JP2005123588A5 - - Google Patents
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- JP2005123588A5 JP2005123588A5 JP2004246944A JP2004246944A JP2005123588A5 JP 2005123588 A5 JP2005123588 A5 JP 2005123588A5 JP 2004246944 A JP2004246944 A JP 2004246944A JP 2004246944 A JP2004246944 A JP 2004246944A JP 2005123588 A5 JP2005123588 A5 JP 2005123588A5
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- JP
- Japan
- Prior art keywords
- wavelength conversion
- led
- conversion unit
- light
- light source
- Prior art date
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Claims (19)
前記LED素子から放射された光を当該光の波長よりも長い波長の光に変換する蛍光物質を含み、前記LED素子の少なくとも一部を覆う光波長変換部と、
を備えるLED光源であって、
前記光波長変換部の側面は、少なくとも1つの凹状曲面部分を有しており、
前記凹状曲面は、前記光波長変換部の側面の表面が前記LED素子の方向に窪んでいる凹状曲面であるLED光源。 At least one LED element mounted on the main surface of the substrate;
A light wavelength conversion unit that includes a fluorescent material that converts light emitted from the LED element into light having a wavelength longer than the wavelength of the light, and covers at least a part of the LED element;
An LED light source comprising:
The side surface of the light wavelength conversion unit has at least one concave curved surface portion ,
The concavely curved surface is an LED light source in which a surface of a side surface of the light wavelength conversion unit is a concavely curved surface that is recessed in the direction of the LED element .
前記光波長変換部の少なくとも一部を覆う透光性部材と、
を備え、
前記透光性部材の屈折率は前記光波長変換部の屈折率とは異なっている、請求項2に記載のLED光源。 A reflective surface spaced from the side surface of the light wavelength conversion unit;
A translucent member covering at least a part of the light wavelength conversion unit;
With
The LED light source according to claim 2, wherein a refractive index of the translucent member is different from a refractive index of the light wavelength conversion unit.
前記透光性部材は、前記光波長変換部の前記側面と前記反射面との隙間を埋めている、請求項4に記載のLED光源。 The translucent member is made of resin,
The LED light source according to claim 4, wherein the translucent member fills a gap between the side surface of the light wavelength conversion unit and the reflection surface.
前記曲線の曲率半径Rを前記光波長変換部の厚さtで割った値R/tは0.5以上8.5以下の範囲内にある、請求項1から7のいずれかに記載のLED光源。 The cross section of the light wavelength conversion unit cut so as to cross the recess on the side surface of the light wavelength conversion unit by a plane perpendicular to the main surface of the substrate has an outer shape including a curve corresponding to the recess,
The LED according to any one of claims 1 to 7, wherein a value R / t obtained by dividing a curvature radius R of the curve by a thickness t of the light wavelength conversion unit is in a range of 0.5 or more and 8.5 or less. light source.
前記複数のLED素子の各々の側面を取り囲む複数の反射面と、
前記LED素子から放射された光を当該光の波長よりも長い波長の光に変換する蛍光物質を含み、各々が、対応する各LED素子を覆う複数の光波長変換部と、
各々が、対応する光波長変換部を覆う複数の透光性部材と、
を備えるLED光源であって、
各光波長変換部の側面は、少なくとも1つの凹状曲面部分を有し、
前記透光性部材は、前記光波長変換部の前記側面と前記反射面との隙間を埋めている、LED光源。 A plurality of LED elements arranged on the main surface of the substrate;
A plurality of reflective surfaces surrounding each side surface of the plurality of LED elements;
A plurality of light wavelength converters each including a fluorescent material that converts light emitted from the LED element into light having a wavelength longer than the wavelength of the light, each covering a corresponding LED element;
A plurality of translucent members each covering a corresponding light wavelength converter;
An LED light source comprising:
The side surface of each light wavelength converter has at least one concave curved surface portion,
The translucent member is an LED light source that fills a gap between the side surface of the light wavelength conversion unit and the reflection surface.
上面と、下面と、前記上面および下面をつなぐ少なくとも1つの貫通穴とを有するプレート状部材を備え、
前記プレート状部材における前記貫通穴の内壁面は、少なくとも前記貫通穴に充填された樹脂が硬化する間、前記貫通穴の中心部に向かって突出した凸状曲面を形成する、印刷用版。 A printing plate used for forming a resin pattern on a substrate,
A plate-like member having an upper surface, a lower surface, and at least one through hole connecting the upper surface and the lower surface;
The printing plate, wherein an inner wall surface of the through hole in the plate-like member forms a convex curved surface protruding toward the center of the through hole while at least the resin filled in the through hole is cured.
前記工程(B)は、前記光波長変換部の側面に少なくとも1つの凹状曲面部分を形成する工程を含む、LED光源の製造方法。 A step (A) of mounting at least one LED element on the main surface of the substrate; and a fluorescent material that converts light emitted from the LED element into light having a wavelength longer than the wavelength of the light, A step (B) of forming an optical wavelength conversion part covering at least a part on the substrate, and a manufacturing method of an LED light source,
The said process (B) is a manufacturing method of an LED light source including the process of forming at least 1 concave curved surface part in the side surface of the said light wavelength conversion part.
前記光波長変換部を構成する材料の孤立パターンを前記基板上に形成する工程(b1)と、
前記孤立パターンの側面を変形させて前記凹状曲面部分を形成する工程(b2)と、
を含む、請求項18に記載の製造方法。 The step (B)
A step (b1) of forming an isolated pattern of the material constituting the light wavelength conversion portion on the substrate;
A step (b2) of deforming a side surface of the isolated pattern to form the concave curved surface portion;
The manufacturing method of Claim 18 containing this.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004246944A JP4896383B2 (en) | 2003-09-25 | 2004-08-26 | LED light source and manufacturing method thereof |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003333211 | 2003-09-25 | ||
JP2003333211 | 2003-09-25 | ||
JP2004246944A JP4896383B2 (en) | 2003-09-25 | 2004-08-26 | LED light source and manufacturing method thereof |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005123588A JP2005123588A (en) | 2005-05-12 |
JP2005123588A5 true JP2005123588A5 (en) | 2008-03-21 |
JP4896383B2 JP4896383B2 (en) | 2012-03-14 |
Family
ID=34622009
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004246944A Expired - Fee Related JP4896383B2 (en) | 2003-09-25 | 2004-08-26 | LED light source and manufacturing method thereof |
Country Status (1)
Country | Link |
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JP (1) | JP4896383B2 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7519287B2 (en) | 2005-08-19 | 2009-04-14 | Avago Technologies Ecbu Ip (Singapore) Pte, Ltd. | Electronic flash, imaging device and method for producing a flash of light having a rectangular radiation pattern |
KR101181112B1 (en) | 2005-10-27 | 2012-09-14 | 엘지이노텍 주식회사 | Light-emitting diode, manufacturing method for the light-emitting diode and light-emitting diode module |
JP2007234968A (en) * | 2006-03-02 | 2007-09-13 | Nichia Chem Ind Ltd | Light emitting device and manufacturing method of same |
TWI423467B (en) | 2007-06-06 | 2014-01-11 | Epistar Corp | Semiconductor light emitting device |
JP2009289816A (en) * | 2008-05-27 | 2009-12-10 | Kyocera Corp | Light emitting device, and lighting system |
JP2010010474A (en) * | 2008-06-27 | 2010-01-14 | Kyocera Corp | Light emitting device |
JP2010183061A (en) * | 2009-01-08 | 2010-08-19 | Showa Denko Kk | Light-emitting device and lighting system |
JP5332960B2 (en) * | 2009-06-30 | 2013-11-06 | 日亜化学工業株式会社 | Light emitting device |
JP5334733B2 (en) * | 2009-07-30 | 2013-11-06 | 京セラ株式会社 | Light emitting device |
DE102010049312B4 (en) | 2010-10-22 | 2023-08-03 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Process for producing a conversion plate and conversion plate |
JP5767552B2 (en) * | 2011-10-07 | 2015-08-19 | 富士フイルム株式会社 | Semiconductor light emitting device and manufacturing method thereof |
JP6097040B2 (en) * | 2012-09-20 | 2017-03-15 | スタンレー電気株式会社 | Semiconductor light emitting device and manufacturing method thereof |
EP3608959B1 (en) * | 2018-08-06 | 2023-11-15 | Nichia Corporation | Light emitting device and method for manufacturing same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000031548A (en) * | 1998-07-09 | 2000-01-28 | Stanley Electric Co Ltd | Surface mount light-emitting diode and its manufacture |
JP2001196640A (en) * | 2000-01-12 | 2001-07-19 | Sharp Corp | Side light emitting led device and its manufacturing method |
JP2001298216A (en) * | 2000-04-12 | 2001-10-26 | Matsushita Electric Ind Co Ltd | Surface-mounting semiconductor light-emitting device |
JP2003152229A (en) * | 2001-11-16 | 2003-05-23 | Rohm Co Ltd | Semiconductor light emitting device |
-
2004
- 2004-08-26 JP JP2004246944A patent/JP4896383B2/en not_active Expired - Fee Related
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