JP2005125444A - Dressing device of polishing pad - Google Patents

Dressing device of polishing pad Download PDF

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Publication number
JP2005125444A
JP2005125444A JP2003362670A JP2003362670A JP2005125444A JP 2005125444 A JP2005125444 A JP 2005125444A JP 2003362670 A JP2003362670 A JP 2003362670A JP 2003362670 A JP2003362670 A JP 2003362670A JP 2005125444 A JP2005125444 A JP 2005125444A
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Prior art keywords
polishing pad
grindstone
diamond dresser
support arm
dressing
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Hirotaka Okonogi
弘孝 小此木
Masato Kikuchi
正人 菊地
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Okamoto Machine Tool Works Ltd
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Okamoto Machine Tool Works Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent tearing-off of a pad of a central part since a dresser bites in the central part of the polishing pad when dressing the polishing pad used for a polishing device by the dresser. <P>SOLUTION: This dressing device 1 can change a rocking speed of a dresser grinding wheel 2 on the polishing pad 200, by changing a rotating speed of a rotary shaft 10 by tooth meshing driving of a worm gear 11b and a worm wheel 11c by driving of an AC servomotor 11a, by rotatably arranging a support arm 6 on the rotary shaft 10, by moving the support arm 6 for supporting a spindle 3 for vertically journaling the dresser grinding wheel 2 in the longitudinal direction (the y axis direction). The device prevents biting-in of the dresser grinding wheel, by restraining abrasion in the polishing pad central part, by changing the rocking speed of the dresser grinding wheel on the polishing pad, so as to shorten a stagnant time of the dresser grinding wheel in the central part of the polishing pad and the outer peripheral vicinity of the polishing pad. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、半導体基板、ガラス基板、シリコンベアウエハ、セラミック基板等の基板の研磨装置に備えられている研磨パッド表面をダイヤモンドドレッサ砥石でドレッシングして研磨パッド面内を均一に磨耗させるドレッシング装置に関する。   The present invention relates to a dressing apparatus that uniformly wears a polishing pad surface by dressing a polishing pad surface provided in a polishing apparatus for a substrate such as a semiconductor substrate, a glass substrate, a silicon bare wafer, or a ceramic substrate with a diamond dresser grindstone. .

基板の研磨や化学機械研磨に用いられる研磨パッド表面をダイヤモンドドレッサ砥石で磨耗させるため、研磨パッドの中心を原点とし、研磨パッド外周近傍までダイヤモンドドレッサ砥石を研磨パッド面上で揺動するドレッシング装置が使用されている。   In order to wear the polishing pad surface used for substrate polishing and chemical mechanical polishing with a diamond dresser grindstone, there is a dressing device that swings the diamond dresser grindstone on the polishing pad surface from the center of the polishing pad to the vicinity of the periphery of the polishing pad. in use.

この研磨パッド表面をダイヤモンドドレッサ砥石でより均一に磨耗させるため、研磨パッドの中心(原点)と研磨パッド外周部近辺においてダイヤモンドドレッサ砥石の揺動速度を変化させることが提案されている。   In order to wear the polishing pad surface more uniformly with the diamond dresser grindstone, it has been proposed to change the rocking speed of the diamond dresser grindstone between the center (origin) of the polishing pad and the vicinity of the outer periphery of the polishing pad.

例えば、研磨パッドの回転方向とダイヤモンドドレッサ砥石の回転方向を同一方向とし、研磨パッドを第一の回転速度で回転させ、ダイヤモンドドレッサ砥石を第二の回転速度で回転させ、両者の回転速度比を互いに素である自然数mとnの比で表したときに、mとnの最小勾倍数が10以上であるように調整し、ダイヤモンドドレッサ砥石は研磨パッドの原点から外周までの範囲内で前後方向(y軸方向)にプラスマイナス8mmの単振動(揺動)動作をし、前記単振動動作の中心を前記単振動動作の開始点位置に一致して研磨を行う際に、ダイヤモンドドレッサ砥石の位置確認をドレッサ揺動速度調整機器で行いながら、ダイヤモンドドレッサ砥石が研磨パッドの外周付近にあるならば研磨パッドの磨耗を抑制するために揺動速度を速めて外周部からダイヤモンドドレッサ砥石を前後方向(y軸方向)に揺動させ、ダイヤモンドドレッサ砥石が研磨パッドの原点付近にあるならば研磨パッドの磨耗を促進するために揺動速度を遅くして中心部にダイヤモンドドレッサ砥石が長く停滞するようにドレッシングを行う方法が提案されている(例えば、特許文献1参照。)。   For example, the rotation direction of the polishing pad and the rotation direction of the diamond dresser grindstone are the same direction, the polishing pad is rotated at a first rotation speed, the diamond dresser grindstone is rotated at a second rotation speed, and the rotation speed ratio between the two is set. When expressed as a ratio of the prime natural numbers m and n, the minimum slope multiple of m and n is adjusted to 10 or more, and the diamond dresser grindstone is back and forth within the range from the origin of the polishing pad to the outer periphery. When performing a single vibration (oscillation) operation of plus or minus 8 mm (in the y-axis direction) and polishing with the center of the single vibration operation being coincident with the starting point position of the single vibration operation, the position of the diamond dresser grindstone While checking with the dresser rocking speed adjusting device, if the diamond dresser grinding wheel is near the outer periphery of the polishing pad, increase the rocking speed to suppress the wear of the polishing pad. The diamond dresser grindstone is swung in the front-rear direction (y-axis direction) from the outer periphery, and if the diamond dresser grindstone is near the origin of the polishing pad, the rocking speed is slowed down to promote the wear of the polishing pad. A method of performing dressing so that the diamond dresser grindstone stays long has been proposed (for example, see Patent Document 1).

また、ドレッサの揺動を行なわず、研磨パッドの回転数とダイヤモンドドレッサ砥石の回転数および、研磨パッドへかかるダイヤモンドドレッサ砥石の圧力を制御してドレッシングを行うことも提案されている。具体的には、研磨パッドの回転方向とダイヤモンドドレッサ砥石の回転方向を同一方向とし、式 DRRmin<kxPxV<DRRmax
(但し、DRRminは切削レ−トの下限値であり、DRRmaxは切削レ−トの上限値であり、kは実験により定まる定数であり、Pはドレッシング圧力であり、Vはドレッシングの相対速度である。)に基づいてドレッシングの圧力とドレッシングの相対速度との積の範囲を求める手段と、
前記積の範囲内で作業者が設定するドレッシングの圧力に基づいてダイヤモンドドレッサ砥石を研磨パッドに接近させる加圧力を制御する手段と、
前記積の範囲内で作業者が設定するドレッシングの相対速度に基づいて研磨パッドの回転速度およびダイヤモンドドレッサ砥石の回転速度を制御する手段とを備えるドレッシング装置が提案されている(例えば、特許文献2参照。)。
特開2000−761号公報 特開2003−257913号公報
It has also been proposed to perform dressing without swinging the dresser by controlling the rotational speed of the polishing pad, the rotational speed of the diamond dresser grindstone, and the pressure of the diamond dresser grindstone applied to the polishing pad. Specifically, the rotation direction of the polishing pad and the rotation direction of the diamond dresser grindstone are the same direction, and the formula DRR min <kxPxV <DRR max
(However, DRR min is the lower limit value of the cutting rate, DRR max is the upper limit value of the cutting rate, k is a constant determined by experiment, P is the dressing pressure, and V is the relative dressing rate. Means for determining the range of the product of the dressing pressure and the relative dressing speed based on
Means for controlling the pressure applied to bring the diamond dresser grindstone closer to the polishing pad based on the dressing pressure set by the operator within the range of the product;
There has been proposed a dressing device including means for controlling the rotational speed of the polishing pad and the rotational speed of the diamond dresser grinding wheel based on the relative speed of the dressing set by the operator within the range of the product (for example, Patent Document 2). reference.).
JP 2000-761 A JP 2003-257913 A

前記特許文献1に記載されるドレッシング方法では、ダイヤモンドドレッサ砥石が研磨パッドの中心(原点)付近にあるならば研磨パッドの磨耗を促進するために揺動速度を遅くして中心部にダイヤモンドドレッサ砥石が長く停滞するようにドレッシングを行うため、研磨パッドの中心(原点)部分が磨耗されすぎてダイヤモンドドレッサ砥石が研磨パッドの中心において噛み込みすぎ、研磨パッドより離れにくくなるか、研磨パッド中央部分を捲り取ってしまう欠点がある。また、ダイヤモンドドレッサ砥石は直線状に前後方向に揺動されるため、ドレッシング後のドレス砥石を洗浄するには砥石洗浄機構の砥石洗浄槽を研磨パッドの外周外であってダイヤモンドドレッサ砥石の直線進退方向に設置しなければならず、ドレッシング装置のフットプリントが大きくなる。   In the dressing method described in Patent Document 1, if the diamond dresser grindstone is near the center (origin) of the polishing pad, the rocking speed is slowed down to promote the wear of the polishing pad, and the diamond dresser grindstone at the center Since the dressing is performed so that the stagnation is long, the center (origin) part of the polishing pad is worn too much, and the diamond dresser grindstone is too bite at the center of the polishing pad, making it difficult to separate from the polishing pad, There is a fault that scavenges. Also, since the diamond dresser grindstone is swung back and forth in a straight line, in order to clean the dressing grindstone after dressing, the grindstone washing tank of the grindstone washing mechanism is placed outside the outer periphery of the polishing pad and the diamond dresser grindstone is moved forward and backward. It must be installed in the direction, increasing the footprint of the dressing device.

前記特許文献2に記載される加圧力と切削速度の積の相関から作業者が条件を設定してドレッシングを行う方法は、理論上は正しいかも知れぬが、現実的には、研磨される基板の種類、パッド径、パッド素材、ダイヤモンドドレッサ砥石径等の条件によって切削速度が大きくことなるため、ドレス最適条件を作業者が求めるに2〜3週間前後要してしまう。また、該特許文献2にはダイヤモンドドレッサ砥石の洗浄機構については何等記載がなされていない。本発明は、研磨パッドの中央部でのダイヤモンドドレッサ砥石の噛み込みがなくドレッシングを行うことができるフットプリントの小さいドレッシング装置を提供するものである。   The method of performing dressing by setting the conditions from the correlation between the product of the applied pressure and the cutting speed described in Patent Document 2 may be theoretically correct, but in reality, the substrate to be polished The cutting speed depends on conditions such as the type, pad diameter, pad material, diamond dresser grindstone diameter, etc., so it takes about two to three weeks for the operator to find the optimum dress condition. Further, Patent Document 2 does not describe anything about the cleaning mechanism of the diamond dresser grindstone. The present invention provides a dressing apparatus with a small footprint that can perform dressing without biting a diamond dresser grindstone at the center of a polishing pad.

請求項1の発明は、水平方向に回転可能な研磨定盤の上面に貼付した研磨パッド、ダイヤモンドドレッサ砥石、前記研磨パッドの中心を原点として直交するxyz3次元座標に対し、該ダイヤモンドドレッサ砥石を鉛直方向(z軸方向)に軸承するスピンドル、該スピンドルの回転機構、該スピンドルを鉛直方向(z軸方向)に昇降し、ダイヤモンドドレッサを前記研磨パッドに押圧するもしくは研磨パッドより遠ざける昇降機構、前記回転機構および昇降機構を支持する支持ア−ム、該支持ア−ムを固定するスライダを前後方向(y軸方向)に延びるリニアガイド上に滑走させる直線移動機構、該直線移動機構のリニアガイドを軸承する回転軸、および、前記研磨パッドとダイヤモンドドレッサ砥石の軸芯を同心とした位置を揺動原点としてACサ−ボモ−タの駆動によりウオ−ムギヤとウオ−ムホイ−ルとの歯噛み合わせで前記回転軸の回転速度を変化させることにより研磨パッド上でのダイヤモンドドレッサ砥石の揺動速度を変化させる支持ア−ム旋回揺動機構、とを備えることを特徴とする研磨パッドのドレッシング装置を提供するものである。   According to the first aspect of the present invention, a polishing pad, a diamond dresser grindstone affixed to the upper surface of a polishing surface plate that can be rotated in the horizontal direction, and the diamond dresser grindstone vertically Spindle bearing in the direction (z-axis direction), rotating mechanism of the spindle, elevating mechanism for raising and lowering the spindle in the vertical direction (z-axis direction) and pressing the diamond dresser against the polishing pad or away from the polishing pad, the rotation A support arm that supports the mechanism and the lifting mechanism, a linear movement mechanism that slides a slider that fixes the support arm on a linear guide extending in the front-rear direction (y-axis direction), and a linear guide of the linear movement mechanism And the position where the axis of the polishing pad and the diamond dresser grindstone are concentric is the origin of oscillation. Support for changing the rocking speed of the diamond dresser wheel on the polishing pad by changing the rotational speed of the rotating shaft by meshing the worm gear and worm wheel by driving the AC servo motor. The present invention provides a dressing device for a polishing pad, comprising: an arm turning swing mechanism.

請求項2の発明は、前記ドレッシング装置は、研磨パッドの中心を通過する前後方向(y軸方向)に平行な支持ア−ムの中心線と支持ア−ム旋回揺動機構の回転軸の軸芯とを結ぶ支持ア−ムの待機位置の支持ア−ムに対して下方の位置に砥石洗浄槽がベ−スに固定されて設けられ、ダイヤモンドドレッサ砥石を軸承するスピンドルを直線移動機構の駆動により前後方向(y軸方向)に移動させて砥石洗浄槽上に位置させ、ついで、昇降機構によりスピンドルを下降してダイヤモンドドレッサ砥石を砥石洗浄槽内に貯蔵されている洗浄液に浸漬し、ダイヤモンドドレッサ砥石の回転によりダイヤモンドドレッサ砥石に付着した異物を除去する砥石洗浄機構を更に備えることを特徴とする。   According to a second aspect of the present invention, the dressing device includes a center line of a support arm that passes through the center of the polishing pad and is parallel to the front-rear direction (y-axis direction), and an axis of a rotation shaft of the support arm swivel swing mechanism. A grinding wheel cleaning tank is fixed to the base at a position below the support arm at the standby position of the support arm that connects the core, and the spindle that supports the diamond dresser grinding wheel drives the linear movement mechanism. Is moved in the front-rear direction (y-axis direction) to be positioned on the grindstone washing tank, and then the spindle is lowered by an elevating mechanism so that the diamond dresser grindstone is immersed in the washing liquid stored in the grindstone washing tank. It is further provided with a grindstone cleaning mechanism for removing foreign matter adhering to the diamond dresser grindstone by the rotation of the grindstone.

研磨パッド上でのダイヤモンドドレッサ砥石(ドレッサ)の揺動を直線方向でなく、時計の振り子の振幅のような軌跡で行うことができ、しかも各ドレッシング位置において最適な揺動速度を減速機付ACサ−ボモ−タの駆動で最高20段階までの複数段変化させることができるドレッシング装置である。   The diamond dresser grindstone (dresser) can be swung on the polishing pad not in a linear direction but with a trajectory like the amplitude of the pendulum of the watch, and the optimum rocking speed can be achieved at each dressing position. This is a dressing device capable of changing a plurality of stages up to 20 stages by driving a servo motor.

ダイヤモンドドレッサ砥石の加速度を変える回数sを6〜20の整数回採れるので、研磨パッドの中心およびドレッサ砥石待機位置近傍でのダイヤモンドドレッサ砥石の揺動速度を大きくすることによりその場所での停滞時間が短いので、研磨パッドの中心部にダイヤモンドドレッサ砥石が噛み込んで研磨パッドの中心部を破損させることはない。   Since the number of times s for changing the acceleration of the diamond dresser grinding wheel can be an integer of 6 to 20, the stagnation time at the location can be increased by increasing the rocking speed of the diamond dresser grinding wheel near the center of the polishing pad and the dresser grinding wheel standby position. Because it is short, the diamond dresser grindstone will not bite into the center of the polishing pad and damage the center of the polishing pad.

ダイヤモンドドレッサ砥石を洗浄する洗浄機構は、研磨パッドの外周外側であって、ダイヤモンドドレッサ砥石を支持する支持ア−ムのスライダの直線移動方向(前後方向のy軸方向)に位置するので、ドレッシング装置にコンパクトに納まり、フットプリントを大きくすることはない。   The cleaning mechanism for cleaning the diamond dresser grindstone is located outside the outer periphery of the polishing pad and in the linear movement direction (the y-axis direction in the front-rear direction) of the slider of the support arm that supports the diamond dresser grindstone. It fits compactly and does not increase the footprint.

(実施例)
以下、図を用いて本発明をさらに詳細に説明する。
図1は本発明のドレッシング装置を示す全体図、図2は研磨定盤の横に据え付けられた本発明のドレッシング装置の平面図、図3は本発明のドレッシング装置の一部を欠いた右側面図、図4はドレッシング装置のスピンドル回転機構と昇降機構と支持ア−ム移動機構を示す図2におけるI−I切断線で切断された断面図、図5は図4で示されるドレッシング装置の左側面図、図6は支持ア−ム旋回揺動機構の正面図、図7は支持ア−ム旋回揺動機構の左側面図、および図8は支持ア−ム旋回揺動機構の断面図で、図6におけるII−II切断線で切断された断面図である。
(Example)
Hereinafter, the present invention will be described in more detail with reference to the drawings.
1 is an overall view showing the dressing apparatus of the present invention, FIG. 2 is a plan view of the dressing apparatus of the present invention installed on the side of the polishing surface plate, and FIG. 3 is a right side view of the dressing apparatus of the present invention which is partially omitted. FIG. 4, FIG. 4 is a sectional view taken along the II cutting line in FIG. 2 showing the spindle rotating mechanism, lifting mechanism and support arm moving mechanism of the dressing apparatus, and FIG. 5 is the left side of the dressing apparatus shown in FIG. 6 is a front view of the support arm swivel swing mechanism, FIG. 7 is a left side view of the support arm swivel swing mechanism, and FIG. 8 is a cross-sectional view of the support arm swivel swing mechanism. FIG. 7 is a cross-sectional view taken along the line II-II in FIG. 6.

図1、図2、図3に示すドレッシング装置1において、100はベ−ス、101は台車、200は研磨パッド、300は制御盤、2はダイヤモンドドレッサ砥石(電着ダイヤモンドディスク)、3はスピンドルで、前記ダイヤモンドドレッサ砥石を鉛直方向(z軸方向)に軸承する。4はスピンドルの回転機構で、サ−ボモ−タ4a、回転軸4b、およびプ−リ−4cより構成される。サ−ボモ−タ4aの駆動によりダイヤモンドドレッサ砥石2を軸承するスピンドル3は水平方向に20〜200rpm回転する。   1, 2, and 3, 100 is a base, 101 is a carriage, 200 is a polishing pad, 300 is a control panel, 2 is a diamond dresser grinding wheel (electrodeposited diamond disk), and 3 is a spindle The diamond dresser grindstone is supported in the vertical direction (z-axis direction). Reference numeral 4 denotes a spindle rotation mechanism, which includes a servo motor 4a, a rotation shaft 4b, and a pulley 4c. The spindle 3 bearing the diamond dresser grindstone 2 is rotated by 20 to 200 rpm in the horizontal direction by driving the servo motor 4a.

5はスピンドルの昇降機構で、エアシリンダ5a、空気供給管5b、一次空気圧力確認センサを構成するフィルタ−レギュレ−タ5cと電子式圧力スイッチ5d、ドレッシング砥石上下用電磁弁5e、電空レギュレ−タ5f、圧力計5g、ドレッシング砥石上昇端確認センサ5h、有接点オ−トスイッチ5i、電子式圧力スイッチ5j、圧力計5k、ドレッシング砥石上昇端確認センサ5l、有接点オ−トスイッチ5mを備える。エアシリンダ5aの筒上部に圧空が導入されるとロッド5nが下降し、スピンドル3を固定するフレ−ム5pを押し下げる。エアシリンダ5aの筒下部に圧空が導入されるとロッド5nが上昇し、スピンドル3を固定するフレ−ム5pを押し上げる。電空レギュレ−タ5fは、スピンドル3を鉛直方向(z軸方向)に下降し、ダイヤモンドドレッサ砥石2を研磨パッド200に押圧する際のドレッシング圧力の大きさ(0〜0.49Mpa)を調整する。ドレッシング砥石2の最大上下移動量は50mmで十分である。   Reference numeral 5 denotes a spindle lifting mechanism, an air cylinder 5a, an air supply pipe 5b, a filter regulator 5c and an electronic pressure switch 5d constituting a primary air pressure confirmation sensor, an electromagnetic valve 5e for raising and lowering a dressing grindstone, and an electropneumatic regulator. 5f, pressure gauge 5g, dressing grindstone rising end confirmation sensor 5h, contact point auto switch 5i, electronic pressure switch 5j, pressure gauge 5k, dressing grindstone rising end confirmation sensor 5l, contact point auto switch 5m. . When pressurized air is introduced into the upper part of the cylinder of the air cylinder 5a, the rod 5n descends and pushes down the frame 5p for fixing the spindle 3. When the compressed air is introduced into the lower part of the air cylinder 5a, the rod 5n rises and pushes up the frame 5p for fixing the spindle 3. The electropneumatic regulator 5f adjusts the magnitude of dressing pressure (0 to 0.49 Mpa) when the spindle 3 is lowered in the vertical direction (z-axis direction) and the diamond dresser grindstone 2 is pressed against the polishing pad 200. . A maximum moving amount of the dressing grindstone 2 of 50 mm is sufficient.

6は支持(旋回)ア−ムで、前記回転機構4および昇降機構5を支持する。7はスライダで前記支持ア−ム6を固定する。8は直線移動機構で前記スライダ7を前後方向(y軸方向)に延びるリニアガイド9上に滑走させる。直線移動機構8は、エアシリンダ8a、前述のスライダ7、リニアガイド9、空気供給管5b、スピンドル前後電磁弁8b、有接点オ−トスイッチ8c、ドレッシングスピンドル後退端確認センサ8e、、ドレッシングスピンドル前進端確認センサ8f、および有接点オ−トスイッチ8dよりなる。   Reference numeral 6 denotes a support (swing) arm that supports the rotating mechanism 4 and the lifting mechanism 5. Reference numeral 7 denotes a slider for fixing the support arm 6. A linear moving mechanism 8 slides the slider 7 on a linear guide 9 extending in the front-rear direction (y-axis direction). The linear moving mechanism 8 includes an air cylinder 8a, the slider 7, the linear guide 9, the air supply pipe 5b, the spindle front / rear solenoid valve 8b, the contact auto switch 8c, the dressing spindle backward end confirmation sensor 8e, and the dressing spindle advance. It consists of an end confirmation sensor 8f and a contact auto switch 8d.

10は回転軸で、前記直線移動機構8のリニアガイド9を軸承する。回転軸10は研磨パッド200の中心(O)とダイヤモンドドレッサ砥石2の軸芯を同心とした位置を揺動原点(O)として旋回揺動機構11のACサ−ボモ−タ11aの駆動により時計の振り子の振幅の軌跡のように揺動する。旋回揺動機構11は、ACサ−ボモ−タ11a、ウオ−ムギヤ11b、ウオ−ムホイ−ル11c、旋回軸原点センサ11d、旋回軸+側OTセンサ11e、旋回軸−側OTセンサ11fを備える。旋回軸原点は、図2において、水平方向に回転可能な研磨定盤の上面に貼付した前記研磨パッド200の中心とダイヤモンドドレッサ砥石2の軸芯を同心とした揺動原点位置Oである。旋回軸+側は、図2において、研磨パッド200の中心点を原点Oとして直交するxyz3次元座標に対し、該ダイヤモンドドレッサ砥石2の旋回ア−ムを仮想線で6’で図面の前後方向に示したスピンドル3の軸芯(+OT)の位置である。   Reference numeral 10 denotes a rotation shaft, which supports the linear guide 9 of the linear movement mechanism 8. The rotary shaft 10 is driven by the AC servo motor 11a of the swivel rocking mechanism 11 with the position where the center (O) of the polishing pad 200 and the axis of the diamond dresser grindstone 2 are concentric as the rocking origin (O). It swings like a trajectory of the amplitude of the pendulum. The swing swing mechanism 11 includes an AC servo motor 11a, a worm gear 11b, a worm wheel 11c, a swing axis origin sensor 11d, a swing axis + side OT sensor 11e, and a swing axis-side OT sensor 11f. . In FIG. 2, the pivot axis origin is a swing origin position O in which the center of the polishing pad 200 affixed to the upper surface of the polishing surface plate that can rotate in the horizontal direction and the axis of the diamond dresser grindstone 2 are concentric. The swivel axis + side in FIG. 2 indicates the swivel arm of the diamond dresser grindstone 2 in the anteroposterior direction 6 ′ with respect to the xyz three-dimensional coordinates orthogonal with the center point of the polishing pad 200 as the origin O in the longitudinal direction of the drawing. This is the position of the axis (+ OT) of the spindle 3 shown.

旋回揺動機構11は、1/20減速機付オシレ−ション用ACサ−ボモ−タ11aの駆動によりウオ−ムギヤ11bとウオ−ムホイ−ル11cとの歯噛み合わせで前記回転軸10の回転速度を変化させることにより研磨パッド200上でのダイヤモンドドレッサ砥石2の揺動速度を変化させる。ACサ−ボモ−タ11aの定格出力は400W、定格回転数は3000rpm、最大回転数は4500rpmである。   The swing swing mechanism 11 is driven by an AC servo motor 11a for oscillation with a 1/20 speed reducer, and the rotational speed of the rotary shaft 10 is engaged with the teeth of the worm gear 11b and the worm wheel 11c. Is changed, the rocking speed of the diamond dresser grindstone 2 on the polishing pad 200 is changed. The AC servo motor 11a has a rated output of 400 W, a rated rotational speed of 3000 rpm, and a maximum rotational speed of 4500 rpm.

ウオ−ム減速機は1/93、総減速比は1/1860、ACサ−ボモ−タ11aの回転数が3000rpm回転時の回転数は1.6129rpm、ア−ム6の旋回半径が990mmおよびACサ−ボモ−タ11aが3000rpm回転のときの周速度は10032.80mm/分、ACサ−ボモ−タ11aの1回転時の移動量は3.344mmと計算される。ACサ−ボモ−タ11aが2900rpm回転のときの速送り速度は10000mm/分、送り速度範囲は線速度で100〜5000mm/分の範囲が可能で、速度は50〜5000mm/分の範囲が可能で、ACサ−ボモ−タ11aが29.9rpm回転のときの送り速度は100mm/分、ACサ−ボモ−タ11aが1495.2rpm回転のときの送り速度は5000mm/分と計算される。揺動座標単位は0.1mmである。   The worm speed reducer is 1/93, the total reduction ratio is 1/1860, the rotation speed of the AC servo motor 11a is 3000 rpm, the turning radius of the arm 6 is 990 mm, The peripheral speed when the AC servo motor 11a rotates at 3000 rpm is calculated to be 10032.80 mm / min, and the movement amount of the AC servo motor 11a at one rotation is calculated as 3.344 mm. When the AC servo motor 11a rotates at 2900 rpm, the fast feed speed can be 10000 mm / min, the feed speed range can be 100 to 5000 mm / min linear speed, and the speed can be 50 to 5000 mm / min. Thus, the feed rate when the AC servo motor 11a rotates at 29.9 rpm is calculated as 100 mm / min, and the feed rate when the AC servo motor 11a rotates at 1495.2 rpm is calculated as 5000 mm / min. The swing coordinate unit is 0.1 mm.

ダイヤモンドドレッサ砥石2による研磨パッド200のドレッシングは、研磨パッド上でダイヤモンドドレッサ砥石を振り子の振幅のような軌跡で行う。この際、原点Oと待機位置(+OT)に近い研磨パッド外周近傍上(図2で示すP点)間の各ドレッシング位置において最適な揺動速度を減速機付ACサ−ボモ−タの駆動で加減速する。加速および減速する段階数をs段階と定め、そのときどきの揺動速度をαiとし、研磨パッド200の外周外の待機位置(+OT)にあるダイヤモンドドレッサ砥石を上昇させ、回転軸10を旋回して研磨パッドの中心(原点O)上に移動させ、ついで、ダイヤモンドドレッサ砥石を下降させて研磨パッドに圧接し、研磨パッドの中心から研磨マッドのドレス終点位置Pまでの距離間、揺動速度を変えながら揺動する。揺動速度は、研磨パッドの磨耗を抑制するために原点Oから一気に加速し、研磨パッドの原点より少し離れた10〜50mmの距離揺動して最高の加速度αに達しさせ、ついで研磨パッドの磨耗を増加するために揺動速度を減速αし、ダイヤモンドドレッサ砥石を振り子の弧状に旋回させる揺動速度α〜αr-2を加速度数回増減させながら行って研磨パッドのドレス終点Pより5〜10mm近傍の距離までダイヤモンドドレッサ砥石を揺動させ、ダイヤモンドドレッサ砥石が研磨パッドのドレス終点P付近にあるその位置からは研磨パッドの磨耗を抑制するためにダイヤモンドドレッサ砥石の揺動速度αr-1を一気に高めてダイヤモンドドレス砥石の軸芯をす速く研磨パッドのドレス終点Pへと揺動し、ダイヤモンドドレッサ砥石の軸芯が研磨パッドのドレス終点Pに到ったときは揺動速度αが0mm/分となるよう減速する。揺動は1回でよいが、2度以上繰り返すときは、ダイヤモンドドレッサ砥石の軸芯が研磨パッドのドレス終点Pに達したら、そこで、ACサ−ボモ−タの回転軸の回転方向を逆にし、研磨パッドの原点方向に移動できるようにする。 The dressing of the polishing pad 200 with the diamond dresser grindstone 2 is performed on a trajectory such as the amplitude of the pendulum on the polishing pad. At this time, the AC servo motor with a reduction gear is driven at an optimum swing speed at each dressing position between the origin O and the vicinity of the outer periphery of the polishing pad close to the standby position (+ OT) (point P shown in FIG. 2). Accelerate and decelerate. The number of stages to be accelerated and decelerated is defined as s stages, the swing speed at that time is αi, the diamond dresser grindstone at the standby position (+ OT) outside the outer periphery of the polishing pad 200 is raised, and the rotary shaft 10 is turned. Move to the center (origin O) of the polishing pad, then lower the diamond dresser grindstone and press against the polishing pad, changing the rocking speed during the distance from the center of the polishing pad to the dressing end point P of the polishing mud. Swing while. Oscillation speed is suddenly accelerated from the origin O in order to suppress the wear of the polishing pad, then peaked at the acceleration alpha 1 and distance swung a little away 10~50mm from the origin of the polishing pad, then the polishing pad the swing speed in order to increase the wear reduction alpha 2 and the dress end point of the polishing pad so while the oscillation speed α 3r-2 to pivot the diamond dresser grindstone arcuate pendulum increasing or decreasing acceleration several times The diamond dresser grindstone is swung to a distance of about 5 to 10 mm from P, and the rocking speed of the diamond dresser grindstone is used to suppress wear of the polishing pad from the position where the diamond dresser grindstone is near the dress end point P of the polishing pad. a stretch enhance alpha r-1 swings to dress the end point P of be faster polishing pad the axis of the diamond dressing grinding stone, the axis of the diamond dresser grindstone There is decelerated so that the swing speed alpha s is 0 mm / min when he reached the dress end point P of the polishing pad. However, if the axis of the diamond dresser grindstone reaches the dressing end point P of the polishing pad, the rotation direction of the rotating shaft of the AC servo motor is reversed. It is possible to move toward the origin of the polishing pad.

研磨パッドのドレス終点POから研磨パッドの原点Oへの復(帰り)のダイヤモンドドレッサ砥石の揺動は、往きの加速度の絶対値にプラスマイナスの符号を往きとは逆にして加減速し、前記揺動速度α、αs−1、αs−2、……α、α、αの揺動速度でダイヤモンドドレッサ砥石を旋回揺動させ、研磨パッドの原点にダイヤモンドドレッサ砥石の軸芯位置を一致させて1往復の揺動を行うことができる。 The rocking of the diamond dresser grindstone returning (returning) from the dressing end point PO of the polishing pad to the origin O of the polishing pad accelerates or decelerates the absolute value of the forward acceleration with a plus or minus sign opposite to that of the forward, The diamond dresser grindstone is swung and swung at rocking speeds α s , α s-1 , α s-2 ,... Α 3 , α 2 , α 1 , and the axis of the diamond dresser grindstone is set at the origin of the polishing pad. The reciprocal rocking can be performed by matching the core positions.

ダイヤモンドドレッサ砥石の加速度を変える回数sを6〜20の整数回採れるので、どれか1つの揺動速度の選択が誤っていても、他の揺動速度の調整により容易に補足できるので、実験により各揺動速度を容易に選定できる。また、研磨パッド原点位置でのダイヤモンドドレッサ砥石の停滞時間が短いので、研磨パッドの中心部にダイヤモンドドレッサ砥石が噛み込んで研磨パッドの中心部を破損させることはない。   Since the number of times s to change the acceleration of the diamond dresser grindstone can be an integer of 6 to 20, even if one of the rocking speeds is selected incorrectly, it can be easily supplemented by adjusting the other rocking speed. Each swing speed can be easily selected. Further, since the stagnation time of the diamond dresser grindstone at the polishing pad origin position is short, the diamond dresser grindstone does not bite into the center portion of the polishing pad and damage the center portion of the polishing pad.

例えば、直径が200mm、回転数50rpmのダイヤモンドドレッサ砥石を用い、ウエハを研磨加工した直径1010mm、回転数400rpmの研磨パッドを揺動幅330mmの条件でドレッシングする際、研磨パッド原点Oおよび研磨パッドのドレス終点P(外周縁より70mm)のダイヤモンドドレッサ砥石揺動速度を0mm/分とし、研磨パッド原点O位置から研磨パッドの外周に向けて20mmまでの揺動距離はダイヤモンドドレッサ砥石揺動速度(線速度)9000mm/分、20を越え50mmまでを揺動速度(線速度)5000mm/分、50を越え100mmまでを揺動速度(線速度)100mm/分、100を越え150mmまでを1000mm/分、150を越え250mmまでを揺動速度(線速度)3000mm/分、250を越え270mmまでを揺動速度(線速度)9000mm/分、P点に達したら揺動速度(線速度)0mm/分とする。   For example, when a diamond dresser grindstone having a diameter of 200 mm and a rotation speed of 50 rpm is used, and a polishing pad having a diameter of 1010 mm and a rotation speed of 400 rpm obtained by polishing a wafer is dressed under the condition of an oscillation width of 330 mm, the polishing pad origin O and the polishing pad The rocking speed of the diamond dresser grindstone at the dress end point P (70 mm from the outer periphery) is 0 mm / min, and the rocking distance from the polishing pad origin O position to the outer periphery of the polishing pad is 20 mm. Speed) 9000 mm / min, over 20 to 50 mm, swing speed (linear speed) 5000 mm / min, over 50 to 100 mm, swing speed (linear speed) 100 mm / min, over 100 to 150 mm, 1000 mm / min, Swing speed (linear speed) 3000mm from 150 to 250mm Min, until 270mm beyond the 250 rocking speed (linear velocity) 9000 mm / min, and rocking speed (linear speed) 0 mm / minute reaches the point P.

ダイヤモンドドレッサ砥石2の洗浄は洗浄機構12により行なわれる。図1乃至図3に示すように、前記ドレッシング装置1は、ダイヤモンドドレッサ砥石2を洗浄する砥石洗浄機構12を備える。この砥石洗浄機構12は、洗浄槽12a、洗浄液供給管12b、洗浄液供給電磁弁(この電磁弁は空気操作管5bを間接作動する)12c、空気操作バルブ12dおよび開閉弁12fを備える。砥石洗浄槽12aは、研磨パッド200の中心Oを通過する前後方向(y軸方向)に平行な待機位置(+OT)に位置する支持ア−ム6’の中心線と回転軸10の軸芯とを結ぶ支持ア−ム下方の位置にベ−ス100より延長された支持体12gにより固定されている。   The diamond dresser grindstone 2 is cleaned by the cleaning mechanism 12. As shown in FIGS. 1 to 3, the dressing apparatus 1 includes a grindstone cleaning mechanism 12 that cleans the diamond dresser grindstone 2. The grindstone cleaning mechanism 12 includes a cleaning tank 12a, a cleaning liquid supply pipe 12b, a cleaning liquid supply electromagnetic valve (this electromagnetic valve indirectly operates the air operation pipe 5b) 12c, an air operation valve 12d, and an opening / closing valve 12f. The grindstone cleaning tank 12 a includes a center line of the support arm 6 ′ located at the standby position (+ OT) parallel to the front-rear direction (y-axis direction) passing through the center O of the polishing pad 200, and the axis of the rotary shaft 10. Are fixed by a support 12g extended from the base 100 at a position below the support arm connecting the two.

制御盤300は、スピンドル回転数、原点、揺動回数、各位置の揺動速度、ドレッサの開始位置、ドレスの完了位置、現在位置、およびドレッサの加圧力を入力設定する操作パネル、ドレッサ砥石の現在値を示す揺動座標表示パネルを備える。   The control panel 300 includes an operation panel for inputting and setting the spindle rotation speed, the origin, the number of swings, the swing speed at each position, the dresser start position, the dressing completion position, the current position, and the dresser pressurizing force. A rocking coordinate display panel indicating the current value is provided.

直線移動機構8のエア−シリンダ8aの駆動によりダイヤモンドドレッサ砥石2を前後方向(y軸方向)に移動させて砥石洗浄槽12a上に位置させ、ついで、昇降機構5によりスピンドル3を下降してダイヤモンドドレッサ砥石2を砥石洗浄槽12a内に貯蔵されている洗浄液に浸漬し、ダイヤモンドドレッサ砥石の20〜200rpmの回転によりダイヤモンドドレッサ砥石に付着した異物を除去する。   The diamond dresser grindstone 2 is moved in the front-rear direction (y-axis direction) by driving the air cylinder 8a of the linear movement mechanism 8 to be positioned on the grindstone washing tank 12a, and then the spindle 3 is lowered by the elevating mechanism 5 to bring the diamond The dresser grindstone 2 is immersed in a cleaning solution stored in the grindstone cleaning tank 12a, and foreign matter adhering to the diamond dresser grindstone is removed by rotation of the diamond dresser grindstone at 20 to 200 rpm.

本発明の研磨パッドのドレッシング装置は、研磨パッド上でのドレッサ砥石の揺動速度を多段に変化させることができるので、研磨パッドの中心点および外周近傍位置でのドレッサ砥石の停滞時間を短くすることにより研磨パッドの磨耗の程度を少なくし、研磨パッド上でのドレッサ砥石の移動を容易としたので、従来のドレッシングで生じていたドレッサ砥石が研磨パッドに噛み込んで離れないという現象は生じない。また、ドレッサ砥石の揺動を時計の振り子の軌跡とし、ドレッサ砥石の洗浄機構を振り子の軌跡の延長上であって研磨パッドの外に設けたので、ドレッシング装置をコンパクトにすることができた。   The dressing apparatus for the polishing pad according to the present invention can change the rocking speed of the dresser grindstone on the polishing pad in multiple stages, thereby shortening the stagnation time of the dresser grindstone at the center point and the vicinity of the outer periphery of the polishing pad. This reduces the degree of wear of the polishing pad and facilitates the movement of the dresser grindstone on the polishing pad, so that the phenomenon that the dresser grindstone that occurs in the conventional dressing does not bite into the polishing pad and does not leave does not occur. . Further, since the swing of the dresser grindstone is the trajectory of the pendulum of the watch, and the cleaning mechanism of the dresser grindstone is provided outside the polishing pad on the extension of the trajectory of the pendulum, the dressing apparatus can be made compact.

本発明のドレッシング装置を示す全体図である。It is a general view which shows the dressing apparatus of this invention. 研磨定盤の横に据え付けられた本発明のドレッシング装置の平面図である。It is a top view of the dressing apparatus of this invention installed beside the polishing surface plate. 本発明のドレッシング装置の一部を欠いた右側面図である。It is a right view which lacked a part of dressing device of the present invention. ドレッシング装置のスピンドル回転機構と昇降機構と支持ア−ム移動機構を示す図2におけるI−I切断線で切断された断面図である。It is sectional drawing cut | disconnected by the II cutting | disconnection line in FIG. 2 which shows the spindle rotating mechanism of the dressing apparatus, a raising / lowering mechanism, and a support arm moving mechanism. 図4で示されるドレッシング装置の左側面図である。It is a left view of the dressing apparatus shown by FIG. 支持ア−ム旋回揺動機構の正面図である。It is a front view of a support arm turning rocking mechanism. 支持ア−ム旋回揺動機構の左側面図である。It is a left view of a support arm turning rocking mechanism. 支持ア−ム旋回揺動機構の断面図で、図6におけるII−II切断線で切断された断面図である。It is sectional drawing of a support arm turning rocking | fluctuation mechanism, and is sectional drawing cut | disconnected by the II-II cutting line in FIG.

符号の説明Explanation of symbols

1 ドレッシング装置
100 ベ−ス
200 研磨パッド
O 原点
300 制御盤
2 ダイヤモンドドレッサ砥石
3 スピンドル
4 スピンドル回転機構
5 スピンドル昇降機構
6 支持(旋回)ア−ム
8 直線移動機構
9 玉軸受
10 回転軸
11 旋回揺動機構
11a ACサ−ボモ−タ
11b ウオ−ムギヤ11b
11c ウオ−ムホイ−ル
12 砥石洗浄機構
DESCRIPTION OF SYMBOLS 1 Dressing apparatus 100 Base 200 Polishing pad O Origin 300 Control board 2 Diamond dresser grindstone 3 Spindle 4 Spindle rotation mechanism 5 Spindle raising / lowering mechanism 6 Support (turning) arm 8 Linear movement mechanism 9 Ball bearing 10 Rotating shaft 11 Turning rocking Motion mechanism 11a AC servo motor 11b Worm gear 11b
11c Worm Wheel 12 Grinding Wheel Cleaning Mechanism

Claims (2)

水平方向に回転可能な研磨定盤の上面に貼付した研磨パッド、ダイヤモンドドレッサ砥石、前記研磨パッドの中心を原点として直交するxyz3次元座標に対し、該ダイヤモンドドレッサ砥石を鉛直方向(z軸方向)に軸承するスピンドル、該スピンドルの回転機構、該スピンドルを鉛直方向(z軸方向)に昇降し、ダイヤモンドドレッサを前記研磨パッドに押圧するもしくは研磨パッドより遠ざける昇降機構、前記回転機構および昇降機構を支持する支持ア−ム、該支持ア−ムを固定するスライダを前後方向(y軸方向)に延びるリニアガイド上に滑走させる直線移動機構、該直線移動機構のリニアガイドを軸承する回転軸、および、前記研磨パッドとダイヤモンドドレッサ砥石の軸芯を同心とした位置を揺動原点としてACサ−ボモ−タの駆動によりウオ−ムギヤとウオ−ムホイ−ルとの歯噛み合わせで前記回転軸の回転速度を変化させることにより研磨パッド上でのダイヤモンドドレッサ砥石の揺動速度を変化させる支持ア−ム旋回揺動機構、とを備えることを特徴とする研磨パッドのドレッシング装置。   A polishing pad, a diamond dresser grindstone affixed to the upper surface of a polishing surface plate that can be rotated in the horizontal direction, and the diamond dresser grindstone in a vertical direction (z-axis direction) with respect to xyz three-dimensional coordinates perpendicular to the center of the polishing pad A spindle for bearing, a rotating mechanism for the spindle, and a lifting mechanism that lifts and lowers the spindle in the vertical direction (z-axis direction) and presses the diamond dresser against the polishing pad or moves away from the polishing pad, and supports the rotating mechanism and the lifting mechanism. A support arm, a linear movement mechanism that slides a slider that fixes the support arm on a linear guide extending in the front-rear direction (y-axis direction), a rotary shaft that supports the linear guide of the linear movement mechanism, and AC servo motor with the position where the axis of the polishing pad and the diamond dresser wheel are concentric as the origin of oscillation A support arm swivel swing mechanism that changes the swing speed of the diamond dresser grinding wheel on the polishing pad by changing the rotational speed of the rotating shaft by meshing the teeth of the worm gear and the worm wheel by driving. And a polishing pad dressing device. 前記ドレッシング装置は、研磨パッドの中心を通過する前後方向(y軸方向)に平行な支持ア−ムの中心線と支持ア−ム旋回揺動機構の回転軸の軸芯とを結ぶ支持ア−ムの待機位置の支持ア−ムに対して下方の位置に砥石洗浄槽がベ−スに固定されて設けられ、ダイヤモンドドレッサ砥石を軸承するスピンドルを直線移動機構の駆動により前後方向(y軸方向)に移動させて砥石洗浄槽上に位置させ、ついで、昇降機構によりスピンドル軸を下降してダイヤモンドドレッサ砥石を砥石洗浄槽内に貯蔵されている洗浄液に浸漬し、ダイヤモンドドレッサ砥石の回転によりダイヤモンドドレッサ砥石に付着した異物を除去する砥石洗浄機構を更に備えることを特徴とする、請求項1に記載の研磨パッドのドレッシング装置。   The dressing apparatus includes a support arm that connects a center line of a support arm that passes through the center of the polishing pad and is parallel to the front-rear direction (y-axis direction) and the axis of the rotation shaft of the support arm swivel swing mechanism. A grinding wheel washing tank is fixed to the base at a position below the support arm at the stand-by position of the drum, and the spindle that supports the diamond dresser grinding wheel is driven by a linear movement mechanism in the front-rear direction (y-axis direction). ), And is positioned on the grindstone cleaning tank, and then the spindle shaft is lowered by the lifting mechanism to immerse the diamond dresser grindstone in the cleaning liquid stored in the grindstone washing tank, and the diamond dresser grindstone rotates to rotate the diamond dresser 2. The dressing device for a polishing pad according to claim 1, further comprising a grindstone cleaning mechanism for removing foreign matter adhering to the grindstone.
JP2003362670A 2003-10-23 2003-10-23 Dressing device of polishing pad Pending JP2005125444A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012254490A (en) * 2011-06-08 2012-12-27 Ebara Corp Method and device for polishing pad conditioning
CN106217165A (en) * 2016-08-29 2016-12-14 安徽宇腾真空电气有限责任公司 A kind of workpiece polishing mechanism for regulator cubicle surface

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012254490A (en) * 2011-06-08 2012-12-27 Ebara Corp Method and device for polishing pad conditioning
JP2016047593A (en) * 2011-06-08 2016-04-07 株式会社荏原製作所 Conditioning method and device for polishing pad
US9469013B2 (en) 2011-06-08 2016-10-18 Ebara Corporation Method and apparatus for conditioning a polishing pad
US9533395B2 (en) 2011-06-08 2017-01-03 Ebara Corporation Method and apparatus for conditioning a polishing pad
KR101796325B1 (en) 2011-06-08 2017-11-09 가부시키가이샤 에바라 세이사꾸쇼 Method and apparatus for conditioning a polishing pad
CN106217165A (en) * 2016-08-29 2016-12-14 安徽宇腾真空电气有限责任公司 A kind of workpiece polishing mechanism for regulator cubicle surface

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