JP2005141128A - Photosensitive paste, plasma display member, and plasma display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a photosensitive paste with no defects in its pattern after coating and burning. <P>SOLUTION: A photosensitive paste consists of an organic ingredient and inorganic fine grains. This is a photosensitive paste including an aliphatic polycyclic chemical compound having two or more ethylenic unsaturated groups as an organic component. A pattern forming method uses it, and a plasma display manufacturing method also uses it. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a photosensitive paste, a plasma display member using the same, and a plasma display.

  2. Description of the Related Art In recent years, high definition has been advanced in circuit materials and displays, and a pattern processing technique that can cope with this has been demanded. In particular, in a plasma display, a material and a processing method capable of patterning an inorganic material such as glass powder with high accuracy in partition formation are desired.

  Conventionally, as a method of patterning an inorganic material, a method of forming a pattern by a negative photosensitive paste method using a photosensitive paste has been proposed (for example, Patent Document 1, Patent Document 2, and Patent Document 3). reference).

However, if there are foreign particles such as coarse particles, gels, and metal powder in the paste coating, the foreign particles are peeled off during development, and cracks are formed in the partition walls. May occur. Further, as the partition wall width becomes narrower, it is more remarkably affected by foreign matter in the paste, resulting in an increase in the occurrence rate of disconnection and defects, causing a decrease in yield.
JP-A-1-296534 (page 2) Japanese Patent Laid-Open No. 2-165538 (2nd page) JP-A-5-342992 (page 2)

  In view of the above-described conventional problems, an object of the present invention is to provide a paste that does not crack during development even if coarse particles are present, and that is free from disconnection or defects after firing.

  In order to solve the above problems, the present invention has the following configuration. That is, the present invention is a photosensitive paste comprising an organic component and inorganic fine particles, wherein the organic component contains an aliphatic polycyclic compound having two or more ethylenically unsaturated groups. And a plasma display member and a plasma display using the same.

  ADVANTAGE OF THE INVENTION According to this invention, the photosensitive paste without a defect in the pattern after baking can be provided.

   The photosensitive paste of the present invention is composed of inorganic fine particles and an organic component, and the organic component contains an aliphatic polycyclic compound having an ethylenically unsaturated group. The photosensitive paste of the present invention can be used for the purpose of forming a pattern consisting essentially of an inorganic substance by baking after pattern formation using photolithography.

  The substantially inorganic pattern produced using the photosensitive paste of the present invention can be suitably used as a partition wall for a plasma display panel back plate in display applications, particularly plasma display applications.

  The organic component used in the present invention is at least one selected from a reactive monomer, a reactive oligomer, and a reactive polymer, and if necessary, a binder polymer, a photopolymerization initiator, a sensitizer, a sensitization aid, It is constituted by adding additive components such as ultraviolet absorbers, organic dyes, dispersants, plasticizers, thickeners, organic solvents, acids, bases, anti-settling agents, and antioxidants. Here, the reactivity in the reactive monomer, reactive oligomer, and reactive polymer means that when the photosensitive paste is irradiated with actinic rays, the reactive monomer, reactive oligomer, and reactive polymer are photocrosslinked, It means that the chemical structure changes through reactions such as photopolymerization, photodepolymerization and photomodification.

The organic component of the present invention may contain a copolymer having a carboxyl group.
Examples of the copolymer having a carboxyl group include monomers having a carboxyl group such as acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, and acid anhydrides thereof, and methacrylic acid esters, acrylics, and the like. It is obtained by selecting monomers such as acid ester, styrene, acrylonitrile, vinyl acetate, 2-hydroxyacrylate and copolymerizing using an initiator such as azobisisobutyronitrile.

  As the copolymer having a carboxyl group, a copolymer containing (meth) acrylic acid ester and (meth) acrylic acid as a copolymerization component is preferably used since the thermal decomposition temperature at the time of firing is low. In particular, a styrene / methyl methacrylate / methacrylic acid copolymer is preferably used. Furthermore, it is also preferable that the copolymer having a carboxyl group has an ethylenically unsaturated group in the side chain. Examples of the ethylenically unsaturated group include an acryl group, a methacryl group, a vinyl group, and an allyl group.

  The resin acid value of the copolymer having a carboxyl group is preferably 50 to 150 mgKOH / g. By setting the acid value to 150 mgKOH / g or less, the development allowable range can be widened. In addition, when the acid value is 50 mgKOH / g or more, the solubility of the unexposed area in the developing solution does not decrease, and therefore it is not necessary to increase the concentration of the developing solution, thereby preventing the exposed area from being peeled off and providing a high-definition pattern. Can get.

  The method of adding such a side chain to the copolymer is an ethylenically unsaturated compound or acrylic acid chloride having a glycidyl group or an isocyanate group with respect to the mercapto group, amino group, hydroxyl group or carboxyl group in the copolymer. There is a method of making an addition reaction of methacrylic acid chloride or allyl chloride.

  Examples of the ethylenically unsaturated compound having a glycidyl group include glycidyl acrylate, glycidyl methacrylate, allyl glycidyl ether, glycidyl ethyl acrylate, crotonyl glycidyl ether, glycidyl crotonic acid, and glycidyl ether of isocrotonic acid. Examples of the ethylenically unsaturated compound having an isocyanate group include (meth) acryloyl isocyanate and (meth) acryloylethyl isocyanate. In addition, the ethylenically unsaturated compound having a glycidyl group or an isocyanate group, acrylic acid chloride, methacrylic acid chloride or allyl chloride is 0.05 to 1 mol with respect to a mercapto group, amino group, hydroxyl group or carboxyl group in the polymer. An amount is preferably added.

  In order to obtain an appropriate exposure amount, the addition amount of the copolymer having a carboxyl group is preferably 10 to 90% by weight in the organic component excluding the solvent.

  When a binder component is required, polyvinyl alcohol, polyvinyl butyral, methacrylic acid ester polymer, acrylic acid ester polymer, acrylic acid ester-methacrylic acid ester copolymer, butyl methacrylate resin, or the like can be used as the polymer.

Examples of the aliphatic polycyclic compound having two or more ethylenically unsaturated groups preferably used in the present invention include compounds represented by the following general formula (1).
The term “aliphatic polycyclic compound” as used herein refers to a compound composed of an aliphatic cyclic compound, in which each ring shares a carbon-carbon bond.

ここにおいてＲ₁及びＲ₂は、それぞれ独立して、水素原子またはメチル基を表し、Ｒ₃及びＲ₄は、それぞれ独立して、単結合またはアルキレン基を表し、ｘは１又は２を表し、ｙは０または１を表す。

Here, R ₁ and R ₂ each independently represent a hydrogen atom or a methyl group, R ₃ and R ₄ each independently represent a single bond or an alkylene group, x represents 1 or 2, y represents 0 or 1;

  Since such an aliphatic polycyclic compound is hydrophobic, coarse glass particles and the like are peeled off from the partition wall during development in order to suppress the penetration of the developer into the exposed portion and prevent the partition wall from swelling. Can be prevented.

  The content of the aliphatic polycyclic compound having two or more ethylenically unsaturated groups is preferably 0.1 to 50% by weight. More preferably, it is 0.1 to 20% by weight. By setting the content within this range, it is possible to obtain an effect of suppressing peeling from an appropriate exposure amount.

Specific examples of the aliphatic polycyclic compound having an ethylenically unsaturated group include bis (hydroxymethyl) tricyclo [5.2.1.0 ^2,6 ] decanediacrylate, bis (hydroxymethyl) tricyclo [5.2. .1.0 ^2,6] decane dimethacrylate, bis (hydroxymethyl) tricyclo [5.2.1.0 ^2,6] tricyclodecane compound such as decane acrylate methacrylate, bis (hydroxymethyl) pentacyclo [6.5 1.1 ^3,6 . 0 ^2,7 . 0 ^9,13 ] pentadecane diacrylate, bis (hydroxymethyl) pentacyclo [6.5.1.1 ^3,6 . 0 ^2,7 . 0 ^9,13 ] pentadecane dimethacrylate, bis (hydroxymethyl) pentacyclo [6.5.1.1 ^3,6 . 0 ^2,7 . 0 ^9,13 ] Pentacyclodecane compounds such as pentadecane acrylate methacrylate, and examples of product names include KAYARAD “R-648” (Nippon Kayaku Co., Ltd.). These may be used alone or in combination.

Moreover, as a urethane compound which has an ethylenically unsaturated group preferably used by this invention, the compound shown by following General formula (2) is mentioned, for example.
^{_{[CH 2 = CR 1 - (}} A) a -OCONH] b -R 2 (2)
Here, R ¹ is a hydrogen atom or a methyl group. A is COO, CONH, or a substituted or unsubstituted phenylene group. R ² is selected from cyclic or acyclic alkylene, arylene, and aralkylene, and may be substituted with an alkyl group having 1 to 6 carbon atoms, a halogen atom, a hydroxyl group, an aryl group, or the like. a represents 0 or 1, and b represents a positive number of 1 or more.

  Preferred product names of urethane compounds having an ethylenically unsaturated group include AH-600, AT-600, AI-600, UA-306H, UA-306T, UA-306I, UA-101T, UA-101I, UF- 8001, UF-8003, UF-503LN, UF-1003LN, UF-803TN, UF-1003LC, UF-702PN, UF-7703PN, UF-4703PN, (Kyoeisha Chemical Co., Ltd.), “Art Resin” UN-7001, "Art Resin" UN-856P, "Art Resin" UN-330, "Art Resin" UN-7000 (Negami Kogyo Co., Ltd.), UA-122P, UA-200X, UA-340P, UA-512, UM-200X (Shin Nakamura Chemical Co., Ltd.), “Neotan” UE-1100, “Neotan” UE 1200, “Neotan” UE-1300, “Neotan” UE-1400, “Neotan” UE-5000, “Neotan” UE-5700 (Toagosei), KRM7222 (Daicel UCB) However, the present invention is not limited to this. Moreover, you may use these compounds in mixture.

  The molecular weight of the urethane compound having an ethylenically unsaturated group is preferably 800 or more. By setting the molecular weight to 800 or more, it is possible to further reduce defects such as peeling of the pattern and disconnection during firing.

  The content of the urethane compound having an ethylenically unsaturated group is preferably 0.1 to 20% by weight. By setting the content within this range, it is possible to obtain an effect of suppressing peeling from an appropriate exposure amount.

The organic component of the present invention preferably contains an amine compound having an ethylenically unsaturated group, and particularly contains an amine compound having an ethylenically unsaturated group represented by the following chemical formulas (3) and (4). It is preferable.
R ¹ R ² R ³ N (3)
R ¹ R ³ N-L-NR ² R ⁴ (4)
(Wherein R ³ and R ⁴ represent a substituent having an ethylenically unsaturated group, R ¹ and R ² are a substituent having an ethylenically unsaturated group, a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, Represents a group selected from an aryl group, an aralkyl group, and a hydroxyalkyl group, and R ¹ and R ² may be the same or different, and L represents a divalent linking group.
Among the amine compounds preferably used in the present invention, the compound represented by the above formula (3) includes N, N-dimethylaminoethyl (meth) as one containing one ethylenically unsaturated group in the molecule. Acrylate, N, N-diethylaminoethyl (meth) acrylate, N, N-dimethylaminopropyl (meth) acrylamide, N, N-dimethyl (meth) acrylamide, (meth) acryloylmorpholine, N-isopropyl (meth) acrylamide, N, N-diethyl (meth) acrylamide, N- [3- (N ′, N′-dimethylamino) propyl] (meth) acrylamide, vinyl p-dimethylaminobenzoate, vinylpyridine, allylamine, allylaniline One or more of them can also be preferably used.

  As the amine compound represented by the above formula (3), those containing two ethylenically unsaturated groups in the molecule include bis (2-hydroxy-3-methacryloyloxypropyl) isopropylamine, bis (2- One or more selected from hydroxy-3-methacryloyloxypropyl) normal propylamine and diallylamine can also be preferably used.

  In addition, as the amine compound represented by the above formula (1), tris (2-methacryloyloxyethyl) amine, tris (2-hydroxy-3-) may be used as a compound containing 3 or more ethylenically unsaturated groups in the molecule. One or more selected from (methacryloyloxypropyl) amine and triallylamine can also be preferably used.

  Among the amine compounds preferably used in the present invention, the compound represented by the above formula (4) includes N- (2-hydroxy-3-methacryloyl) as one containing one ethylenically unsaturated group in the molecule. Oxypropyl) polyoxypropylenediamine, N- (2-methacryloyloxyethyl) polyoxyethylenediamine, N- (2-methacryloyloxyethyl) ethylenediamine, N- (2-methacryloyloxyethyl) -N ′, N′-dimethylethylenediamine One or more selected from the above can also be preferably used.

  As a compound represented by the above formula (4), N, N-bis (2-hydroxy-3-methacryloyloxypropyl) polyoxypropylenediamine, which contains two ethylenically unsaturated groups in the molecule, One or more selected from N, N′-bis (2-methacryloyloxyethyl) polyoxyethylenediamine can also be preferably used.

  As a compound represented by the above formula (4), N, N, N′-tris (2-hydroxy-3-methacryloxypropyl) polyoxypropylene containing three ethylenically unsaturated groups in the molecule 1 type selected from diamine, N, N, N′-tris (2-methacryloyloxyethyl) polyoxyethylenediamine, N, N, N′-tris (2-methacryloyloxyethyl) -N′-methylpolyoxyethylenediamine The above can also be preferably used.

  Examples of the compound represented by the above formula (4) include N, N, N ′, N′-tetra (2-methacryloyloxyethyl) polyoxy as a compound containing 4 or more ethylenically unsaturated groups in the molecule. One or more selected from propylenediamine, N, N, N ′, N′-tetra (2-hydroxy-3-methacryloxypropyl) polyoxyethylenediamine can also be preferably used.

  Preparation of an amine compound having an ethylenically unsaturated bond may be carried out by reacting glycidyl (meth) acrylate, (meth) acrylic acid chloride, (meth) acrylic anhydride, etc. having an ethylenically unsaturated bond with an amino compound. . A plurality of ethylenically unsaturated group-containing compounds may be mixed and used. Examples of the amine compound having an ethylenically unsaturated bond include, but are not limited to, the above compounds. Moreover, you may use these compounds in mixture.

  In this invention, you may use the monomer which has an ethylenically unsaturated bond other than the said urethane compound and an amine compound as needed. Examples of such a polymerizable monomer include a monomer having one or more photopolymerizable (meth) acrylate groups or allyl groups. Specific examples of these include acrylic acid or methacrylic acid esters of alcohols (eg ethanol, propanol, hexanol, octanol, cyclohexanol, glycerin, trimethylolpropane, pentaerythritol, etc.), carboxylic acids (eg acetic acid, propionic acid, benzoic acid). Acid, acrylic acid, methacrylic acid, succinic acid, maleic acid, phthalic acid, tartaric acid, citric acid, etc.) and glycidyl acrylate, glycidyl methacrylate, allyl glycidyl, or tetraglycidyl metaxylylenediamine, amide derivatives (For example, acrylamide, methacrylamide, N-methylolacrylamide, methylenebisacrylamide, etc.), reaction products of epoxy compounds with acrylic acid or methacrylic acid, etc. Kill. Further, in the polyfunctional monomer, the unsaturated group may be present by mixing acrylic, methacrylic, vinyl and allyl groups. These may be used alone or in combination.

The photopolymerization initiator that can be used in the present invention is selected from those that generate radical species. As photopolymerization initiators, diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethyl ketal, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropane- 1-one, 4- (2-hydroxyethoxy) phenyl- (2-hydroxy-2-propyl) ketone, 1-hydroxycyclohexyl-phenylketone, 1-phenyl-1,2-propanedione-2- (o-ethoxy) Carbonyl) oxime, 2-methyl- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, Benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl Ether, benzoin isobutyl ether, benzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4,4-dichlorobenzophenone, hydroxybenzophenone, 4-benzoyl-4'-methyl-diphenyl sulfide, alkylated benzophenone, 3,3 ' , 4,4′-tetra (t-butylperoxycarbonyl) benzophenone, 4-benzoyl-N, N-dimethyl-N- [2- (1-oxo-2-propenyloxy) ethyl] benzenemethananium bromide, (4-Benzoylbenzyl) trimethylammonium chloride, 2-hydroxy-3- (4-benzoylphenoxy) -N, N, N-trimethyl-1-propenaminium chloride monohydrate, 2-isopropylthioxanthone, 2,4- Dimethylthio Sandone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 2-hydroxy-3- (3,4-dimethyl-9-oxo-9H-thioxanthen-2-yloxy) -N, N, N-trimethyl- 1-propanaminium chloride, 2,4,6-trimethylbenzoylphenylphosphine oxide, 2,2′-bis (o-chlorophenyl) -4,5,4 ′, 5′-tetraphenyl-1,2-bi Imidazole, 10-butyl-2-chloroacridone, 2-ethylanthraquinone, benzyl, 9,10-phenanthrenequinone, camphorquinone, methylphenylglyoxyester, η ⁵ -cyclopentadienyl-η ⁶ -cumenyl -Iron (1 +)-hexafluorophosphate (1-), diphenyl sulfide derivative, bis (η ^5- 2,4-cyclopentadien-1-yl) -bis (2,6-difluoro-3- (1H-pyrrol-1-yl) -phenyl) titanium, 4,4-bis (dimethylamino) benzophenone, 4,4 -Bis (diethylamino) benzophenone, thioxanthone, 2-methylthioxanthone, 2-chlorothioxanthone, 4-benzoyl-4-methylphenylketone, dibenzylketone, fluorenone, 2,3-diethoxyacetophenone, 2,2-dimethoxy-2 -Phenyl-2-phenylacetophenone, 2-hydroxy-2-methylpropiophenone, p-t-butyldichloroacetophenone, benzylmethoxyethyl acetal, anthraquinone, 2-t-butylanthraquinone, 2-aminoanthraquinone, β-chloroanthraquinone , Nthrone, benzanthrone, dibenzsuberone, methyleneanthrone, 4-azidobenzalacetophenone, 2,6-bis (p-azidobenzylidene) cyclohexane, 2,6-bis (p-azidobenzylidene) -4-methylcyclohexanone, 2-phenyl -1,2-butadione-2- (o-methoxycarbonyl) oxime, 1,3-diphenylpropanetrione-2- (o-ethoxycarbonyl) oxime, naphthalenesulfonyl chloride, quinolinesulfonyl chloride, N-phenylthioacridone, Photoreductive dyes such as 4,4-azobisisobutyronitrile, benzthiazole disulfide, triphenylphosphine, carbon tetrabrominated, tribromophenylsulfone, benzoyl peroxide and eosin, and methylene blue Examples include a combination of reducing agents such as scorbic acid and triethanolamine.

  In the present invention, one or more of these can be used. The photopolymerization initiator is preferably added in an amount of 0.05 to 10% by weight, more preferably 0.1 to 10% by weight, based on the photosensitive organic component. By setting the addition amount of the photopolymerization initiator within this range, good photosensitivity can be obtained while maintaining the remaining ratio of the exposed portion.

  A sensitizer can be used together with a photopolymerization initiator to improve sensitivity and to expand the effective wavelength range for the reaction. Specific examples of the sensitizer include 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-isopropylthioxanthone, 2,3-bis (4-diethylaminobenzal) cyclopentanone, 2,6-bis ( 4-dimethylaminobenzal) cyclohexanone, 2,6-bis (4-dimethylaminobenzal) -4-methylcyclohexanone, Michler's ketone, 4,4-bis (diethylamino) benzophenone, 4,4-bis (dimethylamino) chalcone 4,4-bis (diethylamino) chalcone, p-dimethylaminocinnamylidene indanone, p-dimethylaminobenzylidene indanone, 2- (p-dimethylaminophenylvinylene) isonaphthothiazole, 1,3-bis (4 -Dimethylaminophenylvinylene) Isonaphtho Sol, 1,3-bis (4-dimethylaminobenzal) acetone, 1,3-carbonylbis (4-diethylaminobenzal) acetone, 3,3-carbonylbis (7-diethylaminocoumarin), triethanolamine, methyl Diethanolamine, triisopropanolamine, N-phenyl-N-ethylethanolamine, N-phenylethanolamine, N-tolyldiethanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, isoamyl dimethylaminobenzoate, diethylamino Isoamyl benzoate, (2-dimethylamino) ethyl benzoate, ethyl 4-dimethylaminobenzoate (n-butoxy), 2-ethylhexyl 4-dimethylaminobenzoate, 3-phenyl-5-benzoylthiotetrazo Le, such as 1-phenyl-5-ethoxycarbonyl-thiotetrazole the like.

In the present invention, one or more of these can be used. Some sensitizers can also be used as photopolymerization initiators. When adding a sensitizer to the photosensitive paste of this invention, the addition amount becomes like this. Preferably it is 0.05 to 10 weight% with respect to the photosensitive organic component, More preferably, it is 0.1 to 10 weight%. By setting the addition amount of the sensitizer within this range, good photosensitivity can be obtained while maintaining the remaining ratio of the exposed portion. In the present invention, an antioxidant is preferably added. The antioxidant has a radical chain inhibiting action, a triplet elimination action, and a hydroperoxide decomposition action.

  For example, when a photosensitive paste is used for manufacturing a partition for a plasma display member, it contains a large amount of glass fine particle components in a dispersed state. Usually, light scattering inside the paste due to exposure light is unavoidable and is considered to be caused by it. The pattern shape is thickened and the pattern is easily filled (residual film formation). It is desirable that the pattern walls are vertically cut and rectangular. Ideally, it is soluble in the developer below a certain exposure dose, and insoluble in the developer above it. That is, it is preferable that even if cured at a low exposure amount by light scattering, it is dissolved in the developer, the pattern shape is thickened and the filling between patterns is eliminated, and the range that can be resolved even when the exposure amount is increased is wide. Ideally, it is soluble in the developer below a certain exposure dose, and insoluble in the developer above it. In other words, it is preferable that even if cured at a low exposure amount by light scattering, it is dissolved in the developer, the pattern shape is thickened and the filling between patterns is eliminated, and the development range is wide even if the exposure amount is increased.

  When an antioxidant is added to the photosensitive paste, the antioxidant captures radicals and returns the energy state of the excited photopolymerization initiator and sensitizer to the ground state, thereby causing excess light due to scattered light. Since the reaction is suppressed and a photoreaction occurs abruptly at an exposure amount that cannot be suppressed by the antioxidant, it is possible to increase the contrast of dissolution and insolubility in the developer.

  Specifically, p-benzoquinone, naphthoquinone, p-xyloquinone, p-toluquinone, 2,6-dichloroquinone, 2,5-diacetoxy-p-benzoquinone, 2,5-dicaproxy-p-benzoquinone, hydroquinone, p- t-butylcatechol, 2,5-dibutylhydroquinone, mono-t-butylhydroquinone, 2,5-di-t-amylhydroquinone, di-t-butyl-p-cresol, hydroquinone monomethyl ether, α-naphthol, hydrazine hydrochloride Salt, trimethylbenzylammonium chloride, trimethylbenzylammonium oxalate, phenyl-β-naphthylamine, parabenzylaminophenol, di-β-naphthylparaphenylenediamine, dinitrobenzene, trinitrobenzene, picric acid, quinonedioxime, Clohexanone oxime, pyrogallol, tannic acid, triethylamine hydrochloride, dimethylaniline hydrochloride, cuperone, (2,2′-thiobis (4-tert-octylphenolate) -2-ethylhexylamino nickel- (II), 4,4 '-Thiobis- (3-methyl-6-t-butylphenol), 2,2'-methylenebis- (4-methyl-6-t-butylphenol), 2,2'-thiobis- (4-methyl-6-t -Butylphenol), triethylene glycol-bis [3- (t-butyl-5-methyl-4-hydroxyphenyl) propionate], 1,6-hexanediol-bis [(3,5-di-t-butyl-4 -Hydroxyphenyl) propionate], 1,2,3-trihydroxybenzene, and the like. In the present invention, one or more of these can be used.

  The addition amount of the antioxidant is preferably 0.1 to 30% by weight, more preferably 0.5 to 20% in the photosensitive paste. By keeping the addition amount of the antioxidant within this range, it is possible to maintain the photosensitivity of the photosensitive paste and to maintain the degree of polymerization and maintain the pattern shape, while increasing the solubility and insoluble contrast in the developer. Can do.

  Moreover, by adding an ultraviolet absorber, scattered light inside the paste due to exposure light can be absorbed and scattered light can be weakened. Examples of the ultraviolet absorber include benzophenone compounds, cyanoacrylate compounds, salicylic acid compounds, benzotriazole compounds, indole compounds, inorganic fine-particle metal oxides, and the like. Among these, benzophenone compounds, cyanoacrylate compounds, benzotriazole compounds, and indole compounds are particularly effective. Specific examples thereof include 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2,2′-dihydroxy-4-methoxybenzophenone, 2,2′-dihydroxy-4,4′-dimethoxybenzophenone, 2,2′-dihydroxy-4,4′-dimethoxy-5-sulfobenzophenone, 2-hydroxy-4-methoxy-2′-carboxybenzophenone, 2-hydroxy-4-methoxy-5-sulfobenzophenone trihydrate, 2 -Hydroxy-4-n-octoxybenzophenone, 2-hydroxy-4-octadecyloxybenzophenone, 2,2 ', 4,4'-tetrahydroxybenzophenone, 4-dodecyloxy-2-hydroxybenzophenone, 2-hydroxy-4 -(2-hydroxy-3-methyl (Chryloxy) propoxybenzophenone, 2- (2′-hydroxy-5′-methylphenyl) benzotriazole, 2- (2′-hydroxy-3 ′, 5′-di-t-butylphenyl) benzotriazole, 2- (2 '-Hydroxy-3'-t-butyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3', 5'-di-t-butylphenyl) -5-chlorobenzo Triazole, 2- (2′-hydroxy-4′-n-octoxyphenyl) benzotriazole, 2-ethylhexyl-2-cyano-3,3-diphenyl acrylate, 2-ethyl-2-cyano-3,3-diphenyl BONASORB UA-3901 (made by Orient Chemical Co., Ltd.) and BONASORB are acrylate and indole-based absorbents A-3902 (manufactured by Orient Chemical Industries, Ltd.), but such SOM-2-0008 (manufactured by Orient Chemical Co., Ltd.) without limitation. Furthermore, a methacryl group or the like may be introduced into the skeleton of these ultraviolet absorbers and used as a reaction type. In the present invention, one or more of these can be used.

  The addition amount of the ultraviolet absorber is preferably in the range of 0.001 to 10% by weight, more preferably 0.005 to 5% by weight in the paste. By making it within this range, the transmission limit wavelength and the wavelength gradient width are kept within the desired ranges, and the effect of absorbing scattered light can be obtained while maintaining the transmittance of exposure light and the sensitivity of the photosensitive paste.

  In the present invention, an organic dye can be added as a mark for exposure and development. By adding a dye and coloring it, the visibility is improved, and it becomes easy to distinguish the portion where the paste remains during development and the portion where it has been removed. Although it does not specifically limit as organic dye, The thing which does not remain in the insulating film after baking is preferable. Specifically] dyes, anthraquinone dyes, indigoid dyes, phthalocyanine dyes, carbonium dyes, quinoneimine dyes, methine dyes, quinoline dyes, nitro dyes, nitroso dyes, benzoquinone dyes, naphthoquinone dyes Dyes, phthalimide dyes, perinone dyes and the like can be used. In particular, it is preferable to select a carbonium-based dye such as basic blue that absorbs light having wavelengths in the vicinity of the h-line and i-line, for example, because the effects of the present invention are more easily exhibited. The amount of organic dye added is preferably 0.001 to 1% by weight.

  An organic solvent is used to adjust the viscosity at the time of applying the photosensitive paste to the substrate according to the application method. As an organic solvent used at this time, methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl ethyl ketone, dioxane, acetone, cyclohexanone, cyclopentanone, isobutyl alcohol, isopropyl alcohol, tetrahydrofuran, dimethyl sulfoxide, γ-butyrolactone, bromobenzene, Chlorobenzene, dibromobenzene, dichlorobenzene, bromobenzoic acid, chlorobenzoic acid and the like, and organic solvent mixtures containing one or more of these are used.

  The inorganic fine particles in the present invention are fine particles of, for example, glass, ceramics, and conductive powder such as Au, Ag, Pd, Pt, and the like, and particularly useful when glass powder or Ag powder is used.

  As the glass powder, glass powder having a glass transition point of 430 to 500 ° C. and a softening point of 470 to 580 ° C. is preferably used. Moreover, pattern processing can be performed on the board | substrate used for a normal display by containing 50 weight% or more of glass powder in a paste.

The glass powder that can be preferably used as the inorganic fine particles used in the photosensitive paste of the present invention has, for example, the following composition.
Lithium oxide, sodium oxide or potassium oxide
3-15% by weight
5-30% by weight of silicon oxide
Boron oxide 20-45% by weight
Barium oxide or strontium oxide
2 to 15% by weight
Aluminum oxide 10-25% by weight
Magnesium oxide or calcium oxide
2 to 15% by weight.

  As described above, at least one of alkali metal oxides of lithium oxide, sodium oxide or potassium oxide is used, and the total amount is preferably 3 to 15% by weight, more preferably 3 to 10% by weight.

  Alkali metal oxide not only facilitates control of the glass load softening point and thermal expansion coefficient, but also reduces the refractive index of the glass, thus reducing the refractive index difference from the photosensitive organic component. Becomes easier. By making the total amount of alkali metal oxides 3% by weight or more, the effect of lowering the melting point of the glass can be obtained, and by making it 15% by weight or less, the chemical stability of the glass is maintained and the thermal expansion coefficient. Can be kept small. As the alkali metal, lithium is preferably selected in consideration of lowering the refractive index of the glass and preventing ion migration.

  The blending amount of silicon oxide is preferably 5 to 30% by weight, more preferably 10 to 30% by weight. Silicon oxide is effective in improving the denseness, strength and stability of glass, and is effective in lowering the refractive index of glass. The thermal expansion coefficient can be controlled to prevent peeling due to mismatch with the glass substrate. By setting the content to 5% by weight or more, the thermal expansion coefficient is kept small, and no cracks occur when baked on a glass substrate. Further, the refractive index can be kept low. By setting it to 30% by weight or less, the glass transition point and the load softening point can be kept low, and the baking temperature on the glass substrate can be lowered.

  Boron oxide is also effective for lowering the refractive index, and is preferably blended in the range of 20 to 45% by weight, more preferably 20 to 40% by weight. By setting it to 20% by weight or more, the glass transition point and the load softening point are kept low, and baking onto the glass substrate is facilitated. Moreover, the chemical stability of glass can be maintained by setting it as 45 weight% or more.

  It is preferable that at least one of barium oxide and strontium oxide is used, and the total amount is 2 to 15% by weight, more preferably 2 to 10% by weight. These components are effective in adjusting the thermal expansion coefficient, and are preferable in terms of application of the baking temperature to the heat resistance of the substrate, electrical insulation, stability of the partition walls formed, and denseness. By setting the content to 2% by weight or more, devitrification due to crystallization can be prevented. Moreover, by setting it as 15 weight% or less, a thermal expansion coefficient can be restrained small and a refractive index can also be restrained small. Also, the chemical stability of the glass can be maintained.

  Aluminum oxide has the effect of expanding the vitrification range and stabilizing the glass, and is effective in extending the pot life of the paste. It is preferable to mix | blend in the range of 10-25 weight%, By making it in this range, a glass transition point and a load softening point can be kept low and baking on a glass substrate can be made easy.

  Furthermore, it is preferable that calcium oxide and magnesium oxide are blended for facilitating melting of the glass and controlling the thermal expansion coefficient. Calcium oxide and magnesium oxide are preferably blended in a total of 2 to 15% by weight. When the total amount is 2% by weight or more, devitrification of the glass due to crystallization can be prevented, and when the total amount is 15% by weight or less, the chemical stability of the glass can be maintained.

  Further, although not described in the above composition, it is also preferable to contain zinc oxide, titanium oxide, zirconium oxide or the like.

  By using glass fine particles having such a glass transition point and softening point and blending a metal oxide so that the refractive index of the glass fine particles is 1.5 to 1.65, glass powder and photosensitive By matching the refractive index of the organic organic component and suppressing light scattering, highly accurate pattern processing becomes possible. For example, a glass powder composed of silicon oxide: 22, aluminum oxide: 23, boron oxide: 33, lithium oxide: 9, magnesium oxide: 7, barium oxide: 4 and zinc oxide 2 (% by weight) has a glass transition point of 490. C., softening point: 528.degree. C. and refractive index at g-line wavelength (436 nm): 1.59, and can be preferably used as the inorganic fine particles of the present invention.

  As a method for producing the glass powder, for example, raw materials such as lithium oxide, silicon oxide, boron oxide, barium oxide and aluminum oxide are mixed so as to have a predetermined composition, melted at 900 to 1200 ° C., and then rapidly cooled. A glass frit is pulverized to a fine powder of 1 to 5 μm. High purity carbonates, oxides, hydroxides and the like can be used as raw materials. Depending on the type and composition of the glass powder, it is possible to use ultra-pure alkoxides of 99.99% or higher and organic metal raw materials, and to use powders that are homogenized by the sol-gel method. This is preferable because a high-strength insulating layer with few pores can be obtained.

The particle diameter of the glass powder used in the above is selected in consideration of the shape of the pattern to be produced. The powder has a 50% by weight particle diameter (average particle diameter) of 2 to 3.5 μm and a top size of 15 μm or less. It is preferable that Further, it is preferable that the 10% by weight particle diameter is 0.6 to 1.5 μm, the 90% by weight particle diameter is 4 to 8 μm, and the specific surface area is 1.5 to ^2.5 m ² / g. More preferably, the average particle size is 2.5 to 3.5 μm and the specific surface area is 1.7 to 2.4 m ² / g. Within this range, light can be sufficiently transmitted at the time of ultraviolet exposure, and a barrier rib pattern having a small line width difference between the upper and lower sides can be obtained. An average particle size of 2.0 μm or less and a specific surface area of 2.5 m ² / g or less are preferable because the powder does not become too fine and light is scattered during exposure to prevent curing of the unexposed portion.

  It is also a preferred practical form to use fine particles of conductive powder such as Au, Ag, Pd, and Pt as the inorganic fine particles of the present invention. Au, Ag, Pd, and Pt can be used alone or as a mixed powder. For example, Ag (30-80) -Pd (70-20), Ag (40-70) -Pd (60-10) -Pt (5-20), Ag (30-80) -Pd (60-10) -Cr (5-15), Pt (20-40) -Au (60-40) -Pd (20), Au (75-80) -Pt (25-20), Au (60-80) -Pd ( 40-20), Ag (40-95) -Pt (60-5), Pt (60-90) -Rh (40-10) (above, () represents weight%), etc. A ternary mixed precious metal powder is used. Among these, those to which Cr or Rh is added are preferable in that high temperature characteristics can be improved.

  The average particle size of these conductive inorganic fine particles is preferably 0.5 to 5 μm. By setting the average particle diameter to 0.5 μm or more, light can be smoothly transmitted through the coated film during ultraviolet exposure, and a fine pattern having a good conductor line width of 60 μm or less can be formed. On the other hand, when the thickness is 5 μm or less, the unevenness of the surface of the circuit pattern after coating is not roughened, the pattern accuracy is improved, and noise generation can be suppressed.

There is a preferred range of conductive powder that satisfies the formation of a fine pattern and a reduction in resistance. That is, in order to obtain a fine circuit pattern of 10 to 40 μm after development by coating the conductor pattern and sufficiently transmitting ultraviolet light without being scattered during exposure and effectively working, the average particle diameter of the conductive powder is 1 It is preferable that the specific surface area is 0.1 to ⁵ m ² / g. More preferably, the average particle size is 0.8 to 4 μm and the specific surface area is 0.5 to 1.5 m ² / g. When it is within this range, there is no generation of a residual film of the conductor film in the unexposed area during development, and a highly accurate circuit pattern can be obtained.

The specific surface area of the noble metal conductive fine particles is preferably 0.1 to ³ m ² / g. By setting the specific surface area to 0.1 m ² / g or more, the accuracy of the circuit pattern can be improved. Moreover, by setting it as 3 m < ² > / g or less, scattering of an ultraviolet-ray can be prevented and a pattern precision can be improved.

  As the shape of the noble metal conductive fine particles, flakes (plates, cones, rods) or spherical shapes can be used, but spherical shapes are preferable because aggregation is suppressed. In the case of a spherical shape, since the scattering of ultraviolet rays at the time of exposure is small, a pattern with this accuracy can be obtained and the irradiation energy can be reduced.

  The photosensitive paste is usually prepared by blending various components such as an ultraviolet absorber, an antioxidant, inorganic fine particles, a photosensitive organic component, an organic dye, a dispersant, a light absorber, and a solvent so as to have a predetermined composition. It is mixed and dispersed homogeneously with a three-roller or kneader.

  The viscosity of the paste is appropriately adjusted depending on the addition ratio of inorganic fine particles, thickener, organic solvent, plasticizer and anti-settling agent, but the range is 2000 to 200,000 cps (centipoise). For example, when the application to the substrate is performed by a spin coating method, 2000 to 5000 cps is preferable. In order to obtain a film thickness of 10 to 20 μm by a single screen printing method, 50,000 to 200,000 cps is preferable. In the case of using a blade coater method or a die coater method, 10,000 to 50,000 cps is preferable.

The photosensitive paste of the present invention thus obtained can be used as a display member. In particular, when used as a member for a plasma display, a member for a plasma display can be obtained by applying a photosensitive paste on a substrate, forming a pattern through exposure and development, and further baking.
An example of performing pattern processing using a photosensitive paste will be described, but the present invention is not limited to this.

  A photosensitive paste is applied over the entire surface or a part of the substrate. As a coating method, methods such as a screen printing method, a bar coater, a roll coater, a die coater, and a blade coater can be used. The coating thickness can be adjusted by selecting the number of coatings, screen mesh, and paste viscosity.

  Here, when the paste is applied onto the substrate, surface treatment of the substrate can be performed in order to improve the adhesion between the substrate and the coating film. Examples of the surface treatment liquid include silane coupling agents such as vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, tris (2-methoxyethoxy) vinylsilane, γ-glycidoxypropyltrimethoxysilane, γ- (methacrylic). Roxypropyl) trimethoxysilane, γ- (2-aminoethyl) aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, or organic metals such as Organic titanium, organic aluminum, organic zirconium and the like. A silane coupling agent or organic metal diluted to a concentration of 0.1 to 5% with an organic solvent such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl alcohol, ethyl alcohol, propyl alcohol, or butyl alcohol Use. Next, this surface treatment liquid is uniformly applied onto the substrate with a spinner or the like, and then dried at 80 to 140 ° C. for 10 to 60 minutes, whereby the surface treatment can be performed.

  After coating, exposure is performed using an exposure apparatus. A proximity exposure machine or the like can be used as the exposure apparatus. Moreover, when performing exposure of a large area, after apply | coating the photosensitive paste on a board | substrate and exposing while conveying, a large area can be exposed with the exposure machine of a small exposure area.

  After the exposure, development is performed using the difference in solubility between the exposed portion and the unexposed portion in the developer. In this case, the immersion method, the spray method, and the brush method are used. It is preferable that the developer used for the development processing contains water as a main component. For the developer, an organic solvent in which the organic components in the photosensitive paste can be dissolved can be used. Further, water may be added to the organic solvent as long as its dissolving power is not lost. When a compound having an acidic group such as a carboxyl group is present in the photosensitive paste, it can be developed with an alkaline aqueous solution. As the alkaline aqueous solution, sodium hydroxide, sodium carbonate, calcium hydroxide aqueous solution or the like can be used. However, it is preferable to use an organic alkaline aqueous solution because an alkaline component can be easily removed during firing.

  As the organic alkali, a general amine compound can be used. Specific examples include tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine, and diethanolamine.

  The concentration of the alkaline aqueous solution is usually 0.05 to 5% by weight, more preferably 0.1 to 1% by weight. If the alkali concentration is too low, the soluble portion is not removed, and if the alkali concentration is too high, the pattern portion may be peeled off and the non-soluble portion may be corroded. The development temperature during development is preferably 20 to 50 ° C. in terms of process control.

Next, firing is performed in a firing furnace. The firing atmosphere and temperature vary depending on the type of paste and substrate, but firing is performed in an atmosphere of air, nitrogen, hydrogen, or the like. As the firing furnace, a batch-type firing furnace or a belt-type continuous firing furnace can be used.
Firing is usually performed at 400 to 1000 ° C. In the case of patterning on a glass substrate, it is preferable to carry out baking while holding at a temperature of 480 to 610 ° C. for 10 to 60 minutes.

Hereinafter, the present invention will be specifically described with reference to examples. However, the present invention is not limited to this. In addition, the density | concentration in an Example is weight% unless there is a notice.
The polymer solution, polymerization initiator, and crosslinking agent used as the organic component of the paste are as follows.

Polymer solution A: 40 of acrylic polymer (addition reaction of 0.4 equivalent of glycidyl methacrylate to the carboxyl group of styrene / methyl methacrylate / methacrylic acid copolymer. Weight average molecular weight 43,000, acid value 95) % Γ-butyrolactone solution Polymer solution B: Ethyl cellulose (number average molecular weight 80000) 5% terpineol solution Crosslinker A: Trimethylolpropane triacrylate crosslinker B: Tetrapropylene glycol dimethacrylate crosslinker C: Bis (2-hydroxy-3) -Methacryloxypropyl) isopropylamine crosslinker D: bis (hydroxymethyl) tricyclo [5.2.1.0 ^2,6 ] decanedimethacrylate crosslinker E: bis (hydroxymethyl) pentacyclo [6.5.1. 1 ^3,6 . 0 ^2,7 . 0 ^{9,1 3} ] pentadecane dimethacrylate urethane compound A: UA-3348PE (molecular weight 22000, EO content 15%)
Urethane compound B: UA-5348PE (molecular weight 39000, EO content 23%)
Polymerization initiator A: 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -1-butanone polymerization initiator B: benzoyl peroxide low melting point glass powder A: bismuth oxide 38%, silicon oxide 6% Boron oxide 20%, Zinc oxide 20%, Aluminum oxide 4%. Glass transition point 475 ° C., softening point 515 ° C., coefficient of thermal expansion 75 × 10 ⁻⁷ / ° C., density 4.61 g / cm ³ .
Low melting glass powder B: 7% lithium oxide, 23% silicon oxide, 32% boron oxide, 4% barium oxide, 20% aluminum oxide, 5% calcium oxide, 6% magnesium oxide, 3% zinc oxide. Glass transition point 495 ° C., softening point 530 ° C., thermal expansion coefficient 75 × 10 ⁻⁷ / ° C., density 2.54 g / cm ³ , average refractive index 1.586, average particle diameter 2.6 μm.

The electrode paste was composed of polymer solution A (20% by weight), cross-linking agent A (3% by weight), polymerization initiator A (1% by weight), urethane compound A (1% by weight) and dipropylene glycol monomethyl ether (5% by weight). ) Was dissolved while heating to 50 ° C., and then silver fine particles (average particle size 1.5 μm, specific surface area 0.80 m ² / g, 70% by weight) were added and kneaded using a kneader. .

  The dielectric paste dissolves polymer solution B (20% by weight), crosslinking agent A (10% by weight), polymerization initiator B (5% by weight) and urethane compound B (5% by weight) while heating to 50 ° C. , Inorganic components (low melting glass powder A (40% by weight), filler (silicon oxide: manufactured by Nippon Aerosil Co., Ltd., “Aerosil 200” 5% by weight), conductor powder (titanium oxide, 10 parts by weight), terpineol (5% by weight) %) Is kneaded with a three-roller kneader, and titanium oxide mixed as a conductive powder also serves as a filler component.

  The partition wall paste was composed of polymer solution A (30% by weight), various crosslinking agents described in Table 1 (4% by weight), polymerization initiator A (2% by weight), urethane compound A (3% by weight) and γ-BL ( 5% by weight) was dissolved while heating to 50 ° C., and low melting point glass powder B (45% by weight), filler (average refractive index 1.59, glass transition point 652 ° C., average particle diameter 2.4 μm, 10% by weight) %) Was stirred while heating and kneaded using a kneader.

(Display member manufacturing method)
A plasma display was produced by the following procedure. First, an address electrode pattern was formed on a “PD-200” glass substrate (42 inches) manufactured by Asahi Glass Co., Ltd. by a photolithography method using a photosensitive silver paste. Next, a dielectric layer having a thickness of 20 μm was formed on the glass substrate on which the address electrodes were formed by screen printing. Thereafter, the produced photosensitive paste was uniformly applied by screen printing onto a glass substrate for back plate on which the address electrode pattern and the dielectric layer were formed. In order to avoid the occurrence of pinholes in the coating film, coating and drying were repeated several times or more to adjust the film thickness. Intermediate drying was performed at 80 ° C. for 10 minutes. Then, it hold | maintained at 80 degreeC for 1 hour, and dried.

Subsequently, using a negative chrome mask, UV exposure was performed with an ultrahigh pressure mercury lamp having an output of 30 mJ / cm ² from the upper surface. The exposure amount was 1.5 mJ / cm ² .
Next, development is carried out by applying a 0.3 wt% aqueous solution of monoethanolamine maintained at 35 ° C. for 150 seconds in a shower, and then washing with water using a shower spray to remove the uncured space portion. A striped partition wall pattern was formed on the glass substrate for the back plate. Thereafter, by baking, a partition wall (top width 35 μm, bottom width 50 μm, height 120 μm, pitch 300 μm) was formed.

(Defect evaluation method)
This substrate was passed through an image defect inspection apparatus, and the number of disconnection defects of 50 μm or more was evaluated.

(Display manufacturing method)
A phosphor layer was formed to a thickness of 20 μm by a dispenser method, and baked to produce a back plate.
Next, an ITO electrode was formed on a “PD-200” glass substrate by a photoetching method, and then a bus electrode pattern was formed by a photolithography method using a photosensitive silver paste. Thereafter, a transparent dielectric layer was formed to a thickness of 30 μm by screen printing. Furthermore, a 500 nm-thick MgO film was formed by electron beam evaporation to obtain a front plate on which a plurality of electrodes for discharge were formed.

Next, a low-melting glass paste serving as a sealant is provided on the glass substrate for the front plate and the back plate, aligned to face each other in a predetermined arrangement, and processed at 450 ° C. for 30 minutes to seal the glass substrate. . Thereafter, the plasma display panel was completed by exhausting the inside of the display region and sealing with a mixed gas of Ne 95% and Xe 5%. After that, the panel was evaluated by lighting it in a black and white checkered pattern, applying a partition wall, lighting by peeling, and no lighting.
(Display characteristics)
The panel was turned on every other row along the partition formation direction, and visually evaluated for lighting, non-lighting, or flickering due to erroneous discharge. The standard is that the display characteristics are AA if the number of lit cells or non-lighted cells due to erroneous discharge is within one, the display characteristics are A if it is within 2-4, and the display characteristics are B, if it is within 5-7. It was unsuitable as a display panel with more than one, and was designated as C.

(Examples 1-4)
An aliphatic polycyclic compound having two ethylenically unsaturated groups (crosslinking agents D and E) out of 4% by weight of the crosslinking agent was prepared according to the composition shown in Table 1 to prepare a paste. Defect evaluation was performed after forming a partition pattern. The results are also shown in Table 1. In Examples 1 and 2 in which 2% by weight of both the crosslinking agents D and E were used, the number of disconnection defects was 0 to 1, and the effect of suppressing disconnection was most remarkable. When this partition pattern was used for evaluation as a display, it was the best. In the case of Examples 3 and 4 in which 1% by weight was used, there were 2 to 3 disconnection defects, and there was an effect of suppressing disconnection. The evaluation of the display was also good.

(Comparative Examples 1-5)
A paste was prepared using the crosslinking agent shown in Table 1, and the defect was evaluated. The results are also shown in Table 1. There were 7 to 15 disconnection defects, and there was no disconnection suppressing effect. A panel was prepared using this partition wall pattern and evaluated as a display.

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Claims (6)

A photosensitive paste containing an organic component and inorganic fine particles, wherein the organic component contains an aliphatic polycyclic compound having two or more ethylenically unsaturated groups. The photosensitive paste according to claim 1, wherein the aliphatic polycyclic compound is represented by the following general formula (1).

(Wherein R ₁ and R ₂ each independently represent a hydrogen atom or a methyl group, R ₃ and R ₄ each independently represent a single bond or an alkylene group, and x represents 1 or 2) And y represents 0 or 1.) The photosensitive paste according to claim 1, wherein the organic component further contains a urethane compound having an ethylenically unsaturated group. The photosensitive paste according to claim 1, wherein the organic component further contains an amine compound having an ethylenically unsaturated group. A display member using the photosensitive paste according to claim 1. A plasma display comprising the display member according to claim 5.