KR100658712B1 - Plasma display manufacturing method - Google Patents

Abstract

SUMMARY OF THE INVENTION An object of the present invention is a manufacturing method of a gas discharge display device that does not require alignment at the time of electrode formation and can greatly shorten the time required for the electrode formation process, thereby reducing the material cost of the electrode and the cost of manufacturing equipment. To provide.

In the method of manufacturing the gas discharge display device of the present invention, recesses and grooves are formed on the surface of the glass substrate by chemical etching or the like, and then the entire surface of the glass substrate including the grooves is formed by a dip method, a roll coating method, a spray coating method, or the like. A liquid repellent layer is formed, and then a conductive composition containing conductive particles is supplied onto the liquid repellent layer in the terminal forming range including grooves by using a dispenser, and the connection terminal is formed by heat treatment of the conductive composition.

Plasma Display, Liquid Repellent Layer, Conductive Particles, Conductive Conductive Material

Description

Manufacturing Method of Gas Discharge Display Device {PLASMA DISPLAY MANUFACTURING METHOD}

1 is a partially exploded perspective view showing an AC plasma display to which a manufacturing method of a gas discharge display device according to one embodiment of the present invention is applied.

FIG. 2 is a plan view showing the vicinity of a terminal portion of a back glass TM substrate to which the manufacturing method of the gas discharge display device of one embodiment of the present invention is applied.

3 is a cross-sectional view taken along the line A-A of FIG.

4 is a process chart showing a method of manufacturing a gas discharge display device according to an embodiment of the present invention.

5 is a partially exploded perspective view showing an AC plasma display having a conventional surface discharge electrode structure.

6 is a cross-sectional view showing the vicinity of a terminal portion of a rear glass substrate of an AC plasma display having a conventional surface discharge electrode structure.

* Description of the symbols for the main parts of the drawings *

1 plasma display 2, 3 glass substrate (transparent substrate)

4A: scan electrode (first electrode) 4B: sustain electrode

5 dielectric layer 7 discharge cell

7a: main part 8: bulkhead

11 address electrode (second electrode) 12 dielectric layer

13: phosphor 21: groove

22: connection terminal 31: glass substrate (transparent substrate)

32: liquid-repellent layer 34: dispenser (supply means)

33: conductive composition containing conductive particles

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a gas discharge display device, and in particular, an alignment is required when forming an electrode when providing a display device such as a plasma display for achieving high definition and high brightness. The present invention relates to a technology capable of greatly shortening the time required for electrode formation and to reduce the material cost of the electrode and the cost of manufacturing equipment.

In recent years, a plasma display (PDP: gas discharge display device) is attracting attention as a large screen, high quality display device for high vision.

In the plasma display, a pair of transparent substrates are disposed to face each other with a sealing material, and a plurality of stripe-type first electrodes are formed on the inner surface of one transparent substrate, and the first electrode is orthogonal to the first electrode on the inner surface of the other transparent substrate. A plurality of stripe-shaped second electrodes are formed, a partition wall is formed between these second electrodes, and the recessed part divided by these partition walls is used as a discharge cell, and has a high gradation compared with a conventional liquid crystal display or the like. I) It is possible to display, has excellent color reproducibility, high-speed response, and has various features that can realize a large screen of diagonally larger than 30 inches at a relatively low cost.

Fig. 5 is a partially exploded perspective view showing an AC plasma display (AC-PDP) having a conventional surface discharge electrode structure, and Fig. 6 is a sectional view showing the vicinity of the terminal portion of the back glass substrate of this plasma display.

In this plasma display 100, two glass substrates (transparent substrates) 101 and 102 are arranged to face each other, and the inner surface of the front glass substrate 102 (one surface of the side opposite to the glass substrate 101). The plurality of stripe scan electrodes (transparent electrodes) 104A and sustain electrodes 104B made of transparent conductive materials such as indium tin oxide (ITO) and SnO ₂ are parallel to each other. These scan electrodes 104A and 104B are covered with a transparent dielectric layer 103, and the dielectric layer 103 is covered with a transparent protective layer (not shown) made of MgO or the like. The scan electrodes 104A and sustain electrodes 104B are alternately arranged.

On the other hand, in order to form the discharge cell 107 which is a space for gas discharge, the scan electrode 104A mentioned above and the inner surface of the back side glass substrate 101 (a side peripheral surface facing the glass substrate 102) and In the direction intersecting the sustain electrode 104B, a plurality of partitions 108 having a predetermined height are formed in a stripe shape, and recesses 107a are formed by these partitions 108, 108,... The area enclosed by these partitions 108 and 108 and the recessed portion 107a is a groove-shaped discharge cell 107 which is a space for gas discharge. The partition 108 is formed integrally with the glass substrate 101.

Each recess 107a has an address electrode 106 made of a conductive material such as a striped Ag foil, an Ag paste, or a Cr-Cu-Cr laminated film orthogonal to the scan electrode 104A and the sustain electrode 104B. Are formed, and these address electrodes 106, ... are covered with a highly reflective dielectric layer 105, and on these dielectric layers 105 are among the three primary colors red (R), green (G), and blue (B). Phosphors 109 emitting one color are stacked.

As shown in FIG. 6, the inner surface (circumferential surface) of the back side glass substrate 101 seals the display part D used as a display surface, and the circumference | surroundings of this display part D with sealing materials, such as sealing glass. Each of the recessed portions 107a of the discharge cell 107 constituting the display portion D, which is composed of three regions of the sealing portion S formed and the terminal portion T formed on the outer side of the sealing portion S. ) And the address electrode 106 extend to the sealing portion S.

Each address electrode 106 is connected to the connection terminal 112 of the terminal portion T by the lead electrode 111. These connection terminals 112 are for electrically connecting an external circuit such as a flexible printed wiring board (FPC) (not shown).

Then, the glass substrates 101, 102 are opposed to each other so that portions of the connection terminals 112, 112, ... are exposed to each other, and each of the discharge cells 107, 107, ... has a width of 147 nm. In the state which sealed discharge gas, such as Ne-Xe and He-Xe using Xe resonance radiation light, the surrounding sealing part S of the display part D was sealed by sealing materials, such as sealing glass.

In this plasma display 100, for example, the surface of the flat glass substrate 101 is cut by the sandblasting method to form the recessed portion 107a, and then a dielectric material such as an Ag sheet by the photolithography method. Patterning to form an address electrode 106 on the recess 107a, and a dielectric layer 105 and a phosphor 109 are sequentially formed on the address electrode 106, and then one side edge portion of the recess 107a is formed. The method of forming the lead-out electrode 111 connected with the address electrode 106 is adopted (for example, refer patent document 1).

[Patent Document 1] Japanese Patent Application Laid-Open No. 2001-43804

However, in the above-described conventional plasma display 100, a conductive material such as an Ag sheet is patterned using the photolithography method, the address electrode 106 is connected to the recessed portion 107a, and the connection terminal 112 is connected to the terminal portion T. ), And the drawing electrode 111 is formed between the address electrode 106 and the connecting terminal 12, but since the equipment itself to which the photolithography method is applied is very expensive, the installation cost is reduced. There is a problem that it is difficult to reduce.

In addition, the photolithography method has a problem that the manufacturing process is lengthy and the loss of the conductive material is large because the processing of forming the conductive material, applying the resist, alignment of the mask, patterning of the resist, etching of the conductive material, and the like becomes complicated. In particular, in the case of using an Ag sheet as the conductive material, since the electrode becomes only a part of the Ag sheet, a substantial portion of the expensive precious metal is wasted, which increases the manufacturing cost.

The present invention has been made in view of the above circumstances, and does not require alignment at the time of electrode formation, and can greatly shorten the time required for the electrode formation process, and can reduce the material cost of the electrode and the cost of manufacturing equipment. An object of the present invention is to provide a method of manufacturing a gas discharge display device.

In order to solve the above problems, the present invention employs the following method of manufacturing a gas discharge display device.

That is, in the method of manufacturing the gas discharge display device of the present invention, a pair of transparent substrates are disposed to face each other, and a plurality of stripe-type first electrodes are formed parallel to each other on one circumferential surface of one of the transparent substrates. And a plurality of stripe-shaped second electrodes orthogonal to the first electrode are formed in parallel with each other on one side surface of the other transparent substrate opposite to each other, and partition walls are formed between each of the second electrodes, and partitioned by these partition walls. Each of the recesses formed is a discharge cell, and grooves communicating with the recesses are formed on at least one outer side of the recess in the longitudinal direction and one peripheral surface of the other transparent substrate, and the second electrode and In the manufacturing method of the gas discharge display device formed by forming the connecting terminal to connect,

A groove communicating with the recess is formed on one peripheral surface of the other transparent substrate, and then a liquid repellent layer is formed on the peripheral surface including the groove, and then on the peripheral surface including the groove. It is characterized in that for supplying a conductive composition comprising a conductive particle for forming the connecting terminal.

In the method of manufacturing the gas discharge display device, a groove communicating with the recess is formed on one peripheral surface of the other transparent substrate, and then a liquid repellent layer is formed on the peripheral surface including the groove, and then the groove is formed. By supplying a conductive composition including conductive particles to form the connection terminal on the one circumferential surface, the conductive composition attached to the upper end portions of both partition walls of the groove into the groove by the liquid repellent layer It flows down, leaving nothing on top of the bulkhead. Further, the conductive composition supplied into the groove is integral with the conductive composition flowing down from the periphery and deformed so as to have a small surface area by the surface tension thereof, and is stored in the groove.

As described above, since the conductive composition supplied on the circumferential surface including the groove is maintained only in the groove, a bad situation such as flowing out of the groove and adhering to the partition part occurs. There is no. Therefore, when the conductive composition is supplied into the grooves, work such as alignment is unnecessary, and the working time is greatly shortened.

Accordingly, the conductive composition can be quickly supplied only into the groove by a simple operation of supplying the conductive composition on the main surface including the groove.

The liquid repellent layer may be formed on the circumferential surface except for the groove. The contact angle θ of the conductive composition and the peripheral surface of the transparent substrate is preferably in the range of 30 ° or more and 100 ° or less.

It is preferable that the said conductive composition exists in the range of 0.01 Pa.s or more and 10 Pa.s or less in the temperature of 23 degreeC, and a shear rate of 10 (1 / sec).

EMBODIMENT OF THE INVENTION One Embodiment of the manufacturing method of the gas discharge display apparatus of this invention is described with reference to drawings.

Here, an AC plasma display (AC-PDP) having a surface discharge electrode structure as an example of a gas discharge display device will be described.

1 is a partially exploded perspective view showing an AC plasma display (AC-PDP) to which the manufacturing method of the gas discharge display device of the present embodiment is applied; FIG. 2 is a plan view showing the vicinity of the rear glass substrate terminal of the plasma display; 3 is a cross-sectional view taken along line AA of FIG. 2. Incidentally, the plasma display shown in Figs. 1 to 3 is one example, and the present invention is not limited to this plasma display.

In this plasma display 1, two glass substrates (transparent substrates) 2 and 3 are disposed to face each other, and the inner surface of the front glass substrate 3 (one surface of the side opposite to the glass substrate 2). ), A plurality of stripe scan electrodes (transparent electrodes) 4A and sustain electrodes 4B made of transparent electrode materials such as indium tin oxide (ITO) and SnO ₂ are formed in parallel with each other. The scanning electrode 4A and the sustain electrode 4B are covered with a transparent dielectric layer 5, and further, the dielectric layer 5 is covered with a transparent protective film (not shown) made of MgO or the like. The scan electrode 4A and the sustain electrode 4B are alternately arranged.

On the other hand, the above-described scanning electrode 4A is formed on the inner surface of the rear glass substrate 2 (one circumferential surface on the side opposite to the glass substrate 3) to form a discharge cell 7 which is a space causing gas discharge. And a plurality of partitions 8 having a predetermined height are formed in a stripe shape in a direction crossing the extending direction of the sustain electrode 4B, and the regions narrowed by these partitions 8, 8, ... are recessed. The space region enclosed by these partitions 8 and 8 and the recessed portions 7a is a groove-shaped discharge cell which is a space causing gas discharge.

The partitions 8, 8,... May be constituted by a separate member different from the glass substrate 2, but in order to simplify the manufacturing process of the plasma display 1, as shown in FIG. 1, It is preferable that it is formed integrally with the glass substrate 2.

A band-shaped address electrode (second electrode) intersecting the above-described scanning electrode 4A and sustain electrode 4B in each discharge cell 7, that is, at the bottom of recess 7a and along the bottom of recess 7a. (11) are formed, and these address electrodes (11, 11, ...) are covered with a highly reflective dielectric layer (12), and on each dielectric layer (12) red (R), green (G), The fluorescent substance 13 which emits a certain color of blue (B) is laminated.

These address electrodes 11, 11, ... fill a recess 7a with a slurry containing at least conductive particles, glass frit, water, a binder resin and a dispersant, Subsequently, the conductive particles are allowed to stand for a predetermined time, and the conductive particles are precipitated. Then, the conductive particles are heat-treated at a predetermined temperature for a predetermined time, and the precipitated conductive particles are obtained by joining each other.

As said electroconductive particle, Ag particle or Ag alloy particle whose average particle diameter is 0.05-5.0 micrometers, Preferably 0.1-2.0 micrometers is used suitably, for example.

The glass frit may be any one which does not affect the characteristics of the electrode. For example, borosilicate glass, zinc borosilicate glass, bismuth borosilicate glass, etc., having an average particle diameter of 0.1 to 5.0 µm, preferably 0.1 to 2.0 µm, It is suitably used.

These address electrodes 11, 11, ... are formed by forming a conductive sheet such as an Ag sheet by a method of adhering a stripe-type conductive foil such as Ag foil, or by a photolithography method, in addition to the method of settling the conductive particles. It can also form by the method of patterning.

As this electrically conductive foil, Ag foil or Ag alloy foil whose thickness is 1-15 micrometers, Preferably 2-10 micrometers is used suitably, for example.

As shown in FIGS. 2 and 3, the recess 7a of each discharge cell 7 constituting the display portion is formed on the inner surface of the glass substrate 2, and one end of the glass substrate 2 extends to the sealing portion S. It is formed so as to extend, and one end of each recessed portion 7a is formed with a groove 21 communicating with the recessed portion 7a in a shape coinciding with the longitudinal direction of the recessed portion 7a. In the cross section of the recessed part 7a, the connection part connected to the address electrode 11 is set as the terminal formation range C. As shown in FIG.

In this case, the depth D of the recess 7a is approximately 100 to 200 µm, the depth d of the groove 21 is approximately 5 to 30 µm, and the width W of the recess 7a and the groove 21 is It is about 50-150 micrometers.

The connecting terminal 22 is substantially the same in width and thickness as the address electrode 11, and is made of a conductive material mainly composed of conductive particles such as Ag fine particles or Ag-Pd fine particles.

Next, the manufacturing method of the gas discharge display device of this embodiment is demonstrated with reference to FIG.

First, as shown in FIG. 4 (a), the glass substrate (transparent substrate) 31 made of soda-lime glass or the like is cleaned and dried using an organic solvent, and then the recessed portion ( 7a) and groove 21 are formed.

The surface between this recessed part 7a and the groove 21 may be a substantially vertical surface, or may be an inclined surface that is inclined at a predetermined angle.

The recesses 7a and the grooves 21 may be formed by dry etching such as chemical etching, wet etching, or sand blasting.

In the case of dry etching or wet etching, after the recessed bottom portion 7a is formed on the surface of the glass substrate 31 by a resist film having an opening having the same shape as the recessed portion 7a, the recessed portion 7a and the groove ( A method of forming recesses 7a and grooves 21 of a predetermined depth in the surface of the glass substrate 31 by using a mask having an opening having the same shape as that of 21 may be taken.

Moreover, in the sandblasting method, the recessed part 7a and the groove | channel 21 of predetermined depth are formed in the surface of the glass substrate 31 by changing the conditions of sandblasting with the recessed part 7a and the groove | channel 21. can do.

Subsequently, as shown in FIG. 4B, the surface of the glass substrate 31 including the grooves 21 is formed by a dip method, a roll coat method, a spray coat method, or the like. The liquid-repellent layer 32 which has liquid repellency is formed in the whole surface with respect to the conductive composition containing the electroconductive particle mentioned later (hereinafter abbreviated as conductive composition).

The liquid repellent layer 32 may be formed by applying and drying an alkoxysilane or silylating agent having an alkyl group, a perfluoroalkyl group, a dimethylpolysiloxy group, or the like. .

In the case of using the dip method or the spray coating method, the liquid repellent layer 32 is formed on the entire surface of the glass substrate 31 including the grooves 21. However, when the roll coating method is used, the grooves 21 are formed. The liquid repellent layer 32 may be formed on the entire surface of the glass substrate 31 except for the above.

Subsequently, as shown in FIG. 4C, the conductive composition 33 is supplied onto the liquid repelling layer 32 in the terminal forming range C including the groove 21.

The conductive composition 33 is a liquid substance containing conductive particles, a glass frit, a solvent such as water or an organic solvent, a binder resin, and a dispersant.

As electroconductive particle, it is preferable to integrate together with a glass frit by heat-processing at predetermined temperature, For example, Ag particle or Ag alloy particle whose average particle diameter is 0.05-5.0 micrometers, Preferably 0.1-2.0 micrometers is suitable. Is used.

As the glass frit, it is preferable that the conductive particles and the wettability are melted at 420 to 490 ° C., for example, and lead borosilicate glass having an average particle diameter of 0.1 to 5.0 μm, preferably 0.1 to 2.0 μm. Zinc borosilicate glass, bismuth borosilicate glass and the like are suitably used.

The conductive composition 33 preferably has a contact angle θ with the surface (circumferential surface) of the glass substrate 31 within a range of 30 ° or more and 100 ° or less, preferably 40 ° or more and 80 ° or less. .

The reason why the contact angle θ with the surface (circumferential surface) of the glass substrate 31 is limited to 30 ° or more and 100 ° or less is that the conductive composition 33 is separated when the contact angle θ is less than 30 °. This is because the electrode 8 remains on the top of the wall 8 and the address electrode 11 may be shorted. When the contact angle θ exceeds 100 °, the conductive composition 33 is isolated from the top of the partition 8. This is because the address electrode 11 may be shorted as described above.

The conductive composition 33 has a viscosity η of 0.01 Pa.s or more and 10 Pa.s or less, preferably 0.1 Pa.s or more and 5 Pa.s at a temperature of 23 ° C. and a shear rate of 10 (1 / sec). It is preferable to exist in the following ranges.

Here, the reason for limiting the viscosity (η) to 0.01 Pa.s or more and 10 Pa.s or less at a temperature of 23 ° C. and a shear rate of 10 (1 / sec) is that when the viscosity (η) is less than 0.01 Pa.s, the conductive composition ( This is because 33 is not attached to the surface between the recessed portion 7a and the groove 21 and is connected to the address electrode 11 so that a disconnection occurs in the connection terminal 22, and the viscosity η is 10 Pa.s. This is because the conductive composition 33 remains at the upper end of the partition wall 8 if exceeded.

In the conductive composition 33 of the present embodiment, the viscosity η at the contact angle θ with the surface (circumferential surface) of the glass substrate 31, the temperature of 23 ° C., and the shear rate of 10 (1 / sec) is described above. The kind and component ratio of each of electroconductive particle, glass frit, solvent, such as water and an organic solvent, binder resin, and a dispersing agent are set so that conditions may be satisfied.

In the case of supplying the conductive composition 33 to the terminal formation range C, a dispenser (supply means) 34 is suitably used.

An ink jet nozzle, a spray nozzle, or the like may be used instead of the dispenser 34.

As a supply method, the dispenser 34 or the ink jet nozzle is suitably supplied continuously or sequentially to each groove 21 while moving in parallel with the arrangement direction of the grooves 21, 21,.

In this case, since the liquid repellent layer 32 is formed on the entire surface of the glass substrate 31 including the grooves 21, the conductive composition 33 adheres to the surfaces of the glass substrates 31 other than the grooves 21. The water repellent layer 32 is supplied into the groove 21 by the water repellency of the water repellent layer 32, and is not left in portions other than the groove 21.

In particular, when the liquid repellent layer 32 is formed on the entire surface of the glass substrate 31 except for the groove 21, this effect is more remarkable.

Subsequently, as shown in Fig. 4 (d), the conductive composition 33 is left standing for a predetermined time to perform leveling of the surface, and then heat-treated at a predetermined temperature for a predetermined time, whereby the conductive particles and the glass frit are firmly secured. The connecting terminal 22 made of the joined conductive material is obtained.

As heat treatment conditions, the holding time of the maximum holding temperature of 400-600 degreeC and maximum holding temperature in air | atmosphere is preferable, for example.

Subsequently, an address electrode 11 connected to the connection terminal 22 is formed.

The address electrode 11 fills the recessed portion 7a with a slurry (conductive liquid material) containing at least conductive particles, glass frit, water, a binder resin and a dispersant, and then settles for a predetermined time to settle the conductive particles. Subsequently, heat treatment is carried out at a predetermined temperature for a predetermined time, whereby the precipitated conductive particles are bonded to each other.

Thereafter, the dielectric layer 12 is formed on the front surface of the recess 7a including the address electrode 11 and the partitions 8 and 8, and the phosphor 13 is formed on the dielectric layer 12 on the inner surface of the discharge cell 7. By forming the back side glass substrate 2 can be produced.

On the other hand, the scanning electrode 4A, the sustain electrode 4B, the transparent dielectric layer 5, and the transparent protective film (not shown) are sequentially stacked on the inner surface of the glass substrate to produce the front glass substrate 3.

Thereafter, the glass substrates 2 and 3 are disposed to face each other, and the glass substrates 2 and 3 are bonded to each other, and Ne-Xe, He-Xe, or the like is formed inside each of the discharge cells 7, 7,. Of mixed gas is sealed and the surroundings are sealed with a sealing glass or the like.

As described above, the plasma display 1 can be manufactured.

The address electrode 11 may be formed before the connection terminal 22 is formed.

According to the manufacturing method of the gas discharge display device of the present embodiment, the liquid repellent layer 32 is formed on the entire surface of the glass substrate 31 including the grooves 21, and then the glass substrate including the grooves 21 ( Since the conductive composition 33 is supplied onto the 31, the conductive composition 33 can be supplied only in the groove 21 without performing alignment in a simple operation. Therefore, no alignment is required, and the connection terminal 22 can be formed on the glass substrate 31 easily and in a short time, and the time required for the electrode forming process can be greatly shortened.

In addition, since the conductive composition 33 is supplied only in the groove 21, there is no waste of the conductive composition 33, that is, conductive terminals such as Ag fine particles, and the material cost of the electrode can be reduced.

Moreover, this process can be handled by the existing simple equipment, thereby reducing the manufacturing equipment cost.

As mentioned above, although one Embodiment of the manufacturing method of the gas discharge display apparatus of this invention was described with reference to drawings, a specific structure is not limited to the above-mentioned embodiment, A design change etc. are carried out in the range which does not deviate from the summary of this invention. This is possible.

For example, the address electrode 11 may be formed by patterning a conductive material such as Ag sheet, Ag foil or the like by a photolithography method in addition to the method of using a slurry.

In the method of manufacturing the gas discharge display device of the present invention, a groove is formed on the surface of the transparent substrate, a liquid-repellent layer is formed on the entire surface including the groove, and a conductive composition including conductive particles is formed on the entire surface including the groove. With a simple operation of supplying, since the conductive composition can be supplied only in the grooves without performing alignment, the manufacturing process of the gas discharge display device can be greatly shortened, and the manufacturing cost can be greatly reduced. This manufacturing method can be easily applied to an apparatus having a configuration in which connection terminals are formed on the surface of the transparent substrate, and therefore the effect is very large.

According to the manufacturing method of the gas discharge display device of the present invention, a groove communicating with the recess is formed on one peripheral surface of the other transparent substrate, and then a liquid repellent layer is formed on the peripheral surface including the groove, and then Since the conductive composition including the conductive terminal is provided to form the connection terminal on the one peripheral surface including the groove, alignment is performed by a simple operation of supplying the conductive composition on the peripheral surface including the groove. It is possible to supply the conductive composition only in the grooves. Therefore, there is no need for alignment, the connection terminal can be easily and shortly formed on the transparent substrate, and the time required for the electrode forming process can be greatly shortened.

In addition, since the conductive composition only collects in the grooves, there is no waste of the conductive composition, and the material cost of the electrode can be reduced.

In addition, this process can cope with existing simple equipment, and can reduce the cost of manufacturing equipment.

Claims (5)

A pair of transparent substrates are disposed to face each other, and a plurality of stripe-shaped first electrodes are formed parallel to each other on one main surface of one of the transparent substrates, and at the opposite side of the other transparent substrate. A plurality of stripe-shaped second electrodes orthogonal to the first electrode are formed on the main surface in parallel with each other, and partition walls are formed between each of the second electrodes, and each recess portion formed by these partition walls is partitioned. A gas formed by discharging cells and having grooves communicating with the recessed portions on at least one outer side in the longitudinal direction of the recessed portion and one peripheral surface of the other transparent substrate, and connecting terminals for connecting with the second electrode formed in the grooves; In the manufacturing method of the discharge display device, A groove communicating with the recess is formed on one peripheral surface of the other transparent substrate, and then a liquid repellent layer is formed on the peripheral surface including the groove, and then the peripheral surface including the groove A method of manufacturing a gas discharge display device, characterized by supplying a conductive composition comprising conductive particles for forming the connection terminal on a substrate. The method of claim 1, And the liquid-repellent layer is formed on the circumferential surface except for the grooves. The method according to claim 1 or 2, And a contact angle [theta] between the conductive composition and the circumferential surface of the transparent substrate is in a range of 30 ° or more and 100 ° or less. The method according to claim 1 or 2, The conductive composition has a viscosity of 0.01 Pa.s or more and 10 Pa.s or less at a temperature of 23 ° C. and a shear rate of 10 (1 / sec). The method of claim 3, wherein The conductive composition has a viscosity of 0.01 Pa.s or more and 10 Pa.s or less at a temperature of 23 ° C. and a shear rate of 10 (1 / sec).

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