JP2005153432A - Method for dividing ceramic substrate - Google Patents

Method for dividing ceramic substrate Download PDF

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JP2005153432A
JP2005153432A JP2003398571A JP2003398571A JP2005153432A JP 2005153432 A JP2005153432 A JP 2005153432A JP 2003398571 A JP2003398571 A JP 2003398571A JP 2003398571 A JP2003398571 A JP 2003398571A JP 2005153432 A JP2005153432 A JP 2005153432A
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ceramic substrate
dividing
resin sheet
ceramic
conveying belt
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JP4426264B2 (en
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Yasuo Manabe
八州男 真鍋
Kenji Kunihiro
謙治 國弘
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Sumitomo Metal SMI Electronics Device Inc
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Sumitomo Metal SMI Electronics Device Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for dividing a ceramic substrate which prevents the occurrence of defective division outside a dividing channel, the lack of a ceramic material, a defective burr, etc. <P>SOLUTION: The method for dividing the ceramic substrate 10, in which the ceramic substrate 10 made of aggregates formed by partitioning pieces 12 with the dividing channel 11 is mounted on a conveying belt 16 and divided into the pieces 12 while the belt 16 is moved, includes a process in which the substrate 10 is held between resin sheets 13, a process in which the substrate 10 is passed with the belt 16 between a first press roller 17 set on the upper side of the belt 16 and a second press roller 18 set before or after the press position of the first press roller 17 to press from the lower side of the belt 16 to divide along the channel 11 into the pieces 12, and a process to take out the pieces 12 from the resin sheets 13. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、複数の個片体のセラミック回路基板や、セラミックパッケージ等の集合体からなるセラミック基板から個片体のセラミック回路基板や、セラミックパッケージ等を作製するためのセラミック基板の分割方法に関する。   The present invention relates to a method of dividing a ceramic substrate for producing a single-piece ceramic circuit board, a ceramic package, or the like from a plurality of single-piece ceramic circuit boards or a ceramic substrate made of an assembly of ceramic packages or the like.

従来から、複数の個片体からなるセラミック回路基板や、セラミックパッケージ等が分割用溝で仕切られて形成されている集合体からなるセラミック基板から個片体のセラミック回路基板や、セラミックパッケージ等を作製するためには、人の手の指や、分割用の治具や、簡単な分割装置等を用い、セラミック基板に予め設けられているＶ字形状等からなる分割用溝に沿って分割することが行われている。通常、この分割は、１本の分割用溝毎に行われている（例えば、特許文献１、特許文献２、特許文献３、及び特許文献４参照）。   Conventionally, a ceramic circuit board made of a plurality of individual pieces, a ceramic board made of an assembly formed by dividing a ceramic package or the like by dividing grooves, and a single piece of ceramic circuit board, a ceramic package, etc. In order to fabricate, a finger is split along a dividing groove made of a V-shape or the like provided in advance on a ceramic substrate using a finger of a human hand, a splitting jig, a simple splitting device, or the like. Things have been done. Normally, this division is performed for each division groove (see, for example, Patent Document 1, Patent Document 2, Patent Document 3, and Patent Document 4).

セラミック基板を効率よく分割用溝に沿って分割するための装置には、複数の個片体のセラミック回路基板や、セラミックパッケージ等の集合体のセラミック基板を分割用溝に沿って一度に、又は縦方向と横方向の分割用溝に沿ってそれぞれ別々に２度に分けてセラミック基板を押圧ロールで押圧しながら分割する方法で個片体のセラミック回路基板や、セラミックパッケージ等を作製する分割装置が提案されている（例えば、特許文献５、特許文献６、特許文献７、特許文献８、及び特許文献９参照）。
特開平７−４０２９６号公報 特開平９−１８０９１５号公報 特開平１１−１０６３６号公報 特開２００２−１１６９８号公報 特開平６−１２０３６７号公報 特開平７−２８３５０９号公報 特開平９−９２７４９号公報 特開２００２−１８８３０号公報 特開２００２−１６６３９８号公報 The apparatus for efficiently dividing the ceramic substrate along the dividing groove includes a plurality of individual ceramic circuit boards and a ceramic substrate of an assembly such as a ceramic package at a time along the dividing groove, or Dividing device for producing individual ceramic circuit boards, ceramic packages, etc. by dividing the ceramic substrate while pressing it with a pressing roll separately twice along the vertical and horizontal dividing grooves. Has been proposed (see, for example, Patent Document 5, Patent Document 6, Patent Document 7, Patent Document 8, and Patent Document 9).
Japanese Patent Laid-Open No. 7-40296 JP-A-9-180915 Japanese Patent Laid-Open No. 11-10636 JP 2002-11698 A JP-A-6-120367 JP 7-283509 A JP-A-9-92749 JP 2002-18830 A JP 2002-166398 A

しかしながら、前述したような従来のセラミック基板の分割方法は、次のような問題がある。
（１）人の手の指や、分割用の治具や、簡単な分割装置等を用いるセラミック基板の分割方法は、分割処理能力が低いので、分割処理するのに多くの人手が必要となり製品となるセラミック回路基板や、セラミックパッケージ等のコストアップとなっている。また、個片体からなるセラミック回路基板や、セラミックパッケージ等は、分割処理するための時間がかかるので、セラミック回路基板や、セラミックパッケージ等を納入するための工期の遅延が発生したりしている。
（２）上下の押圧ロール間にセラミック基板を挿入して押圧したり、セラミック基板上を移動する押圧ロールで押圧したりしてセラミック基板を分割する方法は、押圧ロールが直接セラミック基板の一部分に当接して応力集中が発生する場合があるので、分割用溝から外れて分割される分割不良や、セラミックの欠け、バリ不良等が発生している。また、セラミックの欠け、バリ不良等から発生したセラミックの欠片は、セラミック基板の上に付着したり、搬送用ベルト上に飛散しセラミック基板の下に潜りこんだりして次の分割用溝や、次のセラミック基板を分割する時の新たな応力集中の要因となり、分割用溝から外れて分割される分割不良や、セラミックの欠け、バリ不良等が発生している。
本発明は、かかる事情に鑑みてなされたものであって、コストアップや、納期遅延に対応でき、分割用溝から外れて分割される分割不良や、セラミックの欠け、バリ不良等の発生を防止するセラミック基板の分割方法を提供することを目的とする。 However, the conventional method for dividing a ceramic substrate as described above has the following problems.
(1) The method of dividing a ceramic substrate using fingers of a human hand, a jig for division, a simple dividing device, etc. has a low division processing capability, and therefore requires a lot of human hands for the division processing. This increases the cost of ceramic circuit boards and ceramic packages. In addition, since it takes time to divide ceramic circuit boards and ceramic packages made of individual pieces, there is a delay in the work period for delivering ceramic circuit boards and ceramic packages. .
(2) The method of dividing the ceramic substrate by inserting and pressing the ceramic substrate between the upper and lower pressing rolls or by pressing with the pressing roll moving on the ceramic substrate is such that the pressing roll is directly applied to a part of the ceramic substrate. Since there is a case where stress concentration occurs due to contact, divisional defects that are separated from the dividing grooves, chipping of ceramics, defective burrs, and the like are generated. In addition, ceramic fragments generated due to chipping of ceramics, defective burrs, etc. adhere on the ceramic substrate, scatter on the conveyor belt and sink under the ceramic substrate, and the next dividing groove, This becomes a factor of new stress concentration when the next ceramic substrate is divided, resulting in a division failure that is separated from the division groove, a chipping of the ceramic, a burr failure, or the like.
The present invention has been made in view of such circumstances, and can cope with an increase in cost and delay in delivery, and prevents the occurrence of division defects separated from the division grooves, chipping of ceramics, defective burrs, and the like. An object of the present invention is to provide a method for dividing a ceramic substrate.

前記目的に沿う本発明に係るセラミック基板の分割方法は、複数の個片体が分割用溝で仕切られて形成されている集合体からなるセラミック基板を可撓性のある搬送用ベルト上に載置し搬送用ベルトを移動させながら個片体に分割するセラミック基板の分割方法において、セラミック基板を樹脂シートで挟み込む工程と、搬送用ベルトの上方側に設けられた第１の押圧ローラと、第１の押圧ローラの押圧位置より前、又は後に設けられ、搬送用ベルトの下方側から押圧できる第２の押圧ローラとの間に搬送用ベルトと共にセラミック基板を通過させ、分割用溝に沿って個片体に分割する工程と、樹脂シートから個片体を取り出す工程を有する。   The method for dividing a ceramic substrate according to the present invention in accordance with the above object is to place a ceramic substrate formed of an assembly in which a plurality of individual pieces are partitioned by dividing grooves on a flexible conveying belt. In a method for dividing a ceramic substrate that is placed and divided into individual pieces while moving the conveying belt, a step of sandwiching the ceramic substrate with a resin sheet, a first pressing roller provided on the upper side of the conveying belt, The ceramic substrate is passed along with the conveying belt between the second pressing roller that is provided before or after the pressing position of the first pressing roller and can be pressed from the lower side of the conveying belt. It has the process of dividing | segmenting into a single body, and the process of taking out an individual piece from a resin sheet.

ここで、セラミック基板の分割方法は、樹脂シートが厚さ ２０〜１００μｍのビニールシートからなり、セラミック基板の両面を被覆するのがよい。
また、セラミック基板の分割方法は、樹脂シートが袋状からなり、セラミック基板を袋内に挿入するのがよい。
あるいは、セラミック基板の分割方法は、樹脂シートが１枚からなり、樹脂シートを折り曲げてセラミック基板を両面から挟み込むのがよい。
更に、セラミック基板の分割方法は、樹脂シートに貫通孔を設け、樹脂シート内の空気を押し出しながらセラミック基板を分割するのがよい。 Here, as a method of dividing the ceramic substrate, it is preferable that the resin sheet is a vinyl sheet having a thickness of 20 to 100 μm and covers both surfaces of the ceramic substrate.
Further, as a method of dividing the ceramic substrate, it is preferable that the resin sheet is formed in a bag shape and the ceramic substrate is inserted into the bag.
Alternatively, as a method of dividing the ceramic substrate, it is preferable that the resin sheet is composed of one sheet, the resin sheet is bent, and the ceramic substrate is sandwiched from both sides.
Furthermore, as a method for dividing the ceramic substrate, it is preferable to provide a through hole in the resin sheet and divide the ceramic substrate while extruding air in the resin sheet.

請求項１及びこれに従属する請求項２〜５記載のセラミック基板の分割方法は、セラミック基板を樹脂シートで挟み込む工程と、搬送用ベルトの上方側に設けられた第１の押圧ローラと、第１の押圧ローラの押圧位置より前、又は後に設けられ、搬送用ベルトの下方側から押圧できる第２の押圧ローラとの間に搬送用ベルトと共にセラミック基板を通過させ、分割用溝に沿って個片体に分割する工程と、樹脂シートから個片体を取り出す工程を有するので、樹脂シートでセラミック基板の一部分に集中する応力を緩和させることができ、分割用溝から外れて分割される分割不良や、セラミックの欠け、バリ不良等が発生するのを防止することができる。また、例え分割不良等の発生からセラミックの欠片が発生したとしても、樹脂シートによって欠片の飛散を防止することができるので、新たな分割用溝から外れて分割される分割不良や、セラミックの欠け、バリ不良等の発生を防止することができる。更に、人手をかけずに上下の押圧ローラ間にセラミック基板を通すだけで一度に、あるいは縦方向と横方向の二度に分けて分割用溝に沿って分割できるので、製品であるセラミック回路基板や、セラミックパッケージ等を安価に、効率よく作製することができる。   The method for dividing a ceramic substrate according to claim 1 and dependent claims 2 to 5 includes a step of sandwiching the ceramic substrate with a resin sheet, a first pressing roller provided on the upper side of the conveyor belt, The ceramic substrate is passed along with the conveying belt between the second pressing roller that is provided before or after the pressing position of the first pressing roller and can be pressed from the lower side of the conveying belt. Since it has a process of dividing into pieces and a process of taking out individual pieces from the resin sheet, the stress concentrated on a part of the ceramic substrate can be relieved by the resin sheet, and the division failure that is separated from the dividing groove In addition, it is possible to prevent the occurrence of chipping of ceramics, defective burrs, and the like. In addition, even if ceramic fragments are generated due to the occurrence of defective division, etc., the resin sheet can prevent the fragments from being scattered. The occurrence of burrs and the like can be prevented. Furthermore, it can be divided along the dividing grooves at once or by dividing the ceramic substrate between the upper and lower pressure rollers without manual labor, or twice in the vertical and horizontal directions. In addition, a ceramic package or the like can be efficiently manufactured at low cost.

特に、請求項２記載のセラミック基板の分割方法は、樹脂シートが厚さ ２０〜１００μｍのビニールシートからなり、セラミック基板の両面を被覆するので、柔軟性や弾力性等を有し、適当な厚さのビニールシートによってセラミック基板の一部分に集中する応力を緩和させることができ、分割用溝から外れて分割される分割不良や、セラミックの欠け、バリ不良等が発生するのを防止することができる。   In particular, according to the method for dividing a ceramic substrate according to claim 2, since the resin sheet is made of a vinyl sheet having a thickness of 20 to 100 μm and covers both sides of the ceramic substrate, the ceramic substrate has flexibility and elasticity and has an appropriate thickness. The vinyl sheet can relieve stress concentrated on a part of the ceramic substrate, and can prevent the occurrence of division defects that are separated from the dividing grooves, chipping of ceramics, defective burrs, etc. .

特に、請求項３記載のセラミック基板の分割方法は、樹脂シートが袋状からなり、セラミック基板を袋内に挿入するので、セラミック基板を樹脂シート内に容易に挿入でき、分割効率を高めることができる。また、袋状からなる樹脂シートは、例え分割不良等の発生からセラミックの欠片が発生したとしても、欠片が袋内から飛散するのを防止することができるので、新たな分割用溝から外れて分割される分割不良や、セラミックの欠け、バリ不良等の発生を確実に防止することができる。   Particularly, according to the method for dividing the ceramic substrate according to claim 3, since the resin sheet is formed in a bag shape and the ceramic substrate is inserted into the bag, the ceramic substrate can be easily inserted into the resin sheet, and the dividing efficiency is improved. it can. In addition, since the resin sheet made of a bag can prevent the fragments from scattering from the inside of the bag even if ceramic pieces are generated due to the occurrence of a division failure or the like, the resin sheet is removed from the new division groove. It is possible to reliably prevent the occurrence of division failures, chipping of ceramics, defective burrs, and the like.

また、請求項４記載のセラミック基板の分割方法は、樹脂シートが１枚からなり、樹脂シートを折り曲げてセラミック基板を両面から挟み込むので、セラミック基板を樹脂シートで容易に装填でき、分割効率を高めることができる。   According to a fourth aspect of the present invention, the method of dividing the ceramic substrate comprises a single resin sheet, the resin sheet is bent and the ceramic substrate is sandwiched from both sides, so that the ceramic substrate can be easily loaded with the resin sheet and the division efficiency is increased. be able to.

更に、請求項５記載のセラミック基板の分割方法は、樹脂シートに貫通孔を設け、樹脂シート内の空気を押し出しながらセラミック基板を分割するので、樹脂シート内に空気の閉じ込めがなく、樹脂シートでセラミック基板の一部分に集中する応力を確実に緩和させることができ、分割用溝から外れて分割される分割不良や、セラミックの欠け、バリ不良等が発生するのを防止することができる。   Furthermore, in the method for dividing the ceramic substrate according to claim 5, since the ceramic substrate is divided while providing a through hole in the resin sheet and extruding the air in the resin sheet, there is no air confinement in the resin sheet, The stress concentrated on a part of the ceramic substrate can be surely relieved, and it is possible to prevent the occurrence of division defects that are separated from the dividing grooves, chipping of ceramics, defective burrs, and the like.

続いて、添付した図面を参照しつつ、本発明を具体化した実施の形態について説明し、本発明の理解に供する。
ここに、図１（Ａ）〜（Ｃ）はそれぞれ本発明の一実施の形態に係るセラミック基板の分割方法の説明図、図２（Ａ）〜（Ｃ）は同セラミック基板の分割方法で用いられる樹脂シートの説明図である。 Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
1A to 1C are explanatory views of a method for dividing a ceramic substrate according to an embodiment of the present invention, respectively, and FIGS. 2A to 2C are used for a method for dividing the ceramic substrate. It is explanatory drawing of the resin sheet made.

図１（Ａ）〜（Ｃ）を参照しながら、本発明の一実施の形態に係るセラミック基板１０の分割方法を説明する。図１（Ａ）に示すように、セラミック基板１０は、一方の表面、又は両表面に形成される断面視してＶ字状や、Ｕ字状等からなる分割用溝１１で仕切られて形成されている複数の個片体１２、例えば、セラミック回路基板や、セラミックパッケージ等の集合体からなっている。セラミック基板１０のセラミックには、アルミナ（Ａｌ２Ｏ３）や、窒化アルミニウム（ＡｌＮ）や、低温焼成セラミック等があり、特に材質を限定するものではない。また、セラミック基板１０は、このような材質からなるシート状のセラミックグリーンシートにスクリーン印刷で、例えば、セラミックグリーンシートがＡｌ２Ｏ３や、ＡｌＮの場合にはタングステン（Ｗ）や、モリブデン（Ｍｏ）等からなる導体ペーストを用いて導体配線パターン等を形成した後、１枚で又は複数枚を積層して焼成して形成している。あるいは、セラミック基板１０は、粉末原料をプレス成形し焼成した後、例えば、モリブデンマンガン（Ｍｏ−Ｍｎ）等からなる後付の導体ペーストを用いて導体配線パターンを印刷し、焼成して形成している。そして、このセラミック基板１０は、両面から樹脂シート１３で挟み込まれる。なお、ここで、セラミック基板１０がＡｌ２Ｏ３のセラミックグリーンシートで作製される場合のセラミックグリーンシートの作製方法を簡単に説明しておく。先ず、Ａｌ２Ｏ３粉末にマグネシア、シリカ、カルシア等の焼結助剤が適当量加えられた粉末には、ジオクチルフタレート等の可塑剤と、アクリル樹脂等のバインダー、及びトルエン、キシレン、アルコール類等の溶剤が加えられ、十分に混練されて、脱泡され粘度２０００〜４００００ｃｐｓのスラリーが作製される。次いで、このスラリーは、ドクターブレード法等によって、例えば、厚み０．２５ｍｍのロール状のシートに形成され、適当なサイズの矩形状に切断してセラミックグリーンシートが作製されている。 A method for dividing the ceramic substrate 10 according to an embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1A, the ceramic substrate 10 is formed by being partitioned by a dividing groove 11 having a V shape, a U shape, or the like as viewed in cross section formed on one surface or both surfaces. The plurality of individual pieces 12, for example, a ceramic circuit board, a ceramic package, or the like. The ceramic of the ceramic substrate 10 includes alumina (Al 2 O 3 ), aluminum nitride (AlN), low-temperature fired ceramic, and the like, and the material is not particularly limited. The ceramic substrate 10 is screen-printed on a sheet-like ceramic green sheet made of such a material. For example, when the ceramic green sheet is Al 2 O 3 or AlN, tungsten (W) or molybdenum (Mo After forming a conductor wiring pattern or the like using a conductive paste made of), etc., one or a plurality of layers are laminated and fired. Alternatively, the ceramic substrate 10 is formed by press-molding and firing a powder raw material, and then printing and firing a conductor wiring pattern using a conductive paste made of molybdenum manganese (Mo-Mn) or the like. Yes. And this ceramic substrate 10 is inserted | pinched with the resin sheet 13 from both surfaces. Here, a method for producing a ceramic green sheet in the case where the ceramic substrate 10 is produced from an Al 2 O 3 ceramic green sheet will be briefly described. First, a powder obtained by adding an appropriate amount of a sintering aid such as magnesia, silica, and calcia to Al 2 O 3 powder includes a plasticizer such as dioctyl phthalate, a binder such as an acrylic resin, and toluene, xylene, and alcohols. Etc. is added, kneaded sufficiently, and defoamed to produce a slurry having a viscosity of 2000 to 40000 cps. Next, this slurry is formed into a roll-shaped sheet having a thickness of 0.25 mm, for example, by a doctor blade method or the like, and cut into a rectangular shape having an appropriate size to produce a ceramic green sheet.

次いで、図１（Ｂ）に示すように、両面から樹脂シート１３で挟み込まれたセラミック基板１０は、分割装置１４の途中で段差が変化するプレート１５上を移動するポリウレタン等からなり可撓性を有する搬送用ベルト１６上に載置される。この分割装置１４の搬送用ベルト１６は、エンドレスとなっており、搬送用ベルト１６の上方側には、搬送用ベルト１６上に載置されたセラミック基板１０、又はセラミック基板１０との間にセラミック基板１０を上からセラミック基板を挟持するための基板挟持用ベルト（図示せず）を介して押圧しながら回転できる第１の押圧ローラ１７が設けられている。また、この分割装置１４の搬送用ベルト１６の下方側には、第１の押圧ローラ１７の押圧位置と一致しないように前、又は後の位置（図１（Ｂ）では前の位置の場合を示す）に設けられ、搬送用ベルト１６の下方側を直接押圧しながら回転できる第２の押圧ローラ１８が設けられている。第１の押圧ローラ１７と第２の押圧ローラ１８の間には、搬送用ベルト１６と共に、搬送用ベルト１６上に載置されたセラミック基板１０が通過できるようになっている。なお、分割装置１４のプレート１５は、途中で段差が変化するのではなく、第２の押圧ローラ１８で搬送用ベルト１６をプレート１５上に持ち上げることで搬送用ベルト１６に段差を設ける形態であってもよい。そして、図１（Ｃ）に示すように、セラミック基板１０は、搬送用ベルト１６の移動と共に、押圧ローラの回転方向と実質的に平行の分割用溝１１がこの分割用溝１１に沿って分割され個片体１２を形成している。なお、個片体１２は、セラミック基板１０に形成されている縦方向と、横方向の分割用溝１１の両方を分割することで形成されるので、分割を２回に分けて行う必要がある場合がある。   Next, as shown in FIG. 1 (B), the ceramic substrate 10 sandwiched between the resin sheets 13 from both sides is made of polyurethane or the like that moves on a plate 15 in which a step changes in the middle of the dividing device 14, and has flexibility. It is placed on the conveyor belt 16 that it has. The conveyor belt 16 of the dividing device 14 is endless, and the ceramic substrate 10 placed on the conveyor belt 16 or the ceramic substrate 10 is placed on the upper side of the conveyor belt 16. A first pressing roller 17 is provided that can rotate while pressing the substrate 10 from above via a substrate clamping belt (not shown) for clamping the ceramic substrate. In addition, on the lower side of the conveying belt 16 of the dividing device 14, the front or rear position (in FIG. 1B) is the front position so as not to coincide with the pressing position of the first pressing roller 17. And a second pressing roller 18 that can be rotated while directly pressing the lower side of the conveying belt 16 is provided. Between the first pressing roller 17 and the second pressing roller 18, the ceramic substrate 10 placed on the conveying belt 16 can pass along with the conveying belt 16. The plate 15 of the dividing device 14 does not change in level in the middle, but has a form in which the level is provided on the conveying belt 16 by lifting the conveying belt 16 on the plate 15 by the second pressing roller 18. May be. As shown in FIG. 1C, the ceramic substrate 10 is divided along the dividing grooves 11 with the dividing grooves 11 substantially parallel to the rotation direction of the pressing roller as the conveying belt 16 moves. Thus, the individual piece 12 is formed. The individual piece 12 is formed by dividing both the vertical direction formed in the ceramic substrate 10 and the horizontal dividing groove 11, so that the division needs to be performed twice. There is a case.

次いで、セラミック基板１０から分割されて形成された個片体１２は、樹脂シート１３から取り出している。個片体１２や、分割によって発生したダミー部分の細片は、樹脂シート１３内に納められているので、容易に分離して取り出すことができる。   Next, the individual pieces 12 formed by being divided from the ceramic substrate 10 are taken out from the resin sheet 13. The individual pieces 12 and the small pieces of the dummy portion generated by the division are stored in the resin sheet 13 and can be easily separated and taken out.

ここで、上記のセラミック基板１０を分割のために用いられる樹脂シート１３は、厚さが２０〜１００μｍの、例えば、ポリスチレン等からなるビニールシートがよく、分割に際しての適当な柔軟性や弾力性を確保することができる。なお、ビニールシートの厚さは、２０μｍを下まわると柔軟性や弾力性の効果が少なくなり押圧ローラの応力が直接セラミック基板１０の一部分に集中して分散できなくなり応力を緩和させる効果が少なくなる。また、ビニールシートの厚さは、１００μｍを超えた場合にも柔軟性や弾力性の効果が少なくなり、直接押圧ローラで押圧するのと同じようになって、応力を緩和させる効果が少なくなる。   Here, the resin sheet 13 used for dividing the ceramic substrate 10 is preferably a vinyl sheet made of, for example, polystyrene having a thickness of 20 to 100 μm, and has appropriate flexibility and elasticity at the time of division. Can be secured. If the thickness of the vinyl sheet is less than 20 μm, the effect of flexibility and elasticity is reduced, and the stress of the pressure roller is concentrated on a part of the ceramic substrate 10 and cannot be dispersed, and the effect of relaxing the stress is reduced. . Also, when the thickness of the vinyl sheet exceeds 100 μm, the effect of flexibility and elasticity is reduced, and the effect of relieving stress is reduced in the same manner as when directly pressing with a pressing roller.

次に、図２（Ａ）〜（Ｃ）を参照しながら、上記のセラミック基板１０の分割方法で用いられる樹脂シート１３の形状について説明する。図２（Ａ）に示すように、樹脂シート１３は、袋状の樹脂シート１３ａからなり、この袋内にセラミック基板１０を挿入させるのがよい。この袋状の樹脂シート１３ａを用いた場合の分割においては、袋内に装填されたセラミック基板１０の袋の底側を先頭にして第１、及び第２の押圧ローラ１７、１８に通過させるのがよい。袋内の空気は、通過と共に、外に押し出されるので、セラミック基板１０を安定して分割させることができる。   Next, the shape of the resin sheet 13 used in the method for dividing the ceramic substrate 10 will be described with reference to FIGS. As shown in FIG. 2A, the resin sheet 13 is composed of a bag-shaped resin sheet 13a, and the ceramic substrate 10 is preferably inserted into the bag. In the division when the bag-shaped resin sheet 13a is used, the ceramic substrate 10 loaded in the bag is passed through the first and second pressing rollers 17 and 18 with the bottom side of the bag as the head. Is good. Since the air in the bag is pushed out as it passes, the ceramic substrate 10 can be stably divided.

また、図２（Ｂ）に示すように、樹脂シート１３は、１枚のシート状の樹脂シート１３ｂからなり、この樹脂シート１３ｂを半分程度に折り曲げてセラミック基板１０を両面から挟み込むのがよい。この１枚のシート状の樹脂シート１３ｂを用いた場合の分割においては、シートに挟み込まれたセラミック基板１０の４辺の何れの方向を先頭にして第１、及び第２の押圧ローラ１７、１８に通過させてもよいが、特に、シートの折り曲げ部分を先頭にして通過させる場合には、シートの捲れあがり等を防止してセラミック基板１０を安定して分割させることができる。   Further, as shown in FIG. 2B, the resin sheet 13 is composed of a single sheet-like resin sheet 13b, and the resin sheet 13b is preferably folded in half and the ceramic substrate 10 is sandwiched from both sides. In the division using this single sheet-like resin sheet 13b, the first and second pressing rollers 17 and 18 start from any one of the four sides of the ceramic substrate 10 sandwiched between the sheets. However, particularly when the sheet is passed with the folded portion at the head, the ceramic substrate 10 can be stably divided by preventing the sheet from curling up.

更に、図２（Ｃ）に示すように、樹脂シート１３、１３ａ、１３ｂには、複数の貫通孔１９を設け、セラミック基板１０を分割するときのシートの内側に滞留する空気を押圧ローラの回転と共に、外に押し出すことができるようにするのがよい。また、袋状の樹脂シート１３ａに貫通孔１９を設ける場合には、袋状であっても、袋内の空気は、第１、及び第２の押圧ローラ１７、１８を通過すると共に、外に押し出されるので、袋の何れの方向を先頭にしてでも通過させることができる。   Further, as shown in FIG. 2C, the resin sheets 13, 13a, 13b are provided with a plurality of through holes 19, and the air staying inside the sheet when the ceramic substrate 10 is divided is rotated by the pressure roller. At the same time, it should be possible to push out. Further, when the through-hole 19 is provided in the bag-shaped resin sheet 13a, the air in the bag passes through the first and second pressing rollers 17 and 18 and is exposed to the outside even in the bag shape. Since it is pushed out, it can be passed through any direction of the bag.

本発明のセラミック基板の分割方法は、複数個のセラミック回路基板や、セラミックパッケージや、グレーズ基板や、低温焼成多層回路基板や、電子部品搭載用基板等のセラミック製品が配列したそれぞれ集合体からなるセラミック基板を個片体のセラミック製品に分割するための分割方法に適用することができる。   The method for dividing a ceramic substrate according to the present invention includes a plurality of ceramic circuit boards, ceramic packages, glaze boards, low-temperature fired multilayer circuit boards, and assemblies each having an array of ceramic products such as electronic component mounting boards. The present invention can be applied to a dividing method for dividing a ceramic substrate into individual ceramic products.

（Ａ）〜（Ｃ）はそれぞれ本発明の一実施の形態に係るセラミック基板の分割方法の説明図である。(A)-(C) is explanatory drawing of the division | segmentation method of the ceramic substrate which concerns on one embodiment of this invention, respectively. （Ａ）〜（Ｃ）は同セラミック基板の分割方法で用いられる樹脂シートの説明図である。(A)-(C) are explanatory drawings of the resin sheet used with the division | segmentation method of the ceramic substrate.

符号の説明Explanation of symbols

１０：セラミック基板、１１：分割用溝、１２：個片体、１３、１３ａ、１３ｂ：樹脂シート、１４：分割装置、１５：プレート、１６：搬送用ベルト、１７：第１の押圧ローラ、１８：第２の押圧ローラ、１９：貫通孔   10: Ceramic substrate, 11: Dividing groove, 12: Individual piece, 13, 13a, 13b: Resin sheet, 14: Dividing device, 15: Plate, 16: Conveying belt, 17: First pressing roller, 18 : Second pressing roller, 19: Through hole

Claims (5)

複数の個片体が分割用溝で仕切られて形成されている集合体からなるセラミック基板を可撓性のある搬送用ベルト上に載置し該搬送用ベルトを移動させながら前記個片体に分割するセラミック基板の分割方法において、
前記セラミック基板を樹脂シートで挟み込む工程と、
前記搬送用ベルトの上方側に設けられた第１の押圧ローラと、該第１の押圧ローラの押圧位置より前、又は後に設けられ、前記搬送用ベルトの下方側から押圧できる第２の押圧ローラとの間に前記搬送用ベルトと共に前記セラミック基板を通過させ、前記分割用溝に沿って前記個片体に分割する工程と、
前記樹脂シートから前記個片体を取り出す工程を有することを特徴とするセラミック基板の分割方法。 A ceramic substrate made of an assembly in which a plurality of individual pieces are partitioned by a dividing groove is placed on a flexible conveying belt, and the conveying belt is moved to the individual pieces. In the method of dividing the ceramic substrate to be divided,
Sandwiching the ceramic substrate with a resin sheet;
A first pressing roller provided on the upper side of the conveying belt, and a second pressing roller provided before or after the pressing position of the first pressing roller and capable of pressing from the lower side of the conveying belt Passing the ceramic substrate together with the conveying belt between the two, and dividing the piece into pieces along the dividing groove;
A method for dividing a ceramic substrate, comprising the step of taking out the individual pieces from the resin sheet. 請求項１記載のセラミック基板の分割方法において、前記樹脂シートが厚さ ２０〜１００μｍのビニールシートからなり、前記セラミック基板の両面を被覆することを特徴とするセラミック基板の分割方法。   2. The method for dividing a ceramic substrate according to claim 1, wherein the resin sheet is made of a vinyl sheet having a thickness of 20 to 100 [mu] m and covers both surfaces of the ceramic substrate. 請求項１又は２記載のセラミック基板の分割方法において、前記樹脂シートが袋状からなり、前記セラミック基板を袋内に挿入することを特徴とするセラミック基板の分割方法。   3. The method for dividing a ceramic substrate according to claim 1, wherein the resin sheet has a bag shape, and the ceramic substrate is inserted into the bag. 請求項１又は２記載のセラミック基板の分割方法において、前記樹脂シートが１枚からなり、該樹脂シートを折り曲げて前記セラミック基板を両面から挟み込むことを特徴とするセラミック基板の分割方法。   3. The method for dividing a ceramic substrate according to claim 1, wherein the resin sheet is a single sheet, the resin sheet is bent, and the ceramic substrate is sandwiched from both sides. 請求項１〜４のいずれか１項記載のセラミック基板の分割方法において、前記樹脂シートに貫通孔を設け、該樹脂シート内の空気を押し出しながら前記セラミック基板を分割することを特徴とするセラミック基板の分割方法。   5. The method of dividing a ceramic substrate according to claim 1, wherein a through hole is provided in the resin sheet, and the ceramic substrate is divided while extruding air in the resin sheet. How to split.
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007042808A (en) * 2005-08-02 2007-02-15 Disco Abrasive Syst Ltd Dividing method of wafer
JP2007324349A (en) * 2006-05-31 2007-12-13 Ngk Spark Plug Co Ltd Dividing device and ceramic wiring board manufacturing method
JP2009231331A (en) * 2008-03-19 2009-10-08 Murata Mfg Co Ltd Method of manufacturing laminate
JP2011093286A (en) * 2009-11-02 2011-05-12 Mitsubishi Materials Corp Device and method for manufacturing divided body
JP2016196196A (en) * 2016-08-17 2016-11-24 三星ダイヤモンド工業株式会社 Break method and break device
CN109968283A (en) * 2019-03-25 2019-07-05 林华勇 A kind of substrate strip splitter and its method for splitting stretching press type LED filament lamp

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007042808A (en) * 2005-08-02 2007-02-15 Disco Abrasive Syst Ltd Dividing method of wafer
JP4731241B2 (en) * 2005-08-02 2011-07-20 株式会社ディスコ Wafer division method
JP2007324349A (en) * 2006-05-31 2007-12-13 Ngk Spark Plug Co Ltd Dividing device and ceramic wiring board manufacturing method
JP2009231331A (en) * 2008-03-19 2009-10-08 Murata Mfg Co Ltd Method of manufacturing laminate
JP2011093286A (en) * 2009-11-02 2011-05-12 Mitsubishi Materials Corp Device and method for manufacturing divided body
JP2016196196A (en) * 2016-08-17 2016-11-24 三星ダイヤモンド工業株式会社 Break method and break device
CN109968283A (en) * 2019-03-25 2019-07-05 林华勇 A kind of substrate strip splitter and its method for splitting stretching press type LED filament lamp
CN109968283B (en) * 2019-03-25 2024-04-02 林华勇 Substrate strip splitter of stretching and jacking type LED filament lamp and splitting method thereof

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