JP2005110466A - Linear motor, stage device, exposure device, and method for manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem wherein heat accumulation occurs at a clearance of the coil corner part or the like owing to heat of the coil generated while driving a motor, in a linear motor having the coil. <P>SOLUTION: An adhesive, to which powder of a high thermal conductive material is mixed, is filled in the corner part of the coil of the linear motor, especially of the annular square linear motor. The adhesive, to which the powder of the high thermal conductive material is mixed, is used for bonding between the members of the linear motor. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a linear motor suitable as a drive source for a stage apparatus mounted on an exposure apparatus for manufacturing a semiconductor device or the like, and more particularly to a stage apparatus, an exposure apparatus and a device manufacturing method using the linear motor.

  Conventionally, for example, Patent Document 1 discloses an annular rectangular linear motor. 4A is a view of the internal configuration of the stator of the conventional annular prismatic linear motor as viewed from the XZ plane, and FIG. 4B is a perspective view of the annular prismatic linear motor stator of FIG. .

  In FIG. 4, reference numeral 101 denotes a support member, which is a structure that supports the entire stator. Reference numeral 102 denotes an insulating member that prevents the annular coil 103 and the stator yoke 105 from being electrically short-circuited and plays a role in positioning the annular coil. The annular coil 103 is an annular rectangular (rectangular tube) coil in which a magnet wire is wound so as to have a substantially quadrilateral outer shape.

  Reference numeral 104 denotes a cooling medium flow path for coil cooling, which is formed by cutting through substantially the center of the support member 101, and cools heat generated when the annular coil 103 is excited. Reference numeral 105 denotes a stator yoke, which is made of a permalloy steel plate or the like in order to prevent the movement of the mover due to the generation of magnetic hysteresis and eddy current or to prevent the occurrence of eddy current loss.

  The annular coil 103 is joined to the insulating member 102 further joined to the stator yoke 105 joined to the support member 101.

A Lorentz force is generated by such a linear motor stator and a linear motor movable element (not shown) having a magnet, and the driving force of the actuator is taken out.
JP 2003-116260 A

  In the linear motor as described above, there has been a problem that, for example, heat is generated at the corners of the coil due to the heat generated by the coil when the motor is driven. Such a pool of heat cannot be effectively removed in the cooling medium flow path at the center of the support member as described in Patent Document 1, causing local thermal stress, damage, etc. There was a fear.

  The present invention has been made in view of such problems, and an object thereof is to reduce heat accumulation and improve cooling efficiency in a linear motor having a coil.

  In order to achieve the above object, according to a first aspect of the present invention, in a linear motor that relatively moves the magnet and the coil by a force generated between the magnet and the coil, the coil has a corner portion. The corner is filled with an adhesive mixed with powder of a high thermal conductive material.

  In the second aspect of the present invention, in a linear motor that relatively moves the magnet and the coil by a force generated between the magnet and the coil, a high heat conductive material is used for bonding between members constituting the linear motor. It is characterized by using an adhesive mixed with powder.

  More preferably, in the annular square linear motor, adhesion between members constituting the linear motor and / or an adhesive mixed with powder of a high heat conductive material is filled in the coil corner of the annular square linear motor. desirable.

  The high thermal conductive material powder is preferably aluminum nitride powder.

  Further, it is desirable to use a linear motor filled with an adhesive in which powders of a high thermal conductivity material are mixed in the corners of the coil and / or in the corners of the coil for driving the stage device. Here, the stage device refers to a stage device used in, for example, OA equipment, machine tools, semiconductor manufacturing equipment, and the like.

  Further, it is desirable that the exposure apparatus is for positioning the substrate by the stage apparatus. Here, the exposure apparatus refers to an exposure apparatus used in a process for manufacturing a device such as a semiconductor device or a liquid crystal display device, and the substrate refers to an original plate such as a mask or a reticle, a semiconductor wafer or glass, for example. A substrate to be exposed such as a substrate is generically named.

(Function)
According to the present invention, in a linear motor having a coil, heat accumulation is reduced and cooling efficiency is improved.

  Furthermore, the present invention can be effectively cooled by being applied to an annular rectangular linear motor.

  Furthermore, by using a linear motor filled with adhesive mixed with high-conductivity material powder at the corners of the coil and / or at the corners of the coil for driving the stage device, there is little influence of heat generation. An accurate stage device can be provided.

  Further, since the exposure apparatus positions the substrate by the stage apparatus, a highly integrated device apparatus can be manufactured.

  According to the present invention, in a linear motor having a coil, heat accumulation can be reduced and cooling efficiency can be improved.

(Example 1)
FIG. 3 is a diagram illustrating an internal configuration of the annular rectangular linear motor according to the first and second embodiments as viewed from the XZ plane. FIG. 1A is a diagram illustrating an internal configuration of the annular rectangular linear motor stator according to the first embodiment when viewed from the XZ plane. FIG. 1B is a perspective view of the annular rectangular linear motor stator of FIG.

  Hereinafter, the annular rectangular linear motor of the present invention will be described with reference to FIGS. In FIG. 3, reference numeral 1 denotes a support member, which is a structure that supports the entire stator. Reference numeral 2 denotes an insulating member that prevents electrical short-circuit between adjacent coils (between adjacent annular coils 3) and these coils and the stator yoke 5, and plays a role of positioning each coil. The annular coil 3 is an annular coil in which a magnet wire is wound so as to have a substantially quadrilateral outer shape.

  4 is a cooling medium flow path for cooling the coil, which is formed by cutting through substantially the center of the support member 1 and cools the heat generated when the annular coil 3 is excited. As shown in the drawing, the cooling medium flow path 4 may have a structure in which one is provided in the approximate center of the support member 1 or a structure in which a plurality of cooling medium flow paths 4 are formed. Reference numeral 5 denotes a stator yoke having magnetism for generating a magnetic field, which is a laminated soft iron having a low coercive force so as to prevent the movement of the mover due to the generation of magnetic hysteresis and eddy current or to prevent the generation of eddy current loss. It is comprised by the system member, for example, a permalloy steel plate, a silicon steel plate, etc.

  The annular coil 3 is joined to an insulating member 2 further joined to a stator yoke 5 joined to the support member 1.

  The mover magnet 8 constituting the linear motor mover has a substantially sine wave magnetic field of two cycles inside a magnet fixed plate 9 in which a plurality of permanent magnets are connected in a so-called Halbach arrangement in a direction perpendicular to the paper surface in a substantially rectangular tube shape. It is attached to generate. The four mover magnets 8 are fixed to the inner surfaces of the four magnet fixing plates 9, and the mover arm 10 connected to one outer surface of the magnet fixing plate 9 is connected to, for example, a stage device. The driving force in the driving shaft direction of the actuator due to the Lorentz force is taken out.

  The features of the present embodiment will be described with reference to FIG. In FIG. 1, 6 is an adhesive filled with aluminum nitride powder, and is adhered to the corners of the annular coil. With such a configuration, the cooling efficiency of the entire stator is improved, and the generation of heat pools at the corners of the coil is prevented. Further, the coil heat generation temperature distribution becomes uniform, and the coil can be prevented from being damaged by local thermal stress. The adhesive is not limited to aluminum nitride powder, but may be mixed with other substances as long as it is a powder of a high thermal conductivity material.

  In the above structure, a so-called moving magnet type linear motor provided with a permanent magnet on the mover side is shown, but it can also be configured as a moving coil type linear motor provided with a coil on the mover side.

  In the case of a moving coil type, in addition to the method in which the magnet fixing plate 9 and the member supported by the magnet are used as a stator and the stator yoke 5 and the member supported by the stator are used as a mover, the annular coil 3, The cooling medium flow path 4 and the stator yoke 5 are provided on the magnet fixing plate 9 side to be a mover, and the mover magnet 8 is fixed to a fixed support body while maintaining the positional relationship of the above elements as a stator. What is necessary is just to comprise.

(Example 2)
FIG. 2 shows a second embodiment. In FIG. 2, the same components as those in FIG. In the second embodiment, an adhesive mixed with aluminum nitride is filled and bonded between each member constituting the linear motor stator and on the surface of the member. In FIG. 2, for example, between the support member 1 and the stator yoke 5, between the plurality of annular coils, and between the stator yoke 5 and the insulating member 2 are bonded with an adhesive 7 mixed with aluminum nitride. However, the present invention is not limited to this and may be used for bonding between other members. With such a configuration, the existing gap can be used for cooling, and the cooling efficiency of the entire stator is improved.

  In addition, cooling efficiency improves more by applying Example 1 and Example 2 to a linear motor.

(Example 3)
FIG. 4 is a diagram showing a stage apparatus that is Embodiment 3 of the present invention. In this stage apparatus, the stage has the linear motor of Example 1 and / or Example 2 as driving means.

  A so-called T-type air slide 302 is fixed on the surface plate 303, and a stage 301 is supported so as to be slidable in one axial direction along the T-type air slide 302. On both sides of the stage 301, the linear motor 300 having the substantially square annular coil 3 of the first embodiment is arranged. The mover of the linear motor 300 is coupled to the stage 301, and the stator is fixed to the surface plate 303 through support columns 304 provided at the front and rear ends of the support member 1.

  In the third embodiment, a single-axis stage device is used. Needless to say, the single-axis stage device can also be applied to a two-axis stage device, and can be used in a conventional stage device using a linear motor.

Example 4
Next, an embodiment of a scanning exposure apparatus in which the stage using the linear motor of Example 1 and / or Example 2 described above is mounted as a reticle stage or wafer stage will be described with reference to FIG.

  A reticle stage base 71 a that supports the reticle stage 73 is integral with a frame 94 that is erected on a base plate 92 that supports a wafer stage 93 of the exposure apparatus, while the linear motor base 71 b is separate from the base plate 92 on the floor surface F. It is supported by the support frame 90 fixed directly to. Further, exposure light for exposing the wafer W on the wafer stage 93 through the reticle on the reticle stage 73 is generated from a light source device 95 indicated by a broken line.

  The frame 94 supports the reticle stage base 71 a and supports the projection optical system 96 between the reticle stage 73 and the wafer stage 93. Since the stator 75 of the linear motor that accelerates and decelerates the reticle stage 73 is supported by a support frame 90 that is a separate body from the frame 94, the reaction force of the driving force of the linear motor of the reticle stage 73 is transmitted to the wafer stage 93. Therefore, there is no risk of disturbance of the drive unit or vibration of the projection optical system 96.

  Wafer stage 93 is scanned in synchronization with reticle stage 73 by the drive unit. During scanning of reticle stage 73 and wafer stage 93, the positions of both are continuously detected by interferometers 97 and 98, respectively, and fed back to the drive units of reticle stage 73 and wafer stage 93, respectively. As a result, both scanning start positions can be accurately synchronized, and the scanning speed of the constant speed scanning region can be controlled with high accuracy.

(Example 5)
Next, an embodiment of a semiconductor device manufacturing method using the above-described exposure apparatus will be described. FIG. 6 shows a flow of manufacturing a semiconductor device (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micromachine, etc.). In step S11 (circuit design), a semiconductor device circuit is designed. In step S12 (mask production), a mask on which the designed circuit pattern is formed is produced. On the other hand, in step S13 (wafer manufacture), a wafer as a substrate is manufactured using a material such as silicon. Step S14 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step S15 (assembly) is referred to as a post-process, and is a process for forming a semiconductor chip using the wafer produced in step S14. including. In step S16 (inspection), the semiconductor device manufactured in step S15 undergoes inspections such as an operation confirmation test and a durability test. Through these steps, the semiconductor device is completed and shipped (step S17).

  FIG. 7 shows a detailed flow of the wafer process. In step S21 (oxidation), the wafer surface is oxidized. In step S22 (CVD), an insulating film is formed on the wafer surface. In step S23 (electrode formation), an electrode is formed on the wafer by vapor deposition. In step S24 (ion implantation), ions are implanted into the wafer. In step S25 (resist process), a photosensitive agent is applied to the wafer. In step S26 (exposure), the circuit pattern of the mask is printed on the wafer by exposure using the exposure apparatus described above. In step S27 (development), the exposed wafer is developed. In step S28 (etching), portions other than the developed resist image are removed. In step S29 (resist stripping), the resist that has become unnecessary after the etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. If the manufacturing method of this embodiment is used, a highly integrated semiconductor device can be manufactured.

The figure which shows the cyclic | annular square linear motor stator in Example 1. FIG. The figure which shows the cyclic | annular square linear motor stator in Example 2. FIG. The figure which shows the whole figure of the annular square linear motor The figure which shows the stage apparatus in Example 3 The figure which shows the exposure apparatus in Example 4 The figure which shows the flow of the device manufacturing method in Example 5. The figure which shows the flow of the wafer process in Example 5. Overall view of a conventional annular square linear motor stator

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Support member 2 Insulating member 3 Annular coil 4 Cooling medium flow path 5 Stator yoke 6 Adhesive filled with aluminum nitride 7 Adhesive filled with aluminum nitride 8 Movable magnet 9 Magnet fixed plate 10 Movable arm 71a Reticle stage base 71b Linear motor base 73 Reticle stage 75 Linear motor stator 90 Column frame 92 Base plate 93 Wafer stage 94 Frame 95 Light source device 96 Projection optical system 97 Interferometer 98 Interferometer 300 Linear motor 301 Stage 302 Air slide 303 Surface plate 304 Column W Wafer F Floor

Claims (7)

  In a linear motor that relatively moves the magnet and the coil by a force generated between the magnet and the coil, the coil has a corner portion, and an adhesive in which powder of a high thermal conductive material is mixed in the corner portion A linear motor characterized by filling. In a linear motor that relatively moves the magnet and the coil by a force generated between the magnet and the coil,
A linear motor using an adhesive mixed with powder of a high thermal conductive material for bonding between members constituting the linear motor.   The linear motor according to claim 1, wherein the linear motor is an annular square linear motor.   4. The linear motor according to claim 1, wherein the high thermal conductive material powder is an aluminum nitride powder.   A stage apparatus, wherein the stage is moved by the linear motor according to claim 1.   An exposure apparatus for positioning a substrate by the stage apparatus according to claim 5. A device manufacturing method, wherein a device is manufactured by the exposure apparatus according to claim 6.

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