JP2005144512A - Optical macachining apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a means capable of deciding normal/defective conditions of a machining state in a simple manner relating to a machining apparatus for solder joining or thermal processing of a resin by condensing optical energy to enable local heating and a production facility using the same. <P>SOLUTION: An optical energy output means 1 of outputting optical energy is shown in the figure and is a machining energy source. The state of a workpiece enters an image receiving means 10 through a first optical path 2 and a second optical path 7. The image and the image previously set in a storage 12 are compared and the normal/defective conditions are decided. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a processing apparatus such as solder bonding or resin heat processing, and production equipment using the same, which enables local heating by condensing light energy.

  In recent years, when processing a resin substrate that is a base of a printed circuit board used for circuit mounting or the like, drilling using a laser beam is performed in addition to drilling using a mechanical drill that has been conventionally used (for example, patents) Reference 1).

  Further, without using a reflow oven, soldering is used by optical superheat processing used for mounting after being melted by an optical processing machine represented by laser light or the like (for example, Patent Document 2).

  The quality of the processed body by the optical processing apparatus represented by laser processing as described above is performed after processing. In many cases, the quality of the solder joint is determined based on an X-ray image in which X-rays are transmitted through the joint portion by X-ray inspection equipment.

In addition, there is a method of attaching a color (bad mark) used when performing pass / fail judgment to a workpiece before processing and confirming the presence of the color after processing (see, for example, Patent Document 3). The part is not removed from the processing by the quality determination by the color.
Japanese Patent Laid-Open No. 11-320155 JP-A-3-238185 Japanese Patent Laid-Open No. 8-159981

  The above-described method for determining whether or not the processing is good has the following problems.

  For example, in the case of using an X-ray inspection apparatus, the mainstream method is to randomly select a sample from a large number of printed circuit boards after the completion of soldering and judge the quality, but this confirms all the quality. It is not possible. An in-line method in which an X-ray inspection apparatus is incorporated into a printed circuit board production line has also been put into practical use, but has the disadvantage that the number of man-hours for production increases.

  In the case of multi-chip substrates, when colors (bad marks) used for quality determination are present on the workpiece before processing, these are painted with ink etc., but it is not possible to determine quality with a simple method. It was.

  In order to solve the above-described problems, an object of the present invention is to provide a means that can easily determine the quality of a processed object.

In order to solve the above problems, the first means of the present invention includes a light energy output means for outputting light energy, a first light path for guiding the light energy to the work piece, and a light path from the work piece. The unit includes a second optical path that overlaps the first optical path, and an image receiving unit disposed in the second optical path, and is provided with a comparison unit that compares the image from the image receiving unit with a preset image. I do.

  The second means of the present invention includes a first drive means for relatively moving the first optical path and the workpiece in a direction substantially perpendicular to the direction of light energy, and a first drive means in a direction substantially horizontal to the direction of light energy. A second drive unit that relatively moves the optical path of one workpiece and the workpiece, and a drive control unit that controls the first drive unit and the second drive unit. Set the image for.

  The 3rd means of this invention removes that part from processing, when the color used when performing quality determination exists in a to-be-processed object from before processing.

  The fourth means of the present invention makes a pass / fail judgment by the comparison means before irradiating the workpiece with light energy.

  The fifth means of the present invention performs pass / fail judgment by the comparison means after irradiating the workpiece with light energy.

  According to the present invention, pre- and post-processing images of non-defective and defective products and threshold values are stored in advance, and the pre-processing and post-processing images are compared with the image of the workpiece to determine pass / fail. It becomes possible to do.

Further, in the case where a multi-chip substrate has a color (bad mark) used for quality determination in a workpiece before processing, the portion can be removed from processing before processing each processing site.
Therefore, unnecessary processing can be omitted and time and cost can be reduced.

(Embodiment 1)
Hereinafter, the best mode for carrying out the present invention will be described with reference to FIGS.
According to the figure, reference numeral 1 denotes a light energy output means for outputting light energy. In the case of resin processing, a laser oscillator is mainly used. As this laser oscillator, various laser oscillators such as a carbon dioxide gas laser oscillator, a YAG laser oscillator, and a semiconductor laser oscillator can be used. In the case of solder joint, a xenon lamp or the like is used. Reference numeral 2 denotes a light energy (first) optical path for guiding laser light or lamp light, which is light energy, to a workpiece, and generally a fiber is used for light guiding. Reference numeral 3 denotes a half mirror, which has a characteristic of transmitting a wavelength component of light energy necessary for processing and joining and reflecting a visible light component.

  Reference numeral 4 denotes an optical means for shaping light energy, and includes various lenses such as a spherical lens and a cylindrical lens. Light emitted from the light energy output means 1 is shaped into a necessary beam diameter and condensed. The condensing characteristic is set according to the divergence characteristic of the light energy light source.

  Reference numeral 5 denotes a detachable protective glass that prevents foreign matter including dust and the like rebounding from the substrate during processing from adhering to the optical means 4. When the light energy output is reduced due to the attachment of foreign matter, the light output is replaced to restore the light output and facilitate maintenance.

  Reference numeral 6 denotes a workpiece to be processed by this apparatus, which is mainly an epoxy resin substrate used for a printed circuit board in laser drilling and a printed circuit board in solder bonding.

  What is indicated by reference numeral 7 is a (second) optical path of the image receiving means for guiding the light reflected from the half mirror among the reflected waves from the workpiece to the image receiving means described later, A fiber is used for the light guide. The light reflected by the half mirror 3 and passing through the optical path 7 is reflected again by the mirror 8 and reaches the image receiving means 10 through a lens 9 as an image distortion correcting means for correcting an image distorted by the light energy shaping means. .

  The image receiving means 10 includes an image receiving element typified by a CCD or a CMOS, converts the received light into an electric signal, applies image correction, etc., and applies a video signal to the display means 11 realized on a CRT or liquid crystal screen. Send. The display means 11 displays the image signal of the workpiece transmitted from the image receiving means 10. Those indicated by reference numerals 1 to 10 are hereinafter referred to as processing heads.

 Reference numeral 12 denotes an image comparison means connected to the control device main body 21, which is stored in a storage means 13 provided in the control device main body 21 before and after processing. Is compared with the image of the workpiece captured by.

Hereinafter, the operation of the optical processing apparatus in the present embodiment will be described.
First, laser light or lamp light emitted from the light energy output means 1 passes through the half mirror 3 along the first optical path 2 and enters the light energy shaping means 4 where it is condensed to a required size. The workpiece 6 is irradiated through the protective glass 5. The workpiece 6 is processed with the condensed light, such as drilling and cutting of the workpiece if laser light is used, and soldering if the lamp light is used. The light reflected from the workpiece 6 is reflected by the half mirror 3 to the second optical path 7 after passing through the steps 5 and 4, reflected again by the mirror 8, and then enters the image receiving means 10 through the image distortion correcting means 9. This information is sent to the image display means 11 and displayed as an image.

  When judging the quality of the work piece, a non-illustrated switch is pressed to select a processed non-defective image that has been recorded in the storage means 13 and displayed on the display means at the same time. It is also possible to compare with the eyes. Furthermore, it is good also as a structure which compares both using the image comparison means 12 connected to the control apparatus main body 21. FIG. As an image comparison means, it converts into the luminance information of each pixel of the image previously stored in the storage device 12, and compares this luminance information with the luminance information of each pixel of the image of the workpiece for each pixel. The pass / fail judgment can be made by the above. In addition, it is possible to compare by superimposing the non-defective image and the image of the workpiece using the superimpose method.

As described above, according to the present embodiment, the quality of the workpiece can be determined.
(Embodiment 2)
In the present embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. This will be described with reference to FIG.

  Reference numeral 14 indicates a recognition means for deriving the processing position and detecting the position of the processing head. Reference numeral 15 indicates a relative movement of the first optical path and the workpiece in a direction substantially perpendicular to the direction of light energy. First drive means, indicated by reference numeral 16, is second drive means for relatively moving the first optical path and the workpiece in a substantially horizontal direction with respect to the direction of light energy, and reference numeral 17 indicates the first drive means. Drive control means for controlling the drive means and the second drive means. The drive control means 17 is built in the control device main body 21.

Hereinafter, the operation of the optical processing apparatus in the present embodiment will be described.
The position of the machining head is detected from the information of the machining head position recognition means 14, and the drive control means 17 can change the relative position between the workpiece and the machining head by the first drive means 15 and the second drive means 16. it can.

As described above, according to the present embodiment, it is possible to capture an image of a workpiece regardless of the position of the processing portion of the workpiece.
(Embodiment 3)
In the present embodiment, the same parts as those in the second embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. This will be described with reference to FIGS. 1, 2, and 3. Reference numeral 18 denotes a color comparison means built in the control device main body 21, which plays a role of discriminating whether a color (bad mark) used for quality determination exists in the workpiece before processing. Reference numeral 31 shown in FIG. 2 is a color (bad mark) used when the quality is determined. The bad mark 31 is a color as a mark to be attached to a defective portion before processing.

  Hereinafter, the operation of the optical processing apparatus in the present embodiment will be described. The image information captured from the image receiving means 10 is transmitted to the control device main body 21 and input to the color comparison means 18. A bad mark color threshold is set in the storage means 13 in advance. When image information is input to the color comparison unit 18, the color threshold information is extracted from the storage unit 13 and input to the color comparison unit 18 in accordance with a color threshold extraction command from the color comparison unit 18. The color comparison unit 18 compares the color included in the image information with the color threshold information. As a result of the comparison, if the color comparing means 18 determines that there is a bad mark, the CPU obtains coordinate information of the position where the bad mark is present from the image information, and removes that portion from the processing.

As described above, according to the present embodiment, when the part of the workpiece is known to be defective before processing, it can be removed from the processing and unnecessary processing is not performed.
(Embodiment 4)
In the present embodiment, the same parts as those of the third embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. This will be described with reference to FIGS. In the present embodiment, the role of pre-irradiation comparison means that performs comparison before irradiating the workpiece with the light energy indicated by reference numeral 19 built in the control device main body 21 will be described.

  The image information captured from the image receiving means 10 is input to the pre-irradiation comparing means 19. The storage unit 13 stores in advance image information of non-defective and defective products before irradiation with laser light or lamp light. When the image information from the image receiving means 10 is input to the pre-irradiation comparing means 19, the images of good and defective products before irradiation stored in the storage means 13 are pulled out by the extraction command from the pre-irradiation comparing means 19. And input to the pre-irradiation comparison means 19.

  The pre-irradiation comparing unit 19 compares the image information input from the image receiving unit 10 with the image information input from the storage unit 13 to determine a non-defective part and a defective part to be processed. As a result, the coordinate information of the position of the image portion similar to the image of the defective product portion stored in the storage means 13 is obtained, and the processing of not processing the location is performed.

As described above, according to the present embodiment, when the processing part of the workpiece is known to be defective before processing, it can be removed from the processing, and unnecessary processing can be omitted.
(Embodiment 5)
In the present embodiment, the same parts as those in the fourth embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. This will be described with reference to FIGS. In the present embodiment, it is post-irradiation comparison means for performing comparison after irradiating the workpiece with light energy indicated by reference numeral 20 which is built in the control device main body 21.

  The image information captured from the image receiving means 10 is input to the pre-irradiation comparing means 19. The storage unit 13 stores in advance image information of non-defective and defective products after irradiation with laser light or lamp light. When the image information from the image receiving means 10 is input to the post-irradiation comparison means 20, the images of good and defective products after irradiation stored in the storage means 13 are extracted by the extraction command from the post-irradiation comparison means 20. And input to the comparison means 20 after irradiation.

  The post-irradiation comparison unit 20 compares the image information input from the image receiving unit 10 with the image information input from the storage unit 13 to determine a non-defective part and a defective part after processing.

  As described above, according to the present embodiment, the quality of the workpiece can be determined.

  The optical processing apparatus of the present invention can determine the quality of processing of a small variety of products, and is useful in the technical field of processing a small variety of products.

The block diagram which shows embodiment of the optical processing apparatus which concerns on this invention The block diagram which shows one Embodiment of the control apparatus main body of the optical processing apparatus which concerns on this invention Explanatory drawing of bad mark of workpiece according to the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical energy output means 2 1st optical path 3 Half mirror 4 Optical energy shaping means 5 Protective glass 6 Work piece 7 2nd optical path 8 Mirror 9 Image distortion correction means 10 Image receiving means 11 Display means 12 Image comparison means 13 Storage means 14 processing head position recognition means 15 first driving means 16 second driving means 17 drive control means 18 color comparison means 19 pre-processing image comparison means 20 post-processing image comparison means 21 controller main body 31 defective part of multi-chip substrate 32 pass / fail Color used for judgment (bad mark)

Claims (5)

Light energy output means for outputting light energy, a first optical path for guiding the light energy to the workpiece, a second optical path in which a part of the optical path from the workpiece overlaps the first optical path, An optical processing apparatus comprising: an image receiving unit arranged in the second optical path; and a comparison unit configured to compare an image from the image receiving unit with a preset image to perform pass / fail determination. First drive means for relatively moving the first optical path and the workpiece in a direction substantially perpendicular to the direction of light energy, and the first optical path and the workpiece in a direction substantially horizontal to the direction of light energy. 2. A second drive means for relative movement and a drive control means for controlling the first drive means and the second drive means are provided, and an image for comparison is set for each machining part of the workpiece. The optical processing apparatus according to 1. The optical processing apparatus according to claim 1, wherein when a color used for quality determination is present in the workpiece before processing, the portion is removed from processing. The optical processing apparatus according to claim 1, wherein a quality determination is performed by a comparison unit before irradiating the workpiece with light energy. The optical processing apparatus according to any one of claims 1 to 3, wherein a quality determination is performed by a comparison unit after the workpiece is irradiated with light energy.

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