JP2005166779A

JP2005166779A - Composite circuit substrate and flexible circuit substrate

Info

Publication number: JP2005166779A
Application number: JP2003401157A
Authority: JP
Inventors: Kazuhiro Hayakawa; 和宏早川
Original assignee: Nissan Motor Co Ltd
Current assignee: Nissan Motor Co Ltd
Priority date: 2003-12-01
Filing date: 2003-12-01
Publication date: 2005-06-23

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a conductor pattern, a conductive material of a flexible circuit substrate from being cracked even when the flexible circuit substrate is flexed to a rigid circuit substrate. <P>SOLUTION: A composite circuit substrate includes a conductor pattern 3 formed on an insulating plate 2 of the rigid circuit substrate 1, a protective film 4 formed on the conductor pattern 3, a plurality of lands 15 formed near the end of the rigid circuit substrate 1, a conductor pattern 7 formed on a base film 6 of the flexible circuit substrate 5, a protective film 8 formed on the conductor pattern 7, a plurality of lands 9 formed near the end 5a of the flexible circuit substrate 1, a bent part 10 provided at the land 9 part, a bent part 11 provided between the bent part 10 and the end 5a of the flexible circuit substrate 5, and the land 15 connected to the land 9 by a solder 12. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明はリジッド回路基板とフレキシブル回路基板とをはんだ等の導電材料により接合した複合回路基板およびフレキシブル回路基板に関するものである。 The present invention relates to a composite circuit board and a flexible circuit board in which a rigid circuit board and a flexible circuit board are joined by a conductive material such as solder.

従来の複合回路基板においては、特許文献１、２に示されるように、余剰はんだによるブリッジを防止するために、リジッド回路基板側またはフレキシブル回路基板側に余剰はんだの逃げスペースを設けている。 In the conventional composite circuit board, as shown in Patent Documents 1 and 2, a surplus solder escape space is provided on the rigid circuit board side or the flexible circuit board side in order to prevent bridging due to excess solder.

特開平８−１３８７７４号公報JP-A-8-138774 特開２００２−５０８６３号公報JP 2002-50863 A

しかし、このような複合回路基板においては、フレキシブル回路基板をリジッド回路基板に対して屈曲させて、フレキシブル回路基板をリジッド回路基板の上方に位置させたときに、リジッド回路基板とフレキシブル回路基板との接合部に応力が発生して、フレキシブル回路基板の導体パターン、はんだにクラックが生じてしまう。 However, in such a composite circuit board, when the flexible circuit board is bent with respect to the rigid circuit board and the flexible circuit board is positioned above the rigid circuit board, the rigid circuit board and the flexible circuit board Stress is generated at the joint, and the conductor pattern and solder of the flexible circuit board are cracked.

本発明は上述の課題を解決するためになされたもので、フレキシブル回路基板をリジッド回路基板に対して屈曲させたときにも、フレキシブル回路基板の導体パターン、導電材料にクラックが生するのを防止することができる複合回路基板、フレキシブル回路基板を提供することを目的とする。 The present invention has been made to solve the above-described problems, and prevents the generation of cracks in the conductive pattern and conductive material of the flexible circuit board even when the flexible circuit board is bent with respect to the rigid circuit board. An object of the present invention is to provide a composite circuit board and a flexible circuit board that can be used.

この目的を達成するため、本発明においては、フレキシブル回路基板の第２のランド部に第１の折り曲げ部を設け、上記フレキシブル回路基板の上記第１の折り曲げ部と上記リジッド回路基板側の端部との間に第２の折り曲げ部を設ける。 In order to achieve this object, in the present invention, a first bent portion is provided in the second land portion of the flexible circuit board, and the first bent portion of the flexible circuit board and the end portion on the rigid circuit board side are provided. A second bent portion is provided between the two.

本発明に係る複合回路基板、フレキシブル回路基板においては、フレキシブル回路基板のリジッド回路基板側とは反対側がリジッド回路基板に対して傾斜するから、フレキシブル回路基板をリジッド回路基板に対して屈曲させたときにも、フレキシブル回路基板の導体パターン、導電材料にクラックが生ずるのを防止することができる。 In the composite circuit board and the flexible circuit board according to the present invention, when the flexible circuit board is bent with respect to the rigid circuit board, the side opposite to the rigid circuit board side of the flexible circuit board is inclined with respect to the rigid circuit board. In addition, cracks can be prevented from occurring in the conductor pattern and conductive material of the flexible circuit board.

（第１の実施の形態）
図１は本発明に係る複合回路基板、フレキシブル回路基板を示す正断面図、図２は図１に示した複合回路基板、フレキシブル回路基板を示す概略平面図である。図に示すように、リジッド回路基板１の絶縁板２に導体パターン３が形成され、導体パターン３上に保護膜４が形成され、リジッド回路基板１の端部の近傍に導体パターン３が露出した複数の第１のランド１５が形成されている。また、フレキシブル回路基板５のベースフィルム６に導体パターン７が形成され、導体パターン７上に保護膜８が形成され、フレキシブル回路基板１のリジッド回路基板１側の端部５ａの近傍に導体パターン７が露出した複数の第２のランド９が形成されている。また、ランド９部に第１の折り曲げ部１０が設けられ、折り曲げ部１０ではベースフィルム６の表面のなす角が１８０°よりも小さくなっている。また、フレキシブル回路基板５の折り曲げ部１０と端部５ａとの間に第２の折り曲げ部１１が設けられ、第２の折り曲げ部１１の折り曲げ方向は折り曲げ部１０の折り曲げ方向とは反対方向である。また、ランド１５とランド９とがはんだ１２により接合されている。 (First embodiment)
FIG. 1 is a front sectional view showing a composite circuit board and a flexible circuit board according to the present invention, and FIG. 2 is a schematic plan view showing the composite circuit board and the flexible circuit board shown in FIG. As shown in the figure, the conductor pattern 3 is formed on the insulating plate 2 of the rigid circuit board 1, the protective film 4 is formed on the conductor pattern 3, and the conductor pattern 3 is exposed near the end of the rigid circuit board 1. A plurality of first lands 15 are formed. In addition, a conductor pattern 7 is formed on the base film 6 of the flexible circuit board 5, a protective film 8 is formed on the conductor pattern 7, and the conductor pattern 7 is formed in the vicinity of the end 5 a on the rigid circuit board 1 side of the flexible circuit board 1. A plurality of second lands 9 are formed. Moreover, the 1st bending part 10 is provided in the land 9 part, and the angle | corner which the surface of the base film 6 makes in the bending part 10 is smaller than 180 degrees. A second bent portion 11 is provided between the bent portion 10 and the end portion 5 a of the flexible circuit board 5, and the bent direction of the second bent portion 11 is opposite to the bent direction of the bent portion 10. . Further, the land 15 and the land 9 are joined by the solder 12.

つぎに、図１、図２に示した複合回路基板の製造方法を図３により説明する。まず、図３(ａ)に示すように、折り曲げ治具、プレス加工装置などを使用してフレキシブル回路基板５に折り曲げ部１０、１１を設けたのち、ランド１５にはんだ１２を設け、ランド１５とランド９とを位置合わせする。つぎに、図３(ｂ)に示すように、幅が折り曲げ部１０と折り曲げ部１１との距離よりも小さい熱圧着ツール１３を使用してランド１５、９を熱圧着することにより、ランド１５とランド９とをはんだ１２により接合する。この場合、端部５ａがリジッド回路基板１に接触し、弾性力を生み、端部５ａが支点となってリジッド回路基板１に反発するようにランド９部が浮き上がり、またフレキシブル回路基板５のリジッド回路基板１側とは反対側がリジッド回路基板１に対して傾斜する。 Next, a method of manufacturing the composite circuit board shown in FIGS. 1 and 2 will be described with reference to FIG. First, as shown in FIG. 3A, after bending portions 10 and 11 are provided on the flexible circuit board 5 using a bending jig, a press working device, etc., solder 12 is provided on the land 15, The land 9 is aligned. Next, as shown in FIG. 3B, the lands 15 and 9 are bonded by thermocompression bonding using the thermocompression bonding tool 13 whose width is smaller than the distance between the bent portion 10 and the bent portion 11. The land 9 is joined with the solder 12. In this case, the end portion 5 a comes into contact with the rigid circuit board 1 to generate elasticity, and the land 9 portion is lifted so that the end portion 5 a acts as a fulcrum and repels the rigid circuit board 1, and the rigid circuit board 5 is rigid. The side opposite to the circuit board 1 side is inclined with respect to the rigid circuit board 1.

すなわち、図１、図２に示した複合回路基板は、フレキシブル回路基板５に折り曲げ部１０、１１を設け、ランド１５にはんだ１２を設け、ランド１５とランド９とを位置合わせし、ランド１５、９を熱圧着ツール１３により熱圧着することにより、ランド１５とランド９とをはんだ１２により接合したものである。 That is, in the composite circuit board shown in FIGS. 1 and 2, the flexible circuit board 5 is provided with the bent portions 10 and 11, the land 15 is provided with the solder 12, the land 15 and the land 9 are aligned, and the land 15, The land 15 and the land 9 are joined by the solder 12 by thermocompression bonding 9 with the thermocompression bonding tool 13.

この複合回路基板、フレキシブル回路基板においては、フレキシブル回路基板５のリジッド回路基板１側とは反対側がリジッド回路基板１に対して傾斜するから、図４に示すように、フレキシブル回路基板５をリジッド回路基板１に対して屈曲させて、フレキシブル回路基板５をリジッド回路基板１の上方に位置させたときにも、フレキシブル回路基板５のはんだ１２による接合部の導体パターン７、はんだ１２にクラックが生するのを防止することができる。また、ランド１５、９を熱圧着ツール１３により熱圧着するときに、リジッド回路基板１に反発するようにランド９部が浮き上がるから、余剰はんだの逃げるスペースができるので、余剰はんだによるブリッジを防止することができ、しかもフィレット形状が両端均等に大きく形成されるので、接続強度が大きくなる。また、端部５ａがリジッド回路基板１に弾性力をもって接触しているから、振動時に異音が発生することがなく、また作業工程などで端部５ａを引っ掛けてフレキシブル回路基板５を剥がす可能性が小さくなる。さらに、フレキシブル回路基板５のリジッド回路基板１側とは反対側がリジッド回路基板１に対して傾斜しており、かつフィレット形状が大きく形成されるから、はんだ１２による接合部を簡単に目視することができるので、接合品質の外観判断を容易に行なうことができる。 In this composite circuit board and flexible circuit board, the side opposite to the rigid circuit board 1 side of the flexible circuit board 5 is inclined with respect to the rigid circuit board 1, so that the flexible circuit board 5 is made into a rigid circuit as shown in FIG. Even when the flexible circuit board 5 is bent with respect to the board 1 and positioned above the rigid circuit board 1, cracks occur in the conductor pattern 7 and the solder 12 in the joint portion of the flexible circuit board 5 with the solder 12. Can be prevented. Further, when the lands 15 and 9 are thermocompression-bonded by the thermocompression bonding tool 13, the land 9 part is lifted so as to repel the rigid circuit board 1, so that a space for surplus solder to escape is created, thereby preventing bridging by surplus solder. In addition, since the fillet shape is formed to be equally large at both ends, the connection strength is increased. Further, since the end portion 5a is in contact with the rigid circuit board 1 with elasticity, no abnormal noise is generated during vibration and the flexible circuit board 5 may be peeled off by hooking the end portion 5a in a work process or the like. Becomes smaller. Furthermore, since the opposite side of the flexible circuit board 5 to the rigid circuit board 1 is inclined with respect to the rigid circuit board 1 and the fillet shape is formed large, it is possible to easily visually check the joint portion by the solder 12. Therefore, it is possible to easily determine the appearance of the bonding quality.

なお、図５に示すように、折り曲げ部１１と端部５ａとの間に第３の折り曲げ部１４を設け、折り曲げ部１４の折り曲げ方向を折り曲げ部１１の折り曲げ方向とは反対方向にしてもよい。 In addition, as shown in FIG. 5, the 3rd bending part 14 may be provided between the bending part 11 and the edge part 5a, and the bending direction of the bending part 14 may be made into the opposite direction to the bending direction of the bending part 11. As shown in FIG. .

（第２の実施の形態）
図６は本発明に係る他の複合回路基板、フレキシブル回路基板を示す断面図である。図に示すように、フレキシブル回路基板２１のベースフィルム２２に導体パターン２３が形成され、導体パターン２３上に保護膜２４が形成され、フレキシブル回路基板２１のリジッド回路基板１側の端部２１ａの近傍に導体パターン２３が露出した複数の第２のランド２５が形成されている。また、ランド２５部に折り曲げ部２９が設けられ、折り曲げ部２９ではベースフィルム２２の表面のなす角が１８０°よりも小さくなっている。また、フレキシブル回路基板２１の折り曲げ部２９よりも端部２１ａ側に半円状曲げ部２６が設けられ、半円状曲げ部２６ではベースフィルム２２が外側となっている。また、ランド１５とランド２５とがはんだ２７により接合されている。 (Second Embodiment)
FIG. 6 is a sectional view showing another composite circuit board and flexible circuit board according to the present invention. As shown in the drawing, a conductor pattern 23 is formed on the base film 22 of the flexible circuit board 21, a protective film 24 is formed on the conductor pattern 23, and the vicinity of the end 21 a of the flexible circuit board 21 on the rigid circuit board 1 side. A plurality of second lands 25 where the conductor pattern 23 is exposed are formed. Further, a bent portion 29 is provided in the land 25 portion, and the angle formed by the surface of the base film 22 is smaller than 180 ° in the bent portion 29. Moreover, the semicircular bending part 26 is provided in the edge part 21a side rather than the bending part 29 of the flexible circuit board 21, and the base film 22 is the outer side in the semicircular bending part 26. FIG. Further, the land 15 and the land 25 are joined by solder 27.

つぎに、図６に示した複合回路基板の製造方法を図７により説明する。まず、図７(ａ)に示すように、湾曲した金型を有するプレス加工装置などを使用してフレキシブル回路基板２１に折り曲げ部２９、半円状曲げ部２６を設けたのち、ランド１５にはんだ２７を設け、ランド１５とランド２５とを位置合わせする。つぎに、図７(ｂ)に示すように、ランド１５、２５を熱圧着ツール２８により熱圧着することにより、ランド１５とランド２５とをはんだ２７により接合する。この場合、端部２１ａがリジッド回路基板１に接触し、弾性力を生み、端部２１ａが支点となってリジッド回路基板１に反発するようにランド２５部が浮き上がり、またフレキシブル回路基板２１のリジッド回路基板１側とは反対側がリジッド回路基板１に対して傾斜する。 Next, a method of manufacturing the composite circuit board shown in FIG. 6 will be described with reference to FIG. First, as shown in FIG. 7A, a bent portion 29 and a semicircular bent portion 26 are provided on the flexible circuit board 21 by using a press working apparatus having a curved mold, and then soldered on the land 15. 27 and the land 15 and the land 25 are aligned. Next, as shown in FIG. 7B, the lands 15 and 25 are bonded by the solder 27 by thermocompression bonding of the lands 15 and 25 with the thermocompression bonding tool 28. In this case, the end 21 a comes into contact with the rigid circuit board 1 to generate elasticity, and the land 25 part is lifted so that the end 21 a acts as a fulcrum and repels the rigid circuit board 1, and the rigid circuit board 21 is rigid. The side opposite to the circuit board 1 side is inclined with respect to the rigid circuit board 1.

すなわち、図６に示した複合回路基板は、フレキシブル回路基板５に折り曲げ部２９、半円状曲げ部２６を設け、ランド１５にはんだ２７を設け、ランド１５とランド２５とを位置合わせし、ランド１５、２５を熱圧着ツール２８により熱圧着することにより、ランド１５とランド２５とをはんだ２７により接合したものである。 That is, in the composite circuit board shown in FIG. 6, the flexible circuit board 5 is provided with the bent portion 29 and the semicircular bent portion 26, the land 15 is provided with the solder 27, the land 15 and the land 25 are aligned, The lands 15 and 25 are joined by solder 27 by thermocompression bonding 15 and 25 with a thermocompression bonding tool 28.

この複合回路基板、フレキシブル回路基板においては、フレキシブル回路基板２１のリジッド回路基板１側とは反対側がリジッド回路基板１に対して傾斜するから、フレキシブル回路基板２１をリジッド回路基板１に対して屈曲させて、フレキシブル回路基板２１をリジッド回路基板１の上方に位置させたときにも、フレキシブル回路基板２１のはんだ２７による接合部の導体パターン２３、はんだ２７にクラックが生するのを防止することができる。また、ランド１５、２５を熱圧着ツール１３により熱圧着するときに、リジッド回路基板１に反発するようにランド２５部が浮き上がるから、余剰はんだの逃げるスペースができるので、余剰はんだによるブリッジを防止することができ、しかもはんだ２７のフィレット形状が両端均等に大きく形成されるので、接続強度が大きくなる。また、端部２１ａがリジッド回路基板１に弾性力をもって接触しているから、振動時に異音が発生することがなく、また作業工程などで端部２１ａを引っ掛けてフレキシブル回路基板２１を剥がす可能性が小さくなる。さらに、フレキシブル回路基板２１のリジッド回路基板１側とは反対側がリジッド回路基板１に対して傾斜しており、かつはんだ２７のフィレット形状が大きく形成されるから、はんだ２７による接合部を簡単に目視することができるので、接合品質の外観判断を容易に行なうことができる。また、フレキシブル回路基板２１に半円状曲げ部２６が設けられているから、フレキシブル回路基板２１の断線の可能性を小さくすることができる。 In this composite circuit board and flexible circuit board, since the opposite side of the flexible circuit board 21 to the rigid circuit board 1 is inclined with respect to the rigid circuit board 1, the flexible circuit board 21 is bent with respect to the rigid circuit board 1. Thus, even when the flexible circuit board 21 is positioned above the rigid circuit board 1, it is possible to prevent cracks from occurring in the conductor pattern 23 and solder 27 of the joint portion by the solder 27 of the flexible circuit board 21. . Further, when the lands 15 and 25 are thermocompression bonded by the thermocompression bonding tool 13, the land 25 part is lifted so as to repel the rigid circuit board 1, so that a space for excess solder to escape is created, thereby preventing bridging due to excess solder. In addition, since the fillet shape of the solder 27 is formed to be equally large at both ends, the connection strength is increased. Further, since the end portion 21a is in contact with the rigid circuit board 1 with elasticity, no abnormal noise is generated during vibration, and the end portion 21a may be hooked and peeled off in a work process or the like. Becomes smaller. Further, since the opposite side of the flexible circuit board 21 to the rigid circuit board 1 is inclined with respect to the rigid circuit board 1 and the fillet shape of the solder 27 is formed large, the joint portion by the solder 27 can be easily visually observed. Therefore, it is possible to easily determine the appearance of the bonding quality. Moreover, since the semicircular bending part 26 is provided in the flexible circuit board 21, the possibility of disconnection of the flexible circuit board 21 can be reduced.

（第３の実施の形態）
図８は本発明に係る他の複合回路基板、フレキシブル回路基板を示す断面図である。図に示すように、フレキシブル回路基板３１のベースフィルム３２に導体パターン３３が形成され、導体パターン３３上に保護膜３４が形成され、フレキシブル回路基板３１のリジッド回路基板１側の端部３１ａの近傍に導体パターン７が露出した複数の第２のランド３５が形成されている。また、ランド３５部に折り曲げ部３６が設けられ、折り曲げ部３６ではベースフィルム３２の表面のなす角が１８０°よりも小さくなっている。また、ランド１５とランド３５とがはんだ３７により接合されている。 (Third embodiment)
FIG. 8 is a sectional view showing another composite circuit board and flexible circuit board according to the present invention. As shown in the figure, a conductor pattern 33 is formed on the base film 32 of the flexible circuit board 31, a protective film 34 is formed on the conductor pattern 33, and the vicinity of the end 31a of the flexible circuit board 31 on the rigid circuit board 1 side. A plurality of second lands 35 in which the conductor pattern 7 is exposed are formed. Further, a bent portion 36 is provided in the land 35 portion, and the angle formed by the surface of the base film 32 is smaller than 180 ° in the bent portion 36. Further, the land 15 and the land 35 are joined by solder 37.

つぎに、図８に示した複合回路基板の製造方法を図９により説明する。まず、図９(ａ)に示すように、折り曲げ治具、プレス加工装置などを使用してフレキシブル回路基板３１に折り曲げ部３６を設けたのち、ランド１５にはんだ３７を設け、ランド１５とランド３５とを位置合わせする。つぎに、図９(ｂ)に示すように、ランド１５、３５を熱圧着ツール３８により熱圧着することにより、ランド１５とランド３５とをはんだ３７により接合する。この場合、熱圧着ツール３８によりフレキシブル回路基板３１の端部３１ａ側が熱圧着ツール３８により押され、フレキシブル回路基板３１のランド３５部よりも端部３１ａ側がリジッド回路基板１に接近するから、フレキシブル回路基板３１のリジッド回路基板１側とは反対側がリジッド回路基板１に対して傾斜する。 Next, a method of manufacturing the composite circuit board shown in FIG. 8 will be described with reference to FIG. First, as shown in FIG. 9A, after a bending portion 36 is provided on the flexible circuit board 31 using a bending jig, a press working device, etc., solder 37 is provided on the land 15, and the land 15 and the land 35 are provided. And align. Next, as shown in FIG. 9B, the lands 15 and 35 are bonded by the solder 37 by thermocompression bonding of the lands 15 and 35 by the thermocompression bonding tool 38. In this case, the end portion 31a side of the flexible circuit board 31 is pushed by the thermocompression bonding tool 38 by the thermocompression bonding tool 38, and the end portion 31a side comes closer to the rigid circuit board 1 than the land 35 portion of the flexible circuit board 31. The side opposite to the rigid circuit board 1 side of the substrate 31 is inclined with respect to the rigid circuit board 1.

すなわち、図８に示した複合回路基板は、フレキシブル回路基板３１に折り曲げ部３６を設け、ランド１５にはんだ３７を設け、ランド１５とランド３５とを位置合わせし、ランド１５、３５を熱圧着ツール３８により熱圧着することにより、ランド１５とランド３５とをはんだ３７により接合したものである。 That is, in the composite circuit board shown in FIG. 8, the flexible circuit board 31 is provided with the bent portion 36, the land 15 is provided with the solder 37, the land 15 and the land 35 are aligned, and the lands 15 and 35 are attached to the thermocompression bonding tool. The land 15 and the land 35 are joined by the solder 37 by thermocompression bonding with 38.

この複合回路基板、フレキシブル回路基板においては、フレキシブル回路基板３１のリジッド回路基板１側とは反対側がリジッド回路基板１に対して傾斜するから、フレキシブル回路基板３１をリジッド回路基板１に対して屈曲させて、フレキシブル回路基板３１をリジッド回路基板１の上方に位置させたときにも、フレキシブル回路基板３１のはんだ３７による接合部の導体パターン３３、はんだ３７にクラックが生するのを防止することができる。 In this composite circuit board and flexible circuit board, the side opposite to the rigid circuit board 1 side of the flexible circuit board 31 is inclined with respect to the rigid circuit board 1, so that the flexible circuit board 31 is bent with respect to the rigid circuit board 1. Thus, even when the flexible circuit board 31 is positioned above the rigid circuit board 1, it is possible to prevent cracks from occurring in the conductor pattern 33 and the solder 37 of the joint portion by the solder 37 of the flexible circuit board 31. .

（第４の実施の形態）
図１０は本発明に係る他の複合回路基板、フレキシブル回路基板を示す断面図である。図に示すように、フレキシブル回路基板４１のベースフィルム４２に導体パターン４３が形成され、導体パターン４３上に保護膜４４が形成され、フレキシブル回路基板４１のリジッド回路基板１側の端部４１ａの近傍に導体パターン４７が露出した複数の第２のランド４５が形成されている。また、ランド４５部に折り曲げ部４９が設けられ、折り曲げ部４９ではベースフィルム４２の表面のなす角が１８０°よりも小さくなっている。また、フレキシブル回路基板４１の折り曲げ部４９よりも端部４１ａ側に半円状曲げ部４６が設けられ、半円状曲げ部４６ではベースフィルム４２が外側となっている。また、ランド１５とランド４５とがはんだ４７により接合されている。 (Fourth embodiment)
FIG. 10 is a cross-sectional view showing another composite circuit board and flexible circuit board according to the present invention. As shown in the figure, a conductor pattern 43 is formed on the base film 42 of the flexible circuit board 41, a protective film 44 is formed on the conductor pattern 43, and the vicinity of the end 41a of the flexible circuit board 41 on the rigid circuit board 1 side. A plurality of second lands 45 where the conductor pattern 47 is exposed are formed. Further, a bent portion 49 is provided in the land 45 portion, and the angle formed by the surface of the base film 42 is smaller than 180 ° in the bent portion 49. In addition, a semicircular bent portion 46 is provided on the end 41 a side of the bent portion 49 of the flexible circuit board 41, and the base film 42 is outside the semicircular bent portion 46. Further, the land 15 and the land 45 are joined by the solder 47.

つぎに、図１０に示した複合回路基板の製造方法を図１１により説明する。まず、図１１(ａ)に示すように、湾曲した金型を有するプレス加工装置などを使用してフレキシブル回路基板４１に折り曲げ部４９、半円状曲げ部４６を設けたのち、ランド１５にはんだ４７を設け、ランド１５とランド４５とを位置合わせする。つぎに、図１１(ｂ)に示すように、ランド１５、４５を熱圧着ツール４８により熱圧着することにより、ランド１５とランド４５とをはんだ４７により接合する。この場合、熱圧着ツール４８によりフレキシブル回路基板４１の端部４１ａ側が熱圧着ツール４８により押され、端部４１ａがリジッド回路基板１と接触するから、フレキシブル回路基板４１のリジッド回路基板１側とは反対側がリジッド回路基板１に対して傾斜する。 Next, a method of manufacturing the composite circuit board shown in FIG. 10 will be described with reference to FIG. First, as shown in FIG. 11 (a), a bent portion 49 and a semicircular bent portion 46 are provided on the flexible circuit board 41 by using a press working apparatus having a curved mold or the like, and then soldered on the land 15. 47 is provided, and the land 15 and the land 45 are aligned. Next, as shown in FIG. 11 (b), the lands 15 and 45 are thermocompression-bonded with a thermocompression-bonding tool 48, so that the lands 15 and the lands 45 are joined with solder 47. In this case, the end 41a side of the flexible circuit board 41 is pushed by the thermocompression bonding tool 48 by the thermocompression bonding tool 48, and the end 41a comes into contact with the rigid circuit board 1. Therefore, what is the rigid circuit board 1 side of the flexible circuit board 41? The opposite side is inclined with respect to the rigid circuit board 1.

すなわち、図１０に示した複合回路基板は、フレキシブル回路基板４１に折り曲げ部４９、半円状曲げ部４６を設け、ランド１５にはんだ４７を設け、ランド１５とランド４５とを位置合わせし、ランド１５、４５を熱圧着ツール４８により熱圧着することにより、ランド１５とランド４５とをはんだ４７により接合したものである。 That is, in the composite circuit board shown in FIG. 10, the flexible circuit board 41 is provided with the bent portion 49 and the semicircular bent portion 46, the land 15 is provided with the solder 47, the land 15 and the land 45 are aligned, The lands 15 and 45 are joined by solder 47 by thermocompression bonding 15 and 45 with a thermocompression bonding tool 48.

この複合回路基板、フレキシブル回路基板においては、フレキシブル回路基板４１のリジッド回路基板１側とは反対側がリジッド回路基板１に対して傾斜するから、フレキシブル回路基板４１をリジッド回路基板１に対して屈曲させて、フレキシブル回路基板４１をリジッド回路基板１の上方に位置させたときにも、フレキシブル回路基板４１のはんだ４７による接合部の導体パターン４３、はんだ４７にクラックが生するのを防止することができる。また、フレキシブル回路基板４１に半円状曲げ部４６が設けられているから、フレキシブル回路基板４１の断線の可能性を小さくすることができる。 In this composite circuit board and flexible circuit board, since the opposite side of the flexible circuit board 41 to the rigid circuit board 1 is inclined with respect to the rigid circuit board 1, the flexible circuit board 41 is bent with respect to the rigid circuit board 1. Thus, even when the flexible circuit board 41 is positioned above the rigid circuit board 1, it is possible to prevent cracks from occurring in the conductor pattern 43 and solder 47 of the joint portion by the solder 47 of the flexible circuit board 41. . Further, since the semicircular bent portion 46 is provided in the flexible circuit board 41, the possibility of the flexible circuit board 41 being disconnected can be reduced.

なお、本発明は以上の実施の形態に限定されるものではなく、以上の実施の形態のいずれかを組み合わせてもよい。 In addition, this invention is not limited to the above embodiment, You may combine either of the above embodiment.

また、上述実施の形態においては、導電材料としてはんだ１２等を用いたが、他の導電材料を用いてもよい。また、上述実施の形態においては、湾曲した金型を有するプレス加工装置などを使用してフレキシブル回路基板２１、４１に半円状曲げ部２６、４６を設けたが、ベースフィルム２２、４２と保護膜２４、４４の厚さ、材質などを変えることにより、プレス加工時のベースフィルム２２、４２と保護膜２４、４４との熱収縮率の相違を利用して、フレキシブル回路基板２１、４１に半円状曲げ部２６、４６を設けてもよい。 In the above embodiment, the solder 12 or the like is used as the conductive material, but other conductive materials may be used. In the above-described embodiment, the semicircular bent portions 26 and 46 are provided on the flexible circuit boards 21 and 41 using a press working apparatus having a curved mold, but the base films 22 and 42 are protected. By changing the thickness, material, and the like of the films 24 and 44, the difference in heat shrinkage between the base films 22 and 42 and the protective films 24 and 44 at the time of pressing is used, so that the flexible circuit boards 21 and 41 are semi-finished. Circular bent portions 26 and 46 may be provided.

本発明に係る複合回路基板、フレキシブル回路基板を示す正断面図である。It is a front sectional view showing a composite circuit board and a flexible circuit board according to the present invention. 図１に示した複合回路基板、フレキシブル回路基板を示す概略平面図である。FIG. 2 is a schematic plan view showing the composite circuit board and the flexible circuit board shown in FIG. 1. 図１、図２に示した複合回路基板の製造方法の説明図である。It is explanatory drawing of the manufacturing method of the composite circuit board shown in FIG. 1, FIG. 図１、図２に示した複合回路基板の使用態様を示す概略図である。It is the schematic which shows the usage condition of the composite circuit board shown to FIG. 1, FIG. 本発明に係る他の複合回路基板、フレキシブル回路基板を示す断面図である。It is sectional drawing which shows the other composite circuit board which concerns on this invention, and a flexible circuit board. 本発明に係る他の複合回路基板、フレキシブル回路基板を示す断面図である。It is sectional drawing which shows the other composite circuit board which concerns on this invention, and a flexible circuit board. 図６に示した複合回路基板の製造方法の説明図である。It is explanatory drawing of the manufacturing method of the composite circuit board shown in FIG. 本発明に係る他の複合回路基板、フレキシブル回路基板を示す断面図である。It is sectional drawing which shows the other composite circuit board which concerns on this invention, and a flexible circuit board. 図８に示した複合回路基板の製造方法の説明図である。It is explanatory drawing of the manufacturing method of the composite circuit board shown in FIG. 本発明に係る他の複合回路基板、フレキシブル回路基板を示す断面図である。It is sectional drawing which shows the other composite circuit board which concerns on this invention, and a flexible circuit board. 図１０に示した複合回路基板の製造方法の説明図である。It is explanatory drawing of the manufacturing method of the composite circuit board shown in FIG.

Explanation of symbols

１…リジッド回路基板５…フレキシブル回路基板
５ａ…端部９…第２のランド
１０…第１の折り曲げ部１１…第２の折り曲げ部
１２…はんだ１３…熱圧着ツール
１５…第１のランド２１…フレキシブル回路基板
２１ａ…端部２５…第２のランド
２６…半円状曲げ部２７…はんだ
２８…熱圧着ツール２９…折り曲げ部
３１…フレキシブル回路基板３１ａ…端部
３５…第２のランド３６…折り曲げ部
３７…はんだ３８…熱圧着ツール
４１…フレキシブル回路基板４１ａ…端部
４５…第２のランド４６…半円状曲げ部
４７…はんだ４８…熱圧着ツール
４９…折り曲げ部 DESCRIPTION OF SYMBOLS 1 ... Rigid circuit board 5 ... Flexible circuit board 5a ... End part 9 ... 2nd land 10 ... 1st bending part 11 ... 2nd bending part 12 ... Solder 13 ... Thermocompression-bonding tool 15 ... 1st land 21 ... Flexible circuit board 21a ... End 25 ... Second land 26 ... Semi-circular bent part 27 ... Solder 28 ... Thermocompression bonding tool 29 ... Bending part 31 ... Flexible circuit board 31a ... End 35 ... Second land 36 ... Bending Part 37: Solder 38 ... Thermocompression bonding tool 41 ... Flexible circuit board 41a ... End 45 ... Second land 46 ... Semicircular bending part 47 ... Solder 48 ... Thermocompression bonding tool 49 ... Bending part

Claims

In a composite circuit board in which a rigid circuit board and a flexible circuit board are joined by a conductive material, a first bent portion is provided on a second land portion of the flexible circuit board, and the first bent portion of the flexible circuit board is provided. A second bent portion having a bending direction opposite to the bending direction of the first bent portion is provided between the end portion on the rigid circuit board side, and the second land and the second of the rigid circuit board are provided. A composite circuit board, wherein one land is joined by a conductive material.

In a composite circuit board in which a rigid circuit board and a flexible circuit board are joined by a conductive material, a first bent portion is provided on a second land portion of the flexible circuit board, and the first bent portion of the flexible circuit board is provided. A conductive material is provided on the first land of the rigid circuit board between the end of the rigid circuit board and a second bent part having a folding direction opposite to the folding direction of the first bent part. The first land and the second land are aligned, and the first land and the second land are thermocompression-bonded by a thermocompression-bonding tool. A composite circuit board characterized in that:

A third bent portion having a bending direction opposite to the bending direction of the second bent portion is provided between the second bent portion of the flexible circuit board and the end portion on the rigid circuit board side. The composite circuit board according to claim 1, wherein the composite circuit board is provided.

In the composite circuit board in which the rigid circuit board and the flexible circuit board are joined by a conductive material, a bent portion is provided in the second land portion of the flexible circuit board, and the rigid circuit board side is provided with respect to the bent portion of the flexible circuit board. A composite circuit board, wherein a semicircular bent part is provided on an end side, and the second land and the first land of the rigid circuit board are joined by a conductive material.

In the composite circuit board in which the rigid circuit board and the flexible circuit board are joined by a conductive material, a bent portion is provided in the second land portion of the flexible circuit board, and the rigid circuit board side is provided with respect to the bent portion of the flexible circuit board. A semicircular bent portion is provided on the end side, a conductive material is provided on the first land of the rigid circuit board, the first land and the second land are aligned, and the first and second lands are aligned. A composite circuit board, wherein the first land and the second land are joined to each other by the conductive material by thermocompression bonding of the land with a thermocompression bonding tool.

In the composite circuit board in which the rigid circuit board and the flexible circuit board are joined by a conductive material, a bent portion is provided in the second land portion of the flexible circuit board, and the second land and the first land of the rigid circuit board are provided. And a composite circuit board characterized by being bonded together by a conductive material.

In a composite circuit board in which a rigid circuit board and a flexible circuit board are joined by a conductive material, a bent portion is provided in the second land portion of the flexible circuit board, and a conductive material is provided in the first land of the rigid circuit board, The first land and the second land are aligned with each other, and the first and second lands are thermocompression-bonded with a thermocompression-bonding tool, whereby the first land and the second land are combined with each other. A composite circuit board characterized by being joined by a conductive material.

A land is provided in the vicinity of the end portion, a first bent portion is provided in the land portion, and a bending direction between the first bent portion and the end portion is a folding direction of the first bent portion. A flexible circuit board comprising a second bent portion in the opposite direction.

9. The third bent portion having a bending direction opposite to a bending direction of the second bent portion is provided between the second bent portion and the end portion. Flexible circuit board.

A flexible circuit board, wherein a land is provided in the vicinity of an end portion, a bent portion is provided in the land portion, and a semicircular bent portion is provided between the bent portion and the end portion.

A flexible circuit board, wherein a land is provided in the vicinity of an end portion, and a bent portion is provided in the land portion.