JP2001112234A - Motor, stage, exposing apparatus, and drive control method for motor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a motor for driving an object in the two-dimensional direction through a simple arrangement. SOLUTION: Through electromagnetic interaction between a current fed to an armature coil 46 in an armature unit 45 and a field generated from a first pole unit 63, a force for relatively driving the armature unit 45 and the first pole unit 63 in the first direction (X axis direction) is generated and through electromagnetic interaction between a current fed to the armature coil 46 and a field generated from a second pole unit 83, a force for relatively driving the armature unit 45 and the second pole unit 83 in the second direction (Y axis direction) is generated. Consequently, two-dimensional driving is achieved not through an intricate two stage arrangement but through one stage arrangement.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a motor device, a stage device, an exposure device, and a drive control method of a motor device, and more particularly, to a motor device capable of two-dimensional drive, a method of driving the motor device, and the motor. The present invention relates to a stage apparatus using the apparatus as a driving source of a stage, and an exposure apparatus using the stage apparatus.

[0002]

2. Description of the Related Art Conventionally, in a lithography process for manufacturing a semiconductor device, a liquid crystal display device, or the like, a pattern formed on a mask or a reticle (hereinafter, collectively referred to as a “reticle”) is resisted through a projection optical system. There is used an exposure apparatus that transfers an image onto a substrate such as a wafer or a glass plate (hereinafter, appropriately referred to as a “substrate” or a “wafer”) coated with a substrate. As such an exposure apparatus, a stationary exposure type projection exposure apparatus such as a so-called stepper and a scanning exposure type projection exposure apparatus such as a so-called scanning stepper are mainly used.

In this type of exposure apparatus, it is necessary to apply a resist on a reticle pattern on which a pattern is formed via a projection optical system and sequentially transfer the reticle pattern to a plurality of shot areas on the upper surface of a wafer having a two-dimensional spread. And a substrate stage device including a substrate stage that holds a wafer and moves two-dimensionally along a moving surface. In recent years, as a driving device for such a substrate stage device, a one-axis linear motor has been two-dimensionally arranged, or a magnetically levitated or air levitated two-dimensional linear actuator (plane motor) for directly driving a substrate stage two-dimensionally. Is used.

On the other hand, in the case of a scanning type exposure apparatus, it is essential that the reticle stage holding the reticle can be moved. In such a case, the movement of the reticle stage is mainly one-dimensional along the scanning direction. Movement is performed.
Therefore, the reticle stage may be driven in a long stroke in the scanning direction, and may be driven in a short stroke for fine position adjustment in a direction orthogonal to the scanning direction (non-scanning direction). In recent years, in driving such a reticle stage, a polyphase linear motor has been used for long stroke drive, and a one-phase VCM (voice coil motor) has been used for short stroke drive.

[0005]

In order to drive the reticle stage as described above, for example, a scanning direction driving device for driving the reticle stage at a predetermined stroke in the scanning direction and an arbitrary two-dimensional reticle stage in a two-dimensional plane. A so-called coarse / fine movement structure including a minute driving device that minutely drives in a dimensional direction has been widely adopted as a structure of a driving device in a reticle stage device. For this reason, the structure of the reticle stage device becomes complicated, and it is necessary to secure a large space for the drive device, which limits the degree of freedom in device design.

The present invention has been made under such circumstances, and a first object of the present invention is to provide a motor device and a drive control method of the motor device which can be two-dimensionally driven with a simple structure. .

It is a second object of the present invention to provide a stage apparatus which can move a stage at high speed with good position controllability without employing a coarse / fine movement structure.

It is a third object of the present invention to provide an exposure apparatus capable of improving the throughput.

[0009]

A motor device according to the present invention generates a driving force in a first direction (X direction) and a second direction (Y direction) substantially orthogonal to the first direction. An armature unit (45) disposed along the first direction and including an armature coil (46); disposed along the first direction and flowing through the armature coil. A first magnetic pole unit (6) for generating a magnetic flux density for generating a driving force along the first direction by interaction with a current;
3) and; a second magnetic pole unit arranged along the first direction and generating a magnetic flux density for generating a driving force along the second direction by interaction with a current flowing through the armature coil; 83) a control device (19, 20) for controlling a current flowing through the armature coil to control a driving force along the first direction and the second direction.

[0010] According to this, the electromagnetic interaction between the current supplied to the armature coil included in the armature unit and the magnetic field generated by the first magnetic pole unit causes the armature unit and the first magnetic pole unit to communicate with each other. Is generated in the first direction, and an electromagnetic interaction between a current supplied to the armature coil and a magnetic field generated by the second magnetic pole unit generates an armature unit and a second magnetic pole. A driving force for relatively driving the unit in the second direction is generated. That is, by supplying a current to one type of armature coil, a driving force along the first direction and the second direction can be generated and two-dimensional driving can be performed. Driving becomes possible. Further, the driving force changes depending on the current supplied to the armature coil, but by controlling the current flowing through the armature coil by the control device,
Since the driving force along the first direction and the second direction is controlled,
A desired amount of driving force can be generated in a desired direction.

In the motor device according to the present invention, the armature coil has a first portion having a current path parallel to the second direction, and a first portion having a current path extending from the first portion in a direction intersecting the second direction. It can be configured to have two parts. In such a case, the first magnetic pole unit generates a magnetic flux density in a direction orthogonal to the first direction and the second direction at a position where a part of the first portion of the current path is placed, so that the first magnetic pole unit generates a magnetic flux density in the current path at that position. A Lorentz force along one direction, and thus a driving force along the first direction, can be generated. Also, the second
The magnetic pole unit generates a magnetic flux density in a direction orthogonal to the first direction and the second direction at a position where a part of the second portion of the current path is placed, so that the Lorentz force having the second direction component in the current path at the position. Can be generated. That is, two-dimensional driving is possible while making the magnetic flux density generated by the first magnetic pole unit and the magnetic flux density generated by the second magnetic pole unit parallel.

The stage apparatus of the present invention comprises a stage (RS
A stage device including a driving device for driving T) along a predetermined moving surface, wherein the driving device includes the motor device (40A, 40B) of the present invention. According to this, since the stage is two-dimensionally driven by the motor device of the present invention, the configuration of the stage device can be simplified, and the stage can be moved at a high speed.
The position controllability of the stage can be improved.

An exposure apparatus according to the present invention is an exposure apparatus for transferring a predetermined pattern onto a substrate (W) while a stage (RST) of the stage apparatus is moving. (22). According to this, for example, a substrate or a mask to be moved can be moved by two-dimensionally moving a substrate or a mask on which a predetermined pattern is formed by the stage device of the present invention which can simplify the stage and reduce the size and weight. It is possible to increase the speed and acceleration of the movement, and to shorten the positioning settling time and the like accompanying the improvement of the position controllability, thereby improving the throughput.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment A first embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 shows a schematic configuration of an exposure apparatus 10 according to the first embodiment. This exposure apparatus 10
This is a step-and-scan type scanning exposure apparatus, that is, a so-called scanning stepper. As will be described later, in the present embodiment, a projection optical system PL is provided. Hereinafter, the optical axis A of the projection optical system PL will be described.
The X direction is the Z axis direction, the direction in which the reticle R as a mask and the wafer W as a substrate are relatively scanned in a plane perpendicular to the Z axis is the X axis direction, and the directions orthogonal to these Z axis and X axis are the Y axis. Explanation will be given as a direction.

The exposure apparatus 10 includes an illumination system IOP and a reticle stage R as a stage for holding the reticle R.
The reticle stage device 22 as the stage device having the ST, the projection optical system PL, and the wafer W are moved in the XY plane by XY.
A wafer stage WST driven in a two-dimensional direction, a control system for these components, and the like are provided.

The illumination system IOP is disclosed in, for example,
As disclosed in Japanese Patent Publication No. 320956, the system includes a light source unit, a shutter, a secondary light source forming optical system, a beam splitter, a condenser lens system, a reticle blind, an imaging lens system, and the like (all not shown), Emitting illumination light for exposure having a substantially uniform illuminance distribution. The illumination light is a rectangular (or arc-shaped) illumination area I on the reticle R.
The AR is illuminated with uniform illumination.

The reticle stage RST is arranged on a reticle stage base 52 in a non-contact manner. On the upper surface of reticle stage RST, reticle R is fixed, for example, by vacuum suction.

A reticle laser interferometer (hereinafter, referred to as “reticle interferometer”) 2 is provided on reticle stage RST.
A movable mirror 24 and a pair of corner cubes 26A and 26B (see FIG. 2) that reflect the laser beam from the reticle stage RST are fixed. 5-
It is always detected with a resolution of about 1 nm. Position information of reticle stage RST from reticle interferometer 28 is sent to stage control system 19 and main controller 20 via the same, and stage control system 19 responds to an instruction from main controller 20 to position reticle stage RST. The drive of reticle stage RST is controlled based on the information (or speed information).

As shown in FIG. 2, a pair of corner cubes 26A and 26B are fixed to the -X side end of the upper surface of reticle stage RST for X position measurement. A reticle interferometer 28X for measuring the X position is fixed to an end of the upper surface of the reticle stage base 52 in the −X direction so as to face the reticle stage base 52B. This reticle interferometer 28X actually projects an interferometer beam onto the corner cubes 26A and 26B,
Receiving each reflected light, corner cube 26A,
26B is configured to include a pair of double-pass interferometers for detecting the position in the X-axis direction. A flat mirror 24 extending in the X-axis direction is fixed to an end of the upper surface of the reticle stage RST on the + Y side, and a reticle is provided at an end of the upper surface of the reticle base 52 in the Y direction so as to face the flat mirror 24. An interferometer 28Y is provided. In FIG. 1,
Moving mirror 24 and corner cubes 26A, 26B are typically shown as moving mirror 24, and reticle interferometers 28X, 28Y are typically shown as reticle interferometer 28.

Further, fixed mirrors corresponding to the respective reticle interferometers are provided on the side surfaces of the lens barrel of the projection optical system PL, and these are typically shown as fixed mirrors Mr in FIG.

Returning to FIG. 1, the projection optical system PL is disposed below the reticle stage RST, and here is a reduction system that is telecentric on both sides, and is disposed at predetermined intervals along the optical axis AX direction (Z axis direction). A refractive optical system including a plurality of lens elements is used. The projection magnification of the projection optical system PL is, for example, 1/4, 1/5 or 1/6. Therefore, when the illumination area IAR of the reticle R is illuminated by the illumination light from the illumination system IOP,
The illumination light passing through the reticle R causes the projection optical system P
Through L, a reduced image (partially inverted image) of the circuit pattern in the illumination area IAR of the reticle R is formed in the exposure area IA conjugate to the illumination area IAR on the wafer W whose surface is coated with a photoresist.

A wafer holder 68 as a substrate holder is fixed on the wafer stage WST by vacuum suction, and the wafer W is suction-fixed on the wafer holder 68 via a vacuum chuck, an electrostatic chuck, or the like (not shown). ing. The wafer stage WST is driven in two-dimensional directions of the X-axis and the Y-axis by a wafer stage driving unit (not shown) including, for example, a magnetic levitation type two-dimensional linear actuator. That is, the wafer stage WST is moved not only in the scanning direction (X-axis direction) but also so that a plurality of shot areas on the wafer W can be positioned in the exposure area IA conjugate to the illumination area IAR on the reticle. It is configured to be movable also in a non-scanning direction (Y-axis direction) perpendicular to the direction, and performs an operation of scanning (scanning) exposure of each shot area on the wafer W and a scanning start position for exposure of the next shot And a step-and-scan operation of repeating the stepping operation of moving to the next position.

At one end in the X direction on the upper surface of the wafer stage WST, a movable mirror for X position measurement is provided extending in the Y direction, and at one end in the Y direction, a movable mirror for Y position measurement is provided. A moving mirror extends in the X direction. In FIG. 1, these movable mirrors are typically shown as movable mirrors 56. Also,
A wafer laser interferometer for X position measurement (hereinafter, referred to as “wafer interferometer”) is provided opposite to the X position measurement movable mirror, and Y position measurement is opposed to the Y position measurement movable mirror. Are provided, and the measurement beams from each of the wafer interferometers are irradiated toward the opposing movable mirror. In FIG. 1, these wafer interferometers are typically shown as wafer interferometers 58.

A fixed mirror for measuring the position of wafer stage WST is fixed near the lower end of the lens barrel of projection optical system PL. Corresponding to the provision of the wafer interferometer for X position measurement and the movable mirror for Y position measurement as described above, the fixed mirror for wafer position WST position measurement is also the same as the fixed mirror for X position measurement. , Y position measurement fixed mirror is provided. In FIG. 1, these fixed mirrors are typically shown as fixed mirrors Mw.

The position of the wafer stage WST in the X, Y, and θz directions is constantly measured by the above-described wafer interferometer 58 with a resolution of, for example, about 0.5 to 1 nm with respect to the projection optical system PL. The position information of wafer stage WST from wafer interferometer 58 is sent to stage control system 19 and main controller 20 via the same, and stage control system 19 transmits wafer stage WST in response to support from main controller 20. The wafer stage WST is driven via a wafer drive unit (not shown) based on the position information.

Next, the reticle stage device 22, which is a feature of the present embodiment, will be described in detail with reference to FIGS.

As shown in FIG. 2, the reticle stage device 22 includes a reticle stage RST and a motor device 40A having a long stroke direction in the X-axis direction disposed on both sides of the reticle stage RST in the Y-axis direction. ,
40B. Reticle stage RST is held by holding member 35A fixed to mover 34A of motor device 40A and holding member 35B fixed to mover 34B of motor device 40B. In addition,
A movable section 32A is constituted by the mover 34A and the holding member 35A, and a movable section 3 is constituted by the mover 34B and the holding member 35B.
2B is configured. Also, reticle stage RST
A plurality of air pads (not shown) are arranged on the lower surface of the reticle stage. The reticle stage RST and the movable portions 32A and 32B are moved by the static pressure of the pressurized air blown onto the reticle stage base 52 from these air pads. It is configured to be levitated and supported on the base 52 via a predetermined clearance.

On the other hand, the stator 42A of the motor device 40A
Are supported by a support member 54A in a non-contact state with respect to the reticle stage base 52, and the stator 42B of the motor device 40B is
Is supported by the support member 54B in a non-contact state. The support members 54A and 54B are directly planted on the floor surface without interposing the base plate BP (see FIG. 1).

Further, in order to prevent the vibration generated by driving the reticle stage RST from being transmitted indirectly via the floor, the support members 54A and 54B are provided with a vibration isolator (not shown).

Next, motor devices 40A and 40B for driving reticle stage RST will be described.

As described above, the motor device 40A includes a movable portion 32A including a mover 34A and a holding member 35A;
And a stator 42A.

As shown in FIG. 3A, the mover 34A is adjacent to each other along the X-axis direction (first direction) on each of a pair of opposing surfaces of a magnetic base 64A made of a magnetic material member. A first field as a first magnetic pole unit including a plurality of sets of X-axis driving permanent magnets 36N and 36S arranged at a pitch Pt such that the magnets facing each other in the Z-axis direction have different polarities. Magnet (field magnet) 63
An X-axis drive which is disposed on each of the pair of opposing surfaces at a predetermined interval from the first field magnet (field magnet) 63 in the Y-axis direction (second direction) and is adjacent to the Y-axis direction. A second field magnet (a field magnet) as a second magnetic pole unit comprising a plurality of sets of Y-axis driving permanent magnets 38N, 38S arranged at a fixed interval so as to have the same polarity as the permanent magnets 36N, 36S of FIG. ) 83. The permanent magnet 36N and the permanent magnet 36S are magnets having the same shape and the same magnetic force.
The permanent magnet 36X is represented according to the polarity X (N or S) of the magnetic pole surface opposite to the mounting surface to the magnetic base 64A. The permanent magnets 38N and 38S are magnets having the same shape and the same magnetic force.
Similarly to the case of S, the permanent magnet 38X is represented according to the polarity X (N or S) of the magnetic pole surface opposite to the surface to be attached to the magnetic base 64A.

The permanent magnet 36 in the mover 34A
The magnetic flux densities generated by N, 36S, 38N, and 38S will be described with reference to FIGS. As shown generally in FIG. 4A, which is a YZ sectional view of the mover 34A, and FIG. 4B, which is a view in the Y direction, the magnetic flux emitted from the N pole surfaces of the permanent magnets 36N, 38N is The space between the permanent magnets advances toward the S pole surfaces of the permanent magnets 36S, 38S, and reaches the S pole surfaces of the opposing permanent magnets 36S, 38S. Thereafter, the magnetic flux is applied to the permanent magnets 36S,
Through the 38S, the magnetic flux advances from the N pole faces of the permanent magnets 36S and 38S into the magnetic base 64A. Then, the magnetic flux proceeds through the magnetic base 64A and the S of the permanent magnets 36N, 38N.
After arriving at the pole faces, the poles reach the N pole faces of the permanent magnets 36N and 38N via the permanent magnets 36N and 38N. In this way, a magnetic circuit is formed that sequentially goes through the permanent magnets 36N, 38N, the permanent magnets 36S, 38S, and the magnetic base 64A. The magnetic flux passing through the magnetic circuit generates a magnetic flux density in the Z-axis direction in a space (hereinafter, simply referred to as a “gap”) between the permanent magnets 36N, 38N and the permanent magnets 36S, 38S facing each other. Since the magnetic base 64A is made of a magnetic material, the magnetic base 64A also functions as a magnetic shield material, and reduces the amount of magnetic flux generated by the permanent magnet to the outside.

Further, when stainless steel or the like having high electric resistance, high saturation magnetic flux density, low magnetic hysteresis, and low coercive force is adopted as the material of the magnetic member, generation of eddy current and loss of hysteresis are suppressed. The influence of the eddy current on the magnetic flux density, the hysteresis loss, and the like are reduced, and a stable magnetic flux can be continuously generated.

Here, as shown in FIG. 4B, since the magnets having different polarities are alternately arranged along the X direction in the magnetic base 64A, the magnetic flux density in the Z-axis direction in the air gap. The component has a larger absolute value at the center of the permanent magnet, and has a smaller absolute value of the magnetic flux density at a position farther from the center of the permanent magnet. Then, the distribution of the magnetic flux density component in the Z-axis direction in the X direction in the X direction has a shape in which a good approximation is performed in the form of a sine (or cosine) function as shown in the graph of FIG.

Therefore, the Z-axis direction component B ₁ of the magnetic flux density by the field magnet 63 at the position X of the gap in the X-axis direction is B ₁ (X) = B _P0 · cos (π · X / Pt) (1) ) It can be expressed as. Here, _BP0 is the peak value of the air gap magnetic flux density by the first field magnet 63.

The component B _{2 in} the Z-axis direction of the magnetic flux density by the field magnet 83 at the position X in the X-axis direction of the air gap is: B ₂ (X) = B _Q0 · cos (π · X / Pt) (2) Becomes Here, B _Q0 is the peak value of the air gap magnetic flux density by the second field magnet 83.

Referring back to FIG. 3, the stator 42A of the linear motor 40A is made of a non-magnetic material, has a longitudinal direction in the X-axis direction, and has an L-shaped YZ section, as shown in FIG. Armature base 44, and an armature unit 45 including 3n (n is a natural number) armature coils 46 provided inside the armature base 44. Armature base 44
The armature coil 46 provided therein has two linear current paths extending in the Y-axis direction at positions corresponding to the first field magnets 63 (hereinafter, collectively referred to as “first current paths”). ) And two current paths in a direction (oblique direction) intersecting the Y axis at a predetermined angle on the XY plane at a position corresponding to the second field magnet 83 (hereinafter, collectively referred to as a “second current path”). Route)). The armature coil 46 has a current path width (P
t / 3), and the width in the X-axis direction of the hollow portion between the two current paths constituting the first current path is (2 · Pt / 3).
The 3n armature coils 46 are arranged without a gap in the X-axis direction.

As shown in FIGS. 3A and 3B, the length of the first current path in the Y direction is L _S , and the length of the second current path in the Y direction is L _A. Has become. Also, the first
The length of the side extending in the Y direction of the field magnets 36N, 36S is L ₁ , the length of the side extending in the Y direction of the second field magnets 38N, 38S is L ₂ , and the first field magnet and the second the distance between the 2 of the field magnet is in the L _G. Here, the following relationship is satisfied: L _S > L _G + L ₁ (3) L _A > L _G + L ₂ (4)

Next, a method of driving and controlling a movable portion 32A having a movable element 34A including a permanent magnet as described above and a linear motor 40A including a stator 42 including an armature coil 46 will be described with reference to FIG. This will be described in detail based on (D). Here, since each armature coil 46 is wound in a plurality of layers and the same current _ii is supplied to each layer, in practice, as a whole armature coil, the current I _i (= i _i · N: N is electrically equivalent to supplying the number of turns of the armature coil. Therefore, in the following description, the armature coil 46 will be considered as an equivalent one-turn armature coil. In the following description, when indicating the X position of the armature coil 46,
As shown in FIG. 5A, with the center position of the specific permanent magnet 36N in the X-axis direction as the origin, the center position of the first current path on the −X-direction side of the armature coil 46 in the X-axis direction is set. Let us use the position X represented.

In this embodiment, a current I is supplied to each armature coil 46. As shown in FIG. 5C, the current I includes a component of the current I ₁ (X) for generating the Lorentz force in the first current path, which changes according to the X position of each armature coil 46. , And a component of the current I ₂ (X) for generating Lorentz force in the second current path. Here, the current I ₁ (X) is expressed as I ₁ (X) = I ₁₀ · cos (π · X / Pt) (5), and the magnetic flux density distribution B
₁ (X) and change in the same cycle (2Pt) and the same phase. Here, I ₁₀ is a constant, and FIG.
In (A), the current is defined to be positive when the current is clockwise, and to be negative when the current is clockwise. The current I ₂ (X) is expressed as I ₂ (X) = I ₂₀ · sin (π · X / Pt) (6), and the magnetic flux density distribution B ₂ Same period (2Pt) and phase difference (π / 2) as (X)
It changes with. Here, I ₂₀ is a constant, and is defined to be negative in the case of the clockwise current in FIG. 5A and to be positive in the case of the clockwise current in FIG.

First, consider the Lorentz force generated in the first current path at the position corresponding to the first field magnet 63 of each armature coil 46 by supplying the current I ₁ (X).

In the first current path, as described above, the Z-axis direction
Magnetic flux density B whose distribution is expressed by equation (1)₁(X) occurs
ing. As a result, the first current path of each armature coil 46
Lorentz force f generated on road₁(X) is the force in the X direction
Yes, its size f_1X(X) is f_1X(X) = 2 · C_P・ B₁(X) · I₁(X) L₁  = 2 · C_P・ B_P0・ I_Ten・ Cos^Two(Π · X / Pt) · L₁  ... (7) Where C_PIs a constant. Below, Lauren
Force f₁(X) is Lorentz force f_1X(X)
I do. This Lorentz force f_1X(X) armature coil 46
FIG. 5D shows the change due to the X position.

By the way, in this embodiment, as described above,
And the width of each current path constituting the first current path in the X-axis direction.
Is the magnetic flux density distribution B₁1/6 of the change period of (X)
And a so-called three-phase motor structure. This result
As a result, the three consecutively arranged
Generated in the first current path of the two armature coils 46
Total force F of Lenz force_1X(X) is the armature closest to the -X direction
Let X be the X position of coil 46 and F_1X(X) = 2 · C_P・ B_P0・ I_Ten・ Cos^Two(Π · X / Pt) · L₁  + 2 · C_P・ B_P0・ I_Ten・ Cos^Two(Π · X / Pt + π / 3) · L₁  + 2 · C_P・ B_P0・ I_Ten・ Cos^Two(Π · X / Pt + 2π / 3) · L₁  ... (8) By the way, cos^Twoφ + cos^Two(Φ + π / 3) + cos^Two(Φ + 2π / 3) = 3/2 (9)_1X(X) = 3 · C_P・ B_P0・ I_Ten・ L₁ ... (10) That is, the current I₁Supply of armature unit
First current path of armature coil 46 in knit 45
The resultant of the Lorentz force generated in the armature unit 45
Does not depend on the X position.

Next, the Lorentz force generated in the second current path at the position corresponding to the second field magnet 83 of each armature coil 46 by supplying the current I ₁ will be considered.

The second current path of each armature coil 46 is
Second field magnet 8 composed of a plurality of permanent magnets having different polarities
3 are arranged so as to cross obliquely in the sine wave (or cosine wave) magnetic flux density, and different magnetic flux densities are generated in the respective portions of the armature coil 46. However, it can be considered that a typical magnetic flux density is generated at the center of gravity of the portion of the second current path where the magnetic flux acts, that is, at the point Q in FIG. The Q point is determined by Pt / Pt from the X position of each armature coil 46 described above.
2 in the + X direction, the magnetic flux density B _{Q at} point _Q
(X) is represented by B _Q (X) = B _Q0 · sin (π · X / Pt) (11)

As a result, the second voltage of each armature coil 46
Lorentz force g generated in flow path₁X component g of_1X(X)
And Y component g_1Y(X) is g_1X(X) = 2 · C_Q・ B₁(X) · I₁(X) L_Two  = 2 · C_Q・ B_P0・ I_Ten・ Sin (π × X / Pt) ・ cos (π × X / Pt) ・ L_Two ... (12) g_1Y(X) = 2 · C_Q・ B₁(X) · I₁(X) L_Two・ Tanθ = 2 ・ C_Q・ B_P0・ I_Ten・ Sin (π × X / Pt) ・ cos (π × X / Pt) ・ L_TwoTan θ (13) Where C_QIs a constant. In addition, the first
As in the case of the current path of FIG.
Of the three armature coils 46 arranged continuously in
The resultant G of Lorentz force generated in the current path₁X of (X)
Component G_1X(X) and Y component G_1YWhen (X) is obtained, the following equation is obtained: sinφ · cosφ + sin (φ + π / 3) · cos (φ + π / 3) + sin (φ + 2π / 3) · cos (φ + 2π / 3) = 0 (14)_1X(X) = 0, and G_1Y(X) = 0 and
Become. That is, the current I ₁Supply of armature unit
In the second current path of the armature coil 46 in the cut 45
The resultant Lorentz force acting on the armature unit 45
The value is always 0 regardless of the X position.

As described above, by supplying the current I ₁ , the direction is set to X, regardless of the X position of the armature unit 45.
An axial thrust is generated. By adjusting the current amplitude I _10, the Lorentz force of a desired size, that is, to generate a thrust in a desired size. When generating a thrust in the direction of the direction and the opposite, current out of phase of the current I ₁ of the above only [pi, i.e. may be supplied opposite direction of the current.

Next, the Lorentz force generated in the first current path of each armature coil 46 due to the supply of the current I ₂ (X) will be considered.

The above current I₁Same as (X)
And the current I_TwoBy supplying (X), each armature coil 4
Lorentz force g generated in the first current path of No. 6_Two(X)
Is the force in the X direction, and its magnitude g_2X(X) is g_2X(X) = 2 · C_P・ B₁(X) · I_Two(X) L₁  = 2 · C_P・ B_P0・ I₂₀・ Cos (π × X / Pt) ・ sin (π × X / Pt) ・ L₁ ... (15) Then, the current I₁Same as (X)
And 3 arranged continuously on the arrangement of the armature coils 46.
Generated in the first current path of the two armature coils 46
Resultant G of Lenz force_2XWhen (X) is obtained, the equation (14) is obtained.
G_2X(X) = 0. That is, the current I_TwoSupply of
The armature coil 4 in the armature unit 45
6, the resultant of the Lorentz forces acting on the first current path is:
Always 0 regardless of the X position of the armature unit 45
You.

Next, the Lorentz force generated in the second current path of each armature coil 46 due to the supply of the current I ₂ (X) will be considered.

The above current I₁Same as (X)
And the current I_TwoBy supplying (X), each armature coil 4
6, the Lorentz force f generated in the second current path_Two(X)
X component of_2X(X) and Y component f_2Y(X) is f_2X(X) = 2 · C_Q・ B_Q(X) · I_Two(X) L_Two  = 2 · C_Q・ B_Q0・ I₂₀・ Sin^Two(Π · X / Pt) · L_Two  ... (16) f_2Y(X) = 2 · C_Q・ B_Q(X) · I_Two(X) L_Two・ Tanθ = 2 ・ C_Q・ B_Q0・ I₂₀・ Sin^Two(Π · X / Pt) · L_TwoTan θ (17) This Lorentz force f_TwoX component f of (X)
_2X(X) and Y component f_2Y(X) X of armature coil 46
The change due to the position is shown in FIG.

As in the case of the first current path described above, the Lorentz force generated in the second current path of the three armature coils 46 continuously arranged on the arrangement of the armature coils 46 is X component F _2X (X) and Y of resultant force F ₂ (X)
When the component F _2Y (X) is obtained, from the equation sin ² φ + sin ² (φ + π / 3) + sin ² (φ + 2π / 3) = 3/2 (18), F _2X (X) = 3 · C _Q · B _P0 · I ₂₀ · L ₂ ··· (19) F _2Y (X) = 3 · C _Q · B _P0 · I ₂₀ · L ₂ · tan θ ··· (20) That is, by the supply of current I _2, the resultant force of Lorentz force generated in the second current path of the armature coil 46 in the armature unit 45, the armature unit 45
Does not depend on the X position.

As described above, the current I ₁ is applied to each armature coil 46.
And supplying the current I ₂ , the armature unit 4
5 includes an X component F _X and a Y component F _Y : F _X = F _1X · n + F _2X · n = 3 · n · (C _P · B _P0 · I ₁₀ · L ₂ + C _Q · B _Q0 · I _{20 · L 2) ... (21)} F Y = F 2Y · n = 3 · n · C Q · B Q0 · I 20 · L 2 · tanθ ... force F is (22) is generated. This force F becomes the thrust of the motor device 40A.

Therefore, in the motor device 40A, the current
I₁Amplitude I_TenAnd current I_TwoAmplitude I ₂₀To control
From the above, desired estimates are made in the X-axis direction and the Y-axis direction, respectively.
The movable portion 32A can be driven by force. Sand
In the motor device 40A, the current I₁And current I_TwoControl
By doing, any two-dimensional direction in the XY plane
And a desired thrust can be generated.

The motor device 40B has the same structure as the motor device 40A, and generates a desired thrust in an arbitrary two-dimensional direction in the XY plane by controlling the current supplied in the same manner as the motor device 40A. Can be.

Therefore, by controlling the current supplied to each of motor device 40A and motor device 40B, reticle stage RST can generate a desired thrust in any two-dimensional direction in the XY plane.

Incidentally, the actual reticle stage RST
It is necessary to derive what current should be supplied in order to obtain the required thrust during the driving. For this reason, in the present embodiment, the reticle interferometer 28 described above is used.
Reticle stage RST measured by X, 28Y
Thrust (required thrust) Fx _req for the target position or target speed obtained according to the position information (or speed information)
Fy _req is calculated, and the above-described supply currents I ₁ and I ₂ are derived from the required thrust.

Here, the supply currents I ₁ and I _{2 to be obtained} are
Kfx ₁ a thrust constant of the first current path, the Kfx _2, Y driving thrust constant the X driving thrust constant of the second current path as _{Kfy, I 2 = Fy req /} Kfy ... (23) I 1 = (Fx _{req -F 2X · n) / Kfx} 1, = Fx _req / Kfx ₁ -Fy _req · Kfx ₂ / (Kfx ₁ · Kfy) (24) Then, the current I (= I ₁ + I ₂ ) supplied to the armature coil 46 is given by: I = Fx _req / Kfx ₁ -Fy _req · Kfx ₂ / (Kfx ₁ · Kfy) + Fy _req / Kfy (25) It is expressed as

Therefore, the thrust constants Kfx ₁ , Kfx ₂ , and Kfy for the motor devices 40A and 40B are obtained in advance, and the required thrusts Fx _req and Fy _req corresponding to the position information (or the speed information) of the reticle stage RST are obtained. (25)
The current I to be supplied to each armature coil 46 can be obtained from the equation. By supplying the current I thus obtained to each armature coil, the reticle stage R
The ST can be driven two-dimensionally by the required thrusts Fx _req and Fy _req at each time point.

In the armature base 44A having the armature coil 46, the armature base 4A is connected to the armature base 4 via a refrigerant injection joint (neither is shown) from the refrigerant supply device.
After the refrigerant supplied to the inside of the armature base 44A cools the inside of the armature base 44A, it is returned to the cooling device via the refrigerant discharge joint, where it is cooled and supplied again to the armature base 44A. It is used, so that heat released from the entire surface of the armature coil 46 can be efficiently removed. Such a mechanism of heat removal is similarly employed in the motor device 40B.

Next, the flow of the exposure operation by the exposure apparatus 10 as described above will be briefly described.

First, under the control of main controller 20, reticle loading and wafer loading are performed by a reticle loader and wafer loader (not shown), a reticle microscope, a reference mark plate on wafer stage WST, off-axis alignment, and the like. Preparatory operations such as reticle alignment and baseline measurement (measurement of the optical axis distance of the projection optical system PL from the detection center of the alignment detection system) are performed by a predetermined procedure using a detection system (both not shown).

Thereafter, alignment measurement such as EGA (Enhanced Global Alignment) is performed by main controller 20 using an alignment detection system (not shown). When movement of wafer W is necessary in such an operation, main controller 20 moves wafer stage WST holding wafer W in a predetermined direction via stage control system 19. After the completion of such alignment measurement, the exposure operation of the step-and-scan method is performed as follows.

In this exposure operation, first, the wafer W
The wafer stage WST is moved so that the XY position of the wafer stage becomes the scanning start position for exposing the first shot area (first shot) on the wafer W. at the same time,
The XY position of the reticle R becomes the scanning start position,
Reticle stage RST is moved. Then, in response to an instruction from main controller 20, stage control system 19 performs reticle R (reticle stage RST) based on position information of reticle R measured by reticle interferometer 28.
And the wafer W (wafer stage WST) are synchronously moved to perform scanning exposure.

When the transfer of the reticle pattern to one shot area is completed as described above, wafer stage WST is stepped by one shot area, and scanning exposure is performed on the shot area. In this way, the stepping and the scanning exposure are sequentially repeated, and the required number of shot patterns are transferred onto the wafer W.

In this embodiment, reticle stage RST
The above-mentioned motor device 40A,
The reticle stage RST is driven in the scanning direction (X-axis direction) while finely adjusting the positions of the reticle stage RST in the non-scanning direction (Y-axis direction) and the rotation direction (θz). Therefore, the reticle stage RST can be reduced in size and weight and controllability can be improved without employing a complicated structure as in a conventional reticle stage having a coarse / fine movement structure. Therefore, in the exposure apparatus 10 of the present embodiment, the reticle R can be moved at high speed and with high positional accuracy, so that the pattern formed on the reticle R can be accurately transferred to the wafer W while improving the throughput. it can.

Further, independent supporting members 54A, 54A, separate from the main body column for supporting the main bodies of the stators 42A, 42B of the respective linear motors 40A, 40B for driving the reticle stage.
Since the reticle stage RST is held at 54B, the reaction force when driving the reticle stage RST is applied to the reticle stage base 5 via the stators 42A and 42B as stators of the respective linear motors.
(2) Since the light is not transmitted to the main body column, the vibration of the main body of the exposure apparatus due to the driving of the reticle stage can be effectively suppressed.

The exposure apparatus 10 of the present embodiment incorporates an illumination optical system and a projection optical system composed of a plurality of lenses into an exposure apparatus main body, performs optical adjustment, and exposes a reticle stage and a wafer stage composed of a large number of mechanical parts. The exposure apparatus according to each of the above-described embodiments can be manufactured by attaching the apparatus to the apparatus main body, connecting wiring and piping, and performing overall adjustment (electrical adjustment, operation confirmation, and the like). Here, it is desirable to manufacture the exposure apparatus in a clean room in which the temperature, the degree of cleanliness, and the like are controlled.

In this embodiment, a pentagonal armature coil of a home base type is used, but the present invention is not limited to this. That is, a first current path in the X-axis direction and a second current path in the diagonal direction in the XY plane.
And the shape of the other portions is not limited. For example, an armature coil having a hexagonal shape in plan view can be used.

<< Second Embodiment >> Next, a second embodiment of the present invention will be described. Here, in the description of the present embodiment, the same or equivalent components as those of the above-described first embodiment will be denoted by the same reference numerals, and the description thereof will be simplified or omitted. Note that the present embodiment differs from the first embodiment only in the configuration of the motor device that is the driving device in the reticle stage device. Therefore, the following description will focus on such differences.

FIG. 6 shows the configuration of one motor device 140A of the pair of motor devices in the present embodiment corresponding to the pair of motor devices 40A and 40B in the first embodiment. As shown in FIG. 6A, the motor device 140A of the present embodiment has significant differences in the shape of the armature coils and the arrangement of the permanent magnets compared to the motor device of the first embodiment. Note that, in the present embodiment, similarly to the first embodiment, a moving magnet type motor device in which the armature unit side of the motor device is a stator is configured.

The motor device 140A includes a mover 134
A and a stator 142A.

The mover 134A is a first permanent magnetic unit as a first magnetic pole unit having permanent magnets 136L and 136R whose surfaces in contact with adjacent magnets are rectangular in plan view and whose magnetic pole surfaces are arranged in the same polarity. The magnet group 163 and the first
And the length of the side extending in the X-axis direction is the same as that of the permanent magnets 136L and 136R included in the first permanent magnet group, and the first permanent magnet group 163 A second magnet group 183 as a second magnetic pole unit having permanent magnets 138L and 138R arranged at predetermined intervals in the Y-axis direction from the first permanent magnet group 1
63 and a holding member 164 that holds the second magnet group 183
A.

The stator 142A includes an armature base 144A made of a non-magnetic material and having a U-shaped cross section, and 3n (n is a natural number) armature coils 146 provided in the armature base 144A. And an armature unit 145. The armature coil 146 is connected to the stator yoke 14
As shown in FIG.
As shown in (B), an armature coil 146 ′ wound in a hexagonal shape in which a pair of opposed two sides is longer than the other side and the other four sides are equal in length is bent in a U-shape. It is formed through a process, and is configured so that the shape of the portion facing the permanent magnet groups 163 and 183 is the same as the outer shape of the armature coil 46 in the above-described first embodiment.

In the motor device 140A thus configured, the permanent magnet groups 163, 183
A magnetic flux density similar to that of the first embodiment is generated at the position of the opposing portion 5. Therefore, by controlling the current supplied to the armature coil 146 in the same manner as in the first embodiment, the mover 134A can be driven with a desired thrust in an arbitrary two-dimensional direction in the XY plane. In the present embodiment, the reaction force of the resultant Lorentz force generated in the armature unit 145 is the thrust.

In the present embodiment, reticle stage RST
A linear motor 140B (not shown) facing the linear motor 140A is also configured in the same manner as the linear motor 140A, and by controlling the supplied current,
The mover can be driven with a desired thrust in an arbitrary two-dimensional direction in the XY plane.

In this embodiment, reticle stage RST
The above-mentioned motor device 140
A, 140B, and driven in the scanning direction (X-axis direction) while finely adjusting the positions of the reticle stage RST in the non-scanning direction (Y-axis direction) and the rotation direction (θz). Similarly to the above, the pattern formed on the reticle R can be accurately transferred onto the wafer W while improving the throughput.

In this embodiment, in the arrangement of the permanent magnets in the X-axis direction, the adjacent permanent magnets are brought into close contact with each other, but a gap between the adjacent magnets may be provided. Further, between the permanent magnets 138L and 138R or the permanent magnet 136
It is also possible to arrange an interpolating magnet magnetized in the Z-axis direction between L and 138R.

In each of the above embodiments, the motor device according to the present invention is employed as a driving device for reticle stage RST. However, the motor device according to the present invention can be employed as a driving device for wafer stage WST.

In each of the above embodiments, the motor device is configured as a moving magnet type, but may be configured as a moving coil type.

In each of the above embodiments, the motor device is configured as a so-called three-phase motor. However, the motor device may be configured as a motor device having an arbitrary number of phases as long as it has two or more phases.

In each of the above embodiments, the projection optical system P
Although a reduction system is used as L, the invention is not limited to this, and any of an equal magnification system and an enlargement system may be used.

In each of the above embodiments, the case where the stage device according to the present invention is applied to the drive device of the reticle stage or the wafer stage of the scanning type DUV exposure apparatus has been described. Can be applied to a substrate stage of a step-and-repeat type exposure apparatus that transfers a pattern of a mask onto a substrate in a state where the mask and the substrate are stationary and sequentially moves the substrate in steps. . Also, the present invention provides a charged particle beam exposure apparatus such as a proximity exposure apparatus and an electron beam exposure apparatus for transferring a mask pattern onto a substrate by bringing a mask and a substrate into close contact without using a projection optical system, and a wavelength of about 5 to 15 nm. The present invention can be suitably applied to an exposure apparatus such as a so-called EUVL using light in the soft X-ray region as exposure light, and an apparatus other than the exposure apparatus, for example, an inspection apparatus and a substrate transfer apparatus.

The present invention is not limited to an exposure apparatus for manufacturing a semiconductor, but is also applicable to an exposure apparatus for transferring a device pattern onto a glass plate and a thin-film magnetic head used for manufacturing a display including a liquid crystal display element. The present invention can also be applied to an exposure apparatus that transfers a device pattern to be used on a ceramic wafer, an exposure apparatus that is used for manufacturing an imaging device (such as a CCD), and the like. Also, not only micro devices such as semiconductor elements, but also light exposure devices,
To manufacture a reticle or mask used in an EUV exposure apparatus, an X-ray exposure apparatus, and an electron beam exposure apparatus,
The present invention is also applicable to an exposure apparatus that transfers a circuit pattern onto a glass substrate or a silicon wafer. Where DU
In an exposure apparatus using V (far ultraviolet) light or VUV (vacuum ultraviolet) light, a transmission reticle is generally used, and a reticle substrate is made of quartz glass, fluorine-doped quartz glass, fluorite, magnesium fluoride. Or quartz or the like. A proximity type X-ray exposure apparatus;
Alternatively, a transmission type mask (stencil mask, membrane mask) is used in an electron beam exposure apparatus or the like, and a silicon wafer or the like is used as a mask substrate.

[0087]

As described above, according to the motor device of the present invention, it is possible to provide a motor device capable of two-dimensional driving with a simple configuration and a driving method thereof.

Further, according to the stage device of the present invention, since the motor device of the present invention is provided as a driving device, the weight of the movable portion can be reduced, and the stage device can move the stage at high speed and with high accuracy. Can be provided.

Further, according to the exposure apparatus of the present invention, the substrate and the reticle can be driven with high precision, high speed, and high acceleration by reducing the size and weight of the stage. An exposure apparatus capable of performing high-precision exposure can be provided.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a schematic configuration of an exposure apparatus according to a first embodiment.

FIG. 2 is a perspective view showing the reticle stage of FIG. 1 and its vicinity.

FIGS. 3A and 3B are diagrams showing a configuration of the motor device of FIG. 2;

FIGS. 4A to 4C are diagrams for explaining magnetic flux density in the motor device of FIG. 3;

FIGS. 5A to 5D are diagrams for explaining the driving principle of the linear motor in FIG. 3;

FIGS. 6A and 6B are diagrams illustrating a configuration of a motor device according to a second embodiment.

[Explanation of symbols]

10 Exposure device, 22 Reticle stage device (stage device), 40A, 40B, 140A, 140B Motor device, 45, 145 Armature unit, 46, 146
... armature coil, 63 ... first field magnet (first magnetic pole unit), 83 ... second field magnet (second magnetic pole unit),
163: first permanent magnet group (first magnetic pole unit), 18
3. Second permanent magnet group (second magnetic pole unit), RST
Reticle stage (stage), W: wafer (substrate).

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2F078 CA02 CA08 CB05 CB13 CC11 5F031 CA02 CA05 CA07 KA06 LA04 LA08 MA27 5F046 BA05 CC01 CC02 CC09 CC10 CC16 CC17 DA06 DA07 DA08 5H641 BB06 BB15 BB18 BB19 GG12 GG05 GG05 GG05 GG05 GG05 GG05 GG05 GG05 GG05 HH03 HH05 HH06 JA06 JB05

Claims (5)

[Claims] 1. A motor device for generating a driving force along a first direction and a second direction substantially orthogonal to the first direction, wherein the motor device is arranged along the first direction and includes an armature coil. And an armature unit disposed along the first direction and interacting with a current flowing through the armature coil.
A first magnetic pole unit that generates a magnetic flux density that generates a driving force along the direction; and a first magnetic pole unit that is disposed along the first direction and that is arranged along the second direction by interaction with a current flowing through the armature coil. A second magnetic pole unit that generates a magnetic flux density that generates a driving force; and a control device that controls a current flowing through the armature coil to control a driving force along the first direction and the second direction. A motor device comprising: 2. The armature coil has a first portion having a current path parallel to the second direction, and a second portion having a current path extending from the first portion in a direction intersecting the second direction. The motor device according to claim 1, wherein: 3. A stage device comprising a driving device for driving a stage along a predetermined moving surface, wherein the driving device comprises the motor device according to claim 1 or 2. 4. An exposure apparatus for transferring a predetermined pattern onto a substrate while a stage of a stage device is moving, comprising: the stage device according to claim 3 as said stage device. apparatus. 5. A drive control method for a motor device for generating a driving force along a first direction and a second direction substantially orthogonal to the first direction, the method being provided along the first direction. Providing an armature unit including an armature coil; providing a driving force along the first direction by interaction with a current flowing through the armature coil, the driving force being arranged along the first direction; A second magnetic pole unit for providing a first magnetic pole unit for generating a magnetic flux density to be generated;
And providing a second magnetic pole unit disposed along the first direction and generating a magnetic flux density for generating a driving force along the second direction by interaction with a current flowing through the armature coil. Driving the motor device, comprising: a third step; and a fourth step of controlling a current flowing through the armature coil to control a driving force along the first direction and the second direction. Control method.