JP2007305936A5 - - Google Patents
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- Publication number
- JP2007305936A5 JP2007305936A5 JP2006135539A JP2006135539A JP2007305936A5 JP 2007305936 A5 JP2007305936 A5 JP 2007305936A5 JP 2006135539 A JP2006135539 A JP 2006135539A JP 2006135539 A JP2006135539 A JP 2006135539A JP 2007305936 A5 JP2007305936 A5 JP 2007305936A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- double
- circuit board
- conductor
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Claims (5)
前記屈曲部は、
前記他の導体層が除去されて前記屈曲部における他面の前記接着剤層が露出しており、片側のみに前記片面無接着導体積層板の導体層を有し、
前記接着剤層の縦弾性率が前記ベース材の縦弾性率より低い、
ことを特徴とする両面可撓性回路基板。 Another conductor layer is bonded to the other surface of the single-sided non-adhesive conductor laminate having a conductor layer formed on one surface of the base material via an adhesive layer, and has a bent portion between the end portions in the longitudinal direction. In double-sided conductor laminates,
The bent portion is
The other conductor layer is removed and the adhesive layer on the other surface of the bent portion is exposed, and the conductor layer of the one-side non-adhesive conductor laminate is provided only on one side,
The longitudinal elastic modulus of the adhesive layer is lower than the longitudinal elastic modulus of the base material,
A double-sided flexible circuit board characterized by the above.
前記接着剤の縦弾性率は、前記ベース材の縦弾性率の半分以下の弾性率であることを特徴とする請求項１記載の両面可撓性回路基板。 The double-sided flexible circuit board according to claim 1,
The double-sided flexible circuit board according to claim 1, wherein a longitudinal elastic modulus of the adhesive is an elastic modulus equal to or less than half of a longitudinal elastic modulus of the base material .
カバー材およびそれに付随する層により構成され、前記屈曲部における前記導体層の一面を覆うように設けられた第１の可撓性絶縁樹脂層と、
前記ベース材および前記接着剤により構成され、前記屈曲部における前記導体層の他面に設けられた第２の可撓性絶縁層とをそなえ、
前記第１の可撓性絶縁樹脂層を構成する各層の（使用時の温度における縦弾性率平均値×第１の可撓性絶縁樹脂層の厚み）の和をＡとし、
前記第２の可撓性絶縁層を構成する各層の（使用時の温度における縦弾性率平均値×第２の可撓性絶縁樹脂層の厚み）の和をＢとするとき、
前記第１の可撓性絶縁樹脂層が導体の内側にある場合はＡ／Ｂ＝０．６６〜２．０６であり、かつ
前記第２の可撓性絶縁樹脂層が導体の内側にある場合はＢ／Ａ＝０．６６〜２．０６である
ことを特徴とする両面可撓性回路基板。 The double-sided flexible circuit board according to claim 1,
A first flexible insulating resin layer, which is configured by a cover material and a layer associated therewith, and is provided so as to cover one surface of the conductor layer in the bent portion;
A second flexible insulating layer formed of the base material and the adhesive and provided on the other surface of the conductor layer in the bent portion;
The sum of (the longitudinal elastic modulus average value at the temperature during use × the thickness of the first flexible insulating resin layer) of each layer constituting the first flexible insulating resin layer is A,
When the sum of (longitudinal elastic modulus average value at the temperature in use × thickness of the second flexible insulating resin layer) of each layer constituting the second flexible insulating layer is B,
When the first flexible insulating resin layer is inside the conductor, A / B = 0.66 to 2.06, and when the second flexible insulating resin layer is inside the conductor B / A = 0.66 to 2.06. A double-sided flexible circuit board, wherein:
前記屈曲部が、電子機器への組み込み後の使用時に、摺動屈曲されることを特徴とする両面可撓性回路基板。 The double-sided flexible circuit board according to claim 1,
A double-sided flexible circuit board, wherein the bent portion is slidably bent when used after being incorporated into an electronic device.
前記屈曲部において露出している前記接着剤層が内側面側を向いていることを特徴とする両面可撓性回路基板。 The double-sided flexible circuit board according to claim 1,
The double-sided flexible circuit board, wherein the adhesive layer exposed at the bent portion faces the inner surface.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006135539A JP4642693B2 (en) | 2006-05-15 | 2006-05-15 | Double-sided flexible circuit board |
| TW96116522A TWI384924B (en) | 2006-05-15 | 2007-05-09 | Sided flexible circuit board |
| CN200710142160XA CN101106865B (en) | 2006-05-15 | 2007-05-15 | Double side flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006135539A JP4642693B2 (en) | 2006-05-15 | 2006-05-15 | Double-sided flexible circuit board |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007305936A JP2007305936A (en) | 2007-11-22 |
| JP2007305936A5 true JP2007305936A5 (en) | 2008-08-14 |
| JP4642693B2 JP4642693B2 (en) | 2011-03-02 |
Family
ID=38839581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006135539A Expired - Fee Related JP4642693B2 (en) | 2006-05-15 | 2006-05-15 | Double-sided flexible circuit board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4642693B2 (en) |
| CN (1) | CN101106865B (en) |
| TW (1) | TWI384924B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009096067A1 (en) * | 2008-02-01 | 2009-08-06 | Hitachi Chemical Company, Ltd. | Opto-electric hybrid board and electronic device |
| US9069128B2 (en) | 2008-11-21 | 2015-06-30 | Hitachi Chemical Company, Ltd. | Opto-electric combined circuit board and electronic devices |
| JP2011230308A (en) * | 2010-04-23 | 2011-11-17 | Panasonic Electric Works Co Ltd | Flexible copper-clad laminated sheet and flexible printed wiring board |
| US8628173B2 (en) * | 2010-06-07 | 2014-01-14 | Xerox Corporation | Electrical interconnect using embossed contacts on a flex circuit |
| CN107230429B (en) * | 2017-06-08 | 2019-06-25 | 武汉天马微电子有限公司 | Flexible module and flexible display panel |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0673391B2 (en) * | 1987-08-12 | 1994-09-14 | 住友電気工業株式会社 | Flexible double-sided circuit board manufacturing method |
| JP2753740B2 (en) * | 1989-08-31 | 1998-05-20 | 日本メクトロン株式会社 | Method of manufacturing flexible circuit board |
| JP4860185B2 (en) * | 2005-05-31 | 2012-01-25 | 日本メクトロン株式会社 | Flexible circuit board |
-
2006
- 2006-05-15 JP JP2006135539A patent/JP4642693B2/en not_active Expired - Fee Related
-
2007
- 2007-05-09 TW TW96116522A patent/TWI384924B/en active
- 2007-05-15 CN CN200710142160XA patent/CN101106865B/en not_active Expired - Fee Related
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