JP2005129838A - Circuit board, electronic module, method of manufacturing circuit board, and method of manufacturing electronic module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable electronic parts to be mounted on both the surfaces of a board without making a manufacturing process complicated. <P>SOLUTION: After wiring layers 2a to 2d are formed on the one surface of a flexible board 1, through-holes 3a and 3b are bored in the board 1 penetrating through the wiring layers 2a and 2d, electronic parts 4a to 4c are mounted on the flexible board 1, the flexible board 1 is folded up so as to enable the through-holes 3a and 3b to overlap with each other, and the through-holes 3a and 3b are filled up with a conductor 6. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a circuit board, an electronic module, a method for manufacturing a circuit board, and a method for manufacturing an electronic module, and is particularly suitable for application to a method for manufacturing a double-sided board.

In the conventional method for manufacturing a double-sided substrate, after forming a through hole in a base material, a Cu film is formed on both sides of the base material. Then, by etching the Cu film on each side, a wiring pattern is formed on both sides of the base material, a solder resist film is formed, and then a plating layer is formed on the side wall of the through hole. .
Patent Document 1 discloses that an end portion of an electromagnetic shield layer provided with a conductor layer is bent, the electromagnetic shield layer is attached to a single-sided flexible printed circuit board through an adhesive layer, and a through hole formed in the electromagnetic shield layer. A method of connecting a conductor layer of an electromagnetic shield layer and a conductor layer of a single-sided flexible printed circuit board via a connector is disclosed.
Japanese Patent Laid-Open No. 7-111371

However, in the conventional method for manufacturing a double-sided substrate, a plating layer is formed on the side wall of the through hole in order to electrically connect the wiring pattern formed on the surface of the base material and the wiring pattern formed on the back surface of the base material. There is a problem that the manufacturing process becomes complicated.
In addition, in the conventional method for manufacturing a double-sided board, it is necessary to etch the Cu film on each side in order to form the wiring patterns on the surface of the base material and the back surface of the base material. There was a problem that it was easy.

In addition, in the conventional double-sided board, in order to mount the components on both sides of the base material, it is necessary to invert the base material after mounting the components on one side of the base material, so that the work efficiency deteriorates. there were.
In addition, the method disclosed in Patent Document 1 has a problem in that it cannot be mounted on both sides because an electromagnetic shield layer is attached to a single-sided flexible printed board.

  Therefore, an object of the present invention is to provide a circuit board, an electronic module, a circuit board manufacturing method, and an electronic module manufacturing method that can be mounted on both sides while suppressing the complexity of the manufacturing process.

  In order to solve the above-described problem, according to a circuit board according to an aspect of the present invention, at least a first region and a second region are provided, and the first region and the second region are arranged so as to be inverted from each other. A flexible substrate bent in such a manner, a first wiring pattern formed in a first region of the flexible substrate, a second wiring pattern formed in a second region of the flexible substrate, and a first of the flexible substrate A first through hole formed in the first wiring pattern through a region, and a second through hole formed in the second wiring pattern through the second region of the flexible substrate. And a conductor embedded in the first through hole and the second through hole and connecting the first wiring pattern and the second wiring pattern. That.

Thereby, a double-sided board can be created by forming a wiring pattern only on one side of the flexible board. For this reason, it is not necessary to perform the etching process of the wiring pattern on both surfaces of the flexible substrate, and it becomes possible to reduce the damage to the wiring pattern and improve the working efficiency.
In addition, according to the circuit board of one embodiment of the present invention, at least the first region and the second region are provided, and the flexible region is bent so that the first region and the second region are arranged so as to be reversed with respect to each other. A first wiring pattern formed in a first region of the flexible substrate; a second wiring pattern formed in a second region of the flexible substrate; and the first wiring pattern penetrating through the first region of the flexible substrate. Through a first opening exposing the back surface of one wiring pattern, a first conductor embedded in the first opening so as to contact the back surface of the first wiring pattern, and a second region of the flexible substrate The second opening exposing the back surface of the second wiring pattern is disposed so as to overlap the first conductor, and the second wiring pattern is in contact with the back surface of the second wiring pattern. Characterized in that it comprises a second conductor buried in the opening portion.

  Accordingly, it is possible to form a double-sided substrate by forming a wiring pattern only on one side of the flexible substrate, and the first wiring pattern by embedding a conductor in the first opening and the second opening. And the second wiring pattern can be connected in the vertical direction. For this reason, it is not necessary to etch the wiring pattern on both surfaces of the flexible substrate, it is possible to reduce the damage to the wiring pattern, and the first wiring pattern and the second wiring pattern respectively disposed on both surfaces. Therefore, it is not necessary to form a plating layer on the side wall of the flexible substrate, and work efficiency can be improved.

  Moreover, according to the electronic module which concerns on 1 aspect of this invention, the 1st area | region and the 2nd area | region were provided at least, and it was bent so that the said 1st area | region and the said 2nd area | region might be mutually reversed and arrange | positioned A substrate; a first wiring pattern formed in a first region of the flexible substrate; a second wiring pattern formed in a second region of the flexible substrate; and a first mounted on the first region of the flexible substrate. An electronic component, a second electronic component mounted in a second region of the flexible substrate, a first through hole formed in the first wiring pattern through the first region of the flexible substrate, and the first through hole A second through hole which is arranged to overlap and is formed in the second wiring pattern through the second region of the flexible substrate, the first through hole and the second through hole Embedded in, characterized in that it comprises a conductor for connecting the first wiring pattern and the second wiring pattern.

  Accordingly, it is possible to form a double-sided substrate by forming a wiring pattern only on one side of the flexible substrate, and it is possible to mount electronic components on both sides by mounting only on one side of the flexible substrate. For this reason, it is not necessary to etch the wiring pattern on both sides of the flexible substrate, it is possible to reduce the damage to the wiring pattern, and it is necessary to invert the flexible substrate when mounting electronic parts on both sides It becomes possible to improve work efficiency.

  Moreover, according to the electronic module which concerns on 1 aspect of this invention, the 1st area | region and the 2nd area | region were provided at least, and it was bent so that the said 1st area | region and the said 2nd area | region might be mutually reversed and arrange | positioned A substrate; a first wiring pattern formed in a first region of the flexible substrate; a second wiring pattern formed in a second region of the flexible substrate; and a first mounted on the first region of the flexible substrate. An electronic component, a second electronic component mounted in a second region of the flexible substrate, a first opening that penetrates the first region of the flexible substrate and exposes a back surface of the first wiring pattern, and the first A first conductor embedded in the first opening so as to be in contact with a back surface of the one wiring pattern, and the second wiring pattern through a second region of the flexible substrate; A second opening exposing the back surface, and a second conductor disposed so as to overlap the first conductor and embedded in the second opening so as to be in contact with the back surface of the second wiring pattern. It is characterized by providing.

  Thereby, by forming a wiring pattern only on one side of the flexible substrate, it is possible to mount electronic parts on both sides, and by embedding a conductor in the first opening and the second opening, the first wiring It becomes possible to connect the pattern and the second wiring pattern in the vertical direction. For this reason, it is not necessary to invert the flexible base material when mounting electronic components on both sides, and it is possible to improve the work efficiency, and the first wiring pattern and the second wiring pattern respectively arranged on both sides. In order to connect, it becomes unnecessary to form a plating layer on the side wall of the flexible substrate, and it becomes possible to suppress complication of the manufacturing process.

  In addition, according to the method for manufacturing a circuit board according to one aspect of the present invention, the step of forming the first wiring pattern and the second wiring pattern in the first region and the second region of the flexible substrate, respectively, Forming a first through hole penetrating the first wiring pattern through one region, forming a second through hole penetrating the second wiring pattern through the second region of the flexible substrate, and the first The step of bending the flexible substrate so that the through hole and the second through hole overlap, and the conductor connecting the first wiring pattern and the second wiring pattern are the first through hole and the second through hole. And a step of embedding in the hole.

This eliminates the need to etch the wiring pattern on both sides of the flexible substrate in order to create a double-sided substrate, which can reduce damage to the wiring pattern and improve work efficiency. It becomes possible.
In addition, according to the method for manufacturing a circuit board according to one aspect of the present invention, the step of forming the first wiring pattern and the second wiring pattern in the first region and the second region of the flexible substrate, respectively, Forming a first opening through the first region to expose the back surface of the first wiring pattern; and a second opening through the second region of the flexible substrate to expose the back surface of the second wiring pattern. Forming a portion, embedding the first conductor in the first opening so as to be in contact with the back surface of the first wiring pattern, and contacting the first wiring pattern in contact with the back surface of the second wiring pattern. The first conductor and the second conductor overlap each other in the step of embedding the second conductor in the two openings and the flexible substrate in which the first conductor and the second conductor are embedded. Characterized in that it comprises the step of folding the.

  This eliminates the need for etching the wiring pattern on both sides of the flexible substrate to create the double-sided substrate, thereby making it possible to reduce the damage to the wiring pattern and to dispose the first pattern disposed on each side. In order to connect the 1 wiring pattern and the 2nd wiring pattern, it becomes unnecessary to form a plating layer in the side wall of a flexible substrate, and it becomes possible to improve work efficiency.

  In addition, according to the method for manufacturing an electronic module according to an aspect of the present invention, the steps of forming the first wiring pattern and the second wiring pattern in the first region and the second region of the flexible substrate, respectively, Forming a first through hole penetrating the first wiring pattern through one region, forming a second through hole penetrating the second wiring pattern through the second region of the flexible substrate, and the flexible substrate Mounting the first electronic component on the first region, mounting the second electronic component on the second region of the flexible substrate, and the flexible substrate on which the first electronic component and the first electronic component are mounted. And bending the first through hole and the second through hole so as to overlap each other, and connecting the first wiring pattern and the second wiring pattern Conductors, characterized in that it comprises a step of embedding in the first through-hole and the second through hole.

As a result, it is possible to create a double-sided board by forming a wiring pattern only on one side of the flexible board, it is possible to reduce damage to the wiring pattern, and to be mounted only on one side of the flexible board. Thus, electronic components can be mounted on both sides, and work efficiency can be improved.
In addition, according to the method for manufacturing an electronic module according to an aspect of the present invention, the steps of forming the first wiring pattern and the second wiring pattern in the first region and the second region of the flexible substrate, respectively, Forming a first opening through the first region to expose the back surface of the first wiring pattern; and a second opening through the second region of the flexible substrate to expose the back surface of the second wiring pattern. Forming a portion, embedding the first conductor in the first opening so as to be in contact with the back surface of the first wiring pattern, and contacting the first wiring pattern in contact with the back surface of the second wiring pattern. A step of embedding a second conductor in the two openings, a step of mounting a first electronic component in the first region of the flexible substrate, and a second electronic unit in the second region of the flexible substrate. Mounting the first conductor and the second conductor, and mounting the first electronic component and the second electronic component on the flexible board, the first conductor and the second conductor. And a step of bending so as to overlap with the conductor.

  Thereby, by forming the wiring pattern only on one side of the flexible substrate, it is possible to mount both sides of the electronic component, and without forming the plating layer on the side wall of the flexible substrate, the first wiring pattern and the second wiring pattern are formed. The wiring pattern can be connected in the vertical direction, and the manufacturing process can be prevented from becoming complicated.

Hereinafter, an electronic module and a manufacturing method thereof according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a cross-sectional view illustrating a method for manufacturing an electronic module according to a first embodiment of the present invention.
In FIG. 1A, a conductive layer is formed on one side of the flexible substrate 1. Then, the wiring layers 2 a to 2 d are formed on one side of the flexible substrate 1 by patterning the conductive layer. As the flexible substrate 1, for example, a tape substrate or a film substrate can be used, and as the material of the flexible substrate 1, for example, polyimide resin or PET (polyethylene terephthalate) can be used. Further, as the conductive layer, for example, a metal foil such as Cu foil or Al foil can be used. As a method for forming the conductive layer on one surface of the flexible substrate 1, for example, a metal foil such as Cu is used as the flexible substrate 1. It is possible to use a method of attaching to the substrate.

Next, as shown in FIG. 1B, through-holes 3a and 3b penetrating the wiring layers 2a and 2d through the flexible substrate 1 are formed by using a method such as press working, laser processing, or photo etching, for example. Form.
Next, as shown in FIG. 1C, the electronic components 4 a to 4 c are mounted on the flexible substrate 1. Here, for example, projecting electrodes 5a to 5c can be formed on the electronic components 4a to 4c, respectively, and the projecting electrodes 5a to 5c are joined to the wiring layers 2a to 2d, so that the electronic components 4a to 4c are flexible. It can be mounted on the substrate 1.

  Examples of the electronic components 4a to 4c include a semiconductor chip, a resistor, a capacitor, a coil, and a connector. In addition to the electronic components 4a to 4c, for example, ceramic elements such as surface acoustic wave (SAW) elements, optical elements such as optical modulators and optical switches, and various sensors such as magnetic sensors and biosensors are mounted. It may be. Further, as the protruding electrodes 5a to 5c, for example, Ni bumps, Au bumps, Cu bumps covered with a solder material, or solder balls can be used.

  When the electronic components 4a to 4c are flip-chip mounted on the flexible substrate 1, an ACF (Anisotropic Conductive Film) junction, an NCF (Nonductive Conductive Film) junction, an ACP (Anisotropic Conductive Paste) junction, an NCP (Nunciton junction joint), an NCP (Nunciton junction joint), and an NCP (Nuncuton junction joint), NCP (Nunciton joint paste), Pressure welding may be used, or metal bonding such as solder bonding or alloy bonding may be used. Moreover, you may resin-seal the electronic components 4a-4c, such as a semiconductor chip mounted on the flexible substrate 1, as needed.

Next, as shown in FIG. 1D, a part of the flexible substrate 1 is inverted by bending the flexible substrate 1 on which the electronic components 4a to 4c are mounted. And the back surfaces of the flexible substrate 1 are bonded together so that the through holes 3a and 3b overlap each other.
Next, as shown in FIG. 1E, the wiring layers 2a and 2d are connected to each other by embedding a conductor 6 in the through holes 3a and 3b. As the conductor 6, for example, a conductive paste or a conductive pin can be used. Moreover, as a material of the conductor 16, for example, Cu, Ni, Au, a solder material, or the like can be used.

  Thereby, by forming the wiring layers 2a to 2d on only one side of the flexible substrate 1, it becomes possible to create a double-sided substrate and to mount the electronic components 4a to 4c on only one side of the flexible substrate 1. The electronic components 4a to 4c can be mounted on both sides. For this reason, it is not necessary to perform the etching process of the wiring layers 2a to 2d on both surfaces of the flexible substrate 1, it is possible to reduce the damage to the wiring layers 2a to 2d, and the electronic components 4a to 4c are mounted on both surfaces. When it does, it becomes unnecessary to reverse the flexible base material 1, and it becomes possible to improve work efficiency.

Further, by embedding the conductor 6 in the through holes 3a and 3b, the wiring layers 2a and 2d can be connected to each other without forming a plating layer on the side wall of the flexible substrate 1, and the manufacturing process becomes complicated. Can be suppressed.
Further, by bending the flexible substrate 1, the wiring layer 2c can be disposed on both sides via the bent portion, the number of the through holes 3a and 3b can be reduced, and the manufacturing process can be simplified. It becomes possible.

FIG. 2 is a cross-sectional view illustrating a method for manufacturing an electronic module according to a second embodiment of the present invention.
In FIG. 2A, a conductive layer is formed on one side of the flexible substrate 11. Then, the wiring layers 12 a to 12 d are formed on one surface of the flexible substrate 11 by patterning the conductive layer.
Then, for example, by using a method such as laser processing or photoetching, the openings 13a and 13d that penetrate the flexible substrate 11 and expose the back surfaces of the wiring layers 12a and 12d are formed.

  Note that the openings 13 a and 13 d may be formed in the flexible substrate 11 before the wiring layers 12 a to 12 d are formed on one surface of the flexible substrate 11 by punching the flexible substrate 11 or the like. Then, the wiring layers 12a to 12d may be formed by bonding a metal foil such as Cu to the flexible substrate 11 in which the openings 13a and 13d are formed and patterning the metal foil.

  Next, as shown in FIG. 2B, the conductors 16a and 16d are filled in the openings 13a and 13d so as to be in contact with the wiring layers 12a and 12d, respectively. When the conductors 16a and 16d are filled in the openings 13a and 13d, respectively, the surfaces of the conductors 16a and 16d may coincide with the back surface of the flexible substrate 11, and the conductors 16a and 16d are flexible substrates. 11 may be raised on the back surface. Moreover, as a material of the conductors 16a and 16d, for example, Cu, Ni, Au, a solder material, or the like can be used.

  In addition, as a method of filling the conductors 16a and 16d in the openings 13a and 13d, for example, a conductive paste may be applied to the openings 13a and 13d, respectively, or a conductive material is formed by an inkjet method. You may make it discharge in the opening parts 13a and 13d, respectively. Alternatively, the conductors 16a and 16d may be filled in the openings 13a and 13d, respectively, by performing electrolytic plating using the wiring layers 12a and 12d as plating leads.

  Next, as shown in FIG. 2C, the electronic components 14 a to 14 c are mounted on the flexible substrate 11. Here, for example, projecting electrodes 15a to 15c can be formed on the electronic components 14a to 14c, respectively, and the projecting electrodes 15a to 15c are joined to the wiring layers 12a to 12d, whereby the electronic components 14a to 14c are flexible. It can be mounted on the substrate 11.

  Next, as shown in FIG. 2D, a part of the flexible substrate 11 is inverted by bending the flexible substrate 11 on which the electronic components 14a to 14c are mounted. Then, the conductors 16a and 16d overlap each other so that the back surfaces of the flexible substrate 11 are bonded to each other, and the conductors 16a and 16d are joined to each other to connect the wiring layers 12a and 12d in the vertical direction.

  Thereby, by forming the wiring layers 12 a to 12 d only on one side of the flexible substrate 11, it becomes possible to create a double-sided substrate and to mount the electronic components 14 a to 14 c on only one side of the flexible substrate 11. The electronic components 14a to 14c can be mounted on both sides. For this reason, it is not necessary to perform the etching process of the wiring layers 12a to 12d on both surfaces of the flexible substrate 11, it becomes possible to reduce the damage to the wiring layers 12a to 12d, and the electronic components 14a to 14c are mounted on both surfaces. In doing so, it is not necessary to reverse the flexible substrate 11, and the working efficiency can be improved.

Further, by embedding the conductors 16a and 16d in the openings 13a and 13d, the conductors 16a and 16d can be in stable contact with the wiring layers 12a and 12d without forming a plating layer on the sidewall of the flexible substrate 11, respectively. Therefore, the wiring layers 12a and 12d can be stably connected in the vertical direction while suppressing the complexity of the manufacturing process.
Further, by bending the flexible substrate 11, the wiring layer 12c can be disposed on both sides via the bent portion, the number of openings 13a and 13d can be reduced, and the manufacturing process can be simplified. It becomes possible.

  Note that the electronic module described above can be applied to electronic devices such as a liquid crystal display device, a mobile phone, a portable information terminal, a video camera, a digital camera, an MD (Mini Disc) player, an IC card, and an IC tag. The electronic device can be reduced in size and weight while suppressing the complexity of the manufacturing process.

Sectional drawing which shows the manufacturing method of the electronic module which concerns on 1st Embodiment of this invention. Sectional drawing which shows the manufacturing method of the electronic module which concerns on 2nd Embodiment of this invention.

Explanation of symbols

  1, 11 Flexible substrate 1, 2a-2d, 12a-12d Wiring layer, 3a, 3b Through hole, 4a-4c, 14a-14c Electronic component, 5a-5c, 15a-15c Projecting electrode, 6, 16a, 16d Conductor , Openings 13a, 13d

Claims (8)

A flexible substrate that is provided with at least a first region and a second region, and is bent so that the first region and the second region are arranged opposite to each other;
A first wiring pattern formed in the first region of the flexible substrate;
A second wiring pattern formed in the second region of the flexible substrate;
A first through hole formed in the first wiring pattern through the first region of the flexible substrate;
A second through hole that is disposed to overlap the first through hole and is formed in the second wiring pattern through the second region of the flexible substrate;
A circuit board comprising: a conductor embedded in the first through hole and the second through hole and connecting the first wiring pattern and the second wiring pattern. A flexible substrate that is provided with at least a first region and a second region, and is bent so that the first region and the second region are arranged in an inverted manner;
A first wiring pattern formed in the first region of the flexible substrate;
A second wiring pattern formed in the second region of the flexible substrate;
A first opening that penetrates the first region of the flexible substrate and exposes the back surface of the first wiring pattern;
A first conductor embedded in the first opening so as to be in contact with the back surface of the first wiring pattern;
A second opening that exposes the back surface of the second wiring pattern through the second region of the flexible substrate;
A circuit board comprising: a second conductor disposed so as to overlap the first conductor and embedded in the second opening so as to contact a back surface of the second wiring pattern. A flexible substrate that is provided with at least a first region and a second region, and is bent so that the first region and the second region are arranged in an inverted manner;
A first wiring pattern formed in the first region of the flexible substrate;
A second wiring pattern formed in the second region of the flexible substrate;
A first electronic component mounted on a first region of the flexible substrate;
A second electronic component mounted on the second region of the flexible substrate;
A first through hole formed in the first wiring pattern through the first region of the flexible substrate;
A second through hole that is disposed to overlap the first through hole and is formed in the second wiring pattern through the second region of the flexible substrate;
An electronic module comprising: a conductor embedded in the first through hole and the second through hole and connecting the first wiring pattern and the second wiring pattern. A flexible substrate that is provided with at least a first region and a second region, and is bent so that the first region and the second region are arranged in an inverted manner;
A first wiring pattern formed in the first region of the flexible substrate;
A second wiring pattern formed in the second region of the flexible substrate;
A first electronic component mounted on a first region of the flexible substrate;
A second electronic component mounted on the second region of the flexible substrate;
A first opening that penetrates the first region of the flexible substrate and exposes the back surface of the first wiring pattern;
A first conductor embedded in the first opening so as to be in contact with the back surface of the first wiring pattern;
A second opening that exposes the back surface of the second wiring pattern through the second region of the flexible substrate;
An electronic module comprising: a second conductor disposed so as to overlap the first conductor and embedded in the second opening so as to be in contact with the back surface of the second wiring pattern. Forming a first wiring pattern and a second wiring pattern in the first region and the second region of the flexible substrate, respectively;
Forming a first through-hole penetrating the first wiring pattern through the first region of the flexible substrate;
Forming a second through-hole penetrating the second wiring pattern through the second region of the flexible substrate;
Bending the flexible substrate so that the first through hole and the second through hole overlap;
A method of manufacturing a circuit board, comprising: a step of embedding a conductor connecting the first wiring pattern and the second wiring pattern in the first through hole and the second through hole. Forming a first wiring pattern and a second wiring pattern in the first region and the second region of the flexible substrate, respectively;
Forming a first opening that penetrates the first region of the flexible substrate and exposes the back surface of the first wiring pattern;
Forming a second opening that penetrates the second region of the flexible substrate and exposes the back surface of the second wiring pattern;
Embedding a first conductor in the first opening so as to be in contact with the back surface of the first wiring pattern;
Burying a second conductor in the second opening so as to be in contact with the back surface of the second wiring pattern;
And a step of bending the flexible substrate in which the first conductor and the second conductor are embedded so that the first conductor and the second conductor overlap with each other. . Forming a first wiring pattern and a second wiring pattern in the first region and the second region of the flexible substrate, respectively;
Forming a first through-hole penetrating the first wiring pattern through the first region of the flexible substrate;
Forming a second through-hole penetrating the second wiring pattern through the second region of the flexible substrate;
Mounting a first electronic component on a first region of the flexible substrate;
Mounting a second electronic component on the second region of the flexible substrate;
Bending the first electronic component and the flexible board on which the first electronic component is mounted such that the first through hole and the second through hole overlap;
A method of manufacturing an electronic module comprising: a step of embedding a conductor connecting the first wiring pattern and the second wiring pattern in the first through hole and the second through hole. Forming a first wiring pattern and a second wiring pattern in the first region and the second region of the flexible substrate, respectively;
Forming a first opening that penetrates the first region of the flexible substrate and exposes the back surface of the first wiring pattern;
Forming a second opening that penetrates the second region of the flexible substrate and exposes the back surface of the second wiring pattern;
Embedding a first conductor in the first opening so as to be in contact with the back surface of the first wiring pattern;
Burying a second conductor in the second opening so as to be in contact with the back surface of the second wiring pattern;
Mounting a first electronic component on a first region of the flexible substrate;
Mounting a second electronic component on the second region of the flexible substrate;
The first conductor and the second conductor are embedded, and the flexible board on which the first electronic component and the second electronic component are mounted is overlapped with the first conductor and the second conductor. A method of manufacturing the electronic module.

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