JP2005135931A5 - - Google Patents
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- JP2005135931A5 JP2005135931A5 JP2003366806A JP2003366806A JP2005135931A5 JP 2005135931 A5 JP2005135931 A5 JP 2005135931A5 JP 2003366806 A JP2003366806 A JP 2003366806A JP 2003366806 A JP2003366806 A JP 2003366806A JP 2005135931 A5 JP2005135931 A5 JP 2005135931A5
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003366806A JP4221271B2 (en) | 2003-10-28 | 2003-10-28 | Tape applicator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003366806A JP4221271B2 (en) | 2003-10-28 | 2003-10-28 | Tape applicator |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005135931A JP2005135931A (en) | 2005-05-26 |
JP2005135931A5 true JP2005135931A5 (en) | 2008-04-10 |
JP4221271B2 JP4221271B2 (en) | 2009-02-12 |
Family
ID=34644990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003366806A Expired - Lifetime JP4221271B2 (en) | 2003-10-28 | 2003-10-28 | Tape applicator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4221271B2 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4841355B2 (en) * | 2006-08-08 | 2011-12-21 | 日東電工株式会社 | Method for holding semiconductor wafer |
JP5151104B2 (en) * | 2006-09-22 | 2013-02-27 | パナソニック株式会社 | Manufacturing method of electronic parts |
JP2008153597A (en) * | 2006-12-20 | 2008-07-03 | Hitachi Setsubi Eng Co Ltd | Dicing-tape sticking method and device for semiconductor wafer |
JP2009071145A (en) * | 2007-09-14 | 2009-04-02 | Hitachi Setsubi Eng Co Ltd | Method and device for sticking dicing tape on plate type member such as semiconductor wafer |
JP4840333B2 (en) * | 2007-11-12 | 2011-12-21 | 株式会社デンソー | Tape sticking device and tape sticking method |
JP4773419B2 (en) * | 2007-12-20 | 2011-09-14 | リンテック株式会社 | Sheet sticking device and sticking method |
KR101006216B1 (en) * | 2008-04-10 | 2011-01-07 | 히다치 세츠비 엔지니어링 가부시키가이샤 | Semiconductor wafer dicing tape attaching method and apparatus |
JP4812131B2 (en) * | 2008-04-18 | 2011-11-09 | Necエンジニアリング株式会社 | Substrate bonding equipment |
JP4814284B2 (en) * | 2008-06-12 | 2011-11-16 | 三菱電機株式会社 | Tape applicator |
JP2010016147A (en) * | 2008-07-03 | 2010-01-21 | Disco Abrasive Syst Ltd | Adhesive tape attaching method |
JP5287273B2 (en) * | 2009-01-13 | 2013-09-11 | 株式会社東京精密 | Wafer mounting method and wafer mounting apparatus |
JP5201511B2 (en) * | 2009-01-19 | 2013-06-05 | 株式会社タカトリ | Wafer holding table |
JP5607965B2 (en) * | 2010-03-23 | 2014-10-15 | 日東電工株式会社 | Semiconductor wafer mounting method and semiconductor wafer mounting apparatus |
JP5957330B2 (en) * | 2012-08-01 | 2016-07-27 | 株式会社ディスコ | Wafer sticking device |
JP7132198B2 (en) * | 2019-09-27 | 2022-09-06 | 芝浦メカトロニクス株式会社 | Deposition equipment and embedding processing equipment |
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2003
- 2003-10-28 JP JP2003366806A patent/JP4221271B2/en not_active Expired - Lifetime