JP2005174980A5 - - Google Patents

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Publication number
JP2005174980A5
JP2005174980A5 JP2003408671A JP2003408671A JP2005174980A5 JP 2005174980 A5 JP2005174980 A5 JP 2005174980A5 JP 2003408671 A JP2003408671 A JP 2003408671A JP 2003408671 A JP2003408671 A JP 2003408671A JP 2005174980 A5 JP2005174980 A5 JP 2005174980A5
Authority
JP
Japan
Prior art keywords
bonded
electronic component
flexible film
laminated
circuit pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003408671A
Other languages
Japanese (ja)
Other versions
JP4345464B2 (en
JP2005174980A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2003408671A priority Critical patent/JP4345464B2/en
Priority claimed from JP2003408671A external-priority patent/JP4345464B2/en
Publication of JP2005174980A publication Critical patent/JP2005174980A/en
Publication of JP2005174980A5 publication Critical patent/JP2005174980A5/ja
Application granted granted Critical
Publication of JP4345464B2 publication Critical patent/JP4345464B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Claims (1)

補強板に有機物層、可撓性フイルムを積層し、積層後の可撓性フィルムの貼り合わされた面とは反対側の面には回路パターンが形成された状態とし、該回路パターンに電子部品を接合し、該回路パターンに電子部品を接合を行う時、又は接合を行った後に、該電子部品が接合された領域内の一部もしくは全部を前記可撓性フィルムと補強板とが実質的に接着されていない状態とすることを特徴とする回路基板用部材の製造方法。 An organic material layer and a flexible film are laminated on the reinforcing plate, and a circuit pattern is formed on the surface opposite to the laminated surface of the laminated flexible film, and an electronic component is placed on the circuit pattern. When the electronic component is bonded to the circuit pattern, or after bonding, the flexible film and the reinforcing plate are substantially partly or entirely within the region where the electronic component is bonded. A method for producing a circuit board member, wherein the circuit board member is not bonded.
JP2003408671A 2003-12-08 2003-12-08 Method for manufacturing circuit board member to which electronic component is bonded Expired - Fee Related JP4345464B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003408671A JP4345464B2 (en) 2003-12-08 2003-12-08 Method for manufacturing circuit board member to which electronic component is bonded

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003408671A JP4345464B2 (en) 2003-12-08 2003-12-08 Method for manufacturing circuit board member to which electronic component is bonded

Publications (3)

Publication Number Publication Date
JP2005174980A JP2005174980A (en) 2005-06-30
JP2005174980A5 true JP2005174980A5 (en) 2007-01-25
JP4345464B2 JP4345464B2 (en) 2009-10-14

Family

ID=34730285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003408671A Expired - Fee Related JP4345464B2 (en) 2003-12-08 2003-12-08 Method for manufacturing circuit board member to which electronic component is bonded

Country Status (1)

Country Link
JP (1) JP4345464B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6580808B2 (en) * 2012-06-19 2019-09-25 日鉄ケミカル＆マテリアル株式会社 Display device and manufacturing method thereof
JP2019068016A (en) * 2017-10-05 2019-04-25 Dic株式会社 Method of manufacturing flexible printed wiring board with reinforcing portion

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