JP2005136363A - Horizontal holding mechanism, printed board circuit inspecting device or component-soldering device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a horizontal holding mechanism, a printed board circuit inspecting device or a component-soldering device using the same, capable of vertically moving a presser plate or a pressing plate or the like horizontally from a fixed position, by fitting a horizontal holding assemble holder for fixing a substrate presser plate to a base by a hinge. <P>SOLUTION: A pair of hinge fixed bases 2, a pair of supports 3 for horizontal holding arm, and a pair of plate presser arms 5 are provided on a base 1 for the mechanism, which is composed of a horizontal holding assembly holder fixed base 8 for fixing a horizontal holding assembly holder 7 fitted to the hinge fixed bases 2 via hinges 6 and a plate 9 formed by fixing to the tip of the horizontal holding assembly holder 7 via a horizontal holding spring adjusting tool 16. The plate 9 is a horizontal holding mechanism for vertically moving in the horizontal directions, while moving in a cut-out groove 11, formed in a horizontal holding arm 4 via slide pins 10 provided on the side surfaces. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention is a horizontal holding mechanism in which a plate plate or a plate plate with a presser bar can be moved in parallel from above and contacted with a uniform pressure with a uniform pressure. The present invention relates to an incorporated printed circuit board inspection apparatus or component soldering apparatus.

  In the conventional printed circuit board inspection device, when the substrate pressing plate to which the substrate pressing rod is attached is moved from above, first the substrate pressing rod close to the base portion fixed with a hinge or the like is brought into contact with the substrate sequentially, and finally It moves in a circular motion so that the substrate push rod located on the outermost side contacts.

  As described above, since the presser bar moves in a circular motion and sequentially comes into contact with the substrate, the pressing force of the substrate pressing plate is not uniform, and the force applied to the measurement pin (needle) provided on the back side of the substrate is not uniform. For this reason, there is a drawback that accurate measurement cannot be performed.

  Japanese Patent Application Laid-Open No. 1-169377 “Electronic component insertion failure inspection device” describes a pair of flexible prints having the same number of contact pins as the lead wires, the same number of electrodes as the contact pins, and the post for preventing pressure by the weight of the contact pins. An electronic component insertion defect inspection device is disclosed, comprising a substrate and a conductive element that exhibits a resistance change in response to pressure stimulation.

  Japanese Utility Model Publication No. Hei 6-28760 “Printed Circuit Board Inspection Device” describes that “the first jig to be inspected and the probe held by the probe holding plate can be moved up and down relative to the first jig. And a second printed circuit board inspection apparatus including a second jig having a second electrode having a second electrode having a gap between the front electrodes with respect to the rear electrode disposed in proximity to the conversion substrate. .

In addition, soldering to the back side of the circuit board requires holding the board with the circuit board in hand and pressing the back side, and soldering the soldering points one by one with one hand. Therefore, the unit price including labor cost was high.
JP-A-1-169377 Utility Kaihei 6-28760

  As described above, in the conventional inspection apparatus, since the substrate pressing plate moves in a circular motion, uniform pressing force is not generated, and in the case of an inspection apparatus that moves horizontally up and down, the apparatus itself is a large scale. Therefore, it was not possible to easily inspect the printed circuit board which is the substrate to be inspected.

  Further, it has been desired to develop a technique capable of performing a soldering process at a time while fixing a circuit board, instead of a method of processing while pressing the circuit board with one hand as in the conventional means for soldering to a circuit board.

  The present inventor has intensively studied to solve the problem, and when the horizontal holding assembly holder for fixing the substrate pressing plate is attached to the base with a hinge, the pressing plate, the pressing plate, etc. are moved vertically from a certain position horizontally. As a result, the horizontal holding mechanism of the present invention and the flint substrate circuit inspection apparatus using the same can be provided.

That is, in the first aspect of the present invention, a pair of hinge fixing base 2, a horizontal holding arm column 3 and a plate presser arm 5 are provided on the base 1,
A horizontal holding assembly holder fixing base 8 formed by fixing a horizontal holding assembly holder 7 attached to the hinge fixing base 2 via a hinge 6;
A mechanism comprising a plate plate 9 fixed to the tip of the horizontal holding assembly holder 7 via a horizontal holding spring holding adjustment tool 16;
The plate plate 9 is a horizontal holding mechanism that moves up and down horizontally while moving a cut groove 11 provided in the horizontal holding arm 4 via a slide pin 10 provided on a side surface.

In the second aspect of the present invention, a pair of hinge fixing bases 2, a horizontal holding arm column 3 and a plate presser arm 5 are provided on the base 1,
A horizontal holding assembly holder fixing base 8 formed by fixing a horizontal holding assembly holder 7 attached to the hinge fixing base 2 via a hinge 6;
It comprises a plate plate 9 fixed to the tip of the horizontal holding assembly holder 7 via a horizontal holding spring adjustment tool 16, and further, a set lever 12 attached to the horizontal holding arm 4 is pushed down to bring it to the side of the plate plate 9. Horizontally moving the cut groove 11 provided in the horizontal holding arm 4 through the provided slide pin 10;
When the lower stopper 15 provided at the bottom of the horizontal holding assembly holder 7 comes into contact with the base, the movement of the plate plate 9 stops, and when the set lever 12 is further depressed, the horizontal holding arm 4 is moved by the spring action of the horizontal holding assembly holder 7. The horizontal holding mechanism is fixed by a protruding portion of the plate presser arm 5 while being lowered.

  According to a third aspect of the present invention, the horizontal holding spring adjuster 16 is composed of a slide bearing, a shaft, a stop ring, and a screw through which the horizontal holding assembly holder 7 is inserted. It is a horizontal holding mechanism of description.

According to a fourth aspect of the present invention, a pair of hinge fixing base 2, a horizontal holding arm column 3, a plate presser arm 5, and a printed circuit board mounting base are provided on the base 1,
A horizontal holding assembly holder fixing base 8 formed by fixing a horizontal holding assembly holder 7 attached to the hinge fixing base 2 via a hinge 6;
A plate 9 with a presser bar fixed to the tip of the horizontal holding assembly holder 7;
By moving down the set lever 12 attached to the horizontal holding arm 4, the notch groove 11 provided in the horizontal holding arm 4 is moved horizontally via the slide pin 10 provided on the side surface of the plate plate 8,
When the lower stopper 15 provided at the bottom of the horizontal holding assembly holder 7 comes into contact with the base 1, the movement of the plate plate 9 stops. When the set bar 12 is further pushed down, the horizontal holding arm 4 is moved by the spring action of the horizontal holding assembly holder 7. While being lowered, it is fixed by the protrusion 25 of the plate presser arm 5,
A presser bar attached to a plate plate abuts against the substrate on the printed circuit board mounting base to uniformly press the substrate, and the circuit conductivity is measured by a measurement pin on the back of the substrate. This is a circuit board inspection apparatus.

According to a fifth aspect of the present invention, a pair of hinge fixing base 2, a horizontal holding arm column 3, a plate presser arm 5, and a printed board mounting base are provided on the base 1.
A horizontal holding assembly holder fixing base 8 formed by fixing a horizontal holding assembly holder 7 attached to the hinge fixing base 2 via a hinge 6;
A plate 9 with a presser bar fixed to the tip of the horizontal holding assembly holder 7;
By moving down the set lever 12 attached to the horizontal holding arm 4, the notch groove 11 provided in the horizontal holding arm 4 is moved horizontally via the slide pin 10 provided on the side surface of the plate plate 8,
When the lower stopper 15 provided at the bottom of the horizontal holding assembly holder 7 comes into contact with the base 1, the movement of the plate plate 9 stops. When the set bar 12 is further pushed down, the horizontal holding arm 4 is moved by the spring action of the horizontal holding assembly holder 7. While being lowered, it is fixed by the protrusion 25 of the plate presser arm 5,
The presser bar attached to the plate plate abuts against the circuit board 27 on the circuit board mounting base 26 and uniformly presses the circuit board,
The component soldering apparatus is characterized by having a pedestal 28 capable of raising and fixing the base 1 upward by 90 ° or more while maintaining the pressed state.

BEST MODE FOR CARRYING OUT THE INVENTION

  Details of the apparatus of the present invention will be described in detail with reference to the drawings, but the scope of the present invention is not limited thereto.

  FIG. 1 is a perspective view showing a horizontal holding mechanism of the present invention. In the horizontal holding mechanism of the present invention, a pair of hinge fixing bases 2, 2 ′, horizontal holding arm columns 3, 3 ′ and plate presser arms 5, 5 ′ are located in parallel on a base 1. .

  The horizontal holding assembly holder fixing base 8 fixed with screws by the pair of hinge fixing bases 2 and 2 'and the hinges 6 and 6' has two horizontal holding assembly holders 7 screw-fixed in a T-shape. A horizontal holding spring adjustment tool 16 is inserted and fixed to the two horizontal holding assembly holders 7, and the tip of the horizontal holding spring adjustment tool 16 is on the end side of the plate plate 9. In order to pass through the hole provided in the screw hole and be screw-fixed, the left and right horizontal holding assembly holders 7 and the plate plate 9 are connected via a horizontal holding spring adjustment tool 16.

  Further, the plate plate 9 includes a plate holding plate 14, a horizontal holding arm 4, and a set lever 12 each having a slide pin 10 provided on a side surface of the plate plate rotatably attached to a pair of horizontal holding arm columns 3. Since the inside of the cut groove 11 of the lever body 18 fixed and integrated is movably fixed, as a result, it moves back and forth by the movement of the horizontal holding assembly holder plate 8 and the lever body 18.

  FIG. 2 is a perspective view showing a state where the plate of the horizontal holding mechanism of the present invention is moved to the horizontal position. In this case, when the set lever 12 is pulled forward, the slide pin of the plate plate 9 moves to the front while being locked in the upper part of the cut groove of the lever body. The horizontal holding assembly holder plate 8 rises to the front side through the horizontal holding spring adjustment tool 16 and the horizontal holding assembly holder 7 and the plate plate 9 is horizontal with respect to the base when the hinge 6 becomes a right angle. Is in position.

  In this case, since the left and right lower stoppers 15 attached downward to the horizontal holding assembly holder 7 are fixed in contact with the base surface, the horizontal holding assembly holder plate 8 may be further tilted forward. Absent.

  When the set lever 12 is further pushed down, the slide pin 10 of the plate plate 9 moves to the opposite side in the cut groove 11 of the lever body as shown in FIG. 3, so that the plate plate 9 is lowered horizontally. However, when the tips of the pair of upper stoppers 13 separately attached to the plate plate 9 come into contact with the horizontal holding assembly holder 7, the horizontal movement is stopped.

  Further, when the lever body 18 is slightly pushed down to engage with the plate presser arm 5, the lower end portion of the horizontal holding spring adjustment tool 19 comes into contact with the stopper receiver 17 provided in a base shape. Therefore, the side end portion of the lever body 18 can be locked to a cut portion (not shown) of the plate presser 5.

  In the horizontal holding mechanism of the present invention, the horizontal holding spring adjuster 16 attached to the horizontal holding assembly holder 7 is inserted with a shaft through a hole formed in the holder, and provided with a stop ring at the bottom of the holder 7 body. A slide bearing is fitted to the outer surface of the shaft on the upper side of the main body, and the shaft tip is inserted into a hole provided at the end of the plate plate 9 and screwed to fix the horizontal holding assembly holder 7 and the plate plate. 9 is connected.

  FIG. 4 is a perspective view showing a printed circuit board inspection apparatus to which the mechanism of the present invention is applied. The printed circuit board inspection apparatus of the present invention is provided with a substrate holding installation table 21 opposite to the mechanism shown in FIG. 1 to FIG. Install in.

  A measuring pin (not shown) is installed under the substrate 20 to be inspected, and is connected to a measuring meter (not shown) provided outside the apparatus by a cord 24.

  When the set lever 12 of the lever body 18 is moved to the front after the substrate 20 to be inspected is placed on the substrate holding / mounting base 21, the slide pin (not shown) of the plate plate 19 with a presser bar as in the first embodiment. Is moved to the front while being locked by the upper part of the notch groove (not shown) of the lever body 18, the plate plate 19 with presser bar is also moved forward, and the horizontal holding spring adjustment tool 16, When the horizontal holding assembly holder plate 8 rises to the near side through the horizontal holding assembly holder 7 and the hinge 6 becomes a right angle, the plate plate 19 with a presser bar is opposed to the substrate 20 to be inspected in a horizontal position.

  Further, when the set lever 12 of the lever body 18 is moved to the front, the plate plate 19 with a presser bar is lowered horizontally and comes into contact with the substrate 20 to be inspected and conducts while pressing the substrate 20 to be inspected with a uniform pressing force. And measure.

  FIG. 6 is a perspective view showing a component soldering apparatus to which the mechanism of the present invention is applied. In the component soldering apparatus of the present invention, in addition to the mechanism shown in FIGS. 1 to 3, a circuit board mounting table 26 is provided on the front side of the base 1, and a printed circuit board which is a circuit board 27 is connected to the circuit board mounting table. 26.

  The base 1 and the circuit board mounting base 26 are provided so that the edge of the circuit board 27 is placed in an opening 30 opened at an arbitrary position of the base 2 where they can rise upward simultaneously. It has been.

  When the set lever 12 of the lever body 18 is moved forward after the circuit board 27 is installed on the circuit board mounting table 26, the slide pin (not shown) of the plate plate 19 with the presser bar is moved as in the first embodiment. Is moved to the front while being locked by the upper part of the notch groove (not shown) of the lever body 18, the plate plate 19 with presser bar is also moved forward, and the horizontal holding spring adjustment tool 16, The horizontal holding assembly holder plate 8 rises to the near side through the horizontal holding assembly holder 7 and the plate plate 19 with a presser bar is opposed to the circuit board 27 at a horizontal position when the hinge 6 becomes a right angle.

  Further, when the set lever 12 of the lever body 18 is moved forward, the plate plate 19 with a presser bar comes down horizontally and contacts the circuit board 27 to press the surface of the circuit board 27 with a uniform pressing force.

  Next, when the circuit board 26 is pressed from the surface and fixed, the base 1 and the circuit board installation base 26 are raised from the front to the top, and the position is stopped at 90 ° or more, preferably around 120 ° from the pedestal 28. The back side of the circuit board is easily visible to the operator.

  The operator does not have to hold the circuit board with one hand as in the past, and since the solder can be joined to the soldered parts sequentially with both hands or with one free hand, the amount of work per unit time is It was much faster than the joining method.

  The horizontal holding mechanism of the present invention is used in a printed circuit board inspection apparatus and a component soldering apparatus as an example, but can be applied to an apparatus that requires a uniform pressing force, and has a simple structure, so that the cost is low. It can be used for cheap equipment.

It is a perspective view which shows the horizontal holding mechanism of this invention. It is a perspective view which shows the state which moved the plate of the horizontal holding mechanism of this invention to the horizontal position. It is a perspective view which shows the state which latched the horizontal holding arm of the horizontal holding mechanism of this invention to the plate presser arm. It is a perspective view which shows the printed circuit board inspection apparatus to which this invention mechanism is applied. It is a face figure which shows the conventional print inspection apparatus. It is a perspective view which shows the component soldering apparatus to which this invention mechanism is applied.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Base 2 ... Hinge fixing stand 3 ... Horizontal support arm support 4 ... Horizontal holding arm 5 ... Plate presser arm 6 ... Hinge 7 ... Horizontal holding assembly holder 8 ... Horizontal holding assembly holder fixing plate 9 ... Plate plate 10 · Slide pin 11 · Infeed groove 12 · Set lever 13 · Upper stopper 14 · Plate retainer plate 15 · Lower stopper 16 ··· Horizontal holding spring adjusting tool 17 .. Lower stopper receiver 18.. Lever body 19.. Plate plate 20 with presser bar... Printed substrate 21.. Substrate mounting base 22. Code 25 .. Plate presser arm ridge protrusion 26 .. Circuit board mounting base 27 .. Circuit board 28.. Base 29.. Hinge 30.

Claims (5)

A pair of hinge fixing bases 2, horizontal holding arm columns 3 and plate presser arms 5 are provided on the base 1.
A horizontal holding assembly holder fixing base 8 formed by fixing a horizontal holding assembly holder 7 attached to the hinge fixing base 2 via a hinge 6;
A mechanism comprising a plate plate 9 fixed to the tip of the horizontal holding assembly holder 7 via a horizontal holding spring adjustment tool 16;
The plate plate 9 further moves up and down horizontally while moving a cut groove 11 provided in the horizontal holding arm 4 via a slide pin 10 provided on a side surface. A pair of hinge fixing bases 2, horizontal holding arm columns 3 and plate presser arms 5 are provided on the base 1.
A horizontal holding assembly holder fixing base 8 formed by fixing a horizontal holding assembly holder 7 attached to the hinge fixing base 2 via a hinge 6;
It comprises a plate plate 9 fixed to the tip of the horizontal holding assembly holder 7 via a horizontal holding spring adjustment tool 16, and further, a set lever 12 attached to the horizontal holding arm 4 is pushed down to bring it to the side of the plate plate 9. Horizontally moving the cut groove 11 provided in the horizontal holding arm 4 through the provided slide pin 10;
When the lower stopper 15 provided at the bottom of the horizontal holding assembly holder 7 comes into contact with the base, the movement of the plate plate 9 stops. When the set bar 12 is further pushed down, the horizontal holding arm 4 is moved by the spring action of the horizontal holding assembly holder 7. A horizontal holding mechanism that is fixed by a protruding portion of the plate presser arm 5 while being lowered. The horizontal holding mechanism according to claim 1 or 2, wherein the horizontal holding spring adjustment tool (16) comprises a slide bearing, a shaft, a stop ring, and a screw through which the horizontal holding assembly holder (7) is inserted. A pair of hinge fixing base 2, horizontal holding arm column 3, plate presser arm 5, and printed circuit board installation base are provided on base 1.
A horizontal holding assembly holder fixing base 8 formed by fixing a horizontal holding assembly holder 7 attached to the hinge fixing base 2 via a hinge 6;
A plate 9 with a presser bar fixed to the tip of the horizontal holding assembly holder 7;
By moving down the set lever 12 attached to the horizontal holding arm 4, the notch groove 11 provided in the horizontal holding arm 4 is moved horizontally via the slide pin 10 provided on the side surface of the plate plate 8,
When the lower stopper 15 provided at the bottom of the horizontal holding assembly holder 7 comes into contact with the base 1, the movement of the plate plate 9 stops. When the set bar 12 is further pushed down, the horizontal holding arm 4 is moved by the spring action of the horizontal holding assembly holder 7. While being lowered, it is fixed by the protrusion 25 of the plate presser arm 5,
A presser bar attached to a plate plate abuts against the substrate on the printed circuit board mounting base to uniformly press the substrate, and the circuit conductivity is measured by a measurement pin on the back of the substrate. Board circuit inspection equipment. A pair of hinge fixing base 2, horizontal holding arm column 3, plate presser arm 5, and printed circuit board installation base are provided on base 1.
A horizontal holding assembly holder fixing base 8 formed by fixing a horizontal holding assembly holder 7 attached to the hinge fixing base 2 via a hinge 6;
A plate 9 with a presser bar fixed to the tip of the horizontal holding assembly holder 7;
By moving down the set lever 12 attached to the horizontal holding arm 4, the notch groove 11 provided in the horizontal holding arm 4 is moved horizontally via the slide pin 10 provided on the side surface of the plate plate 8,
When the lower stopper 15 provided at the bottom of the horizontal holding assembly holder 7 comes into contact with the base 1, the movement of the plate plate 9 stops. When the set bar 12 is further pushed down, the horizontal holding arm 4 is moved by the spring action of the horizontal holding assembly holder 7. While being lowered, it is fixed by the protrusion 25 of the plate presser arm 5,
The presser bar attached to the plate plate abuts against the circuit board 27 on the circuit board mounting base 26 and uniformly presses the circuit board,
A component soldering apparatus comprising a pedestal 28 capable of raising and fixing the base 1 upward by 90 ° or more while maintaining a pressed state.

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