JP2005166938A - ダイ接合材形成装置 - Google Patents
ダイ接合材形成装置 Download PDFInfo
- Publication number
- JP2005166938A JP2005166938A JP2003403485A JP2003403485A JP2005166938A JP 2005166938 A JP2005166938 A JP 2005166938A JP 2003403485 A JP2003403485 A JP 2003403485A JP 2003403485 A JP2003403485 A JP 2003403485A JP 2005166938 A JP2005166938 A JP 2005166938A
- Authority
- JP
- Japan
- Prior art keywords
- bonding material
- semiconductor die
- substrate
- semiconductor
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
【解決手段】 基板2に実装された半導体ダイ3上に、吹付け手段24によって液状の接合材原料4cを吹き付け、当該液状の接合材原料4cを変性手段25によって所望の接合材組成に変性させて半導体ダイ3上に接合材4を形成する。液状の接合材原料4cの吹付けエリアの認識は、認識手段23による画像処理等で行なう。
【選択図】図1
Description
22 作業台
23 認識手段
24 変性手段
24 吹付け手段
25 変性手段
Claims (3)
- 基板上又は該基板に実装された半導体ダイ上に、液状の接合材原料を微小な粒状態で吹き付ける吹付け手段と、前記基板上又は該基板に実装された半導体ダイ上で液状の接合材原料を所望の接合材組成に変性させて接合材を形成する変性手段とを備えたダイ接合材形成装置。
- 前記吹付け手段が、インクジェット機構である請求項1に記載のダイ接合材形成装置。
- 前記基板上又は該基板に実装された半導体ダイ上の吹付けエリアを認識する認識手段を備えた請求項1又は2に記載のダイ接合材形成装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003403485A JP2005166938A (ja) | 2003-12-02 | 2003-12-02 | ダイ接合材形成装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003403485A JP2005166938A (ja) | 2003-12-02 | 2003-12-02 | ダイ接合材形成装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2005166938A true JP2005166938A (ja) | 2005-06-23 |
Family
ID=34726780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003403485A Pending JP2005166938A (ja) | 2003-12-02 | 2003-12-02 | ダイ接合材形成装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2005166938A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011233598A (ja) * | 2010-04-23 | 2011-11-17 | Toshiba Corp | 半導体装置の製造方法および半導体製造装置 |
JP2013060597A (ja) * | 2007-10-11 | 2013-04-04 | Hitachi Chemical Co Ltd | 接着剤付きウエハ、接着剤組成物及び接着剤付きウエハの製造方法 |
WO2017163503A1 (ja) * | 2016-03-23 | 2017-09-28 | 日東電工株式会社 | 加熱接合用シート、ダイシングテープ付き加熱接合用シート、及び、接合体の製造方法、パワー半導体装置 |
-
2003
- 2003-12-02 JP JP2003403485A patent/JP2005166938A/ja active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013060597A (ja) * | 2007-10-11 | 2013-04-04 | Hitachi Chemical Co Ltd | 接着剤付きウエハ、接着剤組成物及び接着剤付きウエハの製造方法 |
JP2011233598A (ja) * | 2010-04-23 | 2011-11-17 | Toshiba Corp | 半導体装置の製造方法および半導体製造装置 |
WO2017163503A1 (ja) * | 2016-03-23 | 2017-09-28 | 日東電工株式会社 | 加熱接合用シート、ダイシングテープ付き加熱接合用シート、及び、接合体の製造方法、パワー半導体装置 |
JP2017171981A (ja) * | 2016-03-23 | 2017-09-28 | 日東電工株式会社 | 加熱接合用シート、ダイシングテープ付き加熱接合用シート、及び、接合体の製造方法、パワー半導体装置 |
CN109070230A (zh) * | 2016-03-23 | 2018-12-21 | 日东电工株式会社 | 加热接合用片材、带有切割带的加热接合用片材、及接合体的制造方法、功率半导体装置 |
US10748866B2 (en) | 2016-03-23 | 2020-08-18 | Nitto Denko Corporation | Thermal bonding sheet, thermal bonding sheet with dicing tape, bonded body production method, and power semiconductor device |
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