JP2005111762A - Method of manufacturing cell substrate for electrophoretic display device - Google Patents
Method of manufacturing cell substrate for electrophoretic display device Download PDFInfo
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Abstract
Description
本発明は、電気泳動表示装置用セル基板の製造方法に関する。 The present invention relates to a method for manufacturing a cell substrate for an electrophoretic display device.
非発光系の表示装置として、分散媒に電気泳動粒子を分散させた分散系に電界を印加したときに、電気泳動粒子が泳動する電気泳動現象を利用した電気泳動表示装置がある。
このような電気泳動表示装置においては、多数の小さなセルが並設されたセル基板を形成するとともに、これらのセルにそれぞれ分散系を充填して、電気泳動粒子の泳動距離に制限を加えることによって、解像度を向上させることができる（たとえば、特許文献１参照）。
As a non-light emitting display device, there is an electrophoretic display device using an electrophoretic phenomenon in which electrophoretic particles migrate when an electric field is applied to a dispersion system in which electrophoretic particles are dispersed in a dispersion medium.
In such an electrophoretic display device, by forming a cell substrate in which a large number of small cells are arranged in parallel, each of these cells is filled with a dispersion system to limit the migration distance of the electrophoretic particles. The resolution can be improved (see, for example, Patent Document 1).
そこで、上記のような多数の小さなセルを有するセル基板を得る方法として、可撓性フィルムを金型にセットしプレス成形する方法が既に提案されている（たとえば、特許文献２参照）。 Thus, as a method for obtaining a cell substrate having a large number of small cells as described above, a method of setting a flexible film in a mold and press-molding has already been proposed (for example, see Patent Document 2).
ところで、上記のようなプレス成形方法の場合、金型内にセットされた可撓性フィルムが、加熱プレスされる際に溶融状態となり、金型の型面に沿うように成形されることによって、セル基板が得られるようになっているが、加熱プレスの際に金型内に存在する空気が可撓性フィルムと金型との間に閉じ込められる現象が発生しやすい。そして、このような空気の閉じ込め現象が発生することによって、金型の型締め時に空気の断熱圧縮が起こり、この断熱圧縮効果によって可撓性フィルムを構成する樹脂が炭化する恐れがある。しかも、金型内に存在する空気が、金型のセル周壁形成部に入り込み、溶融した樹脂がセル周壁形成部の奥まで達しにくいため、セル周壁の厚みが薄いセルや、周壁の高さと長手方向の長さとの比（以下、「アスペクト比」と記す）の高い微細なセルを有するセル基板を精度よく成形することが難しい。特に、周壁の厚みが数百ｎｍから数μｍと薄いセルや、２から１０程度とアスペクト比が高い周壁を有するセルを成形することが困難である。また、可撓性フィルムを金型内で溶融させるための時間が必要で、そのため製造時間が長くなり、製造コストアップを招くという問題がある。 By the way, in the case of the press molding method as described above, the flexible film set in the mold is in a molten state when heated and pressed, and is molded along the mold surface of the mold. Although a cell substrate can be obtained, a phenomenon in which air existing in the mold is trapped between the flexible film and the mold during the hot pressing is likely to occur. When such an air confinement phenomenon occurs, adiabatic compression of air occurs when the mold is clamped, and the resin constituting the flexible film may be carbonized due to the adiabatic compression effect. In addition, since the air present in the mold enters the cell peripheral wall forming portion of the mold and the molten resin does not easily reach the depth of the cell peripheral wall forming portion, the cell has a thin cell peripheral wall, or the height and length of the peripheral wall. It is difficult to accurately mold a cell substrate having fine cells with a high ratio to the length in the direction (hereinafter referred to as “aspect ratio”). In particular, it is difficult to mold a cell having a thin peripheral wall with a thickness of several hundred nm to several μm, or a cell having a peripheral wall with a high aspect ratio of about 2 to 10. Further, there is a problem that time for melting the flexible film in the mold is required, and thus the manufacturing time becomes long and the manufacturing cost is increased.
しかも、従来の場合、製造されたセル基板は、各セルに対応する位置に端子を備えた電極基板に積層されるようになっているが、積層の際には、電極基板とセル基板とを接着剤を介して接着一体化するようになっている。したがって、接着剤の厚み分だけ電極端子とセル内の電気泳動粒子との距離が遠くなり、電気泳動粒子の動作反応が悪くなる恐れがある。 In addition, in the conventional case, the manufactured cell substrate is stacked on an electrode substrate having terminals at positions corresponding to the respective cells. It is designed to be bonded and integrated through an adhesive. Therefore, the distance between the electrode terminal and the electrophoretic particles in the cell is increased by the thickness of the adhesive, and the operation reaction of the electrophoretic particles may be deteriorated.
本発明は、上記事情に鑑みて、セル周壁の厚みが薄いセルや、周壁のアスペクト比の高い微細なセルが多数並設されたセル基板を精密に短時間で成形することができるとともに、各セル内の電気泳動粒子と電極基板の電極端子との距離を短くすることができる電気泳動表示装置用セル基板の製造方法を提供することを目的としている。 In view of the above circumstances, the present invention can accurately and quickly form a cell substrate having a thin cell peripheral wall thickness and a cell substrate in which a large number of fine cells having a high aspect ratio of the peripheral wall are arranged side by side. It is an object of the present invention to provide a method for manufacturing a cell substrate for an electrophoretic display device that can shorten the distance between the electrophoretic particles in the cell and the electrode terminal of the electrode substrate.
上記目的を達成するために、本発明にかかる電気泳動表示装置用セル基板の製造方法は
、電気泳動粒子が溶媒中に分散された分散系を充填可能なようにするとともに、一方が開口されたセルを一方の面に多数並設された電気泳動表示装置用セル基板の製造方法であって、電気泳動表示装置の電極基板を、金型内の所定位置にセットした状態で、金型の固定型と可動型とを一旦射出樹脂が漏れでない程度の隙間を残した型閉じ状態にして溶融樹脂をキャビティ内に射出する射出工程と、射出開始から所定時間経過後、可動型を固定型側へさらに移動させて隙間を閉じる樹脂昇圧工程とを備えていることを特徴としている。
In order to achieve the above object, the method for manufacturing a cell substrate for an electrophoretic display device according to the present invention enables filling of a dispersion system in which electrophoretic particles are dispersed in a solvent, and one of them is opened. A method of manufacturing a cell substrate for an electrophoretic display device in which a large number of cells are arranged in parallel on one side, wherein the mold substrate is fixed while the electrode substrate of the electrophoretic display device is set at a predetermined position in the mold. An injection process for injecting the molten resin into the cavity with the mold and the movable mold once closed with a gap that does not allow the injection resin to leak, and after a predetermined time from the start of injection, the movable mold is moved to the fixed mold side. And a resin pressurizing step for closing the gap by moving it.
本発明において、射出開始から所定時間経過後とは、略セル基板の成形に供される樹脂量がキャビティ内に充填される以降を意味する。すなわち、射出工程で概ね樹脂を射出したのち、樹脂昇圧工程を残りの樹脂を射出しつつ隙間を閉じるようにしても構わない。
また、樹脂昇圧工程においては、樹脂圧力の昇圧速度つまり単位時間あたりの圧力上昇が設定圧以上となるように、型閉め速度を経験的に求め、その型閉め速度を制御しながら隙間を閉じることが好ましい。また、直接、キャビティ内の樹脂圧を測定しつつ型閉め速度を制御するようにしても構わない。
In the present invention, “after the elapse of a predetermined time from the start of injection” means after the resin amount used for molding the cell substrate is filled into the cavity. In other words, the resin may be substantially injected in the injection process, and then the resin pressurization process may close the gap while injecting the remaining resin.
Also, in the resin pressurization process, the mold closing speed is determined empirically so that the pressure increase rate of the resin pressure, that is, the pressure increase per unit time is equal to or higher than the set pressure, and the gap is closed while controlling the mold closing speed. Is preferred. Alternatively, the mold closing speed may be controlled while directly measuring the resin pressure in the cavity.
上記のように型締め速度を制御する場合、設定される型閉め速度は、成形されるセル基板の形状や樹脂の種類によって適宜経験的に求められるが、一般に樹脂がポリカーボネートやアクリル樹脂の場合、５００〜１５００ｍｍ／秒程度である。
一方、金型内の樹脂圧を制御する場合、設定される樹脂圧は、成形されるセル基板の形状や樹脂の種類によって適宜経験的に求められるが、一般に樹脂がポリカーボネートやアクリル樹脂の場合、１０〜１５０ＭＰａ程度である。
When controlling the mold clamping speed as described above, the mold closing speed to be set is appropriately determined empirically depending on the shape of the cell substrate to be molded and the type of resin, but generally when the resin is polycarbonate or acrylic resin, It is about 500-1500 mm / sec.
On the other hand, when controlling the resin pressure in the mold, the set resin pressure is appropriately determined empirically depending on the shape of the cell substrate to be molded and the type of resin, but generally when the resin is polycarbonate or acrylic resin, It is about 10-150 MPa.
本発明において、セル基板を構成する樹脂材料としては、熱可塑性樹脂でも熱硬化性樹脂のいずれでも構わず、また、２種類以上の樹脂を用いたアロイ状態、ブレンド状態、コンポジット状態でも構わない。 In the present invention, the resin material constituting the cell substrate may be either a thermoplastic resin or a thermosetting resin, and may be in an alloy state, a blend state, or a composite state using two or more kinds of resins.
本発明にかかる電気泳動表示装置用セル基板の製造方法は、以上のように、電気泳動表示装置の電極基板を、金型内の所定位置にセットした状態で、型を閉じ電極基板と金型との間に形成されるキャビティに溶融樹脂を射出充填して、セル基板を電極基板に一体成形するようにしたので、セル周壁の厚みが薄いセルや、周壁の高い微細なセルが多数並設されたセル基板を精密に短時間で成形することができる。もちろん、射出によって金型内の空気が押し出されるので、空気のかみ込みによる断熱圧縮効果によって樹脂が炭化する恐れもない。 As described above, the method for manufacturing a cell substrate for an electrophoretic display device according to the present invention closes the die while the electrode substrate of the electrophoretic display device is set at a predetermined position in the die, and the electrode substrate and the die. Since the cell substrate is integrally molded with the electrode substrate by injecting and filling molten resin into the cavity formed between the two, a large number of cells with thin cell peripheral walls and fine cells with high peripheral walls are arranged side by side The formed cell substrate can be precisely formed in a short time. Of course, since the air in the mold is pushed out by the injection, there is no fear that the resin is carbonized due to the adiabatic compression effect by the air biting.
また、セル基板と電極基板とが接着剤なしに一体化することができるので、接着剤層のない分だけ、電極端子とセル内の電気泳動粒子との距離を短くすることができる。したがって、電気泳動粒子の良好な動作反応を確保することができるとともに、接着剤の塗布作業等がなくなり、製造時間が短縮できる。
しかも、射出工程と、樹脂昇圧工程を備えた射出圧縮成形でセル基板のみを成形しようとした場合、各セルを支持する基底部がコンパクトディスクのように数百μｍ〜１、２ｍｍ程度の厚肉なものであれば成形できるものの、セルを支持する基底部が数μｍ程度の薄肉のものは成形が困難であるが、本発明にかかる電気泳動表示装置用セル基板の製造方法では、電極基板によってセルを支持する基底部が受けられた状態でセル基板が成形されるので、セルの底部分をセル基板を単独で射出成形する場合に比べ薄肉化できる。そして、セルの底部分の薄肉化によって、より電極端子とセル内の電気泳動粒子との距離を短くすることができる。
Further, since the cell substrate and the electrode substrate can be integrated without an adhesive, the distance between the electrode terminal and the electrophoretic particles in the cell can be shortened by the amount of the adhesive layer. Accordingly, it is possible to ensure a good operation reaction of the electrophoretic particles, and it is possible to eliminate the operation of applying the adhesive and shorten the manufacturing time.
Moreover, when only the cell substrate is formed by injection compression molding including an injection process and a resin pressurizing process, the base portion supporting each cell is thick, about a few hundred μm to 1 or 2 mm like a compact disk. However, it is difficult to mold a thin base having a base portion supporting a cell of about several μm. However, in the method for manufacturing a cell substrate for an electrophoretic display device according to the present invention, an electrode substrate is used. Since the cell substrate is molded in a state where the base portion supporting the cell is received, the bottom portion of the cell can be made thinner than when the cell substrate is injection molded alone. And the distance of an electrode terminal and the electrophoretic particle in a cell can be shortened more by thinning of the bottom part of a cell.
さらに、樹脂昇圧工程において、金型内に射出された溶融樹脂に圧力がさらに付加されるが、可動型からの直接の圧力付加であるため、溶融樹脂に対して圧力損失が非常に小さ
く、高い圧力を均一に溶融樹脂に付加することができる。したがって、溶融樹脂が高い圧力を保持し、金型の微細な溝状をしたキャビティ部分にも容易に充填される。すなわち、周壁がより薄肉で、アスペクト比の高いセルを有するセル基板を得ることができる。
Furthermore, in the resin pressurizing step, pressure is further applied to the molten resin injected into the mold, but since pressure is directly applied from the movable mold, the pressure loss is very small and high with respect to the molten resin. Pressure can be uniformly applied to the molten resin. Therefore, the molten resin maintains a high pressure, and is easily filled into the cavity portion having a fine groove shape of the mold. That is, a cell substrate having cells with a thinner peripheral wall and a high aspect ratio can be obtained.
以下に、本発明を、その実施の形態をあらわす図面を参照しつつ詳しく説明する。
図１は、本発明にかかる電気泳動表示装置用セル基板の製造方法に使用する成形装置の１例をあらわし、図２〜図６は、図１の成形装置を用いた本発明にかかる電気泳動表示装置用セル基板の製造方法の１例を製造工程順にあらわしている。
Hereinafter, the present invention will be described in detail with reference to the drawings showing embodiments thereof.
FIG. 1 shows an example of a molding apparatus used in the method for manufacturing a cell substrate for an electrophoretic display device according to the present invention, and FIGS. 2 to 6 show the electrophoresis according to the present invention using the molding apparatus of FIG. An example of a method for manufacturing a cell substrate for a display device is shown in the order of manufacturing steps.
図１に示すように、この成形装置１は、金型２と、射出機３と、温調機４とを備えている。
金型２は、固定型２ａと可動型２ｂとを備え、可動型２ｂ側に後述する電極基板５が所定位置にセットされるように凹部２１がその型内面に設けられていて、図５に示すように、電極基板５を凹部２１にセットした状態で固定型２ａと可動型２ｂとを閉合することによって、セル基板形成部２２を含むキャビティを形成するようになっている。また、固定型２ａは、その型面に、各セルの周壁を形成する溝状部２３が穿設されている。
As shown in FIG. 1, the molding apparatus 1 includes a mold 2, an injection machine 3, and a temperature controller 4.
The mold 2 includes a fixed mold 2a and a movable mold 2b, and a concave portion 21 is provided on the inner surface of the mold so that an electrode substrate 5 described later is set at a predetermined position on the movable mold 2b side. As shown, the cavity including the cell substrate forming part 22 is formed by closing the fixed mold 2a and the movable mold 2b with the electrode substrate 5 set in the recess 21. In addition, the fixed mold 2a has a groove 23 formed in the mold surface for forming the peripheral wall of each cell.
電極基板５は、得ようとするセル基板の各セルに対応する位置に電極端子（図示せず）が設けられた回路５１が、得ようとするセル基板を構成する樹脂と相溶性を備えた樹脂基材中に埋設された板状あるいはシート状をしている。 The electrode substrate 5 is compatible with the resin constituting the cell substrate to be obtained in the circuit 51 in which electrode terminals (not shown) are provided at positions corresponding to the respective cells of the cell substrate to be obtained. It has a plate shape or a sheet shape embedded in the resin base material.
つぎに、この成形装置１を用いた本発明にかかるセル基板の製造方法を詳しく説明する。
この製造方法は、まず、成形装置１を２０〜２５℃の設定温度±１℃に管理された作業環境中に設置した状態で、温調機４によって金型２の温度を８０〜１５０℃の範囲に保持しておく。
Next, a method for manufacturing a cell substrate according to the present invention using the molding apparatus 1 will be described in detail.
In this manufacturing method, first, the temperature of the mold 2 is set to 80 to 150 ° C. by the temperature controller 4 in a state where the molding apparatus 1 is installed in a working environment controlled at a set temperature ± 1 ° C. of 20 to 25 ° C. Keep in range.
そして、図２に示すように、金型２を開放状態にして、電極基板５を可動型２ｂに設けられた凹部２１にセットしたのち、図３に示すように、可動型２ｂを固定型２ａ側に移動させ、完全型閉じ状態の少し手前、すなわち、固定型２ａと可動型２ｂとの隙間Ｓが、射出された樹脂が漏れでない０．０〜５ｍｍ程度となるまで型を閉じる。
続いて、図４に示すように、十分に乾燥・湿度管理したポリカーボネートやアクリル樹脂などのペレット状態の熱可塑性樹脂原料を射出機３のホッパ３１から投入し、１５０〜３００℃に設定された射出シリンダ３２内で、スクリュー回転数６０〜１００ｒｐｍ、背圧０．１〜２ＭＰａで、樹脂を十分に溶融させたのち、溶融樹脂Ｐを３００〜８００ｍｍ／秒の超高速で金型２内に充填する。
Then, as shown in FIG. 2, the mold 2 is opened and the electrode substrate 5 is set in the recess 21 provided in the movable mold 2b, and then the movable mold 2b is fixed to the fixed mold 2a as shown in FIG. The mold is closed until the fully mold-closed state, that is, the gap S between the fixed mold 2a and the movable mold 2b is about 0.0 to 5 mm where the injected resin does not leak.
Subsequently, as shown in FIG. 4, a thermoplastic resin material in a pellet state such as polycarbonate or acrylic resin, which has been sufficiently dried and humidity controlled, is introduced from the hopper 31 of the injection machine 3, and the injection set to 150 to 300 ° C. In the cylinder 32, the resin is sufficiently melted at a screw rotational speed of 60 to 100 rpm and a back pressure of 0.1 to 2 MPa, and then the molten resin P is filled into the mold 2 at an ultra high speed of 300 to 800 mm / sec. .
充填完了後、図５に示すように、５００〜１５００ｍｍ／秒の速度で、あるいは、金型２内の溶融樹脂Ｐに単位時間あたり、１０〜１５０ＭＰａの均一な圧力がかかる速度で、可動型２ｂを固定型２ａ側へ移動させ、金型２を完全に閉じる。
金型２を完全に閉じた状態を２〜６０秒保持した後、金型２から取り出せる状態まで溶融樹脂Ｐを硬化させ、図６に示すように可動型２ｂを固定型２ａから離れる方向に移動させて金型２を開き、図７に示すような、ハニカム状にセル７１が多数連接されるとともに、電極基板５と一体成形されたセル基板７や、図８に示すように、セルとして円柱状の凹部８１を一方の面に多数備え、電極基板５と一体成形されたセル基板８等を得るようになっている。
After the completion of filling, as shown in FIG. 5, the movable mold 2b has a speed of 500 to 1500 mm / second or a speed at which a uniform pressure of 10 to 150 MPa is applied to the molten resin P in the mold 2 per unit time. Is moved to the fixed mold 2a side, and the mold 2 is completely closed.
After holding the mold 2 in a completely closed state for 2 to 60 seconds, the molten resin P is cured until it can be removed from the mold 2, and the movable mold 2b is moved away from the fixed mold 2a as shown in FIG. Then, the mold 2 is opened, and a large number of cells 71 are connected in a honeycomb shape as shown in FIG. 7, and the cell substrate 7 formed integrally with the electrode substrate 5 or a circle as a cell as shown in FIG. A large number of columnar recesses 81 are provided on one surface to obtain a cell substrate 8 or the like integrally formed with the electrode substrate 5.
本発明にかかる電気泳動表示装置用セル基板の製造方法は、上記の実施の形態に限定されない。 The manufacturing method of the cell substrate for electrophoretic display devices according to the present invention is not limited to the above embodiment.
１ 成形装置
２ 金型
２ａ 固定型
２ｂ 可動型
２１ 凹部（所定位置）
２２ セル基板形成部
２３ 溝状部
３ 射出機
３１ ホッパ
３２ 射出シリンダ
４ 温調機
５ 電極基板
５１ 回路
７，８ セル基板
７１ セル
８１ 凹部（セル）
Ｐ 溶融樹脂
Ｓ 隙間
DESCRIPTION OF SYMBOLS 1 Molding apparatus 2 Mold 2a Fixed mold 2b Movable mold 21 Recessed part (predetermined position)
22 Cell substrate forming portion 23 Groove-shaped portion 3 Injection machine 31 Hopper 32 Injection cylinder 4 Temperature controller 5 Electrode substrate 51 Circuits 7 and 8 Cell substrate 71 Cell 81 Recess (cell)
P Molten resin S Clearance
Claims (1)
電気泳動表示装置の電極基板を、金型内の所定位置にセットした状態で、金型の固定型と可動型とを一旦射出樹脂が漏れでない程度の隙間を残した型閉じ状態にして溶融樹脂をキャビティ内に射出する射出工程と、
射出開始から所定時間経過後、可動型を固定型側へさらに移動させて隙間を閉じる樹脂昇圧工程とを備えていることを特徴とする電気泳動表示装置用セル基板の製造方法。
A method of manufacturing a cell substrate for an electrophoretic display device in which a plurality of electrophoretic particles dispersed in a solvent can be filled, and a plurality of open cells are arranged in parallel on one surface. ,
With the electrode substrate of the electrophoretic display device set at a predetermined position in the mold, the mold is fixed in a mold and the movable mold is once closed with a gap that does not leak the injection resin. Injection process for injecting into the cavity,
A method of manufacturing a cell substrate for an electrophoretic display device, comprising: a resin pressurization step of closing a gap by further moving a movable mold toward a fixed mold after a lapse of a predetermined time from the start of injection.
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| JP2003347387A JP2005111762A (en) | 2003-10-06 | 2003-10-06 | Method of manufacturing cell substrate for electrophoretic display device |
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| JP2003347387A JP2005111762A (en) | 2003-10-06 | 2003-10-06 | Method of manufacturing cell substrate for electrophoretic display device |
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| JP2005111762A true JP2005111762A (en) | 2005-04-28 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007023740A1 (en) * | 2005-08-26 | 2007-03-01 | Brother Kogyo Kabushiki Kaisha | Method for manufacturing partitioning member for electrophoretic display medium, and electrophoretic display medium |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007023740A1 (en) * | 2005-08-26 | 2007-03-01 | Brother Kogyo Kabushiki Kaisha | Method for manufacturing partitioning member for electrophoretic display medium, and electrophoretic display medium |
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