JP2005187791A5 - - Google Patents
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- JP2005187791A5 JP2005187791A5 JP2004087110A JP2004087110A JP2005187791A5 JP 2005187791 A5 JP2005187791 A5 JP 2005187791A5 JP 2004087110 A JP2004087110 A JP 2004087110A JP 2004087110 A JP2004087110 A JP 2004087110A JP 2005187791 A5 JP2005187791 A5 JP 2005187791A5
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本発明のSiC製蛍光体は、外部光源により励起して発光し、BまたはAlのうちいずれか1種類以上の元素により10 15 /cm 3 〜10 20 /cm 3 の濃度でドーピングされ、Nにより10 15 /cm 3 〜10 20 /cm 3 の濃度でドーピングされたことを特徴とする。かかる蛍光体においては、BまたはAlのうちいずれか1種類以上の元素によるドーピング濃度と、Nによるドーピング濃度がいずれも、1016/cm3〜1020/cm3である態様が好ましい。 The SiC phosphor of the present invention emits light when excited by an external light source , and is doped with one or more elements of B or Al at a concentration of 10 15 / cm 3 to 10 20 / cm 3. It is doped with a concentration of 10 15 / cm 3 to 10 20 / cm 3 . In such a phosphor, and doping concentration by any one or more elements of B or Al, any doping concentration by N, preferably embodiment is 10 16 / cm 3 ~10 20 / cm 3.
本発明の半導体用基板は、外部光源により励起して発光する蛍光体であって、BまたはAlのうちいずれか1種類以上の元素により10 15 /cm 3 〜10 20 /cm 3 の濃度でドーピングされ、Nにより10 15 /cm 3 〜10 20 /cm 3 の濃度でドーピングされた6H型SiC単結晶蛍光体からなることを特徴とする。かかる半導体基板には、NおよびBによりドーピングされ、波長500nm〜750nmの蛍光を発し、500nm〜650nmにピーク波長を有する6H型SiC単結晶蛍光体からなるものが含まれる。さらに、NおよびAlによりドーピングされ、波長400nm〜750nmの蛍光を発し、400nm〜550nmにピーク波長を有する6H型SiC単結晶蛍光体からなる半導体基板が含まれる。 The semiconductor substrate of the present invention is a phosphor that emits light when excited by an external light source , and is doped at a concentration of 10 15 / cm 3 to 10 20 / cm 3 with one or more elements of B or Al. is characterized in that it consists of more 10 15 / cm 3 ~10 20 / 6H -type doped at a concentration of cm 3 SiC single crystal phosphor N. Such semiconductor substrates include those made of 6H-type SiC single crystal phosphor doped with N and B, emitting fluorescence with a wavelength of 500 nm to 750 nm, and having a peak wavelength at 500 nm to 650 nm. Further, a semiconductor substrate made of 6H-type SiC single crystal phosphor that is doped with N and Al, emits fluorescence with a wavelength of 400 nm to 750 nm, and has a peak wavelength at 400 nm to 550 nm is included.
本発明の半導体用粉末は、BまたはAlのうちいずれか1種類以上の元素により10 15 /cm 3 〜10 20 /cm 3 の濃度でドーピングされ、Nにより10 15 /cm 3 〜10 20 /cm 3 の濃度でドーピングされ、外部光源により励起して、波長500nm〜750nmの蛍光を発し、500nm〜650nmにピーク波長を有する6H型SiC単結晶蛍光体からなり、粒径が2μm〜10μmであり、中心粒径が3μm〜6μmであることを特徴とする。 The semiconductor powder of the present invention is doped with one or more elements of B or Al at a concentration of 10 15 / cm 3 to 10 20 / cm 3 , and with N is 10 15 / cm 3 to 10 20 / cm. 3 is doped with a concentration of 3 , excited by an external light source, emits fluorescence with a wavelength of 500 nm to 750 nm, consists of a 6H-type SiC single crystal phosphor having a peak wavelength at 500 nm to 650 nm, and has a particle size of 2 μm to 10 μm, The center particle size is 3 μm to 6 μm.
本発明の発光ダイオードは、第1の局面によれば、BまたはAlのうちいずれか1種類以上の元素と、Nとによりドーピングされた6H型SiC単結晶蛍光体からなる半導体用基板と、該基板上に窒化物半導体からなり発光波長が6H型SiCの吸収端波長以下である発光素子を備えることを特徴とする。 According to a first aspect, the light-emitting diode of the present invention includes a semiconductor substrate composed of a 6H-type SiC single crystal phosphor doped with one or more elements of B or Al and N, Do Ri emission wavelength of the nitride semiconductor on a substrate, characterized in that it comprises a light emitting element is less than the absorption edge wavelength of 6H-type SiC.
また、第2の局面によれば、BまたはAlのうちいずれか1種類以上の元素と、Nとによりドーピングされた6H型SiC単結晶蛍光体からなる1または2以上の層を、SiC製の半導体用基板上に有し、前記6H型SiC単結晶蛍光体層上に、窒化物半導体からなり発光波長が6H型SiCの吸収端波長以下である発光素子を備えることを特徴とする。
Further, according to the second aspect, one or more layers made of 6H-type SiC single crystal phosphor doped with one or more elements of B or Al and N are made of SiC. has a semiconductor for substrate, the 6H-type SiC single crystal phosphor layer, an emission wavelength Ri Do nitride semiconductor is characterized in that it comprises a light emitting element is less than the absorption edge wavelength of 6H-type SiC.
Claims (21)
LaB6、B4C、TaB2、NbB2、ZrB2、HfB2、BN、または、Bを含有した炭素をB源とし、昇華再結晶法によりSiC結晶を形成することを特徴とするSiC製蛍光体の製造方法。 Excited by an external light source, emits fluorescence with a wavelength of 500 nm to 750 nm, has a peak wavelength at 500 nm to 650 nm, is doped with N and B, and the concentration of either N or B is 10 15 / cm 3 to 10 18 / cm 3 , and the other concentration is 10 16 / cm 3 to 10 19 / cm 3 .
LaB 6 , B 4 C, TaB 2 , NbB 2 , ZrB 2 , HfB 2 , BN, or carbon containing B is used as a B source, and an SiC crystal is formed by sublimation recrystallization. A method for producing a phosphor.
B単体、LaB6、B4C、TaB2、NbB2、ZrB2、HfB2またはBNをB源とし、真空下または不活性ガス雰囲気下において、1500℃以上で、SiCに熱拡散することを特徴とするSiC製蛍光体の製造方法。 Excited by an external light source, emits fluorescence with a wavelength of 500 nm to 750 nm, has a peak wavelength at 500 nm to 650 nm, is doped with N and B, and the concentration of either N or B is 10 15 / cm 3 to 10 18 / cm 3 , and the other concentration is 10 16 / cm 3 to 10 19 / cm 3 .
Using B alone, LaB 6 , B 4 C, TaB 2 , NbB 2 , ZrB 2 , HfB 2 or BN as a B source, heat diffusion to SiC at 1500 ° C. or higher in a vacuum or in an inert gas atmosphere A method for producing a SiC phosphor.
B単体、LaB6、B4C、TaB2、NbB2、ZrB2、HfB2またはBNをB源とし、真空下または不活性ガス雰囲気下において、1500℃以上で、SiCに熱拡散する工程と、
表面層を除去する工程と
を備えることを特徴とする半導体用基板の製造方法。 Excited by an external light source, emits fluorescence with a wavelength of 500 nm to 750 nm, has a peak wavelength at 500 nm to 650 nm, is doped with N and B, and the concentration of either N or B is 10 15 / cm 3 to 10 18 / cm 3 , and the concentration of the other is 10 16 / cm 3 to 10 19 / cm 3 .
A process of thermally diffusing into SiC at 1500 ° C. or higher in a vacuum or an inert gas atmosphere using B alone, LaB 6 , B 4 C, TaB 2 , NbB 2 , ZrB 2 , HfB 2 or BN as a B source; ,
And a step of removing the surface layer. A method for manufacturing a semiconductor substrate, comprising:
結晶成長時の雰囲気ガスが、ガス分圧で1%〜30%のN2ガスを含み、原料SiCが、0.05mol%〜15mol%のB源を含むことを特徴とする昇華再結晶法によりSiC結晶を形成する半導体用基板の製造方法。 Excited by an external light source, emits fluorescence with a wavelength of 500 nm to 750 nm, has a peak wavelength at 500 nm to 650 nm, is doped with N and B, and the concentration of either N or B is 10 15 / cm 3 to 10 18 / cm 3 , and the concentration of the other is 10 16 / cm 3 to 10 19 / cm 3 .
The sublimation recrystallization method is characterized in that the atmosphere gas at the time of crystal growth includes 1% to 30% N 2 gas by gas partial pressure, and the raw material SiC includes 0.05 mol% to 15 mol% B source. A method for manufacturing a semiconductor substrate for forming a SiC crystal.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004087110A JP4153455B2 (en) | 2003-11-28 | 2004-03-24 | Phosphor and light emitting diode |
GB0620523A GB2428681B (en) | 2004-03-24 | 2005-03-22 | Phosphor |
GB0721879A GB2440695B (en) | 2004-03-24 | 2005-03-22 | Phospher and light-emitting diode |
US10/594,010 US20070176531A1 (en) | 2004-03-24 | 2005-03-22 | Phoshor and light-emitting diode |
PCT/JP2005/005143 WO2005090515A1 (en) | 2004-03-24 | 2005-03-22 | Phosphor and light-emitting diode |
DE112005000637T DE112005000637T5 (en) | 2004-03-24 | 2005-03-22 | Fluorescent and LED |
TW094108959A TW200604331A (en) | 2004-03-24 | 2005-03-23 | Phosphor and light-emitting diode |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003399992 | 2003-11-28 | ||
JP2004087110A JP4153455B2 (en) | 2003-11-28 | 2004-03-24 | Phosphor and light emitting diode |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007165729A Division JP4303765B2 (en) | 2003-11-28 | 2007-06-25 | SiC semiconductor, semiconductor substrate, powder and nitride semiconductor light emitting diode |
Publications (3)
Publication Number | Publication Date |
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JP2005187791A JP2005187791A (en) | 2005-07-14 |
JP2005187791A5 true JP2005187791A5 (en) | 2007-05-24 |
JP4153455B2 JP4153455B2 (en) | 2008-09-24 |
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Application Number | Title | Priority Date | Filing Date |
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JP2004087110A Expired - Lifetime JP4153455B2 (en) | 2003-11-28 | 2004-03-24 | Phosphor and light emitting diode |
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JP2007180377A (en) * | 2005-12-28 | 2007-07-12 | Sharp Corp | Light emitting device |
JP2007305708A (en) * | 2006-05-10 | 2007-11-22 | Rohm Co Ltd | Semiconductor light emitting element array, and illumination apparatus using the same |
WO2007136097A1 (en) * | 2006-05-23 | 2007-11-29 | Meijo University | Semiconductor light emitting element |
JP2007320790A (en) * | 2006-05-30 | 2007-12-13 | Nippon Steel Corp | Method for producing silicon carbide single crystal, silicon carbide single crystal ingot, and silicon carbide single crystal substrate |
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JP5060823B2 (en) * | 2007-04-24 | 2012-10-31 | エルシード株式会社 | Semiconductor light emitting device |
JP5085974B2 (en) * | 2007-04-26 | 2012-11-28 | エルシード株式会社 | Fluorescent substrate and semiconductor light emitting device |
JP5031651B2 (en) * | 2008-04-21 | 2012-09-19 | 新日本製鐵株式会社 | Method for producing silicon carbide single crystal ingot |
JP2010027645A (en) * | 2008-07-15 | 2010-02-04 | Ushio Inc | Light emitting device and fabrication process therefor |
JP2010021202A (en) * | 2008-07-08 | 2010-01-28 | Ushio Inc | Light emitting device |
JP5301904B2 (en) * | 2008-07-09 | 2013-09-25 | ウシオ電機株式会社 | Light emitting device |
JP5306779B2 (en) * | 2008-11-04 | 2013-10-02 | 学校法人 名城大学 | Light emitting device and manufacturing method thereof |
JP5330880B2 (en) | 2009-03-27 | 2013-10-30 | 学校法人 名城大学 | Light emitting diode element and method for manufacturing the same |
JP5212343B2 (en) * | 2009-12-08 | 2013-06-19 | 新日鐵住金株式会社 | Silicon carbide single crystal ingot, substrate obtained therefrom and epitaxial wafer |
JP5537326B2 (en) * | 2010-08-06 | 2014-07-02 | 学校法人 名城大学 | LIGHT EMITTING DIODE DEVICE AND ITS MANUFACTURING METHOD, AND SINGLE-CRYSTAL SIC MATERIAL AND ITS MANUFACTURING METHOD |
CN102959739B (en) | 2010-12-08 | 2016-05-18 | 崇高种子公司 | III nitride semiconductor devices and manufacture method thereof |
JP5219230B1 (en) * | 2012-09-04 | 2013-06-26 | エルシード株式会社 | SiC fluorescent material, method for producing the same, and light emitting device |
JP2013021350A (en) * | 2012-09-06 | 2013-01-31 | El-Seed Corp | Fluorescent substrate and semiconductor light-emitting device |
JP6219044B2 (en) | 2013-03-22 | 2017-10-25 | 株式会社東芝 | Semiconductor device and manufacturing method thereof |
JP5521242B1 (en) * | 2013-06-08 | 2014-06-11 | エルシード株式会社 | SiC material manufacturing method and SiC material laminate |
JP5331263B1 (en) * | 2013-06-17 | 2013-10-30 | 株式会社アドマップ | Silicon carbide material and method for producing silicon carbide material |
US9590150B2 (en) | 2013-06-20 | 2017-03-07 | El-Seed Corporation | Light-emitting device |
JP6226681B2 (en) * | 2013-10-09 | 2017-11-08 | エルシード株式会社 | LED element |
US9577045B2 (en) | 2014-08-04 | 2017-02-21 | Fairchild Semiconductor Corporation | Silicon carbide power bipolar devices with deep acceptor doping |
WO2016098853A1 (en) * | 2014-12-19 | 2016-06-23 | エルシード株式会社 | Light-emitting element |
JP2018022919A (en) * | 2017-10-06 | 2018-02-08 | エルシード株式会社 | LED element |
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2004
- 2004-03-24 JP JP2004087110A patent/JP4153455B2/en not_active Expired - Lifetime
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