material such as seal glass. Each of the concave portions 107a and the address electrodes 106 of the discharge cell 107 constituting the display portion D are formed up to the seal portion S. The seal portion S and the terminal portion T are formed outside the seal portion S. It is formed to extend.
Each address electrode 106 is connected to the connection terminal 112 of the terminal portion T by a lead electrode 111. These connection terminals 112 are for electrically connecting an external circuit such as a flexible printed circuit board (FPC: not shown).
Then, the glass substrates 101 and 102 are opposed to each other so that the portions of the connection terminals 112, 112,... Are exposed, and Ne that uses Xe resonance radiation of 147 nm inside each discharge cell 107, 107,. In a state in which a discharge gas such as -Xe or He-Xe is sealed, the sealing portion S around the display portion D is sealed with a sealing material such as sealing glass.

In the plasma display 100, for example, the surface of the flat glass substrate 101 is cut by a sandblast method to form a recess 107a, and then a conductive material such as an Ag sheet is patterned by a photolithography method to form an address electrode on the recess 107a. 106, and a dielectric layer 105 and a phosphor 109 are sequentially formed on the address electrode 106, and then an extraction electrode 111 connected to the address electrode 106 is formed on the peripheral edge of one end of the recess 107a. The method is taken (for example, refer patent document 1).
JP 2001-43804 A

By the way, in the conventional plasma display 100 described above, a conductive material such as an Ag sheet is patterned using a photolithography method, and the address electrode 106 is formed in the concave portion 107a, and the connection terminal 112 is formed in the terminal portion T. Although a method of forming the extraction electrode 111 between the electrode 106 and the connection terminal 112 is adopted, the equipment itself to which the photolithography method is applied is very expensive, so it is difficult to reduce the equipment cost. There was a problem.
In addition, the photolithography method has a problem that the manufacturing process becomes long and there is a lot of loss of the conductive material because of complicated processes such as conductive material formation, resist coating, mask alignment, resist patterning, conductive material etching, etc. There was a point. In particular, when an Ag sheet is used as a conductive material, since only a part of the Ag sheet becomes an electrode, a considerable portion of expensive noble metal is wasted, which increases the manufacturing cost. Yes.

  The present invention has been made in view of the above circumstances, and there is no need for alignment during electrode formation, and the time required for the electrode formation process can be greatly reduced. An object of the present invention is to provide a method for manufacturing a gas discharge display device capable of reducing the cost.

In order to solve the above problems, the present invention employs the following method for manufacturing a gas discharge display device.
That is, in the method for manufacturing a gas discharge display device according to the present invention, a pair of transparent substrates are arranged to face each other, and a plurality of striped first electrodes are formed on one main surface of one of the transparent substrates. A plurality of striped second electrodes perpendicular to the first electrode are formed in parallel to each other on one main surface of the opposite side of the other transparent substrate, and these second electrodes A barrier rib is formed between each, and each recess defined by these barriers is a discharge cell. The recess is formed on at least one outer side in the longitudinal direction of the recess and on one main surface of the other transparent substrate. A method of manufacturing a gas discharge display device, wherein a groove that communicates is formed, and a connection terminal that is connected to the second electrode is formed in the groove, wherein the groove is formed on one main surface of the other transparent substrate, on the recess. Shaped communicating groove Then, a conductive composition containing conductive particles for forming a liquid repellent layer on the one main surface including the groove, and then forming the connection terminal on the one main surface including the groove. It is characterized by supplying.

  In this method for manufacturing a gas discharge display device, a groove communicating with the recess is formed on one main surface of the other transparent substrate, and then a liquid repellent layer is formed on the one main surface including the groove, Next, by supplying a conductive composition including conductive particles for forming the connection terminal on the one main surface including the groove, the upper ends of the partition walls on both sides of the groove in the conductive composition. The material adhering to the portion is bounced by the liquid repellent layer and flows down into the groove and does not remain at the upper end of the partition wall. In addition, the conductive composition supplied into the groove is integrated with the conductive composition that flows down from the surroundings, and is deformed so that the surface area is reduced by the surface tension and stored in the groove. The

As described above, since the conductive composition supplied on the one main surface including the groove is held in a state where the shape is held only in the groove, the conductive composition flows out of the groove and adheres to the partition wall portion. There is no risk of malfunction. Therefore, work such as alignment when supplying the conductive composition into the groove is not required, and the work time is greatly shortened.
Thus, the conductive composition can be supplied quickly only into the groove by a simple operation of supplying the conductive composition onto the one main surface including the groove.

The liquid repellent layer may be formed on the one main surface excluding the groove.
The contact angle (θ) between the conductive composition and one main surface of the transparent substrate is preferably in the range of 30 ° to 100 °.
The conductive composition preferably has a viscosity at 23 ° C. and a shear rate of 10 (1 / second) within a range of 0.01 Pa · s to 10 Pa · s.

According to the method for manufacturing a gas discharge display device of the present invention, a groove communicating with the recess is formed on one main surface of the other transparent substrate, and then the liquid repellent layer is formed on the one main surface including the groove. And then supplying a conductive composition including conductive particles for forming the connection terminal on the one main surface including the groove, and thus providing conductivity on the one main surface including the groove. With the simple operation of supplying the composition, the conductive composition can be supplied only into the groove without alignment. Therefore, there is no need for alignment, the connection terminals can be formed on the transparent substrate easily and in a short time, and the time required for the electrode forming process can be greatly reduced.
Further, since the conductive composition collects only in the groove, the conductive composition is not wasted, and the material cost of the electrode can be reduced.
Furthermore, since this process can be handled with existing simple equipment, the cost of manufacturing equipment can be reduced.

An embodiment of a method for manufacturing a gas discharge display device of the present invention will be described with reference to the drawings.
Here, an AC plasma display (AC-PDP) having a surface discharge electrode structure will be described as an example of the gas discharge display device.
FIG. 1 is a partially exploded perspective view showing an AC type plasma display (AC-PDP) to which the method of manufacturing a gas discharge display device of this embodiment is applied, and FIG. 2 is a vicinity of a terminal portion of a glass substrate on the back side of the plasma display. FIG. 3 is a cross-sectional view taken along line AA of FIG. The plasma display shown in FIGS. 1 to 3 is an example, and the present invention is not limited to this plasma display.

In this plasma display 1, two glass substrates (transparent substrates) 2 and 3 are arranged to face each other, and an inner surface of the front glass substrate 3 (one main surface facing the glass substrate 2) is indium. A plurality of stripe-shaped scan electrodes (transparent electrodes) 4A and sustain electrodes 4B made of a transparent conductive material such as indium tin oxide (ITO) and SnO ₂ are formed in parallel to each other. These scan electrodes 4A and sustain electrodes 4B is covered with a transparent dielectric layer 5, and this dielectric layer 5 is further covered with a transparent protective film (not shown) made of MgO or the like. The scan electrodes 4A and the sustain electrodes 4B are alternately arranged.

  On the other hand, on the inner surface of the glass substrate 2 on the back side (one main surface facing the glass substrate 3), the above-described scan electrodes 4A and the sustain electrodes are formed in order to form discharge cells 7 that are spaces for gas discharge. A plurality of partition walls 8 having a predetermined height are formed in a stripe shape in a direction crossing the extending direction of the electrode 4B, and a region sandwiched by these partition walls 8, 8,. , 8 and the space 7 surrounded by the recess 7a is a groove-shaped discharge cell 7 which is a space for gas discharge.

The partition walls 8, 8,... May be formed of separate members different from the glass substrate 2, but in order to simplify the manufacturing process of the plasma display 1, as shown in FIG. It is desirable that it be formed.
In each discharge cell 7, that is, on the bottom surface of the recess 7a, a strip-like address electrode (second electrode) 11 is formed perpendicular to the scan electrode 4A and the sustain electrode 4B and along the bottom surface of the recess 7a. The address electrodes 11, 11,... Are covered with a dielectric layer 12 having high reflectivity, and on each dielectric layer 12, any one of the three primary colors red (R), green (G), and blue (B) The phosphors 13 emitting such colors are stacked.

  These address electrodes 11, 11,... Are filled with slurry (conductive liquid material) containing at least conductive particles, glass frit, water, a binder resin, and a dispersing agent in the recess 7a, It is obtained by allowing the conductive particles to settle by standing for a predetermined time, then heat-treating at a predetermined temperature for a predetermined time, and bonding the precipitated conductive particles to each other.

As the conductive particles, for example, Ag particles or Ag alloy particles having an average particle diameter of 0.05 to 5.0 μm, preferably 0.1 to 2.0 μm, are preferably used.
The glass frit is not particularly limited as long as it does not affect the characteristics of the electrode. For example, a lead borosilicate glass having an average particle size of 0.1 to 5.0 μm, preferably 0.1 to 2.0 μm. Borosilicate zinc glass, borosilicate bismuth glass and the like are preferably used.

These address electrodes 11, 11,... Are formed by applying a conductive sheet such as an Ag sheet by a method of attaching a stripe-shaped conductive foil such as an Ag foil, or a photolithography method in addition to the method of precipitating the conductive particles. It can also be formed by a patterning method.
As the conductive foil, for example, an Ag foil or an Ag alloy foil having a thickness of 1 to 15 μm, preferably 2 to 10 μm is preferably used.

On the inner surface of the glass substrate 2, as shown in FIGS. 2 and 3, the concave portions 7 a of the discharge cells 7 constituting the display portion are extended so that one end portion in the longitudinal direction extends to the seal portion S. A groove 21 communicating with the recess 7a is formed at one end of each recess 7a so as to coincide with the longitudinal direction of the recess 7a. A connection terminal 22 to be connected is formed.
A region where the connection terminal 22 is formed, that is, the groove 21, the end surface of the recess 7a, and a part of the bottom portion is a terminal formation range C.

In this case, the depth D of the recess 7a is approximately 100 to 200 μm, the depth d of the groove 21 is approximately 5 to 30 μm, and the width W of the recess 7a and the groove 21 is approximately 50 to 150 μm.
The connection terminal 22 has substantially the same width and thickness as the address electrode 11 and is made of a conductive material whose main component is conductive particles such as Ag fine particles or Ag—Pd fine particles.

Next, the manufacturing method of the gas discharge display apparatus of this embodiment is demonstrated based on FIG.
First, as shown in FIG. 4A, after a glass substrate (transparent substrate) 31 made of soda lime glass or the like is washed with an organic solvent and dried, the concave portions 7a and grooves 21 are formed in the glass substrate 31. Form.
The surface between the recess 7a and the groove 21 may be a substantially vertical surface or an inclined surface inclined at a predetermined angle.
The recesses 7a and the grooves 21 can be formed using dry etching such as chemical etching, wet etching, or sand blasting.

In the case of dry etching or wet etching, a shallow shallow recess 7a is formed on the surface of the glass substrate 31 with a resist film having the same shape as the recess 7a, and then a mask having the same shape as the recess 7a and the groove 21 is formed. A method is used in which the recesses 7a and the grooves 21 having a predetermined depth are formed on the surface of the glass substrate 31.
Further, in the case of the sandblasting method, the recesses 7a and the grooves 21 having a predetermined depth can be formed on the surface of the glass substrate 31 by changing the sandblasting conditions between the recesses 7a and the grooves 21.

Next, as shown in FIG. 4B, a conductive composition (hereinafter referred to as “conductive composition”) containing conductive particles described below on the entire surface of the glass substrate 31 including the groove 21 by dipping, roll coating, spray coating, or the like. A liquid repellent layer 32 having liquid repellency is formed on the conductive composition).
The liquid repellent layer 32 can be formed by applying and drying an alkoxysilane having an alkyl group, a perfluoroalkyl group, a dimethylpolysiloxy group, or a silylating agent.
In addition, when the dip method or the spray coating method is used, the liquid repellent layer 32 is formed on the entire surface of the glass substrate 31 including the groove 21, but when the roll coating method is used, the groove 21 is excluded. It is also possible to form the liquid repellent layer 32 on the entire surface of the glass substrate 31.

Next, as shown in FIG. 4C, the conductive composition 33 is supplied onto the liquid repellent layer 32 in the terminal formation range C including the grooves 21.
The conductive composition 33 is a liquid substance containing conductive particles, glass frit, a solvent such as water or an organic solvent, a binder resin, and a dispersant.

As the conductive particles, those that are bonded and integrated with the glass frit by heat treatment at a predetermined temperature are preferable. For example, the average particle size is 0.05 to 5.0 μm, preferably 0.1 to 2.0 μm. Ag particles or Ag alloy particles are preferably used.
The glass frit preferably has good wettability with the above conductive particles and melts at 420 to 490 ° C., for example, the average particle size is 0.1 to 5.0 μm, preferably 0.1 to 0.1 μm. 2.0 μm lead borosilicate glass, zinc borosilicate glass, bismuth borosilicate glass and the like are preferably used.

The conductive composition 33 has a contact angle (θ) with the surface (one main surface) of the glass substrate 31 of 30 ° or more and 100 ° or less, preferably 40 ° or more and 80 ° or less. preferable.
Here, the reason why the contact angle (θ) with the surface (one main surface) of the glass substrate 31 is limited to 30 ° or more and 100 ° or less is that the conductive composition 33 is used when the contact angle (θ) is less than 30 °. May remain at the upper end of the partition wall 8 and the address electrode 11 may be short-circuited. When the contact angle (θ) exceeds 100 °, the conductive composition 33 is isolated at the upper end of the partition wall 8. This is because there is a possibility that the address electrode 11 may be short-circuited.

The conductive composition 33 has a viscosity η at 23 ° C. and a shear rate of 10 (1 / second) of 0.01 Pa · s to 10 Pa · s, preferably 0.1 Pa · s to 5 Pa · s. It is preferable to be within the range.
Here, the reason why the viscosity η at 23 ° C. and a shear rate of 10 (1 / second) is limited to 0.01 Pa · s or more and 10 Pa · s or less is that when the viscosity η is less than 0.01 Pa · s, the conductive composition 33 does not adhere to the surface between the recess 7a and the groove 21, and disconnection occurs in the connection terminal 22 formed by connecting to the address electrode 11, and when the viscosity η exceeds 10 Pa · s, This is because the conductive composition 33 remains at the upper end of the partition wall 8.

  In the conductive composition 33 of the present embodiment, the contact angle (θ) with the surface (one main surface) of the glass substrate 31 and the viscosity η at 23 ° C. and a shear rate of 10 (1 / second) satisfy the above conditions. The types and component ratios of the conductive particles, glass frit, solvent such as water and organic solvent, binder resin, and dispersant are set so as to satisfy the conditions.

When supplying the conductive composition 33 to the terminal formation range C, a dispenser (supplying means) 34 is preferably used.
Instead of the dispenser 32, an inkjet nozzle, a spray nozzle, or the like may be used.
As a supply method, a method in which the dispenser 34 or the inkjet nozzle is moved in parallel in the arrangement direction of the grooves 21, 21,.

Here, since the liquid repellent layer 32 is formed on the entire surface of the glass substrate 31 including the groove 21, even if the conductive composition 33 adheres to the surface of the glass substrate 31 other than the groove 21, the liquid repellent layer 32. It is repelled by the water repellency and supplied into the groove 21 and does not remain in the portion other than the groove 21.
In particular, when the liquid repellent layer 32 is formed on the entire surface of the glass substrate 31 excluding the grooves 21, this effect is more remarkable.

Next, as shown in FIG. 4 (d), the conductive composition 33 is allowed to stand for a predetermined time to level the surface, and then heat-treated at a predetermined temperature for a predetermined time, whereby the conductive particles and the glass are heated. A connection terminal 22 made of a conductive material to which the frit is firmly bonded is obtained.
As heat treatment conditions, for example, a maximum holding temperature of 400 to 600 ° C. and a holding time of the maximum holding temperature of 10 to 30 minutes are preferable in the air.

Next, the address electrode 11 connected to the connection terminal 22 is formed.
The address electrode 11 is filled with a slurry (conductive liquid substance) containing at least conductive particles, glass frit, water, binder resin, and a dispersant in the concave portion 7a, and is then allowed to stand for a predetermined time. Thus, the conductive particles are allowed to settle, and then heat-treated at a predetermined temperature for a predetermined time, and the precipitated conductive particles are bonded to each other.

Thereafter, a dielectric layer 12 is formed on the entire surface of the recess 7 a including the address electrode 11 and the barrier ribs 8, 8, and a phosphor 13 is formed on the dielectric layer 12 on the inner surface of the discharge cell 7. The glass substrate 2 can be produced.
On the other hand, the scanning electrode 4A and the sustaining electrode 4B, the transparent dielectric layer 5, and the transparent protective film (not shown) are sequentially laminated on the inner surface of the glass substrate to produce the front glass substrate 3.
Then, these glass substrates 2 and 3 are arranged to face each other, and the glass substrates 2 and 3 are bonded together, and a mixed gas such as Ne—Xe and He—Xe is sealed inside each discharge cell 7, 7,. The periphery is sealed with seal glass or the like.
As described above, the plasma display 1 can be manufactured.
The address electrode 11 may be formed before the connection terminal 22 is formed.

  According to the method for manufacturing a gas discharge display device of this embodiment, the liquid repellent layer 32 is formed on the entire surface of the glass substrate 31 including the grooves 21, and then the conductive composition 33 is formed on the glass substrate 31 including the grooves 21. Therefore, the conductive composition 33 can be supplied only into the groove 21 without performing alignment by a simple operation. Therefore, there is no need for alignment, and the connection terminal 22 can be formed on the glass substrate 31 easily and in a short time, and the time required for the electrode forming process can be greatly reduced.

Further, since the conductive composition 33 is supplied only into the groove 21, the conductive composition 33, that is, conductive particles such as Ag fine particles is not wasted, and the material cost of the electrode can be reduced.
Furthermore, since this process can be handled with existing simple equipment, the cost of manufacturing equipment can be reduced.

As mentioned above, although one Embodiment of the manufacturing method of the gas discharge display apparatus of this invention was described based on drawing, a specific structure is not limited to one Embodiment mentioned above, and does not deviate from the summary of this invention. The design can be changed within the range.
For example, the address electrode 11 may be formed by patterning a conductive material such as an Ag sheet or an Ag foil by a photolithography method in addition to the method using the slurry described above.

  In the method for manufacturing a gas discharge display device of the present invention, a groove is formed on the surface of a transparent substrate, a liquid repellent layer is formed on the entire surface including the groove, and a conductive material including conductive particles on the entire surface including the groove. Since the conductive composition can be supplied only into the groove without performing alignment by a simple operation of supplying the composition, the manufacturing process of the gas discharge display device is greatly shortened and the manufacturing cost is greatly increased. Reduction is possible. Since this manufacturing method can be easily applied to an apparatus having a configuration in which a connection terminal is formed on the surface of a transparent substrate, the effect is very large.

It is a partial exploded perspective view showing an AC type plasma display to which a manufacturing method of a gas discharge display device of one embodiment of the present invention is applied. It is a top view which shows the terminal part vicinity of the glass substrate of the back side to which the manufacturing method of the gas discharge display apparatus of one Embodiment of this invention is applied. It is sectional drawing which follows the AA line of FIG. It is process drawing which shows the manufacturing method of the gas discharge display apparatus of one Embodiment of this invention. It is a partial exploded perspective view which shows the AC type plasma display which has the conventional surface discharge type electrode structure. It is sectional drawing which shows the terminal part vicinity of the glass substrate of the back side of the AC type plasma display which has the conventional surface discharge type electrode structure.

Explanation of symbols

1 Plasma display 2, 3 Glass substrate (transparent substrate)
4A Scanning electrode (first electrode)
4B Sustain electrode 5 Dielectric layer 7 Discharge cell 7a Recessed part 8 Partition 11 Address electrode (second electrode)
12 Dielectric layer 13 Phosphor 21 Groove 22 Connection terminal 31 Glass substrate (transparent substrate)
32 Liquid repellent layer 33 Conductive composition containing conductive particles 34 Dispenser (supply means)

Claims (4)

A pair of transparent substrates are arranged opposite to each other, and a plurality of stripe-shaped first electrodes are formed in parallel with each other on one main surface of one of the transparent substrates, and the other transparent substrate is opposed to the other transparent substrate. A plurality of striped second electrodes perpendicular to the first electrode are formed in parallel to each other on one main surface, and a partition is formed between each of the second electrodes. Each formed recess is a discharge cell, and a groove communicating with the recess is formed on at least one outer side of the recess in the longitudinal direction and on one main surface of the other transparent substrate, and the second groove is formed in the groove. A manufacturing method of a gas discharge display device in which a connection terminal connected to an electrode is formed,
A groove communicating with the recess is formed on one main surface of the other transparent substrate, a liquid repellent layer is then formed on the one main surface including the groove, and then the one main surface including the groove A method of manufacturing a gas discharge display device, comprising supplying a conductive composition containing conductive particles for forming the connection terminal thereon. 2. The method of manufacturing a gas discharge display device according to claim 1, wherein the liquid repellent layer is formed on the one main surface excluding the groove. 3. The gas discharge display device according to claim 1, wherein a contact angle (θ) between the conductive composition and one main surface of the transparent substrate is in a range of 30 ° to 100 °. Manufacturing method. The viscosity at 23 ° C. and a shear rate of 10 (1 / second) of the conductive composition is in a range of 0.01 Pa · s to 10 Pa · s. Manufacturing method of the gas discharge display device.

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