JP2004207303A - Wiring board, semiconductor device, their manufacturing methods, circuit board, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board, a semiconductor device and their manufacturing methods in which stabilized connection is ensured between the electrode of an electronic component and wiring by preventing deformation of the electrode, and to provide a circuit board and an electronic apparatus. <P>SOLUTION: The method for manufacturing a wiring board comprises a step for partially making thin a conductive foil 20 formed on a base substrate 10 by etching, a step for patterning the conductive foil 20 by etching, and a step for forming a wiring 30 having a thin part 32 on the base substrate 10 in an area being bonded to the electrode of an electronic component. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a wiring board, a semiconductor device, a manufacturing method thereof, a circuit board, and an electronic device.
[0002]
BACKGROUND OF THE INVENTION
When a wiring is formed on a base substrate by etching, the width on the upper end side may be different for each wiring due to the difference in the degree of undercut. In the case where the electrodes of the semiconductor chip and the wiring are brought into contact and are electrically connected, if the influence of the variation in the width of the upper end of each wiring on the electrode can be reduced, the deformation of the electrode can be prevented, Therefore, a highly reliable semiconductor device can be manufactured.
[0003]
An object of the present invention is to provide a wiring board and a semiconductor device which prevent deformation of an electrode of an electronic component and enable a stable connection between the electrode and a wiring, a method for manufacturing the same, a circuit board, and an electronic device. .
[0004]
[Means for Solving the Problems]
(1) The method of manufacturing a wiring board according to the present invention includes:
Thinning a part of the conductive foil formed on the base substrate by etching, and patterning the conductive foil by etching,
On the base substrate, a wiring having a thin portion in a bonding region with an electrode of an electronic component is formed.
ADVANTAGE OF THE INVENTION According to this invention, the wiring which has a thin part in the junction area | region with the electrode of an electronic component can be formed. On the surface of the thin portion that is to be joined to the electrode of the electronic component, the influence of the variation in width due to the difference in undercut during etching on the electrode is reduced. Therefore, it is possible to prevent the electrodes from being deformed when the electronic component is mounted, and to manufacture a wiring board that enables stable connection between the electrodes and the wiring.
(2) In this method of manufacturing a wiring board,
The wiring may be formed such that at least a part of the thin portion protrudes inside a device hole of the base substrate.
(3) The method for manufacturing a semiconductor device according to the present invention includes:
Part of the conductive foil formed on the base substrate is thinned by etching,
Patterning the conductive foil by etching; and
Joining the electrode of the semiconductor chip to the surface formed by etching the conductive foil.
ADVANTAGE OF THE INVENTION According to this invention, the wiring which has a thin part in the junction area | region with the electrode of an electronic component can be formed. On the surface of the thin portion that is to be joined to the electrode of the electronic component, the influence of the variation in width due to the difference in undercut during etching on the electrode is reduced. Therefore, by bringing the electrode into contact with the surface formed by the etching, the electrode can be prevented from being deformed, and a semiconductor device with high connection reliability between the electrode and the wiring can be manufactured.
(4) In this method of manufacturing a semiconductor device,
The semiconductor chip may be arranged inside a device hole of the base substrate.
(5) The wiring board according to the present invention includes:
A base substrate,
Formed on the base substrate, a wiring having a thin portion in the joint region with the electrode of the electronic component,
Having.
According to the present invention, the wiring has the thin portion in the joint region with the electrode of the electronic component. In the thin portion, the influence of the variation in the width on the upper end side on the electrode is reduced, so that the electrode can be prevented from being deformed when an electronic component is mounted. Thus, it is possible to provide a wiring board that enables stable connection between the electrode and the wiring.
(6) In this wiring board,
At least a part of the thin portion may protrude inside a device hole of the base substrate.
(7) The semiconductor device according to the present invention comprises:
A base substrate,
A wiring formed on the base substrate so as to have a thin portion with a part of the surface lowered;
A semiconductor chip in which an electrode is bonded to the surface on the lower side of the thin portion,
Having.
According to the present invention, the electrode of the semiconductor chip is joined to the surface of the thinner portion on the lower side. In the thin portion, the influence of the variation in the width of the wiring on the electrode is reduced, so that it is possible to prevent the electrode from being deformed when the semiconductor chip is mounted. Therefore, a semiconductor device with high connection reliability between an electrode and a wiring can be provided.
(8) In this semiconductor device,
The semiconductor chip may be disposed inside a device hole of the base substrate.
(9) The above-described semiconductor device is mounted on a circuit board according to the present invention.
(10) An electronic apparatus according to the present invention includes the above semiconductor device.
[0005]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiments.
[0006]
(Wiring board)
1 to 11 are views for explaining a method for manufacturing a wiring board according to an embodiment to which the present invention is applied.
[0007]
First, the base substrate 10 is prepared. The base substrate 10 may be made of any of an organic or inorganic material, and may have a composite structure thereof. As the base substrate 10, for example, a substrate or film made of polyethylene terephthalate (PET) may be used. Alternatively, a flexible substrate made of a polyimide resin may be used as the base substrate 10. As the flexible substrate, a tape used in FCP (Flexible Printed Circuit) or TAB (Tape Automated Bonding) technology may be used.
[0008]
A long substrate may be used as the base substrate 10. The long base substrate may be used in a reel-to-reel process in which both ends are wound around a reel and a process of manufacturing a wiring substrate and a semiconductor device is performed. Then, the method for manufacturing a semiconductor device according to the present embodiment may be performed by a reel-to-reel process. As shown in FIG. 1, a substrate on which device holes 12 and sprocket holes 14 are formed may be used as the base substrate 10. In this case, the device hole 12 and the sprocket hole 14 may be formed by mechanical punching. In one base substrate 10, only one device hole may be formed, or two or more device holes 12 may be formed. However, separately from this, for example, a substrate having no device hole 12 may be used as the base substrate. Alternatively, an outer lead hole may be formed around the device hole 12, and this may be used as the base substrate 10.
[0009]
Next, the conductive foil 20 is formed on the base substrate 10 (see FIG. 2). The conductive foil 20 may be formed from a single metal foil, or a laminate of a plurality of metal foils may be used as the conductive foil 20. For example, the conductive foil 20 may be formed of a copper foil. The conductive foil 20 may be attached to the base substrate 10 with an adhesive to form the conductive foil 20 on the base substrate 10.
[0010]
Next, a part of the conductive foil 20 formed on the base substrate 10 is thinned by etching. As shown in FIGS. 3 and 4, the resist 100 is formed avoiding a part (a region to be thinned) of the conductive foil 20, and the conductive foil 20 is etched to make the conductive foil 20 thinner. Good. Note that a protective member (not shown) is formed in the device hole 12 in order to prevent a portion exposed from the device hole 12 on the back surface (the surface facing the base substrate 10) of the conductive foil 20 from being removed. In this state, the conductive foil may be etched.
[0011]
FIG. 5 is a diagram showing a state of the base substrate 10 and the conductive foil 20 after the etching process is completed, and FIG. 6 is a partially enlarged view of a cross section taken along line VI-VI of FIG. The thickness of the conductive foil 20 after the etching (specifically, the thickness of the thinned portion) may be adjusted by adjusting the etching time.
[0012]
Next, the partially thinned conductive foil 20 is patterned by etching. By patterning the conductive foil 20, the wiring 30 having the thin portion 32 can be formed (see FIGS. 9 and 10). The conductive foil 20 may be etched so that at least a part of the thin portion 32 projects inside the device hole 12 of the base substrate 10. FIG. 7 is a view showing a state in which a resist 200 is formed on the conductive foil 20 which is partially thinned, and FIG. 8 is a partially enlarged view of a cross section taken along line VIII-VIII of FIG. As shown in FIG. 7, the conductive foil 20 may be patterned by forming and etching a resist 200 in a pattern shape of the wiring 30. Further, the conductive foil 20 may be patterned so as to form a plating lead (not shown). When the plating lead is formed, the wiring 30 can be easily plated in a later step. In addition, in order to protect the back surface of the conductive foil 20, etching for patterning the conductive foil 20 may be performed in a state where the protection member is formed in the device hole 12.
[0013]
The wiring 30 may have a portion (inner lead) sealed in a later step and a portion (outer lead) used for electrical connection with the outside. Part of the inner leads may protrude inside the device hole 12. Further, the wiring 30 may be further extended to provide a test pad (not shown).
[0014]
Then, the wiring substrate 1 shown in FIG. 9 can be manufactured through a step of plating the wiring 30 and a step of removing the protection member formed in the device hole 12. 10 is a partially enlarged view of a section taken along line XX in FIG. 9, and FIG. 11 is a partially enlarged view of a section taken along line XI-XI in FIG.
[0015]
Through the above steps, it is possible to manufacture the wiring board 1 in which the wiring 30 having the thin portion 32 is formed on the base substrate 10 in the joint region with the electrode of the electronic component. The thin portion 32 may be formed on the base end side of the wiring 30 (on the side facing the base substrate 10). Further, the surface on the base end side of the wiring 30 may be formed flat. In other words, the thin portion 32 may have a shape formed by lowering the upper end side of the wiring 30 or by forming a step. That is, the wiring 30 may be formed so as to have the thin portion 32 in which a part of the surface is lowered. Further, the thin portion 32 may be formed at the tip of the wiring 30. Note that the wiring 30 may be formed such that at least a part of the thin portion 32 projects inside the device hole 12 of the base substrate 10. Further, the wiring 30 may be formed so that the entire thin portion 32 is arranged inside the device hole 12.
[0016]
Conventionally, when a wiring is formed by etching, the width of the upper end side of the wiring may differ for each wiring due to the difference in the degree of undercut, and the contact area between the electrode and the wiring may vary. When the difference in the contact area between the electrode and the wiring is large for each electrode, the difference in the pressure applied to each electrode from the wiring increases. And the electrode which receives a large pressure deform | transforms, and the stable connection of the electrode and wiring was sometimes unable to be implement | achieved. In particular, when the width of the upper end side of the wiring is narrow, the difference in width between the wirings has a great effect on the electrodes. However, in the method of manufacturing a wiring board according to the present embodiment, the wiring 30 having the thin portion 32 is formed in a region where the electronic component is joined to the electrode. As shown in FIG. 11, the width of the upper end side of the thin portion 32 is wider than the width of the upper end side of the portion other than the thin portion 32 in the wiring 30. Since the width of the upper end of the thin portion 32 is wide, even if the width of the upper end of the thin portion 32 is different for each wiring, the difference is relatively small in relation to the width of the upper end of the thin portion 32. It becomes. Therefore, the influence of the variation in the width on the upper end side of each thin portion 32 on the electrode is reduced. Therefore, it is possible to prevent the electrodes from being deformed when the electronic component is mounted, and to manufacture the wiring board 1 that enables stable connection between the electrodes and the wiring.
[0017]
After forming the wiring, a part of the wiring may be thinned by etching or mechanically thinned to form a wiring having a thin portion. With this, a wiring board having the same effect as that of the wiring board 1 can be manufactured.
[0018]
The wiring substrate 1 manufactured by the method for manufacturing a semiconductor device according to the present embodiment has a base substrate 10. The wiring substrate 1 has a wiring 30 formed on the base substrate 10 and having a thin portion 32 in a bonding region with an electrode of an electronic component. Note that at least a part of the thin portion 32 may protrude inside the device hole 12 of the base substrate 10.
[0019]
(Semiconductor device)
12 and 13 are views for explaining a method for manufacturing a semiconductor device according to an embodiment to which the present invention is applied.
[0020]
First, the semiconductor chip 50 is mounted on the wiring board 1. The wiring board 1 can be manufactured by the method described above. An integrated circuit may be formed on the semiconductor chip 50. The planar shape of the semiconductor chip 50 is generally rectangular, but is not limited to this. A plurality of electrodes 52 may be formed on one surface of the semiconductor chip 50. The electrodes 52 may be arranged along at least one side (in most cases, two or four sides) of the surface of the semiconductor chip 50. Further, the electrodes 52 may be arranged at the end of the surface of the semiconductor chip 50 or at the center. Each of the electrodes 52 may be formed of a thin and flat pad made of aluminum or the like, and a bump formed thereon. If no bump is formed, the pad may be used as the electrode 52. A passivation film (not shown) may be formed on the semiconductor chip 50 avoiding at least a part of the electrode 52. The passivation film may be formed of, for example, SiO ₂ , SiN, polyimide resin, or the like.
[0021]
The semiconductor chip 50 may be mounted on the wiring board 1 from the side of the wiring board 1 where the wiring 30 is formed. The electrode 52 of the semiconductor chip 50 may be bonded to a surface formed by etching the conductive foil 20 (specifically, a surface formed by etching when a part of the conductive foil 20 is thinned). After the alignment of the electrode 52 and the thin portion 32 of the semiconductor chip 50, one or both of the electrode 52 and the thin portion 32 may be pressed to join the electrode 52 and the thin portion 32. . FIG. 12 is a diagram in which the semiconductor chip 50 is mounted on the wiring board 1, and FIG. 13 is a partially enlarged view of a cross section taken along line XIII-XIII in FIG. As shown in FIGS. 12 and 13, the semiconductor chip 50 may be arranged inside the device hole 12.
[0022]
Next, the semiconductor chip 50 is sealed with a resin. The semiconductor chip 50 may be resin-sealed by potting the sealing resin. The resin sealing may be performed while transporting the wiring board 1 by a reel-to-reel. Then, the semiconductor device 2 can be manufactured through processes such as cutting the base substrate 10 and bending the wiring 30 (see FIG. 14).
[0023]
As described above, in the wiring board 1, the influence of the variation in the width on the upper end side of the thin portion 32 in the wiring 30 on the electrode 52 is small. Therefore, when the thin portion 32 and the electrode 52 are joined, the variation in the pressure applied to each of the electrodes 52 from the thin portion 32 is reduced, and the electrode 52 can be prevented from being deformed. Therefore, stable connection between the electrode 52 and the wiring 30 can be realized, and a highly reliable semiconductor device 2 can be manufactured.
[0024]
The semiconductor device 2 manufactured by the method for manufacturing a semiconductor device according to the present embodiment has a base substrate 10. The semiconductor device 2 has a wiring 30 formed on the base substrate 10 so as to have a thin portion 32 whose surface is partially reduced. The semiconductor device 2 has a semiconductor chip 50 in which the electrode 52 is joined to the lower surface of the thin portion 32. Note that the semiconductor chip 50 may be disposed inside the device hole 12 of the base substrate 10.
[0025]
FIG. 14 shows a circuit board 1000 on which the semiconductor device 2 manufactured by the method for manufacturing a semiconductor device according to the present embodiment is mounted. The wiring pattern 300 may be formed on the circuit board 1000, and the outer leads of the semiconductor device 2 may be electrically connected to the wiring pattern 300. 15 shows a notebook personal computer 2000 and FIG. 16 shows a mobile phone 3000 as electronic devices having the semiconductor device 2.
[0026]
Note that the present invention is not limited to the above-described embodiment, and various modifications are possible. For example, the invention includes configurations substantially the same as the configurations described in the embodiments (for example, a configuration having the same function, method, and result, or a configuration having the same object and result). Further, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. Further, the invention includes a configuration having the same operation and effect as the configuration described in the embodiment, or a configuration capable of achieving the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.
[Brief description of the drawings]
FIG. 1 is a diagram showing a method for manufacturing a wiring board according to an embodiment to which the present invention is applied.
FIG. 2 is a diagram illustrating a method of manufacturing a wiring board according to an embodiment to which the present invention is applied.
FIG. 3 is a diagram illustrating a method of manufacturing a wiring board according to an embodiment to which the present invention is applied.
FIG. 4 is a diagram showing a method of manufacturing a wiring board according to an embodiment to which the present invention is applied.
FIG. 5 is a diagram illustrating a method of manufacturing a wiring board according to an embodiment to which the present invention is applied.
FIG. 6 is a diagram illustrating a method of manufacturing a wiring board according to an embodiment to which the present invention is applied.
FIG. 7 is a diagram illustrating a method of manufacturing a wiring board according to an embodiment to which the present invention is applied.
FIG. 8 is a diagram showing a method for manufacturing a wiring board according to an embodiment to which the present invention is applied.
FIG. 9 is a diagram illustrating a method of manufacturing a wiring board according to an embodiment to which the present invention is applied.
FIG. 10 is a diagram illustrating a method of manufacturing a wiring board according to an embodiment to which the present invention is applied.
FIG. 11 is a diagram illustrating a method of manufacturing a wiring board according to an embodiment to which the present invention is applied.
FIG. 12 is a diagram illustrating a method of manufacturing a semiconductor device according to an embodiment to which the present invention is applied.
FIG. 13 is a diagram illustrating a method of manufacturing a semiconductor device according to an embodiment to which the present invention is applied.
FIG. 14 is a view showing a circuit board on which a semiconductor device manufactured by a method of manufacturing a semiconductor device according to an embodiment of the present invention is mounted.
FIG. 15 is a diagram showing an electronic apparatus having a semiconductor device manufactured by a method of manufacturing a semiconductor device according to an embodiment to which the present invention is applied.
FIG. 16 is a diagram showing an electronic apparatus having a semiconductor device manufactured by a method of manufacturing a semiconductor device according to an embodiment to which the present invention is applied.
[Explanation of symbols]
Reference Signs List 10 base substrate, 12 device hole, 30 wiring, 32 thin part, 50 semiconductor chip, 52 electrode

Claims (10)

Thinning a part of the conductive foil formed on the base substrate by etching, and
Patterning the conductive foil by etching,
A method of manufacturing a wiring board, wherein a wiring having a thin portion in a bonding region with an electrode of an electronic component is formed on the base substrate. The method for manufacturing a wiring board according to claim 1,
A method of manufacturing a wiring board, wherein the wiring is formed such that at least a part of the thin portion protrudes inside a device hole of the base substrate. Part of the conductive foil formed on the base substrate is thinned by etching,
Patterning the conductive foil by etching; and
A method of manufacturing a semiconductor device, comprising joining an electrode of a semiconductor chip to a surface formed by etching the conductive foil. The method for manufacturing a semiconductor device according to claim 3,
A method of manufacturing a semiconductor device, wherein the semiconductor chip is arranged inside a device hole of the base substrate. A base substrate,
Formed on the base substrate, a wiring having a thin portion in the joint region with the electrode of the electronic component,
A wiring board having the same. The wiring board according to claim 5,
A wiring board wherein at least a part of the thin portion protrudes inside a device hole of the base substrate. A base substrate,
A wiring formed on the base substrate so as to have a thin portion with a part of the surface lowered;
A semiconductor chip in which an electrode is bonded to the surface on the lower side of the thin portion,
A semiconductor device having: The semiconductor device according to claim 7,
A semiconductor device, wherein the semiconductor chip is arranged inside a device hole of the base substrate. A circuit board on which the semiconductor device according to claim 7 is mounted. An electronic device comprising the semiconductor device according to claim 7.

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