TWI774061B - Laser processing device - Google Patents

Abstract

A laser processing device for processing a workpiece is provided. The laser processing device includes a laser emitter, a lens module, a driving module, a camera module, and a processing unit. The camera module can capture an image of the work piece, and the processing unit is electrically connected to the camera module and the driving module. The camera module transmits an image signal to the processing unit according to the image, and the processing unit transmits a driving signal to the driving module according to the image signal, thus driving an optical lens of the lens module to move.

Description

Laser processing equipment

The present invention relates to a laser processing device, in particular to a laser processing device that can adjust the size of the laser spot.

Generally, when laser soldering equipment is used for laser processing, an optical lens combination can be used to focus the energy of the light beam within a specific range to process the pads. However, in the laser soldering process, it is often necessary to process pads of different sizes. If the laser spot is too small, the pads cannot be heated uniformly. However, if the laser spot is too large, the printed circuit substrate may be burned.

FIG. 1 shows a schematic diagram of a conventional laser processing apparatus 10 processing pads S on a substrate B (eg, a printed circuit board). As shown in FIG. 1, a conventional laser processing device 10 is usually provided with one or more optical lenses 11, and a laser light source located inside the laser processing device 10 can emit laser light E, and the laser The emitted light E will pass through the aforementioned optical lens 11 and then be projected on the pad S of a substrate B (as shown by the laser light E').

As can be seen from FIG. 1, the pad S on the substrate B has a diameter Ld, and the laser light E' emitted from the laser processing device 10 can form a diameter corresponding to the size of the pad S on the substrate B spot. However, since the optical lens 11 inside the conventional laser processing device 10 cannot be moved arbitrarily, the conventional laser processing device 10 must be moved to a specific position when the spot size needs to be adjusted, which often results in the use of Inconvenient, but also reduce production efficiency.

In view of this, how to provide a high-efficiency and more flexible laser processing device has become an important challenge.

In view of the aforementioned conventional problems, an embodiment of the present invention provides a laser processing apparatus for processing a workpiece. The laser processing device includes a laser light source, a lens module, a driving module, a camera module and a processing unit. The lens module has a first optical lens and a second optical lens. The laser light source emits a laser beam that passes through the first and second optical lenses and is projected on the workpiece. The driving module is used for driving the first optical lens to move relative to the second optical lens. The camera module is used for capturing an image of the workpiece, the processing unit is electrically connected to the camera module and the driving module, the camera module transmits an image data to the processing unit according to the image of the workpiece, and the processing unit transmits a driving signal according to the image data to the driving module to drive the first optical lens to move relative to the second optical lens.

In one embodiment, the laser processing apparatus further includes a power measurement module for measuring the power intensity of the laser light.

In one embodiment, the laser processing device further includes a beam splitter, a part of the laser light emitted from the laser light source is reflected by the beam splitter and then reaches the workpiece, and the other part of the laser light passes through the beam splitter to reach the workpiece. Reach the power measurement module.

In one embodiment, the laser processing device further includes a reflector, and the laser light emitted from the laser light source is reflected by the reflector and then passes through the lens module to reach the beam splitter.

In one embodiment, the driving module includes a motor, a stage and a ball screw, the first optical lens is disposed on the stage, and the ball screw is connected to the motor and the stage, wherein when the motor drives the ball screw to rotate, the load The stage moves relative to the ball screw in the direction of an optical axis of the first optical lens.

In one embodiment, the laser processing apparatus further includes a beam splitter, and a part of the laser light emitted from the laser light source is reflected by the beam splitter and reaches the workpiece.

In one embodiment, an external light is reflected by the workpiece and then passes through the beam splitter to reach the camera module.

In one embodiment, the laser processing device further includes two mirrors, and the external light after being reflected by the workpiece passes through the beam splitter, and is reflected by the mirrors in sequence to reach the camera module.

In one embodiment, the laser processing device further includes a distance sensor for sensing a distance between the laser processing device and the workpiece, and the distance sensor transmits a height position signal to the processing unit according to the distance .

In one embodiment, the processing unit transmits a driving signal to the driving module according to the height position signal and the image data, so as to drive the first optical lens to move relative to the second optical lens.

The laser processing apparatus according to the embodiment of the present invention will be described below. It can be readily appreciated, however, that embodiments of the invention provide many suitable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments disclosed are merely illustrative of particular ways to use the invention, and are not intended to limit the scope of the invention.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is to be understood that these terms, such as those defined in commonly used dictionaries, should be interpreted to have a meaning consistent with the relevant art and the context or context of this disclosure, and not in an idealized or overly formal manner Interpretation, unless specifically defined herein.

The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front or rear, etc., are only for referring to the directions of the attached drawings. Therefore, the directional terms used in the embodiments are used to describe and not to limit the present invention.

FIG. 2 is a schematic diagram showing the laser processing apparatus 100 according to an embodiment of the present invention performing laser soldering processing on the pads S on a substrate B (eg, a printed circuit board). As shown in FIG. 2 , the laser processing apparatus 100 according to an embodiment of the present invention mainly includes a laser light source L, a driving module V and a lens module K. The lens module K includes a first optical lens K1 and a second optical lens K2, wherein the laser light source L disposed inside the laser processing device 100 can emit a laser light L1, and the laser light L1 passes through the first, The second optical lenses K1 and K2 can then be focused and projected on the pad S of the substrate B, so that the pad S can be processed by laser soldering.

As can be seen from Figure 2, the driving module V mainly includes a motor V1, a lead screw V2 (such as a ball lead screw) and a movable stage V3, wherein the first optical lens K1 is disposed on the movable stage V3 Above, the second optical lens K2 is fixed inside the laser processing apparatus 100, and the lead screw V2 is connected to the motor V1 and the stage V3. It should be understood that, when the spot size of the laser light L1 on the pad S needs to be changed to process different pads S on the substrate B, the lead screw V2 can be driven by the motor V1 in the driving module V to rotate, thereby The stage V3 and the first optical lens K1 on the stage V3 can be driven to move together relative to the lead screw V2 along the optical axis direction of the first optical lens K1 (as shown by the arrow direction in Fig. 2), so as to appropriately change The distance d between the first and second optical lenses K1 and K2 enables the laser light L1 to be focused on the pad S of the substrate B and form a light spot with a moderate size.

FIG. 3 is a schematic diagram showing the laser processing apparatus 100 according to another embodiment of the present invention performing laser processing on the pads S on a substrate B. As shown in FIG. As shown in FIG. 3 , the main difference between the laser processing apparatus 100 of this embodiment and FIG. 2 is that the laser processing apparatus 100 of this embodiment further includes a casing H, a camera module C, a The distance sensor P and a power measurement module W, wherein the laser light source L and the camera module C are both arranged in the casing H, the distance sensor P is arranged on a first side 101 of the casing H, the power The measurement module W is embedded in a second side 102 of the housing H.

In this embodiment, the distance sensor P may include a laser displacement meter for sensing the distance D between the laser processing device 100 and the substrate B, and the power measurement module W may be An optical power meter is included to monitor the output power of the laser light in real time during the laser processing, wherein the substrate B can be a printed circuit board.

When the laser processing apparatus 100 is to be used to perform laser processing on the substrate B (such as a printed circuit substrate), a laser light L1 can be emitted through the laser light source L, and the laser light L1 will be reflected by the mirror R1 and then pass through the first 1. The second optical lenses K1 and K2 reach a beam splitter R2 (splitter). Next, a part of the laser light L1 is reflected by the beam splitter R2 and then reaches the substrate B through the through hole H1 on the housing H, so that a pad S on the substrate B is subjected to laser processing, and the laser light L1 is The other part will pass through the beam splitter R2 and reach the power measurement module W (as shown by the light L3 in Figure 3), so that the output power of the laser light can be monitored in real time during the processing.

On the other hand, the external light can be reflected by the substrate B and then enter the housing H through the through hole H1, and then the external light will pass through the beam splitter R2 and reach a reflector R3 (as shown by the light L2 in the third figure) ; Next, the light L2 reflected by the mirror R3 will be reflected by another mirror R4 to reach the camera module C. Here, the camera module C can obtain a partial image (eg, the image of the pad S) on the surface of the substrate B by receiving the light L2, and can calculate an ideal laser spot size information according to the image.

It should be noted that, a guide rail G is provided on the inner surface of the housing H in this embodiment, wherein the first optical lens K1 and/or the second optical lens K2 can be driven by the driving module V as shown in FIG. 2 . By sliding along the guide rail G, the distance d of the first and second optical lenses K1 and K2 in the optical axis direction (X axis direction) can be properly adjusted, so that the laser light L1 emitted by the laser light source L can be A laser spot corresponding to the size of the pad S is formed on the surface of the substrate B.

FIG. 4 is a schematic block diagram of a system for performing laser soldering on a pad S on a substrate B (eg, a printed circuit board) by a laser processing apparatus 100 according to another embodiment of the present invention. As shown in FIG. 4 , the main difference between the laser processing apparatus 100 of this embodiment and FIG. 3 is that the laser processing apparatus 100 of this embodiment further includes a processing unit 110 and a laser controller 120 . The processing unit 110 is, for example, an Industrial PC (IPC), which is electrically connected to the distance sensor P, the camera module C and the driving module V, and the laser controller 120 is electrically connected to the processing unit 110 and the laser light source L.

Specifically, the distance sensor P can measure the distance D between the laser processing device 100 and the substrate B in advance before performing the laser processing procedure, and transmit a height position signal N1 to the processing unit 110 accordingly; in addition, After being reflected by the pad S on the substrate B, the external light will enter the interior of the laser processing device 100 and pass through the beam splitter R2 (as shown by the light L2 in FIG. 4 ), wherein the camera module C can receive the light L2 to The image data of the pad S on the substrate B is obtained, and an image signal N2 can be sent to the processing unit 110 according to the image data before laser processing.

Next, the processing unit 110 can calculate an ideal laser spot size information according to the height position signal N1 and the image signal N2, and then transmit a driving signal N3 to the driving module V according to the laser spot size information, so as to pass the driving module The connecting mechanism (such as the lead screw V2) in the group V drives one or more optical lenses (such as the first and second optical lenses K1, K2) in the lens module K to move relative to each other, so that the lens module K An appropriate distance is formed between the optical lenses.

Finally, the processing unit 110 can send a control command N4 to the laser controller 120 , and the laser controller 120 can send an emission command N5 to the laser light source L according to the control command N4 , and emit the laser light L1 through the laser light source L to lens module K.

After passing through the lens module K, a part of the laser light L1 can be reflected by the beam splitter R2 to reach the substrate B, so as to perform laser soldering on a pad S on the substrate B. In addition, another part of the laser light L1 can pass through the beam splitter R2 to reach the power measurement module W (as shown by the light L3 in Fig. 4 ), so that the output of the laser light L1 can be monitored in real time during the processing. power.

To sum up, the laser processing apparatus 100 of the present invention is mainly used to perform laser processing on a workpiece (for example, laser solder processing on the pad S on the substrate B), which can pass through the camera module. C captures the image of the current pad S, and automatically calculates the ideal laser spot size information through the processing unit 110 (such as an industrial computer), so it is no longer necessary to manually set input and determine, thereby greatly reducing labor costs and The risk of misjudgment can also meet the needs of intelligent manufacturing. The laser processing device of the present invention can be applied to laser cutting, laser drilling or laser welding.

It should be noted that, in addition to the relative distance of the optical lenses in the optical path, since the size of the laser spot is also related to the working height, the laser processing apparatus 100 of the present invention also integrates a distance sensor P (such as a laser beam). Laser displacement meter) to monitor the variation of working height in real time during laser soldering, and at the same time, it can compensate for the variation of working height caused by the height deviation of the incoming material or the processing error of the fixture during the laser processing, so as to effectively improve the processing accuracy And greatly improve production efficiency.

Although the embodiments of the present invention and their advantages have been disclosed above, it should be understood that those skilled in the art can make changes, substitutions and modifications without departing from the spirit and scope of the present invention. In addition, the protection scope of the present invention is not limited to the process, machine, manufacture, material composition, device, method and steps in the specific embodiments described in the specification. Anyone with ordinary knowledge in the technical field can learn from the present disclosure. It is understood that processes, machines, manufactures, compositions of matter, devices, methods and steps developed in the present or in the future can be used in accordance with the present invention as long as they can perform substantially the same functions or achieve substantially the same results in the embodiments described herein. Therefore, the protection scope of the present invention includes the above-mentioned process, machine, manufacture, composition of matter, device, method and steps. In addition, each claimed scope constitutes a separate embodiment, and the protection scope of the present invention also includes the combination of each claimed scope and the embodiments.

Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the scope of the appended patent application.

10: Laser processing device 11: Optical lens 100: Laser processing device 101: First side 102: Second Side 110: Processing unit 120: Laser Controller B: substrate C: camera module d: distance D: distance E: laser light E': laser light G: rail H: shell H1: perforated K: lens module K1: The first optical lens K2: Second Optical Lens L: laser light source L1: Laser light L2: light L3: Light Ld: diameter N1: height position signal N2: video signal N3: drive signal N4: Control command N5: launch command P: Distance sensor R1: Reflector R2: Beamsplitter R3: Reflector R4: Reflector S: pad V: drive module V1: Motor V2: Lead screw V3: Stage W: Power measurement module

FIG. 1 shows a schematic diagram of a conventional laser processing apparatus 10 processing a pad S on a substrate B. As shown in FIG. FIG. 2 shows a schematic diagram of processing a pad S on a substrate B by a laser processing apparatus 100 according to an embodiment of the present invention. FIG. 3 is a schematic diagram showing the laser processing apparatus 100 according to another embodiment of the present invention performing laser processing on the pads S on a substrate B. As shown in FIG. FIG. 4 is a schematic block diagram of a system for laser processing a pad S on a substrate B by a laser processing apparatus 100 according to another embodiment of the present invention.

100: Laser processing device

B: substrate

d: distance

K: lens module

K1: The first optical lens

K2: Second Optical Lens

L: laser light source

L1: Laser light

S: pad

V: drive module

V1: Motor

V2: Lead screw

V3: Stage

Claims (10)

A laser processing device is used for processing a workpiece, the laser processing device comprises: a laser light source; a lens module having a first optical lens and a second optical lens, wherein the laser light source emits A laser light passes through the first and second optical lenses and is projected on the workpiece; a driving module is used to drive the first optical lens to move relative to the second optical lens; a camera module is used to capture An image of the workpiece; a processing unit electrically connected to the camera module and the driving module, wherein the camera module transmits an image data to the processing unit according to the image of the workpiece, and the processing unit according to the image data sending a driving signal to the driving module to drive the first optical lens to move relative to the second optical lens; and a distance sensor for sensing a distance between the laser processing device and the workpiece, And the distance sensor transmits a height position signal to the processing unit according to the distance. The laser processing device of claim 1, wherein the laser processing device further comprises a power measuring module for measuring the power intensity of the laser light. The laser processing device of claim 2, wherein the laser processing device further comprises a beam splitter, a part of the laser light emitted from the laser light source is reflected by the beam splitter to reach the workpiece, and the laser beam Another part of the emitted light passes through the beam splitter and reaches the power measuring module. The laser processing device of claim 3, wherein the laser processing device further comprises a reflector, and the laser light emitted from the laser light source is reflected by the reflector and then passes through the lens module to reach the beam splitter . The laser processing device of claim 1, wherein the driving module comprises a motor, a stage and a ball screw, the first optical lens is disposed on the stage, and the ball The screw is connected with the motor and the stage, wherein when the motor drives the ball screw to rotate, the stage moves relative to the ball screw along an optical axis direction of the first optical lens. The laser processing device of claim 1, wherein the laser processing device further comprises a beam splitter, and a part of the laser light emitted from the laser light source is reflected by the beam splitter to reach the workpiece. The laser processing device of claim 6, wherein an external light is reflected by the workpiece and then passes through the beam splitter to reach the camera module. The laser processing device according to claim 7, wherein the laser processing device further comprises two mirrors, and the external light after being reflected by the workpiece passes through the beam splitter, and is sequentially reflected by the mirrors to the camera module. The laser processing apparatus of claim 1, wherein the processing unit transmits a driving signal to the driving module according to the height position signal and the image data, so as to drive the first optical lens to move relative to the second optical lens. The laser processing device of claim 1, wherein the laser processing device is applied to laser cutting, laser drilling or/and laser welding.

Images