JPH05146885A - Laser beam machine - Google Patents
Laser beam machineInfo
- Publication number
- JPH05146885A JPH05146885A JP3312195A JP31219591A JPH05146885A JP H05146885 A JPH05146885 A JP H05146885A JP 3312195 A JP3312195 A JP 3312195A JP 31219591 A JP31219591 A JP 31219591A JP H05146885 A JPH05146885 A JP H05146885A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- irradiating
- welding
- laser
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/044—Seam tracking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
- B23K26/26—Seam welding of rectilinear seams
- B23K26/262—Seam welding of rectilinear seams of longitudinal seams of tubes
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Measurement Of Optical Distance (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
［発明の目的］ [Object of the Invention]
【０００１】[0001]
【産業上の利用分野】本発明は、非接触方式により加工
部位を検出し、その検出された加工部位にレーザ光を照
射することにより加工を施すレーザ加工装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus for detecting a processed portion by a non-contact method and irradiating the detected processed portion with a laser beam for processing.
【０００２】[0002]
【従来の技術】従来のレーザ加工装置について、図面を
用いて説明する。2. Description of the Related Art A conventional laser processing apparatus will be described with reference to the drawings.
【０００３】図３に示すように、従来のレーザ加工装置
の一種であるレーザ溶接機においては、被溶接物１の突
き合わせ部２を検出する装置が、溶接ヘッド３よりも被
溶接物１の進行方向に対し前方に配置されている。そし
て、この検出装置は、半導体レーザ４と、コリメートレ
ンズ５，シリンドリカルレンズ６から構成され、半導体
レーザ４から放射されたレーザビームをコリメートレン
ズ５により平行光線に変換し、シリンドリカルレンズ６
によってこの光を１軸方向のみ収束させ、スリット状の
光Ｓに交換する。スリット状の光Ｓと溶接線方向を互い
に直交させている。これらのスリット光Ｓを照射する手
段を２組も設け、突き合せ部を２ヶ所照射する。これら
のスリット光Ｓを照射する手段はパイプ７内に冷却水Ｗ
を流して冷却されている。このようにして溶接する熱で
半導体レーザ４の温度が上昇しないようにし、半導体レ
ーザ４の温度を一定に保っている。As shown in FIG. 3, in a laser welding machine, which is a type of conventional laser processing apparatus, a device for detecting a butted portion 2 of a work piece 1 advances the work piece 1 more than the welding head 3. It is arranged in front of the direction. The detection device is composed of a semiconductor laser 4, a collimating lens 5 and a cylindrical lens 6, and converts the laser beam emitted from the semiconductor laser 4 into parallel light rays by the collimating lens 5 to make the cylindrical lens 6
This light is converged only in the one-axis direction and is exchanged for slit-shaped light S. The slit-shaped light S and the welding line direction are orthogonal to each other. Two sets of means for irradiating the slit light S are provided, and two abutting portions are irradiated. The means for irradiating the slit light S is provided with the cooling water W in the pipe 7.
Is cooled by flowing. In this way, the temperature of the semiconductor laser 4 is prevented from rising by the heat of welding, and the temperature of the semiconductor laser 4 is kept constant.
【０００４】Ｃは、スリット線（光切断線）で、スリッ
ト状の光Ｓを被溶接物１に照射することによって生じる
もので、８は、ＣＣＤカメラでスリット線の上方に配置
され、これにより、２本のスリット線を撮影し、２つの
光切断像を得る。C is a slit line (light cutting line), which is generated by irradiating the workpiece 1 with slit-shaped light S, and 8 is arranged above the slit line by the CCD camera. Two slit lines are photographed and two light section images are obtained.
【０００５】また、ＣＣＤカメラ８の前方には溶接光な
どの外乱光の影響を除去するため、半導体レーザ４の発
生するレーザビームの波長帯の光のみを透過する干渉フ
ィルタ９が取付けられている。上記半導体レーザ４，コ
リメートレンズ５，シリンドリカルレンズ６，ＣＣＤカ
メラ８，干渉フィルタ９の各部材は、図示されないケー
スに納められており、レーザ溶接ヘッド３に固定されて
いる。１０はレーザ溶接ヘッド内にある集光レンズから
下部を移動させる駆動手段である。１１はＣＣＤカメラ
８からの映像信号を処理する画像処理装置、１２は半導
体レーザ４を制御する半導体レーザドライバ、１３は画
像処理装置１１，半導体レーザドライバ１２及びレーザ
溶接ヘッド３を駆動手段を制御する制御装置である。Further, in front of the CCD camera 8, an interference filter 9 for transmitting only light in the wavelength band of the laser beam generated by the semiconductor laser 4 is attached in order to remove the influence of ambient light such as welding light. . The semiconductor laser 4, collimator lens 5, cylindrical lens 6, CCD camera 8, and interference filter 9 are housed in a case (not shown) and fixed to the laser welding head 3. Reference numeral 10 is a driving means for moving the lower part from the condenser lens in the laser welding head. Reference numeral 11 is an image processing device for processing a video signal from the CCD camera 8, 12 is a semiconductor laser driver for controlling the semiconductor laser 4, 13 is a driving means for the image processing device 11, the semiconductor laser driver 12 and the laser welding head 3. It is a control device.
【０００６】図４に実際に溶接中にＣＣＤカメラ８が撮
影している画像を示す。図中の矢印は溶接方向を示す。
１は、被溶接物，Ｇは突き合せ部ギャップ，ＳＬはスリ
ット光による光切断像を示す。ＭはＣＣＤカメラ８が撮
影している像の範囲で、その拡大図を図５に示す。FIG. 4 shows an image taken by the CCD camera 8 during actual welding. The arrow in the figure indicates the welding direction.
Reference numeral 1 denotes an object to be welded, G a butt portion gap, and SL a light section image by slit light. M is the range of the image taken by the CCD camera 8, and its enlarged view is shown in FIG.
【０００７】図４と同様に、図５において、ＳＬは光切
断像，Ｇは突き合せ部ギャップを示す。これら２本の光
切断像を画像処理し、制御装置で突き合せ部ギャップ中
心０を求め、溶接点での溶接基準線Ｅからのずれを算出
し、それに応じて制御装置１３から駆動手段１０に指令
を与えて矢印Ｂ方向若しくは、これとは反対方向に溶接
ヘッド３を駆動させてレーザビームを溶接機に一致させ
る。Similar to FIG. 4, in FIG. 5, SL shows a light section image, and G shows a butt gap. Image processing is performed on these two light section images, the center of the butted portion gap is determined by the control device, the deviation from the welding reference line E at the welding point is calculated, and the control device 13 causes the drive means 10 to respond accordingly. A command is given to drive the welding head 3 in the direction of the arrow B or in the opposite direction to match the laser beam with the welding machine.
【０００８】[0008]
【発明が解決しようとする課題】しかし、上記従来のレ
ーザ溶接機においては、被溶接物の高さ方向の変位につ
いては何ら考慮されておらず、被溶接物の高さ方向に変
位が生じた場合、被溶接物へ照射されるレーザ光のスポ
ット径を一定に保持することができず、加工不良等が発
生していた。そこで、本発明は、被加工物の高さ方向に
対する変位にも対応のできるレーザ加工装置を提供する
ことを目的とする。 ［発明の構成］However, in the above-mentioned conventional laser welding machine, no consideration is given to the displacement of the work piece in the height direction, and the displacement of the work piece in the height direction occurs. In this case, the spot diameter of the laser beam applied to the object to be welded cannot be kept constant, resulting in processing defects and the like. Therefore, it is an object of the present invention to provide a laser processing apparatus capable of coping with displacement of a workpiece in the height direction. [Constitution of Invention]
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するため
に、本発明は、被加工物の加工部位を非接触方式にて検
出し、この検出された加工部位にレーザ光を照射して加
工を施すレーザ加工装置において、前記被加工物の所定
部位に光を照射する照射手段と、この照射手段から光を
照射された所定部位の輝度及び所定方向に対する距離分
布を検出する検出手段と、この検出手段からの検出結果
を基に、その特徴を抽出する特徴抽出手段と、この特徴
抽出手段からの抽出結果を基に、前記所定部位が加工部
位であるか否かを判定する判定手段と、この判定手段か
らの判定結果を基に、前記所定部位に前記レーザ光を照
射して加工を施すか否かを決定する決定手段とを備えた
レーザ加工装置を提供する。In order to achieve the above object, the present invention detects a processed portion of a workpiece by a non-contact method and irradiates the detected processed portion with a laser beam to perform processing. In the laser processing apparatus, the irradiation means for irradiating a predetermined portion of the workpiece with light, the detection means for detecting the luminance and the distance distribution in a predetermined direction of the predetermined portion irradiated with light from the irradiation means, Based on the detection result from the detection means, the feature extraction means for extracting the feature, based on the extraction result from the feature extraction means, the determination means for determining whether the predetermined site is a processed site, There is provided a laser processing apparatus comprising: a determination unit that determines whether or not to perform processing by irradiating the predetermined portion with the laser light based on the determination result from the determination unit.
【００１０】[0010]
【作用】このように構成された本発明においては、被加
工物に光を照射し、その照射した被加工物の部位の輝度
及び所定方向に対する距離分布を検出し、この検出結果
に基いて被加工物の位置変位を考慮してレーザ加工を行
なうので、レーザ光のスポット径を常時一定に保持して
レーザ加工を行なうことができる。In the present invention thus constituted, the work is irradiated with light, the brightness of the irradiated part of the work and the distance distribution in a predetermined direction are detected, and the object is detected based on the detection result. Since the laser processing is performed in consideration of the positional displacement of the workpiece, the laser processing can be performed while keeping the spot diameter of the laser beam constant.
【００１１】[0011]
【実施例】以下、本発明の一実施例を図面を用いて説明
する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【００１２】図１に示すように、照射部１４，１５から
各々扇状光ｆ1 ，ｆ2 が被加工物１６の同一場所に交互
に照射される。このとき、扇状光ｆ1 ，ｆ2 は同一平面
内となる。そして、電荷結合素子を使った撮像管（以
下、ＣＣＤカメラという）１７は、扇状光ｆ1 ，ｆ2 で
形成された光切断像を観測する。このときＣＣＤカメラ
１７の１画面入力のタイミングに合せて照射部１４，１
５からの照射を交互に行い、ＣＣＤカメラ１７で扇状光
ｆ1 ，ｆ2 に対応する光切断像を別々に得る。図１に示
した地点ｇは溶接線地点ｈは反射率の低いごみの部分で
ある。ＣＣＤカメラ１７で得られた信号はデータ処理部
１８に送られ、データ処理部１８では、水平方向及び垂
直方向の溶接位置を検出し、レーザヘッド駆動装置１９
と水平位置補正用モータ２０及び垂直位置補正用モータ
２１によってレーザヘッド２２を位置合せする。次に、
図２を用いて、データ処理部１８について詳述する。As shown in FIG. 1, fan-shaped light beams f 1 and f 2 are alternately emitted from the irradiation units 14 and 15 to the same location of the workpiece 16. At this time, the fan-shaped lights f 1 and f 2 are in the same plane. An image pickup tube (hereinafter referred to as a CCD camera) 17 using a charge-coupled device observes the light section image formed by the fan-shaped lights f 1 and f 2 . At this time, the irradiation units 14, 1 are synchronized with the timing of inputting one screen of the CCD camera 17.
The irradiation from 5 is alternately performed, and the CCD camera 17 separately obtains the light-section images corresponding to the fan-shaped lights f 1 and f 2 . The point g shown in FIG. 1 is a welding line point h, which is a dust portion having a low reflectance. The signal obtained by the CCD camera 17 is sent to the data processing unit 18, and the data processing unit 18 detects the welding positions in the horizontal direction and the vertical direction, and the laser head driving device 19
The laser head 22 is aligned by the horizontal position correction motor 20 and the vertical position correction motor 21. next,
The data processing unit 18 will be described in detail with reference to FIG.
【００１３】本実施例では、２つの扇状光ｆ1 ，ｆ2 を
用いているので、光切断像も２つ得られる。そこで、輝
度分布測定手段２３では、それぞれの光切断像の溶接線
に直交方向の輝度分布を得る。また、距離分布測定手段
２４では、溶接線に直交方向のＣＣＤカメラ１７から被
加工物１６までの距離分布を得る。In this embodiment, since two fan-shaped lights f 1 and f 2 are used, two light section images can be obtained. Therefore, the luminance distribution measuring means 23 obtains the luminance distribution in the direction orthogonal to the welding line of each light section image. Further, the distance distribution measuring means 24 obtains the distance distribution from the CCD camera 17 to the workpiece 16 in the direction orthogonal to the welding line.
【００１４】輝度・距離分布特徴抽出手段２５では、あ
る注目範囲を設け、その範囲内及び外側の輝度分布，距
離分布の特徴を抽出し、この抽出結果を基に、溶接線確
度推定手段２６では予め設定された条件を用いて、注目
範囲が溶接線である確度を推定する。そして、水平溶接
位置決定手段２７では、溶接線確度推定手段２６の推定
結果を基に溶接線確度の最も高い位置を水平溶接位置と
する。The brightness / distance distribution feature extraction means 25 sets a certain range of interest, extracts the features of the brightness distribution and distance distribution within and outside the range, and based on the extraction result, the welding line accuracy estimation means 26. The probability that the attention area is the welding line is estimated using the preset conditions. Then, in the horizontal welding position determining means 27, the position having the highest welding line accuracy is set as the horizontal welding position based on the estimation result of the welding line accuracy estimating means 26.
【００１５】また距離確度推定手段２８では、上記確度
距離分布特徴抽出手段２５からの距離分布の特徴を基
に、予め設定された条件を用いて被加工物１６の溶接線
からＣＣＤカメラ１７までの距離確度を推定し、垂直溶
接位置決定手段２９では、距離確度推定手段２８からの
距離確度のうち確度の最も高い位置を垂直溶接位置とす
る。そして、水平溶接位置決定手段２７及び垂直溶接位
置決定手段２８からの水平溶接位置及び垂直溶接位置に
基いて、水平位置補正用モータ２０及び垂直位置補正用
モータ２１を駆動制御する。Further, the distance accuracy estimating means 28 uses the preset distance from the welding line of the workpiece 16 to the CCD camera 17 based on the characteristics of the distance distribution from the accuracy distance distribution characteristic extracting means 25. The distance accuracy is estimated, and the vertical welding position determination means 29 sets the position with the highest accuracy among the distance accuracy from the distance accuracy estimation means 28 as the vertical welding position. Then, based on the horizontal welding position and the vertical welding position from the horizontal welding position determining means 27 and the vertical welding position determining means 28, the horizontal position correcting motor 20 and the vertical position correcting motor 21 are drive-controlled.
【００１６】[0016]
【発明の効果】以上述べたように、本発明によれば、被
加工物の加工部位に照射されるレーザ光の方向を所定方
向に対して補正できるので、レーザ加工の品質特性に大
きく影響を及ぼすレーザ光のスポット径を加工部位に対
し一定に保つことができ、溶接品質の向上が図れる。As described above, according to the present invention, it is possible to correct the direction of the laser beam applied to the processed portion of the work piece with respect to the predetermined direction, which greatly affects the quality characteristics of the laser processing. The spot diameter of the exerted laser beam can be kept constant with respect to the processed portion, and the welding quality can be improved.
【図１】本発明の一実施例を示す斜視図。FIG. 1 is a perspective view showing an embodiment of the present invention.
【図２】図１に示したデータ処理部を示す詳細ブロック
図。FIG. 2 is a detailed block diagram showing a data processing unit shown in FIG.
【図３】従来のレーザ溶接機を示す斜視図。FIG. 3 is a perspective view showing a conventional laser welding machine.
【図４】図３に示したＣＣＤカメラが撮影している画像
を示す図。4 is a diagram showing an image taken by the CCD camera shown in FIG.
【図５】図４に示した画像の部分拡大図。5 is a partially enlarged view of the image shown in FIG.
１４，１５…照射部， １６…被加工物， １７…ＣＣ
Ｄカメラ，１８…データ処理装置， ２３…輝度分布測
定手段，２４…距離分布測定手段， ２５…輝度・距離
分布特徴抽出手段，２６…溶接線確度推定手段 ２７…
水平溶接位置決定手段，２８…距離確度推定手段， ２
９…垂直溶接位置決定手段，ｆ1 …扇状光， ｆ2 …扇
状光， ｇ…溶接線。14, 15 ... Irradiation part, 16 ... Workpiece, 17 ... CC
D camera, 18 ... Data processing device, 23 ... Luminance distribution measuring means, 24 ... Distance distribution measuring means, 25 ... Luminance / distance distribution feature extracting means, 26 ... Welding line accuracy estimating means 27 ...
Horizontal welding position determining means, 28 ... Distance accuracy estimating means, 2
9: vertical welding position determining means, f 1 ... fan-shaped light, f 2 ... fan-shaped light, g ... welding line.
Claims (1)
出し、この検出された加工部位にレーザ光を照射して加
工を施すレーザ加工装置において、前記被加工物の所定
部位に光を照射する照射手段と、この照射手段から光を
照射された所定部位の輝度及び所定方向に対する距離分
布を検出する検出手段と、この検出手段からの検出結果
を基に、その特徴を抽出する特徴抽出手段と、この特徴
抽出手段からの抽出結果を基に、前記所定部位が加工部
位であるか否かを判定する判定手段と、この判定手段か
らの判定結果を基に、前記所定部位に前記レーザ光を照
射して加工を施すか否かを決定する決定手段とを具備し
たことを特徴とするレーザ加工装置。1. A laser processing apparatus for detecting a processed portion of a workpiece by a non-contact method and irradiating the detected processed portion with a laser beam to perform processing. Irradiating means for irradiating, a detecting means for detecting the brightness and a distance distribution in a predetermined direction of a predetermined portion irradiated with light from the irradiating means, and a feature for extracting the characteristics based on the detection result from the detecting means Based on the extraction means and the extraction result from the feature extraction means, a determination means for determining whether or not the predetermined portion is a processed portion, and based on the determination result from the determination means, the predetermined portion is A laser processing apparatus comprising: a determining unit that determines whether or not to perform processing by irradiating a laser beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3312195A JPH05146885A (en) | 1991-11-27 | 1991-11-27 | Laser beam machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3312195A JPH05146885A (en) | 1991-11-27 | 1991-11-27 | Laser beam machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05146885A true JPH05146885A (en) | 1993-06-15 |
Family
ID=18026358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3312195A Pending JPH05146885A (en) | 1991-11-27 | 1991-11-27 | Laser beam machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05146885A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008014740A1 (en) | 2006-08-01 | 2008-02-07 | Eroform Edelstahl Gmbh | Suspension for a laser welding unit |
| JP2009525186A (en) * | 2006-02-01 | 2009-07-09 | ティッセンクルップ スチール アクチェンゲゼルシャフト | Laser beam welding |
| CN101704202A (en) * | 2009-11-11 | 2010-05-12 | 上海宝信软件股份有限公司 | Device and method for extracting steel plate outline on wire cutting machine |
| CN110238520A (en) * | 2019-06-26 | 2019-09-17 | 北京工业大学 | A kind of automatic precision method for laser welding based on CCD vision-based detection |
| DE112015004532B4 (en) | 2014-10-02 | 2024-02-01 | Ngk Spark Plug Co., Ltd. | Evaluation method, laser device and method for producing a sensor |
-
1991
- 1991-11-27 JP JP3312195A patent/JPH05146885A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009525186A (en) * | 2006-02-01 | 2009-07-09 | ティッセンクルップ スチール アクチェンゲゼルシャフト | Laser beam welding |
| WO2008014740A1 (en) | 2006-08-01 | 2008-02-07 | Eroform Edelstahl Gmbh | Suspension for a laser welding unit |
| CN101704202A (en) * | 2009-11-11 | 2010-05-12 | 上海宝信软件股份有限公司 | Device and method for extracting steel plate outline on wire cutting machine |
| DE112015004532B4 (en) | 2014-10-02 | 2024-02-01 | Ngk Spark Plug Co., Ltd. | Evaluation method, laser device and method for producing a sensor |
| CN110238520A (en) * | 2019-06-26 | 2019-09-17 | 北京工业大学 | A kind of automatic precision method for laser welding based on CCD vision-based detection |
| CN110238520B (en) * | 2019-06-26 | 2021-09-24 | 北京工业大学 | Automatic precise laser welding method based on CCD visual detection |
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