JP2005123441A - Semiconductor chip grinding apparatus and manufacturing method of semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip grinding apparatus and a manufacturing method of the same for realizing the grinding of a rear surface by the single body of a reliable and stable semiconductor chip by protecting an element forming surface. <P>SOLUTION: A tray 11 is constituted so as to have equal tapered surfaces 11T at its 4 edges, and to respectively contact with only an edge part on the side of the element forming surface 12A of the semiconductor chip 12. A chip fixed mask 13 is positioned and fixed onto the tray 11. Each semiconductor chip 12 is housed in the opening frame 131 of the chip fixed mask 13. Thus, the semiconductor chip 12 makes its edge on the side of the element forming surface 12A contact with the tapered surface 11T of the tray 11, and exposes the side of a grinding surface 12B. A rotary grinding machine 14 grinds the grinding surface 12B of the semiconductor chip 12 to work the semiconductor chip 12 to a desired thickness. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a semiconductor device manufacturing technique, and more particularly to a semiconductor chip grinding apparatus and a semiconductor device manufacturing method for adjusting the thickness of a semiconductor chip ground in a wafer state.

  Thinning of semiconductor chips has been promoted along with the demands of devices to be mounted. Generally, the back surface grinding is performed in the wafer state after the completion of the wafer process such as semiconductor integrated circuit formation. However, there is a concern that variations in thickness within the wafer surface after grinding may affect mounting. In addition, if the wafer is ground and enters the dicing process while being larger than the required thickness, the chip cannot be reused and is discarded.

In order to solve the above problem, a technique for performing back surface grinding of a semiconductor chip is disclosed. As a result, the non-uniformity of grinding of the semiconductor chip located in the peripheral portion of the wafer is eliminated, and the chip is thinned accurately (see, for example, Patent Document 1).
JP 2002-319558 (pages 3 to 5, FIGS. 1 and 2)

  However, the backside grinding of the semiconductor chip is difficult to fix the chip. In [Patent Document 1] as well, it is brought into contact with and adsorbed to the element forming surface of the semiconductor chip and is pressed by the grinding tool surface. For this reason, there is a concern that the element formation surface may be scratched or the element formation surface may be adversely affected.

  The present invention has been made in consideration of the above-described circumstances, and provides a semiconductor chip grinding apparatus that protects an element formation surface and realizes stable backside grinding with a more reliable semiconductor chip alone and a method for manufacturing the same. It is something to be offered.

  The semiconductor chip grinding apparatus according to the present invention includes a tray having a taper surface on which the element formation surface side of a plurality of semiconductor chips is in contact with only the edge portion, and the size of each semiconductor chip provided on the tray. A chip fixing mask that has an opening frame and exposes the grinding surface side of each semiconductor chip; and a rotary grinding machine that contacts the grinding surface side of each semiconductor chip.

  According to the semiconductor chip grinding apparatus of the present invention, the tray has a tapered surface and contacts only the edge portions on the element formation surface side of the plurality of semiconductor chips. Positioning and fixing of each semiconductor chip is achieved together with a chip fixing mask. As a result, the pressure at the time of grinding is not directly applied to the element forming surface side of the semiconductor chip, and the fixing stability of each semiconductor chip is obtained.

  A semiconductor chip grinding apparatus according to the present invention includes a tray having a step for contacting only a peripheral portion on each of the element formation surfaces of a plurality of semiconductor chips, and an opening provided on the tray according to the size of each semiconductor chip. A chip fixing mask having a frame to expose the grinding surface side of each semiconductor chip; and a rotary grinding machine contacting the grinding surface side of each semiconductor chip.

  According to the semiconductor chip grinding apparatus according to the present invention, the tray has a step and comes into contact with only the peripheral portions on the element formation surface side of the plurality of semiconductor chips. Positioning and fixing of each semiconductor chip is achieved together with a chip fixing mask. As a result, the pressure at the time of grinding is not directly applied to the element forming surface side of the semiconductor chip, and the fixing stability of each semiconductor chip is obtained.

  A semiconductor chip grinding apparatus according to the present invention has an opening frame corresponding to the size of each of a plurality of semiconductor chips, and has a step for contacting each peripheral portion on the element forming surface side of each semiconductor chip. A chip fixing mask for exposing the grinding surface side, a tray on which the chip fixing mask is mounted and on which the element formation surface sides of the plurality of semiconductor chips face each other, a rotary grinding machine that contacts the grinding surface side of each semiconductor chip, including.

  According to the semiconductor chip grinding apparatus of the present invention, the chip fixing mask has a step and comes into contact with the peripheral portions on the element formation surface side of the plurality of semiconductor chips. The tray is configured to seal and protect the element formation surface side of each semiconductor chip. Each semiconductor chip is positioned and fixed by a chip fixing mask and a tray. The pressure at the time of grinding is not directly applied to the element forming surface side of the semiconductor chip, and the fixing stability of each semiconductor chip is obtained.

Each of the semiconductor chip grinding apparatuses according to the present invention has any one of the following features, thereby contributing to further stability of chip grinding.
The tray has a vent for supplying gas pressure to the element formation surface side of each semiconductor chip.
The tray has a vent for supplying air pressure to the element forming surface side of each semiconductor chip.
The tray has a path for supplying a gelling member to the element formation surface side of each semiconductor chip.
The tray is provided with an adhesive member that supports the semiconductor chips.
The tray or the chip fixing mask is at least partially covered with a thin film.
The chip fixing mask is made of the same material as the ground surface of each semiconductor chip.

  A semiconductor chip grinding apparatus according to the present invention includes a plurality of semiconductor chip trays each facing the element formation surface side of the semiconductor chip, an adhesive member provided on the tray, and an opening frame corresponding to the size of each semiconductor chip. A chip fixing mask for contacting the element forming surface side of each semiconductor chip with the adhesive member of the tray and exposing the grinding surface side of each semiconductor chip; and contacting the grinding surface side of each semiconductor chip A rotary grinder.

According to the semiconductor chip grinding apparatus of the present invention, the element forming surface side of each semiconductor chip is protected by the adhesive member provided on the tray. Positioning and fixing of each semiconductor chip is achieved together with a chip fixing mask. Thereby, the adhesive member serves as a cushion on the element forming surface side of the semiconductor chip, and pressure during grinding is not directly applied. From such a configuration, fixing stability in each semiconductor chip is obtained.
In the semiconductor chip grinding apparatus according to the present invention, the chip fixing mask has a step that comes into contact with an element forming surface side peripheral portion of each semiconductor chip. By having such a feature, it contributes to further stability of chip grinding.

  The method of manufacturing a semiconductor device according to the present invention includes a step of positioning and fixing a chip fixing mask having an opening frame corresponding to the size of a plurality of semiconductor chips on a predetermined tray, and the plurality of the fixing frames on the opening frame of the chip fixing mask. Each of the semiconductor chips is stored such that the element formation surface side faces the tray, and the grinding surface side is exposed, and a rotary grinder is brought into contact with the grinding surface side of the plurality of semiconductor chips, Grinding the semiconductor chip.

  According to the method for manufacturing a semiconductor device according to the present invention, a plurality of semiconductor chips are respectively stored in an opening frame of a chip fixing mask positioned and fixed on the tray so that the element forming surface side faces the tray and ground. Grind the surface side. That is, the stability of fixing and grinding in each semiconductor chip can be obtained by the chip fixing mask.

The semiconductor device manufacturing method according to the present invention has the following characteristics in order to obtain better grinding stability.
Pressure control means for maintaining a balance with the pressure during grinding is provided from the tray to the element forming surface side of each of the plurality of semiconductor chips.
The method further includes a step of arranging an adhesive member at least at the element forming surface side of each of the semiconductor chips at a predetermined position of the tray.

  The semiconductor manufacturing method according to the present invention includes a step of mounting a removable adhesive sheet on a predetermined tray, an opening frame corresponding to each size of the plurality of semiconductor chips, and an edge of each of the semiconductor chips. A step of positioning and fixing a chip fixing mask having a step in contact with the vicinity on the adhesive sheet of the tray, and a plurality of semiconductor chips on the chip fixing mask, the element formation surface side of which contacts the step or the adhesive sheet, respectively. And exposing the grinding surface side of the plurality of semiconductor chips from the chip fixing mask, and contacting the rotary grinding machine to the grinding surface side of the plurality of semiconductor chips to grind the plurality of semiconductor chips. And a step of performing.

  According to the semiconductor device manufacturing method of the present invention, the positioning and fixing of each semiconductor chip is stabilized by the chip fixing mask and the adhesive sheet on the tray. The element forming surface side of the semiconductor chip is protected by an adhesive sheet. It also serves as a cushion on the element forming surface side, and pressure during grinding is not directly applied. From such a configuration, the stability of fixing and grinding in each semiconductor chip is obtained.

  In each of the semiconductor device manufacturing methods according to the present invention, as a more preferred embodiment, the chip fixing mask is ground together with the grinding surfaces of the plurality of semiconductor chips by the rotary grinding machine. The chip fixing mask is preferably made of the same material as the grinding part of the semiconductor chip.

  In each of the semiconductor device manufacturing methods according to the present invention, the semiconductor chip is subjected to a wafer grinding step in a wafer state. It is conceivable that the final thickness is obtained by chip grinding after grinding to some extent in the wafer grinding process. In addition, it may be used for relief of individual semiconductor chips that have been mistaken in thickness in the wafer grinding process or partially have a thickness outside the specified range.

BEST MODE FOR CARRYING OUT THE INVENTION

FIG. 1 is a cross-sectional view of a main part of a semiconductor chip grinding apparatus according to a first embodiment of the present invention. 2A to 2D are top views showing application examples relating to a part of the tray surrounded by a broken line in FIG.
The tray 11 has a tapered surface 11T that is equivalent to four sides, and is configured to contact only the edge portion of the semiconductor chip 12 on the element forming surface 12A side. The tray 11 is attached to a support base (not shown). The chip fixing mask 13 has an opening frame 131 corresponding to the size of each semiconductor chip 12. The chip fixing mask 13 is positioned and fixed on the tray 11. Each semiconductor chip 12 is accommodated in the opening frame 131 of the chip fixing mask 13. Thereby, the semiconductor chip 12 makes the edge part by the side of the element formation surface 12A contact the taper surface 11T of the tray 11, and exposes the grinding surface 12B side. The rotary grinding machine 14 includes a grinding wheel or the like, grinds the grinding surface 12B of the semiconductor chip 12, and processes the semiconductor chip 12 to a desired thickness.

  It is conceivable that the tray 11 is made of a metal member that is easily accurate. It is conceivable that the chip fixing mask 13 is made of the same material as the semiconductor chip 12. For example, when the semiconductor chip 12 is a silicon chip, the chip fixing mask 13 is made of silicon. The chip fixing mask 13 together with the semiconductor chip 12 is ground to a desired level. Although the figure shows a state in which the grinding surface 12B of each semiconductor chip 12 protrudes from the chip fixing mask 13 before grinding, this is not restrictive. A state closer to the same surface level as the chip fixing mask 13 or a thickness smaller than the chip fixing mask 13 may be considered. In addition, the chip fixing mask 13 may be made of a material different from that of the semiconductor chip 12 and not actively ground. Although not shown, a protective thin film may be disposed on the side of the opening frame 131 of the chip fixing mask 13.

  The taper surface 11T of the tray 11 is more preferably coated with a thin film 21 having a resin property or an adhesive property for improving the adhesion to the semiconductor chip 12 (FIG. 2A).

  Further, the bottom of the tray 11 may have a vent hole 22 for supplying gas pressure or air pressure to the element forming surface 12A side of the semiconductor chip 12 (FIG. 2B). As a result, pressure is supplied to support suction of the semiconductor chip 12 and balance pressure during grinding. For the pressure control, an inert gas or air having a certain degree of cleanliness is used. When using the thin film 21, the thin film which has adhesiveness is preferable.

  Further, the gelling member 23 may be supplied to the bottom of the tray 11 for protection and adhesion on the element forming surface 12A side of the semiconductor chip 12 (FIG. 2C). The gelling member 23 is supplied via a path 24 at the bottom of the tray 11. A material that has a certain degree of adhesion to the semiconductor chip 12 and is easily attached and detached is used. This also serves as a pressure supply for suction support of the semiconductor chip 12 and pressure balance during grinding.

  In addition, an adhesive member 25 may be disposed on the bottom of the tray 11 for protection and close contact on the element forming surface 12A side of the semiconductor chip 12 (FIG. 2D). The adhesive member 25 is desirably made of a material that can be easily separated from the semiconductor chip 12. As a result, the pressure balance during suction support and grinding of the semiconductor chip 12 is achieved.

  According to the configuration of the above embodiment, the tray 11 has the tapered surface 11T and contacts only the respective edge portions on the element forming surface 12A side of the plurality of semiconductor chips 12. The positioning and fixing of each semiconductor chip 12 is achieved together with the chip fixing mask 13. Further, a device taking into account the balance when grinding the semiconductor chip 12 added in the tray 11 is used. Thereby, the stability and reliability of fixation in each semiconductor chip 12 can be obtained without directly applying pressure to the element forming surface 12A side of the semiconductor chip 12 during grinding.

FIG. 3 is a cross-sectional view of a main part of a semiconductor chip grinding apparatus according to the second embodiment of the present invention. 4A to 4D are top views showing application examples relating to a part of the tray surrounded by a broken line in FIG. The same parts as those in the first embodiment will be described with the same reference numerals used in FIG.
The tray 31 has a uniform step 31S on four sides and is configured to contact only the peripheral portion of the semiconductor chip 12 on the element forming surface 12A side. The tray 31 is attached to a support base (not shown). The chip fixing mask 13 has an opening frame 131 corresponding to the size of each semiconductor chip 12. The chip fixing mask 13 is positioned and fixed on the tray 31. Each semiconductor chip 12 is accommodated in the opening frame 131 of the chip fixing mask 13. Thereby, the semiconductor chip 12 brings the peripheral portion on the element forming surface 12A side into contact with the step 31S of the tray 31 and exposes the grinding surface 12B side. The rotary grinding machine 14 grinds the grinding surface 12B of the semiconductor chip 12 and processes the semiconductor chip 12 to a desired thickness.

  The tray 31 may be composed of a metal member, but may be composed of another substance such as a resin member as long as accuracy is achieved. The chip fixing mask 13 is the same as that in the first embodiment. That is, it can be considered that the material is the same as that of the semiconductor chip 12. Although the figure shows a state in which the grinding surface 12B of each semiconductor chip 12 protrudes from the chip fixing mask 13 before grinding, this is not restrictive. A state closer to the same surface level as the chip fixing mask 13 or a thickness smaller than the chip fixing mask 13 may be considered. In addition, the chip fixing mask 13 may be made of a material different from that of the semiconductor chip 12 and not actively ground. Although not shown, a protective thin film may be disposed on the side of the opening frame 131 of the chip fixing mask 13.

  The step 31S of the tray 31 is more preferably coated with a thin film 41 having a resin property or an adhesive property for enhancing the adhesion to the semiconductor chip 12 (FIG. 4A).

  Further, the bottom of the tray 31 may have a vent 42 for supplying gas pressure or air pressure to the element forming surface 12A side of the semiconductor chip 12 (FIG. 4B). As a result, pressure is supplied to support suction of the semiconductor chip 12 and balance pressure during grinding. For the pressure control, an inert gas or air having a certain degree of cleanliness is used. When using the thin film 41, the thin film which has adhesiveness is preferable.

  Further, the gelling member 43 may be supplied to the bottom of the tray 31 for protection and adhesion on the element forming surface 12A side of the semiconductor chip 12 (FIG. 4C). The gelling member 43 is supplied via a path 44 at the bottom of the tray 11. A material that has a certain degree of adhesion to the semiconductor chip 12 and is easily attached and detached is used. This also serves as a pressure supply for suction support of the semiconductor chip 12 and pressure balance during grinding.

  In addition, an adhesive member 45 may be disposed on the bottom of the tray 31 for protection and close contact on the element forming surface 12A side of the semiconductor chip 12 (FIG. 4D). The adhesive member 45 is desirably made of a material that can be easily separated from the semiconductor chip 12. As a result, the pressure balance during suction support and grinding of the semiconductor chip 12 is achieved.

  According to the configuration of the above embodiment, the tray 31 has the step 31S and contacts only the peripheral portions on the element forming surface 12A side of the plurality of semiconductor chips 12 respectively. The positioning and fixing of each semiconductor chip 12 is achieved together with the chip fixing mask 13. Further, a device taking into account the balance when grinding the semiconductor chip 12 added in the tray 11 is used. Thereby, the stability and reliability of fixation in each semiconductor chip 12 can be obtained without directly applying pressure to the element forming surface 12A side of the semiconductor chip 12 during grinding.

FIG. 5 is a cross-sectional view of a main part of a semiconductor chip grinding apparatus according to the third embodiment of the present invention. 6A to 6C are top views showing application examples relating to a part of the tray surrounded by a broken line in FIG. The same parts as those in the first embodiment will be described with the same reference numerals used in FIG.
The chip fixing mask 53 has an opening frame 531 corresponding to the size of each semiconductor chip 12 and a step 53S that contacts each peripheral portion of each semiconductor chip 12 on the element forming surface 12A side. The chip fixing mask 53 is mounted and positioned on the tray 51. The tray 51 is attached to a support base (not shown). Thereby, the element forming surface 12 </ b> A side of the semiconductor chip 12 faces the tray 51, and the ground surface 12 </ b> B side of the semiconductor chip 12 is exposed from the chip fixing mask 53. The rotary grinding machine 14 grinds the grinding surface 12B of the semiconductor chip 12 and processes the semiconductor chip 12 to a desired thickness.

  The tray 51 may have various configurations such as a metal member and a resin member. It is conceivable that the chip fixing mask 53 is made of the same material as the semiconductor chip 12. In the figure, the ground surface 12B of each semiconductor chip 12 is in the same level as the chip fixing mask 13, but this is not restrictive. It is conceivable that each semiconductor chip 12 has a level different from that of the chip fixing mask 53, that is, the thickness is larger or smaller than the chip fixing mask 53. In addition, the chip fixing mask 53 may be made of a material different from that of the semiconductor chip 12 and not actively ground. Further, a thin film 61 for protection or adhesion may be disposed on the step 53S of the chip fixing mask 53. The thin film 61 may be sticky.

  The bottom of the tray 51 may have a vent 62 for supplying gas pressure or air pressure to the element forming surface 12A side of the semiconductor chip 12 (FIG. 6A). As a result, pressure is supplied to support suction of the semiconductor chip 12 and balance pressure during grinding. For the pressure control, an inert gas or air having a certain degree of cleanliness is used.

  Alternatively, the gelling member 63 may be supplied to the bottom of the tray 51 for protection and close contact on the element forming surface 12A side of the semiconductor chip 12 (FIG. 6B). The gelling member 63 is supplied via a path 64 at the bottom of the tray 11. A material that has a certain degree of adhesion to the semiconductor chip 12 and is easily attached and detached is used. This also serves as a pressure supply for suction support of the semiconductor chip 12 and pressure balance during grinding.

  Further, an adhesive member 65 may be disposed on the bottom of the tray 51 for protection and adhesion on the element forming surface 12A side of the semiconductor chip 12 (FIG. 6C). The adhesive member 65 is preferably made of a material that can be easily separated from the semiconductor chip 12. As a result, the pressure balance during suction support and grinding of the semiconductor chip 12 is achieved.

  According to the configuration of the above-described embodiment, the chip fixing mask 53 has the step 53S and comes into contact with the peripheral portions on the element forming surface 12A side of the plurality of semiconductor chips 12 respectively. The tray 51 is configured to seal and protect the element formation surface 12A side of each semiconductor chip 12. The positioning and fixing of each semiconductor chip 12 is achieved by the chip fixing mask 13 and the tray 51. Further, a device taking into account the balance when grinding the semiconductor chip 12 added in the tray 51 is used. Thereby, the stability and reliability of fixation in each semiconductor chip 12 can be obtained without directly applying pressure to the element forming surface 12A side of the semiconductor chip 12 during grinding.

  FIG. 7 is a flowchart showing the main part of the semiconductor device manufacturing method according to the fourth embodiment of the present invention, and relates to a semiconductor chip grinding process common to the first to third embodiments. In step S11, a chip fixing mask having an opening frame corresponding to the size of a plurality of semiconductor chips is positioned and fixed on a predetermined tray. Any of the configurations shown in the above embodiments is used for the chip fixing mask and the tray. In step S12, a plurality of semiconductor chips are stored in the opening frame of the chip fixing mask so that the element formation surface faces the tray. At this time, the chip is stably fixed as shown in any of FIGS. 2, 4, and 6. That is, a pressure control means for maintaining a balance with the pressure at the time of grinding is provided from the tray to the element forming surface side of each of the plurality of semiconductor chips. In process S13, a rotary grinder is brought into contact with the grinding surface side of the plurality of semiconductor chips to grind the semiconductor chips.

  According to the method of the above embodiment, a plurality of semiconductor chips are respectively stored in the opening frame of the chip fixing mask positioned and fixed on the tray so that the element formation surface side faces the tray, and the grinding surface side is ground. . That is, the stability of fixing and grinding in each semiconductor chip can be obtained by the chip fixing mask. Further, it is considered that such a semiconductor chip has already undergone a wafer grinding process at the stage in the wafer state. That is, it is conceivable that after grinding to some extent in the wafer grinding process, the final thickness is obtained by chip grinding by the method of the above embodiment. In addition, it may be used for relief of individual semiconductor chips that have been mistaken in thickness in the wafer grinding process or partially have a thickness outside the specified range.

  FIG. 8 is a block diagram showing the final state of grinding in a chip grinding apparatus, for example, representative of FIG. The chip fixing mask 13 is ground together with the semiconductor chip 12 so as to have the same flat surface as the ground surface 12B. Although not illustrated with respect to other FIG. 1 and FIG. In addition, although not shown, a method in which the chip fixing mask 13 is not actively ground together with the semiconductor chip 12 is also conceivable. At that time, the chip fixing mask 13 can be a stopper for grinding.

FIG. 9 is a cross-sectional view of a main part of a semiconductor chip grinding apparatus according to the fifth embodiment of the present invention. The same parts as those in the first embodiment will be described with the same reference numerals used in FIG.
The tray 71 is opposed to the element forming surface 12A side of the semiconductor chip 12 via a relatively thick adhesive sheet 72, respectively. The tray 71 is attached to a support base (not shown). The chip fixing mask 73 has an opening frame 731 corresponding to the size of each semiconductor chip 12. The chip fixing mask 73 is positioned and fixed on the tray 71 via an adhesive sheet 72. Each semiconductor chip 12 is accommodated in the opening frame 731 of the chip fixing mask 73. Thereby, the semiconductor chip 12 brings the element forming surface 12A side into close contact with the adhesive sheet 72 of the tray 11 and exposes the ground surface 12B side. The rotary grinding machine 14 grinds the grinding surface 12B of the semiconductor chip 12 and processes the semiconductor chip 12 to a desired thickness.

  It is conceivable that the tray 71 is composed of a metal member, a resin member, or the like. The chip fixing mask 73 is the same as that in the first embodiment. That is, it can be considered that the material is the same as that of the semiconductor chip 12. In addition, if there is no problem, it is possible to use a material different from the semiconductor chip 12. Although not shown, a protective thin film may be disposed on the side of the opening frame 731 of the chip fixing mask 73.

  According to the configuration of the above embodiment, the pressure-sensitive adhesive sheet 72 on the tray 31 contributes to protection and adhesion of the semiconductor chip 12 on the element forming surface 12A side. The pressure-sensitive adhesive sheet 72 is desirably made of a material that can be easily separated from the semiconductor chip 12 and the chip fixing mask 73. As a result, the pressure is absorbed by the element forming surface 12A side of the semiconductor chip 12 through the adhesive sheet 72 during grinding and is not directly applied. As a result, fixing stability and reliability in each semiconductor chip 12 can be obtained.

FIG. 10 is a cross-sectional view of a main part of a semiconductor chip grinding apparatus according to the sixth embodiment of the present invention. The same parts as those in the fifth embodiment will be described with the same reference numerals used in FIG.
The tray 71 is opposed to the element forming surface 12A side of the semiconductor chip 12 via a relatively thick adhesive sheet 72, respectively. The tray 71 is attached to a support base (not shown). The chip fixing mask 83 has an opening frame 831 corresponding to the size of each semiconductor chip 12 and has a uniform step 83S on four sides so as to come into contact with the peripheral portion of the semiconductor chip 12 on the element forming surface 12A side. It is configured. The chip fixing mask 83 is positioned and fixed on the tray 71 via an adhesive sheet 72. Each semiconductor chip 12 is housed in the opening frame 831 of the chip fixing mask 83, and its peripheral part is fixed securely. As a result, the semiconductor chip 12 has its element forming surface 12A side in close contact with the adhesive sheet 72 of the tray 71 excluding its peripheral portion, and the ground surface 12B side is exposed. The rotary grinding machine 14 grinds the grinding surface 12B of the semiconductor chip 12 and processes the semiconductor chip 12 to a desired thickness.

  According to the configuration of the above embodiment, the pressure-sensitive adhesive sheet 72 on the tray 31 contributes to protection and adhesion on the element forming surface 12A side of the semiconductor chip 12. The pressure-sensitive adhesive sheet 72 is desirably made of a material that can be easily separated from the semiconductor chip 12 and the chip fixing mask 83. Further, the chip fixing mask 83 is in contact with the peripheral part of the semiconductor chip 12 on the element forming surface 12A side, and more stable fixing is realized. Thereby, the pressure is absorbed through the adhesive sheet 72 to the element forming surface 12 </ b> A side of the semiconductor chip 12 and is not directly applied. As a result, fixing stability and reliability in each semiconductor chip 12 can be obtained.

  FIG. 11 is a flowchart showing the main part of the semiconductor device manufacturing method according to the seventh embodiment of the present invention, and relates to a semiconductor chip grinding process using the fourth embodiment or the fifth embodiment. In process S21, a removable adhesive sheet is mounted on a predetermined tray. Next, in step S22, the chip fixing mask is positioned and fixed on the adhesive sheet of the tray. Next, in process S23, a plurality of semiconductor chips are stored in the opening frame of the chip fixing mask so that the element forming surface side is in contact with the step of the chip fixing mask or the adhesive sheet of the tray. As a result, the chip is stably fixed. In process S24, a rotary grinding machine is brought into contact with the grinding surface side of the plurality of semiconductor chips to grind the semiconductor chips.

  According to the method of the above embodiment, the positioning and fixing of each semiconductor chip is stabilized by the chip fixing mask and the adhesive sheet on the tray. The element forming surface side of the semiconductor chip is protected by an adhesive sheet. It also serves as a cushion on the element forming surface side, and pressure during grinding is not directly applied. From such a configuration, the stability of fixing and grinding in each semiconductor chip is obtained. Further, it is considered that such a semiconductor chip has already undergone a wafer grinding process at the stage in the wafer state. That is, it is conceivable that after grinding to some extent in the wafer grinding process, the final thickness is obtained by chip grinding by the method of the above embodiment. In addition, it may be used for relief of individual semiconductor chips that have been mistaken in thickness in the wafer grinding process or partially have a thickness outside the specified range.

  FIG. 12 is a block diagram showing the final state of grinding in a chip grinding apparatus, for example, representative of FIG. The chip fixing mask 83 is ground together with the semiconductor chip 12 so as to have the same flat surface as the ground surface 12B. The same applies to the other FIG. 9 although not illustrated. In addition, although not shown, a method in which the chip fixing mask 83 is not actively ground together with the semiconductor chip 12 is also conceivable. At that time, the chip fixing mask 83 can be a stopper for grinding.

As described above, as shown in each embodiment and method, by variously devised trays and chip fixing masks, pressure is not directly applied to the element formation surface side of the semiconductor chip during chip grinding, and Fixing stability in the semiconductor chip can be obtained. As a result,
It is possible to provide a semiconductor chip grinding apparatus that protects an element formation surface and realizes stable backside grinding with a more reliable semiconductor chip alone and a method for manufacturing the same.

Sectional drawing of the principal part of the semiconductor chip grinding apparatus which concerns on 1st Embodiment. The top view which shows the application example of the part enclosed with the broken line in FIG. 1, respectively. Sectional drawing of the principal part of the semiconductor chip grinding apparatus which concerns on 2nd Embodiment. The top view which shows the application example of the part enclosed with the broken line in FIG. 3, respectively. Sectional drawing of the principal part of the semiconductor chip grinding apparatus which concerns on 3rd Embodiment. The top view which shows the application example of the part enclosed with the broken line in FIG. 5, respectively. 9 is a flowchart showing a main part of a method for manufacturing a semiconductor device according to a fourth embodiment. The block diagram which shows the final state of grinding in the chip grinding apparatus corresponding to FIG. Sectional drawing of the principal part of the semiconductor chip grinding apparatus which concerns on 5th Embodiment. Sectional drawing of the principal part of the semiconductor chip grinding apparatus which concerns on 6th Embodiment. 9 is a flowchart showing a main part of a method for manufacturing a semiconductor device according to a seventh embodiment. The block diagram which shows the final state of grinding with the chip grinding apparatus corresponding to FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11, 31, 71 ... Tray, 11T ... Tapered surface, 12 ... Semiconductor chip, 12A ... Semiconductor chip element formation surface, 12B ... Semiconductor chip grinding surface, 13, 53, 73, 83 ... Chip fixing mask, 131, 531 731, 831 ... opening frame, 14 ... rotary grinding machine, 21, 41, 61 ... thin film, 22, 42, 62 ... vent, 23, 43, 63 ... gelled part, 24, 44, 64 ... path, 25 45, 65 ... Adhesive member, 31S ... Tray step, 53S, 83S ... Chip fixing mask step, 72 ... Adhesive sheet, S11-S13, S21-S24 ... Processing steps.

Claims (17)

A tray having a taper surface with which the element forming surface side of the plurality of semiconductor chips is in contact with only the edge portion, and
A chip fixing mask provided on the tray and having an opening frame corresponding to the size of each semiconductor chip to expose the grinding surface side of each semiconductor chip;
A semiconductor chip grinding apparatus comprising: a rotary grinding machine that contacts a grinding surface side of each semiconductor chip. A tray having a step for contacting only the peripheral portion of each of the element formation surfaces of the plurality of semiconductor chips; and
A chip fixing mask provided on the tray and having an opening frame corresponding to the size of each semiconductor chip to expose the grinding surface side of each semiconductor chip;
A semiconductor chip grinding apparatus comprising: a rotary grinding machine that contacts a grinding surface side of each semiconductor chip. A chip fixing mask having an opening frame corresponding to the size of each of the plurality of semiconductor chips, and having a step for contacting each peripheral portion on the element forming surface side of each semiconductor chip, and exposing the ground surface side of each semiconductor chip When,
A tray on which the chip fixing mask is mounted and the element formation surface sides of a plurality of semiconductor chips face each other;
A semiconductor chip grinding apparatus comprising: a rotary grinding machine that contacts a grinding surface side of each semiconductor chip. 4. The semiconductor chip grinding apparatus according to claim 1, wherein the tray has a vent hole that supplies a gas pressure to an element formation surface side of each semiconductor chip. 5. 4. The semiconductor chip grinding apparatus according to claim 1, wherein the tray has a vent hole that supplies air pressure to an element formation surface side of each semiconductor chip. 5. The said chip | tip is a semiconductor chip grinding apparatus as described in any one of Claims 1-3 which has the path | route which supplies a gelatinization member to the element formation surface side of each said semiconductor chip. The semiconductor chip grinding apparatus according to claim 1, wherein the tray is provided with an adhesive member that supports the semiconductor chips. The semiconductor chip grinding apparatus according to claim 1, wherein at least a part of the tray or the chip fixing mask is covered with a thin film. The semiconductor chip grinding apparatus according to claim 1, wherein the chip fixing mask is made of a material equivalent to a grinding surface of each semiconductor chip. A plurality of semiconductor chip trays each facing the element formation surface side of the semiconductor chip;
An adhesive member provided on the tray;
A chip fixing mask having an opening frame corresponding to the size of each semiconductor chip, contacting the element forming surface side of each semiconductor chip with the adhesive member of the tray and exposing the grinding surface side of each semiconductor chip; ,
A semiconductor chip grinding apparatus comprising: a rotary grinding machine that contacts a grinding surface side of each semiconductor chip. 11. The semiconductor chip grinding apparatus according to claim 10, wherein the chip fixing mask has a step contacting with an element forming surface side peripheral portion of each semiconductor chip. A step of positioning and fixing a chip fixing mask having an opening frame corresponding to the size of a plurality of semiconductor chips on a predetermined tray;
Storing the plurality of semiconductor chips in the opening frame of the chip fixing mask such that the element forming surface side faces the tray, and exposing the grinding surface side;
A method of manufacturing a semiconductor device, comprising: bringing a rotary grinding machine into contact with a grinding surface side of the plurality of semiconductor chips and grinding the plurality of semiconductor chips. 13. The method of manufacturing a semiconductor device according to claim 12, wherein pressure control means for maintaining a balance with the pressure during grinding is provided from the tray to the element formation surface side of each of the plurality of semiconductor chips. The method for manufacturing a semiconductor device according to claim 12, further comprising a step of arranging an adhesive member at least at which an element formation surface side of each of the semiconductor chips is closely attached to a predetermined portion of the tray. Mounting a removable adhesive sheet on a predetermined tray; and
A step of positioning and fixing a chip fixing mask having an opening frame corresponding to the size of each of the plurality of semiconductor chips and having a step contacting each of the semiconductor chips in the vicinity of the edge thereof on the adhesive sheet of the tray;
Storing the plurality of semiconductor chips in the chip fixing mask such that the element forming surface side is in contact with the step or the adhesive sheet, and exposing the ground surface side of the plurality of semiconductor chips from the chip fixing mask, respectively. When,
A method of manufacturing a semiconductor device, comprising: bringing a rotary grinding machine into contact with a grinding surface side of the plurality of semiconductor chips and grinding the plurality of semiconductor chips. The method of manufacturing a semiconductor device according to claim 12, wherein the chip fixing mask is ground together with a ground surface of the plurality of semiconductor chips by the rotary grinding machine. The method of manufacturing a semiconductor device according to claim 12, wherein the semiconductor chip undergoes a wafer grinding process at a stage in a wafer state.

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