JP2005167135A - Method for forming conductive pattern, method for forming wiring, method for manufacturing semiconductor device, method for manufacturing circuit board, method for manufacturing electronic component, conductive pattern, wiring, semiconductor device, circuit board, electronic component, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for inexpensively forming a conductive pattern with less facility investment. <P>SOLUTION: The surface of a core member 12 formed by a photo-fabrication technique is plated for its conduction. Using conductive resin (polymer material such as pyrrole exhibiting a metal conductivity or insulating resin such as acryl having conductive fine particles incorporated therein) as the material of the core member, an arbitrary shape of a three-dimensional pattern can be formed only by a core member forming step (photo-fabrication step). <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a conductive pattern forming method, a wiring forming method, a semiconductor device manufacturing method, a circuit board manufacturing method, an electronic component manufacturing method, and a conductive pattern, wiring, semiconductor device, circuit board, electronic component, electronic Regarding equipment.

Conventionally, a three-dimensional pattern such as a hollow wiring has been formed by MEMS technology or its application technology such as etching of a sacrificial layer (for example, Patent Documents 1 to 3).
JP 11-354717 A JP 2000-269327 A JP 2001-185821 A

However, since any of the above methods uses photolithography technology, the capital investment for the process is large and the flow time of the process is long. In addition, a three-dimensional pattern (for example, a hollow wiring) formed by the MEMS technique is vulnerable to an impact or the like, and has a problem in terms of reliability.
The present invention has been made in view of such circumstances, and a conductive pattern forming method, a wiring forming method, a semiconductor device manufacturing method, and a circuit board manufacturing method capable of forming a pattern inexpensively with little capital investment. An object of the present invention is to provide a method for manufacturing an electronic component, and further to provide a conductive pattern, a wiring, a semiconductor device, a circuit board, an electronic component, and an electronic device that can obtain high reliability against an impact or the like. To do.

In order to solve the above problems, the conductive pattern forming method of the present invention includes a step of forming a core material of a pattern on a substrate by an optical modeling technique and a step of forming a conductive material on the surface of the core material by a plating technique. It is characterized by comprising.
In this method, since only the stereolithography machine and the plating apparatus are used (that is, the capital investment is small), the product can be provided at low cost. In particular, in this method, since an arbitrary three-dimensional shape can be obtained by the optical modeling technique, it is easy to add an additional structure such as a resistor or a capacitor, and the degree of freedom in device design is very high. In addition, this method does not require a mask as used in the conventional photolithography technique, and the manufacturing conditions are stable, so that there is an advantage that it is excellent in manufacturing a small variety of products. Furthermore, the conductive pattern formed by this method is resistant to impact and the like and has a high reliability because the core material is formed of resin. Conversely, by actively utilizing the elastic force of such a resin, a stress relaxation function and an elastic deformation function (including a spring structure) can be imparted to the pattern itself.

  In the conductive pattern obtained by this method, since the conductive path is formed only on the surface portion of the pattern, the resistance is slightly larger than the conventional one (the conductive path is formed by the entire pattern), When this conductive pattern is used, for example, for high-frequency transmission, electrical conduction occurs only on the surface portion of the pattern (skin effect), so there is no particular problem.

Moreover, the manufacturing method of the conductive pattern of this invention forms a predetermined pattern on a board | substrate with an optical modeling technique using electroconductive resin.
In this method, it is not necessary to separately form a conductive material on the surface of the resin, so that a desired pattern can be obtained more easily. Further, in the conductive pattern thus obtained, the conductive path is formed over the entire pattern, so that better electrical characteristics can be obtained than in the above-described configuration in which the conductive path is formed only in the pattern surface layer portion. As the above-described conductive resin, for example, a polymer material exhibiting metal conductivity such as pyrrole can be used. Alternatively, a material obtained by kneading conductive fine particles in an insulating polymer material such as acrylic may be used.

The conductive pattern forming method of the present invention is a method of forming a conductive pattern electrically connected to the conductive layer on the conductive layer, and the pattern main body is formed on the conductive layer by stereolithography. A step of integrally forming a first core portion having a shape and a second core portion for connecting the first core portion and the conductive layer; and the first core portion by a plating technique. And a step of forming a conductive material on the surface of the core material including the second core portion.
According to this method, since the conductive pattern can be directly formed without forming the interlayer insulating film on the conductive layer, the parasitic capacitance generated between the conductive layer and the pattern main body can be sufficiently reduced. For this reason, when this structure is applied to a multilayer wiring, an ideal wiring form called a so-called hollow wiring having no interlayer insulating film between the wirings can be realized. Normally, sufficient mechanical strength cannot be obtained with such a hollow wiring, but the pattern formed by this method is composed of a resin core material, so unlike a conductive pattern made of only a conventional inorganic material, Even if there is no reinforcing material (interlayer insulating film or the like) between the pattern body and the conductive layer, it is not easily damaged.

Further, the conductive pattern forming method of the present invention is a method of forming a conductive pattern electrically connected to the conductive layer on the conductive layer, wherein the above-mentioned method is performed by stereolithography using a conductive resin. A first conductive part serving as a pattern body and a second conductive part serving as a connection plug for connecting the first conductive part and the conductive layer are integrally formed on the conductive layer. To do.
In this method, it is not necessary to separately form a conductive material on the surface of the resin, so that a three-dimensional pattern such as a hollow wiring can be more easily formed.

The wiring forming method, the semiconductor device manufacturing method, the circuit board manufacturing method, and the electronic component manufacturing method according to the present invention each include a wiring, a semiconductor device, a circuit board, An electronic component is formed or manufactured.
Thereby, these members and parts can be provided more inexpensively.

In addition, the conductive pattern of the present invention includes a resin-made core material having a three-dimensional shape and a conductive material covering the surface of the core material.
In the present invention, since the core material of the conductive pattern is made of resin, a highly reliable pattern can be obtained with respect to impact or the like. On the contrary, it is possible to impart a stress relaxation function and an elastic deformation function to the conductive pattern by positively utilizing the elastic force of the resin.

The conductive pattern of the present invention is a conductive pattern electrically connected to the conductive layer, and connects the first core portion forming the pattern body, and the first core portion and the conductive layer. And a second core part formed integrally with a resin core material and a conductive material covering the surface of the core material.
In this configuration, since the core material of the conductive pattern is made of resin, sufficient mechanical strength can be obtained. For this reason, a space (that is, an air layer) is formed between the conductive layer and the conductive pattern, and the parasitic capacitance between them can be reduced.

Moreover, the wiring, semiconductor device, circuit board, electronic component, and electronic device of the present invention are characterized by including the above-described conductive pattern.
As a result, it is possible to provide members, parts, and equipment with high mechanical reliability.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In the present invention, a pattern core material is formed by stereolithography, and the surface of the core material is plated to make it conductive.
FIG. 1 is a process diagram showing an example of a method for forming an electric pattern of the present invention. In all the drawings below, the film thicknesses and dimensional ratios of the constituent elements are appropriately changed in order to make the drawings easy to see.

  In this example, first, as shown in FIG. 1A, a substrate 10 to be a pattern formation target is prepared. Various materials can be selected for the substrate 10 according to the purpose. For example, a light-transmitting material such as glass is selected when light transmission is required, and a resin material or the like is selected when flexibility is required. When forming a semiconductor element, a semiconductor substrate such as a silicon wafer is selected. Further, the substrate 10 may be a multilayer wiring board, a circuit board, an IC chip or the like in which a plurality of conductive films (wiring layers) and an insulating film are laminated in advance. In this example, a case will be described in which the substrate 10 is an IC chip having electrodes or lands (conductive layers) 11 on the surface, and rearrangement wiring is formed on the conductive layer 11 of the IC chip 10.

  As described above, in the present invention, as shown in FIG. 1B, a three-dimensional resin core 12 is formed on the substrate 10 by an optical modeling technique. The core material 12 is formed by integrating a first core portion 12a having a shape of a wiring main body (pattern main body) and a second core portion 12b for connecting the first core portion 12a and the conductive layer 11 together. In preparation. In this example, a third core portion 12c having a terminal electrode or land shape can be integrally provided at the end portion of the first core portion 12a as necessary.

Such a core material 12 can be formed by an optical modeling apparatus as shown in FIG. In FIG. 2, the optical modeling apparatus 100 includes a laser light source 101, a substrate supporting stage 102, and a microdispenser 103 for discharging a resin R as a core material onto the substrate 10. This stereolithography apparatus 100 can form a core material having an arbitrary shape by selectively curing a predetermined portion of the resin layer by laser irradiation.
Here, as the resin R, any of a photocurable resin (photosensitive resin) and a thermosetting resin can be used. In this example, an insulating photosensitive resin (photocurable resin) such as acrylic is used. The output wavelength and output intensity of the laser light source 101 are optimally set according to the curing characteristics (photoreaction characteristics and thermal reaction characteristics) of the resin R.

  The stage 102 is provided so as to be movable in the X-axis direction and the Y-axis direction while supporting the substrate 10, and the substrate 10 is movable with respect to the light beam emitted from the light source 101 by the movement of the stage 102. Yes. The stage 102 can also move in the Z-axis direction. Here, an optical system (not shown) is disposed between the light source 101 and the substrate 10 supported by the stage 102. The stage 102 that supports the substrate 10 moves in the Z-axis direction so that the position of the substrate 10 with respect to the focal point of the optical system can be adjusted. The light beam emitted from the light source 101 irradiates the substrate 10 supported by the stage 102.

Next, a specific procedure for forming the core material will be described with reference to FIG.
First, as shown in FIG. 3A, a resin layer R1 is formed in a predetermined region on the substrate by the microdispenser 103, and a laser beam having a predetermined beam diameter is partially irradiated to the resin layer R1. To do. Thereby, as shown in FIG. 3B, the resin layer R1 is partially cured corresponding to the laser irradiation region, and the second core portion 12b is formed by the cured resin layer.

Next, the first core portion 12a is formed on the resin layer R1 by the same procedure as that for forming the second core portion 12b. That is, the resin layer R2 is formed on the resin layer R1 (including the second core portion 12b) by the microdispenser 103, and the resin layer in a predetermined region including the region where the second core portion 12b is formed by laser irradiation. R2 is selectively cured. By this step, the first core portion 12a made of a cured resin is formed integrally with the second core portion 12b on the first resin layer R1.
And after forming the 2nd core part 12b and the 1st core part 12 in order from a lower layer side in this way, the resin layer of an unhardened part is removed by image development processing. As a result, a core material having a three-dimensional shape is formed on the substrate 10. In addition, when forming the 3rd core part 12c on the 1st core part 12a, the 2nd core part 12b and the 1st core part 12a were formed after the process of FIG.3 (d). The same procedure as above may be repeated.

Returning to FIG. 1, the process after the core material is formed will be described.
When the core material 12 is formed as shown in FIG. 3, a conductive material is formed on the surface of the core material 12 by a plating technique. Specifically, a catalyst such as palladium chloride is formed on the surface of the core material 12 by a liquid phase method (dip method, droplet discharge method, etc.), and a conductive thin film (conductive material) 13 is deposited by electroless plating (FIG. 1 (c)).

As described above, on the conductive layer 11, the first conductive portion 14 a serving as a wiring main body (pattern main body), and the second plug serving as a connection plug for connecting the first conductive portion 14 a and the conductive layer 11. The wiring 1 integrally including the conductive portion 14b is formed. This wiring 1 has a so-called hollow wiring structure in which an interlayer insulating film or the like is not disposed on the lower layer side of the first conductive portion 14a which is a wiring body (that is, an air layer is formed under the wiring body), so that the wiring 1 is ideal. Electrical characteristics can be obtained. Normally, sufficient mechanical strength cannot be obtained with such a hollow wiring, but the wiring core of this example is made of a resin, so that the pattern body is different from the conventional conductive pattern made of only inorganic materials. Even if there is no reinforcing material (interlayer insulating film or the like) between the conductive layer and the conductive layer, it is not easily damaged.
In the wiring 1 formed in this way, as shown in FIG. 1D, solder bumps 20 are formed on the terminal electrodes or lands 13a formed at the ends of the wiring, and externally connected via the bumps 20. It is electrically connected to the element.

As described above, according to the present invention, since only the optical modeling machine and the plating apparatus are used (that is, the capital investment is small), the product can be provided at low cost. In addition, this method does not require a mask as used in the conventional photolithography technique, and the manufacturing conditions are stable, so that there is an advantage that it is excellent in manufacturing a small variety of products.
Moreover, since the core material is formed of resin, the conductive pattern formed by this method is resistant to impact and the like and has a high reliability. Conversely, by actively utilizing the elastic force of such a resin, a stress relaxation function and an elastic deformation function (including a spring structure) can be imparted to the pattern itself. Examples of the form in which the elastic force of such a resin is effectively exhibited include the following.

  FIG. 4 is a cross-sectional view showing the main structure of a probe card 2 which is an example of an electronic component manufactured using the method for forming a conductive pattern of the present invention. The probe card 2 is a stylus instrument for inspecting electrical characteristics of a semiconductor device, a liquid crystal device or the like, and includes a probe substrate 10 having a terminal electrode (conductive layer) 11 and an inspection needle formed on the electrode 11. As a probe 17. A through electrode (not shown) is formed on the probe substrate 10 at a position where the electrode 11 is formed, and the probe 17 is connected to the probe 17 from the inspection apparatus body (tester) arranged on the back side of the substrate via the through electrode and the electrode 11. On the other hand, an inspection signal is supplied.

  The probe 17 includes a first conductive portion 17a which is a probe main body (pattern main body), a second conductive portion 17b which is a connection plug for connecting the first conductive portion 17a and the electrode 11, and these A third conductive portion 17c that connects the first conductive portion 17a and the second conductive portion 17b is provided. For example, the first conductive portion 17a and the second conductive portion 17b are formed by the same procedure as the method for forming the wiring 1 shown in FIG. That is, first, a resin core material 15 having a three-dimensional shape is formed on the substrate 10 using an optical modeling technique. At this time, the core material 15 includes, for example, a first core portion 15a having the shape of the probe main body 17a, a second core portion 15b for connecting the first core portion 15a and the electrode 11, and these A third core portion 15c for connecting the core portions 15a and 15b is formed in order from the lower layer side. Then, the first core portion 15a, the second core portion 15b, and the third core portion 15c (that is, the core material 15) integrally formed by this process are plated so that the surface of the core material 15 is Cover with conductive material 16.

Since the core material of the probe 17 of this example is made of resin, the probe 17 has a structure rich in elasticity as compared with a conventional probe in which an inspection needle is simply embedded in a substrate. For this reason, when the inspection needle 17a is brought into contact with the terminal portion of the semiconductor device or the liquid crystal device, the second conductive layer 17c, which is a connecting portion between the inspection needle 17a and the connection plug 17b, is elastically deformed, Stress can be relaxed (stress relaxation function). As described above, according to this example, it is possible to obtain a high-accuracy inspection because good adhesion can be obtained between the terminals to be measured without damaging the terminals to be measured. In addition, since an extremely flexible structure can be obtained, there is less possibility that the probe 17 will be damaged by the impact at the time of contact with the counterpart terminal.
In addition, as an example in which the elastic force of the resin is effectively exhibited, for example, a movable mirror device used in DMD or the like can be cited. By forming such an element by the method of the present invention, high performance and low cost of the device can be achieved.

  Further, in the method for forming a conductive pattern of the present invention, an arbitrary three-dimensional shape can be obtained by the optical modeling technique. For example, by forming a part of the wiring 18 in a spiral shape as shown in FIG. It is also easy to add a structure such as (17 indicates a core material of the wiring 3). Of course, a capacitor can be formed by overlapping flat wirings, and a resistance portion can be formed. As described above, according to the present invention, the degree of freedom of device design is also greatly increased, and it is possible to improve the functionality of the device.

Next, a circuit board and an electronic device including a wiring or a semiconductor device having a conductive pattern according to the present invention will be described.
FIG. 6 is a perspective view showing a schematic configuration of an embodiment of the circuit board of the present invention. As shown in FIG. 6, on the circuit board 5 of this embodiment, a semiconductor device 4 in which an IC chip having the above-described rearrangement wiring is three-dimensionally mounted is mounted. The circuit board 5 is made of an organic substrate such as a glass epoxy board, for example, and a wiring pattern (not shown) made of, for example, copper or the like is formed so as to form a desired circuit, and electrode pads ( (Not shown) is connected. Then, the solder balls of the interposer substrate in the semiconductor device 4 are electrically connected to the electrical pads, so that the semiconductor device 4 is mounted on the circuit board 5. In addition, it is also possible to form the wiring pattern which comprises a circuit with the method of this invention.

FIG. 7 is a perspective view showing a schematic configuration of a mobile phone as an embodiment of the electronic apparatus of the present invention. As shown in FIG. 7, the cellular phone 6 includes the IC chip or the circuit board 5 inside the casing.
Note that the electronic device is not limited to the mobile phone described above, and can be applied to various electronic devices. For example, notebook computers, liquid crystal projectors, multimedia-compatible personal computers (PCs) and engineering workstations (EWS), pagers, word processors, TVs, viewfinder type or monitor direct view type video tape recorders, electronic notebooks, electronic desks The present invention can be applied to electronic devices such as a computer, a car navigation device, a POS terminal, and a device having a touch panel.

The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples.
For example, in the present embodiment, an example in which the method for forming a conductive pattern of the present invention is applied to a method for forming an electrode or wiring or a method for forming an electronic component has been described. However, it goes without saying that the present invention can be applied to a method for manufacturing various devices having a conductive pattern, such as a semiconductor device or a circuit board, thereby making it more suitable than a three-dimensional structure formed using conventional MEMS technology. A highly reliable structure can be formed at low cost. In this case, a planar pattern can be formed, but the effect of the present invention can be more effectively exhibited by forming a three-dimensional pattern.
In the conductive pattern obtained by this method, since the conductive path is formed only on the surface portion of the pattern, the resistance is slightly larger than the conventional one (the conductive path is formed by the entire pattern), When this conductive pattern is used, for example, for high-frequency transmission, electrical conduction occurs only on the surface portion of the pattern (skin effect), so there is no particular problem.

  In the above embodiment, the conductive pattern is formed by plating the surface of the insulating core material. However, if the core material itself exhibits conductivity, such a plating process is not necessary. . For example, the core material is formed of a polymer material exhibiting metal conductivity such as pyrrole or formed by kneading conductive fine particles in an insulating polymer material such as acrylic. The conductive pattern can be formed only by the forming process. Further, in the conductive pattern thus obtained, the conductive path is formed over the entire pattern, so that better electrical characteristics can be obtained than in the above-described configuration in which the conductive path is formed only in the pattern surface layer portion.

FIG. 5 is a process diagram showing a wiring forming method as an example of a conductive pattern forming method of the present invention. The schematic diagram which shows schematic structure of the optical modeling apparatus used suitably for the formation method of an electroconductive pattern similarly. Process drawing which shows an example of the formation process of the core material of a conductive pattern equally. The fragmentary sectional view which shows an example of the electronic component of this invention. The top view and sectional drawing which show an example of the wiring structure of this invention. The perspective view which shows an example of the circuit board of this invention. FIG. 14 is a perspective view illustrating an example of an electronic device of the invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Wiring (conductive pattern), 2 ... Electronic component, 3 ... Wiring (conductive pattern), 5 ... Circuit board, 6 ... Electronic device, 10 ... Board, 11 ... -Conductive layer, 12 ... core material, 12a, 15a ... first core portion, 12b, 15b ... second core portion, 12c, 15c ... third core portion, 13, 16 ... Conductive material, 14a, 17a ... 1st conductive part, 14b, 17b ... 2nd conductive part, 14c, 17c ... 3rd conductive part, 17 ... Probe (conductive pattern) ), 18 ... inductor (conductive pattern), R, R1, R2 ... resin

Claims (15)

Forming the core material of the pattern on the substrate by stereolithography technology;
And a step of forming a conductive material on the surface of the core material by a plating technique.   A method for forming a conductive pattern, wherein a predetermined pattern is formed on a substrate by an optical modeling technique using a conductive resin. A method of forming a conductive pattern electrically connected to the conductive layer on the conductive layer,
A first core part that forms the shape of the pattern main body and a second core part for connecting the first core part and the conductive layer are integrally formed on the conductive layer by an optical modeling technique. Process,
A method for forming a conductive pattern, comprising: a step of forming a conductive material on a surface of a core material including the first core portion and the second core portion by a plating technique. A method of forming a conductive pattern electrically connected to the conductive layer on the conductive layer,
A first conductive part that becomes a pattern body on the conductive layer, and a second plug that becomes a connection plug for connecting the first conductive part and the conductive layer by an optical modeling technique using a conductive resin. A conductive pattern forming method, wherein the conductive portion is integrally formed.   A method of forming a wiring, comprising forming a wiring by using the conductive pattern formed by the method according to claim 1.   A method of manufacturing a semiconductor device, comprising: manufacturing a semiconductor device using the conductive pattern formed by the method according to claim 1.   A circuit board is manufactured using the conductive pattern formed by the method of any one of Claims 1-4, The manufacturing method of a circuit board characterized by the above-mentioned.   The manufacturing method of an electronic component characterized by manufacturing an electronic component using the conductive pattern formed by the method of any one of Claims 1-4.   A conductive pattern comprising a resin-made core material having a three-dimensional shape and a conductive material covering the surface of the core material. A conductive pattern electrically connected to the conductive layer,
A resin core material in which a first core portion forming the shape of a pattern body and a second core portion for connecting the first core portion and the conductive layer are integrally formed;
A conductive pattern comprising a conductive material covering the surface of the core material.   A wiring comprising the conductive pattern according to claim 9.   A semiconductor device comprising the conductive pattern according to claim 9.   A circuit board comprising the conductive pattern according to claim 9.   An electronic component comprising the conductive pattern according to claim 9.   An electronic apparatus comprising the conductive pattern according to claim 9.

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