WO2007064138A1 - Electromagnetic waves and static electricity screening structure at circuit - Google Patents

Electromagnetic waves and static electricity screening structure at circuit Download PDF

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Publication number
WO2007064138A1
WO2007064138A1 PCT/KR2006/005079 KR2006005079W WO2007064138A1 WO 2007064138 A1 WO2007064138 A1 WO 2007064138A1 KR 2006005079 W KR2006005079 W KR 2006005079W WO 2007064138 A1 WO2007064138 A1 WO 2007064138A1
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Prior art keywords
circuit
board
electromagnetic waves
static electricity
thin film
Prior art date
Application number
PCT/KR2006/005079
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French (fr)
Inventor
Younhee Choi
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Younhee Choi
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Publication of WO2007064138A1 publication Critical patent/WO2007064138A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Definitions

  • the present invention relates to a structure for screening electromagnetic waves and static electricity on a circuit, wherein a metallic thin film layer is coated on a surface of an insulation film or board with a conductive circuit such as various kinds of PCB (Printed Circuit Board), FPCB (Flexible Printed Circuit Board), RFPCB (Rigid Flexible Printed Circuit Board), TCP (Tape Carrier Package) and COF (Chip On Film) for use in notebook computers, PDAs, small video cameras, compact cameras, electronic schedulers, LCD/OLED/PDP modules and cellular phones printed or buried therein and a ground portion of a circuit using a sputtering device, so that a ground region can be expanded to enhance grounding performance and the electromagnetic waves and static electricity are screened to prevent the resultant radiation and noise from occurring.
  • a conductive circuit such as various kinds of PCB (Printed Circuit Board), FPCB (Flexible Printed Circuit Board), RFPCB (Rigid Flexible Printed Circuit Board), TCP (Tape Carrier Package
  • printed circuit boards are used to support various kinds of components on an original printed circuit board or connect the components in accordance with a circuit design of electric wirings.
  • the printed circuit boards are generally compared to neural circuits of electronic products.
  • the RFPCB comprises first and second rigid boards 240 and 260 formed respectively at both sides thereof and a flexible substrate 220 that is a connection portion for connecting the first and second rigid boards 240 and 260 to each other.
  • an object of the present invention is to provide a structure for screening electromagnetic waves and static electricity on a circuit, wherein a metallic thin film layer (several tens to several hundreds of nanometers) is formed on a surface of an insulation film or board with a conductive circuit such as PCB, FPCB, RFPCB, TCP or COF printed or buried therein and a ground portion of a circuit using a sputtering device, so that a ground region can be expanded and the circuit can be surrounded by the metal thin film in order to screen the electromagnetic waves and static electricity for the prevention of occurrence of resultant radiation and noise and to enhance the durability of FPCB while maintaining the flexibility thereof.
  • a metallic thin film layer severe tens to several hundreds of nanometers
  • a structure for screening electromagnetic waves and static electricity at a circuit wherein a metallic thin film layer is coated in a single layer or multiple layers on a surface of an insulation film or board with a conductive circuit such as PCB, FPCB, RFPCB, TCP or COF printed or buried therein and a ground portion of a circuit using a sputtering device, so that a ground region can be expanded to enhance grounding performance, and electromagnetic waves and static electricity can be screened to prevent resultant radiation and noise from occurring at the circuit.
  • a conductive circuit such as PCB, FPCB, RFPCB, TCP or COF
  • the metal thin film layer is formed of any one metal selected from the group consisting of gold, silver, copper, nickel, aluminum, stainless steel, titanium, molybdenum and indium, or an alloy of at least two or more metals.
  • a metallic thin film layer is coated on a surface of an insulation film or board with a conductive circuit such as PCB, FPCB, RFPCB, TCP or COF printed or buried therein and a ground portion of a circuit, using a sputtering device.
  • a ground region can be expanded to enhance a grounding performance, the electromagnetic waves and static electricity can be screened to prevent resultant radiation and noise from occurring at the circuit.
  • the present invention can be used in manufacturing electronic devices such as various kinds of LCD/OLED/PDP modules and cellular phones, and can provide superior conductivity and grounding performance, uniform coating characteristics and extended life span. Further, failures due to film stripping and cracking can be prevented while maintaining flexibility of the insulation film Brief Description of the Drawings
  • Fig. 1 is a perspective view showing a conventional rigid flexible printed circuit board.
  • Fig. 2 is a perspective view showing a rigid flexible printed circuit board to which the present invention is applied.
  • Fig. 3 is a longitudinal sectional view of the rigid flexible printed circuit board according to the present invention.
  • Fig. 4 is a cross-sectional view of the rigid flexible printed circuit board according to the present invention.
  • Fig. 5 is a longitudinal sectional view showing a flexible board of the rigid flexible printed circuit board according to the present invention on which a multilayer metal thin film is formed.
  • Fig. 6 is a cross-sectional view showing the flexible board of the rigid flexible printed circuit board according to the present invention on which a multilayer metal thin film is formed.
  • FIG. 7 is an exemplary view showing another embodiment of the present invention.
  • FIG. 8 is an exemplary view showing a further embodiment of the present invention.
  • Fig. 2 is a perspective view of a rigid flexible printed circuit board (RFPCB) according to a first embodiment of the present invention.
  • the RFPCB comprises first and second rigid boards 240 and 260 formed at both sides thereof, a flexible board 220 for connecting the first and second rigid boards 240 and 260 to each other, and metal thin film layers 250 coated on top and bottom surfaces of the flexible board 220 through a sputtering device.
  • Figs. 3 and 4 are longitudinal sectional and cross-sectional views of the rigid flexible printed circuit board according to the present invention, respectively.
  • the flexible circuit 220 is configured in such a manner that copper foils 222a and 222b patterned into a predetermined conductive circuit are formed respectively on top and bottom surfaces of a polyimide layer 221 made of an insulation film; coverlays 223a and 223b made of an insulation film for protecting a surface circuit of the flexible board 220 are formed respectively on top and bottom surfaces of the copper foils 222a and 222b throughout the entire printed circuit board; prepregs are formed respectively on top and bottom surfaces of the coverlays 223 a and 223b to form the first and second rigid boards 240 and 260; and one or more circuit layers 243 are formed respectively on top and bottom surfaces of the prepregs 242a and 242b, and the metal thin film layers 250 are then coated on the top and bottom surfaces of the coverlays 223a and 223b made of the insulation film in the flexible board 220 through a sputtering device.
  • each of the metal thin film layers 250 formed on the surface of the flexible board 220 should be formed to slightly overlap ground regions of a circuit which are either plated with metal such as gold or copper or electrically connected and are exposed on the first and second rigid boards 240 and 260.
  • Figs. 5 and 6 are longitudinal sectional and cross-sectional views showing a rigid flexible printed circuit board with a multilayer metal thin film formed on a flexible board thereof according to the present invention.
  • Multilayer metal thin film layers 250 are formed on top and bottom surfaces of coverlays 223a and 223b made of an insulation film in a flexible board 220.
  • each of the metal thin film layers 250 formed on the surface of the flexible board 220 should be formed to slightly overlap ground regions of a circuit which are either plated with metal such as gold or copper or electrically connected and are exposed on the first and second rigid boards 240 and 260.
  • a rigid flexible printed circuit board refers to a board in which a rigid board (MLB) and a flexible board (FPCB) are structurally coupled with each other such that a rigid portion and a flexible portion can be connected to each other without an additional connector.
  • the RFPCB can solve a component space problem, secure connection reliability in a connector portion and improve a component mounting characteristic since such a connector is not utilized in this RFPCB.
  • a flexible printed circuit board (FPCB) has been developed to cope with the tendency that electronic products are miniaturized and complicated.
  • the FPCB has superior thermal, bending and chemical resistances and a small change in size.
  • the aforementioned flexible printed circuit board is classified into a single-face structure, a double-face structure, a multi-face structure and a double-face exposure structure.
  • the flexible printed circuit board is used for signal connection to a place where continuous repetition movement of a bent portion is required and functions as an interface.
  • the flexible printed circuit board comprises polyimides, coverlays and adhesives, and is mainly utilized in cellular phones, LCD/OLED/PDP modules, camera batteries, HDDs and printers.
  • a second embodiment of the present invention is configured in such a manner that connectors 109 are formed on the top and bottom of a board 110 formed with an insulation film on a surface thereof and a chip 107 is formed at a central portion of the board 110.
  • a metal thin film layer 250 is coated on a surface of the board 110 except where the chip 107 and connectors 109 are formed, so that electromagnetic waves and static electricity can be screened.
  • the metal thin film layer 250 formed on the surface of the board 110 should be formed to slightly overlap a ground region of a circuit, which is either plated with metal such as gold or copper or electrically connected and is exposed on the circuit.
  • metal thin film layers 250 are coated on front and rear surfaces of a flexible board (FPCB or RFPCB) 220 formed with an insulation film on a surface thereof such that electromagnetic waves and static electricity can be screened.
  • FPCB or RFPCB flexible board
  • a gold layer 250 was formed on gold-plated circuit ground regions of first and second rigid boards 240 and 260 and a surface of a flexible board 220 of the FPCB for use in mobile devices at a thickness of 150 nm such that it overlap the surface of the flexible board 220 and the ground regions of the rigid boards 240 and 260 by 0.3 mm. As a result, it has been measured that real characteristics of EMI and ESD was improved.
  • the ESD characteristics have been measured in a state where electric impact with an intensity of 5 to 15 kV is applied in a contact or non-contact mode using an electronic gun, and the EMI characteristics have been measured by measuring a radiation value of the structure mounted into a finished cellular phone.
  • Table 1 illustrates measurement results of ESD and EMI before and after the present invention is applied.
  • portions coated on the surface of an insulation film or board and the circuit grounds may be formed on a top surface, a bottom surface, top/bottom surfaces, top/ bottom/left/right surfaces or the like according to the characteristics of printed circuit boards and semiconductor packages.

Abstract

The present invention relates to a structure for screening electromagnetic waves and static electricity on a circuit, wherein a metallic thin film layer is coated on a surface of an insulation film or board with a conductive circuit such as PCB, FPCB, RFPCB, TCP or COF printed or buried therein and a ground portion of a circuit using a sputtering device, so that a ground region can be expanded to enhance grounding performance and electromagnetic waves and static electricity can be screened to prevent resultant radiation and noise from occurring.

Description

Description
ELECTROMAGNETIC WAVES AND STATIC ELECTRICITY SCREENING STRUCTURE AT CIRCUIT
Technical Field
[1] The present invention relates to a structure for screening electromagnetic waves and static electricity on a circuit, wherein a metallic thin film layer is coated on a surface of an insulation film or board with a conductive circuit such as various kinds of PCB (Printed Circuit Board), FPCB (Flexible Printed Circuit Board), RFPCB (Rigid Flexible Printed Circuit Board), TCP (Tape Carrier Package) and COF (Chip On Film) for use in notebook computers, PDAs, small video cameras, compact cameras, electronic schedulers, LCD/OLED/PDP modules and cellular phones printed or buried therein and a ground portion of a circuit using a sputtering device, so that a ground region can be expanded to enhance grounding performance and the electromagnetic waves and static electricity are screened to prevent the resultant radiation and noise from occurring. Background Art
[2] In general, printed circuit boards are used to support various kinds of components on an original printed circuit board or connect the components in accordance with a circuit design of electric wirings. The printed circuit boards are generally compared to neural circuits of electronic products.
[3] Various kinds of electronic devices such as LCD/OLED/PDP modules, various kinds of notebook computers, PDAs, small video cameras, compact cameras, electronic schedulers and cellular phones, which utilize the aforementioned PCB, FPCB, RFPCB, COF, TCP and the like, have had their compact, thin, high-technology and various design characteristics with the advancement of a micromachining technology for mounting components, a space optimization technique and a high- density and high-integrated mounting technology.
[4] A structure of a rigid flexible printed circuit board (RFPCB), which is generally known as using such a technology, will be discussed. As shown in Fig. 1, the RFPCB comprises first and second rigid boards 240 and 260 formed respectively at both sides thereof and a flexible substrate 220 that is a connection portion for connecting the first and second rigid boards 240 and 260 to each other.
[5] However, since electromagnetic waves and static electricity are produced by themselves in various kinds of modules and electronic devices, penetrate into the modules and electronic devices from the outside, or are introduced along circuit lines connected to the modules and electronic devices due to the aforementioned compactness, thinness and diversity of the modules and electronic devices, the electromagnetic waves and static electricity generate resultant radiation and noise or cause many damages to electronic devices, which results in failure. Disclosure of Invention
Technical Problem
[6] The present invention is conceived to solve the aforementioned problem in the prior art. Accordingly, an object of the present invention is to provide a structure for screening electromagnetic waves and static electricity on a circuit, wherein a metallic thin film layer (several tens to several hundreds of nanometers) is formed on a surface of an insulation film or board with a conductive circuit such as PCB, FPCB, RFPCB, TCP or COF printed or buried therein and a ground portion of a circuit using a sputtering device, so that a ground region can be expanded and the circuit can be surrounded by the metal thin film in order to screen the electromagnetic waves and static electricity for the prevention of occurrence of resultant radiation and noise and to enhance the durability of FPCB while maintaining the flexibility thereof. Technical Solution
[7] According to an aspect of the present invention for achieving the object, there is provided a structure for screening electromagnetic waves and static electricity at a circuit, wherein a metallic thin film layer is coated in a single layer or multiple layers on a surface of an insulation film or board with a conductive circuit such as PCB, FPCB, RFPCB, TCP or COF printed or buried therein and a ground portion of a circuit using a sputtering device, so that a ground region can be expanded to enhance grounding performance, and electromagnetic waves and static electricity can be screened to prevent resultant radiation and noise from occurring at the circuit.
[8] Preferably, the metal thin film layer is formed of any one metal selected from the group consisting of gold, silver, copper, nickel, aluminum, stainless steel, titanium, molybdenum and indium, or an alloy of at least two or more metals.
Advantageous Effects
[9] According to the present invention, a metallic thin film layer is coated on a surface of an insulation film or board with a conductive circuit such as PCB, FPCB, RFPCB, TCP or COF printed or buried therein and a ground portion of a circuit, using a sputtering device. Thus, a ground region can be expanded to enhance a grounding performance, the electromagnetic waves and static electricity can be screened to prevent resultant radiation and noise from occurring at the circuit. Accordingly, the present invention can be used in manufacturing electronic devices such as various kinds of LCD/OLED/PDP modules and cellular phones, and can provide superior conductivity and grounding performance, uniform coating characteristics and extended life span. Further, failures due to film stripping and cracking can be prevented while maintaining flexibility of the insulation film Brief Description of the Drawings
[10] Fig. 1 is a perspective view showing a conventional rigid flexible printed circuit board. [11] Fig. 2 is a perspective view showing a rigid flexible printed circuit board to which the present invention is applied. [12] Fig. 3 is a longitudinal sectional view of the rigid flexible printed circuit board according to the present invention. [13] Fig. 4 is a cross-sectional view of the rigid flexible printed circuit board according to the present invention. [14] Fig. 5 is a longitudinal sectional view showing a flexible board of the rigid flexible printed circuit board according to the present invention on which a multilayer metal thin film is formed. [15] Fig. 6 is a cross-sectional view showing the flexible board of the rigid flexible printed circuit board according to the present invention on which a multilayer metal thin film is formed.
[16] Fig. 7 is an exemplary view showing another embodiment of the present invention.
[17] Fig. 8 is an exemplary view showing a further embodiment of the present invention.
Mode for the Invention [18] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. [19] Fig. 2 is a perspective view of a rigid flexible printed circuit board (RFPCB) according to a first embodiment of the present invention. The RFPCB comprises first and second rigid boards 240 and 260 formed at both sides thereof, a flexible board 220 for connecting the first and second rigid boards 240 and 260 to each other, and metal thin film layers 250 coated on top and bottom surfaces of the flexible board 220 through a sputtering device. [20] The metal thin film layers formed on the top and bottom surfaces of the flexible board 220 should be formed to slightly overlap ground regions of a circuit which are plated with metal such as gold or copper and exposed on the first and second rigid boards 240 and 260. [21] Since the sputtering device is well known in the art, detailed descriptions thereof will be omitted herein. [22] Figs. 3 and 4 are longitudinal sectional and cross-sectional views of the rigid flexible printed circuit board according to the present invention, respectively. The flexible circuit 220 is configured in such a manner that copper foils 222a and 222b patterned into a predetermined conductive circuit are formed respectively on top and bottom surfaces of a polyimide layer 221 made of an insulation film; coverlays 223a and 223b made of an insulation film for protecting a surface circuit of the flexible board 220 are formed respectively on top and bottom surfaces of the copper foils 222a and 222b throughout the entire printed circuit board; prepregs are formed respectively on top and bottom surfaces of the coverlays 223 a and 223b to form the first and second rigid boards 240 and 260; and one or more circuit layers 243 are formed respectively on top and bottom surfaces of the prepregs 242a and 242b, and the metal thin film layers 250 are then coated on the top and bottom surfaces of the coverlays 223a and 223b made of the insulation film in the flexible board 220 through a sputtering device.
[23] At this time, each of the metal thin film layers 250 formed on the surface of the flexible board 220 should be formed to slightly overlap ground regions of a circuit which are either plated with metal such as gold or copper or electrically connected and are exposed on the first and second rigid boards 240 and 260.
[24] Further, Figs. 5 and 6 are longitudinal sectional and cross-sectional views showing a rigid flexible printed circuit board with a multilayer metal thin film formed on a flexible board thereof according to the present invention. Multilayer metal thin film layers 250 are formed on top and bottom surfaces of coverlays 223a and 223b made of an insulation film in a flexible board 220. At this time, each of the metal thin film layers 250 formed on the surface of the flexible board 220 should be formed to slightly overlap ground regions of a circuit which are either plated with metal such as gold or copper or electrically connected and are exposed on the first and second rigid boards 240 and 260.
[25] Meanwhile, a rigid flexible printed circuit board (RFPCB) refers to a board in which a rigid board (MLB) and a flexible board (FPCB) are structurally coupled with each other such that a rigid portion and a flexible portion can be connected to each other without an additional connector. The RFPCB can solve a component space problem, secure connection reliability in a connector portion and improve a component mounting characteristic since such a connector is not utilized in this RFPCB.
[26] Further, a flexible printed circuit board (FPCB) has been developed to cope with the tendency that electronic products are miniaturized and complicated. The FPCB has superior thermal, bending and chemical resistances and a small change in size.
[27] The aforementioned flexible printed circuit board is classified into a single-face structure, a double-face structure, a multi-face structure and a double-face exposure structure. The flexible printed circuit board is used for signal connection to a place where continuous repetition movement of a bent portion is required and functions as an interface. The flexible printed circuit board comprises polyimides, coverlays and adhesives, and is mainly utilized in cellular phones, LCD/OLED/PDP modules, camera batteries, HDDs and printers.
[28] As shown in Fig. 7, a second embodiment of the present invention is configured in such a manner that connectors 109 are formed on the top and bottom of a board 110 formed with an insulation film on a surface thereof and a chip 107 is formed at a central portion of the board 110. A metal thin film layer 250 is coated on a surface of the board 110 except where the chip 107 and connectors 109 are formed, so that electromagnetic waves and static electricity can be screened.
[29] At this time, the metal thin film layer 250 formed on the surface of the board 110 should be formed to slightly overlap a ground region of a circuit, which is either plated with metal such as gold or copper or electrically connected and is exposed on the circuit.
[30] Further, as shown in Fig. 8, metal thin film layers 250 are coated on front and rear surfaces of a flexible board (FPCB or RFPCB) 220 formed with an insulation film on a surface thereof such that electromagnetic waves and static electricity can be screened.
[31] Each of the metal thin film layers 250 formed on the surface of the flexible board
220 should be formed to slightly overlap a ground region of a circuit, which is either plated with metal such as gold or copper or electrically connected and is exposed on the circuit.
[32] Characteristics of a structure for screening electromagnetic waves and static electricity at a circuit according to the present invention have been tested as follows.
[33] A gold layer 250 was formed on gold-plated circuit ground regions of first and second rigid boards 240 and 260 and a surface of a flexible board 220 of the FPCB for use in mobile devices at a thickness of 150 nm such that it overlap the surface of the flexible board 220 and the ground regions of the rigid boards 240 and 260 by 0.3 mm. As a result, it has been measured that real characteristics of EMI and ESD was improved.
[34] At this time, the ESD characteristics have been measured in a state where electric impact with an intensity of 5 to 15 kV is applied in a contact or non-contact mode using an electronic gun, and the EMI characteristics have been measured by measuring a radiation value of the structure mounted into a finished cellular phone.
[35] Table 1 illustrates measurement results of ESD and EMI before and after the present invention is applied.
[36] Table 1
Figure imgf000006_0001
Figure imgf000007_0001
[37] Meanwhile, in order to effectively screen electromagnetic waves and static electricity, portions coated on the surface of an insulation film or board and the circuit grounds may be formed on a top surface, a bottom surface, top/bottom surfaces, top/ bottom/left/right surfaces or the like according to the characteristics of printed circuit boards and semiconductor packages.
[38] In the accompanying drawings, the thicknesses of layers and regions are exaggerated for easy understanding of the present invention.
[39] The foregoing is merely an exemplary embodiment of a structure for screening electromagnetic waves and static electricity on a circuit according to the present invention. Thus, the present invention is not limited thereto. Although the present invention has been described in detail in connection with the preferred embodiments, it will be readily understood by those skilled in the art that various modifications and changes can be made thereto within the technical spirit and scope of the present invention. It is also apparent that the modifications and changes fall within the scope of the present invention defined by the appended claims.

Claims

Claims
[1] A structure for screening electromagnetic waves and static electricity on a circuit, wherein a metallic thin film layer is coated on a surface of an insulation film or board with a conductive circuit such as PCB, FPCB, RFPCB, TCP or COF printed or buried therein and a ground portion of a circuit using a sputtering device to overlap the surface of the film or board and the ground region of a circuit at a predetermined interval.
[2] The structure as claimed in claim 1, wherein the metal thin film layer is formed in multiple layers.
[3] The structure as claimed in claim 1 or 2, wherein the metal thin film layer is formed of any one material selected from the group consisting of gold, silver, copper, aluminum, chromium, nickel, stainless steel, titanium, molybdenum and indium, or an alloy of at least two or more metals.
PCT/KR2006/005079 2005-11-29 2006-11-29 Electromagnetic waves and static electricity screening structure at circuit WO2007064138A1 (en)

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KR20-2005-0033664 2005-11-29

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KR100762787B1 (en) 2007-03-16 2007-10-02 주식회사 에프엔텍 Both faces flexible pcb touch pad

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US20040106001A1 (en) * 2001-09-28 2004-06-03 Kovacs Alan L. Multilayer thin film hydrogen getter and internal signal EMI shield for complex three dimensional electronic package components
JP2004039981A (en) * 2002-07-05 2004-02-05 Hitachi Chem Co Ltd Emi shield film and manufacturing method therefor
US20040033384A1 (en) * 2002-08-17 2004-02-19 Funkenbusch Arnold William Durable transparent EMI shielding film
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US8624130B2 (en) 2008-12-16 2014-01-07 Continental Automotive Gmbh Circuit board having grown metal layer in a flexible zone

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