JP2005127806A - Screening apparatus and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a screening apparatus and a screening method which prevent troubles appearing after assembling a control board to a product. <P>SOLUTION: Inspection processing by the screening apparatus conducts, at step S1, an inspection with a test program which is a level judgment of ON voltage, OFF voltage, etc. in the ambient temperature of board temperature of a mounting board 14. Then in step S2, inspection is conducted in an actual use state of the mounting board 14 by varying the substrate temperature of the mounting board 14 from the ambient temperature to a low temperature in a specific time. In step S4 and step S7, inspection with the test program is conducted at a low temperature and a high temperature. In step S5, inspection is conducted in an actual use state by varying the board temperature from a low temperature to a high temperature in specific time. In step S8, inspection is conducted in the actual use state by varying the board temperature from a high temperature to a low temperature in a specific time. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a screening apparatus and a screening method.

  2. Description of the Related Art Conventionally, as disclosed in, for example, Patent Document 1, a screening apparatus that performs an inspection for good or bad operation of a mounting substrate under a predetermined temperature environment is known.

  FIG. 7 is a schematic configuration diagram showing the configuration of the screening apparatus of Patent Document 1. In this screening apparatus, a constant temperature bath 20 and an inspection / measuring machine 21 are connected via a relay cable 22. The constant temperature bath 20 is provided with a door 23 that can be opened and closed. The thermostat 20 is provided with a well-known temperature control means so that the atmosphere temperature in the thermostat 20 can be adjusted freely so that it can be controlled to a predetermined temperature according to the inspection conditions. Composed.

  The inspection / measuring machine 21 includes an inspection unit 24 for inspecting whether the mounting substrate is good or defective, and a control unit 25 connected to the inspection unit 24. The control means 25 consists of general microcomputers, such as a personal computer provided with CPU, ROM, RAM, etc., for example. The inspection unit 24 includes input / output terminals for inputting / outputting inspection input / output signals to / from the mounting board and an internal memory in which a predetermined inspection program corresponding to the type of the mounting board is stored.

When the data (for example, a product number) relating to the mounting board to be inspected is input, the control means 25 gives the inspection unit 24 an inspection command for executing an inspection corresponding to the mounting board corresponding to the data input. When an inspection command is given from the control means 25, the inspection unit 24 sequentially transmits an input signal for inspection to each mounting board based on an inspection program corresponding to the type of the mounting board. The inspection unit 24 receives an inspection output signal output from each mounting board in response to the inspection input signal. The inspection unit 24 determines whether the operation of each control board is good or bad based on the input output signal for inspection.
JP 2000-131365 A

  However, in the above-described prior art, an inspection input signal is input to the mounting substrate, and inspection of good or defective operation is performed based on the inspection output signal responding thereto. In this way, since the mounting board alone performs only good and defective inspection of the mounting board, if there is a problem that becomes apparent for the first time after the mounting board is assembled to the product, such a problem must be discovered. I could not.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a screening apparatus and a screening method that prevent the occurrence of a problem that becomes apparent only after a control board is assembled to a product.

  In order to achieve the above object, the screening apparatus according to claim 1 is configured such that the periphery is constituted by a heat insulating member, the inspection room for storing the control board to be inspected, and the temperature of the control board in the actual use state of the control board. The temperature adjustment device that changes in the temperature range that may be exposed to, the peripheral device that corresponds to the device connected to the control board in the actual usage state of the control board, and the temperature of the control board is changed within the temperature range However, an inspection apparatus for inspecting whether the operation of the control board is normal or not with a peripheral device connected to the control board is provided.

  According to this, while changing the temperature of the control board within a predetermined temperature range, and in the state where the peripheral device corresponding to the device connected to the control board in the actual use state of the control board is connected to the control board Since it is inspected whether or not the operation of the control board is normal, it is possible to prevent a problem that becomes apparent only after the control board is assembled to the product.

  Further, in the screening device according to claim 2, the control board has a self-diagnosis function for inspecting the operation state of the peripheral device, and the inspection apparatus operates based on the self-diagnosis result from the control board. It is characterized by inspecting whether or not is normal.

  According to this, since many functions of the control board are used when inspecting the operation state of the peripheral device connected in the actual use state, many functions of the control board operate normally. You can check whether or not

  According to a third aspect of the present invention, the temperature adjustment device is characterized in that the temperature is changed from a low temperature to a high temperature and from a high temperature to a low temperature.

  According to this, by changing the temperature of the control board from the low temperature to the high temperature and from the high temperature to the low temperature, the control board can be inspected in a state closer to the actual use state.

  The screening apparatus according to claim 4, wherein the temperature adjusting device includes air supply means for supplying air whose temperature changes, and the inspection chamber includes a nozzle for ejecting air toward the control board. To do.

  According to this, since the temperature of the control board is changed by supplying air whose temperature changes, the temperature in the test chamber and the temperature of the control board can be changed in a short time.

  Further, in the screening apparatus according to claim 5, the air supply means includes low dew point air generating means for generating low dew point air having a dew condensation temperature lower than the temperature of the control board at a low temperature. It is.

  According to this, since the low dew point air whose dew condensation temperature is lower than the temperature of the control board at the low temperature is supplied to the inspection room, even if the high temperature air is supplied after the low temperature air is supplied to the inspection room, the control is performed. It is possible to prevent the substrate from condensing.

  The screening apparatus according to claim 6 is characterized in that the examination room includes a discharge port for discharging air.

  According to this, by discharging the air supplied to the examination room, the air can be circulated in the examination room, and the temperature distribution in the examination room can be made uniform.

  According to a seventh aspect of the present invention, the nozzle includes a plurality of air jets arranged in a horizontal direction with respect to the control board.

  According to this, the temperature distribution of the control board can be made uniform over the entire surface of the control board by providing the plurality of air jets arranged in the horizontal direction with respect to the control board.

  In the screening apparatus according to claim 8, the control board includes a mounting board on which various electronic components are mounted, and the nozzle includes a moving unit that moves the nozzle position in accordance with the mounting position of the electronic component. It is characterized by this.

  According to this, since the nozzle can be moved according to the mounting position of the electronic component, it is possible to efficiently change the temperature of the electronic component in which the temperature hardly changes.

  In the screening device according to claim 9, the peripheral device corresponds to an input device that inputs a signal to the control board in an actual use state of the control board, and an operation device that operates according to an output signal output from the control board. It is characterized by comprising the apparatus which performs.

  According to this, since it is possible to perform inspection with all peripheral devices connected to the control board connected in the actual use state of the control board, the problem that becomes apparent only after the control board is further assembled to the product. Can be prevented.

  Further, since the actions and effects of the screening method according to claims 10 to 18 are the same as those of claims 1 and 9 described above, description thereof is omitted.

  Hereinafter, a screening apparatus according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing the entire screening apparatus in the present embodiment. FIG. 2 is a cross-sectional view showing the configuration of the examination room 3 in the embodiment of the present invention.

  The screening apparatus includes an inspection apparatus 1, a low / high temperature air generator 2, and an inspection room 3. The inspection device 1 includes a power supply, a measuring instrument, a measurement board, and peripheral devices (for example, a solenoid coil and a yaw rate sensor) corresponding to devices connected when the mounting board 14 is actually used. The inspection device 1 is electrically connected to the low-temperature and high-temperature air generation device 2 through a cable 6. The inspection device 1 transmits a temperature control signal to the low and high temperature air generator 2 so that the temperature and supply time of the dry air become a predetermined value according to a predetermined test program stored in the inspection device 1.

  The inspection apparatus 1 is also electrically connected to the inspection room 3 and the mounting substrate 14 in the inspection room 3 via the cable 7. The inspection apparatus 1 transmits a movement control signal for controlling the movement of the nozzle 9 to the inspection room 3. Further, the inspection apparatus 1 transmits / receives an inspection input signal / inspection output signal and a self-diagnosis input signal / self-diagnosis output signal to / from the mounting substrate 14 to inspect whether the mounting substrate 14 is good or defective. To do. Then, good or bad operation of the mounting board 14 is inspected by the inspection output signal and the self-diagnosis output signal from the mounting board 14.

  Note that the mounting board 14 in the embodiment of the present invention has a self-diagnosis function, and is used, for example, as an ABS ECU. The mounting board 14 used as the ABS ECU is mounted on the mounting board 14 to determine whether there is an abnormality in a load such as a solenoid coil and a sensor such as a yaw rate sensor when the engine of the vehicle is started. Inspect yourself.

  The low and high temperature air generator 2 includes a dehumidifying unit, a cooling unit, a heating unit, and the like. The dehumidifying unit includes a dehumidifying material such as silica gel, sucks outside air, generates dry air having a low dew point temperature from the outside air, and supplies the dry air to a cooling unit or the like. The dehumidifying unit also supplies the generated dry air to the wiring chamber 3b of the inspection chamber 3 through the dry air supply pipe 5 without passing through the cooling unit and the heating unit.

  The cooling unit includes a cooler through which the refrigerant flows. The cooling unit cools the dry air supplied from the dehumidifying unit by passing it through the cooler. Then, the cooled low-temperature dry air is supplied to the heating unit.

  The heating unit includes a heater. The heating unit heats the low-temperature dry air supplied from the cooling unit to a predetermined temperature by heating with a heater. Then, the low-temperature and high-temperature air generator 2 blows the dry air having the predetermined temperature from the air outlet 10 to the mounting substrate 14 in the inspection chamber 3 through the low-temperature and high-temperature air supply pipe 4 and the nozzle 9.

  Thus, the low-temperature and high-temperature air generating device 2 creates a temperature range corresponding to the actual use state of the mounting board 14 by blowing dry air of a predetermined temperature onto the mounting board 14 in the inspection chamber 3.

  The inspection chamber 3 is connected to the low and high temperature air generator 2 via a low and high temperature air supply pipe 4 and a dry air supply pipe 5. As shown in FIG. 2, the inspection room 3 includes a wiring room 3a and a heat insulation room 3b.

  The wiring chamber 3 a includes a wiring 13 that is electrically connected to the probe pins 12 that are electrically connected to the electrodes provided on the mounting substrate 14. The wiring 13 is also electrically connected to the cable 7, and the inspection device 1 (peripheral device and the like) and the mounting substrate 14 are connected to the inspection input signal / inspection output signal via the cable 7, the probe 12, and the wiring 13. Send and receive. The wiring chamber 3a also includes a dry air supply pipe 5 for supplying the dry air from the low-temperature and high-temperature air generator 2 to the wiring chamber 3a.

  The heat insulation chamber 3b includes a box-shaped heat insulation member 8 that houses the mounting substrate 14, and includes a nozzle 9 (air jet port 10) for blowing dry air supplied from the low-temperature and high-temperature air generator 2 onto the mounting substrate 14. . The heat insulation chamber 3b includes an air discharge port 11 for discharging the dry air to the outside of the heat insulation chamber 3b in order to circulate the supplied dry air in the heat insulation chamber 3b. The air discharge port 11 may be provided with large and small air discharge ports 11 a and 11 b in order to reduce the influence of the external environment temperature of the examination room 3. Although not shown, the heat insulation chamber 3b is provided with a temperature sensor for measuring the substrate temperature of the mounting substrate 14.

  Here, the nozzle 9 will be described with reference to FIGS. 3 and 4. FIG. 3 is a view of the nozzle 9 and the mounting substrate 14 in FIG. 2 as viewed from above the drawing, and is an explanatory diagram showing the shape of the nozzle 9 and the positional relationship between the nozzle 9 and the mounting substrate 14. FIG. 4 is a cross-sectional view showing the positional relationship between the mounting substrate 14 and the nozzle 9, where (a) is the case of the double-sided mounting substrate 14, and (b) is the case of the single-sided mounting substrate 14. The nozzle 9 includes a plurality of air jets 10 arranged in the horizontal direction in order to blow dry air uniformly over the entire surface of the mounting substrate 14.

  The nozzle 9 includes an actuator (not shown) made of a motor or the like controlled by the inspection apparatus 1. This actuator moves the nozzle 9 up and down by a movement control signal from the inspection apparatus 1. For example, as shown in FIG. 4A, when the electronic components 15 are mounted on both surfaces of the mounting substrate 14, the nozzle is arranged so that the air outlet 10 faces the center in the thickness direction of the mounting substrate 14. 9 is moved. Further, as shown in FIG. 4B, when the electronic component 15 is mounted only on one side of the mounting substrate 14, the nozzle 9 is moved so that the air outlet 10 faces the electronic component 15. . By doing so, it is possible to efficiently change the temperature of the electronic component 15 whose temperature is difficult to change.

  Here, the inspection process by the screening apparatus will be described. FIG. 5 is an explanatory diagram showing the inspection contents and the substrate temperature change of the mounting substrate 14 in the present embodiment. FIG. 6 is a flowchart showing an inspection process by the screening apparatus in the present embodiment.

  In the inspection process by the screening apparatus shown in the flow chart of FIG. 6, the mounting substrate 14 is housed in the inspection chamber 3 in a state of being electrically connected to the probe pins 12, and the substrate temperature of the mounting substrate 14 is normal temperature (for example, Start at 25 ℃ ± 5 ℃. If the substrate temperature is not room temperature when the mounting substrate 14 is stored in the inspection room 3, the inspection apparatus 1 mounts dry air of a predetermined temperature on the low-temperature air generator 2 so that the substrate temperature becomes room temperature. A temperature control signal is transmitted so as to spray on the substrate 14.

  When the process shown in the flowchart of FIG. 6 is started, first, in step S1, an inspection by a test program is performed. The inspection by the test program is an inspection that has been performed conventionally, and is a level determination of ON voltage, OFF voltage, etc. at a predetermined temperature and a predetermined time. The inspection by the test program in step S1 corresponds to the area A in FIG. 5, and is performed for 18 seconds, for example, with the substrate temperature of the mounting substrate 14 being a normal temperature (25 ° C. ± 5 ° C. here). The inspection device 1 transmits an input signal for inspection to the mounting board 14 in accordance with a predetermined test program stored in the inspection device 1. The measuring instrument provided in the inspection apparatus 1 receives the inspection output signal from the mounting substrate 14 and inspects whether the operation of the mounting substrate 14 is good or defective based on the received inspection output signal.

  In step S <b> 2, the inspection apparatus 1 inspects the mounting substrate 14 in the actual use state while cooling the mounting substrate 14. The inspection in the actual use state in step S2 corresponds to the region B in FIG. 5, and the substrate temperature of the mounting substrate 14 is changed from normal temperature to low temperature in a predetermined time (for example, 57 seconds) (here, 25 ° C.). ± 5 ° C. to −30 ° C. ± 5 ° C.). The inspection apparatus 1 controls the temperature so that dry air of a predetermined temperature is blown to the low-temperature and high-temperature air generator 2 so that the substrate temperature is changed from room temperature to low temperature (here, −30 ° C. ± 5 ° C.). Send a signal. The low-temperature and high-temperature air generation device 2 that has received the temperature control signal adjusts the flow rate of the refrigerant that passes through the heater and the cooling unit of the heating unit, for example, and brings the dry air to a predetermined temperature. Then, the low-temperature and high-temperature air generator 2 blows the dry air having the predetermined temperature from the air outlet 10 to the mounting substrate 14 in the inspection chamber 3 through the low-temperature and high-temperature air supply pipe 4 and the nozzle 9.

  Further, the inspection apparatus 1 changes the substrate temperature of the mounting substrate 14 from room temperature to low temperature (here, 25 ° C. ± 5 ° C. to −30 ° C. ± 5 ° C.) for a predetermined time (for example, 57 seconds). Sends a self-diagnosis input signal. The mounting board 14 that has received the self-diagnosis input signal performs self-diagnosis in a state where peripheral devices such as a solenoid coil provided in the inspection apparatus 1 are electrically connected. The mounting board 14 that has performed the self-diagnosis transmits a self-diagnosis output signal indicating whether or not the mounting board 14 is operating normally to the inspection apparatus 1. Then, the inspection device 1 inspects whether the mounting substrate 14 is good or bad based on whether the self-diagnosis output signal and the self-diagnosis output signal are normally received.

  Here, the self-diagnosis by the mounting substrate 14 will be described. For example, when performing self-diagnosis as to whether or not the solenoid valve is operating normally, the mounting substrate 14 energizes and shuts off the solenoid valve (solenoid coil) provided in the inspection apparatus 1 so that ON / OFF is normally performed. Inspect what is going on. When performing self-diagnosis as to whether or not the yaw rate sensor is operating normally, the mounting board 14 acquires a sensor signal from a yaw rate sensor that is provided in the inspection apparatus 1 and is operated in a pseudo manner. Inspect whether the yaw rate sensor is operating normally.

  The solenoid coil described above generates a whisker-like flyback voltage when ON / OFF, and may cause stress on the mounting substrate 14. However, by performing a self-diagnosis in the actual use state using the solenoid coil (peripheral device) on the mounting board 14 in the screening test, the stress applied to the mounting board 14 becomes equivalent to the actual use state, and after the mounting board 14 is mounted on the vehicle. Problems that become apparent can be reduced.

  In the case of a yaw rate sensor, it may be possible to create a pseudo waveform with inspection software and communicate with the mounting board 14 using communication software, but the communication timing and communication speed differ from the state where the mounting board 14 is mounted on the vehicle. There is a possibility that a problem occurs after the mounting board 14 is mounted on the vehicle. However, by performing self-diagnosis on the mounting board 14 in the actual use state using the yaw rate sensor (peripheral device) in the screening test, the communication timing and the communication speed become equivalent to the actual use state, and are apparent after the mounting board 14 is mounted on the vehicle. Can be reduced. In addition, by using the yaw rate sensor (peripheral device) for inspection, it is possible to shorten the time for creating and debugging the inspection software and communication software.

  The self-diagnosis by the mounting board 14 is not limited to the above-described inspection of the electromagnetic valve and the yaw rate sensor, but the inspection of all sensors and control devices connected to the mounting board 14 in the actual use state. There may be.

  In step S3, it is determined whether or not the substrate temperature of the mounting substrate 14 is a low temperature (here, −30 ° C. ± 5 ° C.). If the substrate temperature of the mounting substrate 14 is low, the process proceeds to step S4. If the substrate temperature of the mounting substrate 14 has not reached the low temperature, the process returns to step S2. That is, the inspection in the actual use state in step S2 is repeatedly performed until the substrate temperature of the mounting substrate 14 is changed from the normal temperature to the low temperature.

  The inspection by the test program in step S4 corresponds to the region C in FIG. 5, and is performed for 27 seconds, for example, with the substrate temperature of the mounting substrate 14 being low (here, −30 ° C. ± 5 ° C.). Since the inspection method is the same as the inspection in step S1, description thereof is omitted.

  In step S <b> 5, the inspection apparatus 1 inspects the mounting substrate 14 in the actual use state while heating the mounting substrate 14. The inspection in the actual use state in step S5 corresponds to the region D in FIG. 5, and the substrate temperature of the mounting substrate 14 is changed from a low temperature to a high temperature for a predetermined time (for example, 48 seconds) (here, −30). ℃ ± 5 ℃ to 100 ℃ ± 5 ℃). Since the inspection method is the same as the inspection in step S2, description thereof will be omitted.

  In step S6, it is determined whether or not the substrate temperature of the mounting substrate 14 is high (here, 100 ° C. ± 5 ° C.). If the substrate temperature of the mounting substrate 14 is high, the process proceeds to step S7, and if the substrate temperature of the mounting substrate 14 has not reached the high temperature, the process returns to step S5. That is, the inspection in the actual use state in step S5 is repeatedly performed until the substrate temperature of the mounting substrate 14 changes from the low temperature to the high temperature.

  The inspection by the test program in step S7 corresponds to the region E in FIG. 5, and is performed for 27 seconds, for example, with the substrate temperature of the mounting substrate 14 being high (here, 100 ° C. ± 5 ° C.). Since the inspection method is the same as the inspection in step S1, description thereof is omitted.

  In step S <b> 8, the inspection apparatus 1 inspects the mounting substrate 14 in the actual use state while cooling the mounting substrate 14. The inspection in the actual use state in step S8 corresponds to the region F in FIG. 5, and the substrate temperature of the mounting substrate 14 is changed from a high temperature to a normal temperature for a predetermined time (for example, 20 seconds) (here, 100 ° C. ± 5 ° C. to 25 ° C. ± 5 ° C.). Since the inspection method is the same as the inspection in step S2, description thereof will be omitted.

  In step S9, it is determined whether or not the substrate temperature of the mounting substrate 14 is normal temperature (here, 25 ° C. ± 5 ° C.). If the substrate temperature of the mounting substrate 14 is normal, the process is terminated, and if the substrate temperature of the mounting substrate 14 has not reached normal temperature, the process returns to step S8. That is, the inspection in the actual use state in step S8 is repeatedly performed until the substrate temperature of the mounting substrate 14 is changed from high temperature to room temperature.

It is a perspective view which shows the whole screening apparatus in embodiment of this invention. It is sectional drawing which shows the structure of the test room 3 in embodiment of this invention. It is explanatory drawing which shows the shape of the nozzle 9 in embodiment of this invention, and the positional relationship of the nozzle 9 and the mounting substrate 14. FIG. FIG. 4 is a cross-sectional view showing the positional relationship between the mounting substrate 14 and the nozzle 9 in the embodiment of the present invention, where (a) is the case of the double-sided mounting substrate 14 and (b) is the case of the single-sided mounting substrate 14. . It is explanatory drawing which shows the content of a test | inspection and the board | substrate temperature change of the mounting board | substrate 14 in embodiment of this invention. It is a flowchart which shows the test | inspection process by the screening apparatus in embodiment of this invention. It is a schematic block diagram which shows the structure of the screening apparatus in a prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Inspection apparatus, 2 Low and high temperature air generating apparatus, 3 Inspection room, 4 Low and high temperature air supply pipe, 5 Dry air supply pipe, 6 Cable, 7 Cable, 8 Heat insulation member, 9 Nozzle, 10 Air outlet, 11 Air outlet , 12 Probe pin, 13 Wiring, 14 Mounting board, 15 Electronic component

Claims (18)

An inspection room that is composed of a heat insulating member and houses a control board to be inspected;
A temperature adjusting device that changes the temperature of the control board in a temperature range in which the control board may be exposed in an actual use state; and
A peripheral device corresponding to a device connected to the control board in an actual use state of the control board;
An inspection device for inspecting whether or not the operation of the control board is normal while the peripheral device is connected to the control board while changing the temperature of the control board within the temperature range;
A screening apparatus comprising: The control board has a self-diagnosis function for inspecting an operation state of the peripheral device, and the inspection apparatus inspects whether the operation is normal based on a self-diagnosis result from the control board. The screening apparatus according to claim 1, wherein: The screening apparatus according to claim 1, wherein the temperature adjusting device changes the temperature from a low temperature to a high temperature and from a high temperature to a low temperature. The said temperature control apparatus is provided with the air supply means which supplies the air from which temperature changes, The said inspection chamber is equipped with the nozzle which ejects the said air toward the said control board, The Claim 1 thru | or 3 characterized by the above-mentioned. The screening apparatus in any one of. The screening apparatus according to claim 4, wherein the air supply unit includes a low dew point air generation unit that generates low dew point air having a dew condensation temperature lower than a temperature of the control board at a low temperature. 6. The screening apparatus according to claim 4, wherein the examination room includes a discharge port for discharging the air. The screening apparatus according to claim 4, wherein the nozzle includes a plurality of air jets arranged in a horizontal direction with respect to the control board. 5. The control board includes a mounting board on which various electronic components are mounted, and the nozzle includes a moving unit that moves the nozzle position in accordance with the mounting position of the electronic component. The screening apparatus according to claim 7. The peripheral device includes an input device that inputs a signal to the control board in an actual use state of the control board, and a device that corresponds to an operation device that operates according to an output signal output from the control board. The screening apparatus according to any one of claims 1 to 8. The control board is housed in an inspection room composed of a heat insulating member, and the temperature of the control board is changed in the temperature range in which the control board may be exposed in the actual use state, while the control board is actually A screening method comprising: inspecting whether or not the operation of the control board is normal in a state in which a peripheral device corresponding to a device connected to the control board is connected in the use state. The control board has a self-diagnosis function for inspecting an operation state and the like of the peripheral device, and inspects whether or not the operation is normal based on a self-diagnosis result from the control board. The screening method according to claim 10. The screening method according to claim 10 or 11, wherein the temperature of the control board is changed from a low temperature to a high temperature and from a high temperature to a low temperature. The said inspection chamber is provided with a nozzle, The temperature of the said control board is changed by ejecting the air from which the temperature changes toward the said control board. The screening method according to claim 1. The screening method according to claim 13, wherein the air is low dew point air having a dew condensation temperature lower than a temperature of the control board at a low temperature. The screening method according to claim 13 or 14, wherein the inspection room includes a discharge port, and air supplied from the nozzle is discharged from the discharge port. The screening method according to any one of claims 13 to 15, wherein the air is supplied from a plurality of air jets arranged in a horizontal direction with respect to a control board provided in the nozzle. . The said control board consists of a mounting board | substrate with which various electronic components were mounted, The said nozzle is moved according to the mounting position of the said electronic component, The Claim 13 thru | or 16 characterized by the above-mentioned. Screening method. As the peripheral device, an input device that inputs a signal to the control board in an actual use state of the control board and an apparatus corresponding to an operation device that operates by an output signal output from the control board are connected to the control board. The screening method according to claim 10, wherein an inspection is performed as to whether or not the operation of the control board is normal in a state.

Images