JP2005141154A - Substrate for optoelectronic device and its manufacturing method, optoelectronic device and its manufacturing method, exposure mask and electronic appliance - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a reflecting layer having a favorable scattering effect by a simple manufacturing process. <P>SOLUTION: An exposure mask 7 is used for an exposure process to roughen an objective region 511 to be processed of a film 51. The exposure mask 7 has a first region 71 and a second region 72. The first region 71 functions as a light transmitting region to transmit light incident to the periphery of the objective region 511; and the second region 72 has a plurality of dot regions 721 where a light shielding portion 86 to cut the light incident to the objective region 511 is disposed, and has a semitransmitting portion 86 in a region excluding the dot region 721, with the semitransmitting portion transmitting the light incident to the objective region 511 at a lower transmittance than in the transmitting region. The planar form of the light shielding portion 86 is a surfased shape or a polygon with a circumscribed oval. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a technique for scattering reflected light by making the surface of a reflective layer rough.

  In a so-called reflective liquid crystal display device, a reflective layer having light reflectivity is formed on a plate surface of a substrate holding liquid crystal. Then, external light such as sunlight and indoor illumination light incident from the observation side is reflected on the surface of the reflective layer, and this reflected light is used for image display. In this configuration, if the surface of the reflective layer is a perfect plane, the incident light on the liquid crystal display device is specularly reflected by the surface of the reflective layer and viewed by an observer. In this case, in addition to the original display image, there is a problem that an image of a person or an object facing the display surface of the liquid crystal display device is visually recognized, making it difficult to see the display.

  In order to prevent such reflection of the background, a large number of fine protrusions and depressions (hereinafter referred to as “scattering structures”) are formed on the surface of the reflective layer. According to this configuration, reflected light on the surface of the reflective layer is appropriately scattered and emitted to the observation side, so that reflection of the background can be prevented. Patent Document 1 discloses a method for forming this scattering structure. In this method, first, a large number of fine resin pieces are formed dispersed on the plate surface of the substrate, and secondly, in order to smooth the steps between these protrusions and the plate surface of the substrate. A film body covering the protrusion is provided, and third, a reflective layer is formed so as to cover the film body.

Japanese Patent Laying-Open No. 2003-75987 (paragraph 0073 and paragraph 0074 and FIG. 12)

  However, this method requires a process of forming a film body covering each protrusion in addition to the process of forming a large number of fine resin pieces on the substrate, which complicates the manufacturing process and increases the manufacturing cost. The problem can arise. As a measure for solving this problem, it is conceivable to form a reflective layer so as to directly cover each resin piece without forming a film body. However, when this method is used, a flat surface reflecting the plate surface of the substrate exposed between the resin pieces and the flat surface at the top of each resin piece appears on the surface of the reflective layer, so that light is scattered. This may cause a problem that the effect (hereinafter referred to as “light scattering effect”) cannot be sufficiently obtained. This invention is made | formed in view of such a situation, The objective is to obtain the reflection layer which has a favorable light-scattering effect by a simple manufacturing process.

  In order to solve the above problems, the present invention provides a mask to be used for an exposure process for making a surface of a film body a rough surface on which a plurality of protrusions are formed. A transparent region that transmits light toward the region outside the region, and a plurality of regions that block light toward the region to be processed, each of which is a substantially polygonal shape in which each planar shape is substantially oval or circumscribed circle is oval A plurality of light-shielding regions and a semi-transmissive region that transmits light toward the region to be processed with a light transmittance lower than that of the light-transmitting region are provided. The “oblong shape” in the present invention is a long circular shape excluding a regular circular shape, in addition to an ellipse, a shape in which a semicircular shape having a diameter is added to each of opposite sides of a rectangle or a square ( The concept includes various shapes such as FIG.

  Since the exposure mask according to the present invention has a light-transmitting region so as to face a region outside the region to be processed of the film body, the light transmitted through this region can act on the entire thickness direction of the film body. it can. On the other hand, the region of the exposure mask that is opposed to the region to be processed includes a plurality of light-shielding regions and semi-transmissive regions. According to this configuration, the amount of light transmitted from the light source to the processing region of the film body through the semi-transmission region is limited, and thus the light transmitted through the light transmission region acts on the entire thickness direction of the film body. Even if a sufficient amount of light is irradiated from the light source, light can be selectively applied to only a part of the processed region in the thickness direction. For this reason, even if the portion of the film body on which the light has acted is removed by development, the region to be processed is not completely removed, so that the surface of the substrate provided with the film body is not exposed in the region to be processed. Therefore, the electro-optical device substrate (reflective substrate) using the base layer obtained from the film body through the exposure processing using the exposure mask does not include a flat surface reflecting the flat surface of the substrate, and has good light. Shows scattering effect. In addition, according to the exposure mask of the present invention, the region outside the region to be processed in the film body and the region to be a rough surface in the region to be processed are collectively exposed in a common process. can do.

  By the way, under the configuration in which a plurality of light shielding regions are provided as in the exposure mask according to the present invention, the light from the light source directed to the film body via the vicinity of the periphery of each light shielding region is the periphery of the light shielding region. And reaches the film body after diffracting. Here, in the case where an exposure mask (hereinafter referred to as “proportional”) in which the planar shape of each light shielding region is a regular circle or a polygon whose circumscribed circle is a regular circle is used for exposure, the entire periphery of the light shielding region The diffracted light is concentrated on the narrow area of the film body (that is, the central portion of the film body that overlaps the light-shielding area) at substantially the same phase and strengthens each other. In this case, since strong light acts on the portion where the diffracted light is concentrated, that is, the portion of the film body that should be the top of the projection on the rough surface, the rough surface obtained by subsequent development. Is a deep depression formed at the top of each projection. Here, when the top of each protrusion is a flat surface without a depression, specular reflection occurs on the surface of the reflective layer covering the top of the protrusion, so there is a limit to obtaining good light scattering characteristics. . Therefore, in order to obtain a good light scattering effect, it is desirable to provide a depression at the top of each protrusion on the rough surface. However, as a result of the test by the inventors of the present application, when the exposure mask according to the above-described comparison is used, the indentation at the top of each protrusion becomes too deep, and the light scattering effect is reduced. . Based on such knowledge, the present invention is characterized in that the planar shape of the light-shielding region is a substantially polygonal shape, or a circumscribed circle is a substantially polygonal shape. According to this configuration, the diffracted light at the periphery of each light shielding region is dispersed over a wider area than the area where the diffracted light is concentrated when the above-described proportional exposure mask is used, and reaches the film body. . As a result, the intensity of light acting on the portion of the film body that should become the top of the projection on the rough surface is weakened as compared with the case of using the exposure mask according to the above-mentioned comparison, and thus obtained after development. It can suppress that the hollow of the top part of each protrusion becomes deep too much. Therefore, the exposure mask according to the present invention can produce an electro-optical device substrate having a good light scattering effect.

  In the present invention, the semi-transmission region may be in contact with the entire periphery of each light shielding region, but the peripheral light transmission region that transmits light with substantially the same light transmittance as the light transmission region is connected to each light shielding region. It is good also as a structure interposed between translucent areas. According to this configuration, since the amount of diffracted light diffracted at the periphery of each light shielding region and reaching the film body can be reliably ensured, a recess having a desired depth is formed on the top of the protrusion on the rough surface. It can form more reliably. Note that the amount of light that is transmitted through the peripheral light-transmitting region and diffracted at the periphery of each light-shielding region (in other words, the depth of the depression formed on the top of the protrusion on the rough surface) under this mode is It adjusts according to the length of the contact part with the periphery of the light-shielding area | region in a light area. Therefore, it is desirable that the aspect of the peripheral light-transmitting region is appropriately selected according to the depth of the depression to be formed on the top of the protrusion on the rough surface. That is, a configuration in which the peripheral light transmitting region is provided so as to be in contact with the entire periphery of each light shielding region, or a configuration in which the peripheral light transmitting region is provided so as to be partially in contact with the peripheral edge of each light shielding region may be employed. Of these, the former configuration can increase the amount of diffracted light at the periphery of the light-shielding region as compared with the latter configuration, so that a deep recess can be formed at the top of the protrusion on the rough surface. In other words, according to the latter structure, compared with the former structure, the depth of the hollow formed in the top of the protrusion on the rough surface can be suppressed.

  In order to completely remove the region outside the region to be processed in the film body, it is necessary to irradiate a sufficient amount of light from the light source. If the light transmittance of the semi-transmissive region in the exposure mask used in such an exposure process is relatively high, the amount of light that passes through the semi-transmissive region and reaches the region to be processed increases, and the thickness direction of the film body There is a possibility that light acts (photodecomposes) over the whole area. However, as described above, when the region to be processed is completely removed, the plate surface of the substrate is exposed, which may cause a reduction in the light scattering effect. In order to prevent this problem, it is desirable that the light transmittance of the semi-transmissive region is sufficiently lower than the light transmittance of the light-transmissive region. According to the test by the present inventor, a rough surface capable of realizing a particularly good light scattering effect is formed by setting the light transmittance of the semi-transmissive region with respect to the irradiation light from the light source to 10% (percent) or more and 40% or less. It came to obtain the knowledge that it is done. Therefore, it is desirable that the light transmittance of the semi-transmissive region in the exposure mask according to the present invention be 10% or more and 40% or less.

  In addition, as long as it has a light transmittance lower than that of the light-transmitting region, the specific configuration of the semi-transmitting region is arbitrary. For example, if a light-shielding film body is formed very thin, part of the light irradiated to the thin film is absorbed or reflected, while the other part transmits the thin film. Thus, the area | region which formed the thin film which has light-shielding property can be made into a semi-transmissive area | region. Alternatively, an area in which a plurality of micro light-shielding regions having light shielding properties and a plurality of micro light-transmitting regions having translucency are arranged on the surface may be used as a semi-transmissive region. According to this configuration, a part of the light emitted from the light source can be shielded by the minute light shielding region, while the other part can be transmitted from the minute light transmitting region. The arrangement of each minute light-shielding region and each minute light-transmissive region is arbitrary, but from the viewpoint of uniformizing the amount of light that passes through the semi-transmissive region and reaches the film body, It is desirable to use a region (that is, a checkered region) in which the light-shielding region and the minute light-transmitting regions are alternately arranged in the first direction and the second direction as the semi-transmissive region. In this configuration, in order to prevent the transmitted light of each micro light-transmitting region from diffracting and interfering with each other at the periphery of the adjacent micro light-shielding region, The length of each side is desirably 2.0 μm (micrometer) or less, and more preferably 1.5 μm or less. In addition to this aspect, each micro light-shielding region and each micro light-transmitting region extending in the first direction are alternately arranged in a second direction orthogonal to the first direction (that is, the micro light-shielding region). And a small light-transmitting region arranged in a stripe shape) may be used as a semi-transmissive region. Also in this configuration, in order to prevent interference of diffracted light, the width of each minute light shielding region and each minute light transmitting region is desirably 2.0 μm or less, more preferably 1.5 μm or less.

  In addition, when a plurality of light shielding regions are too dense or extremely sparse, the flatness of the rough surface obtained by development after exposure increases, and thus the light scattering effect of the reflective layer on the rough surface is increased. It may decline. Therefore, the ratio of the total area of the plurality of light shielding regions to the entire area of the exposure mask (the entire area of the plate surface facing the film body to be processed) is desirably 30% or more and 60% or less.

  By the way, the light that reaches the surface of the reflective layer provided on the rough surface of the film body is mainly scattered on the slope (side surface) of the protrusion formed on the surface of the reflective layer. Therefore, if the longitudinal directions of the plurality of light shielding regions are substantially the same direction, for example, bright display over a wide viewing angle can be realized in one of the horizontal direction and the vertical direction of the display surface.

  The present invention can also be specified as a method of manufacturing an electro-optical device substrate using the exposure mask described above. In this method, a film body is formed of a photosensitive material in a method for manufacturing a substrate for an electro-optical device having a base layer having a rough surface and a reflective layer provided on the rough surface of the base layer. A film body forming step, and a step of exposing the film body through an exposure mask having a plurality of light shielding regions each having a substantially polygonal shape in which each planar shape is substantially flat or a circumscribed circle is flat. The film body is configured such that light from the light source toward the region to be the projection of the surface is blocked by each light shielding region of the exposure mask, and light from the light source toward other regions is transmitted through the semi-transmissive region of the exposure mask. An exposure process in which the light is applied to only a part in the thickness direction of the film, a development process in which a portion on which the light has been applied in the exposure process is removed by development to form a base layer, and a base layer obtained by the development process Light reflectivity on rough surface And a reflecting layer forming step of forming a reflective layer for. According to this manufacturing method, the electro-optical device substrate having a good light scattering effect is manufactured by a simple process for the same reason as described above for the exposure mask according to the present invention. In this exposure method, in the exposure step, the light transmitted through the peripheral light-transmitting region in contact with the periphery of each light shielding region in the exposure mask is diffracted at the periphery of each light shielding region, and this diffracted light is reflected on the top of the protrusion. It is desirable to act on the part that should be.

  An electro-optical device is manufactured by arranging an electro-optical material so as to face the reflective layer of the electro-optical device substrate obtained by the manufacturing method according to the present invention. According to this manufacturing method, an electro-optical device having a good display quality with less reflection of the background is manufactured by a simple process. The electro-optical material in the present invention is a material that converts an electrical action such as voltage application or current supply into a change in optical characteristics such as a change in light transmittance or luminance. A typical example of the electro-optical material is liquid crystal, but the applicable range of the present invention is not limited to this.

  On the other hand, the substrate for an electro-optical device according to the present invention includes a base layer having a plurality of protrusions on the surface, each of which has a depression on the top surface and has a substantially flat planar shape, and a plurality of protrusions of the base layer. And a reflective layer having light reflectivity provided on the surface having the same. According to this electro-optical device substrate, since the depression is formed at the top of each protrusion on the rough surface of the base layer, the ratio of the flat portion on the surface of the reflective layer is suppressed, and as a result, a good light scattering effect Is obtained. The base film of the substrate for the electro-optical device can be obtained, for example, by developing after exposing the film body using the exposure mask according to the present invention.

  In the present invention, the electro-optical device substrate is used as a substrate of the electro-optical device. That is, the electro-optical device according to the present invention includes a first substrate and a second substrate that face each other and sandwich an electro-optical material, and layers provided on a plate surface of the second substrate that faces the electro-optical material. The first substrate is provided with a base layer having a plurality of protrusions on the surface, each of which has a recess on each top surface and a planar shape that is substantially flat, and is provided on the surface of the base layer having the plurality of protrusions. A reflective layer that reflects incident light from the side. According to this electro-optical device, incident light from the first substrate side can be scattered by the reflecting layer and then reflected and emitted to the first substrate side, so that the reflection of the background is suppressed. Display quality can be obtained. Furthermore, the present invention is also specified as an electronic apparatus including the electro-optical device as a display device. As this type of electro-optical device, various electro-optical devices such as a mobile phone and a personal computer are conceivable.

  As described above, according to the present invention, a reflective layer having a good light scattering effect can be obtained by a simple manufacturing process.

  Embodiments of the present invention will be described with reference to the drawings. In the following, a mode in which the present invention is applied to a liquid crystal display device using liquid crystal as an electro-optical material will be exemplified, but the scope to which the present invention can be applied is not limited to this. In the drawings shown below, the dimensions and ratios of the constituent elements are different from actual ones for convenience of explanation.

<A: Configuration of liquid crystal display device>
FIG. 1 is a cross-sectional view illustrating a configuration of a liquid crystal display device according to the present embodiment, and FIG. 2 is a perspective view illustrating a part of the liquid crystal display device in an enlarged manner. A sectional view taken along line II in FIG. 2 corresponds to FIG. As shown in these drawings, the liquid crystal display device 100 includes a first substrate 10 and a second substrate 20 arranged so as to face each other through a sealing material 34 formed in a substantially rectangular frame shape. Have. These substrates are plate-like or film-like members made of a light-transmitting material such as glass or plastic. For example, a TN (Twisted Nematic) type liquid crystal 35 is sealed in a space surrounded by both substrates and the sealing material 34. In the following, as shown in FIGS. 1 and 2, the first substrate 10 side as viewed from the liquid crystal 35 is referred to as “observation side”. That is, it means the side where an observer who visually recognizes a display image by the liquid crystal display device 100 is located. On the other hand, when viewed from the liquid crystal 35, the second substrate 20 side is referred to as “back side”. A retardation plate 311 for improving the contrast of a display image and a polarizing plate 312 for polarizing incident light are attached to the observation-side plate surface of the first substrate 10. A similar retardation plate 321 and polarizing plate 322 are attached on the rear plate (not shown in FIG. 2). Further, the second substrate 20 has a portion (hereinafter referred to as “projected portion”) 20 a that projects from the periphery of the first substrate 10. An IC chip 38 having a circuit for driving the liquid crystal display device 100 is mounted on the overhanging portion 20a by a COG (Chip On Glass) technique.

  A plurality of pixel electrodes 11 are arranged in a matrix over the X direction and the Y direction on the plate surface of the first substrate 10 facing the liquid crystal 35. Each pixel electrode 11 is a substantially rectangular electrode made of a conductive material having optical transparency such as ITO (Indium Tin Oxide). A scanning line 12 extending in the Y direction is formed in the gap between the pixel electrodes 11 adjacent in the X direction. Each pixel electrode 11 is connected to the scanning line 12 via a TFD (Thin Film Diode) element 13. The TFD element 13 is a two-terminal switching element having non-linear current-voltage characteristics. The plate surface of the first substrate 10 on which these elements are formed is covered with an alignment film 14 that has been subjected to a rubbing process (not shown in FIG. 2).

  On the other hand, a plurality of data lines 27 extending in the X direction are formed on the plate surface of the second substrate 20 facing the liquid crystal 35. Each data line 27 is an electrode made of a light-transmitting conductive material such as ITO, like the pixel electrode 11, and faces the plurality of pixel electrodes 11 that are arranged in the X direction on the first substrate 10. The plate surface of the second substrate 20 on which the data lines 27 are formed is covered with an alignment film 28 similar to the alignment film 14. With this configuration, the liquid crystal 35 sandwiched between the first substrate 10 and the second substrate 20 corresponds to the voltage applied from the IC chip 38 between each pixel electrode 11 and the data line 27 opposed thereto. The orientation direction changes. As shown in FIG. 2, each of the regions (hereinafter referred to as “sub-pixels”) Gs in which the orientation direction changes is assigned one of red, green, and blue.

  On the plate surface of the second substrate 20 facing the liquid crystal 35, the base layer 21, the reflective layer 22, the color filter 24, and the insulating layer 26 are laminated in this order from the second substrate 20 side. The data line 27 and the alignment film 28 described above are formed on the surface of the insulating layer 26. The color filter 24 is a resin layer provided corresponding to each sub-pixel Gs, and is colored in the color of each sub-pixel Gs by a pigment or a dye. The sub-pixel Gs corresponding to the three color filters 24 of red, green and blue constitutes a pixel which is the minimum unit of the display image. In addition, a light shielding layer 25 is formed in the gap between the color filters 24 of each color (that is, the gap between adjacent subpixels Gs). The light shielding layer 25 is formed of a resin material in which carbon black is dispersed or a metal material having a light shielding property such as chromium, and plays a role of shielding the gap between the sub-pixels Gs. The insulating layer 26 is a film body formed so as to cover the color filter 24 and the light shielding layer 25 with various resin materials such as epoxy and acrylic. The insulating layer 26 has a role of flattening the step between the color filter 24 and the light shielding layer 25 and a role of preventing the pigment and dye of the color filter 24 from leaking into the liquid crystal 35.

  On the other hand, the foundation layer 21 is a film body provided on the plate surface of the second substrate 20 and is made of a photosensitive resin material such as acrylic or epoxy. The underlayer 21 is selectively provided only in the region surrounded by the sealing material 34 on the surface of the second substrate 20 and does not exist in the overhanging portion 20a on which the IC chip 38 is mounted. Here, under the configuration in which the base layer 21 is formed over the entire surface of the second substrate 20 including the overhanging portion 20a (that is, the configuration in which the IC chip 38 is mounted on the surface of the base layer 21), the IC chip 38 is provided. There is a problem that the base layer 21 easily peels off from the second substrate 20 together with the IC chip 38 when an external force is applied. On the other hand, as in the present embodiment, the base layer 21 is completely removed from the overhanging portion 20a (that is, a configuration in which the IC chip 38 is mounted on the second substrate 20 without the base layer 21). According to this, there is an advantage that such a problem can be avoided.

  As shown in FIGS. 1 and 2, an opening 211 that penetrates the base layer 21 in the thickness direction is provided in a portion of the base layer 21 corresponding to the vicinity of the center of each sub-pixel Gs. Yes. On the other hand, the reflective layer 22 is a thin film formed on the surface of the base layer 21 by a material having light reflectivity such as a single metal such as aluminum or silver or an alloy containing these metals as a main component. The light-transmitting portion 221 is opened to correspond to the opening 211. Accordingly, a part of each color filter 24 laminated on the base layer 21 and the reflective layer 22 reaches the surface of the second substrate 20 through the light transmitting part 221 of the reflective layer 22 and the opening 211 of the base layer 21. With the configuration described above, the light emitted from the backlight unit that has entered the second substrate 20 from the back side of the liquid crystal display device 100 is transmitted through the opening 211 of the base layer 21 and the light transmitting portion 221 of the reflective layer 22. Through the color filter 24 and the liquid crystal 35, and further through the first substrate 10 to be emitted to the observation side. In this way, transmissive display is realized by the transmitted light from the back side of the liquid crystal display device 100 to the observation side. On the other hand, outside light such as room illumination light and sunlight incident on the first substrate 10 from the observation side of the liquid crystal display device 100 passes through the liquid crystal 35 and the color filter 24 and reaches the surface of the reflective layer 22. The light is reflected from the surface and emitted from the first substrate 10 to the observation side. Thus, the reflective display is realized by the light emitted to the observation side after being reflected by the reflective layer 22.

  Here, if the surface of the reflective layer 22 is a perfect plane, the incident light from the observation side with respect to the liquid crystal display device 100 is specularly reflected on the surface of the reflective layer 22. There may be a problem that a background image opposite to the image appears in the display image. In order to solve this problem, a scattering structure for appropriately scattering the reflected light is formed on the surface of the reflective layer 22 in the present embodiment. More specifically, the surface of the underlayer 21 is a rough surface on which a number of fine protrusions (convex parts) are formed, and the surface of the reflective layer 22 formed in a thin film shape on the rough surface A fine undulation (that is, a scattering structure) reflecting the rough surface of the underlayer 21 appears. FIG. 3A is an enlarged plan view showing one protrusion 213 on the rough surface of the underlayer 21, and FIG. 4 shows the surface of the underlayer 21 as viewed from a direction perpendicular to the plate surface of the second substrate 20. It is a top view which shows the aspect of the arrangement | sequence of each processus | protrusion 213 at the time. As shown in these drawings, the outer shape of each projection 213 when viewed in plan is substantially flat (in the present embodiment, substantially elliptical). Further, as shown in FIG. 4, the protrusions 213 are formed at random positions over the entire surface of the base layer 21. Further, in the present embodiment, the base layer 21 is arranged such that the longitudinal direction of the flattened shape (for example, the major axis direction of the ellipse) when viewing each projection 213 in a plane is directed to the X direction which is the vertical direction of the display surface. A plurality of protrusions 213 are provided on the surface.

  On the other hand, FIG. 3B is a sectional view taken along line IIIb-IIIb in FIG. 3A, and FIG. 3C is a sectional view taken along line IIIc-IIIc in FIG. However, in FIGS. 3B and 3C, in addition to the base layer 21, the reflective layer 22 is also illustrated. As shown in these drawings, the distance from the top 213a, which is the portion of the protrusion 213 that protrudes most to the first substrate 10 side, to the portion of the base layer other than the protrusion 213 (hereinafter referred to as “dent”) 214 When the height H of the protrusion 213 is assumed, the height H of each protrusion 213 is smaller than the thickness T (the distance between the contact surface with the second substrate 20 and the top 213a of the protrusion 213) T. . In other words, the depth of the depression 214 on the surface of the base layer 21 (that is, the height H of each protrusion 213) is selected so that the second substrate 20 is not exposed at the bottom of the depression 214.

  Furthermore, as shown in FIG. 3B and FIG. 3C, a recess (concave portion) 213b is formed in the top portion 213a of each projection 213. The recess 213b is formed in a long shape along the longitudinal direction of each projection 213. The depth D of each recess 213b is smaller than the height H of the protrusion 213. Since the surface of the underlayer 21 in this embodiment is such a rough surface, the surface of the reflective layer 22 formed on the surface is as shown in FIGS. 3B and 3C. Thus, a large number of fine protrusions 223 having depressions at the tops of the respective tops are formed. Here, if the top of each projection 223 constituting the scattering structure of the reflective layer 22 is a flat surface, the incident light from the observation side will be specularly reflected on the flat surface, so that the reflection of the background is reflected. A sufficient light scattering effect to avoid this is not always obtained. On the other hand, according to the scattering structure according to the present embodiment, the reflected light from the reflective layer 22 can be scattered even in the depression at the top of each protrusion 223, so that the reflection of the background can be completely avoided. Light scattering effect can be obtained.

  By the way, the light reaching the surface of the reflective layer 22 is mainly scattered on the slope (side surface) of the protrusion 223 formed on the surface of the reflective layer 22. On the other hand, in the present embodiment, since the longitudinal direction of the protrusions 213 of the base layer 21 is oriented in the X direction, as shown in FIG. 4, the number of the protrusions 213 arranged in the X direction is arranged in the Y direction. More than the number of protrusions 213. Therefore, when the protrusions 223 on the surface of the reflective layer 22 are viewed along the X direction and the Y direction, the number of slopes facing the Y direction is larger than the number of slopes facing the X direction. Therefore, in this embodiment, the amount of light scattered in the Y direction on the surface of the reflective layer 223 is greater than the amount of light scattered in the X direction. Now, since the X direction coincides with the vertical direction of the display surface, in the present embodiment, bright display is realized over a wide viewing angle in the left-right direction (that is, the Y direction) of the display surface. On the other hand, if the X direction is the left-right direction of the display surface, bright display is realized over a wide viewing angle in the vertical direction of the display surface. As described above, it is desirable that the longitudinal direction of each protrusion 213 in the base layer 21 is appropriately selected according to the direction in which the liquid crystal display device 100 requires a wide viewing angle. Here, the configuration in which the longitudinal directions of all the protrusions 213 are directed in one direction (X direction) is illustrated, but as illustrated in FIG. 5, the protrusions 213 whose longitudinal directions are directed in the X direction and Y The protrusions 213 directed in the direction may be mixed on the surface of the base layer 21. Under this configuration, the viewing angle characteristics in the vertical direction and the horizontal direction on the display surface depend on the ratio between the number of protrusions 213 whose longitudinal direction is directed in the X direction and the number of protrusions 213 directed in the Y direction. Can be adjusted appropriately.

<B: Manufacturing method of liquid crystal display device>
Next, a method for manufacturing the liquid crystal display device 100 according to the present embodiment will be described with particular attention paid to the step of forming the base layer 21 and the reflective layer 22 on the second substrate 20. FIG. 6 is a process diagram (corresponding to the cross section shown in FIG. 1) showing the configuration of elements on the second substrate 20 in each manufacturing process.

  First, as shown in FIG. 6A, a film body 51 to be the base layer 21 is formed on the plate surface on the second substrate 20. The film body 51 is obtained by applying a positive resin material having photosensitivity on the second substrate 20 by a method such as a spin coat method. Next, the film body 51 is dried in a reduced pressure environment and then heated (pre-baked) at a temperature in the range of 85 ° C. to 105 ° C.

  Thereafter, as shown in FIG. 6B, the film body 51 is exposed through a mask (hereinafter referred to as “exposure mask”) 7. More specifically, the exposure mask 7 is disposed with a gap (proximity gap) of about 60 μm from the surface of the film body 51, and then light emitted from the light source (for example, i-line) is applied to the film body 51. ) Is irradiated. As shown in FIG. 6B, in the present embodiment, a region outside the region (hereinafter referred to as “processed region”) 511 of the film body 51 to be left as the base layer 21 (that is, the sealing material 34). 513, a region 515 corresponding to the opening 211 of the base layer 21, and a region to be a depression 214 on the surface of the base layer 21 in the processed region 511. Are exposed together. Here, FIG. 7 is a diagram showing a portion that undergoes photolysis by this exposure. In the figure, the vicinity of the boundary between the work area 511 and the peripheral area 513 is shown enlarged, and the hatched area corresponds to a portion photodecomposed by exposure. As shown in FIGS. 6 and 7, in the present embodiment, the film body 51 is photodegraded over the entire thickness direction in the peripheral region 513 and the region 515 corresponding to the opening 211, while the base layer 21. In the region 517 to be the depression 214, only a part in the thickness direction of the film body 51 is photodecomposed. The specific configuration of the exposure mask 7 used in this exposure step will be described in detail later.

  Next, the film body 51 is developed. By this development, as shown in FIG. 6C, a portion of the film body 51 that has been photolyzed by exposure is selectively removed. Subsequently, the film body 51 is heated (melt-baked) at a temperature in the range of 120 ° C. to 130 ° C. By this step, only the surface layer portion of the film body 51 is partially melted, and the uneven corners appearing on the surface of the film body 51 by development are rounded. Thereafter, the film body 51 is baked (post-baked) at a temperature of about 220 ° C. By these steps, as shown in FIG. 6D, the surface shape of the entire film body 51 is determined, and the base layer 21 is obtained. Here, the heating of the film body 51 after the development is performed in two stages. If the film body 51 after the development is immediately heated to a temperature of about 220 ° C., the unevenness on the surface thereof is excessively melted. This is because the surface has many flat portions, and as a result, the light scattering effect of the reflective layer 22 is impaired. That is, it can be said that the step of heating the film body 51 in the range of 120 ° C. to 130 ° C. prior to post-baking is a process for maintaining and stabilizing the surface shape of the film body 51 in an intended shape.

  Next, as shown in FIG. 6E, a reflective layer 22 having a light transmitting portion 221 is formed on the surface of the base layer 21. That is, a thin film made of a light-reflective material is formed on the surface of the base layer 21 by a film formation method such as sputtering, and the thin film is patterned by a photolithography technique and an etching technique to obtain the reflection layer 22. . As described above, a scattering structure reflecting the rough surface of the base layer 21 is formed on the surface of the reflective layer 22.

  Subsequently, the color filter 24 and the light shielding layer 25 are formed, and the insulating layer 26 is formed so as to cover them. Further, after the data line 27 is formed on the surface of the insulating layer 26, an alignment film 28 is formed by an organic thin film such as polyimide and subjected to a rubbing process. Meanwhile, each element on the first substrate 10 can be manufactured by various known techniques. Next, the first substrate 10 and the second substrate 20 that have undergone the above-described processes are bonded together with the sealing material 34 in a state where the alignment films 14 and 28 face each other. Further, a liquid crystal 35 is sealed in a space surrounded by both substrates and the sealing material 34, and this space is sealed with a sealing material (not shown). Thereafter, the retardation plates 311 and 321 and the polarizing plates 312 and 322 are attached to the first substrate 10 and the second substrate 20, respectively, and the IC chip 38 is mounted on the overhanging portion 20a of the second substrate 20, The liquid crystal display device 100 shown in FIG. 1 is obtained.

<C: Configuration of exposure mask>
Next, the configuration of the exposure mask 7 used in the exposure process of FIG. 6B (hereinafter simply referred to as “exposure process”) will be described. FIG. 8 is a plan view showing the configuration of the exposure mask 7. As shown in the figure, the exposure mask 7 in the present embodiment is divided into a first region 71 and a second region 72 in plan view. Among these, the first region 71 is a region opposed to the peripheral region 513 of the film body 51 (that is, a region removed by development as not constituting the underlayer 21) in the exposure process. On the other hand, the second region 72 is a region that faces the processing region 511 of the film body 51 in the exposure process. The second region 72 includes a large number of dot-like regions (hereinafter referred to as “dot regions”) 721 that are distributed at random positions and a region corresponding to the opening 211 of the base layer 21 (hereinafter referred to as “opening formation”). 724) (referred to as “region”). Each dot region 721 is a region corresponding to the protrusion 213 on the surface of the base layer 21.

  Next, FIG. 9 is a cross-sectional view showing the structure of the exposure mask 7. Focusing on the cross-sectional structure as shown in the figure, the exposure mask 7 has a base material 70, and a light shielding portion 84 and a semi-transmissive portion 86 formed on the plate surface of the base material 70. Among these, the base material 70 is a plate-like member that transmits almost all of the irradiation light from the light source. That is, the light transmittance of the base material 70 itself with respect to the light emitted from the light source in the exposure processing is about 100%. On the other hand, the light shielding portion 84 is a film body that shields (absorbs or reflects) substantially all of the light emitted from the light source, and is formed of a light-shielding material such as chromium (Cr). On the other hand, the semi-transmissive portion 86 is a portion that transmits the irradiation light from the light source with a light transmittance lower than that of the base material 70. In other words, the semi-transmissive portion 86 transmits only a part of the light emitted from the light source, while the other part is shielded (absorbed or reflected). As a specific form of the semi-transmissive portion 86, any of the following halftone and gray tone can be adopted.

The halftone is made of a light-shielding material such as chromium oxide (Cr ₂ O ₃ ) or molybdenum silicide (MoSi or MoSi ₂ ). By forming these materials on the base material 70 in a thin film shape, only a part of the irradiation light from the light source is transmitted and reaches the film body 51, while the other part is shielded.

  On the other hand, in gray tone, a large number of fine light-shielding portions (hereinafter referred to as “micro-light-shielding portions”) and a large number of fine light-transmitting portions (hereinafter referred to as “micro-light-transmitting portions”) are arranged on the substrate 70 in a planar shape. Do it. Among these, each minute light-shielding part is a part formed in the same process as the light-shielding part 84, and shields substantially all of the irradiation light from the light source. On the other hand, each micro light-transmitting portion is a portion where the base material 70 is exposed (that is, a portion where no light-shielding member is provided), and therefore transmits almost all of the irradiation light from the light source. Since each of these regions is arranged in a plane, a part of the irradiation light from the light source passes through the minute light transmitting part and reaches the film body 51, while the other part is caused by the minute light shielding part. Shaded. In the semi-transmissive portion 86 that employs this gray tone, the minute light-shielding portion and the minute light-transmissive portion are in the plane of the semi-transmissive portion 86 so that the intensity of the transmitted light is substantially uniform over the surface of the semi-transmissive portion 86. It is desirable to disperse and arrange in FIG. FIG. 10 and FIG. 11 are plan views showing desirable arrangement modes of the minute light shielding portions and the minute light transmitting portions.

  In FIG. 10, the substantially square-shaped micro light-shielding portions 861 and the substantially square-shaped micro light-transmitting portions 862 are staggered in the x and y directions orthogonal to each other (that is, between the micro-light-shielding portions 861 or the micro light-transmissive portions 862). A mode in which the light portions 862 are arranged so that the light portions 862 are not adjacent to each other is illustrated. Here, depending on the length of each side of each micro light shielding portion 861 and each micro light transmitting portion 862, the light transmitted through the micro light transmitting portion 862 is diffracted at the periphery of the micro light shielding portion 861 and interferes with each other. As a result, it is possible to prevent the intended region 511 from being irradiated with the desired amount of light. In order to solve this problem, the length L of each side of each micro light-shielding portion 861 and each micro light-transmissive portion 862 is preferably 1.0 μm or more and 2.0 μm or less, and is preferably 1.5 μm or less. Further preferred.

  On the other hand, in FIG. 11, linear micro light-shielding portions 865 extending in the y direction and linear micro light-transmitting portions 866 extending in the y direction are alternately arranged in the x direction orthogonal to the y direction. In other words, a mode in which the micro light shielding portions 865 or the micro light transmitting portions 866 are not adjacent to each other is illustrated. Even in this mode, from the viewpoint of preventing problems due to interference of diffracted light, the width W of each micro light-shielding portion 865 and each micro light-transmissive portion 866 is preferably 1.0 μm or more and 2.0 μm or less. More preferably, it is 1.5 μm or less.

  Of the two types of semi-transmissive portions 86 described above, the semi-transmissive portion 86 employing a halftone has a light transmitted through the semi-transmissive portion 86 as compared with the semi-transmissive portion 86 employing a gray tone. There is an advantage that the diffraction of the above cannot be generated in principle. However, the semi-transmissive portion 86 in which halftone is adopted is formed in a separate process from the light shielding portion 84 of the exposure mask 7. On the other hand, according to the semi-transmission part 86 employing the gray tone, there is an advantage that the semi-transmission part 86 can be formed in the same process as the light shielding part 84 of the exposure mask 7.

  In FIG. 8, the area where the hatching is dense indicates that the light shielding portion 84 is provided, and the area where the hatching is sparse indicates that the semi-transmissive portion 86 is provided, while the hatching is performed. A region that is not shown indicates that neither the light shielding portion 84 nor the semi-transmissive portion 86 is provided. As shown in the figure, neither the light-shielding portion 84 nor the semi-transmissive portion 86 is provided in the first region 71 of the exposure mask 7. That is, the first region 71 is a region where only the base material 70 exists, and functions as a light-transmitting region that transmits light from the light source toward the peripheral region 513. Similarly to the first region 71, the opening forming region 724 is a region of only the base material 70 and functions as a light-transmitting region. Therefore, as shown in FIG. 7, the peripheral region 513 of the film body 51 to which the transmitted light of the first region 71 reaches and the region 515 of the film body 51 to which the transmitted light of the opening formation region 724 reach have the thickness. Photolysis will occur over the entire direction. On the other hand, as shown in FIG. 8, a semi-transmissive portion 86 is provided in a region excluding each dot region 721 and the opening formation region 724 in the second region 72. That is, this region functions as a semi-transmissive region that transmits light toward the processing region 511 with a light transmittance lower than that of the first region 71. Accordingly, only a part of the light traveling from the light source toward the processing region 511 of the film body 51 toward the region to be the depression 214 in the base layer 21 reaches the surface of the film body 51. Therefore, as shown in FIG. 7, only a part in the thickness direction of the film body 51 to be the depression 214 of the base layer 21 is photodecomposed.

  Further, as shown in FIG. 8, each dot region 721 of the second region 72 is covered with a light shielding portion 84, and functions as a light shielding region that blocks light from the light source toward the film body 51. Of the region to be processed 511, the region where light irradiation is prevented by each dot region 721 becomes a protrusion 213 of the base layer 21 without being removed by development. Here, the ratio of the total area of the plurality of dot regions 721 in the area of the entire plate surface of the exposure mask 7 (that is, the total area of the first region 71 and the second region 72) is selected as follows. It is desirable that That is, since the dot region 721 in the present embodiment corresponds to the region of the film body 51 that becomes the protrusion 213 in the base layer 21, the proportion of the dot region 721 in the entire plate surface of the exposure mask 7 is too small. In this case, the area of the protrusion 213 occupying the surface of the base layer 21 is reduced, the flat portion is increased, and the light scattering effect by the reflective layer 22 is reduced. On the other hand, when the ratio of the dot region 721 to the entire plate surface of the exposure mask 7 is too large, the flat portion increases as a result of the area of the projection 213 occupying the surface of the base layer 21 being increased. The light scattering effect by the reflective layer 22 is reduced. Therefore, in order to obtain a good light scattering effect by the reflective layer 22, it is desirable that the ratio of the total area of the dot regions 721 in the entire area of the exposure mask 7 is 30% or more and 60% or less.

  Next, FIG. 12 is an enlarged plan view showing one dot region 721. As shown in the figure, the planar shape of each dot region 721 in the present embodiment is a substantially polygonal shape (here, a dodecagon), and thus is a substantially polygonal shape of the planar shape of each light shielding portion 84. More specifically, the planar shape of each dot region 721 (or the light-shielding portion 84 provided in the dot region 721) is, as shown in FIG. Shape). In the present embodiment, it is assumed that the circumscribed circle C is an ellipse.

  Also, as shown in FIG. 12, a peripheral light-transmitting region 88 is provided around each dot region 721 so as to follow the periphery of the dot region 721 (periphery of the light shielding portion 84). The peripheral translucent area 88 in this embodiment is an area in contact with the entire periphery of the dot area 721. Similar to the first region 71, the peripheral light-transmitting region 88 is a region where neither the light shielding portion 84 nor the semi-transmissive portion 86 is provided. Therefore, the emitted light from the light source is substantially the same as the first region 71. The light passes through the peripheral light transmitting region 88 at the light transmittance (that is, the transmittance of the base material 70 is about 100%) and reaches the film body 51. FIG. 13 is a cross-sectional view showing the state of transmitted light in the vicinity of each dot region 721. As shown in the figure, the light transmitted through the peripheral light transmitting region 88 provided around one dot region 721 is diffracted at the periphery of the light shielding portion 84 covering the dot region 721 and then the surface of the film body 51. To. These diffracted lights Li reach the area of the film body 51 that faces the dot area 721, and intensify each other particularly at the part of the elliptical dot area 721 that faces each focal point. A region 518 shown in FIG. 13 is a region that is photodecomposed by the diffracted light Li at the periphery of the dot region 721 in the film body 51. As shown in the figure, when the diffracted light Li at the periphery of the dot region 721 is irradiated, the length along the longitudinal direction of the dot region 721 is within the region facing the dot region 721 of the film body 51. The scale-shaped region 518 is photodecomposed over the depth d1. This region 518 is removed over a part in the thickness direction of the film body 51 through the development process shown in FIG. 6D, whereby the top of the projection 213 as shown in FIG. 3 and FIG. This is a recess 213b in 213a.

  By the way, a configuration (comparative) in which the planar shape of each dot region 721 is a regular circle or a polygon whose circumscribed circle is a regular circle is also conceivable, but in this case, the depth of the recess 213b is as follows. The problem of becoming too large can arise. FIG. 14 is a cross-sectional view (corresponding to FIG. 13) showing the state of transmitted light in the vicinity of the dot region 721 ′ that is proportional. As shown in the figure, when the planar shape of the dot region 721 ′ is a regular circle, the diffracted light Li over the entire periphery of the dot region 721 ′ has substantially the same phase as the region 518 ′ of the film body 51. Concentrate and strengthen each other. Since the diffracted light Li concentrates in the narrow region 518 ′ in this way, as shown in FIG. 14, the depth d2 of the portion of the film body 51 that is photolyzed by the diffracted light is the dot region according to this embodiment. It becomes larger than the maximum depth d1 of the region 518 that is photolyzed by the diffracted light Li of 721. The surface of the base layer 21 obtained by developing the film body 51 that has undergone such exposure processing is such that a very deep depression 213b is formed in the top 213a of each protrusion 213. When the indentation 213b provided on the top 213a of the protrusion 213 in the base layer 21 is too deep as a result of the test by the inventor of the present application, the light scattering characteristics of the reflection layer 22 provided on the rough surface are not necessarily high. It came to obtain the knowledge that. On the other hand, according to the present embodiment, the diffracted light Li in each dot region 721 reaches the film body 51 dispersively over a region 518 wider than the region 518 ′ shown in FIG. The depth d1 of the region 518 that undergoes photolysis is suppressed. Therefore, according to the exposure mask 7, the reflection layer 22 having a good light scattering effect can be obtained.

  Further, in the exposure mask 7 according to the present embodiment, the region to be the depression 214 in the base layer 21 in the processing region 511 is a semi-transmissive region, and thus light transmitted through this region is transmitted from the film body 51. Only a part in the thickness direction is photodecomposed. Therefore, since the surface of the second substrate 20 is not exposed at the bottom of the recess 214 of the base layer 21, the reflective layer 22 provided on the surface of the base layer 21 provides a good light scattering effect. . In addition, according to the exposure mask 7, the region 515 corresponding to the peripheral region 513 and the opening 211 and the region to be the roughened recess 214 in the processing region 511 are collectively collected in a common process. Since exposure can be performed, the manufacturing process can be simplified and the manufacturing cost can be reduced as compared with the conventional technique.

<D: Modification>
The embodiment described above is merely an example. Various modifications can be made to this embodiment without departing from the spirit of the present invention. Specifically, the following modifications can be considered.

(1) In each of the above embodiments, the configuration in which the opening 211 is provided in the base layer 21 so as to correspond to each pixel is illustrated. However, as shown in FIG. 15, the opening 211 is provided in the base layer 21. Configurations that are not possible may also be employed. However, in the configuration shown in FIG. 15, part of light traveling from the second substrate 20 side to the first substrate 10 side is absorbed by the base layer 21 in the transmissive display. Therefore, from the viewpoint of suppressing the loss of the amount of light used for the transmissive display, a configuration in which the opening 211 is provided in the base layer 21 as in the above embodiments is desirable. In each of the above embodiments, the so-called transflective liquid crystal display device 100 capable of both reflective display and transmissive display has been exemplified. However, the present invention also applies to the liquid crystal display device 100 capable of only reflective display. Can be applied. In this case, the opening 211 of the reflective layer 22 and the light transmitting part 221 of the reflective layer 22 are not provided. Therefore, the opening forming region 724 is not provided in the exposure mask 7.

(2) In each of the above embodiments, the light-shielding portion 84 is configured by a single layer. However, the light-shielding portion 84 is formed by laminating a light-shielding layer such as chrome and a semi-transmissive portion 86 employing a halftone. Also good. According to this configuration, the light shielding performance by the light shielding unit 84 can be enhanced.

(3) In the above embodiments, the dot area 721 of the exposure mask 7 is a polygon whose circumscribed circle is an ellipse, but the planar shape of each dot area 721 is arbitrary. For example, a dot region 721 having a substantially elliptical planar shape, or a dot region 721 having a planar shape obtained by adding a semicircular R having a diameter to each of opposite sides of a rectangle (or square) S as shown in FIG. Can also be employed. As described above, the “flattened shape” in the present invention is a concept including not only a strict ellipse but also all elongated circles (in other words, a circle other than a regular circle).

(4) In the above embodiment, the configuration in which the peripheral light transmitting region 88 is provided so as to be in contact with the entire periphery of each dot region 721 is illustrated. However, as shown in FIG. The structure provided so that it may contact | connect partially the periphery of 721 (periphery of the light-shielding part 84) may also be employ | adopted. In the drawing, a configuration in which the peripheral light transmitting region 88 is provided along only four sides that are not adjacent to each other among the sides of the dot region 721 having a substantially octagonal shape is illustrated. In the configuration shown in FIG. 12, light from the light source is diffracted over the entire periphery of the dot region 721 and reaches the region 518 of the film body 51. Therefore, the top of the protrusion 213 depends on the amount of light emitted from the light source. There is still a possibility that the recess 213b of the stub is too deep. On the other hand, according to the configuration according to this modification, the amount of diffracted light that passes through the peripheral light transmitting region 88 and reaches the region 518 of the film body 51 can be reduced as compared with the case of FIG. Can be effectively suppressed from becoming too deep. Thus, it is desirable that the shape of the peripheral light transmitting region 88 is selected so that the depth of the recess 213b is optimal. Even when the peripheral light transmitting region 88 is not provided, the light transmitted through the semi-transparent portion 86 at the periphery of each dot region 721 is diffracted at the periphery of the dot region 721. Similar effects can be obtained.

(5) Although the liquid crystal display device has been exemplified in each of the above embodiments, the present invention can be applied to other electro-optical devices. That is, the present invention can be applied to any device that displays an image using an electro-optical material that converts an electrical action of supplying an image signal into an optical action such as a change in luminance and light transmittance. For example, an electrophoretic display device using a microcapsule including a colored liquid and white particles dispersed in the liquid as an electro-optical material, and a twist ball that is separately applied in different colors for different regions of polarity. The present invention can be applied to various electro-optical devices such as a twist ball display used as an electro-optical material or a toner display using black toner as an electro-optical material. It can be said that the electro-optical device substrate according to the present invention is particularly suitable for an electro-optical material that displays an image using an electro-optical material that itself does not emit light, as exemplified above. However, the present invention can also be applied to an electro-optical device using an electro-optical material that emits light (that is, a self-luminous electro-optical material). For example, when the electro-optic device substrate according to the present invention is provided on the back side of a self-luminous electro-optic material, a bright display is realized by reflecting light emitted from the electro-optic material to the back side to the observation side. Is done. The electro-optical device using the self-luminous electro-optical material includes a display device using an organic light emitting diode (OLED) element such as an organic EL or a light-emitting polymer as an electro-optical material, or a high-pressure gas such as helium or neon. For example, a plasma display panel (PDP) using a phosphor as an electro-optical material, and a field emission display (FED) using a phosphor as an electro-optical material.

<E: Electronic equipment>
Next, an electronic apparatus including the electro-optical device according to the invention as a display device will be described. FIG. 18 is a perspective view showing a configuration of a mobile phone using the liquid crystal display device 100 according to each of the above embodiments. As shown in this figure, the mobile phone 1200 includes the liquid crystal display device 100 described above together with a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206.

  FIG. 19 is a perspective view showing a configuration of a digital still camera in which the liquid crystal display device 100 according to each of the above embodiments is applied to a viewfinder. The liquid crystal display device 100 according to each of the above embodiments is provided on the back surface of the main body 1302 in the digital still camera 1300. Since the liquid crystal display device 100 performs display based on the imaging signal, it functions as a finder for displaying the subject. A light receiving unit 1304 including an optical lens and a CCD is provided on the front side of the main body 1302 (the back side in FIG. 19). When the photographer confirms the subject image displayed on the liquid crystal display device 100 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory of the circuit board 1308. Further, in the digital still camera 1300, a video signal output terminal 1312 for external display and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302.

  Note that examples of electronic equipment in which the electro-optical device according to the present invention can be used as a display device include a notebook computer, a liquid crystal television, a mobile phone shown in FIG. 18 and a digital still camera shown in FIG. Examples include a viewfinder type (or monitor direct view type) video recorder, a car navigation device, a pager, an electronic notebook, a calculator, a word processor, a workstation, a videophone, a POS terminal, and a device equipped with a touch panel.

It is sectional drawing which shows the structure of the liquid crystal display device which concerns on 1st Embodiment of this invention. It is a perspective view which expands and shows the structure of the principal part of a liquid crystal display device. It is a figure which expands and shows the protrusion of a base layer and a reflection layer among liquid crystal display devices. It is a top view which shows the aspect of the some protrusion provided in the surface of the base layer. It is a top view which shows the other aspect of several protrusion provided in the surface of the base layer. It is sectional drawing which shows the manufacturing process of each element on a 2nd board | substrate among liquid crystal display devices. It is sectional drawing which shows the part photodecomposed in an exposure process among film bodies. It is a top view which shows the structure of the mask for exposure. It is sectional drawing which shows the structure of the mask for exposure. It is a top view which shows the specific structure of the semi-transmission part which employ | adopted the gray tone. It is a top view which shows the specific structure of the semi-transmission part which employ | adopted the gray tone. It is a top view which expands and shows the dot area | region of the mask for exposure. It is sectional drawing which shows the path | route of the light emitted from the light source and having reached the vicinity of the dot area | region. It is sectional drawing which shows the path | route of the light which reached the vicinity of the dot area | region which concerns on a proportional. It is sectional drawing which shows the structure of the liquid crystal display device which concerns on a modification. It is a top view which shows the shape of the dot area | region which concerns on a modification. It is a top view which expands and shows the dot area | region of the mask for exposure which concerns on a modification. It is a perspective view which shows the structure of the mobile telephone which is an example of the electronic device which concerns on this invention. 1 is a perspective view illustrating a configuration of a digital still camera which is an example of an electronic apparatus according to the invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Liquid crystal display device, 10 ... 1st board | substrate, 11 ... Pixel electrode, 12 ... Scanning line, 13 ... TFD element, 14 ... Alignment film, 20 ... 2nd board | substrate, 21 ... Underlayer , 211... Opening, 213... Projection, 213 a... Top of projection, 213 b. ... Projection of reflection layer, 24 ... color filter, 25 ... light-shielding layer, 26 ... insulating layer, 27 ... data line, 34 ... sealing material, 35 ... liquid crystal, 38 ... IC chip, 51 ... Film body, 511... Processed area, 513... Peripheral area, 515... Area that becomes the opening of the underlayer of the film body, 517. The area of the film that is photolyzed by diffracted light at the periphery of the dot area, 7. Mask, 71... First region, 72... Second region, 721... Dot region, 81 .. translucent portion, 84 .. light-shielding portion, 86. Part, 862, 866... Microtranslucent part, 88.

Claims (11)

In the mask used for the exposure process to make the surface of the film body rough,
A light-transmitting region that transmits light toward a region outside the processing region to be roughened in the film body;
A plurality of light shielding regions that are a plurality of regions that block light directed toward the region to be processed, and each planar shape is a substantially polygonal shape in which a substantially circular shape or a circumscribed circle is a flattened shape,
An exposure mask comprising: a semi-transmissive region that transmits light directed toward the processing region with a light transmittance lower than that of the light-transmitting region. An exposure mask comprising: a peripheral light-transmitting region that is a region along a periphery of each light-shielding region and transmits light at substantially the same light transmittance as the light-transmitting region. The exposure mask according to claim 2, wherein the peripheral translucent area is an area in contact with the entire periphery of each light shielding area. The exposure mask according to claim 2, wherein the peripheral light shielding region is a region in contact with a part of a periphery of each light shielding region. The exposure mask according to claim 1, wherein a longitudinal direction of each of the light shielding regions is substantially the same direction for the plurality of light shielding regions. In a method for manufacturing a substrate for an electro-optical device comprising a base layer having a rough surface and a reflective layer provided on the rough surface of the base layer,
A film body forming step of forming a film body from a photosensitive material;
A step of exposing the film body through an exposure mask having a plurality of light-shielding regions, each of which has a substantially polygonal shape in which each planar shape is substantially oblong or a circumscribed circle is oblong, and the projections on the rough surface The film is formed by blocking light from the light source toward the region to be formed by the respective light shielding regions of the exposure mask and transmitting light from the light source toward other regions through the semi-transmissive region of the exposure mask. An exposure process in which the light is applied to only a part of the thickness direction of the body;
A development step of forming the underlayer by removing a portion on which light has acted in the exposure step by development; and
And a reflective layer forming step of forming the reflective layer having light reflectivity on the rough surface of the base layer obtained by the developing step. In the exposure step, light transmitted through a peripheral light transmitting region in contact with the periphery of each light shielding region in the exposure mask is diffracted at the periphery of each light shielding region, and this diffracted light becomes the top of the projection. The method for manufacturing a substrate for an electro-optical device according to claim 6, wherein the method is applied to a power portion. In a method for manufacturing an electro-optical device comprising a substrate for an electro-optical device provided with a reflective layer having light reflectivity on a rough surface of a base layer having a rough surface,
Producing a substrate for an electro-optical device by the method according to claim 6,
And a step of disposing an electro-optic material so as to face the reflective layer of the substrate for the electro-optic device. A base layer having a plurality of protrusions on the surface, each of which has a depression on each top surface and a planar shape that is substantially flat;
A substrate for an electro-optical device, comprising: a reflective layer having light reflectivity provided on a surface of the base layer having the plurality of protrusions. A first substrate and a second substrate that face each other and sandwich the electro-optic material;
A layer provided on a plate surface of the second substrate facing the electro-optic material, each of which has a plurality of protrusions on the surface, each of which has a depression on the top surface and a substantially flat shape in plan view. An underlayer,
An electro-optical device comprising: a reflective layer that is provided on a surface of the base layer having the plurality of protrusions and reflects incident light from the first substrate side.   An electronic apparatus comprising the electro-optical device according to claim 10 as a display device.

Images