JPH06344167A - Laser beam machine - Google Patents

Laser beam machine

Info

Publication number
JPH06344167A
JPH06344167A JP5135504A JP13550493A JPH06344167A JP H06344167 A JPH06344167 A JP H06344167A JP 5135504 A JP5135504 A JP 5135504A JP 13550493 A JP13550493 A JP 13550493A JP H06344167 A JPH06344167 A JP H06344167A
Authority
JP
Japan
Prior art keywords
workpiece
distance
imaging
laser
welded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5135504A
Other languages
Japanese (ja)
Inventor
Yoshimune Kodama
義宗 小玉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP5135504A priority Critical patent/JPH06344167A/en
Publication of JPH06344167A publication Critical patent/JPH06344167A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)
  • Closed-Circuit Television Systems (AREA)

Abstract

PURPOSE:To improve the quality of a laser beam machine by preventing the focus displacement of CCD camera to photograph a work and precisely travel controlling a laser head. CONSTITUTION:A work 21 to be welded is traveled in the arrow mark direction A with butting a weld zone 22. A welding head 23 is placed so as to weld a weld zone 22. A position detecting sensor 26 is positioned in front of the welding head 23, the work 21 to be welded is irradiated with a belt-like beam by illumination parts 27, 28, photographing its optical cross sectional image by CCD camera 29. A data processing part 31 assumes the weld zone 22 as well as a vertical distance based on the image information, travel controlling the vertical position of CCD camera 29 by a distance correcting monitor 30 so as to set the position in the zone depth to be photographed, accordingly at all times the work to be welded 21 is precisely photographed, confirming the weld zone so as to execute welding.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、被加工物の加工部位を
非接触で検出してレーザヘッドからレーザ光を照射する
ようにしたレーザ加工装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus which detects a processed portion of a workpiece without contact and irradiates a laser beam from a laser head.

【0002】[0002]

【従来の技術】従来、この種の装置としては、例えば、
図5に示すようなレーザ溶接機がある。被加工物として
の被溶接物1は、直線状の溶接加工部位2を突き合わせ
た状態でセットされ、その突き合わせギャップ部1aの
方向(図中矢印A方向)に移動されるようになってい
る。溶接ヘッド3はレーザ光を下方に向けて照射して被
溶接物1の溶接加工部位2を溶接加工するもので、その
レーザ光の照射位置は、垂直位置補正モータ4により被
溶接物1との対向する方向(図中矢印B方向)の移動制
御を行って距離が補正され、水平位置補正モータ5によ
り被溶接物1の突き合わせギャップ1aのラインとほぼ
直交する水平方向(図中矢印C方向)に移動制御される
ようになっている。
2. Description of the Related Art Conventionally, as this type of device, for example,
There is a laser welding machine as shown in FIG. A work piece 1 as a work piece is set in a state in which linear welding portions 2 are butted, and is moved in the direction of the butted gap portion 1a (direction of arrow A in the figure). The welding head 3 irradiates a laser beam downward to weld the welded portion 2 of the object 1 to be welded, and the irradiation position of the laser beam is set by the vertical position correction motor 4 with respect to the object 1 to be welded. The movement is controlled in the opposite direction (direction of arrow B in the figure) to correct the distance, and the horizontal position correction motor 5 causes the horizontal direction (direction of arrow C in the figure) substantially orthogonal to the line of the butt gap 1a of the workpiece 1 to be welded. The movement is controlled.

【0003】この溶接ヘッド3よりも反矢印A方向の位
置には、被溶接物1の突き合わせギャップ部1aを検出
する位置検出装置6が配設されている。この位置検出装
置6は、被溶接物1にスリットを介した帯状の光を同一
平面内で照射する2つの照明部7,8と、被溶接物1の
照明部位を撮影するCCDカメラ9とから構成される。
CCDカメラ9は矢印B方向に光軸が設定されており、
被溶接物1を真上から撮影するようになっており、照明
部7,8からの帯状の光の照射位置が被溶接物1の表面
の凹凸に応じて変化するように斜め上方に配置されてい
る。
A position detecting device 6 for detecting the butt gap portion 1a of the object 1 to be welded is disposed at a position opposite to the arrow A direction with respect to the welding head 3. The position detection device 6 includes two illumination units 7 and 8 that irradiate the workpiece 1 with strip-shaped light through a slit in the same plane, and a CCD camera 9 that captures an illuminated portion of the workpiece 1. Composed.
The optical axis of the CCD camera 9 is set in the direction of arrow B,
The object to be welded 1 is photographed from directly above, and is arranged obliquely upward so that the irradiation position of the band-shaped light from the illumination units 7 and 8 changes according to the unevenness of the surface of the object to be welded 1. ing.

【0004】データ処理部10はCCDカメラ9からの
画像信号に基いて、被溶接物1の溶接加工部位2を検出
し、被溶接物1が矢印A方向に移動していま検出した溶
接加工部位2が溶接ヘッド3のレーザ光照射位置に達す
るときに適切な位置に来るように駆動回路11を介して
前記垂直位置補正モータ4および水平位置補正モータ5
を駆動制御する。
The data processing unit 10 detects the welded portion 2 of the workpiece 1 on the basis of the image signal from the CCD camera 9, and the welded portion 1 of the workpiece 1 is moving in the direction of arrow A and is now detected. The vertical position correction motor 4 and the horizontal position correction motor 5 are arranged via a drive circuit 11 so that the laser beam 2 reaches an appropriate position when the laser beam irradiation position of the welding head 3 is reached.
Drive control.

【0005】上記構成によれば、矢印A方向に移動され
る被溶接物1に対して、位置検出装置6の照明部7,8
から溶接加工部位2に交互に照明光を照射し、それぞれ
の照射タイミングに応じた画像をCCDカメラ9で撮影
し、その画像信号に基いて被溶接物1と溶接ヘッド3と
の相対的な位置を検出する。この場合、照明部7,8か
ら照射された帯状の光は、被溶接物1の表面の凹凸に応
じて屈曲された状態に被溶接物1に投影される。帯状の
光は、被溶接物1の表面の高さ方向(矢印B方向)の位
置が基準高さ位置にある部分は所定の基準線に投影さ
れ、その基準高さ位置からの高さ方向の寸法が大きくな
るに従って、基準線からのずれ量が大きくなる。
According to the above configuration, the illumination parts 7 and 8 of the position detecting device 6 are provided with respect to the work piece 1 which is moved in the direction of arrow A.
The welding processing portion 2 is alternately irradiated with the illumination light, the image corresponding to each irradiation timing is photographed by the CCD camera 9, and the relative position between the workpiece 1 and the welding head 3 is based on the image signal. To detect. In this case, the strip-shaped light emitted from the illumination units 7 and 8 is projected on the work piece 1 in a bent state according to the unevenness of the surface of the work piece 1. The strip-shaped light is projected on a predetermined reference line at a portion where the position of the surface of the object to be welded 1 in the height direction (arrow B direction) is at the reference height position, and the light in the height direction from the reference height position is projected. As the size increases, the amount of deviation from the reference line increases.

【0006】したがって、データ処理部10において
は、CCDカメラ9から得られた画像信号に基いて被溶
接物1の表面形状とその高さ方向の距離の分布を検出す
ることができ、その検出結果に基いて、あらかじめ記憶
された被溶接物1のデータと比較して溶接加工部位2の
位置を求める。そして、駆動回路11を介して垂直位置
補正モータ4および水平位置補正モータ5を駆動制御
し、被溶接物1が溶接ヘッド3の下部に達するときに溶
接加工部位2にレーザ光が照射されるように制御する。
Therefore, the data processing section 10 can detect the distribution of the surface shape of the workpiece 1 and its distance in the height direction based on the image signal obtained from the CCD camera 9, and the detection result. Based on the above, the position of the welded portion 2 is obtained by comparing with the data of the workpiece 1 stored in advance. Then, the vertical position correction motor 4 and the horizontal position correction motor 5 are drive-controlled via the drive circuit 11 so that the laser beam is irradiated to the welding processed portion 2 when the workpiece 1 reaches the lower portion of the welding head 3. To control.

【0007】これにより、被溶接物1は、矢印A方向に
移動されながら、適切な溶接位置に溶接ヘッド3からレ
ーザ光が照射され、連続的に溶接加工が施されるように
なるものである。
As a result, the object to be welded 1 is moved in the direction of arrow A, while the laser beam is emitted from the welding head 3 to an appropriate welding position so that the welding process is continuously performed. .

【0008】[0008]

【発明が解決しようとする課題】しかしながら、上述の
ような従来構成のものでは、被溶接物1の加工表面に大
きな凹凸がある場合や、上下方向の相対位置がずれてC
CDカメラ9の焦点距離範囲から外れている場合には、
撮影される画像自体が不鮮明となり、その画像データに
基いてギャップ部2aの位置を推定する際に正確な位置
を検出することができず、加工不良が生じてしまう不具
合があった。
However, in the conventional structure as described above, when the work surface of the workpiece 1 has large irregularities or the relative position in the vertical direction is displaced, C
If it is out of the focal length range of the CD camera 9,
The photographed image itself becomes unclear, and when estimating the position of the gap portion 2a based on the image data, the accurate position cannot be detected, resulting in processing defects.

【0009】本発明は、上記事情に鑑みてなされたもの
で、その目的は、撮像手段による被加工物の加工対象部
位の画像を焦点ボケをなくして常に鮮明なものとし、レ
ーザヘッドによる加工を常に正確に実施できるようにし
たレーザ加工装置を提供するにある。
The present invention has been made in view of the above circumstances, and an object thereof is to make an image of a processing target portion of a workpiece by an image pickup means always clear without defocusing, and to perform processing by a laser head. It is an object of the present invention to provide a laser processing apparatus that can always be accurately executed.

【0010】[0010]

【課題を解決するための手段】本発明は、被加工物の加
工部位の所定範囲に照明手段により帯状の光を照射して
これを撮像手段により撮影し、その撮像手段からの画像
情報に基きレーザヘッドと前記被加工物との間の相対位
置を制御することにより前記加工部位にレーザ光を照射
して加工を行うようにしたレーザ加工装置を対象とする
ものであり、前記撮像手段と前記被加工物との間の相対
距離を制御するための撮像距離補正手段と、前記撮像手
段からの画像情報に基いて前記被加工物との間の相対距
離がその撮像手段の被写界深度内に入るように前記撮像
距離補正手段を制御する制御手段とを設けて構成したと
ころに特徴を有する。
According to the present invention, a predetermined area of a processed portion of a workpiece is irradiated with band-shaped light by an illuminating means, the light is photographed by an image pickup means, and based on image information from the image pickup means. The present invention is directed to a laser processing device that controls the relative position between a laser head and the object to be processed by irradiating the processed portion with a laser beam, the imaging means and the imaging device. An imaging distance correction means for controlling the relative distance to the workpiece and a relative distance to the workpiece based on image information from the imaging means are within the depth of field of the imaging means. And a control means for controlling the image pickup distance correction means so as to enter.

【0011】また、上記構成に加え、前記撮像手段から
の画像情報に基いて前記照明手段による帯状の光の輝度
分布および所定方向に対する距離分布を検出する検出手
段と、この検出手段の検出結果に基いてその画像の特徴
を抽出する抽出手段と、この抽出手段による抽出結果に
基いて前記撮像手段による撮影部位が加工対象部位であ
るか否かを判定する判定手段と、この判定手段による判
定結果に基いて前記レーザヘッドによる加工を決定する
決定手段とを設けて構成することもできる。
In addition to the above-mentioned structure, the detecting means for detecting the luminance distribution of the band-shaped light by the illuminating means and the distance distribution in the predetermined direction based on the image information from the image pickup means, and the detection result of the detecting means. Based on the extraction result of the extraction means, the determination means for determining whether or not the imaged region by the image capturing means is the processing target region, and the determination result by the determination means. It is also possible to provide a determining means for determining processing by the laser head based on the above.

【0012】[0012]

【作用】請求項1記載のレーザ加工装置によれば、レー
ザヘッドからレーザ光を照射して被加工物を加工すると
きに、あらかじめ照明手段により被加工物の所定部位に
照射し、被加工物の凹凸に起因してそのときの帯状の光
により生ずる光切断像を撮像手段により撮影して被加工
物とレーザヘッドとの間の距離と加工部分を検出する。
そして、被加工物とレーザヘッドとの間の相対位置を移
動制御して加工部分にレーザ光が照射されるようにして
レーザ加工を行う。このとき、制御手段は、撮像手段の
画像情報に基いて被加工物と撮像手段との間の距離につ
いても検出しており、検出した距離が撮像手段の被写界
深度から外れている場合には撮像距離補正手段に制御信
号を出力してそれらの間の相対距離を補正して被写界深
度内に入るようにする。したがって、撮像手段により撮
影される被加工物の加工部位は、常に正確な画像として
入力することができ、この結果、画像情報に基くレーザ
加工を精度良く行うことができるものである。
According to the laser processing apparatus of the present invention, when the laser beam is emitted from the laser head to process the workpiece, the illumination means irradiates a predetermined portion of the workpiece in advance so that the workpiece is processed. The light-section image generated by the band-shaped light at that time due to the unevenness of the image is photographed by the image pickup means to detect the distance between the workpiece and the laser head and the processed portion.
Then, the laser processing is performed by controlling the relative position between the workpiece and the laser head to irradiate the processed portion with the laser light. At this time, the control unit also detects the distance between the workpiece and the image pickup unit based on the image information of the image pickup unit, and when the detected distance is out of the depth of field of the image pickup unit. Outputs a control signal to the imaging distance correction means to correct the relative distance between them so that the distance falls within the depth of field. Therefore, the processed portion of the workpiece imaged by the image pickup means can always be input as an accurate image, and as a result, laser processing based on image information can be performed accurately.

【0013】請求項2記載のレーザ加工装置によれば、
検出手段により前記撮像手段からの画像情報に基いて前
記照明手段による帯状の光の輝度分布および所定方向に
対する距離分布を検出し、その検出結果に基いて抽出手
段によりその画像の特徴を抽出し、さらに、判定手段お
よび決定手段により、抽出結果に基いて前記撮像手段に
よる撮影部位が加工対象部位であるか否かを判定すると
共に、レーザヘッドによる加工を決定する。このとき、
上述同様に、撮像手段は被加工物が被写界深度内に入る
ように被加工物との間の相対距離が制御されているの
で、撮像手段の画像情報に基いた被加工物の加工部位の
推定を確実に行ってレーザ加工を実施することができ
る。
According to the laser processing apparatus of the second aspect,
Based on the image information from the image pickup means by the detection means, the luminance distribution of the strip-shaped light by the illumination means and the distance distribution in a predetermined direction are detected, and the characteristics of the image are extracted by the extraction means based on the detection result. Further, the determination means and the determination means determine whether or not the imaged part by the image pickup part is the part to be processed based on the extraction result, and determine the processing by the laser head. At this time,
Similarly to the above, since the relative distance between the image pickup means and the work piece is controlled so that the work piece is within the depth of field, the processed portion of the work piece based on the image information of the image pickup means. It is possible to perform the laser processing by reliably estimating.

【0014】[0014]

【実施例】以下、本発明をレーザ溶接機に適用した場合
の一実施例について図1ないし図4を参照しながら説明
する。図1は全体構成を示すもので、被加工物としての
被溶接物21は、湾曲した面を有する2つの部材21
a,21bを直線状の溶接加工部位22を突き合わせた
状態でセットされており、この被溶接物21は、図示し
ない駆動機構によりその突き合わせギャップ部22aの
方向(図中矢印A方向)に移動されるようになってい
る。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to a laser welding machine will be described below with reference to FIGS. FIG. 1 shows the overall configuration. A work piece 21 as a work piece is composed of two members 21 having curved surfaces.
a and 21b are set in a state in which the linear welded portions 22 are butted against each other, and the workpiece 21 is moved in the direction of the butted gap portion 22a (direction of arrow A in the figure) by a drive mechanism (not shown). It has become so.

【0015】溶接ヘッド23はレーザ光を下方に向けて
照射して被溶接物21の溶接加工部位22を溶接加工す
るもので、そのレーザ光の照射位置は、垂直位置補正モ
ータ24により被溶接物21との対向する方向(図中矢
印B方向)の移動制御を行って距離が補正され、水平位
置補正モータ25により被溶接物21の突き合わせギャ
ップ22aと直交する水平方向(図中矢印C方向)に移
動制御されるようになっている。
The welding head 23 irradiates a laser beam downward to weld the welded portion 22 of the workpiece 21, and the laser beam irradiation position is controlled by the vertical position correction motor 24. The distance is corrected by performing movement control in the direction opposite to 21 (the direction of arrow B in the figure), and the horizontal position correction motor 25 makes the horizontal direction orthogonal to the butt gap 22a of the workpiece 21 (direction of the arrow C in the figure). The movement is controlled.

【0016】この溶接ヘッド23よりも反矢印A方向の
位置には、被溶接物21の突き合わせギャップ部22a
を検出する位置検出装置26が配設されている。この位
置検出装置26は、被溶接物21にスリットを介した帯
状の光を同一平面内で照射する2つの照明部27,28
と、被溶接物21の照明部位を撮影する撮像手段として
のCCDカメラ29とから構成される。CCDカメラ2
9は矢印B方向に光軸が設定されており、被溶接物21
を真上から撮影するようになっている。照明部27,2
8は被溶接物21の表面の凹凸に応じて帯状の光の照射
位置が変化するように斜め上方に配置されている。ま
た、位置検出装置26は、撮像距離補正手段としての距
離補正モータ30により上下方向つまりCCDカメラ2
9の光軸方向(図中矢印B方向)に全体が移動可能に設
けられている。
At the position opposite to the arrow A direction with respect to the welding head 23, the abutting gap portion 22a of the workpiece 21 is welded.
A position detection device 26 for detecting the position is provided. The position detection device 26 includes two illumination units 27 and 28 that irradiate the workpiece 21 with band-shaped light through a slit in the same plane.
And a CCD camera 29 as an image pickup means for photographing the illuminated portion of the object to be welded 21. CCD camera 2
9, the optical axis is set in the direction of arrow B, and the object to be welded 21
Is designed to be shot from directly above. Illumination unit 27, 2
8 is arranged obliquely above so that the irradiation position of the strip-shaped light changes according to the unevenness of the surface of the workpiece 21. In addition, the position detection device 26 is vertically moved by the distance correction motor 30 as the image pickup distance correction means, that is, the CCD camera 2.
9 is provided so as to be movable in its entirety in the optical axis direction (direction of arrow B in the figure).

【0017】制御手段としてのデータ処理部31は、C
CDカメラ29からの画像信号に基いて、被溶接物21
の溶接加工部位22を検出し、その検出した被溶接物2
1の溶接加工部位22がが矢印A方向に移動して溶接ヘ
ッド23のレーザ光照射位置に達するときに適切な位置
に来るように駆動回路32を介して前記垂直位置補正モ
ータ24および水平位置補正モータ25を駆動制御する
ようになっている。また、CCDカメラ29の被溶接物
21に対する撮影距離がCCDカメラ29の被写界深度
の範囲内にはいるように前述の距離補正モータ30を駆
動回路32を介して駆動制御するようになっている。
The data processing unit 31 as the control means is
Based on the image signal from the CD camera 29, the object to be welded 21
Of the welded portion 22 of the workpiece 2 and the detected workpiece 2
The vertical position correction motor 24 and the horizontal position correction are performed via the drive circuit 32 so that the welding processing portion 22 of No. 1 moves in the direction of the arrow A and reaches an appropriate position when reaching the laser beam irradiation position of the welding head 23. The motor 25 is drive-controlled. Further, the distance correction motor 30 is driven and controlled via the drive circuit 32 so that the photographing distance of the CCD camera 29 with respect to the object to be welded 21 is within the range of the depth of field of the CCD camera 29. There is.

【0018】図2はデータ処理部31のブロック構成を
示すもので、次のように構成されている。検出手段とし
ての検出部33は、CCDカメラ29から画像信号が入
力されるもので、輝度分布検出部33aにおいては撮影
した画面内の溶接加工部位22の線に直交する方向の輝
度分布を求め、距離分布検出部33bにおいては撮影し
た画面の情報から基準位置に対する被溶接物21の撮影
面とのずれ量を検出する。抽出手段としての特徴抽出部
34は、所定の注目範囲を設定し、検出部33の結果か
らその内外における輝度分布および距離分布の特徴を抽
出する。
FIG. 2 shows a block configuration of the data processing unit 31, which is configured as follows. An image signal is input from the CCD camera 29 to the detecting unit 33 as a detecting unit, and the luminance distribution detecting unit 33a obtains the luminance distribution in the direction orthogonal to the line of the welded portion 22 in the photographed screen, The distance distribution detection unit 33b detects the amount of deviation of the object 21 to be photographed from the reference position from the information on the photographed screen. The feature extraction unit 34 as an extraction unit sets a predetermined range of interest and extracts the features of the luminance distribution and the distance distribution inside and outside the result of the detection unit 33.

【0019】判定手段としての判定部35は、溶接線確
度推定部35aにおいて特徴抽出部34の抽出結果に基
いて設定した注目範囲が溶接を行うべき部位であるか否
かの確度を推定すると共に、距離確度推定部35bにお
いてCCDカメラ29と被溶接物21との間の距離分布
の抽出結果に基いて溶接加工を行う部位の距離確度を推
定する。そして、決定手段としての位置決定部36は、
水平位置決定部36aと垂直位置決定部36bとからな
り、水平位置決定部36aにおいては、判定部35の結
果に基いて注目範囲に対して推定された確度が最も高い
部位を水平溶接位置として決定し制御信号として出力す
る。また、垂直位置決定部36bにおいては、判定部3
5による距離確度の推定結果に基いて、それらの確度の
うち最も高い位置を垂直溶接位置として決定し制御信号
を出力するようになっている。
The determination unit 35 as a determination means estimates the accuracy of whether or not the attention range set by the welding line accuracy estimation unit 35a based on the extraction result of the feature extraction unit 34 is a region to be welded. The distance accuracy estimation unit 35b estimates the distance accuracy of the portion to be welded based on the extraction result of the distance distribution between the CCD camera 29 and the workpiece 21. Then, the position determination unit 36 as the determination means
It consists of a horizontal position determination unit 36a and a vertical position determination unit 36b. In the horizontal position determination unit 36a, a region with the highest accuracy estimated for the attention range based on the result of the determination unit 35 is determined as the horizontal welding position. Output as a control signal. Further, in the vertical position determination unit 36b, the determination unit 3
Based on the distance accuracy estimation result of 5, the highest position among these accuracy is determined as the vertical welding position and a control signal is output.

【0020】次に、本実施例の作用について図3および
図4をも参照して説明する。すなわち、まず、矢印A方
向に移動される被溶接物21に対して、位置検出装置2
6の照明部27,28から交互に帯状の光が照射される
と、被溶接物21の上面にはその凹凸状態に応じて帯状
の光が切断された形状の輝度分布を有する光切断像SL
が図3のように形成される。CCDカメラ29はその光
切断像SLを上面から所定範囲E内で撮影し、その画像
情報を照明部27,28から帯状の光が照射される毎に
データ処理部31に出力する。このとき、例えば、CC
Dカメラ29により撮影された画面Eは図4に示すよう
に、被溶接物21の表面の凹凸形状に応じて照明部2
7,28による帯状の光が切断された形状に輝度分布を
有した状態となっている。
Next, the operation of this embodiment will be described with reference to FIGS. 3 and 4. That is, first, the position detecting device 2 is attached to the object to be welded 21 that is moved in the direction of arrow A.
When the strip-shaped light is alternately emitted from the illumination units 27 and 28 of No. 6, the light-section image SL having a luminance distribution in which the strip-shaped light is cut on the upper surface of the object to be welded 21 in accordance with the uneven state thereof.
Are formed as shown in FIG. The CCD camera 29 photographs the light section image SL within a predetermined range E from the upper surface, and outputs the image information to the data processing unit 31 each time the illumination units 27 and 28 irradiate band-shaped light. At this time, for example, CC
As shown in FIG. 4, the screen E captured by the D camera 29 has the illumination unit 2 according to the uneven shape of the surface of the workpiece 21.
7 and 28, the striped light has a luminance distribution in a cut shape.

【0021】この場合、被溶接物21の2つの部材21
a,21bの形状のそれぞれに対応して円弧状の投影部
分が突き合わされた状態に光切断像SLが形成されてお
り、その突き合わされた部分Dがレーザヘッド23によ
り溶接を行うべき部位である。図4においては、溶接点
Dは、被溶接物21の移動方向である矢印Aに沿った中
心線Qに対してΔQだけずれている。
In this case, the two members 21 of the object to be welded 21 are
The light section image SL is formed in a state where arc-shaped projection portions are abutted corresponding to the shapes of a and 21b, and the abutted portion D is a portion to be welded by the laser head 23. . In FIG. 4, the welding point D is deviated by ΔQ with respect to the center line Q along the arrow A which is the moving direction of the workpiece 21.

【0022】そして、幾何学的な関係から、CCDカメ
ラ29に対して被溶接物21の撮影面が例えば高さ方向
の基準位置にあるときには、画面E上において光切断像
SLが基準位置に対応する基準線Pに現れ、被溶接物2
1の撮影面がその基準位置から上下方向に離れる程、基
準線Pから離れた位置に光切断像SLが現れるようにな
っている。したがって、図中における溶接点DはΔPだ
け左にずれていることから基準位置から下にΔPに相当
する距離だけ下がった位置にあることを示している。
Due to the geometrical relationship, when the photographing surface of the object to be welded 21 is at the reference position in the height direction with respect to the CCD camera 29, the light section image SL on the screen E corresponds to the reference position. Appears on the reference line P that
The further the image plane 1 is away from the reference position in the vertical direction, the more the light section image SL appears at a position further away from the reference line P. Therefore, since the welding point D in the figure is shifted to the left by ΔP, it indicates that the welding point D is located below the reference position by a distance corresponding to ΔP.

【0023】さて、データ処理部31においては、CC
Dカメラ29から与えられた画像信号に基いて、まず、
検出部33の輝度分布検出部33aにおいては、撮影し
た画面E内の溶接加工部位22の線に直交する方向の輝
度分布を求め、距離分布検出部33bにおいては撮影し
た画面E内の画像信号から基準位置に対する被溶接物2
1の撮影面とのずれ量を検出する。次に、特徴抽出部3
4は、所定の注目範囲を設定し、検出部33の結果から
その内外における輝度分布および距離分布の特徴を抽出
し、判定部35においては、特徴抽出部34の抽出結果
に基いて設定した注目範囲が溶接を行うべき部位である
か否かの確度を推定すると共に、CCDカメラ29と被
溶接物21との間の距離分布の抽出結果に基いて溶接加
工を行う部位の距離確度を推定するようになる。
In the data processing unit 31, CC
Based on the image signal given from the D camera 29, first,
The luminance distribution detecting unit 33a of the detecting unit 33 obtains the luminance distribution in the direction orthogonal to the line of the welded part 22 in the photographed screen E, and the distance distribution detecting unit 33b uses the image signal in the photographed screen E to obtain the luminance distribution. Workpiece 2 for reference position
The amount of deviation from the photographing surface of No. 1 is detected. Next, the feature extraction unit 3
Reference numeral 4 sets a predetermined attention range, extracts the features of the luminance distribution and the distance distribution inside and outside thereof from the result of the detection unit 33, and the determination unit 35 sets the attention range set based on the extraction result of the feature extraction unit 34. The accuracy of whether or not the range is the part to be welded is estimated, and the distance accuracy of the part to be welded is estimated based on the extraction result of the distance distribution between the CCD camera 29 and the workpiece 21. Like

【0024】次に、位置決定部36は、水平位置決定部
36aにおいては、判定部35の結果から注目範囲に対
して推定された確度が最も高い部位を水平溶接位置とし
て決定し制御信号として出力するようになり、垂直位置
決定部36bにおいては、判定部35による距離確度の
推定結果からそれらの確度のうち最も高い位置を垂直溶
接位置として決定して制御信号を出力するようになる。
Next, the position determining unit 36 determines, in the horizontal position determining unit 36a, the portion having the highest accuracy estimated from the result of the determining unit 35 with respect to the attention range as the horizontal welding position and outputs it as a control signal. Then, in the vertical position determination unit 36b, the position of the highest accuracy is determined as the vertical welding position from the estimation result of the distance accuracy by the determination unit 35, and the control signal is output.

【0025】このとき、データ処理部31においては、
まず、上述の結果に基いて距離補正モータ30を駆動回
路32を介して駆動制御し、CCDカメラ29を含む位
置検出装置26を移動させ、被溶接物21がCCDカメ
ラ29の被写界深度の範囲内に入るように制御する。こ
れにより、CCDカメラ29は、常に被溶接物21を被
写界深度内つまり焦点ボケが生じない状態で鮮明な画像
で撮影することができるようになる。
At this time, in the data processing section 31,
First, based on the above result, the distance correction motor 30 is drive-controlled via the drive circuit 32, the position detection device 26 including the CCD camera 29 is moved, and the welding object 21 is set to the depth of field of the CCD camera 29. Control to stay within the range. As a result, the CCD camera 29 can always take a clear image of the object to be welded 21 within the depth of field, that is, in the state where defocusing does not occur.

【0026】そして、データ処理部31は、このように
して得られた制御信号を駆動回路32を介して垂直位置
補正モータ24および水平位置補正モータ25を駆動制
御し、被溶接物21が溶接ヘッド23の下部に達すると
きに溶接加工部位22にレーザ光が照射されるように制
御するようになる。これにより、被溶接物21は、矢印
A方向に移動されながら、常に適切な溶接位置に溶接ヘ
ッド23からレーザ光が照射され、連続的に溶接加工が
施されるようになるものである。
Then, the data processing unit 31 drives and controls the vertical position correction motor 24 and the horizontal position correction motor 25 via the drive circuit 32 based on the control signal thus obtained, and the workpiece 21 is welded to the welding head. Control is performed so that the laser beam is applied to the welded portion 22 when reaching the lower portion of 23. As a result, the object to be welded 21 is constantly moved in the direction of the arrow A while being irradiated with the laser beam from the welding head 23 at an appropriate welding position and continuously subjected to the welding process.

【0027】このような本実施例によれば、位置検出装
置26によりCCDカメラ29と被溶接物21との間の
距離を推定し、その検出結果に基いて距離補正モータ3
0を駆動制御してCCDカメラ29を移動させ、これに
より、被溶接物21がCCDカメラ29の被写界深度の
範囲内に入るようにしたので、CCDカメラ29は、常
に被溶接物21を被写界深度内つまり焦点ボケが生じな
い状態で鮮明な画像で撮影することができるようにな
る。
According to the present embodiment as described above, the position detecting device 26 estimates the distance between the CCD camera 29 and the object to be welded 21, and the distance correction motor 3 is based on the detection result.
Since 0 is driven and the CCD camera 29 is moved so that the object to be welded 21 is within the range of the depth of field of the CCD camera 29, the CCD camera 29 always moves the object to be welded 21. It becomes possible to shoot a clear image within the depth of field, that is, in a state where defocusing does not occur.

【0028】また、位置検出装置26を、検出部33,
特徴抽出部34,判定部35および位置決定部36から
構成し、CCDカメラ29により得られる光切断像SL
の画像信号に基いてデータ処理を行い、溶接を行うべき
部位を推定し、駆動回路32を介して前記垂直位置補正
モータ24および水平位置補正モータ25を駆動制御す
るようにしたので、上述の効果に加えて精度良く溶接加
工部位を認識してレーザヘッド23により溶接加工を行
うことができる。
Further, the position detecting device 26 is provided with a detecting section 33,
A light-section image SL obtained by the CCD camera 29, which includes a feature extraction unit 34, a determination unit 35, and a position determination unit 36.
The data processing is performed on the basis of the image signal of (1) to estimate the portion to be welded, and the vertical position correction motor 24 and the horizontal position correction motor 25 are drive-controlled via the drive circuit 32. In addition to this, it is possible to accurately recognize the welding processing portion and perform the welding processing by the laser head 23.

【0029】尚、上記実施例においては、本発明をレー
ザ溶接機に適用した場合について述べたが、これに限ら
ず、例えばレーザ切断加工機など、レーザ光を利用して
被加工物を加工するレーザ加工装置全般に適用できるも
のである。
In the above embodiments, the case where the present invention is applied to the laser welding machine has been described, but the present invention is not limited to this, and a workpiece is processed by using laser light, for example, a laser cutting machine. It is applicable to all laser processing devices.

【0030】[0030]

【発明の効果】以上説明したように、本発明のレーザ加
工装置によれば、次のような効果を得ることができる。
すなわち、請求項1記載のレーザ加工装置によれば、撮
像手段により被加工物の凹凸に起因して照明手段からの
帯状の光により生ずる光切断像を撮影した画像情報に基
いて、制御手段により、制御手段により、被加工物と撮
像手段との間の距離を検出し、その検出した距離が撮像
手段の被写界深度の範囲から外れている場合には、撮像
距離補正手段に制御信号を出力してそれらの間の相対距
離を補正して被写界深度内に入るようにしたので、撮像
手段により撮影される被加工物の加工部位は、常に正確
な画像として入力することができ、この結果、画像情報
に基くレーザ加工を精度良く行うことができるという優
れた効果を奏する。
As described above, according to the laser processing apparatus of the present invention, the following effects can be obtained.
That is, according to the laser processing apparatus of the first aspect, the control means controls the image processing means based on the image information obtained by capturing the light-section image generated by the band-shaped light from the illumination means due to the unevenness of the workpiece. The control means detects the distance between the workpiece and the image pickup means, and when the detected distance is out of the range of the depth of field of the image pickup means, a control signal is sent to the image pickup distance correction means. Since the output is made so as to correct the relative distance between them so as to be within the depth of field, the processed portion of the workpiece imaged by the imaging means can be always input as an accurate image, As a result, there is an excellent effect that the laser processing based on the image information can be accurately performed.

【0031】請求項2記載のレーザ加工装置によれば、
検出手段,抽出手段,判定手段および決定手段を設け、
撮像手段からの画像情報に基いて検出手段により照明手
段から被加工物に照射された帯状の光の輝度分布および
所定方向に対する距離分布を検出し、抽出手段により検
出手段の検出結果に基いてその画像の特徴を抽出し、判
定手段により抽出手段による抽出結果に基いて撮像手段
による撮影部位が加工対象部位であるか否かを判定し、
この後、決定手段により判定手段の判定結果に基いて前
記レーザヘッドによる加工部位を決定するようにしたの
で、撮像手段の画像情報に基いた被加工物の加工部位の
推定を確実に行ってレーザ加工を実施することができる
という優れた効果を奏する。
According to the laser processing apparatus of the second aspect,
Providing detection means, extraction means, determination means and determination means,
Based on the image information from the image pickup means, the detection means detects the luminance distribution of the band-shaped light emitted from the illumination means to the workpiece and the distance distribution in a predetermined direction, and the extraction means detects the luminance distribution based on the detection result of the detection means. The feature of the image is extracted, and the determination unit determines whether or not the imaged region by the image capturing unit is the processing target region based on the extraction result by the extraction unit,
After that, the processing portion is determined by the laser head based on the determination result of the determination means by the determination means. Therefore, the processing portion of the workpiece is reliably estimated based on the image information of the image capturing means, and the laser beam is reliably estimated. It has an excellent effect that processing can be performed.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示す全体構成の概略斜視図FIG. 1 is a schematic perspective view of the overall configuration showing an embodiment of the present invention.

【図2】データ処理部の内部構成を示すブロック図FIG. 2 is a block diagram showing an internal configuration of a data processing unit.

【図3】被加工物の上面図FIG. 3 is a top view of the work piece.

【図4】CCDカメラの撮影画面を示す図FIG. 4 is a diagram showing a shooting screen of a CCD camera.

【図5】従来例を示す図1相当図FIG. 5 is a view corresponding to FIG. 1 showing a conventional example.

【符号の説明】[Explanation of symbols]

21は被溶接物(被加工物)、21a,21bは部材、
22は溶接加工部位、22aは突き合わせギャップ部、
23は溶接ヘッド(レーザヘッド)、24は垂直位置補
正モータ、25は水平位置補正モータ、26は位置検出
装置、27,28は照明部(照明手段)、29はCCD
カメラ(撮像手段)、30は距離補正モータ(撮像距離
補正手段)、31はデータ処理部(制御手段)、32は
駆動回路、33は検出部(検出手段)、33aは輝度分
布検出部、33bは距離分布検出部、34は特徴抽出部
(抽出手段)、35は判定部(判定手段)、36は位置
決定部(決定手段)、36aは水平位置決定部、36b
は垂直位置決定部である。
21 is a workpiece (workpiece), 21a and 21b are members,
22 is a welded portion, 22a is a butt gap portion,
23 is a welding head (laser head), 24 is a vertical position correction motor, 25 is a horizontal position correction motor, 26 is a position detection device, 27 and 28 are illumination units (illumination means), and 29 is a CCD.
A camera (imaging unit), 30 is a distance correction motor (imaging distance correcting unit), 31 is a data processing unit (control unit), 32 is a drive circuit, 33 is a detection unit (detection unit), 33a is a luminance distribution detection unit, and 33b. Is a distance distribution detecting unit, 34 is a feature extracting unit (extracting unit), 35 is a determining unit (determining unit), 36 is a position determining unit (determining unit), 36a is a horizontal position determining unit, and 36b.
Is a vertical position determining unit.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 被加工物の加工部位の所定範囲に照明手
段により帯状の光を照射してこれを撮像手段により撮影
し、その撮像手段からの画像情報に基きレーザヘッドと
前記被加工物との間の相対位置を制御することにより前
記加工部位にレーザ光を照射して加工を行うようにした
レーザ加工装置において、 前記撮像手段と前記被加工物との間の相対距離を制御す
るための撮像距離補正手段と、 前記撮像手段からの画像情報に基いて前記被加工物との
間の相対距離がその撮像手段の被写界深度内に入るよう
に前記撮像距離補正手段を制御する制御手段とを具備し
たことを特徴とするレーザ加工装置。
1. A predetermined area of a processed portion of a workpiece is irradiated with band-shaped light by an illuminating means and is photographed by an image pickup means. Based on image information from the image pickup means, a laser head and the workpiece. In the laser processing apparatus that performs processing by irradiating the processed portion with a laser beam by controlling the relative position between, for controlling the relative distance between the imaging unit and the workpiece. Control means for controlling the imaging distance correction means so that the relative distance between the imaging distance correction means and the workpiece based on the image information from the imaging means falls within the depth of field of the imaging means. A laser processing apparatus comprising:
【請求項2】 被加工物の加工部位の所定範囲に照明手
段により帯状の光を照射してこれを撮像手段により撮影
し、その撮像手段からの画像情報に基きレーザヘッドと
前記被加工物との間の相対位置を制御することにより前
記加工部位にレーザ光を照射して加工を行うようにした
レーザ加工装置において、 前記撮像手段からの画像情報に基いて前記照明手段によ
る帯状の光の輝度分布および所定方向に対する距離分布
を検出する検出手段と、 この検出手段の検出結果に基いてその画像の特徴を抽出
する抽出手段と、 この抽出手段による抽出結果に基いて前記撮像手段によ
る撮影部位が加工対象部位であるか否かを判定する判定
手段と、 この判定手段による判定結果に基いて前記レーザヘッド
による加工を決定する決定手段と、 前記撮像手段と前記被加工物との間の相対距離を制御す
るための撮像距離補正手段と、 前記検出手段により得られる距離分布結果に基いて前記
被加工物との間の相対距離を検出し、その相対距離が前
記撮像手段の被写界深度内に入るように前記撮像距離補
正手段を制御する制御手段とを具備したことを特徴とす
るレーザ加工装置。
2. A predetermined area of a processed portion of a workpiece is irradiated with band-shaped light by an illuminating means and is photographed by an image pickup means. Based on image information from the image pickup means, a laser head and the workpiece. In the laser processing apparatus that performs processing by irradiating the processed portion with laser light by controlling the relative position between the two, the brightness of the band-shaped light by the illumination unit based on the image information from the imaging unit. The detection means for detecting the distribution and the distance distribution with respect to the predetermined direction; the extraction means for extracting the characteristics of the image based on the detection result of the detection means; and the imaging region by the imaging means based on the extraction result by the extraction means. Determination means for determining whether or not it is a processing target portion, determination means for determining processing by the laser head based on a determination result by the determination means, and the imaging means Imaging distance correction means for controlling the relative distance to the workpiece, and the relative distance to the workpiece based on the distance distribution result obtained by the detection means, the relative distance And a control means for controlling the image pickup distance correction means so that the image pickup distance is within the depth of field of the image pickup means.
JP5135504A 1993-06-07 1993-06-07 Laser beam machine Pending JPH06344167A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5135504A JPH06344167A (en) 1993-06-07 1993-06-07 Laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5135504A JPH06344167A (en) 1993-06-07 1993-06-07 Laser beam machine

Publications (1)

Publication Number Publication Date
JPH06344167A true JPH06344167A (en) 1994-12-20

Family

ID=15153311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5135504A Pending JPH06344167A (en) 1993-06-07 1993-06-07 Laser beam machine

Country Status (1)

Country Link
JP (1) JPH06344167A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000196924A (en) * 1998-12-24 2000-07-14 Ishikawajima Harima Heavy Ind Co Ltd Weld image pickup device using double laser illumination
JP2003516860A (en) * 1999-11-27 2003-05-20 ティッセンクルップ シュタール アクチェンゲゼルシャフト Method and apparatus for quality control of laser butt welded sheet metal or band seams
JP2003251476A (en) * 2002-03-01 2003-09-09 Denso Corp High density energy machining device and method
KR100447924B1 (en) * 2002-03-25 2004-09-13 사단법인 고등기술연구원 연구조합 Apparatus for controlling position of welding head in welding robot
KR100447923B1 (en) * 2002-03-27 2004-09-13 사단법인 고등기술연구원 연구조합 Position precision control apparatus for laser welding by use of robot and method thereof
KR100556287B1 (en) * 2004-09-01 2006-03-03 한국원자력연구소 Laser welding method and apparatus for sealing a seed capsule
US7595895B2 (en) 2004-01-13 2009-09-29 Hamamatsu Photonics K.K. Laser beam machining system
JP2011045892A (en) * 2009-08-25 2011-03-10 Nippon Sharyo Seizo Kaisha Ltd Nozzle gap measuring apparatus
WO2013133197A1 (en) * 2012-03-08 2013-09-12 株式会社 アマダ Welding robot and gap adjustment method for welding robot
CN104227244A (en) * 2014-09-17 2014-12-24 沈阳工业大学 Electromagnetic drive permanent magnet self-resetting laser cutting head
JP2016055345A (en) * 2014-09-12 2016-04-21 株式会社ダイヘン Camera position adjusting device, welding robot system, and camera position adjusting method
CN108213788A (en) * 2018-01-03 2018-06-29 湘潭大学 A kind of full pose corrugated plating intelligence weld seam tracking sensor of three mesh
CN110421258A (en) * 2019-08-15 2019-11-08 珠海冠宇电源有限公司 Laser welding and solder joint detect all-in-one machine
CN112222620A (en) * 2020-09-29 2021-01-15 哈尔滨工业大学 Ultra-narrow gap laser wire filling welding pool image real-time monitoring device
CN114406551A (en) * 2022-03-02 2022-04-29 深圳美新隆制罐有限公司 Intelligent welding system for metal can production

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000196924A (en) * 1998-12-24 2000-07-14 Ishikawajima Harima Heavy Ind Co Ltd Weld image pickup device using double laser illumination
JP2003516860A (en) * 1999-11-27 2003-05-20 ティッセンクルップ シュタール アクチェンゲゼルシャフト Method and apparatus for quality control of laser butt welded sheet metal or band seams
JP2003251476A (en) * 2002-03-01 2003-09-09 Denso Corp High density energy machining device and method
KR100447924B1 (en) * 2002-03-25 2004-09-13 사단법인 고등기술연구원 연구조합 Apparatus for controlling position of welding head in welding robot
KR100447923B1 (en) * 2002-03-27 2004-09-13 사단법인 고등기술연구원 연구조합 Position precision control apparatus for laser welding by use of robot and method thereof
US7595895B2 (en) 2004-01-13 2009-09-29 Hamamatsu Photonics K.K. Laser beam machining system
KR100556287B1 (en) * 2004-09-01 2006-03-03 한국원자력연구소 Laser welding method and apparatus for sealing a seed capsule
JP2011045892A (en) * 2009-08-25 2011-03-10 Nippon Sharyo Seizo Kaisha Ltd Nozzle gap measuring apparatus
WO2013133197A1 (en) * 2012-03-08 2013-09-12 株式会社 アマダ Welding robot and gap adjustment method for welding robot
JP2016055345A (en) * 2014-09-12 2016-04-21 株式会社ダイヘン Camera position adjusting device, welding robot system, and camera position adjusting method
CN104227244A (en) * 2014-09-17 2014-12-24 沈阳工业大学 Electromagnetic drive permanent magnet self-resetting laser cutting head
CN108213788A (en) * 2018-01-03 2018-06-29 湘潭大学 A kind of full pose corrugated plating intelligence weld seam tracking sensor of three mesh
CN110421258A (en) * 2019-08-15 2019-11-08 珠海冠宇电源有限公司 Laser welding and solder joint detect all-in-one machine
CN112222620A (en) * 2020-09-29 2021-01-15 哈尔滨工业大学 Ultra-narrow gap laser wire filling welding pool image real-time monitoring device
CN114406551A (en) * 2022-03-02 2022-04-29 深圳美新隆制罐有限公司 Intelligent welding system for metal can production
CN114406551B (en) * 2022-03-02 2024-04-23 深圳美新隆制罐有限公司 Intelligent welding system for metal can production

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